JP2008169889A - Joint structure, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joint structure where generation or partial concentration of stress is restrained and joint strength of respective members is high. <P>SOLUTION: This joint structure comprises a first member, a second member, and an intermediate member interposed between the first member and the second member, and is composed by jointing the respective members by a joint material. The joint structure is characterized in that the intermediate member has a plurality of holes or grooves forming spaces. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a joined structure. More specifically, the present invention is composed of a first member, a second member, and an intermediate member interposed between the first member and the second member, and a joined structure in which these members are joined, and It relates to the manufacturing method.

  In a joined structure in which multiple members are joined, there are various physical properties such as differences in physical properties based on the material and shape of each member, residual stress due to differences in thermal expansion coefficients at the joining interface, warping, deformation, peeling, etc. It was difficult to obtain sufficient joint strength and reliability.

  The joining structure of plate glass is described in Japanese Patent Application Laid-Open No. 2002-266819 (Patent Document 1). However, this technique mainly relates to a technique for preventing variation in the adhesive strength of the adhesive due to variations in the tightening force of bolts and the like, including residual stress due to a difference in thermal expansion coefficient, It does not describe in detail the warpage, deformation, and prevention of stress generation.

Japanese Patent Laid-Open No. 10-29256 (Patent Document 2) discloses a composite material and a method for manufacturing the same. However, although this document shows a structure that resists tensile stress in the direction perpendicular to the surface of the composite material, it does not specifically show the horizontal stress of the composite material and its relaxation structure. In addition, since the hole of the composite material is filled with a different material, it is considered that this hole does not directly contribute to stress relaxation.
Japanese Patent Laid-Open No. 2002-266819 JP-A-10-29256

  As described above, in a bonded structure in which a plurality of members are bonded, it is difficult to obtain sufficient bonding strength and reliability. In particular, a bonded structure made of a different material or a large bonded structure tends to be warped or peeled off due to an increase in stress or partial concentration.

  For this reason, there is a demand for a bonded structure in which the bonding strength of each member is high and the occurrence of stress or partial concentration is suppressed.

  The present invention has been made to solve the above problems.

  Therefore, the joining structure according to the present invention includes the first member, the second member, and the intermediate member interposed between the first member and the second member, and these members are joined by the joining material. The intermediate structure is characterized in that the intermediate member has a plurality of holes or grooves forming a space.

  Such a bonded structure according to the present invention includes, as a preferred embodiment, one in which the first member and / or the second member are made of a metal material, a ceramic material, or a glass material.

  Such a bonded structure according to the present invention includes, as a preferred embodiment, one in which the intermediate member is made of a metal material, a ceramic material, or a glass material.

  Such a bonded structure according to the present invention includes, as a preferred embodiment, one in which the intermediate member is composed of a plurality of members that can form the space.

  Such a bonded structure according to the present invention includes, as a preferred mode, one in which the intermediate member has a through hole in a direction perpendicular to the bonding interface with the first member or the second member.

  In such a bonded structure according to the present invention, as a preferred embodiment, the through hole is formed in the linear member in the vertical direction of the bonding interface with the first member or the second member of the intermediate member. Including those arranged to break continuity.

  In such a bonded structure according to the present invention, as a preferred embodiment, the intermediate member is made of an iron-based, copper-based, Ni-based or Co-based metal material, or an iron-based metal material on which a Ni or Co film is formed, Is included.

  In such a bonded structure according to the present invention, as a preferred embodiment, the bonding material is made of an Sn-based low melting point metal material containing at least one selected from Cu, Ni, Zn, Ag, In, and Bi. .

  Such a bonded structure according to the present invention includes, as a preferred embodiment, one in which the bonding material is made of an Sn-based low melting point metal material further containing at least one selected from Co, Ti, Ta, and Pd. To do.

  In such a bonded structure according to the present invention, as a preferred embodiment, the first member, the second member, and the intermediate member are each made of a glass material, and at least a contact portion of each of the members with the bonding material is metallized. In which a layer is formed.

  In such a bonded structure according to the present invention, as a preferred embodiment, the metallized layer contains at least one of Ag, Cu, Ni, and Co and a Co oxide, and the balance is made of glass.

  In such a bonded structure according to the present invention, as a further preferred embodiment, the metallized layer has a content of 1 to 80% by weight of Ag, Cu, Ni and Co, respectively, and a total content of these is 90% by weight. %, And the Co oxide content is 1 to 50% by weight, with the balance being made of glass.

  Further, the manufacturing method of the bonded structure according to the present invention includes the bonding material disposed between the first member and the intermediate member and between the intermediate member and the second member, the melting point of the bonding material. The first member, the intermediate member, and the second member are joined by heating to the above temperature.

  Such a method for producing a bonded structure according to the present invention includes, as a preferred embodiment, one in which the adhesive is previously formed on any of the first member, the second member, and the intermediate member.

  ADVANTAGE OF THE INVENTION According to this invention, the joining structure with high joining strength of each member with which generation | occurrence | production or partial concentration of stress was suppressed can be obtained. Therefore, the present invention can be applied to, for example, a joining structure made of different materials, a large joining structure, a joining structure that is repeatedly subjected to heating, cooling, etc., particularly a joining structure that is required to be highly accurate, It is particularly useful as a bonded structure requiring durability.

  Hereinafter, the present invention will be described with reference to the drawings as necessary.

<Joint structure>
FIG. 1 is a top view of a preferred bonded structure according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA of the bonded structure of FIG.

  The joining structure according to the present invention shown in FIGS. 1 and 2 includes a first member 1, a second member 2, and an intermediate member 3 interposed between the first member 1 and the second member 2. Each of these members (that is, the first member 1, the second member 2, and the intermediate member 3) is a joined structure that is joined by the joining materials 4a and 4b, and the intermediate member 3 forms a plurality of spaces. The hole 6 is provided.

  The size and shape of the first member 1, the second member 2, and the intermediate member 3 can be appropriately determined according to the purpose of use of the bonded structure, for example.

  In the present invention, as shown in FIGS. 1 and 2, it is preferable that the first member 1 and the second member 2 have substantially the same size and the intermediate member 3 is smaller than the first member 1. The first member 2 and the second member 2 may have different sizes. In some cases, the first member 1 and the second member 2 may be smaller than the intermediate member 3.

  The number of intermediate members 3 relative to the pair of first members 1 and second members 2 and their positions are arbitrary. For example, as shown in FIG. 1, one intermediate member 3 can be provided near the center of the pair of first member 1 and second member 2, for example, the first member 1 and the second member 2. One or more intermediate members can be provided continuously or at intervals along the outer periphery.

  The first member 1 and the second member 2 are preferably made of a metal material, a ceramic material, or a glass material. The intermediate member 3 is preferably made of a metal material, a ceramic material, or a glass material. The first member 1, the second member 2 and the intermediate member 3 are preferably the same or similar in thermal expansion characteristics.

  Here, the intermediate member 3 in the preferable joint structure shown in FIGS. 1 and 2 has a hole 6 penetrating in the vertical direction of the joint interface between the first member 1 and the second member 2. In addition, although it is normal that the opening diameter by the side of the 1st member 1 and the opening diameter by the side of the 2nd member 2 are the same, the hole 6 may differ. As shown in FIG. 2, the hole 6 normally passes through the intermediate member 3, but may be opened only in either the first member 1 or the second member 2. . That is, the hole may be a non-penetrating hole that is opened only on either the first member 1 side or the second member 2 side. Further, the hole 6 may not be perpendicular to the bonding interface with the first member 1 or the second member 2 when it penetrates.

  1 and FIG. 2, the hole 6 has a straight cross section in the vertical direction of the bonding interface between the first member 1 and the second member 2 of the intermediate member 3 (ie, AA. In the cross section), the intermediate member 3 is arranged so as to break the continuity. And the opening diameter (opening length) on the linear cross section (AA cross section) of the hole 6 is the same, and the hole 6 was formed on the linear cross section (AA cross section) at equal intervals. It is.

  Note that the opening diameters (opening lengths) of the plurality of through holes present on the linear cross section (the AA cross section) may not be the same, and the intervals between the through holes may be different.

And as for the joining structure body by this invention, what has the some groove | channel which the intermediate member 3 forms space is also preferable. One or a plurality of grooves can be provided on one surface or both surfaces of the intermediate member 3 in parallel with the AA cross section of FIG. 1, at a right angle, or at an arbitrary angle. Further, the plurality of grooves may be arranged in parallel in one direction, or the grooves arranged in parallel may have two or more directions and intersect at an arbitrary angle. Preferably, the intermediate member 3 is made of an iron-based, copper-based, Ni-based or Co-based metal material, or an iron-based metal material on which a Ni or Co film is formed. This makes it easy to improve the bonding strength between the first member 1 and the second member 2.

  In the bonded structure according to the present invention, the bonding materials 4a and 4b are preferably made of an Sn-based low melting point metal material containing at least one selected from Cu, Ni, Zn, Ag, In, and Bi. . In particular, those made of a Sn-based low melting point metal material further containing at least one selected from Co, Ti, Ta, and Pd are preferable. Ag, Cu, Ni, Co content is 0.1-70 wt% each, the total amount does not exceed 80 wt%, and Co oxide content is 0.1-10 wt% Things are appropriate. Since Ag is expensive, it can be used together with Cu, Ni and Co, but the total amount is preferably 20 to 60% by weight. Although the Co oxide content is not particularly limited, sufficient interfacial reaction control can be exhibited at 1 to 5% by weight.

  The bonding material 4a on the first member 1 side and the bonding material 4b on the second member 2 side are appropriately determined in consideration of the material of the first member 1 or the second member 2 and the bonding strength and stress with the material. Can do.

  When the first member 1, the second member 2 and the intermediate member 3 are each made of a glass material, metallized layers 5a and 5b may be formed at least in contact with the bonding materials 4a and 4b of these members. preferable. As a preferable metallized layer, it is possible to exemplify a layer containing at least one of Ag, Cu, Ni and Co and a Co oxide with the balance being made of glass. As a particularly preferred metallized layer, the contents of Ag, Cu, Ni and Co are each 1 to 80% by weight, the total content thereof does not exceed 90% by weight, and the content of Co oxide is What is 1 to 50 weight% can be illustrated.

<Method of manufacturing a joined structure>
The preferable joining structure shown in FIG. 1 and FIG. 2 includes, for example, joining materials 4a and 4b disposed between the first member 1 and the intermediate member 3 and between the intermediate member 3 and the second member 2. The first member 1, the intermediate member 3, and the second member 2 can be joined by heating to a temperature equal to or higher than the melting point of the bonding material. Although it is most preferable in terms of efficiency to join the first member 1 and the intermediate member 3 and the intermediate member 3 and the second member 2 at the same time, the joining of the first member 1 and the intermediate member 3 and the intermediate The member 3 and the second member 2 can be joined separately.

  The binding materials 4a and 4b are preferably formed in advance on the first member 1, the second member 2 or the intermediate member. The binding material can be used in a ribbon shape, a linear shape, or a rod shape.

  In the case where the metallized layers 5a and 5b are provided as necessary on the bonding structure, the metallized layers 5a and 5b are formed on the first member 1 and the second member 2 before the bonding materials 4a and 4b are formed. It is preferable to do.

<Example 1>
The surface of the first member 1 made of a glass substrate having a thickness of 2 mm, a width of 40 mm, and a length of 100 mm and the second member 2 made of a glass substrate having a thickness of 2 mm, a width of 40 mm, and a length of 100 mm are respectively 10 μm thick and 5 mm wide. Base layers (metallized layers) 5a and 5b made of glass frit having a length of 35 mm were formed. Next, 50 μm thick Sn-0.7 wt% Cu-0.15 wt% Co-0.05 wt% on both sides of the 1 mm thick iron plate 2 to be the intermediate member 3 made of Fe-42 wt% Ni The clad members 4a and 4b made of Ti are clad rolled and integrated, and then punched holes having a hole diameter of 2.5 mm, a pitch of 5 mm, and an array of 45 ° are processed, and then the intermediate member 3 and the joint member having a width of 5 mm and a length of 35 mm. The conjugates 4a and 4b were prepared.

Next, as shown in FIG. 1, a combined body of the intermediate member 3 and the joining members 4a and 4b is inserted into the upper part of the first member 1 on which the base layer is formed, and the base layer (metallized layer) is placed on the upper part. After the second member 2 having the above-mentioned structure was inserted, it was joined by heating at 250 ° C. for 3 minutes in a vacuum of 10 ⁻⁵ Torr. As a result of observing internal defects in the obtained bonded structure by the X-ray flaw detection test method, the first member 1 and the bonded member 4a, the bonded member 5a and the intermediate member 3, and the intermediate member 3 on which the above-described base layer (metallized layer) is formed. In addition, void defects were not seen at the bonding interface between the bonding material 4b, the bonding material 4b, and the second member 2 on which the base layer was formed, and a sound bonding structure was obtained.

<Example 2>
The surface of the first member 1 made of a glass substrate having a thickness of 2 mm, a width of 40 mm, and a length of 100 mm and the second member 2 made of a glass substrate having a thickness of 2 mm, a width of 40 mm, and a length of 100 mm are respectively 10 μm thick and 5 mm wide. Base layers (metallized layers) 5a and 5b made of glass frit having a length of 35 mm were formed. Next, 50 μm thick Sn-3 wt% Ag-0.5 wt% Cu-0.15 wt% Co-0.05 on both sides of the 1 mm thick iron plate 2 to be the intermediate member 3 made of S45C iron plate i. After clad-rolling and integrating the weight% Ti joining members 4a and 4b, punching holes having a hole diameter of 2.5 mm, a pitch of 5 mm, and a 45 ° array were processed, and then joined to the intermediate member 3 having a width of 5 mm and a length of 35 mm. A combined body of members 4a and 4b was produced.

Next, as shown in FIG. 1, a combined body of the intermediate member 3 and the joining members 4a and 4b is inserted into the upper part of the first member 1 on which the base layer is formed, and the base layer (metallized layer) is placed on the upper part. After the second member 2 having the above-mentioned structure was inserted, it was joined by heating at 250 ° C. for 3 minutes in a vacuum of 10 ⁻⁵ Torr. As a result of observing internal defects in the obtained bonded structure by the X-ray flaw detection test method, the first member 1 and the bonded member 4a, the bonded member 5a and the intermediate member 3, and the intermediate member 3 and the bonded material 4b on which the above-mentioned base layer was formed. No void defects were found at the bonding interface between the bonding material 4b and the second member 2 on which the underlayer was formed, and a sound bonding structure was obtained.

<Example 3>
The first member 1 made of a SiN substrate having a thickness of 5 mm, a width of 40 mm, and a length of 100 mm and the surface of the second member 2 made of a glass substrate having a thickness of 2 mm, a width of 40 mm, and a length of 100 mm have a thickness of 10 μm, a width of 5 mm, respectively. Base layers (metallized layers) 5a and 5b made of glass frit having a length of 35 mm were formed.

Next, 50 μm thick Sn-3 wt% Ag-0.5 wt% Cu joining members 4a, 4b are clad rolled on both sides of the 1 mm thick iron plate 2 to be the intermediate member 3 made of S45C iron plate i, After the integration, punching holes having a hole diameter of 2.5 mm, a pitch of 5 mm, and an array of 45 ° were processed, and then a combined body of the intermediate member 3 having a width of 5 mm and a length of 35 mm and the joining members 4a and 4b was produced. Next, as shown in FIG. 1, a combined body of the intermediate member 3 and the bonding materials 4a and 4b is inserted into the upper part of the first member 1 on which the above-described base layer is formed, and the base layer (metallized layer) is placed on the upper part. After the second member 2 having the above-mentioned structure was inserted, it was joined by heating at 250 ° C. for 3 minutes in a vacuum of 10 ⁻⁵ Torr. As a result of observing internal defects in the obtained bonded structure by the X-ray flaw detection test method, the first member 1 and the bonding material 4a, the bonding material 5a and the intermediate member 3, and the intermediate member 3 and the bonding material 4b on which the above-mentioned base layer was formed. No void defects were found at the bonding interface between the bonding material 4b and the second member 2 on which the underlayer was formed, and a sound bonding structure was obtained.

Top view of a preferred bonded structure according to the invention AA cross section of the bonded structure of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st member 2 2nd member 3 Intermediate member 4a, 4b Binding material 5a, 5b Underlayer (metallized layer)
6 holes

Claims (14)

  A joined structure including a first member, a second member, and an intermediate member interposed between the first member and the second member, wherein each of these members is joined by a joining material, A joining structure, wherein the member has a plurality of holes or grooves forming a space.   The joining structure according to claim 1, wherein the first member and / or the second member are made of a metal material, a ceramic material, or a glass material.   The joining structure according to claim 1 or 2, wherein the intermediate member is made of a metal material, a ceramic material, or a glass material.   The junction structure according to any one of claims 1 to 3, wherein the intermediate member includes a plurality of members that can form the space.   The joined structure according to claim 1, wherein the intermediate member has a through hole in a direction perpendicular to a joining interface with the first member or the second member.   The said through-hole is arrange | positioned so that the continuity of the said intermediate member may be interrupted in the linear cross section of the orthogonal | vertical direction of the joining interface with the said 1st member or the said 2nd member of the said intermediate member. The joint structure according to the description.   The joined structure according to any one of claims 1 to 6, wherein the intermediate member is made of an iron-based, copper-based, Ni-based, or Co-based metal material, or an iron-based metal material on which a Ni or Co film is formed. .   The joining structure according to claim 1, wherein the joining material is made of an Sn-based low melting point metal material containing at least one selected from Cu, Ni, Zn, Ag, In, and Bi. body.   The joining structure according to claim 8, wherein the joining material is made of a Sn-based low-melting-point metal material further containing at least one selected from Co, Ti, Ta, and Pd.   The said 1st member, the said 2nd member, and the said intermediate member consist of glass materials, respectively, The metallization layer was formed in the at least contact part with the said joining material of each of these members, The any one of Claims 1-9 The joined structure according to item.   The bonded structure according to claim 10, wherein the metallized layer contains at least one of Ag, Cu, Ni, and Co and a Co oxide, and the balance is made of glass.   The metallized layer has an Ag, Cu, Ni and Co content of 1 to 80% by weight, and the total content thereof does not exceed 90% by weight, and the Co oxide content is 1 to 80% by weight. The bonded structure according to claim 11, wherein the bonded structure is 50% by weight and the balance is made of glass.   Heating the bonding material disposed between the first member and the intermediate member and between the intermediate member and the second member to a temperature equal to or higher than a melting point of the bonding material; A method for manufacturing a joined structure, comprising joining the intermediate member and the second member.   The method for manufacturing a bonded structure according to claim 13, wherein the adhesive is formed in advance on any of the first member, the second member, and the intermediate member.

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