JP2008175781A - Ultrasonic probe for high-temperature application - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely perform various inspections, such as flaw detection and thickness measurement using ultrasonic waves against an object 38 to be inspected in a high-temperature application. <P>SOLUTION: A signal terminal 24 is provided on the outer surface of a case 21, formed of a conductive material having an opening 2 facing the object 38 of a conductive material and contains a vibrator 28 in the case 21; positive electrode side spring member 30, the over end of which is electrically connected to the side of a positive electrode 33 of the signal terminal 24 and the other end of which contacts the upper surface of the vibrator 28 to urge the vibrator 28 to the object 38; and a negative electrode side spring member 35 one end of which is fixed to the case 21 and the other end of which contacts the object 38 are provided; and the use of solder with a melting point temperature, in the range from 230 to 240°C is eliminated, and thus, the object in high-temperature application can be performed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ultrasonic probe for performing various examinations on a subject by propagating ultrasonic waves to the subject, and more particularly to a high-temperature ultrasonic probe for examining a high-temperature subject. .

  An ultrasonic inspection method has been widely put into practical use as a method for easily detecting a defect existing inside a subject such as a steel plate or measuring the thickness of the subject such as a steel plate. In this ultrasonic inspection method, an ultrasonic probe that transmits / receives ultrasonic waves to / from a subject is used. The ultrasonic probe is an oblique type ultrasonic probe that makes ultrasonic waves incident obliquely with respect to the surface of the subject, and a vertical that makes ultrasonic waves incident perpendicular to the surface of the subject. There is a type of ultrasonic probe.

  10A and 10B are a cross-sectional view and an external view of a vertical ultrasonic probe. A signal terminal 3 is attached to the upper surface of a casing 1 made of a conductive metal material and formed in a cylindrical shape having an opening 2 at the lower end. A damper material 4 formed in a cylindrical shape with, for example, acrylic resin or the like is accommodated in the housing 1. A disk-shaped vibrator 5 made of a piezoelectric material such as quartz, barium titanate ceramic, ceramic, lead niobate ceramic or the like is attached to the lower surface of the damper material 4.

  The upper and lower surfaces of the vibrator 5 are coated with conductive films 6 and 7. A lead wire 8 connecting the upper surface of the vibrator 5 coated with the conductive film 6 and the positive electrode 9 of the signal terminal 3 is accommodated in a through hole 9 formed in the axial center of the cylindrical damper material 4. ing. The lead wire 8 is connected to the conductive film 6 coated on the vibrator 5 and the cylindrical positive electrode 9 of the signal terminal 3 by “solder”.

  Further, the conductive film 7 coated on the lower surface of the vibrator 5 is connected to the inner peripheral surface of the opening 2 portion of the housing 1 through the lead wire 11. The lead wire 11 is connected to the conductive film 7 coated on the vibrator 5 and the inner peripheral surface of the opening 2 of the housing 1 by “solder”. Since the negative electrode 12 of the signal terminal 3 is integrally formed with the housing 1, for example, the lower surface of the vibrator 5 coated with the conductive film 6 is electrically connected to the negative electrode 12 of the signal terminal. A protective film 13 for protecting the vibrator 5 is attached to the lower surface of the vibrator 5 coated with the conductive film 6.

  At the time of actual measurement, a connector 14 for inputting / outputting a signal from an ultrasonic measurement device (not shown) is attached to the signal terminal 3.

  In a state where the vertical ultrasonic probe 15 having such a configuration is pressed against the surface of the subject 16 with a jig (not shown), a pulse signal of, for example, a repetition frequency of 500 Hz is sent from the ultrasonic measurement device to the connector 14. When applied to the vibrator 5 via the terminal 3 and the lead wire 8, an ultrasonic pulse 17 having a repetition frequency of 500 Hz having a vibration frequency of 5 MHz determined by the thickness of the vibrator 5 is applied from the vibrator 5 to the surface of the subject 16. On the other hand, it enters in the vertical direction and propagates in the subject 16 in the vertical direction. When the ultrasonic pulse 17 propagating in the subject 16 comes into contact with a defect or the bottom surface of the subject 16, the original path travels backward and is input to the vibrator 5.

In addition, the ultrasonic probe for high temperature is reported by patent document 1, for example.
Japanese Patent Laid-Open No. 10-339722

  However, the ultrasonic probe described above still has the following problems to be solved.

  That is, in recent years, there has been a demand for expansion of a measurement condition range in a subject that can accurately inspect defect detection and thickness measurement using an ultrasonic inspection method. For example, periodic ultrasonic flaw detection and periodic thickness measurement for pipes, tanks and the like in various plants of chemical factories are required.

  However, since flaw detection and thickness measurement for these pipes, tanks, etc. must be carried out with the plant maintained in an operating state, high-temperature gas or liquid is flowing or stored in the pipes, tanks, etc. In some cases, the temperature of the subject 16 becomes high. For example, it may exceed 300 ° C. When the temperature of the subject 16 becomes high, the temperature of the ultrasonic probe 15 pressed against the subject 16 by using a jig or the like also becomes high.

  In each member constituting the ultrasonic probe 15 shown in FIGS. 10A and 10B, the member most vulnerable to the temperature rise is the vibrator that is in contact with the subject 16 through the protective film 13. 5 is a “solder” that connects the conductive film 6 and the signal terminal 3, and connects the conductive film 7 coated on the vibrator 5 with the lead wire 11 and the opening 2.

  Generally, the melting point temperature of “solder” in which “lead” and “tin” are mixed at a ratio of about 50% is about 200 ° C. Even what is called “high temperature solder” has a melting point temperature of 230 ° C. to 240 ° C. at most. When the subject 16 having a temperature exceeding the melting point temperature is inspected, the lead wire 8 is separated from the vibrator 5. Therefore, the temperature range of the subject that can be inspected by the ultrasonic probe 15 is 230 ° C. to 240 ° C. at the highest.

  The present invention has been made in view of such circumstances, and even if it is a high-temperature specimen exceeding the melting temperature of the solder, flaw detection or thickness measurement using ultrasonic waves on the high-temperature specimen, etc. An object of the present invention is to provide a high-temperature ultrasonic probe capable of performing various inspections with high accuracy.

  In order to solve the above-described problems, the ultrasonic probe for high temperature of the present invention has one surface that contacts a subject in a casing formed of a conductive material having an opening facing the subject of the conductive material. In the ultrasonic probe that stores the contacted transducer and has a signal terminal for transmitting and receiving a signal to the transducer with the negative electrode side in contact with the housing, one end is electrically connected to the positive electrode side of the signal terminal, A positive side spring member whose other end is in contact with the other surface of the vibrator and biases the vibrator toward the subject; and a negative side spring member whose one end is fixed to the housing and whose other end is in contact with the subject. Yes.

  In the high-temperature ultrasonic probe configured as described above, the vibrator housed in the casing made of a conductive material is biased to the subject by the positive-side spring member. Furthermore, the other surface (upper surface, positive electrode side surface) of the vibrator is electrically connected to the positive electrode side of the signal terminal via a positive electrode spring member. In addition, one surface (lower surface, negative electrode side surface) of the vibrator is in contact with the subject of the conductive material. A negative-side spring member is interposed between the housing and the conductive material subject. Therefore, one surface (lower surface, negative electrode side surface) of the vibrator is connected to the negative electrode side of the signal terminal.

  In a state where the high-temperature ultrasonic probe thus configured is pressed against the subject using a jig or the like, for example, without using solder having a low melting point temperature, the other surface (upper surface, Since the positive electrode side surface and the one surface (lower surface, negative electrode side surface) are electrically connected to the positive electrode side and the negative electrode side of the signal terminal via the positive electrode side spring member and the negative electrode side spring member, the melting point temperature of the solder is reduced. Various inspections such as flaw detection using ultrasonic waves and thickness measurement can be performed with high accuracy on a high-temperature subject exceeding the temperature.

  In another aspect of the invention, an ultrasonic probe for high temperature includes a transducer having one surface in contact with a subject in a case formed of a conductive material having an opening facing the subject of the conductive material. In the ultrasonic probe having a signal terminal for housing and having a negative electrode side in contact with the casing and transmitting / receiving a signal to the vibrator, one end is electrically connected to the positive electrode side of the signal terminal and the other end is the vibration A positive-side spring member that abuts the other surface of the child and biases the vibrator to the subject; a negative-side spring member that has one end fixed to the housing and the other end abuts the subject; a positive-side spring member and a negative electrode A clamping mechanism for clamping the casing to the subject against the urging force of the side spring member.

  Since the high-temperature ultrasonic probe configured as described above is provided with a clamp mechanism for clamping the housing to the subject, the high-temperature ultrasonic probe is separately pressed against the subject during the examination. There is no need to prepare a jig for this purpose.

  In another aspect of the invention, an ultrasonic probe for high temperature includes a vibrator having one surface in contact with a subject in a casing formed of a conductive material having an opening facing the subject made of a non-conductive material. In the ultrasonic probe having a signal terminal for transmitting and receiving signals to and from the vibrator with the negative electrode side in contact with the casing, one end is electrically connected to the positive electrode side of the signal terminal and the other end vibrates. A positive-side spring member that abuts the other surface of the child and biases the vibrator to the subject; a negative-side spring member that abuts the subject that has one end fixed to the housing and the other end coated with a conductive film; And a clamping mechanism for clamping the casing to the subject against the biasing force of the positive side spring member and the negative side spring member.

  In the high-temperature ultrasonic probe configured as described above, in the case where the subject is a non-conductive material, the conductive film is coated on the portion where the vibrator of the subject contacts, One surface (lower surface, negative electrode side surface) of the vibrator is electrically and reliably connected to the negative electrode side of the signal terminal via the coated conductive film, the negative electrode side spring member, and the housing. Therefore, even for a high-temperature subject made of a non-conductive material, various inspections such as flaw detection and thickness measurement using ultrasonic waves can be accurately performed on the high-temperature subject made of this non-conductive material.

  In the high-temperature ultrasonic probe of the present invention, the spring member does not move away from the vibrator because the spring member transmits and receives signals to the vibrator and biases the vibrator to the subject. As a result, there is no need to use conventional solder, so even if the specimen has a temperature exceeding the melting temperature of the solder, various inspections such as flaw detection using ultrasonic waves and thickness measurement are accurately performed on this high-temperature specimen. Can be implemented well.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
1A and 1B are a cross-sectional view and a top view of a high-temperature ultrasonic probe according to the first embodiment of the present invention.

  In the high-temperature ultrasonic probe 20 of the first embodiment, a signal terminal 24 is attached to a lid 23 at the upper end of a casing 21 made of a conductive metal material and formed in a cylindrical shape having an opening 22 at the lower end. ing. A damper material 26 covered with a damper case 25 is accommodated in the housing 21. A stopper material 27 is accommodated on the upper surface of the damper material 26. A disk-shaped vibrator 28 formed of a piezoelectric material such as quartz, barium titanate-based ceramics, ceramics, lead niobate-based ceramics or the like is gently attached to the lower surface of the damper material 26 so as not to fall.

  The upper surface and the lower surface of the vibrator 28 are coated with a conductive film. A coil spring 30 made of a conductive material as a positive-side spring member is housed in a through hole 29 formed in the axial center of a cylindrical damper material 26 and a cylindrical stopper material 27. The upper end of the coil spring 30 is in contact with the electrode plate 31 fixed to the stopper material 27, and the upper end of the coil spring 30 is connected to the positive electrode 33 of the signal terminal 24 via the electrode plate 31 and the lead wire 32. . The lower end of the coil spring 30 is in contact with the upper surface of the vibrator 28 coated with a conductive film. Since the upper end position of the coil spring 30 is fixed at the position of the electrode plate 31, the vibrator 28 is biased downward by the coil spring 30, and the lower surface of the vibrator 28 is opened at the lower end of the housing 21. For example, it is exposed downward by about 1 mm from 22.

  A step portion 34 is formed at a position below the outer peripheral surface of the casing 21 formed in a cylindrical shape, and a coil spring formed of a conductive material as a negative side spring member on the annular step portion 34. 35 is inserted. The lower end of the coil spring 35 is exposed downward from the lower end opening 22 of the housing 21 by, for example, about 10 mm. The spring constant (repulsive force) of the coil spring 35 is very small. As shown in FIG. 2, when the high-temperature ultrasonic probe 20 is placed on the upper surface of the flat object 38, The coil spring 35 is compressed by the gravity of the ultrasonic probe 20, and the upper surface of the subject 38 comes into contact with the lower surface coated with the conductive film of the vibrator 28.

  On the other hand, the negative electrode 36 having the cylindrical shape of the signal terminal 24 is electrically connected to the coil spring 35 through the lid 23 and the housing 21. As described above, when the high-temperature ultrasonic probe 20 is placed on the upper surface of the flat specimen 38, the lower end of the coil spring 35 comes into contact with the upper face of the subject 38 made of a conductive material. In actual inspection, the lower surface of the vibrator 28 coated with the conductive film is electrically connected to the negative electrode 36 of the signal terminal 24 through the subject 38, the coil spring 35, the housing 21, and the lid 23. Will be connected to. Further, at the time of actual measurement, a connector 37 to which signals are input / output from an ultrasonic measurement device (not shown) is attached to the signal terminal 24.

  In the high-temperature ultrasonic probe 20 according to the first embodiment configured as described above, the high-temperature ultrasonic probe 20 is pressed against the subject 38 made of a conductive material using a jig (not shown). As shown in FIG. 2, when the high-temperature ultrasonic probe 20 is placed on the upper surface of the flat object 38, the vibrator 28 biases the upper surface of the object 38 by the coil spring 30. Is done. In this state, the upper surface of the vibrator 28 is connected to the positive electrode 33 of the signal terminal 24 via the coil spring 30, the electrode plate 31, and the lead wire 32. In this state, as described above, the lower surface of the vibrator 28 coated with the conductive film is connected to the negative electrode 36 of the signal terminal 24 via the subject 38, the coil spring 35, the housing 21, and the lid 23. Is electrically connected.

  Therefore, the high-temperature ultrasonic probe 20 can transmit / receive an ultrasonic pulse to / from the subject 38 in accordance with a pulse signal input from an ultrasonic measurement device (not shown). In this case, the upper surface (positive electrode side surface) and the lower surface (negative electrode side surface) of the vibrator 28 are electrically connected to the positive electrode 33 and the negative electrode 36 of the signal terminal 24 via the coil springs 30 and 35 without using solder having a low melting point temperature. Therefore, various inspections such as flaw detection using ultrasonic waves and thickness measurement can be performed with high accuracy on a high-temperature object 38 that exceeds the melting point temperature of solder at 230 ° C. to 240 ° C.

  Note that the measurable upper limit temperature of the subject 38 is abruptly deteriorated in the piezoelectric function of the disk-shaped vibrator 28 formed of a piezoelectric material such as quartz, barium titanate ceramic, ceramic, lead niobate ceramic, or the like. The secondary phase transition temperature (Curie point temperature) is 530 ° C. (lead niobate-based porcelain).

(Second Embodiment)
FIG. 3 is a cross-sectional view of a high-temperature ultrasonic probe according to the second embodiment of the present invention. The same parts as those of the high-temperature ultrasonic probe 20 of the first embodiment shown in FIGS. 1A and 1B are denoted by the same reference numerals, and detailed description of the overlapping parts is omitted.

  In the high-temperature ultrasonic probe 20a of the second embodiment, a screw groove 39 is formed on the outer peripheral surface of the casing 21 that houses the transducer 28, the damper material 26, the stopper material 27, and the coil spring 30. A cap nut 40 as a clamping mechanism is screwed into the thread groove 39.

  A screw hole 41 in which a screw groove into which the screw groove 39 is screwed is formed is formed in the upper wall of the cap nut 40, and a large-diameter portion 43a is formed at the upper end shown in FIG. A through-hole 42 is formed through which the cylindrical subject 43 penetrates. Further, a coil spring 44 is accommodated in the cylindrical cap nut 40 in the vicinity of the inner peripheral surface. The upper end of the coil spring 44 is fixed to the inner surface of the upper wall in which the screw hole 41 is formed.

  A subject 43 formed of a conductive material to be inspected by the high-temperature ultrasonic probe 20a of the second embodiment has a cylindrical shape with a large-diameter portion 43a formed at the upper end, as shown in FIG. . The lower surface of the transducer 28 of the high-temperature ultrasonic probe 20a is brought into contact with the upper surface 43b of the subject 43.

  A procedure for mounting the subject 43 having such a shape on the high-temperature ultrasonic probe 20a will be described. First, the cap nut 40 is removed from the outer peripheral surface of the casing 21, and in this state, the upper surface 43b of the subject 43 is placed below the high temperature ultrasonic probe 20a from the lower surface of the transducer 28, the coil springs 34, 44. In a state where the cylindrical cap nut 40 is pressed against the lower end and the subject 43 is passed through the through hole 42, the subject is inserted into the screw groove 39 formed on the outer peripheral surface of the housing 21 from below. The upper surface 43b of 43 is screwed to a position where it contacts the lower surface of the vibrator 28.

  FIG. 6 is a cross-sectional view showing a state in which the subject 43 is attached to the high-temperature ultrasonic probe 20 a with the cap nut 40. In this state, the large-diameter portion 43 a of the subject 43 is sandwiched between the upper surface of the lower wall of the cap nut 40 and the lower surface of the vibrator 28. Therefore, similarly to the high-temperature ultrasonic probe 20 of the first embodiment shown in FIG. 1, the vibrator 28 is urged to the upper surface 43 b of the subject 43 by the coil spring 30. In this state, the upper surface of the vibrator 28 is connected to the positive electrode 33 of the signal terminal 24 via the coil spring 30, the electrode plate 31, and the lead wire 32. In this state, the lower surface of the vibrator 28 coated with the conductive film is electrically connected to the negative electrode 36 of the signal terminal 24 via the upper surface 43 b of the subject 43, the coil spring 35, the housing 21, and the lid 23. Connected.

  Therefore, the high-temperature ultrasonic probe 20a of the second embodiment can transmit and receive an ultrasonic pulse to and from the subject 43 in accordance with a pulse signal input from an ultrasonic measurement device (not shown). In this case, the upper surface (positive electrode side surface) and the lower surface (negative electrode side surface) of the vibrator 28 are electrically connected to the positive electrode 33 and the negative electrode 36 of the signal terminal 24 via the coil springs 30 and 35 without using solder having a low melting point temperature. Therefore, it is possible to accurately perform various inspections such as flaw detection using ultrasonic waves and thickness measurement on a high-temperature object 43 that exceeds the melting point temperature of solder at 230 ° C. to 240 ° C.

  Furthermore, in the high-temperature ultrasonic probe 20a of the second embodiment, the high-temperature subject 43 is pressed against the vibrator 28 of the high-temperature ultrasonic probe 20a using the cap nut 40. Therefore, it is not necessary to press the high-temperature subject 43 against the vibrator 28 of the high-temperature ultrasonic probe 20a by using a dedicated jig.

  FIG. 7 shows a non-conductive material in the case where a test using an ultrasonic wave is performed on an object of a non-conductive material using the high-temperature ultrasonic probe 20a of the second embodiment shown in FIG. It is a figure which shows the processing state of this subject.

  This non-conductive material subject 45 has the same shape as the conductive material subject 43 shown in FIG. 5, and has a cylindrical shape with a large-diameter portion 45a formed at the upper end. A conductive film 46 is coated on the upper surface 45 b of the subject 45. The area of the conductive film 46 is set so as to sufficiently cover the lower surface of the vibrator 28 and the lower end portion of the coil spring 35.

  As shown in FIG. 6, when such a subject 45 is mounted on the high-temperature ultrasonic probe 20a, the lower surface of the transducer 28 comes into contact with the upper surface 45b of the subject 45 coated with the conductive film 46. Further, the lower end of the coil spring 35 whose upper end is in contact with the stepped portion 34 of the casing 21 is in contact with the upper surface 45b of the subject 45 coated with the conductive film 46.

  Accordingly, in this state, the lower surface coated with the conductive film of the vibrator 28 is connected to the upper surface 45 of the subject 45 via the conductive film 46, the coil spring 35, the casing 21, and the lid 23. The signal terminal 24 is electrically connected to the negative electrode 36.

  Therefore, even if it is the test object 45 of a nonelectroconductive material, the test object of the conductive material shown in FIG. 5 can be obtained by coating the upper surface 45b of the test object 45 as shown in FIG. The same effect as 43 can be obtained.

(Third embodiment)
FIGS. 8A and 8B are an application diagram and a cross-sectional schematic diagram of a high-temperature ultrasonic probe according to the third embodiment of the present invention. The same parts as those of the high-temperature ultrasonic probe 20 of the first embodiment shown in FIGS. 1A and 1B are denoted by the same reference numerals, and detailed description of the overlapping parts is omitted.

  The ultrasonic probe 20b for high temperature according to the third embodiment is permanently attached to the outer peripheral surface of the pipe 47 of the chemical factory, measures the thickness d of the pipe 47 as the subject at a constant period, and measures the thickness d. Measure changes.

  In such a high-temperature ultrasonic probe 20 b, an annular protrusion 49 is integrally formed on the outer peripheral surface of the housing 21, and the annular protrusion 49 and the pipe 47 are fixed with a bolt 50. The tightening pressure of the bolt 50 is adjusted so that the lower surface of the vibrator 28 contacts the surface of the pipe 47 with a predetermined pressure. Therefore, the annular protrusion 49 and the bolt 50 constitute a clamp mechanism that clamps the casing 21 to the pipe 47 as the subject.

  The high-temperature ultrasonic probe 20b of the third embodiment configured as described above can achieve substantially the same effect as the high-temperature ultrasonic probe 20a of the second embodiment described above. .

  FIG. 9 is a schematic sectional view of an ultrasonic probe for high temperature according to the fourth embodiment of the present invention. The same parts as those of the high-temperature ultrasonic probe 20b of the third embodiment shown in FIG. 8B are denoted by the same reference numerals, and detailed description of the overlapping parts is omitted.

  In the high-temperature ultrasonic probe 20 c of the fourth embodiment, an annular protrusion 49 is integrally formed on the outer peripheral surface of the housing 21, and the annular protrusion 49 is attracted and fixed to the pipe 47 by the magnet 51. ing. Therefore, the annular protrusion 49 and the magnet 51 constitute a clamp mechanism that clamps the casing 21 to the pipe 47 as the subject.

  The high-temperature ultrasonic probe 20c according to the fourth embodiment configured as described above can achieve substantially the same effect as the high-temperature ultrasonic probe 20a according to the second embodiment described above. .

Sectional drawing and top view which show schematic structure of the ultrasonic probe for high temperature concerning 1st Embodiment of this invention The figure which shows the state which mounted the ultrasonic probe for high temperature of the same 1st Embodiment on the upper surface of the flat test subject. Sectional drawing which shows schematic structure of the ultrasonic probe for high temperature concerning 2nd Embodiment of this invention. The schematic diagram which shows the cap nut integrated in the ultrasonic probe for high temperature of 2nd Embodiment The perspective view which shows the test object test | inspected with the ultrasonic probe for high temperature of 2nd Embodiment. The figure which shows the state with which the test object was mounted | worn in the ultrasonic probe for high temperature of 2nd Embodiment. The perspective view which shows the test object formed with the nonelectroconductive material test | inspected with the ultrasonic probe for high temperature of 2nd Embodiment. Application diagram and cross-sectional schematic diagram of an ultrasonic probe for high temperature according to the third embodiment of the present invention Sectional drawing of the principal part of the ultrasonic probe for high temperature concerning 4th Embodiment of this invention. Sectional view and perspective view showing a schematic configuration of a conventional ultrasonic probe

Explanation of symbols

  20, 20a, 20b, 20c ... high temperature ultrasonic probe, 21 ... housing, 22 ... opening, 23 ... lid, 24 ... signal terminal, 26 ... damper material, 27 ... stopper material, 28 ... vibrator, 29 ... through hole, 30, 35, 44 ... coil spring, 33 ... positive electrode, 34 ... step, 36 ... negative electrode, 37 ... connector, 38, 43, 45 ... subject, 39 ... screw groove, 40 ... cap nut, 47 ... Piping, 49 ... Annular projection, 50 ... Bolt, 51 ... Magnet

Claims (3)

A vibrator having one surface in contact with the subject is housed in a case formed of a conductive material having an opening facing the subject made of a conductive material, and the negative electrode side is in contact with the case and the vibrator In an ultrasonic probe equipped with a signal terminal for transmitting and receiving a signal for
A positive-side spring member that has one end electrically connected to the positive electrode side of the signal terminal and the other end abutting against the other surface of the vibrator to bias the vibrator toward the subject;
An ultrasonic probe for high temperature, comprising: a negative-side spring member having one end fixed to the casing and the other end contacting the subject. A vibrator having one surface in contact with the subject is housed in a case formed of a conductive material having an opening facing the subject made of a conductive material, and the negative electrode side is in contact with the case and the vibrator In an ultrasonic probe equipped with a signal terminal for transmitting and receiving a signal for
A positive-side spring member that has one end electrically connected to the positive electrode side of the signal terminal and the other end abutting against the other surface of the vibrator to bias the vibrator toward the subject;
A negative side spring member having one end fixed to the housing and the other end in contact with the subject;
An ultrasonic probe for high temperature, comprising: a clamp mechanism that clamps the casing against the subject against the biasing force of the positive side spring member and the negative side spring member. A vibrator whose one surface is in contact with the subject is housed in a case formed of a conductive material having an opening facing the subject made of a non-conductive material, and the negative electrode side is in contact with the case and the vibration In an ultrasonic probe with a signal terminal for transmitting and receiving signals to the child,
A positive-side spring member that has one end electrically connected to the positive electrode side of the signal terminal and the other end abutting against the other surface of the vibrator to bias the vibrator toward the subject;
A negative side spring member abutting on the subject whose one end is fixed to the casing and the other end is coated with a conductive film;
An ultrasonic probe for high temperature, comprising: a clamp mechanism that clamps the casing against the subject against the biasing force of the positive side spring member and the negative side spring member.

Images