JP2008187438A - Imaging module, and adjusting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small imaging module exhibiting high performance, as a whole, including from a photographing optical system to an imaging element. <P>SOLUTION: A lens barrel unit 2 and an imaging circuit unit 1 are integrated and an imaging element unit 51 outputting an object image as digital image data is provided in the imaging circuit unit 1. The imaging element unit 51 comprises an imaging element 61 performing photoelectric conversion of the object image, an A/D conversion circuit 202 performing digital conversion of the output signal from the imaging element, a memory circuit 205 storing the location information (coordinate information) of a pixel outputting an abnormal value out of a plurality of pixels of the imaging element 61, and a circuit 204 for interpolating the pixel output corresponding to the output from the A/D conversion circuit 202 by the outputs from the peripheral pixels based on the information stored in the memory circuit 205. High definition image data from which the impact of pixel defect, or the dust and flaw of a photo-optical system are removed can be obtained without performing adjustment on the body side of a digital camera. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an imaging module and an adjustment device, and more particularly to a so-called imaging module including a lens unit and an imaging circuit unit, and an adjustment device for the imaging module.

An imaging apparatus such as a digital camera is composed of a combination of a plurality of units. Among them, in particular, an imaging module in which a lens unit and an imaging circuit unit are combined is a main part of the imaging apparatus. In recent years, even this imaging module alone has become a transaction object.

By the way, in recent years, digital cameras have been miniaturized, and there has been a strong demand for miniaturization of imaging modules, and there is a technology for efficiently arranging an imaging element package and its peripheral circuit package on a mounting substrate. It has been proposed (see, for example, Patent Document 1 and Patent Document 2). In addition, when dealing with an image pickup module alone, it is necessary that the lens unit and the image pickup circuit unit are combined, and the accuracy of both image pickup modules is ensured. In Patent Document 3, in order to realize an imaging module having high optical performance as a whole, a parameter value indicating the optical performance of the imaging optical system is detected by the imaging device, and the position of the imaging device is determined based on the detected value. It is disclosed to move parallel to the optical axis.
JP 2003-219227 A Japanese Patent Laying-Open No. 2005-085976 JP 2000-050146 A

As described above, various proposals have been made regarding the downsizing of the imaging module. As the electrical circuit of the imaging system, various circuits such as an imaging element driving circuit, an analog signal processing circuit, and an AD conversion circuit are provided in addition to the imaging element. is required. For this reason, in the conventional mounting method in which the respective IC packages are arranged on the substrate, the substrate area becomes large, and it is difficult to reduce the size of the imaging module. Further, if the pixel of the image sensor is defective in the inspection after assembling the image capturing module, the image capturing module is discarded, resulting in waste.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a small-sized imaging module and adjusting device that have high performance as a whole including the imaging optical system to the imaging device.

In order to achieve the above object, an image pickup module according to a first invention is an image pickup module in which a lens unit and an image pickup circuit unit are integrated. The image pickup circuit unit outputs a subject image as digital image data. The image pickup device package includes an image pickup device having a plurality of pixels for photoelectrically converting a subject image, an A / D conversion circuit for digitally converting an output signal of the image pickup device, and the image pickup device. Among the plurality of pixels, a storage circuit that stores position information of a pixel that outputs an abnormal value, and a pixel output corresponding to the output of the A / D conversion circuit based on the information stored in the storage circuit. An interpolation circuit for interpolating with the output of the pixel is included.

In the imaging module according to a second invention, in the first invention, the memory circuit is a nonvolatile memory.
According to a third aspect of the present invention, in the image pickup module according to the first aspect, the storage circuit stores a defect type of a pixel that outputs the abnormal value, and the interpolation circuit corresponds to the defect type. Determine the interpolation operation.
Furthermore, the adjustment device that can be connected to the imaging module according to the fourth invention can store the positional information of the abnormal output pixel in the storage circuit in the first invention.

In order to achieve the above object, an imaging module according to a fifth aspect of the present invention is an imaging module in which a lens unit and an imaging circuit unit are integrated. The imaging circuit unit outputs a subject image as digital image data. The image pickup device package includes an image pickup device having a plurality of pixels for photoelectrically converting a subject image, an A / D conversion circuit for digitally converting an output signal of the image pickup device, and the A / D. Among the outputs of the conversion circuit, an interpolation circuit for interpolating the pixel output indicating the abnormal value with the output of the surrounding pixels is included.

In order to achieve the above object, an image pickup module according to a sixth aspect of the present invention is an image pickup module in which a lens unit and an image pickup circuit unit are integrated, and the image pickup circuit unit outputs a subject image as digital image data. The image sensor package includes an image sensor that photoelectrically converts the subject image and outputs an image signal, an A / D conversion circuit that digitally converts the image signal, and a defect in the image sensor is corrected. And a correction circuit for correcting the A / D converted image signal based on the correction data stored in the storage circuit.
In the imaging module according to a seventh invention, in the sixth invention, the correction data is information indicating a position of a pixel in which the defect exists.
According to an eighth aspect of the present invention, there is provided an imaging module according to the sixth aspect, further comprising a lens unit for forming the subject image, and the storage circuit corrects a malfunction of the photographing optical system in the lens unit. Optical correction data is stored, and the correction circuit outputs image data in which a malfunction of the photographing optical system is corrected based on the optical correction data.

In order to achieve the above object, an image pickup module adjustment apparatus according to a ninth aspect of the present invention is an image pickup module adjustment apparatus in which a lens unit and an image pickup circuit unit are integrated, wherein a subject image arranged in the image pickup circuit unit is photoelectrically converted. Based on the output of the imaging device, an abnormal value of the output of the imaging device derived from a defect of the imaging device in the imaging circuit unit or a malfunction of the photographing optical system in the lens unit is detected, and the defect or Correction data calculation means for obtaining correction data for correcting a defect and transmission means for transmitting the correction data obtained by the correction data calculation means to a storage circuit in the imaging module.

According to the present invention, position information of a pixel that outputs an abnormal value among a plurality of pixels of the image sensor is stored, and the output of the image sensor is corrected based on the stored information. To an image pickup device as a whole, and a small image pickup module and adjustment device can be provided.

Hereinafter, preferred embodiments will be described using an imaging module to which the present invention is applied and an adjustment device thereof according to the drawings. The imaging module according to this embodiment is a photographic optical system with a variable focal length, an imaging device that photoelectrically converts a subject image formed by the imaging optical system, and an image signal output from the imaging device. Circuit. In addition, a camera shake detection sensor that detects the amount of camera shake and an image shake correction device for removing the influence of camera shake according to the output of the sensor are provided. Furthermore, the adjusting device used in combination with the imaging module is attached to the presence or absence of a pixel defect or the like, a flaw in the photographing optical system, or the photographing optical system based on an image signal output from each pixel of the image pickup device. Interpolation data for detecting dust and electrically correcting the image signal is written to a storage circuit in the imaging module.

FIG. 1 is an external perspective view of an imaging module 100 of a digital camera according to an embodiment of the present invention as viewed from the photographic lens side. The imaging module 100 includes an imaging circuit unit 1 having an image blur correction function and a lens barrel unit 2. The lens barrel unit 2 includes a plurality of optical elements, and includes a photographing optical system 2b that forms a subject image, and a plurality of barrels that hold the photographing optical system 2b movably in a direction along the optical axis. A lens barrel 2a, a focus motor 2c for driving a lens barrel that holds a focus adjusting optical system in the lens barrel 2a, and an optical system that performs a zooming operation in the lens barrel 2a. A zoom motor 2d for driving a lens barrel to be held, a focus motor 2c, a zoom motor 2d and a corresponding lens barrel connected to each other and a mechanism for transmitting a driving force, and a diaphragm or It is configured by a light amount adjustment mechanism including an ND filter.

The imaging module 100 is configured by assembling the imaging circuit unit 1 to the lens barrel unit 2. In this case, the base 10 that is a basic component of the imaging circuit unit 1 is fixed to the base portion of the lens barrel unit 2. At this time, the positional relationship between the lens barrel unit 2 and the imaging circuit unit 1 is such that the optical axis of the imaging optical system 2b of the lens barrel unit 2 is the imaging element 61 (see FIG. 2) in the imaging element unit 51 (see FIG. 2). 4) and the optical axis of the photographing optical system 2b is orthogonal to the light receiving surface of the image sensor section 51.

Next, the configuration of the imaging circuit unit 1 will be described in detail with reference to FIG. The imaging circuit unit 1 mainly includes a base 10, a first moving frame 11, a second moving frame 31, a first drive mechanism unit 14, a second drive mechanism unit 34, and an image sensor unit 50. The base 10 is a basic component, and the first moving frame 11 is supported to be displaceable with respect to the base 10, and the second moving frame 31 is supported to be displaceable with respect to the first moving frame 11. ing. The image sensor unit 50 is supported by the second moving frame 31 and has an image sensor section 51. As shown in FIG. 3, an image sensor 61 is provided in the image sensor section 51. The first drive mechanism unit 14 is fixed to the base 10 and is an assembly unit in which the first moving frame 11, the second moving frame 31, and the image sensor unit 50 are assembled (hereinafter, this assembly unit is referred to as a movable unit). It comprises a drive source and a drive mechanism for displacing 80 in the first direction (the direction along arrow Y in FIG. 2). The second drive mechanism unit 34 is fixed to the base 10 and includes a drive source for displacing the second moving frame 31 and the image sensor unit 50 in the second direction (the direction along the arrow X in FIG. 2). It consists of a drive mechanism.

The above-described base 10 is a frame-like member having an opening window 10x at a substantially central portion, and the first drive mechanism portion 14 and the second drive mechanism portion 34 are fixedly provided. Here, the first drive mechanism unit 14 is disposed on the upper side of the base 14, and the second drive mechanism unit 34 extends along the first direction (Y direction) from the region where the first drive mechanism unit 14 is disposed. It is arranged in the vicinity of the extended region.

The first drive mechanism unit 14 is fixed to a predetermined part of the base 10 with screws 21a, and is fixed to one end of the rotary shaft of the first motor 15 and the first motor 15 for driving the first moving frame. A first pinion 16 provided, a first gear 17 meshing with the first pinion 16, a first lead screw 18 pivotally supported on the same axis of the first gear 17 and driven by the first motor 15, The first lead screw 18 is configured by a first nut 19 or the like that is displaced along the first direction by the rotation of the first lead screw 18. And in the state where each component of the 1st drive mechanism part 14 was arranged in a predetermined part of base 10, the 1st drive part press board 20 is screw 21b so that these members may be covered from the outside. It is fixed.

The first nut 19 is formed with a female thread portion that meshes with the first lead screw 18 at a substantially central portion thereof, and is engaged with a predetermined engagement portion of the first moving frame 11 to thereby A rotation restricting portion 19a that restricts the rotation of the first nut 19 itself with the rotation of the one lead screw 18 is provided. In addition, one end of the first screw 18 is pivotally supported with respect to the first drive unit pressing plate 20. Further, the other end is pivotally supported at the fixed portion of the base 10 so as to be rotatable. Therefore, with this configuration, when the first motor 15 is driven, the first pinion 16 is rotated, and the first lead screw 18 is rotated in the same direction via the first gear 17 engaged therewith. As the first lead screw 18 rotates, the first nut 19 moves in the first direction (Y direction in FIG. 2).

In a state where the imaging circuit unit 1 is assembled, the first nut 19 of the first drive mechanism unit 14 is disposed so as to contact and engage with the inner side of the first engagement portion 11 c of the first moving frame 11. ing. The first engaging portion 11c is formed with a first cutout portion 11e having a substantially C-shaped cross section. The first cutout portion 11e is provided to prevent the first lead screw 18 from interfering while ensuring the contact between the first engagement portion 11c and the first nut 19. The position at which the first nut 19 and the first engaging portion 11c are engaged with each other between the first urging spring 13 and the first positioning guide shaft 12 when the imaging circuit unit 1 is viewed from the front side. Arranged in the area between.

In the vicinity of the first drive mechanism section 14, a first position detection sensor 24 is fixed to a predetermined fixing section of the base 10. Corresponding to the sensor part of the first position detection sensor 24, a first detection part 11d is provided on the first moving frame 11 side. As the first moving frame 11 moves, the first detection unit 11 d passes through the sensor unit of the first position detection sensor 24. Thereby, the first position detection sensor 24 can detect the movement of the first moving frame 11.

The second drive mechanism section 34 basically has the same configuration as the first drive mechanism section 14 described above, and is fixed to a predetermined part of the base 10 by screws 41a to drive the second moving frame 31. A second motor 35, a second pinion 36 fixed to one end of the rotation shaft of the second motor 35, a second gear 37 meshing with the second pinion 36, and the coaxial of the second gear 37 A second lead screw 38 supported on the upper side and driven by a second motor, and meshed with the second lead screw 38 and rotated in the second direction (second direction X in FIG. 2). The second nut 39 and the like that are displaced along Then, in a state where the respective constituent members of the second drive mechanism section 34 are disposed at predetermined portions of the base 10, the second drive portion pressing plate 40 is screwed by screws 41 b so as to cover these constituent members from the outside. It is fixed.

The second nut 39 is formed with a female screw portion that meshes with the second lead screw 38 at a substantially central portion thereof, and is engaged with an engaging portion of the base 10 at a part of the outer peripheral edge portion. By doing so, it has the rotation control part 39a which controls that 2nd nut 39 itself rotates with rotation of the 2nd lead screw 38. FIG. Further, one end portion of the second lead screw 38 is pivotally supported with respect to the second drive unit pressing plate 40. The other end is pivotally supported at the fixed portion of the base 10 so as to be rotatable. Therefore, with this configuration, when the second motor 35 is driven, the second pinion 36 is rotated, and the second lead screw 38 is rotated in the same direction via the second gear 37 engaged therewith. As the second lead screw 38 rotates, the second nut 39 moves in the second direction (X direction in FIG. 2).

In a state in which the imaging circuit unit 1 is assembled, the second nut 39 of the second drive mechanism 34 is an inner portion of the second engagement portion 31 c of the engagement member 45 that is disposed integrally with the second moving frame 31. It is arrange | positioned so that it may contact | abut and engage with. The second engaging portion 31 has a second cutout portion 31e that has a substantially U-shaped cross section and is formed to extend in the first direction (Y direction in FIG. 2). The second notch 31e is configured so that the second engaging portion 31 and the second nut are arranged when the second moving frame 31 is displaced along the same direction as the first moving frame 11 is displaced along the first direction. 39, the contact position is displaced along the same direction (first direction). At this time, in order to prevent the second lead screw 38 from interfering with the second engagement portion 31c while securing the contact state between the two (the second engagement portion 31c and the second nut 39), the second engagement is performed. A joint portion 31e is provided.

The second notch 31e is disposed so as to surround the second lead screw 38 and is formed to extend in the first direction (Y direction in FIG. 2). And the notch amount of the 2nd notch part 31e is set so that it may become larger than the movement amount along the 1st direction of the 1st moving frame 11. FIG. Further, the second engaging portion 31c and the second nut 39 are disposed in the vicinity of a region where the region where the first drive mechanism 14 is disposed is extended in the first direction.

A second position detection sensor 44 is fixed to a predetermined fixing portion of the base 10 in the vicinity of the second drive mechanism portion 34. Corresponding to the sensor part of the second position detection sensor 44, a second detection part 31d is provided on the second moving frame 31 side. As the second moving frame 31 moves, the second detection unit 31d passes through the sensor part of the second position detection sensor 44, and the second position detection sensor 44 is connected to the second movement frame 31. The movement of 31 can be detected.

As described above, the first moving frame 11 is a frame-like member having the opening window 11x in the substantially central portion, and is supported so as to be displaceable with respect to the base 10. The first moving frame 11 is supported so as to be displaceable with respect to the base 10 along a first direction (Y direction in FIG. 2) in a plane parallel to the light receiving surface of the image sensor unit 51. In order to enable such displacement, the first moving frame 11 is a first positioning guide (guide shaft) with respect to the base 10 and is a support shaft that supports the first moving frame 11. The first positioning guide shaft 12 and the first moving frame 11 are guided (guided) along the first direction, and the first moving frame 11 is restricted from rotating around the first positioning guide shaft 12. It is supported so as to be displaceable along the first direction via a first rotation stop guide shaft 22 which is a rotation stop guide (guide) shaft.

A first urging force is formed between the first moving frame 11 and the base 10 by a contractile coil spring or the like, and urges the first moving frame 11 along the first direction (Y direction in FIG. 2). A spring 13 is suspended. The first biasing spring 13 is parallel to the major axis direction of the first positioning guide shaft 12 along the side of the first rotation stopping guide shaft 22 in the vicinity of the first positioning guide shaft 12. They are arranged side by side. Further, in the vicinity of the first rotation stop guide shaft 22, an extensible coil spring or the like is used, and the first moving frame 11 is urged along the first direction and is parallel to the light receiving surface of the imaging element unit 51. A first rotation urging spring 23 for urging and urging the first moving frame in a plane is disposed.

The urging directions of the first urging spring 13 and the first rotation urging spring 23 are substantially the same direction, and the first urging spring 13 and the first rotation urging spring 23 are both first with respect to the first positioning guide shaft 12. By being arranged on the side of the guide shaft 22 for one rotation stop, the first moving frame 11 is urged to rotate in the same direction within a plane parallel to the light receiving surface of the imaging element unit 51. For this reason, the play between the guide shaft and its fitting portion can be efficiently moved to one side.

The second moving frame 31 is a frame-like member having an opening window 31 x at a substantially central portion, and is supported so as to be displaceable with respect to the first moving frame 11. The second moving frame 31 is displaceable along the first direction (Y direction in FIG. 2) in the plane parallel to the light receiving surface of the image sensor unit 51 together with the first moving frame 11, and the first direction. Is supported so as to be displaceable with respect to the first moving frame 11 along a second direction (X direction in FIG. 2) in a plane substantially perpendicular to the first moving frame 11.

For this purpose, the second moving frame 31 is provided on the first moving frame 11 and the second positioning guide shaft 32, which is a second positioning guide (guide) shaft with respect to the first moving frame 11. A second anti-rotation guide that guides the moving frame 31 along the second direction (X direction in FIG. 2) and restricts the rotation of the second moving frame 31 around the second positioning guide shaft 32. The shaft 42 is supported so as to be displaceable along the second direction.

Between the 2nd moving frame 31 and the base 10, it consists of a coiling spring etc., and the 2nd urging | biasing which urges | biases the 2nd moving frame 31 along a 2nd direction (X direction of FIG. 2). A spring 33 is suspended. The second urging springs 33 are arranged side by side in the vicinity of the second positioning guide shaft 32 so as to be parallel to the major axis direction of the second positioning guide shaft 32. Further, in the vicinity of the second rotation stop guide shaft 42, an extensible coil spring or the like is provided, and the second moving frame 31 is urged along the second direction and is parallel to the light receiving surface of the image sensor 51. A second rotation urging spring 43 for urging and urging the second moving frame 31 in a plane is provided. Note that the direction of the rotation biasing force generated by the first rotation biasing spring 23 and the direction of the rotation biasing force generated by the second rotation biasing spring 43 are set to be the same direction.

The image sensor unit 50 includes an image sensor section 51, a flexible printed circuit board 52 mounted with the image sensor section 51 and connected to the image sensor section 51, and the flexible printed circuit board 52 held on the back side of the second moving frame 31. The image sensor holding plate 53 is mainly configured. Then, on the front surface side of the light receiving surface of the image sensor 61 (see FIG. 3) in the image sensor section 51, the sealing member 54, the low pass filter (LPF) / infrared filter 55, the light shielding sheet 56, LPF from the light receiving surface side. A pressing plate 57 is provided. The imaging element unit 50 configured as described above is incorporated from the back side of the imaging circuit unit 1.

Next, a basic operation of the imaging circuit unit 1 configured as described above will be described. When an operation member such as a shutter release button is operated in order to execute an imaging operation in a state where the imaging module 100 is activated and usable, and the imaging circuit unit 1 is operable, an instruction signal at this time is displayed as an imaging module. The control circuit starts a predetermined operation such as an automatic focus adjustment (AF) operation or an automatic exposure (AE) operation.

When an image blur correction control signal is generated based on the output of the camera shake sensor at the start of this operation, the first motor 15 and the second motor 35 are driven accordingly. The driving force of the first motor 15 rotates the first pinion 16, and the first pinion 16 rotates the first lead screw 18 via the first gear 17. At this time, the rotation of the first nut 19 screwed into the first lead screw 18 is restricted because the rotation restricting member 19 a is engaged with the engaging portion of the base 10. Accordingly, as the first lead screw 18 rotates, the first nut 19 moves along the first direction (Y direction in FIG. 2).

The first engagement portion 11 c of the first moving frame 11 is in contact with the first nut 19, and the contact state between the two is always maintained by the urging force of the first urging spring 13. In this state, when the drive control of the first motor 15 is performed and the first nut 19 moves along the first direction (Y direction in FIG. 2), the first moving frame 11 moves to the first biasing spring 13. The urging force moves in the first direction while maintaining the contact state between the first engaging portion 11c and the first nut 19. Conversely, when the first nut moves in the direction opposite to the first direction, the first nut 19 abuts against the first engaging portion 11 c against the biasing force of the first biasing spring 13. , Press this. As a result, the first moving frame 11 moves in a direction opposite to the above-described direction. As described above, the first moving frame 11 moves along the first direction by the drive control of the first motor 15.

On the other hand, the driving force of the second motor 35 rotates the second pinion 36, and the second pinion 36 rotates the second lead screw 38 via the second gear 3737. At this time, the rotation of the second nut 39 screwed into the second lead screw 38 is restricted because the rotation restricting portion 39 a is engaged with the engaging portion of the base 10. Accordingly, as the second lead screw 38 rotates, the second nut 39 moves in the second direction (X direction in FIG. 2).

The second engaging portion 31c of the engaging member 45 disposed integrally with the second moving frame 31 is in contact with the second nut 39, and the contact state between the two is the second biasing spring 33. It is always maintained by the urging force. In this state, the drive control of the second motor 35 is performed, and when the second nut 39 moves along the second direction (the X direction in FIG. 2), the second moving frame 31 moves to the second biasing spring 33. The second engaging portion 31c and the second nut 39 are maintained in the contact state by the urging force, and move in the same direction. When the second nut 39 moves in the opposite direction, the second moving frame 31 maintains the contact state between the second engaging portion 31 c and the second nut 39 by the urging force of the second urging spring 33. While moving in the same direction. In this manner, the second moving frame 31 is moved along the second direction (the X direction in FIG. 2) by driving and controlling the second motor 35.

Note that the second moving frame 31 is displaced along the same direction as the first moving frame 11 is displaced along the first direction. The part 31c moves along the same first direction as the first moving frame 11 is displaced while maintaining the contact state. That is, the contact position between the second nut 39 and the second engagement portion 31c is displaced, and the second engagement is caused by the displacement of the second moving frame 31 and the first moving frame 11 in the first direction. The joint portion 31c also moves in the same direction. Within this moving range, the contact state between the second engaging portion 31c and the second nut 39 is always maintained.

Next, the configuration of the image sensor section 51 having a function as an image sensor package will be described with reference to FIG. The imaging element unit 51 uses a known system-in-package (Sip) technique to stack the substrates and chips here. In general, when the number of pixels of the image sensor increases, there is a problem that the operation sequence of the camera becomes slow unless the transfer speed is increased. If the SIP technology is used, the wiring can be shortened, so that unnecessary radiation can be reduced even if the operation clock speed is increased.

A spacer 64a is disposed on the back side of the image sensor 61 that photoelectrically converts the subject image formed by the photographing optical system 2b. A first circuit board including various circuits including an analog signal processing circuit 201, an A / D conversion circuit 202, a temporary storage circuit 203, an image sensor driving circuit 206, and the like on the opposite side of the image sensor 61 across the spacer 64a. 62 is arranged. A spacer 64b is disposed on the back side of the first circuit board 62, and a second circuit board including an interpolation circuit 204, a storage circuit 205, and an interface circuit on the opposite side of the first circuit board 62 across the spacer 64b. 63 is arranged.

These image sensor 61, first circuit board 62, second circuit board 63 and spacers 64 a and 64 b are stacked and arranged on an interposer 66 that is a thin substrate in the image sensor section 51. Each circuit element in the image sensor 61, the first circuit board 62, and the second circuit board 63 is connected to an external circuit through a bonding wire 65 and an electrode 67, respectively. Each member is surrounded by a package 69, and a cover glass 68 is provided on the light receiving surface side of the image sensor 61, so that the inside is kept airtight and can prevent entry of dust and the like. it can.

Next, mainly the electrical configuration of the imaging module 100 will be described with reference to FIG. The imaging module 100 is a device incorporated in a camera (not shown), but before being incorporated in the camera, the adjustment device 300 is attached to perform an adjustment operation. Hereinafter, a state in which the adjusting device 300 is mounted will be described.

In the lens barrel unit 2 in the imaging module 100, the photographing optical system 2b is arranged as described above, and the photographing optical system 2b is adjusted in focus and focal length by the lens driving mechanism 7. The focal position and focal length of the photographing optical system 2b driven by the lens driving mechanism 7 are detected by the lens position detecting mechanism 6 and output to a camera shake correction arithmetic circuit 216 described later.

A light amount adjusting mechanism 4 for adjusting the amount of light received by the image sensor 61 is disposed on the optical path of the photographing optical system 2b. As the light amount adjusting mechanism 4, an ND filter capable of adjusting the transmitted light amount, a diaphragm device, or the like is used. The light amount adjusting mechanism 4 is connected to and driven by the light amount adjusting mechanism 5. The light amount adjusting mechanism 5 and the lens driving mechanism 7 are driven in response to a control signal from an adjusting device 300 combined with the imaging module 100 or a camera body (not shown). Further, the focal position information and focal length information detected by the lens position detection mechanism 6 are output to the adjustment device 300 or the camera body.

An infrared cut filter and a low-pass filter 55 are arranged in the image sensor unit 50 in the image pickup module 100 and on the optical path of the photographing optical system 2b. The low-pass filter is an optical filter for cutting a high-frequency component of a subject image and allowing only a low frequency to pass therethrough, and the infrared cut filter is an optical filter for cutting an infrared light component.

An imaging element unit 51 is disposed behind the infrared cut filter and the low-pass filter 55 and on the optical path of the photographing optical system 2b. As described above, the image sensor 61 is disposed in the image sensor section 51, photoelectrically converts the subject image, and outputs an analog image signal. As the image sensor 61, a two-dimensional image sensor such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) is used.

The image sensor 61 is connected to an image sensor drive circuit 206, and this image sensor drive circuit 206 is controlled by a sequence controller (hereinafter abbreviated as CPU) 301 via an input / output circuit 317 in the adjustment device 300. Is done. The image sensor 61 photoelectrically converts the subject image and outputs an analog image signal to the analog signal processing circuit 201.

The analog signal processing circuit 201 performs an amplification process on the analog image signal and outputs it to the A / D conversion circuit 202. The A / D conversion circuit 202 converts the analog image signal to digital, outputs this image data to a temporary storage memory 203 such as SDRAM, and temporarily stores the image data in the temporary storage memory 203. The image data stored in the temporary storage memory 203 is output to the interpolation circuit 204.

As will be described later, the interpolation circuit 204 performs an interpolation calculation process on the image data stored in the temporary storage memory 203 using the interpolation data stored in the storage circuit 205, and the image sensor 61 such as a pixel defect is detected. High quality image data is output by removing defects in the photographic optical system such as defects, scratches in the photographic optical system, and attached dust. The interpolation circuit 204 is connected to a storage circuit 205, and the storage circuit 205 is an electrically rewritable nonvolatile memory such as E ² PROM for storing interpolation data used for the interpolation calculation processing. It is.

In the imaging circuit unit 1, there are provided first and second drive mechanism portions 213 including the first drive mechanism portion 14 and the second drive mechanism portion 34 described above, and the first and second drive mechanism portions 213. Thus, the image sensor 61 is driven in the first and second directions (X direction and Y direction) in a plane orthogonal to the optical axis of the photographing optical system 2b. The amount of movement of the image sensor 61 driven by the first and second drive mechanisms 213 is detected by the first and second position detection sensors 211. The first and second position detection sensors 211 include the first position detection sensor 24 and the second position detection sensor 44 described above.

In the imaging circuit unit 1, a camera shake sensor 215 for detecting a shake due to a camera shake of a photographer is disposed, and a movement amount (rotation amount) in first and second directions (X direction and Y direction). Is output to the camera shake correction arithmetic circuit 216. Based on the camera shake amount information from the camera shake sensor 215 and the focal length information from the lens position detection mechanism 6, the camera shake correction calculation circuit 216 calculates a camera shake correction amount for removing the effect of camera shake.

The output of the camera shake correction calculation circuit 216 is connected to the camera shake correction drive circuit 217, and the first and second drive are based on the position information from the first and second position detection sensors 211 and the control signal from the input / output circuit 317. A drive control signal is output to the mechanism 213.

The adjustment device 300 is a device that performs various adjustment operations of the imaging module 100, and as one of the adjustment operations, from the image data based on the output of the imaging device 61, a defect of the imaging device 61 such as a pixel defect or a photographing optical system. Interpolation data used to obtain image data that eliminates the effects of defects in the photographic optical system such as scratches and adhering dust is obtained. In the adjustment, as shown in FIG. 5, a measurement chart 331 is disposed in front of the photographing optical system 2 b in the imaging module 100, and this measurement chart is illuminated from the back by a backlight 333.

A CPU 301 for performing sequence control of the adjustment device 300 is provided in the adjustment device 300, and the CPU 301 is connected to the data bus 303. An image processing circuit 311, SDRAM control circuit 313, input / output circuit 317, switch detection circuit 319, and video signal output circuit 323 are connected to the data bus 303. The input / output circuit 317 inputs the output of the trimming circuit 204 and performs various image processing such as digital amplification (digital gain adjustment processing) of digital image data, color correction, gamma (γ) correction, and contrast correction.

The SDRAM 315 is connected to the SDRAM control circuit 313, and temporarily stores the image data output from the image processing circuit 311 under the control of the SDRAM control circuit 313. The input / output circuit 317 transmits control signals, adjustment values, correction data, and the like to circuits such as the CPU 301 in the adjustment apparatus 300 and each circuit / mechanism in the imaging module, and also provides various types of information such as focal length information. It is a circuit for inputting.

The switch circuit 319 is connected to the keyboard device 321 and detects a key input. The video signal output circuit 323 displays an image of the measurement chart 331 based on the output of the image sensor 61 during the adjustment operation in the adjustment device 300, and a video signal for displaying an adjustment screen for the adjustment operation. Is a circuit for outputting. The output of the video signal output circuit 323 is connected to the liquid crystal monitor drive circuit 325, converted into a drive signal for the liquid crystal monitor 327 by the liquid crystal monitor drive circuit 325, and then output to the liquid crystal monitor 327.

An assembly process of the imaging module 100 according to the present embodiment configured as described above will be described with reference to FIG. First, SIP mounting of the image sensor section 51 having a structure as shown in FIG. 3 is performed (# 1). Subsequently, the image sensor section 51 is mounted on the flexible printed circuit board 52 (# 3). Further, the movable unit 80 (consisting of the first moving frame 11 and the second moving frame 31 fixed to the base 10) other than the image pickup device 51 and the flexible printed circuit board 52 is assembled (# 5).

Subsequently, the imaging circuit unit 1 is assembled from the above-described imaging element unit 51, flexible printed circuit board 52, movable unit 80, etc. (# 7). In parallel, the lens barrel unit 2 including the photographing optical system 2a, the lens driving mechanism 7 and the like is assembled (# 9). Thereafter, the lens barrel unit 2 and the imaging circuit unit 1 are assembled (# 11), and the imaging module 100 is assembled by this. When the imaging module 100 is assembled, the imaging module 100 is then adjusted, and as one of them, imaging optics such as a defect of the imaging element 61 such as a pixel defect, a flaw in the imaging optical system, or attached dust Interpolation data used when performing an interpolation operation so as to obtain image data from which system problems have been eliminated is obtained (# 13). In obtaining the interpolation data, an image caused by a pixel defect, a dust image, a scratch image, and the like are detected from the image data, and the position data and its type are obtained.

Interpolation data acquisition in the adjustment operation of # 13 in FIG. 6 will be described using the flowchart of the adjustment operation in FIG. 7 and the conceptual diagram of the adjustment operation in FIG. First, the imaging module 100 is connected to the adjustment device 300 as shown in FIG. Subsequently, the movable unit 80 is initialized (S101). This initialization is performed by driving the first drive mechanism 14 and the second drive mechanism 34 so that the optical axis of the photographic optical system 2b and the design center of the image sensor section 51 are substantially coincident. After that, as the measurement chart 331, a white chart that is entirely white and has no shading is set (S103).

Subsequently, the CPU 301 instructs the imaging element driving circuit 206 to start an imaging operation and performs chart imaging (S105). When shooting is finished, the imaged data is read (S107). At this time, the imaging data is temporarily stored in the temporary storage memory 203 and then transferred to the SDRAM 315 in the adjustment apparatus 300 via the interpolation circuit 204, the image processing circuit 311 and the like. Thereafter, the position of a pixel whose pixel output obtained by imaging the white chart is lower than a predetermined value is obtained, and black point coordinates are detected (S109). The imaging data of the white chart should be uniformly the same value, but if the imaging device 61 or the imaging optical system is defective or defective, the output of the pixel becomes an abnormal value, as shown in FIGS. 8A and 8B. As shown, black dots 351 and 352, black surface 353, and black lines 354 and 355 are obtained.

That is, the black spots 351 and 352 are cases where there is a pixel defect. In this case, the output of only the pixel having a pixel defect is reduced to become a black spot. At this time, the coordinates of the black dot pixel, (X1, Y1) and (X2, Y2) are detected in the example of FIG. The black surface 353 is a case where dust adheres to the photographing optical system 2b. In this case, since the amount of light at the portion where dust is attached decreases, the pixel output decreases and the black surface becomes black. At this time, the diagonal coordinates of the square diagonal line covering the black surface 353, (X1, Y1) and (X2, Y2) are detected in the example of FIG. 8B.

The black line 354 is a case where there is a linear flaw in the photographing optical system 2b. In this case, the amount of light decreases along the flaw, so that the pixel output decreases and becomes a black line. At this time, the coordinates of both ends of the black line 354, (X1, Y1) and (X2, Y2) are detected in the example of FIG. 8B. A black line 355 is a case where the readout line of the image sensor has a defect. That is, in the case of an image pickup device such as a CCD, the pixel output is read out along the line. If there is a defect in the read line, a black line is formed along the vertical line. At this time, the coordinates of both ends of the black line 355, (X1, Y1) and (X1, Y2) are detected in the example of FIG. 8B.

When the detection of the black point coordinates is completed, the type of these black point coordinates is then discriminated (S111). The determination is performed as follows. When the pixel output of only one pixel is lower than the predetermined value, it is determined that the pixel defect is a black point 351 or 352, and “1” is given as the determination data. If the output of a plurality of adjacent pixels is lower than a predetermined value, it is determined that the image is deteriorated due to dust such as the black surface 353, and “2” is given as determination data. Further, when the pixel output along the oblique line is lower than a predetermined value, it is determined that the image is deteriorated due to the scratch such as the black line 354, and “3” is given as the determination data. When the pixel output along the vertical line is lower than a predetermined value, it is determined as a read line defect such as the black line 355, and “4” is given as determination data.

When the pixel defect, dust, and scratch determinations in step S111 are completed, storage data is created (S113). This interpolated data for storage is a set of the black dot coordinates obtained in step S109 and the discrimination data obtained in step S111. For example, since the black point 351 is a pixel defect and the position thereof is at (X1, Y1), the interpolation data is (1, X1, Y1). In this way, interpolation data composed of the coordinates and types obtained in steps S109 and S111 is created.

When the creation of the interpolation data for storage is completed, the interpolation data is then transmitted to the storage circuit 205 in the imaging module 100 (S113). Since the storage circuit 205 is composed of an electrically rewritable nonvolatile memory, when trimming coordinate data is stored, data obtained by the adjustment operation is stored even when the power is turned off.

When the above adjustment operation is completed, interpolation data for performing interpolation calculation by the interpolation circuit 204 is stored in the storage circuit 205. The interpolation circuit 204 uses this correction data to interpolate image data based on the image signal from the image sensor 61, and image deterioration due to defects in the image sensor 61 and dust and scratches in the imaging optical system 2b is corrected. Image data.

Next, the interpolation calculation by the interpolation circuit 204 will be described with reference to FIG. This interpolation calculation is performed when the imaging module 100 is removed from the adjustment device 300, incorporated into a digital camera, and completed as a digital camera. The interpolation calculation starts in response to an instruction from the control CPU in the digital camera body. When receiving the start command, the interpolation circuit 204 reads the interpolation data from the storage circuit 205 (S121).

When the reading is completed, it is next determined whether or not the interpolation data is final data (S123). As described above, the interpolation data is composed of a set of black point coordinates and discrimination data for each black point, and is sequentially read for each black point to perform interpolation calculation. If the final data has been reached as a result of the determination, the process returns. On the other hand, if the final data has not been reached, the process proceeds to step S125 to determine whether or not the discrimination data in the interpolation data is “1”. .

As a result of the determination, if the determination data is “1”, it is a pixel defect such as the black point 351, and thus the process proceeds to step S133 and correction is performed based on the black point coordinates (X, Y) in the interpolation data. Correction is performed by replacing the pixel data immediately before the black dot coordinates. The correction is not limited to this, and there are various methods such as, for example, the average value of pixel data before and after the black point coordinates, and the average value of the upper, lower, left and right pixels. When the correction in step S133 is completed, the process returns to step S121, and the next interpolation data is read.

If the determination data is not “1” in step S125, the process proceeds to step S127, and it is determined whether or not the determination data is “2”. As a result of the determination, if the determination data is “2”, the process proceeds to step S135 to perform an interpolation calculation. In the case of the discrimination data “2”, since it is an image of dust such as the black surface 353, the coordinates at the four corners of the area where the amount of light is reduced by dust, that is, (X1, Y1) and The range of (X2, Y2) is interpolated. Interpolation calculation is performed by averaging the pixel data of the upper, lower, left, and right sides of this area. When the correction in step S135 is completed, the process returns to step S121, and the next interpolation data is read.

If the determination data is not “2” in step S127, the process proceeds to step S129 to determine whether or not the determination data is “3”. As a result of the determination, if the determination data is “3”, the process proceeds to step S137 to perform interpolation calculation. When the discrimination data is “3”, it is a flaw in the photographic optical system such as the black line 354, and thus the line where the amount of light is reduced due to the flaw, that is, the coordinates (X1, Y1) and (X2, Y2). Interpolation is performed along the line connecting. As the interpolation calculation, pixel data on the upper, lower, left, and right sides of this line are used, and each is calculated by averaging. When the correction in step S137 is completed, the process returns to step S121, and the next interpolation data is read.

If the determination data is not “3” in step S129, the process proceeds to step S131 to determine whether or not the determination data is “4”. As a result of the determination, if the determination data is “4”, the process proceeds to step S139 to perform an interpolation calculation. If the determination data is “4”, it is a line reading defect such as the black line 355. Therefore, interpolation calculation is performed along a line in which the pixel output is reduced due to this defect, that is, a perpendicular line connected by coordinates (X1, Y1) and (X1, Y2). As the interpolation calculation, the pixel data on the right and left sides of the perpendicular are used, and each is calculated by averaging. When the correction in step S139 is completed, or when the discrimination data is not “4” in step S131, the process returns to step S121, and the next interpolation data is read.

The output of the imaging device 61 in the imaging module 100 is A / D converted by the A / D conversion circuit 202 and then temporarily stored in the temporary storage memory 203. The interpolation circuit 204 performs an interpolation operation on the temporarily stored image data to remove deterioration due to pixel defects or dust or scratches of the photographing optical system. Therefore, high-quality image data can be output from the imaging module 100, and no correction or the like is required on the digital camera side.

As described above, the imaging module 100 according to the embodiment of the present invention integrates the lens barrel unit 2 and the imaging circuit unit 1, and outputs the subject image as digital image data in the imaging circuit unit 1. An image sensor unit 51 is provided. The image sensor unit 51 includes an image sensor 61 that photoelectrically converts a subject image, an A / D conversion circuit 202 that digitally converts an output signal of the image sensor, and an image sensor 61. Among the plurality of pixels, a storage circuit 205 that stores position information (coordinate information) of a pixel that outputs an abnormal value, and a corresponding output of the A / D conversion circuit 202 based on the information stored in the storage circuit 205. An interpolation circuit 204 for interpolating the pixel output with the output of the surrounding pixels is provided. For this reason, it is possible to obtain high-quality image data from which the influence of the defect of the image sensor 61 and the malfunction of the photographing optical system is eliminated without adjustment on the main body side of the digital camera. Further, even when a pixel defect or a malfunction in the photographing optical system is found by inspection after the imaging module 100 is assembled, it can be used by interpolation data without being discarded.

Further, in the present embodiment, as interpolation data, discrimination data indicating the types of defects in the image sensor and the imaging optical system is stored. Therefore, when performing the interpolation calculation, it can be processed with a simple calculation. .

Furthermore, in this embodiment, since the interpolation data is stored in the nonvolatile memory, the interpolation data is not lost even when the power supply to the storage circuit 205 is stopped. In addition, since the nonvolatile memory is electrically rewritable, it is easy to change the interpolation data for each product.

Furthermore, in the present embodiment, each chip substrate in the image sensor section 51 is configured by SIP (system in package) mounting. For this reason, the circuit around the imaging element can be made compact, necessary components can be accommodated in the lens barrel, and the entire imaging module can be reduced in size. In addition, since the image pickup device that performs high-speed signal transmission, the drive circuit, and the control circuit thereof are connected by a short wiring, there is an effect that noise due to unnecessary radiation is reduced.

In the present embodiment, the imaging element unit 51 is a chip stack type in which chips are stacked as SIP mounting. However, the present invention is not limited to this, and for example, a chip on chip type may be used. Further, both the black dot coordinates and the discrimination data are stored in the storage circuit 205 as the interpolation data. However, the present invention is not limited to this, and two points representing an area that needs to be interpolated due to defects or defects, or Four points may be stored and the discrimination data may be omitted. In this case, although the calculation speed is reduced, it can be obtained by a uniform interpolation calculation formula.

Furthermore, in the present embodiment, the first drive mechanism 14 and the second drive mechanism 34 for correcting camera shake are provided, and these mechanisms are used when the movable unit is initialized. However, in the case of an imaging module that does not have a camera shake correction mechanism, a drive mechanism may be provided on the adjustment device side or may be moved manually.

In the description of the embodiments of the present invention, an imaging module for a digital camera is taken as an example. However, the digital camera may be either a single-lens reflex type or a compact type digital camera, or a dedicated device other than these digital cameras. Needless to say, the present invention can also be applied to an electronic image pickup apparatus incorporated in the apparatus.

1 is an external perspective view schematically showing an imaging module according to an embodiment of the present invention. It is a disassembled perspective view of the imaging part which comprises some imaging modules concerning one Embodiment of this invention. It is sectional drawing of the image pick-up element unit in one Embodiment of this invention. It is an electric circuit diagram of the imaging module and adjustment device in one embodiment of the present invention. 1 is an external perspective view showing a state where an imaging module is attached to an adjustment device in an embodiment of the present invention. It is process drawing which shows the assembly process of the imaging module in one Embodiment of this invention. It is a flowchart figure which shows adjustment operation of the imaging module in one Embodiment of this invention. 4A and 4B are diagrams illustrating the concept of interpolation data in the adjustment operation of the imaging module according to the embodiment of the present invention, where FIG. 5A illustrates an example of a pixel defect and FIG. 5B illustrates an example of dust / scratches. . It is a flowchart which shows the interpolation operation | movement in the apparatus incorporating the imaging module in one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Imaging circuit unit, 2 ... Lens barrel unit, 2a ... Lens barrel, 2b ... Shooting optical system, 2c ... Focus motor, 2d ... Zoom motor, 4・ ・ ・ Light quantity adjustment mechanism, 5 ... Light quantity adjustment mechanism, 6 ... Lens position detection mechanism, 7 ... Lens drive mechanism, 10 ... Base, 10x ... Open window, 11 ... 1st moving frame, 11c ... 1st engagement part, 11d ... 1st detection part, 11e ... 1st notch part, 12 ... 1st guide shaft for positioning, 13 ... 1st Biasing spring, 14 ... first drive mechanism, 15 ... first motor, 16 ... first pinion, 17 ... first gear, 18 ... first lead screw, 19 .... First nut, 19a ... rotation restricting portion, 20 ... first drive portion pressing plate, 21a ... screw, 21b ... Screws, 22 ... first rotation stop guide shaft, 24 ... first position detection sensor, 31 ... second moving frame, 31c ... second engagement portion, 31d ... second detection Part 31e ... second cutout part 31x ... opening window 32 ... second positioning guide shaft 33 ... second urging spring 34 ... second drive mechanism part 35 ... Second motor, 36 ... Second pinion, 37 ... Second gear, 38 ... Second lead screw, 39 ... Second nut,
39a ... rotation restricting part, 40 ... third drive part pressing plate, 41a ... screw, 41b ... screw, 42 ... second rotation stop guide shaft, 43 ... second rotation Biasing spring, 44 ... second position detection sensor, 50 ... imaging element unit, 51 ... imaging element unit, 52 ... flexible printed circuit board, 54 ... sealing member, 55 ... Low-pass filter / infrared filter, 56... Light-shielding sheet, 57... LPF pressing plate, 61... Image pickup element, 62. -Spacer, 64b ... Spacer, 65 ... Bonding wire, 66 ... Interposer, 67 ... Electrode, 68 ... Cover glass, 69 ... Package, 80 ... Movable unit, 100 ..Imaging module, 2 DESCRIPTION OF SYMBOLS 1 ... Analog signal processing circuit, 202 ... A / D conversion circuit, 203 ... Temporary storage memory, 204 ... Interpolation circuit, 205 ... Storage circuit, 206 ... Image sensor drive circuit, 211: first and second position detection sensors, 213: first and second drive mechanisms, 215: camera shake sensor, 216: camera shake correction calculation circuit, 217: camera shake correction drive circuit, 300 ... Adjustment device, 301 ... Sequence controller (CPU), 303 ... Data bus, 311 ... Image processing circuit, 313 ... SDRAM control circuit, 315 ... SDRAM, 317 ... Input / output circuit, 319 ... switch detection circuit, 321 ... keyboard device, 323 ... video signal output circuit, 325 ... liquid crystal monitor drive circuit, 327 ... liquid crystal monitor, 31 ... measurement chart, 333 ... backlight, 351 ... black point, 352 ... black point, 353 ... black surface, 354 ... black line, 355 ... black line

Claims (9)

In an imaging module that integrates a lens unit and an imaging circuit unit,
The imaging circuit unit includes a single imaging device package that outputs a subject image as digital image data,
The imaging device package includes an imaging device having a plurality of pixels for photoelectrically converting a subject image;
An A / D conversion circuit for digitally converting the output signal of the image sensor;
A storage circuit that stores position information of a pixel that outputs an abnormal value among the plurality of pixels of the imaging element;
An interpolation circuit that interpolates the corresponding pixel output of the output of the A / D conversion circuit based on the information stored in the storage circuit with the output of the surrounding pixels;
An imaging module comprising:   The imaging module according to claim 1, wherein the storage circuit is a nonvolatile memory.   The imaging module according to claim 1, wherein the storage circuit stores a defect type of a pixel that outputs the abnormal value, and the interpolation circuit determines an interpolation calculation according to the defect type.   The adjustment device connectable to the imaging module according to claim 1, wherein the storage circuit can store position information of the abnormal output pixel. In an imaging module that integrates a lens unit and an imaging circuit unit,
The imaging circuit unit includes a single imaging device package that outputs a subject image as digital image data,
The imaging device package includes an imaging device having a plurality of pixels for photoelectrically converting a subject image;
An A / D conversion circuit for digitally converting the output signal of the image sensor;
Among the outputs of the A / D conversion circuit, an interpolation circuit that interpolates a pixel output indicating an abnormal value with an output of its peripheral pixels,
An imaging module comprising: In an imaging module that integrates a lens unit and an imaging circuit unit,
The imaging circuit unit includes a single imaging device package that outputs a subject image as digital image data.
An image sensor that photoelectrically converts the subject image and outputs an image signal;
An A / D conversion circuit for digitally converting the image signal;
A storage circuit for storing correction data for each defect for correcting the defect of the image sensor;
A correction circuit for correcting the A / D converted image signal based on the correction data stored in the storage circuit;
An imaging module comprising:   The imaging module according to claim 6, wherein the correction data is information indicating a position of a pixel where the defect exists.   A lens unit for forming the subject image is provided, the storage circuit stores optical correction data for correcting a malfunction of the photographing optical system in the lens unit, and the correction circuit stores the optical correction data in the optical correction data. The image pickup module according to claim 6, wherein image data obtained by correcting a malfunction of the photographing optical system is output based on the image data. In the adjustment device for the imaging module in which the lens unit and the imaging circuit unit are integrated,
Based on the output of the image sensor that photoelectrically converts the subject image disposed in the image pickup circuit unit, the defect originates in the image sensor in the image sensor circuit unit or the imaging optical system in the lens unit, Correction data computing means for detecting an abnormal value of the output of the image sensor and obtaining correction data for correcting the defect or defect;
Transmitting means for transmitting the correction data obtained by the correction data calculating means to a storage circuit in the imaging module;
An apparatus for adjusting an imaging module, comprising: