JP2008198697A - Method for grounding electromagnetic wave shielding member formed of conductive resin - Google Patents

Method for grounding electromagnetic wave shielding member formed of conductive resin Download PDF

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JP2008198697A
JP2008198697A JP2007030194A JP2007030194A JP2008198697A JP 2008198697 A JP2008198697 A JP 2008198697A JP 2007030194 A JP2007030194 A JP 2007030194A JP 2007030194 A JP2007030194 A JP 2007030194A JP 2008198697 A JP2008198697 A JP 2008198697A
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shielding member
conductive resin
grounding
electromagnetic shielding
crack
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Hironobu Taniguchi
展紳 谷口
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Kojima Industries Corp
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Kojima Press Industry Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To save the time required for grounding work of an electromagnetic wave shielding member in the method for grounding the electromagnetic wave shielding member formed of a conductive resin. <P>SOLUTION: An element 20 constituting a housing element as the electromagnetic wave shielding member is molded into a shape including a V-shaped channel 24 having the V-shaped cross-section on a single surface in the thickness direction with the conductive resin. Thereafter, the housing element is formed where a conductive part is exposed to a mark of crack or to a cracking part by cracking the element 20 at the V-shaped channel part 24. Thereafter, a grounding wire is connected directly or via the other conductor to the conductive part exposed in both sides of the mark of crack or cracking part of the housing element. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電磁波シールド部材を構成する素材を導電性樹脂により成形し、電磁波シールド部材において、導電性を有する部分にアース線を直接または他の導体を介して接続する導電性樹脂製の電磁波シールド部材の接地方法に関する。   The present invention relates to an electromagnetic wave shield made of a conductive resin, in which a material constituting an electromagnetic wave shield member is molded from a conductive resin, and the ground wire is connected to a conductive portion directly or via another conductor in the electromagnetic wave shield member. The present invention relates to a method for grounding a member.

従来から、電気素子同士を導通させているプリント基板等の電気回路部の外部からの電磁波ノイズ等、電磁波の影響を抑える対策として、図9に示すように、電気回路部(図示せず)を、導電性を有する導電材料製の筐体10の内部に配置し、筐体10を接地する(アースする)ことが考えられている。このような筐体10により、筐体10が地面12とほぼ同電位になり、電気回路部が外部から電磁波の影響を受けにくくなるという、電磁波シールド効果を得られる可能性がある。これに対して、筐体10をアースしない場合には、筐体10の電圧が上昇して、筐体10自体が電磁波を発生させる原因となり、筐体10内部に配置した電気回路部が電磁波により好ましくない影響を受ける可能性がある。このため、導電材料製の筐体10をアースすることが、電気回路部において電磁波の影響を受けにくくする面から好ましい。   Conventionally, as a measure for suppressing the influence of electromagnetic waves such as electromagnetic noise from the outside of an electric circuit part such as a printed circuit board in which electric elements are electrically connected, an electric circuit part (not shown) is provided as shown in FIG. It is conceivable that the casing 10 is disposed inside the casing 10 made of a conductive material having conductivity, and the casing 10 is grounded (grounded). With such a case 10, there is a possibility that an electromagnetic wave shielding effect can be obtained in which the case 10 has substantially the same potential as the ground 12 and the electric circuit portion is hardly affected by electromagnetic waves from the outside. On the other hand, when the casing 10 is not grounded, the voltage of the casing 10 rises, causing the casing 10 itself to generate an electromagnetic wave, and the electric circuit unit disposed inside the casing 10 is caused by the electromagnetic wave. May be adversely affected. For this reason, grounding the casing 10 made of a conductive material is preferable from the viewpoint of making it less susceptible to electromagnetic waves in the electric circuit portion.

このような導電材料製の筐体10を構成するために、筐体10を構成する筐体要素を、「電磁波シールド部材」と呼ばれる、導電性樹脂製の部材により構成することが考えられている。なお、本明細書全体および特許請求の範囲において、「電磁波シールド部材」とは、基材となる樹脂中に、シールド材料となる導電性を有するフィラー(銅、カーボン等)と呼ばれる充填物を混入することにより構成する部材をいう。   In order to configure the case 10 made of such a conductive material, it is considered that the case element constituting the case 10 is constituted by a member made of conductive resin called an “electromagnetic wave shielding member”. . In the entire specification and claims, the term “electromagnetic wave shielding member” means that a filler called conductive filler (copper, carbon, etc.) serving as a shielding material is mixed in a resin serving as a base material. The member which comprises by doing.

ただし、筐体要素を導電性樹脂により構成する場合、筐体要素の成形時に、導電性を有する充填物(フィラー)よりも流動性の高い樹脂が筐体要素の表面となる部分に流れ込み、スキン層と呼ばれる絶縁部分が筐体要素の表面に形成されやすくなる。このように筐体要素の表面に絶縁部分が形成されると、筐体要素の表面にそのままアース線を接続しても、筐体要素を接地する効果を十分に得られない。このような筐体要素を接地するためには、例えば、筐体要素の表面を削る等の加工を行うことにより、表面の絶縁部分を突き破った状態で、表面に露出した導電性を有する部分にアース線等の導体を接続する等の作業を行う必要がある。   However, when the casing element is made of a conductive resin, when the casing element is molded, a resin having a higher fluidity than the conductive filler (filler) flows into the surface of the casing element, and the skin Insulating portions called layers are easily formed on the surface of the housing element. When the insulating portion is formed on the surface of the housing element as described above, the effect of grounding the housing element cannot be sufficiently obtained even if the ground wire is directly connected to the surface of the housing element. In order to ground such a housing element, for example, by cutting the surface of the housing element or the like, the insulating portion of the surface is pierced and the conductive portion exposed on the surface is exposed. It is necessary to perform work such as connecting a conductor such as a ground wire.

例えば、従来から、図10に示すように、筐体要素14を導電性樹脂製の電磁波シールド部材により構成するとともに、筐体要素14と金具等の金属物16とを、ボルト18により接続することが考えられている。そして、金属物16またはボルト18に、図示しないアース線の一端を接続し、このアース線の他端を接地することにより、筐体要素14をアースする。このような図10に示した構成の場合、筐体要素14の成形時に表面に形成された絶縁部分を突き破るための孔部19を形成する加工を行い、孔部19にボルト18を挿入し、金具16にねじ結合することにより、筐体要素14の導電性を有する部分と金属製のボルト18とを電気的に接続することができる。このような筐体要素14により筐体を構成すれば、筐体内に設置する電気回路部が電磁波の影響を受けにくくなる電磁波シールド効果を得られる。   For example, conventionally, as shown in FIG. 10, the casing element 14 is made of an electromagnetic shielding member made of conductive resin, and the casing element 14 and a metal object 16 such as a metal fitting are connected by a bolt 18. Is considered. Then, one end of a ground wire (not shown) is connected to the metal object 16 or the bolt 18 and the other end of the ground wire is grounded to ground the housing element 14. In the case of the configuration shown in FIG. 10, processing is performed to form the hole 19 for breaking through the insulating portion formed on the surface when the housing element 14 is molded, and the bolt 18 is inserted into the hole 19. By screw coupling to the metal fitting 16, the conductive portion of the housing element 14 and the metal bolt 18 can be electrically connected. If the casing is configured by such a casing element 14, an electromagnetic wave shielding effect can be obtained in which the electric circuit unit installed in the casing is less susceptible to electromagnetic waves.

なお、特許文献1には、筐体要素である金属製の天板および底板をアースした電子機器の筐体構造が記載されている。特許文献1に記載された電子機器の筐体構造の場合、金属製の天板の裏面に形成された絶縁被膜にアース金具を擦過させることにより、天板を、アース金具を介してアースしている。また、底板に形成されたねじ孔の周辺部に設けた尖頭突起により、天板の裏面の絶縁被膜を突き破らせることにより、底板もアースしている。   Patent Document 1 describes a housing structure of an electronic device in which metal top plates and bottom plates that are housing elements are grounded. In the case of the housing structure of the electronic device described in Patent Document 1, the top plate is grounded through the grounding metal by rubbing the grounding metal against the insulating coating formed on the back surface of the metal top. Yes. Further, the bottom plate is also grounded by breaking through the insulating coating on the back surface of the top plate by a pointed projection provided at the periphery of the screw hole formed in the bottom plate.

特許第2834934号公報Japanese Patent No. 2834934

上記の図10に示した構造の場合、導電性樹脂製の筐体要素14を接地するために、筐体要素14にボルト18を挿入するための孔部19を形成する加工作業を行う必要がある。また、このような孔部19を形成しない場合には、筐体要素14の表面を加工工具により削る等の加工作業を行い、筐体要素14表面の絶縁部分を突き破る必要がある。ただし、このように筐体要素14表面の絶縁部分を突き破るために孔部19を形成したり、削り加工等の加工作業を行うことは、電磁波シールド部材である筐体要素14の接地作業に要する時間が長くなる原因となる。   In the case of the structure shown in FIG. 10, it is necessary to perform a processing operation for forming a hole portion 19 for inserting the bolt 18 into the casing element 14 in order to ground the casing element 14 made of conductive resin. is there. Further, when such a hole 19 is not formed, it is necessary to perform a processing operation such as cutting the surface of the housing element 14 with a processing tool to break through the insulating portion on the surface of the housing element 14. However, it is necessary for the grounding work of the housing element 14 that is an electromagnetic wave shielding member to form the hole 19 or to perform the machining work such as the shaving process to break through the insulating portion on the surface of the housing element 14 in this way. Causes longer time.

また、特許文献1に記載された電子機器の筐体構造の場合、筐体要素は金属製の天板および底板であり、導電性樹脂製の電磁波シールド部材を接地する方法を開示するものではない。   In the case of the casing structure of the electronic device described in Patent Document 1, the casing elements are a metal top plate and a bottom plate, and do not disclose a method of grounding an electromagnetic shielding member made of conductive resin. .

本発明の目的は、導電性樹脂製の電磁波シールド部材の接地方法において、電磁波シールド部材の接地作業に要する時間を短くすることを目的とする。   An object of the present invention is to shorten the time required for the grounding work of the electromagnetic wave shielding member in the grounding method of the electromagnetic wave shielding member made of conductive resin.

本発明に係る導電性樹脂製の電磁波シールド部材の接地方法は、電磁波シールド部材を構成する素材を、導電性樹脂により側面に凹部または段部を有する形状に成形した後、素材を凹部部分または段部部分で割ることにより、割れ跡または割れ目に導電性を有する部分を露出させた電磁波シールド部材を構成し、電磁波シールド部材において、割れ跡または割れ目の両側に露出した、導電性を有する部分にアース線を直接または他の導体を介して接続することを特徴とする導電性樹脂製の電磁波シールド部材の接地方法である。   In the method for grounding an electromagnetic wave shielding member made of conductive resin according to the present invention, after forming the material constituting the electromagnetic wave shielding member into a shape having a concave portion or a step portion on the side surface by the conductive resin, the material is formed into the concave portion or step. An electromagnetic shielding member in which a conductive portion is exposed at a crack mark or a crack is formed by dividing by a portion, and the conductive portion exposed on both sides of the crack mark or the crack is grounded in the electromagnetic shielding member. A method for grounding an electromagnetic wave shielding member made of a conductive resin, characterized in that a wire is connected directly or via another conductor.

また、好ましくは、電磁波シールド部材を構成する素材に設ける凹部または段部は、素材の側面に断面V字形で直線状に設けるV字溝とする。   Preferably, the recess or step provided in the material constituting the electromagnetic wave shielding member is a V-shaped groove provided in a straight line with a V-shaped cross section on the side surface of the material.

また、好ましくは、電磁波シールド部材を構成する素材に設ける凹部または段部は、素材の側面に仮想直線上に間欠的に設ける複数の凹部とする。   Preferably, the recesses or stepped portions provided in the material constituting the electromagnetic wave shielding member are a plurality of recesses provided intermittently on a virtual straight line on the side surface of the material.

また、好ましくは、電磁波シールド部材を構成する素材に設ける凹部または段部は、素材の両面に薄肉部を挟んで対向する状態で設けるそれぞれ直線状の2個の凹溝とする。   Preferably, the concave portion or the step portion provided in the material constituting the electromagnetic wave shielding member is formed as two straight concave grooves provided in a state of being opposed to each other with a thin portion sandwiched between both surfaces of the material.

また、好ましくは、電磁波シールド部材を構成する素材は板状とするとともに、素材に設ける凹部または段部は、素材の長さ方向または幅方向に貫通する直線状の孔部とする。   Preferably, the material constituting the electromagnetic wave shielding member is plate-shaped, and the recess or step provided in the material is a linear hole penetrating in the length direction or width direction of the material.

本発明に係る導電性樹脂製の電磁波シールド部材の接地方法によれば、電磁波シールド部材にアース線を接続するために、導電樹脂製の素材を凹部部分または段部部分で割り、割れ跡または割れ目の両側に露出した導電性を有する部分にアース線を直接または他の導体を介して接続すればよく、素材を凹部部分または段部部分で割る作業は、短時間で容易に行える。すなわち、素材に凹部または段部を設けているため、素材は凹部部分または段部部分で割れやすくなる。このため、素材に導電性を有する部分を露出させる作業を短時間で容易に行える。また、導電性樹脂により構成する電磁波シールド部材表面の絶縁部分を突き破り導体を接続するために、電磁波シールド部材にボルトを挿入するための孔部を形成したり、電磁波シールド部材の表面を加工工具により削る等の長時間を要する加工作業を行う必要がなくなる。この結果、電磁波シールド部材の接地作業に要する時間を短くできる。   According to the grounding method of the electromagnetic shielding member made of conductive resin according to the present invention, in order to connect the ground wire to the electromagnetic shielding member, the conductive resin material is divided by the concave portion or the step portion, and cracks or cracks are formed. The ground wire may be connected to the conductive portions exposed on both sides of the wire directly or via other conductors, and the work of dividing the material by the concave portion or the step portion can be easily performed in a short time. That is, since the concave portion or the step portion is provided in the material, the material is easily broken at the concave portion or the step portion. For this reason, the operation | work which exposes the part which has electroconductivity to a raw material can be performed easily in a short time. Moreover, in order to break through the insulating portion of the surface of the electromagnetic wave shielding member made of conductive resin and connect the conductor, a hole for inserting a bolt into the electromagnetic wave shielding member is formed, or the surface of the electromagnetic wave shielding member is formed with a processing tool. It is not necessary to perform a long working process such as cutting. As a result, the time required for the grounding work of the electromagnetic wave shielding member can be shortened.

[第1の発明の実施の形態]
以下において、図面を用いて本発明に係る実施の形態につき詳細に説明する。図1から図2は、第1の実施の形態を示している。図1は、本実施の形態に係る導電性樹脂製の電磁波シールド部材の接地方法により接地する、電磁波シールド部材である板状の筐体要素を構成する素材20を示す部分斜視図である。また、図2(a)は図1の素材20を完全に割ることにより構成する筐体要素22を示す部分斜視図であり、図2(b)は図1の素材20を、割れ目を残すようにして割ることにより構成する筐体要素22aの別例を示す部分斜視図である。筐体要素22,22aは、例えば、図示しない自動車用の電子機器の筐体10(図9参照)を構成する、天板、底板、横板等として使用する。筐体要素22,22aは、導電性を有する樹脂である導電性樹脂製とする。
[First Embodiment]
Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. 1 to 2 show a first embodiment. FIG. 1 is a partial perspective view showing a material 20 constituting a plate-shaped casing element which is an electromagnetic wave shielding member, which is grounded by a grounding method of an electromagnetic wave shielding member made of a conductive resin according to the present embodiment. 2A is a partial perspective view showing a housing element 22 formed by completely dividing the material 20 of FIG. 1, and FIG. 2B is a view of leaving the material 20 of FIG. It is a fragmentary perspective view which shows another example of the housing element 22a comprised by dividing by. The casing elements 22 and 22a are used as, for example, a top plate, a bottom plate, a horizontal plate, and the like constituting the casing 10 (see FIG. 9) of an automobile electronic device (not shown). The casing elements 22 and 22a are made of conductive resin that is conductive resin.

このような導電樹脂製の筐体要素22,22aを接地、すなわちアースする筐体要素22,22aの接地方法は、次のようにして行う。まず、図1に示すように、筐体要素22,22a(図2(a)(b))を構成する素材20を、導電性樹脂により厚さ方向片面(図1の上側面)に凹部であり、断面V字形の直線状のスリットである、V字溝24を有する板状に成形する。導電性樹脂は、基材となる樹脂中に、シールド材料となる導電性を有するフィラーと呼ばれる充填物(銅、カーボン等)を混入することにより構成する。このような素材20の成形時には、金型の内側で素材20の表面となる部分に流動性の高い樹脂が流れ込み、流動性の低い導電性を有する充填物が、素材20の表面から外れた内側部分を構成するようになる。このため、成形後の素材20の表面は絶縁部分により覆われた状態となる。このため、素材20の表面にアース線をそのまま接続しても接地の効果を得ることができない。   Such a grounding method for grounding the casing elements 22 and 22a made of conductive resin, that is, grounding the casing elements 22 and 22a, is performed as follows. First, as shown in FIG. 1, the material 20 constituting the casing elements 22 and 22a (FIGS. 2A and 2B) is formed into a concave portion on one side in the thickness direction (upper side surface in FIG. 1) by a conductive resin. Yes, it is formed into a plate shape having a V-shaped groove 24, which is a linear slit having a V-shaped cross section. The conductive resin is configured by mixing a filler (copper, carbon, or the like) called a conductive filler serving as a shielding material into a resin serving as a base material. At the time of molding such a material 20, a resin having high fluidity flows into a portion that becomes the surface of the material 20 inside the mold, and the filling material having low fluidity conductivity is removed from the surface of the material 20. To make up part. For this reason, the surface of the molded material 20 is covered with an insulating portion. For this reason, the grounding effect cannot be obtained even if the ground wire is connected to the surface of the material 20 as it is.

本実施の形態はこのような事情を考慮してなされたもので、素材20は、図1に示すように、厚さ方向片面(図1の上側面)に幅方向(図1の裏表方向)に直線状に伸びるV字溝24を有する板状に成形する。V字溝24の両端は、素材20の幅方向両側面に達している。   The present embodiment has been made in consideration of such circumstances, and as shown in FIG. 1, the material 20 has a thickness direction on one side (the upper side in FIG. 1) and a width direction (the front and back directions in FIG. 1). Are formed into a plate shape having V-shaped grooves 24 extending linearly. Both ends of the V-shaped groove 24 reach both side surfaces of the material 20 in the width direction.

次いで、素材20の長さ方向(図1の左右方向)両側を図1に矢印イで示す方向に、同方向(図1の下方向)に向け曲げることにより、図2(a)に示すように、素材20をV字溝24部分で割り、これにより、割れた片側部分(図1の左側部分)により筐体要素22を構成する。また、この状態で、筐体要素22の割れ跡25(図2(a)に梨地で示す部分)に、導電性を有する部分が露出された状態となる。そして、筐体要素22の割れ跡25に露出した導電性を有する部分に、アース線26の一端を直接接続し、アース線26の図示しない他端を接地する(アースする)。例えば、筐体要素22により構成する筐体を自動車に搭載する場合には、アース線26の他端を車体に接続する。筐体要素22とアース線26とは、はんだ付け等種々の方法で接続する。なお、筐体要素22にアース線26を直接接続せず、筐体要素22の割れ跡25にアース線26をコネクタと導線等の、他の導体を介して接続することもできる。なお、V字溝24は、素材20の厚さ方向片面において、長さ方向(図1の左右方向)に直線状に伸びるように形成し、素材20をV字溝24部分で割ることにより、筐体要素を構成することもできる。   Next, as shown in FIG. 2A, the both sides of the length direction of the material 20 (left and right direction in FIG. 1) are bent in the same direction (downward direction in FIG. 1) in the direction indicated by the arrow A in FIG. In addition, the material 20 is divided by the V-shaped groove 24 portion, and thereby, the housing element 22 is configured by the one side portion (left side portion in FIG. 1) that is broken. Further, in this state, a conductive portion is exposed at the crack 25 of the housing element 22 (the portion indicated by the matte surface in FIG. 2A). Then, one end of the ground wire 26 is directly connected to the conductive portion exposed at the crack 25 of the housing element 22 and the other end (not shown) of the ground wire 26 is grounded (grounded). For example, in the case where a casing constituted by the casing element 22 is mounted on an automobile, the other end of the ground wire 26 is connected to the vehicle body. The housing element 22 and the ground wire 26 are connected by various methods such as soldering. It is also possible to connect the ground wire 26 to the crack 25 of the housing element 22 via another conductor such as a connector and a conductor without connecting the ground wire 26 directly to the housing element 22. The V-shaped groove 24 is formed so as to extend linearly in the length direction (left-right direction in FIG. 1) on one side in the thickness direction of the material 20, and the material 20 is divided by the V-shaped groove 24 portion. A housing element can also be configured.

また、図2(b)に示す別例のように、素材20(図1)をV字溝24部分、すなわちV字溝24の底部で途中まで割り、V字溝24を挟んで両側部分同士を一部で結合した状態で、V字溝24底部に形成される割れ目28の両側に、導電性を有する部分を露出させることにより、筐体要素22a(図2(b))を構成することもできる。この場合には、筐体要素22aにおいて、割れ目28の両側に露出した導電性を有する部分によりアース線26の一端を挟んだ状態で、アース線26と素材20とを接続し、筐体要素22aの導電性を有する部分にアース線26を接続する。なお、筐体要素22aの割れ目28の両側部分により、アース線26と接続した他の導体を挟みこむようにして、筐体要素22aとアース線26とを、他の導体を介して接続することもできる。   Further, as in another example shown in FIG. 2B, the material 20 (FIG. 1) is divided halfway at the V-shaped groove 24 portion, that is, the bottom of the V-shaped groove 24, and the both side portions sandwiching the V-shaped groove 24. In a state where the two are partially coupled, the casing element 22a (FIG. 2B) is configured by exposing the conductive portions on both sides of the crack 28 formed at the bottom of the V-shaped groove 24. You can also. In this case, in the housing element 22a, the ground wire 26 and the material 20 are connected in a state where one end of the ground wire 26 is sandwiched between conductive portions exposed on both sides of the crack 28, and the housing element 22a. The ground wire 26 is connected to the conductive part. It is also possible to connect the housing element 22a and the ground wire 26 via other conductors so that the other conductors connected to the ground wire 26 are sandwiched between both side portions of the crack 28 of the housing element 22a. .

このような本実施の形態の導電性樹脂製の電磁波シールド部材の接地方法によれば、筐体要素22,22aにアース線26を接続するために、導電性樹脂製の素材20(図1)をV字溝24部分で割り、割れ跡25または割れ目28の両側に露出した導電性を有する部分にアース線26を直接または他の導体を介して接続すればよく、素材20をV字溝24部分で割る作業は、短時間に容易に行える。すなわち、素材20にV字溝24を設けているため、素材20はV字溝24部分で割れやすくなる。このため、素材20に導電性を有する部分を露出させる作業を短時間で容易に行える。   According to the grounding method of the electromagnetic shielding member made of conductive resin according to this embodiment, the conductive resin material 20 (FIG. 1) is used to connect the ground wire 26 to the casing elements 22 and 22a. Is divided by the V-shaped groove 24 portion, and the ground wire 26 may be connected to the conductive portions exposed on both sides of the crack mark 25 or the crack 28 directly or via other conductors. The division work can be easily performed in a short time. That is, since the V-shaped groove 24 is provided in the material 20, the material 20 is easily broken at the V-shaped groove 24 portion. For this reason, the operation | work which exposes the part which has electroconductivity to the raw material 20 can be performed easily in a short time.

また、導電性樹脂により構成する筐体要素22,22a(図2(a)(b))表面の絶縁部分を突き破りアース線26等の導体を接続するために、筐体要素22,22aにボルトを挿入するための孔部を形成したり、筐体要素22,22aの表面を加工工具により削る等の、長時間を要する加工作業を行う必要がなくなる。この結果、筐体要素22,22aの接地作業に要する時間を短くできる。また、本実施の形態により得られる筐体要素22,22aにより筐体10(図9参照)を構成すれば、上記の図9に示したように、筐体10の電位が地面12とほぼ同じになるため、電磁波が筐体10内部に入り込みにくくなる。このため、筐体10の内部にプリント基板等の電気回路部を配置すれば、電気回路部において外部からの電磁波の影響を受けにくくできる。   Further, in order to break through the insulating portion of the surface of the casing elements 22 and 22a (FIGS. 2A and 2B) made of conductive resin and connect a conductor such as the ground wire 26, bolts are connected to the casing elements 22 and 22a. There is no need to perform a long working process such as forming a hole for inserting the surface of the casing element 22 or 22a with a machining tool. As a result, the time required for the grounding work of the casing elements 22 and 22a can be shortened. Further, if the casing 10 (see FIG. 9) is configured by the casing elements 22 and 22a obtained by the present embodiment, the potential of the casing 10 is substantially the same as that of the ground 12 as shown in FIG. Therefore, it is difficult for electromagnetic waves to enter the inside of the housing 10. For this reason, if an electric circuit unit such as a printed circuit board is arranged inside the housing 10, the electric circuit unit can be hardly affected by external electromagnetic waves.

また、図2(b)に示す別例のように、割れ目28の両側によりアース線26またはアース線に接続した他の導体を挟んだ状態で、筐体要素22aにアース線26を接続する場合には、筐体要素22aにアース線26を接続する作業をより行いやすくして、筐体要素22aの接地作業をより行いやすくなる。   Further, as in another example shown in FIG. 2B, the ground wire 26 is connected to the housing element 22a with the ground wire 26 or another conductor connected to the ground wire sandwiched between both sides of the crack 28. In this case, the work of connecting the ground wire 26 to the housing element 22a is made easier, and the work of grounding the housing element 22a is made easier.

[第2の発明の実施の形態]
図3から図4は、本発明の第2の実施の形態を示している。図3は、本実施の形態において、図1に対応する、素材20aの部分斜視図であり、図4は、本実施の形態において、図2(a)に対応する、筐体要素22bの部分斜視図である。筐体要素22bを構成する、図3に示す素材20aの場合、素材20aの片面(図3の上側面)の仮想直線上に、複数の凹部である、断面が円形または長円形の通孔30を間欠的に設けている。複数の通孔30は、素材20の厚さ方向(図3の上下方向)両側面を貫通している。これにより、素材20に複数の通孔30がミシン目状に形成された状態となる。
[Second Embodiment]
3 to 4 show a second embodiment of the present invention. FIG. 3 is a partial perspective view of the material 20a corresponding to FIG. 1 in the present embodiment, and FIG. 4 is a portion of the housing element 22b corresponding to FIG. 2A in the present embodiment. It is a perspective view. In the case of the material 20a shown in FIG. 3 constituting the housing element 22b, a through-hole 30 having a circular or oval cross section, which is a plurality of recesses, on an imaginary straight line on one side (upper side surface of FIG. 3) of the material 20a. Are provided intermittently. The plurality of through holes 30 penetrate both side surfaces of the material 20 in the thickness direction (vertical direction in FIG. 3). As a result, a plurality of through holes 30 are formed in the material 20 in a perforated shape.

本実施の形態の場合、このような素材20aを使用して、素材20aの長さ方向(図3の左右方向)両側を図3の矢印イ方向に同方向(図3の下方向)に向け曲げて、素材20を複数の通孔30部分で割ることにより、図4に示すように、割れた片側部分により筐体要素22bを構成する。そして、筐体要素22bの割れ跡25(図4の梨地で示す部分)に、上記の図2(a)に示す場合と同様にして、アース線26(図2(a)参照)を直接または図示しない他の導体を介して接続する。   In the case of the present embodiment, such a material 20a is used, and both sides of the material 20a in the length direction (left and right direction in FIG. 3) are directed in the same direction (downward direction in FIG. 3) in the direction of arrow A in FIG. By bending and dividing the material 20 by a plurality of through-hole 30 portions, as shown in FIG. 4, the housing element 22b is constituted by one side portion that is broken. Then, the ground wire 26 (see FIG. 2A) is directly or directly attached to the crack 25 of the housing element 22b (the portion indicated by the satin surface in FIG. 4) in the same manner as shown in FIG. The connection is made through another conductor (not shown).

このような本実施の形態の場合には、素材20を複数の通孔30部分で割ることにより、筐体要素22bを構成する。このため、筐体要素22bに導電性を有する部分を露出させる作業は短時間で容易に行える。その他の構成および作用は、上記の第1の実施の形態と同様であるため、重複する説明は省略する。   In the case of this embodiment, the casing element 22b is configured by dividing the material 20 by a plurality of through-holes 30. For this reason, the operation | work which exposes the part which has electroconductivity to the housing | casing element 22b can be easily performed in a short time. Other configurations and operations are the same as those in the first embodiment described above, and a duplicate description is omitted.

[第3の発明の実施の形態]
なお、図5は、本発明の第3の実施の形態に係る筐体要素22cを示す、図2(a)に対応する部分斜視図である。図5に示すように、筐体要素22cを構成する素材に設ける複数の凹部は、厚さ方向他面(図5の下面)に貫通しない凹孔とすることもできる。その他の構成および作用は、上記の図3から図4に示した第2の実施の形態と同様である。
[Third Embodiment]
FIG. 5 is a partial perspective view corresponding to FIG. 2A, showing a housing element 22c according to the third embodiment of the present invention. As shown in FIG. 5, the plurality of concave portions provided in the material constituting the housing element 22 c can be concave holes that do not penetrate the other surface in the thickness direction (the lower surface in FIG. 5). Other configurations and operations are the same as those of the second embodiment shown in FIGS.

なお、上記の図3から図5に示した第2の実施の形態および第3の実施の形態において、筐体要素22b、22cを構成する際に、筐体要素22b、22cを構成する素材20a(図3)を複数の通孔30部分または複数の凹孔部分で割れ目を残したままとなるように一部の結合部を残して割ることにより、割れ目の両側に導電性を有する部分を露出させ、露出させた導電性を有する部分にアース線を直接または他の導体を介して接続することもできる。   In the second embodiment and the third embodiment shown in FIGS. 3 to 5 above, when the casing elements 22b and 22c are configured, the material 20a that configures the casing elements 22b and 22c. (FIG. 3) exposes the conductive parts on both sides of the cracks by splitting them leaving some joints so that the cracks remain in the plurality of through-hole 30 parts or the plurality of recessed hole parts. It is also possible to connect the ground wire directly or through another conductor to the exposed conductive portion.

[第4の発明の実施の形態]
図6は、本発明の第4の実施の形態において、図1に対応する、素材20bの部分斜視図である。図6に示すように、本実施の形態に係る筐体要素を構成する素材20bは、凹部である断面V字形のV字溝24aを幅方向片面(図6の表側面)に開口させるように形成している。すなわち、上記の図1に示した第1の実施の形態の場合に、素材20に設けるV字溝24を、V字の幅広の開口端が素材20の厚さ方向片面(図1の上面)に開口するように形成しているが、本実施の形態では、素材20に設けるV字溝24aを、V字の幅広の開口端が素材20の幅方向片面に開口するように形成している。また、V字溝24aの両端は、素材20の厚さ方向(図6の上下方向)両面に達している。
[Fourth Embodiment]
FIG. 6 is a partial perspective view of the material 20b corresponding to FIG. 1 in the fourth embodiment of the present invention. As shown in FIG. 6, the material 20 b constituting the housing element according to the present embodiment has a V-shaped groove 24 a having a V-shaped cross section, which is a recess, opened on one side in the width direction (the front side in FIG. 6). Forming. That is, in the case of the first embodiment shown in FIG. 1, the V-shaped groove 24 provided in the material 20 has a V-shaped wide opening end on one side in the thickness direction of the material 20 (upper surface in FIG. 1). In this embodiment, the V-shaped groove 24 a provided in the material 20 is formed so that the wide opening end of the V shape opens on one side in the width direction of the material 20. . Further, both ends of the V-shaped groove 24a reach both surfaces of the material 20 in the thickness direction (vertical direction in FIG. 6).

このような本実施の形態の場合、素材20bの長さ方向(図6の左右方向)両側を図6の矢印イ方向に同方向(図6の裏方向)に向け曲げることにより、素材20bをV字溝24a部分で割り、割れ跡または割れ目の両側に導電性を有する部分を露出させた筐体要素を構成する。そして、筐体要素の割れ跡または割れ目の両側に露出した、導電性を有する部分に、アース線26(図2(a)(b)参照)を、直接または他の導体を介して接続する。その他の構成および作用は、上記の図1から図2に示した第1の実施の形態と同様であるため、重複する説明を省略する。   In the case of this embodiment, the material 20b is bent by bending both sides of the material 20b in the length direction (left-right direction in FIG. 6) in the same direction (back direction in FIG. 6) in the direction of arrow A in FIG. The casing element is formed by dividing the V-shaped groove 24a and exposing the conductive portions on both sides of the crack or the crack. And the ground wire 26 (refer FIG. 2 (a) (b)) is connected to the part which has the electroconductivity exposed to the crack mark of a housing | casing element, or both sides of a crack, directly or via another conductor. Other configurations and operations are the same as those of the first embodiment shown in FIGS.

[第5の発明の実施の形態]
図7は、本発明の第5の実施の形態において、図1に対応する、素材20cの部分斜視図である。本実施の形態の場合、図7に示すように、筐体要素を構成する素材20cの厚さ方向(図7の上下方向)両面に、薄肉部32を挟んで対向する状態でそれぞれ直線状の2個の凹溝34を設けている。2個の凹溝34の両端は、素材20の幅方向(図7の表裏方向)両端に達している。本実施の形態では、2個の凹溝34がそれぞれ凹部に対応する。
[Fifth Embodiment]
FIG. 7 is a partial perspective view of the material 20c corresponding to FIG. 1 in the fifth embodiment of the present invention. In the case of the present embodiment, as shown in FIG. 7, each of the materials 20c constituting the housing element has a linear shape with both sides facing each other with the thin portion 32 interposed therebetween in the thickness direction (vertical direction in FIG. 7). Two concave grooves 34 are provided. Both ends of the two concave grooves 34 reach both ends in the width direction of the material 20 (front and back direction in FIG. 7). In the present embodiment, the two concave grooves 34 correspond to the concave portions, respectively.

このような本実施の形態の場合、素材20cの長さ方向(図7の左右方向)両側を図7の矢印イ方向に同方向(図7の下方向)に向け曲げることにより、素材20cを2個の凹溝34部分で割り、割れ跡または割れ目の両側に導電性を有する部分を露出させた筐体要素を構成する。そして、筐体要素の割れ跡または割れ目の両側に露出した、導電性を有する部分に、アース線26(図2(a)(b)参照)を直接または他の導体を介して接続する。その他の構成および作用は、上記の図1から図2に示した第1の実施の形態と同様であるため、重複する説明を省略する。   In the case of this embodiment, the material 20c is bent by bending both sides of the material 20c in the length direction (left and right direction in FIG. 7) in the same direction (downward direction in FIG. 7) in the direction of arrow A in FIG. The housing element is formed by dividing the two concave groove portions 34 and exposing portions having conductivity on both sides of the crack mark or the crack. And the ground wire 26 (refer FIG. 2 (a) (b)) is connected to the part which has the electroconductivity exposed to the crack mark of a housing | casing element, or both sides of a crack directly or via another conductor. Other configurations and operations are the same as those of the first embodiment shown in FIGS.

[第6の発明の実施の形態]
図8は、本発明の第6の実施の形態において、図1に対応する、素材20dの部分斜視図である。本実施の形態の場合、図8に示すように、筐体要素を構成する素材20dを板状とするとともに、素材20dに幅方向(図8の表裏方向)に貫通する、直線状で断面矩形状の孔部である通孔36を設けている。通孔36の両端は、素材20dの幅方向両端に達している。これにより、素材20dの一部は中空状に構成される。本実施の形態では、通孔36が凹部に対応する。
[Sixth Embodiment]
FIG. 8 is a partial perspective view of the material 20d corresponding to FIG. 1 in the sixth embodiment of the present invention. In the case of the present embodiment, as shown in FIG. 8, the material 20d constituting the housing element is formed into a plate shape, and the material 20d is penetrated in the width direction (front and back direction in FIG. 8) and has a linear shape and a rectangular cross section. A through hole 36 which is a hole having a shape is provided. Both ends of the through hole 36 reach both ends in the width direction of the material 20d. Thereby, a part of the raw material 20d is formed in a hollow shape. In the present embodiment, the through hole 36 corresponds to the recess.

このような本実施の形態の場合、素材20dの長さ方向(図8の左右方向)両側を図8の矢印イ方向に同方向(図8の下方向)に向け曲げることにより、素材20を通孔36部分で割り、割れ跡または割れ目の両側に導電性を有する部分を露出させた筐体要素を構成する。そして、筐体要素の割れ跡または割れ目の両側に露出した、導電性を有する部分に、アース線26(図2(a)(b)参照)を直接または他の導体を介して接続する。その他の構成および作用は、上記の図1から図2に示した第1の実施の形態と同様であるため、重複する説明を省略する。   In the case of this embodiment, the material 20 is bent by bending both sides of the material 20d in the length direction (left-right direction in FIG. 8) in the same direction (downward in FIG. 8) in the direction of arrow A in FIG. The casing element is formed by dividing the through hole 36 portion and exposing portions having conductivity on both sides of the crack or the crack. And the ground wire 26 (refer FIG. 2 (a) (b)) is connected to the part which has the electroconductivity exposed to the crack mark of a housing | casing element, or both sides of a crack directly or via another conductor. Other configurations and operations are the same as those of the first embodiment shown in FIGS.

なお、素材20dに設ける通孔36を、素材20dの長さ方向(図8の左右方向)に貫通する状態で設けることもできる。この場合、素材20dの幅方向(図8の表裏方向)両側部分を同方向に向け曲げることにより、素材20を通孔36部分で割り、筐体要素を構成する。   In addition, the through-hole 36 provided in the raw material 20d can also be provided in a state of penetrating in the length direction (left-right direction in FIG. 8) of the raw material 20d. In this case, by bending both sides of the material 20d in the width direction (front and back direction in FIG. 8) in the same direction, the material 20 is divided by the through-hole 36 portion to constitute a casing element.

なお、図示は省略するが、上記の各実施の形態において、筐体要素を構成する素材の側面に、凹部の代わりに段差面を有する段部を形成することもできる。このように素材を、段部を有する形状に成形する場合には、素材を段部部分で割ることにより、割れ跡または割れ目に導電性を有する部分を露出させた筐体要素を構成し、筐体要素において、割れ跡または割れ目の両側に露出した、導電性を有する部分にアース線を直接または他の導体を介して接続することができる。このような場合にも、素材は段部部分で割れやすくなるため、筐体要素に導電性を有する部分を露出させる作業を短時間で容易に行える。このため、筐体要素の接地作業に要する時間を短くできる。   In addition, although illustration is abbreviate | omitted, in each said embodiment, the step part which has a level | step difference surface instead of a recessed part can also be formed in the side surface of the raw material which comprises a housing | casing element. When the material is formed into a shape having a stepped portion as described above, a case element is formed by dividing the material by the stepped portion, thereby exposing a cracked trace or a conductive portion in the crack. In the body element, the ground wire can be connected directly or via other conductors to the conductive portions exposed on both sides of the crack or the crack. Even in such a case, since the material easily breaks at the step portion, the work of exposing the conductive portion to the casing element can be easily performed in a short time. For this reason, the time required for the grounding operation of the casing element can be shortened.

第1の発明の実施の形態に係る導電性樹脂製の電磁波シールド部材の接地方法により接地する、電磁波シールド部材である筐体要素を構成する素材を示す部分斜視図である。It is a fragmentary perspective view which shows the raw material which comprises the housing | casing element which is an electromagnetic wave shielding member grounded with the earthing | grounding method of the electromagnetic shielding member made from the conductive resin which concerns on embodiment of 1st invention. (a)は図1の素材を完全に割ることにより構成する筐体要素を示す部分斜視図であり、(b)は図1の素材を割れ目を残して割ることにより構成する筐体要素の別例を示す部分斜視図である。(A) is a fragmentary perspective view which shows the housing | casing element comprised by dividing the raw material of FIG. 1 completely, (b) is another housing element comprised by dividing the raw material of FIG. 1 leaving a crack. It is a fragmentary perspective view which shows an example. 第2の発明の実施の形態において、図1に対応する、素材の部分斜視図である。In embodiment of 2nd invention, it is the fragmentary perspective view of a raw material corresponding to FIG. 同じく図2(a)に対応する、筐体要素の部分斜視図である。FIG. 3 is a partial perspective view of a housing element corresponding to FIG. 2 (a). 第3の発明の実施の形態に係る筐体要素を示す、図2(a)に対応する部分斜視図である。It is a fragmentary perspective view corresponding to Drawing 2 (a) showing a case element concerning an embodiment of the 3rd invention. 第4の発明の実施の形態において、図1に対応する、素材の部分斜視図である。In embodiment of 4th invention, it is a fragmentary perspective view of a raw material corresponding to FIG. 第5の発明の実施の形態において、図1に対応する、素材の部分斜視図である。In embodiment of 5th invention, it is a fragmentary perspective view of a raw material corresponding to FIG. 第6の発明の実施の形態において、図1に対応する、素材の部分斜視図である。In embodiment of 6th invention, it is a fragmentary perspective view of a raw material corresponding to FIG. 筐体内部に配置する電気回路部において、外部からの電磁波の影響を受けにくくするために、導電材料製とした筐体を接地する状態を示す模式図である。FIG. 5 is a schematic diagram showing a state in which a casing made of a conductive material is grounded in order to make it less susceptible to external electromagnetic waves in an electric circuit unit disposed inside the casing. 従来から考えられている、筐体要素を接地するための構造の1例を示す部分断面図である。It is a fragmentary sectional view showing one example of the structure for grounding the case element considered conventionally.

符号の説明Explanation of symbols

10 筐体、12 地面、14 筐体要素、16 金属物、18 ボルト、19 孔部、20,20a,20b,20c,20d 素材、22,22a,22b,22c 筐体要素、24,24a V字溝、25 割れ跡、26 アース線、28 割れ目、30 通孔、32 薄肉部、34 凹溝、36 通孔。   10 housing, 12 ground, 14 housing element, 16 metal object, 18 bolt, 19 hole, 20, 20a, 20b, 20c, 20d material, 22, 22a, 22b, 22c housing element, 24, 24a V-shaped Groove, 25 crack mark, 26 ground wire, 28 crack, 30 through hole, 32 thin part, 34 concave groove, 36 through hole.

Claims (5)

電磁波シールド部材を構成する素材を、導電性樹脂により側面に凹部または段部を有する形状に成形した後、
素材を凹部部分または段部部分で割ることにより、割れ跡または割れ目に導電性を有する部分を露出させた電磁波シールド部材を構成し、
電磁波シールド部材において、割れ跡または割れ目の両側に露出した、導電性を有する部分にアース線を直接または他の導体を介して接続することを特徴とする導電性樹脂製の電磁波シールド部材の接地方法。
After forming the material constituting the electromagnetic wave shielding member into a shape having a recess or a step on the side surface with a conductive resin,
By dividing the material by the recessed portion or the stepped portion, an electromagnetic shielding member in which the conductive portion is exposed at the crack mark or the crack is constituted,
A grounding method for an electromagnetic shielding member made of a conductive resin, wherein an earth wire is connected directly or via another conductor to a conductive portion exposed on both sides of a crack mark or a crack in an electromagnetic shielding member .
請求項1に記載の導電性樹脂製の電磁波シールド部材の接地方法において、
電磁波シールド部材を構成する素材に設ける凹部または段部は、素材の側面に断面V字形で直線状に設けるV字溝とすることを特徴とする導電性樹脂製の電磁波シールド部材の接地方法。
In the grounding method of the electromagnetic shielding member made of conductive resin according to claim 1,
A method for grounding an electromagnetic shielding member made of a conductive resin, wherein the concave portion or the step portion provided in the material constituting the electromagnetic shielding member is a V-shaped groove provided in a straight shape with a V-shaped cross section on the side surface of the raw material.
請求項1に記載の導電性樹脂製の電磁波シールド部材の接地方法において、
電磁波シールド部材を構成する素材に設ける凹部または段部は、素材の側面に仮想直線上に間欠的に設ける複数の凹部とすることを特徴とする導電性樹脂製の電磁波シールド部材の接地方法。
In the grounding method of the electromagnetic shielding member made of conductive resin according to claim 1,
A method for grounding an electromagnetic shielding member made of conductive resin, wherein the concave portions or step portions provided in the material constituting the electromagnetic shielding member are a plurality of concave portions provided intermittently on a virtual straight line on a side surface of the raw material.
請求項1に記載の導電性樹脂製の電磁波シールド部材の接地方法において、
電磁波シールド部材を構成する素材に設ける凹部または段部は、素材の両面に薄肉部を挟んで対向する状態で設けるそれぞれ直線状の2個の凹溝とすることを特徴とする導電性樹脂製の電磁波シールド部材の接地方法。
In the grounding method of the electromagnetic shielding member made of conductive resin according to claim 1,
The concave portion or the step portion provided in the material constituting the electromagnetic wave shielding member is made of conductive resin, characterized in that each of the concave portions or the step portion provided on both surfaces of the raw material is opposed to each other with the thin portion sandwiched therebetween. Grounding method for electromagnetic wave shielding member.
請求項1に記載の導電性樹脂製の電磁波シールド部材の接地方法において、
電磁波シールド部材を構成する素材は板状とするとともに、素材に設ける凹部または段部は、素材の長さ方向または幅方向に貫通する直線状の孔部とすることを特徴とする導電性樹脂製の電磁波シールド部材の接地方法。
In the grounding method of the electromagnetic shielding member made of conductive resin according to claim 1,
The material constituting the electromagnetic shielding member is plate-shaped, and the recess or step provided in the material is a linear hole penetrating in the length direction or width direction of the material. Grounding method of electromagnetic shielding member.
JP2007030194A 2007-02-09 2007-02-09 Method for grounding electromagnetic wave shielding member formed of conductive resin Pending JP2008198697A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152984A (en) * 2008-12-25 2010-07-08 Alphana Technology Co Ltd Disk drive
US8300353B2 (en) 2009-11-19 2012-10-30 Alphana Technology Co., Ltd. Disk drive device having function of discharging static electricity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152984A (en) * 2008-12-25 2010-07-08 Alphana Technology Co Ltd Disk drive
US8300353B2 (en) 2009-11-19 2012-10-30 Alphana Technology Co., Ltd. Disk drive device having function of discharging static electricity

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