JP2008177464A - Method and device for dechuck monitoring - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and device for dechuck monitoring capable of being easily applied also to a device having an existing electrostatic chuck mechanism, and evaluating whether static electricity is fully diselectrified when an adsorbed/held substrate is removed from a substrate holder. <P>SOLUTION: A dechuck monitoring device is one used together with a mounting/removing device of the treated object having a mounting device that mounts a treated object to be treated in a treating chamber on a treated object holder and a dechuck mechnism that removes the treated object treated in the treating chamber from the treating holder, and a measuring device of variation in adsorbing power that is communicated with a dechuck mechanism and measures variation in residual adsorbing power when the treated object is removed from the treated holder is provided. The measuring device is provided between a compressed air cylinder 7 and a bellows 11 in the dechuck mechanism and include load cells that measure compression or pull strength. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a mounting mechanism for mounting a workpiece to be processed in a processing chamber such as a substrate in a semiconductor manufacturing apparatus to a processing workpiece holder, and a dechucking mechanism for removing the workpiece processed in the processing chamber from the processing holder. The present invention relates to a dechuck monitoring method and apparatus that can be used with an apparatus for mounting and removing an object to be processed.

  Various electrostatic chucks for attracting and holding a substrate to a substrate holder by electrostatic attraction force in a semiconductor manufacturing apparatus are known. Usually, the substrate holder is composed of a flat plate-like conductor covered with an insulator, and this conductive A DC voltage is applied to the body to generate an electrostatic attracting force generated between the conductor and the substrate, and the electrostatic attracting force holds the substrate on the substrate holder (Patent Document) 1 and Patent Document 2).

  In this type of electrostatic chuck, when the substrate in the suction holding state is removed from the substrate holder after performing the required processing, the DC voltage to the conductor is stopped and the electrostatic force is extinguished. A withdrawal takes place. In that case, in order to shorten the substrate removal time and increase the throughput, various static elimination methods such as a method of applying a reverse voltage to the conductor of the substrate holder, a plasma elimination method, and a gas elimination method are used. Yes.

  Incidentally, in recent years, the necessity of controlling the substrate temperature by the electrostatic chuck mechanism has increased, and the electrostatic chuck mechanism has been provided in the processing chamber almost even in the sputtering process. There is also a change in the situation of the substrate to be processed, and there is a tendency that the film pressure of the insulating film on the substrate surface is increasing. For this reason, when removing the substrate in the suction holding state from the substrate holder, it is difficult for static electricity to disappear even if the DC voltage to the conductor is stopped. Various static neutralization methods as described above are used. However, whether static neutralization has been sufficiently performed or not is experimentally determined by using a load cell and a cylinder. Although the adsorption force can be measured by lifting the substrate, no practical evaluation method or means has been proposed in the past, and it has often relied on sensory evaluation such as visual observation.

In this way, it is difficult to monitor whether static neutralization has been performed normally in an actual device.If static electricity has not been removed by mistake, static electricity has not been removed, If the effect of removing static electricity is not sufficient, problems such as damaging the substrate when the substrate is removed from the substrate holder or causing a failure of the substrate transport system may occur.
Japanese Patent Laid-Open No. 6-252253 Japanese Patent Laid-Open No. 2003-1347395

  The present invention can be easily applied to an apparatus equipped with an existing electrostatic chuck mechanism, and can evaluate whether or not static electricity has been sufficiently removed when a substrate in a suction holding state is removed from the substrate holder. It is an object of the present invention to provide a dechuck monitoring method and apparatus.

  In order to achieve the above object, according to one aspect of the present invention, a mounting mechanism for mounting a workpiece to be processed in a processing chamber to a workpiece holder, and a workpiece processed in the processing chamber are processed. In a dechuck monitoring device used with a dechucking mechanism that has a dechucking mechanism that removes it from the workpiece holder, it measures the change in the residual adsorption force when the workpiece is removed from the workpiece holder in conjunction with the dechuck mechanism. It is characterized in that a device for measuring the adsorption force change is provided.

  In the dechuck monitor device of the present invention, the dechuck mechanism includes an elevating mechanism and a compressed air cylinder, and the adsorption force change measuring device is interlocked with the compressed air cylinder in the dechuck mechanism to displace the workpiece from the workpiece holder. It can consist of a displacement sensor that measures the quantity.

  In the dechuck monitor device of the present invention, the measuring device for the change in adsorption force can be composed of a pressure sensor that measures the pressure of the compressed air to the compressed air cylinder in the dechuck mechanism.

  In the dechuck monitoring device of the present invention, the adsorption force change measuring device can be composed of an encoder that is combined with the compressed air cylinder in the dechuck mechanism and measures the operation amount of the compressed air cylinder.

  In the dechuck monitoring device of the present invention, the dechuck mechanism is provided with a bellows, and the adsorption force change measuring device is provided between the compressed air cylinder and the bellows in the dechuck mechanism, and is from a load cell that measures compression or tensile strength. It can be done.

  In the dechuck monitor device of the present invention, the dechuck mechanism includes an electric cylinder, and the measuring device for the change in adsorption force can include a measuring instrument for measuring the torque value, electric power value, or load factor of the electric cylinder.

  In the dechuck monitor device of the present invention, an alarm signal generating device that generates an alarm signal when the residual suction force exceeds a predetermined level based on the change in the suction force measured by the suction force change measuring device can be provided. .

  According to another invention of the present invention, the apparatus has a mounting mechanism for mounting a workpiece to be processed in the processing chamber to the workpiece holder, and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder. In the dechuck monitoring method using the workpiece attachment and removal device, the displacement amount of the workpiece from the workpiece holder is measured by a displacement sensor provided in conjunction with the dechuck mechanism, and the measured workpiece It is characterized by differentiating the displacement amount and obtaining the maximum value of the inclination.

  According to another invention of the present invention, the apparatus has a mounting mechanism for mounting a workpiece to be processed in the processing chamber to the workpiece holder, and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder. In the dechuck monitoring method using the workpiece loading and unloading device, the pressure of the compressed air to the compressed air cylinder in the dechucking mechanism is measured, and the measured pressure of the compressed air is differentiated to obtain the maximum value of the inclination. It is characterized by that.

  According to another invention of the present invention, the apparatus has a mounting mechanism for mounting a workpiece to be processed in the processing chamber to the workpiece holder, and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder. In the dechuck monitoring method using the workpiece loading and unloading device, the operation amount of the compressed air cylinder is measured using an encoder that generates a pulse output in conjunction with the compressed air cylinder in the dechuck mechanism, and the measured operation amount Is differentiated to obtain the maximum value of the slope.

  According to another invention of the present invention, the apparatus has a mounting mechanism for mounting a workpiece to be processed in the processing chamber to the workpiece holder, and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder. In the dechuck monitoring method using the apparatus for mounting and removing the workpiece, the compression or tensile strength is measured by a load cell inserted between the electric cylinder and the bellows in the dechuck mechanism, and the measured compression or tensile strength is measured. It is characterized by measuring the adsorption force from the peak value.

  According to another invention of the present invention, the apparatus has a mounting mechanism for mounting a workpiece to be processed in the processing chamber to the workpiece holder, and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder. In the dechuck monitoring method using the workpiece loading and unloading device, the power value, torque value, or load factor of the electric cylinder in the dechucking mechanism is measured, and adsorption is performed from the measured power value, torque value, or load factor increase. It is characterized by measuring force.

  In the dechuck monitor device according to the present invention, a measuring device for the change in the adsorption force that measures the change in the residual adsorption force when the workpiece is removed from the workpiece holder is provided in conjunction with the dechuck mechanism, so that the conventional feeling can be obtained. It will be possible to automatically measure and monitor the adsorption power that has been relied upon, and to make judgments on abnormalities and life in advance.

  In addition, since the dechuck monitor device according to the present invention can be used by attaching it to an existing device outside, it is not necessary to modify the vacuum side, and can be easily implemented at low cost.

  In each dechuck monitoring method using the dechuck monitoring device according to the present invention, it becomes possible to automatically measure and monitor the suction force that has been relied on the conventional sense, and to make a judgment of abnormality or life in advance. . As a result, a guideline for replacing the electrostatic chuck can be established before the workpiece is displaced or cracked due to the residual attracting force, and sudden troubles can be avoided.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 shows an electrostatic chuck device provided with a dechuck monitor device according to an embodiment of the present invention. Reference numeral 1 denotes a vacuum chamber constituting a processing chamber. Inside the vacuum chamber 1, as shown in FIG. The electrostatic chuck mechanism 2 is disposed on the surface. The electrostatic chuck mechanism 2 includes a hot plate 3 and an electrostatic chuck portion 4. Although the hot plate 3 is not shown in the drawing, a heater is incorporated therein, and such a heater can be constituted by, for example, a heating wire connected to a suitable power source or a heat medium circuit connected to a suitable heat medium source. The heater can be adjusted to a predetermined temperature by a temperature control device. The electrostatic chuck portion 4 is configured, for example, by covering a plate-like conductor with an insulator and receiving the substrate 5 on the upper surface. The plate-like conductor of the electrostatic chuck unit 4 is connected to a DC power source (not shown), and a DC voltage is applied from the DC power source to the plate-like conductor of the electrostatic chuck unit 4 to thereby form the electrostatic chuck unit 4 and the substrate. 5 is configured such that static electricity is generated between them and an electrostatic attraction force acts.

  In FIG. 1, reference numeral 6 denotes an elevating mechanism for the substrate 5, which is fixed to the elevating cylinder 7, the piston 8 reciprocating in the elevating cylinder 7, the rod 9 connected to the piston 8, and the tip of the rod 9. And a plurality of lift pins 10 for raising and lowering the substrate. The elevating cylinder 7 is connected to a compressed air supply device (not shown). The tip of the rod 9 extends into the vacuum chamber 1 through an opening 1 a provided in the bottom wall of the vacuum chamber 1, and a plurality of lift pins 10 fixed to the tip of the rod 9 are attached to the hot plate 3 and the electrostatic chuck portion 4. It extends in the corresponding through holes 3a, 4a provided. A retractable bellows 11 is provided outside the vacuum chamber 1 so as to surround an opening 1 a provided in the bottom wall of the vacuum chamber 1 and surround a part of the rod 9. A flange 11 a at the lower end of the bellows 11 is provided around the rod 9. And the inside of the vacuum chamber 1 is vacuum-sealed.

  In the illustrated embodiment of the present invention, a detection plate 12 fixed to the flange 11 a at the lower end of the bellows 11 and synchronized with the movement of the rod 9, that is, the lift pin 10 is provided, and the detection plate is located at a position opposite to the detection plate 12. 12, a displacement sensor 13 that detects a change in the amount of axial displacement of the lift pin 10 when the tip of the lift pin 10 contacts the substrate 5 is provided. The displacement sensor 13 is connected to a displacement signal processing circuit device 14. The processing circuit device 14 differentiates the change in the axial displacement amount of the lift pin 10 measured from the displacement sensor 13, and determines the electrostatic chuck from the peak value. The residual adsorption force in the mechanism 2 is calculated. The level signal of the residual suction force in the electrostatic chuck mechanism 2 calculated in this way is supplied to the display or alarm device 15 so that the level of the residual suction force can be displayed. An alarm signal can be generated when the level of the residual adsorption force is higher than a predetermined level.

  The operation of the illustrated apparatus configured as described above will be described. First, it is assumed that a required process for the substrate 5 is completed. At this stage, energization of the electrostatic chuck portion 4 in the electrostatic chuck mechanism 2 is stopped, and compressed air is supplied from a compressed air supply device (not shown) to the lifting cylinder 7 in the lifting mechanism 6. Moves upward in the elevating cylinder 7, and a plurality of lift pins 10 fixed to the tips of the rods 9 are displaced upward in the corresponding through holes 3a, 4a provided in the hot plate 3 and the electrostatic chuck part 4, respectively. It contacts the back surface of the substrate 5. In this case, although not shown in the drawing, there is provided a speed control device for controlling the flow rate of the compressed air so that the compressed air is supplied from the compressed air supply device to the lifting cylinder 7 at a constant speed. When there is no residual adsorption force by the mechanism 2, even if the lift pin 10 abuts against the back surface of the substrate 5, only the vibration corresponding to the weight of the substrate 5 is generated, so that the lift pin 10 moves up from the lower limit position A as shown by the solid line in FIG. The amount of displacement of the lift pin 10 to the limit position B increases substantially linearly with time. On the other hand, when there is a residual attracting force by the electrostatic chuck mechanism 2, when the lift pin 10 contacts the back surface of the substrate 5, the lift pin 10 stops rising due to the residual attracting force, and the dotted line in FIG. As indicated by a, b, c, the displacement amount of the lift pin 10 becomes zero according to the degree of the residual adsorption force. On the other hand, when the pressure in the elevating cylinder 7 is increased by the supply of compressed air to the elevating cylinder 7 in the elevating mechanism 6 and the pressure between the weight of the substrate 5 itself and the residual adsorption force by the electrostatic chuck mechanism 2 is overcome, the lift pin 10 Rises rapidly and returns to the normal operation shown by the solid line in FIG. Such a change in the displacement amount with respect to time in the lifting process of the lift pin 10 is detected by measuring the rising of the detection plate 12 by the displacement sensor 13. 2 is a case where the residual attracting force by the electrostatic chuck mechanism 2 is relatively small, a dotted line B is a case where the residual attracting force is medium, and a dotted line is, for example, an electrostatic chuck. This is a case where the residual adsorption force that requires replacement of the mechanism 2 is relatively large.

  In this way, the displacement amount with respect to time in the ascending process of the lift pin 10 measured by the displacement sensor 13 is sent to the displacement amount signal processing circuit device 14, and the deviation of the waveform from the normal operation waveform indicated by the solid line in FIG. (Denoted by dotted lines A, B, and C) is digitized to specify the degree of the residual suction force. In the displacement signal processing circuit device 14, the measured displacement is measured by paying attention to the fact that the relationship between the normal displacement amount and the time in the ascending process of the lift pin 10 when there is no residual attracting force is substantially linear. The amount is differentiated and the maximum value of the slope is calculated. The results obtained by differentiation are shown in FIG. In FIG. 3, the solid line indicates a case where there is no residual adsorption force, the dotted line A indicates a case where the residual adsorption force is relatively small, the dotted line B indicates a case where the residual adsorption force is medium, and the dotted line indicates This is a case where the residual adsorption force is relatively large.

  In addition, as a means for digitizing the measured displacement amount, a method using a difference from a waveform representing a normal displacement amount in the ascending process of the lift pin 10 when there is no residual attracting force or a sum of the differences may be used. .

  FIG. 4 shows an electrostatic chuck device provided with a dechuck monitor device according to another embodiment of the present invention, and the parts corresponding to those in FIG. That is, reference numeral 1 denotes a vacuum chamber constituting a processing chamber, and an electrostatic chuck mechanism 2 is arranged inside the vacuum chamber 1 as shown in the figure. The electrostatic chuck mechanism 2 includes a hot plate 3 and an electrostatic chuck portion 4. Although the hot plate 3 is not shown in the drawing, a heater is incorporated therein, and such a heater can be constituted by, for example, a heating wire connected to a suitable power source or a heat medium circuit connected to a suitable heat medium source. The heater can be adjusted to a predetermined temperature by a temperature control device. The electrostatic chuck portion 4 is configured, for example, by covering a plate-like conductor with an insulator and receiving the substrate 5 on the upper surface. The plate-like conductor of the electrostatic chuck unit 4 is connected to a DC power source (not shown), and a DC voltage is applied from the DC power source to the plate-like conductor of the electrostatic chuck unit 4 to thereby form the electrostatic chuck unit 4 and the substrate. 5 is configured such that static electricity is generated between them and an electrostatic attraction force acts.

  In FIG. 4, reference numeral 6 denotes an elevating mechanism for the substrate 5, which is fixed to the elevating cylinder 7, the piston 8 reciprocating in the elevating cylinder 7, the rod 9 connected to the piston 8, and the tip of the rod 9. And a plurality of lift pins 10 for raising and lowering the substrate. The elevating cylinder 7 is connected to a compressed air supply device (not shown). The tip of the rod 9 extends into the vacuum chamber 1 through an opening 1 a provided in the bottom wall of the vacuum chamber 1, and a plurality of lift pins 10 fixed to the tip of the rod 9 are attached to the hot plate 3 and the electrostatic chuck portion 4. It extends in the corresponding through holes 3a, 4a provided. A retractable bellows 11 is provided outside the vacuum chamber 1 so as to surround an opening 1 a provided in the bottom wall of the vacuum chamber 1 and surround a part of the rod 9. A flange 11 a at the lower end of the bellows 11 is provided around the rod 9. And the inside of the vacuum chamber 1 is vacuum-sealed.

  In the embodiment shown in FIG. 4, the pressure of the compressed air flowing through the compressed air supply pipe 16 is connected to the compressed air supply pipe 16 connected between the elevating cylinder 7 and a compressed air supply device (not shown). A pressure sensor 17 for measuring the change is provided. The pressure sensor 17 is connected to a pressure change signal processing circuit device 18. The processing circuit device 18 differentiates the measured pressure change from the pressure sensor 17, and the residual adsorption force in the electrostatic chuck mechanism 2 from the peak value. Is calculated. The level signal of the residual suction force in the electrostatic chuck mechanism 2 calculated in this way is supplied to the display or alarm device 19 so that the level of the residual suction force can be displayed. An alarm signal can be generated when the level of the residual adsorption force is higher than a predetermined level.

The operation of the apparatus configured as shown in FIG. 4 will be described below.
First, it is assumed that the required processing for the substrate 5 has been completed. At this stage, energization of the electrostatic chuck unit 4 in the electrostatic chuck mechanism 2 is stopped, and the compressed air supply line 16 and the pressure sensor 17 are supplied from a compressed air supply device (not shown) to the lifting cylinder 7 in the lifting mechanism 6. Compressed air is supplied through the rod 9 so that the rod 9 moves upward in the elevating cylinder 7, and a plurality of lift pins 10 fixed to the tip of the rod 9 are provided on the hot plate 3 and the electrostatic chuck portion 4, respectively. The through holes 3a and 4a are displaced upward and come into contact with the back surface of the substrate 5. Also in this case, although not shown in the drawing, a speed control device is provided for controlling the flow rate of the compressed air so that the compressed air is supplied from the compressed air supply device to the lifting cylinder 7 at a constant speed. When the piston 9 is operated within 7, the volume in the elevating cylinder 7 increases, so that the pressure change is relatively gradual. When there is no residual attracting force by the electrostatic chuck mechanism 2, even if the lift pin 10 comes into contact with the back surface of the substrate 5, only the vibration corresponding to the weight of the substrate 5 is generated. Therefore, as shown by the solid line in FIG. From A to the ascending limit position B, the pressure in the elevating cylinder 7 increases substantially linearly with time. On the other hand, when there is a residual adsorption force by the electrostatic chuck mechanism 2, when the lift pin 10 comes into contact with the back surface of the substrate 5 and stops, the pressure in the elevating cylinder 7 rises rapidly, and the dotted line in FIG. As indicated by a, b, c, the pressure in the elevating cylinder 7 changes according to the degree of the residual adsorption force. On the other hand, when the pressure in the elevating cylinder 7 is increased by the supply of compressed air to the elevating cylinder 7 in the elevating mechanism 6 and the pressure of the weight of the substrate 5 itself and the residual adsorption force by the electrostatic chuck mechanism 2 is overcome, the elevating cylinder 7, the piston 9 rises again and the volume in the elevating cylinder 7 increases, so that the pressure in the elevating cylinder 7 decreases and returns to the normal operation indicated by the solid line in FIG. 5. Such a change in pressure in the elevating cylinder 7 is detected by measuring with a pressure sensor 17 provided in the compressed air supply line 16. 2 is a case where the residual attracting force by the electrostatic chuck mechanism 2 is relatively small, a dotted line B is a case where the residual attracting force is medium, and a dotted line is, for example, an electrostatic chuck. This is a case where the residual adsorption force that requires replacement of the mechanism 2 is relatively large.

  In this way, the change in the pressure in the elevating cylinder 7 measured by the pressure sensor 17 is sent to the pressure change signal processing circuit device 18, and the waveform shift (dotted line) from the normal operation waveform shown by the solid line in FIG. The degree of residual suction force is specified by quantifying (indicated by a, b, c). In the pressure change signal processing circuit device 18, the measured pressure change amount is differentiated, and the maximum value of the slope is calculated. The results thus obtained are shown in FIG. In FIG. 6, a solid line indicates a case where there is no residual adsorption force, a dotted line A indicates a case where the residual adsorption force is relatively small, a dotted line B indicates a case where the residual adsorption force is medium, and a dotted line indicates This is a case where the residual adsorption force is relatively large.

  FIG. 7 shows an electrostatic chuck device provided with a dechuck monitor device according to another embodiment of the present invention, and portions corresponding to those in FIG. That is, reference numeral 1 denotes a vacuum chamber constituting a processing chamber, and an electrostatic chuck mechanism 2 is arranged inside the vacuum chamber 1 as shown in the figure. The electrostatic chuck mechanism 2 includes a hot plate 3 and an electrostatic chuck portion 4. Although the hot plate 3 is not shown in the drawing, a heater is incorporated therein, and such a heater can be constituted by, for example, a heating wire connected to a suitable power source or a heat medium circuit connected to a suitable heat medium source. The heater can be adjusted to a predetermined temperature by a temperature control device. The electrostatic chuck portion 4 is configured, for example, by covering a plate-like conductor with an insulator and receiving the substrate 5 on the upper surface. The plate-like conductor of the electrostatic chuck unit 4 is connected to a DC power source (not shown), and a DC voltage is applied from the DC power source to the plate-like conductor of the electrostatic chuck unit 4 to thereby form the electrostatic chuck unit 4 and the substrate. 5 is configured such that static electricity is generated between them and an electrostatic attraction force acts.

  In FIG. 7, reference numeral 6 denotes an elevating mechanism for the substrate 5, which is fixed to the elevating cylinder 7, the piston 8 reciprocating in the elevating cylinder 7, the rod 9 connected to the piston 8, and the tip of the rod 9. And a plurality of lift pins 10 for raising and lowering the substrate. The elevating cylinder 7 is connected to a compressed air supply device (not shown). The tip of the rod 9 extends into the vacuum chamber 1 through an opening 1 a provided in the bottom wall of the vacuum chamber 1, and a plurality of lift pins 10 fixed to the tip of the rod 9 are attached to the hot plate 3 and the electrostatic chuck portion 4. It extends in the corresponding through holes 3a, 4a provided. A retractable bellows 11 is provided outside the vacuum chamber 1 so as to surround an opening 1 a provided in the bottom wall of the vacuum chamber 1 and surround a part of the rod 9. A flange 11 a at the lower end of the bellows 11 is provided around the rod 9. And the inside of the vacuum chamber 1 is vacuum-sealed.

  In the embodiment shown in FIG. 7, an encoder 20 that is fixed to the flange 11 a at the lower end of the bellows 11 and detects the movement of the rod 9, that is, the lift pin 10 is provided. The encoder 20 can measure how many pitches are moved by moving up and down along the axial direction, thereby detecting the amount of displacement. The encoder 20 is connected to a displacement signal processing circuit device 21. The processing circuit device 21 differentiates the change in the axial displacement amount of the lift pin 10 measured from the encoder 20 as in the embodiment shown in FIG. The residual chucking force in the electrostatic chuck mechanism 2 is calculated from the peak value. The level signal of the residual suction force in the electrostatic chuck mechanism 2 calculated in this way is supplied to the display or alarm device 22 so that the level of the residual suction force can be displayed. An alarm signal can be generated when the level of the residual adsorption force is higher than a predetermined level.

  FIG. 8 shows an electrostatic chuck device provided with a dechuck monitor device according to another embodiment of the present invention, and parts corresponding to those in FIG. That is, reference numeral 1 denotes a vacuum chamber constituting a processing chamber, and an electrostatic chuck mechanism 2 is arranged inside the vacuum chamber 1 as shown in the figure. The electrostatic chuck mechanism 2 includes a hot plate 3 and an electrostatic chuck portion 4. Although the hot plate 3 is not shown in the drawing, a heater is incorporated therein, and such a heater can be constituted by, for example, a heating wire connected to a suitable power source or a heat medium circuit connected to a suitable heat medium source. The heater can be adjusted to a predetermined temperature by a temperature control device. The electrostatic chuck portion 4 is configured, for example, by covering a plate-like conductor with an insulator and receiving the substrate 5 on the upper surface. The plate-like conductor of the electrostatic chuck unit 4 is connected to a DC power source (not shown), and a DC voltage is applied from the DC power source to the plate-like conductor of the electrostatic chuck unit 4 to thereby form the electrostatic chuck unit 4 and the substrate. 5 is configured such that static electricity is generated between them and an electrostatic attraction force acts.

  In FIG. 8, reference numeral 6 denotes an elevating mechanism for the substrate 5, which is fixed to the electric elevating cylinder 23, the actuator rod 24 reciprocated by the elevating cylinder 23, and the tip of the rod 24. And a plurality of lift pins 25. The elevating cylinder 23 includes a stepping motor, for example, and is connected to a control power supply device (not shown). The tip of the rod 24 extends into the vacuum chamber 1 through an opening 1 a provided in the bottom wall of the vacuum chamber 1, and a plurality of lift pins 25 fixed to the tip of the rod 24 are attached to the hot plate 3 and the electrostatic chuck unit 4. It extends in the corresponding through holes 3a, 4a provided. An expandable bellows 11 is provided outside the vacuum chamber 1 so as to surround an opening 1 a provided on the bottom wall of the vacuum chamber 1 and surround a part of the rod 24, and a flange at the lower end of the bellows 11 is provided around the rod 24. The interior of the vacuum chamber 1 is vacuum-sealed by being hermetically sealed.

  In the embodiment shown in FIG. 8, a measuring instrument 26 that measures an electric power value, a torque value, and a load factor is connected to the elevating cylinder 23. Since the electric power value and torque value of the elevating cylinder 23 change according to the load, for example, when a residual adsorption force acts on the substrate 5 by the electrostatic chuck mechanism 2, a reaction force is generated in the elevating cylinder 23, and the electric power value temporarily. , Torque value and load factor increase. Therefore, in this embodiment, changes in the power value, torque value, and load factor are measured by the measuring device 26. Changes in the power value, torque value, and load factor measured by the measuring instrument 26 are supplied to the change signal processing circuit device 27. The processing circuit device 27 changes the power value, torque value, and load factor measured by the measuring device 26. The residual adsorption force can be measured by processing the power value, torque value, and increase amount of the load factor based on the above. The level signal of the residual attracting force in the electrostatic chuck mechanism 2 measured in this way is supplied to the display or alarm device in the same manner as in the above embodiment so that the level of the residual attracting force can be displayed. An alarm signal can be generated when the level of the residual adsorption force is higher than a predetermined level.

  FIG. 9 shows an electrostatic chuck device provided with a dechuck monitor device according to another embodiment of the present invention, and parts corresponding to those in FIG. That is, reference numeral 1 denotes a vacuum chamber constituting a processing chamber, and an electrostatic chuck mechanism 2 is arranged inside the vacuum chamber 1 as shown in the figure. The electrostatic chuck mechanism 2 includes a hot plate 3 and an electrostatic chuck portion 4. Although the hot plate 3 is not shown in the drawing, a heater is incorporated therein, and such a heater can be constituted by, for example, a heating wire connected to a suitable power source or a heat medium circuit connected to a suitable heat medium source. The heater can be adjusted to a predetermined temperature by a temperature control device. The electrostatic chuck portion 4 is configured, for example, by covering a plate-like conductor with an insulator and receiving the substrate 5 on the upper surface. The plate-like conductor of the electrostatic chuck unit 4 is connected to a DC power source (not shown), and a DC voltage is applied from the DC power source to the plate-like conductor of the electrostatic chuck unit 4 to thereby form the electrostatic chuck unit 4 and the substrate. 5 is configured such that static electricity is generated between them and an electrostatic attraction force acts.

  In FIG. 9, reference numeral 6 denotes an elevating mechanism for the substrate 5, which is fixed to the electric elevating cylinder 23, the actuator rod 24 reciprocated by the elevating cylinder 23, and the tip of the rod 24. And a plurality of lift pins 25. The elevating cylinder 23 includes a stepping motor, for example, and is connected to a control power supply device (not shown). The tip of the rod 24 extends into the vacuum chamber 1 through an opening 1 a provided in the bottom wall of the vacuum chamber 1, and a plurality of lift pins 25 fixed to the tip of the rod 24 are attached to the hot plate 3 and the electrostatic chuck unit 4. It extends in the corresponding through holes 3a, 4a provided. An expandable bellows 11 is provided outside the vacuum chamber 1 so as to surround an opening 1 a provided on the bottom wall of the vacuum chamber 1 and surround a part of the rod 24, and a flange at the lower end of the bellows 11 is provided around the rod 24. The interior of the vacuum chamber 1 is vacuum-sealed by being hermetically sealed.

  In the embodiment shown in FIG. 9, a load cell 28 is provided between the elevating cylinder 23 and the bellows 11. The load cell 28 is composed of, for example, a strain gauge, and is configured to measure the compressive or tensile strength applied to the load cell 28. When the lift pin 25 comes into contact with the substrate 5 in the ascending process of the elevating cylinder 23, a force generated by the substrate 5 and the elevating cylinder 23 is generated on the load cell 28, and the residual adsorption force is measured from the peak value of this force. Can do. The level signal of the residual attracting force in the electrostatic chuck mechanism 2 measured in this way is supplied to the display or alarm device in the same manner as in the above embodiment so that the level of the residual attracting force can be displayed. An alarm signal can be generated when the level of the residual adsorption force is higher than a predetermined level.

1 is a schematic sectional view showing an embodiment of the present invention. The graph explaining operation | movement of the apparatus of FIG. The graph which shows the operation result of the apparatus of FIG. The schematic sectional drawing which shows another embodiment of this invention. The graph explaining operation | movement of the apparatus of FIG. The graph which shows the operation result of the apparatus of FIG. The schematic sectional drawing which shows another embodiment of this invention. The schematic sectional drawing which shows another embodiment of this invention. The schematic sectional drawing which shows another embodiment of this invention.

Explanation of symbols

1: Vacuum chamber constituting processing chamber 2: Electrostatic chuck mechanism 3: Hot plate 4: Electrostatic chuck section 5: Substrate 6: Lifting mechanism for substrate 5 7: Lifting cylinder 8: Piston 9: Rod 10: Lift pin 11: Bellows 12: Detection plate 13: Displacement sensor 14: Displacement amount signal processing circuit device 15: Display or alarm device

Claims (12)

  Used together with a processing object mounting and removal device having a mounting mechanism for mounting a processing object to be processed in a processing chamber to a processing object holder, and a dechucking mechanism for removing the processing object processed in the processing chamber from the processing object holder A dechuck monitoring device, comprising a dechucking mechanism interlocking with a dechucking mechanism, and a dechucking force change measuring device for measuring a change in a residual adsorbing force when a workpiece is removed from a workpiece holder. Monitor device.   The dechuck mechanism includes an elevating mechanism and a compressed air cylinder, and the adsorption force change measuring device includes a displacement sensor that interlocks with the compressed air cylinder in the dechuck mechanism and measures the amount of displacement of the workpiece from the workpiece holder. The dechuck monitor device according to claim 1, wherein   The dechucking mechanism includes an elevating mechanism and a compressed air cylinder, and the measuring device for the change in adsorption force comprises a pressure sensor for measuring the pressure of the compressed air applied to the compressed air cylinder in the dechucking mechanism. Dechuck monitor device.   2. The dechuck mechanism includes an elevating mechanism and a compressed air cylinder, and the adsorption force change measuring device comprises an encoder which is combined with the compressed air cylinder in the dechuck mechanism and measures the operation amount of the compressed air cylinder. The dechuck monitor device described in 1.   The dechuck mechanism includes a bellows, and the measuring device for the change in adsorption force includes a load cell provided between the compressed air cylinder and the bellows in the dechuck mechanism and measuring a compression or tensile strength. The dechuck monitor device described.   2. The dechuck monitor device according to claim 1, wherein the dechuck mechanism includes an electric cylinder, and the measuring device for the change in adsorption force comprises a measuring instrument for measuring the torque value, electric power value or load factor of the electric cylinder.   2. An alarm signal generating device for generating an alarm signal when a residual suction force exceeds a predetermined level based on a change in the suction force measured by the suction force change measuring device is provided. The dechuck monitor device according to any one of claims 6 to 6. An apparatus for mounting and removing a workpiece having a mounting mechanism for mounting a workpiece to be processed in the processing chamber on a workpiece holder and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder is used. A dechuck monitoring method,
It is characterized by measuring the displacement of the workpiece from the workpiece holder with a displacement sensor provided in conjunction with the dechuck mechanism and differentiating the measured displacement of the workpiece to obtain the maximum value of the inclination. How to monitor dechuck. An apparatus for mounting and removing a workpiece having a mounting mechanism for mounting a workpiece to be processed in the processing chamber on a workpiece holder and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder is used. A dechuck monitoring method,
A dechuck monitoring method, comprising: measuring a pressure of compressed air to a compressed air cylinder in a dechuck mechanism, and differentiating the measured pressure of the compressed air to obtain a maximum value of the inclination. An apparatus for mounting and removing a workpiece having a mounting mechanism for mounting a workpiece to be processed in the processing chamber on a workpiece holder and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder is used. A dechuck monitoring method,
Measures the amount of operation of the compressed air cylinder using an encoder that generates a pulse output in conjunction with the compressed air cylinder in the dechuck mechanism, differentiates the measured amount of operation to determine the maximum value of the inclination. Chuck monitoring method. An apparatus for mounting and removing a workpiece having a mounting mechanism for mounting a workpiece to be processed in the processing chamber on a workpiece holder and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder is used. A dechuck monitoring method,
A dechuck monitoring method characterized in that a compression or tensile strength is measured by a load cell inserted between an electric cylinder and a bellows in a dechuck mechanism, and an adsorption force is measured from a peak value of the measured compression or tensile strength. . An apparatus for mounting and removing a workpiece having a mounting mechanism for mounting a workpiece to be processed in the processing chamber on a workpiece holder and a dechuck mechanism for removing the workpiece processed in the processing chamber from the workpiece holder is used. A dechuck monitoring method,
A dechuck monitoring method characterized by measuring an electric power value, a torque value, or a load factor of an electric cylinder in a dechucking mechanism, and measuring an adsorption force from an increase amount of the measured electric power value, torque value, or load factor.

Images