JP2008164586A5 - - Google Patents

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Publication number
JP2008164586A5
JP2008164586A5 JP2007267308A JP2007267308A JP2008164586A5 JP 2008164586 A5 JP2008164586 A5 JP 2008164586A5 JP 2007267308 A JP2007267308 A JP 2007267308A JP 2007267308 A JP2007267308 A JP 2007267308A JP 2008164586 A5 JP2008164586 A5 JP 2008164586A5
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Japan
Prior art keywords
manufacturing
mover
impurity ion
sensor
ion introduction
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JP2007267308A
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JP5376790B2 (en
JP2008164586A (en
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Priority to JP2007267308A priority Critical patent/JP5376790B2/en
Priority claimed from JP2007267308A external-priority patent/JP5376790B2/en
Priority to PCT/JP2007/073617 priority patent/WO2008069284A1/en
Priority to US12/516,007 priority patent/US8336381B2/en
Publication of JP2008164586A publication Critical patent/JP2008164586A/en
Publication of JP2008164586A5 publication Critical patent/JP2008164586A5/ja
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Publication of JP5376790B2 publication Critical patent/JP5376790B2/en
Expired - Fee Related legal-status Critical Current
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Claims (9)

可動子と、前記可動子に対して間隔を隔てて設けられた対向部材との相対位置関係を検出するセンサであって、
前記対向部材が、前記可動子に対向する対向部分、または前記対向部分に隣接する隣接部分に、不純物イオン導入部を有し、
前記不純物イオン導入部の少なくとも一部が、前記可動子と対向する面側と反対側の面に形成され、前記反対側の面から電気配線が取り出されていることを特徴とするセンサ。
A sensor that detects a relative positional relationship between a movable element and a facing member provided at a distance from the movable element,
The opposing member has an impurity ion introduction part in an opposing part facing the movable element, or an adjacent part adjacent to the opposing part,
At least a part of the impurity ion introduction part is formed on a surface opposite to the surface facing the movable element, and electrical wiring is taken out from the surface opposite to the sensor.
前記対向部材において、前記不純物イオン導入部は、その周囲と絶縁部により絶縁されていることを特徴とする請求項1に記載のセンサ。 2. The sensor according to claim 1, wherein, in the facing member, the impurity ion introduction part is insulated from its periphery by an insulating part. 前記可動子は電位を有し、前記不純物イオン導入部は、前記対向部分に形成されて前記可動子との間で静電容量を生じさせる検出電極であることを特徴とする請求項1または2に記載のセンサ。 3. The mover has a potential, and the impurity ion introduction part is a detection electrode that is formed in the facing portion and generates a capacitance between the mover and the mover. Sensor. 前記可動子は電位を有し、前記不純物イオン導入部は、前記隣接部分に形成されたソース領域とドレイン領域であり、前記ソース領域と前記ドレイン領域と前記対向部分のチャネル領域とで電界効果トランジスタ構造を形成することを特徴とする請求項1に記載のセンサ。 The mover has a potential, and the impurity ion introduction portion is a source region and a drain region formed in the adjacent portion, and a field effect transistor is formed by the source region, the drain region, and the channel region of the opposite portion. 2. The sensor according to claim 1, wherein the sensor forms a structure. 前記可動子は検出振動子を構成し、前記対向部材は参照振動子の一部を構成し、前記検出振動子は前記参照振動子に対して振動可能に支持され、前記参照振動子は支持基板に対して振動可能に支持され、
前記参照振動子の振動と角速度の入力によるコリオリ力が、前記検出振動子と前記参照振動子との相対位置関係の変化により検出されることを特徴とする請求項1乃至4の何れかに記載のセンサ。
The movable element constitutes a detection vibrator, the opposing member constitutes a part of a reference vibrator, the detection vibrator is supported so as to be able to vibrate with respect to the reference vibrator, and the reference vibrator is a support substrate. Supported so that it can vibrate against
5. The Coriolis force generated by inputting the vibration of the reference vibrator and the angular velocity is detected by a change in a relative positional relationship between the detection vibrator and the reference vibrator. Sensor.
請求項1乃至5の何れかに記載のセンサを製造する製造方法であって、
半導体層と絶縁層が交互に積層された基板を用意する第1の工程と、
第1のマスクパターニングを用いた前記基板の第1の半導体層のエッチングで前記可動子を形成する第2の工程と、
第2のマスクパターニングを用いた前記基板の第2の半導体層への不純物イオン導入で前記対向部材の前記不純物イオン導入部を形成する第3の工程と、
前記第1の半導体層と前記第2の半導体層で挟まれた絶縁層のエッチングで前記可動子と前記対向部材の間に間隔を形成する第4の工程と、
前記可動子のある側と反対側の面の前記不純物イオン導入部の少なくとも一部に電気配線を形成する第5の工程と、
を含むことを特徴とする製造方法。
A manufacturing method for manufacturing the sensor according to any one of claims 1 to 5,
A first step of preparing a substrate in which semiconductor layers and insulating layers are alternately laminated;
A second step of forming the mover by etching the first semiconductor layer of the substrate using a first mask patterning;
A third step of forming the impurity ion introduction portion of the counter member by introducing impurity ions into the second semiconductor layer of the substrate using the second mask patterning;
A fourth step of forming a gap between the movable element and the opposing member by etching an insulating layer sandwiched between the first semiconductor layer and the second semiconductor layer;
A fifth step of forming an electrical wiring on at least a part of the impurity ion introduction portion on the surface opposite to the side having the mover;
The manufacturing method characterized by including.
請求項4に記載のセンサを製造する製造方法であって、
前記第3の工程において、前記不純物イオン導入部である前記ソース領域と前記ドレイン領域を、前記可動子のある側と反対側の前記対向部材の面から熱拡散を行って不純物イオンを導入することで形成することを特徴とする請求項6に記載の製造方法。
A manufacturing method for manufacturing the sensor according to claim 4,
In the third step, impurity ions are introduced by thermally diffusing the source region and the drain region, which are the impurity ion introducing portion, from the surface of the opposing member opposite to the side where the mover is present. 7. The manufacturing method according to claim 6, wherein
請求項4に記載のセンサを製造する製造方法であって、
前記第3の工程において、前記不純物イオン導入部である前記ソース領域と前記ドレイン領域を、前記可動子のある側と反対側の前記対向部材の面からエッチングを行って凹部を形成した後に前記凹部を形成した部分に不純物イオンを導入することで形成することを特徴とする請求項6に記載の製造方法。
A manufacturing method for manufacturing the sensor according to claim 4,
In the third step, the source region and the drain region, which are the impurity ion introduction portions, are etched from the surface of the opposing member on the side opposite to the side having the mover to form a recess, and then the recess 7. The manufacturing method according to claim 6, wherein impurity ions are introduced into a portion where the metal is formed.
請求項4に記載のセンサを製造する製造方法であって、
前記第2の工程において、前記可動子に貫通孔を形成し、
前記第3の工程において、前記第1の工程で用意した基板の上面から見た前記貫通孔のパターンをマスクとして、前記第2の半導体層に不純物イオンを導入し、前記不純物イオン導入部である前記ソース領域と前記ドレイン領域を形成することを特徴とする請求項6に記載の製造方法。
A manufacturing method for manufacturing the sensor according to claim 4,
In the second step, a through hole is formed in the mover,
In the third step, the impurity ions are introduced into the second semiconductor layer by introducing impurity ions into the second semiconductor layer using the pattern of the through hole viewed from the top surface of the substrate prepared in the first step as a mask. 7. The manufacturing method according to claim 6, wherein the source region and the drain region are formed.
JP2007267308A 2006-12-04 2007-10-15 Sensor and manufacturing method thereof Expired - Fee Related JP5376790B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007267308A JP5376790B2 (en) 2006-12-04 2007-10-15 Sensor and manufacturing method thereof
PCT/JP2007/073617 WO2008069284A1 (en) 2006-12-04 2007-11-29 Sensor and method of manufacturing the same
US12/516,007 US8336381B2 (en) 2006-12-04 2007-11-29 Sensor and method of manufacturing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006326401 2006-12-04
JP2006326401 2006-12-04
JP2007267308A JP5376790B2 (en) 2006-12-04 2007-10-15 Sensor and manufacturing method thereof

Publications (3)

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JP2008164586A JP2008164586A (en) 2008-07-17
JP2008164586A5 true JP2008164586A5 (en) 2010-12-02
JP5376790B2 JP5376790B2 (en) 2013-12-25

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JP (1) JP5376790B2 (en)

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