JP2008164586A5 - - Google Patents
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- JP2008164586A5 JP2008164586A5 JP2007267308A JP2007267308A JP2008164586A5 JP 2008164586 A5 JP2008164586 A5 JP 2008164586A5 JP 2007267308 A JP2007267308 A JP 2007267308A JP 2007267308 A JP2007267308 A JP 2007267308A JP 2008164586 A5 JP2008164586 A5 JP 2008164586A5
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- JP
- Japan
- Prior art keywords
- manufacturing
- mover
- impurity ion
- sensor
- ion introduction
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Claims (9)
前記対向部材が、前記可動子に対向する対向部分、または前記対向部分に隣接する隣接部分に、不純物イオン導入部を有し、
前記不純物イオン導入部の少なくとも一部が、前記可動子と対向する面側と反対側の面に形成され、前記反対側の面から電気配線が取り出されていることを特徴とするセンサ。 A sensor that detects a relative positional relationship between a movable element and a facing member provided at a distance from the movable element,
The opposing member has an impurity ion introduction part in an opposing part facing the movable element, or an adjacent part adjacent to the opposing part,
At least a part of the impurity ion introduction part is formed on a surface opposite to the surface facing the movable element, and electrical wiring is taken out from the surface opposite to the sensor.
前記参照振動子の振動と角速度の入力によるコリオリ力が、前記検出振動子と前記参照振動子との相対位置関係の変化により検出されることを特徴とする請求項1乃至4の何れかに記載のセンサ。 The movable element constitutes a detection vibrator, the opposing member constitutes a part of a reference vibrator, the detection vibrator is supported so as to be able to vibrate with respect to the reference vibrator, and the reference vibrator is a support substrate. Supported so that it can vibrate against
5. The Coriolis force generated by inputting the vibration of the reference vibrator and the angular velocity is detected by a change in a relative positional relationship between the detection vibrator and the reference vibrator. Sensor.
半導体層と絶縁層が交互に積層された基板を用意する第1の工程と、
第1のマスクパターニングを用いた前記基板の第1の半導体層のエッチングで前記可動子を形成する第2の工程と、
第2のマスクパターニングを用いた前記基板の第2の半導体層への不純物イオン導入で前記対向部材の前記不純物イオン導入部を形成する第3の工程と、
前記第1の半導体層と前記第2の半導体層で挟まれた絶縁層のエッチングで前記可動子と前記対向部材の間に間隔を形成する第4の工程と、
前記可動子のある側と反対側の面の前記不純物イオン導入部の少なくとも一部に電気配線を形成する第5の工程と、
を含むことを特徴とする製造方法。 A manufacturing method for manufacturing the sensor according to any one of claims 1 to 5,
A first step of preparing a substrate in which semiconductor layers and insulating layers are alternately laminated;
A second step of forming the mover by etching the first semiconductor layer of the substrate using a first mask patterning;
A third step of forming the impurity ion introduction portion of the counter member by introducing impurity ions into the second semiconductor layer of the substrate using the second mask patterning;
A fourth step of forming a gap between the movable element and the opposing member by etching an insulating layer sandwiched between the first semiconductor layer and the second semiconductor layer;
A fifth step of forming an electrical wiring on at least a part of the impurity ion introduction portion on the surface opposite to the side having the mover;
The manufacturing method characterized by including.
前記第3の工程において、前記不純物イオン導入部である前記ソース領域と前記ドレイン領域を、前記可動子のある側と反対側の前記対向部材の面から熱拡散を行って不純物イオンを導入することで形成することを特徴とする請求項6に記載の製造方法。 A manufacturing method for manufacturing the sensor according to claim 4,
In the third step, impurity ions are introduced by thermally diffusing the source region and the drain region, which are the impurity ion introducing portion, from the surface of the opposing member opposite to the side where the mover is present. 7. The manufacturing method according to claim 6, wherein
前記第3の工程において、前記不純物イオン導入部である前記ソース領域と前記ドレイン領域を、前記可動子のある側と反対側の前記対向部材の面からエッチングを行って凹部を形成した後に前記凹部を形成した部分に不純物イオンを導入することで形成することを特徴とする請求項6に記載の製造方法。 A manufacturing method for manufacturing the sensor according to claim 4,
In the third step, the source region and the drain region, which are the impurity ion introduction portions, are etched from the surface of the opposing member on the side opposite to the side having the mover to form a recess, and then the recess 7. The manufacturing method according to claim 6, wherein impurity ions are introduced into a portion where the metal is formed.
前記第2の工程において、前記可動子に貫通孔を形成し、
前記第3の工程において、前記第1の工程で用意した基板の上面から見た前記貫通孔のパターンをマスクとして、前記第2の半導体層に不純物イオンを導入し、前記不純物イオン導入部である前記ソース領域と前記ドレイン領域を形成することを特徴とする請求項6に記載の製造方法。 A manufacturing method for manufacturing the sensor according to claim 4,
In the second step, a through hole is formed in the mover,
In the third step, the impurity ions are introduced into the second semiconductor layer by introducing impurity ions into the second semiconductor layer using the pattern of the through hole viewed from the top surface of the substrate prepared in the first step as a mask. 7. The manufacturing method according to claim 6, wherein the source region and the drain region are formed.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007267308A JP5376790B2 (en) | 2006-12-04 | 2007-10-15 | Sensor and manufacturing method thereof |
PCT/JP2007/073617 WO2008069284A1 (en) | 2006-12-04 | 2007-11-29 | Sensor and method of manufacturing the same |
US12/516,007 US8336381B2 (en) | 2006-12-04 | 2007-11-29 | Sensor and method of manufacturing the same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006326401 | 2006-12-04 | ||
JP2006326401 | 2006-12-04 | ||
JP2007267308A JP5376790B2 (en) | 2006-12-04 | 2007-10-15 | Sensor and manufacturing method thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008164586A JP2008164586A (en) | 2008-07-17 |
JP2008164586A5 true JP2008164586A5 (en) | 2010-12-02 |
JP5376790B2 JP5376790B2 (en) | 2013-12-25 |
Family
ID=39694275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007267308A Expired - Fee Related JP5376790B2 (en) | 2006-12-04 | 2007-10-15 | Sensor and manufacturing method thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US8336381B2 (en) |
JP (1) | JP5376790B2 (en) |
Families Citing this family (17)
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US9481912B2 (en) | 2006-09-12 | 2016-11-01 | Longhorn Vaccines And Diagnostics, Llc | Compositions and methods for detecting and identifying nucleic acid sequences in biological samples |
US11041215B2 (en) | 2007-08-24 | 2021-06-22 | Longhorn Vaccines And Diagnostics, Llc | PCR ready compositions and methods for detecting and identifying nucleic acid sequences |
US9683256B2 (en) | 2007-10-01 | 2017-06-20 | Longhorn Vaccines And Diagnostics, Llc | Biological specimen collection and transport system |
US10004799B2 (en) | 2007-08-27 | 2018-06-26 | Longhorn Vaccines And Diagnostics, Llc | Composite antigenic sequences and vaccines |
EP3058954B1 (en) | 2007-08-27 | 2017-03-01 | Longhorn Vaccines and Diagnostics, LLC | Immunogenic compositions and methods |
US11041216B2 (en) | 2007-10-01 | 2021-06-22 | Longhorn Vaccines And Diagnostics, Llc | Compositions and methods for detecting and quantifying nucleic acid sequences in blood samples |
ES2552858T3 (en) | 2007-10-01 | 2015-12-02 | Longhorn Vaccines And Diagnostics, Llc | Collection of biological samples and transport system and methods of use |
US8704314B2 (en) * | 2007-12-06 | 2014-04-22 | Massachusetts Institute Of Technology | Mechanical memory transistor |
JP5495607B2 (en) * | 2008-05-27 | 2014-05-21 | キヤノン株式会社 | Ultrasonic diagnostic equipment |
JP2010080466A (en) * | 2008-09-24 | 2010-04-08 | Fuji Electric Holdings Co Ltd | Acceleration and angular acceleration sensor |
JP2010245277A (en) * | 2009-04-06 | 2010-10-28 | Fuji Electric Holdings Co Ltd | Semiconductor sensor and method for manufacturing the same |
EP2437657B1 (en) * | 2009-06-05 | 2018-05-23 | Koninklijke Philips N.V. | Capacitive sensing system |
EP3494989A1 (en) | 2012-01-26 | 2019-06-12 | Longhorn Vaccines and Diagnostics, LLC | Composite antigenic sequences and vaccines |
US8987845B2 (en) * | 2012-11-09 | 2015-03-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for the prevention of suspended silicon structure etching during reactive ion etching |
US9976136B2 (en) | 2015-05-14 | 2018-05-22 | Longhorn Vaccines And Diagnostics, Llc | Rapid methods for the extraction of nucleic acids from biological samples |
WO2018029120A1 (en) * | 2016-08-09 | 2018-02-15 | Koninklijke Philips N.V. | Maternal monitoring transducer and operating method |
US20220252635A1 (en) * | 2021-02-05 | 2022-08-11 | Kionix, Inc. | Mechanically-sensitive semiconducting triode capacitor |
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-
2007
- 2007-10-15 JP JP2007267308A patent/JP5376790B2/en not_active Expired - Fee Related
- 2007-11-29 US US12/516,007 patent/US8336381B2/en not_active Expired - Fee Related
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