JP2008147159A - Illuminating device, electro-optical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminating device which optimizes heat radiation structure of a flexible printed circuit substrate (FPC) and the like, enhances its insulation, and can enhance its heat radiation so as to improve reliability of a light source mounted on the FPC. <P>SOLUTION: An illuminating device constituting a liquid crystal display device has a light source, an FPC on which the light source is mounted, and a heat radiation frame which supports the FPC and includes a substrate supporting surface. The light source has a heat radiation terminal. The FPC has a multilayer structure body formed by stacking multilayer composites made of an insulating layer and a metal layer, a mount surface on which the light source is mounted via the heat radiation terminal, a supported surface which is positioned on the opposite side to the mount surface and mounted on the frame, and a metal layer which is disposed most distant from the mount surface toward the supported surface and acts as a non-conducting layer electrically insulated from the other metal layer. The metal layer as the non-conducting layer and the heat radiation terminal are connected to each other via a heat-conducting interlayer contact portion. The supported surface is mounted in close contact with the substrate supporting surface. This can improve the reliability of the light source. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an illumination device suitable for use in an electro-optical device.

  In a liquid crystal device as an example of an electro-optical device, a backlight is provided on the back side of a liquid crystal display panel in order to perform transmissive display. In general, the backlight is configured as a lighting device including a light source such as an LED (Light Emitting Diode) and a light guide plate that irradiates the back surface of the liquid crystal display panel with light from the light source as planar light. . As such a backlight method, a method called an “edge light method” in which a light source is provided on an end face of a light guide plate is the mainstream.

  Among backlights, an in-vehicle backlight is larger than a portable backlight, and high luminance is required. However, an LED used as a light source for an existing portable backlight has a small amount of light and is uneasy in terms of reliability. Therefore, it is not appropriate to use such an LED as a light source for a vehicle-mounted backlight. For this reason, a power LED (hereinafter referred to as an LED) is a power LED that can increase the input current and thereby emit a high luminance. Is used).

  However, when this input current is increased, the junction temperature in the LED rises in proportion thereto, causing a change in LED characteristics and a decrease in reliability. Therefore, in order to lower the junction temperature, it is necessary to provide the backlight with a structure for radiating the heat generated in the LED.

  Here, Patent Documents 1 to 4 describe an example of a lighting device having a heat dissipation structure. In the illumination device described in Patent Document 1, the LED light source is provided so as to be thermally conducted to a metal chassis. Thereby, the heat generated from the LED light source is dissipated by being conducted to the metal chassis, and as a result, the temperature rise of the LED light source can be suppressed, and the occurrence of thermal destruction, disconnection, etc. can be suppressed. .

  In the backlight-only LCD heat dissipation device described in Patent Document 2, the metal substrate connected to the LED is bonded to the metal storage case with a heat conductive adhesive. Thereby, the heat generated in the LED is absorbed by the metal substrate and immediately transmitted to the metal storage case, and is radiated on the surface of the metal storage case on average, so that the product does not continue to have heat.

  Further, in the liquid crystal display device described in Patent Document 3, the LED chip is bonded and fixed to the mounting metal film of the LED mounting substrate, and the metal film pattern provided on the mounting metal film and the mounting surface side has a metal through hole. And is connected to the metal film for heat dissipation on the back side. Therefore, with the lighting of the LED chip, the heat generated on the mounting surface side of the LED mounting substrate is transferred from the mounting metal film or metal film pattern to the heat radiating metal film through the metal through hole, thereby increasing the temperature of the LED chip. Can be effectively suppressed.

  Moreover, in the heat radiating device of the light source for liquid crystal display described in Patent Document 4, a plurality of light emitting diodes are mounted on a film substrate on which a wiring pattern is formed, and the back surface of the film substrate is made of a metal material through a heat conductive adhesive. In addition, the film substrate and the support frame are provided with holes communicating with each other so as to avoid the land portion at a position corresponding to each light emitting diode, and each hole has a highly heat-conductive adhesive property. Filler is filled. As a result, the heat generated by the heat from the light source chip is mainly conducted through the heat conductive adhesive filler to be conducted to the film substrate and radiated, and further, the heat conducted to the film substrate is conducted to the support frame and radiated. By doing so, it is said that the heat generated by the light source can be effectively radiated.

JP 2004-186004 A Utility Model Registration No. 3098463 JP 2005-283852 A JP 2002-162626 A

  In the illumination device described in Patent Document 1 and the backlight-only LCD heat dissipation device described in 2, a specific heat dissipation path from the LED light source serving as a heat source is not shown, and an optimal heat dissipation structure is provided. It is hard to say that it has.

  On the other hand, in the liquid crystal display device described in Patent Document 3 and the heat dissipation device of the light source for liquid crystal display described in Patent Document 4, the heat dissipation path from the LED light source is shown, but the mounting substrate, the metal housing, However, it is difficult to say that the insulation is sufficiently secured.

  In particular, in the case of the liquid crystal display device described in Patent Document 3, the heat dissipation structure on the mounting substrate or the like is complicated, and it is difficult to mass-produce it. In addition, in this liquid crystal display device, a mounting metal film and a metal film pattern for heat dissipation and a metal driving wiring for driving an LED chip are formed on one surface of the mounting substrate, and therefore heat dissipation is emphasized. When the area of the mounting metal film and the metal film pattern is increased, it is difficult to route the metal drive wiring, and there remains a problem in the conductivity. If an attempt is made to route the metal drive wiring after increasing the area of the mounting metal film and the metal film pattern, a new problem arises that the lateral width of the mounting board increases. On the other hand, if the mounting metal film and the metal film pattern are reduced in size by giving priority to the routing of the metal drive wiring, there is a problem that the heat dissipation is deteriorated.

  The present invention has been made in view of the above points, and in order to improve the reliability of the light source mounted on the flexible substrate, by optimizing the heat radiation path from the light source serving as the heat source to the metallic frame, It is an object to provide an illumination device or the like that can improve heat dissipation while enhancing insulation.

  In one aspect of the present invention, a lighting device includes a light source including a light emitting element, an electrode electrically connected to the light emitting element, and a heat dissipation terminal that is electrically non-conductive with the light emitting element. A substrate having a multilayer structure in which a plurality of insulating layers and metal layers are stacked, and the substrate includes a surface on the mounting side made of an insulating layer for mounting the light source via the electrodes and the heat dissipation terminals. A metal layer serving as a conductive layer provided between the plurality of metal layers with the insulating layer sandwiched between the light source and electrically connected to the electrode; and the metal serving as the electrode and the conductive layer. A conductive interlayer contact portion that electrically connects the layer and a non-conductive layer that is electrically non-conductive with the other metal layer provided at a position farthest from the mounting side surface among the plurality of metal layers. Metal layer as a conductive layer, the heat dissipation terminal and the non-conductive Having a heat conduction interlayer contact portion which connects the metal layer as.

  The illumination device includes a light source and a substrate. The light source radiates heat generated by the light emitting element represented by a semiconductor light emitting element such as an LED, electrodes (for example, a pair of plus and minus electrodes) electrically connected to the light emitting element, and the like. And a heat radiating terminal that is electrically non-conductive with the light emitting element. It is preferable that the heat radiating terminal is formed of a metal material having high heat radiating properties. The substrate is, for example, a flexible wiring substrate, and has a multilayer structure in which a plurality of insulating layers and metal layers are stacked.

  In particular, the substrate is provided with a surface on the mounting side made of an insulating layer for mounting the light source via the electrode and the heat radiating terminal, and a plurality of metal layers sandwiching the insulating layer with respect to the light source, From the surface on the mounting side among a plurality of metal layers, a metal layer as a conductive layer that is electrically connected, a conductive interlayer contact portion that electrically connects an electrode and a metal layer as a conductive layer A metal layer as a non-conductive layer which is provided at the most distant position and is electrically non-conductive with another metal layer, and a heat conductive interlayer contact portion for connecting the heat radiating terminal and the metal layer as a non-conductive layer And having.

  As a result, a drive current supplied from a power supply unit (not shown) can be supplied to the electrode of the light source through the conduction path including the metal layer as the conduction layer of the substrate and the interlayer contact portion for conduction, and the light emitting element emits light. be able to. The heat generated by the light emitting element of the light source is dissipated through the heat dissipation path including the heat dissipation terminals, the heat conduction interlayer contact portions, and the metal layer as the nonconductive layer. Can be made. Furthermore, in this lighting device, the layer corresponding to the mounting side surface on which the light source is mounted is formed of an insulating layer, and the above-described heat dissipation path is a path separate from the conduction path and is electrically Since it functions as a non-conducting portion and a non-conducting layer that do not have such characteristics, it is possible to improve heat dissipation efficiency while maintaining insulation.

  Therefore, it is possible to prevent an increase in the junction temperature of the light source, and it is possible to prevent a change in characteristics of the light source and a decrease in reliability.

  In one aspect of the above lighting device, the lighting device includes a frame having a substrate support surface that supports the substrate formed of a heat-dissipating material, and the surface of the substrate on the mounting side is provided. The surface to be attached, which is located on the opposite side and attached to the substrate support surface, is attached in close contact with the substrate support surface of the frame.

  Thus, the heat generated by the light emitting element of the light source emits heat via a heat dissipation path including the heat dissipation terminal, the heat conduction interlayer contact portion, the metal layer as the non-conductive layer, and the substrate support surface of the frame. To dissipate heat to the outside (in the atmosphere). In addition, since the mounting surface of the substrate is mounted in close contact with the substrate support surface of the frame, at this time, the heat transferred to the layer corresponding to the mounting surface of the substrate reduces the heat dissipation efficiency. Without being transmitted to the frame.

  In one aspect of the illumination device, in order to efficiently transfer heat from the light source, a thermally conductive adhesive material having thermal conductivity and adhesiveness between the mounted surface and the substrate support surface. For example, it is preferable that a heat conductive adhesive tape is interposed.

  In a preferred example, the thermal conduction interlayer contact portion is provided so that the metal layer as the non-conductive layer enters, and the conductive interlayer contact portion is surface-mounted on the metal layer as the conductive layer. (For example, it is preferable to connect using SMT; Surface Mounting Technology).

  In another aspect of the illumination device, in the light source, a surface area of the heat radiating terminal is larger than each surface area of the electrode. Thereby, heat dissipation can be improved.

  In another aspect of the above lighting device, the metal layer as the non-conductive layer may be a plurality of the insulating layers with respect to a formation surface of the insulating layer on which the metal layer as the non-conductive layer is formed. It is formed substantially on the entire surface. Thereby, the area of the said metal layer as the said non-conduction layer can be enlarged, and heat dissipation can be improved.

  In another aspect of the lighting device described above, the lighting device is formed of an insulating material, and has another frame that fits the frame. The frame is formed of a metal material, and is one end of the substrate support surface. The electrode has a bent surface that bends from the side, the electrode is disposed on the other frame side, and the heat radiating terminal is disposed on the bent surface side of the frame.

  As a result, when the electrode of the light source and the conductive layer of the substrate are electrically connected to each other by using a surface mounting technology, for example, a bonding metal such as solder, the bonding metal seems to protrude greatly from the bonding portion to the surroundings. Even in such a case, the joining metal will not protrude from the conductive frame side formed of a metal material but to the other frame side having insulation, and it will not contact the conductive frame. Absent. Therefore, it is possible to prevent a short circuit from occurring between the light source and the substrate and the frame having conductivity.

  On the other hand, when the heat radiation terminal of the light source and the metal layer as the non-conductive layer of the substrate are electrically connected using a surface mount technology, for example, a bonding metal such as solder, the bonding metal is bonded. If the metal protrudes from the outside, the bonding metal protrudes not to the other insulating frame but to the conductive frame made of a metal material. The terminal and the frame having conductivity are only thermally connected through the bonding metal, and are not electrically connected. Therefore, it is possible to prevent a short circuit from occurring between the light source and the conductive frame.

  In another aspect of the illumination device, the substrate has a bent portion disposed at a position facing the bent surface, and the attached surface of the bent portion of the substrate is in close contact with the bent surface. It is attached in a state. As a result, the contact area between the metal layer as the non-conductive layer of the substrate and the frame via the thermally conductive adhesive substance or directly with the frame can be increased, and the heat dissipation efficiency can be increased. Can be increased.

  In another aspect of the illumination device described above, the layer corresponding to the attached surface is preferably the metal layer as the non-conductive layer. Thereby, heat dissipation efficiency can be further improved while ensuring insulation.

  In another aspect of the lighting device, the heat dissipation terminal, the heat conduction interlayer contact portion, and a heat dissipation portion including a heat dissipation path constituted by the metal layer as the non-conductive layer, the electrode, And a conduction part including a conduction path constituted by the metal layer as the conduction layer, and the heat dissipation part and the conduction part include at least a plurality of the insulating layers. It is insulated through one said insulating layer.

That is, according to this aspect, in addition to the conducting portion for causing the light source to emit light, the dedicated heat radiating portion for radiating the heat generated by the light source emitting light is provided, and the heat radiating portion and Since the conduction portion is insulated through at least one of the plurality of insulating layers, it is possible to improve heat dissipation while maintaining insulation.
In the illumination device, the substrate is a flexible substrate having flexibility.

  In another aspect of the present invention, an electro-optical device including a display panel that displays an image and the illumination device that illuminates the display panel can be configured.

  In still another aspect of the invention, an electronic apparatus including the electro-optical device as a display unit can be configured.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the present invention is applied to a liquid crystal device as an example of an electro-optical device.

[Configuration of liquid crystal device]
FIG. 1 is a cross-sectional view illustrating a configuration of a liquid crystal device 100 having the illumination device according to the present embodiment. The liquid crystal device 100 includes a liquid crystal display panel 10 and an illumination device 30 that illuminates the liquid crystal display panel 10.

(Configuration of LCD panel)
The configuration of the liquid crystal display panel 10 is as follows.

  The liquid crystal display panel 10 includes a first substrate 1 made of a light-transmitting material such as glass or quartz, and a second substrate 2 made of the same material as the first substrate 1, and a frame-shaped sealing material. 3 and the liquid crystal layer 4 is sandwiched between the two substrates. In addition, the liquid crystal display panel 10 includes, for example, a black matrix, a color filter, electrodes, and many other constituent elements formed in a matrix (lattice) or stripe (line), but is not illustrated in FIG. is doing. In the present invention, the liquid crystal display panel 10 is not limited to a specific configuration, and can adopt various known configurations.

(Configuration of lighting device)
The configuration of the illumination device 30 is as follows.

  The illumination device 30 mainly includes a light source 18, a flexible substrate 19 on which the light source 18 is mounted, a light guide plate 13, a plurality of optical sheets, other elements, a first frame 11 that supports these elements, and a first frame. And a second frame 21 fitted to one frame 11.

  Here, the plurality of optical sheets include a reflection sheet 12, a diffusion sheet 14, a first prism sheet 15, a second prism sheet 16, a polarization reflection transflective sheet 17, and the like. In addition, the other elements include a heat conductive adhesive tape 20 as an example of a heat conductive adhesive substance having heat conductivity and adhesiveness.

  The first frame 11 has a box-like shape, is excellent in heat dissipation, and is formed of a metal material having high thermal conductivity such as aluminum. The reflection sheet 12, the light guide plate 13, the diffusion sheet 14, The prism sheet 15, the second prism sheet 16, and the polarization reflection transflective sheet 17 are accommodated in a stacked state in this order. The second frame 21 has a lid shape, is formed of an insulating material such as plastic, and is fitted to the first frame 11. A flexible printed circuit (FPC) 19 is a flexible printed circuit board on which a light source 18 is mounted. In order to cause the light source 18 to emit light, a driving current supplied from a power supply unit (not shown) is used as the light source. 18 and the function of radiating the heat generated by the light source 18. The flexible substrate 19 is a position facing the one end surface 13 c of the light guide plate 13, and one of the four inner side surfaces (not shown) of the first frame 11 is attached to one inner side surface 11 a via the heat conductive adhesive tape 20. Installed in close contact. Thereby, the inner side surface 11 a of the first frame 11 plays a role of supporting the flexible substrate 19. Therefore, hereinafter, the “inner surface 11a” of the first frame 11 is referred to as “substrate support surface 11a”.

  The light source 18 emits light when a driving current is supplied through a power supply unit (not shown) and the flexible substrate 19. The emitted light L enters the light guide plate 13 through one end surface (hereinafter referred to as “light incident end surface”) 13 c of the light guide plate 13.

  The light guide plate 13 is made of a transparent resin such as an acrylic resin and has a rectangular planar shape. The light guide plate 13 has a role of uniformly irradiating the liquid crystal display panel 10 opposed to the light guide plate 13 with the light L emitted from the light source 18 in the plane of the liquid crystal display panel 10. The light L incident on the inside of the light guide plate 13 from the light incident end surface 13 c is repeatedly reflected on the reflection surface 13 b and the light exit surface 13 a of the light guide plate 13. When the angle between the light exit surface 13a and the light L exceeds the critical angle, the light L passes through the light exit surface 13a and exits to the diffusion sheet 14 side. At this time, a part of the light L is also emitted to the reflective sheet 12 side through the reflective surface 13b, but a part of the light L is guided by the reflective sheet 12 disposed on the reflective surface 13b side of the light guide plate 13. It returns to the inside of the optical plate 13.

  The diffusion sheet 14 has a role of diffusing the light L from the light guide plate 13 and making the luminance of the light of the display screen in the liquid crystal display panel 10 more uniform. The first prism sheet 15 and the second prism sheet 16 are optical elements used to focus the light L emitted from the diffusion sheet 14 in a specific direction. For example, the arrangement directions of the prism shapes are orthogonal to each other. To be arranged. Accordingly, these prism sheets have a role of increasing the intensity by converging the light traveling toward the liquid crystal display panel 10. The polarization reflection transflective sheet 17 is, for example, DBEF-D (registered trademark of 3M Co.), and has a function of transmitting a P wave and reflecting an S wave among components of incident light.

  Under the above configuration, the light L emitted from the light source 18 passes through the light guide plate 13, the diffusion sheet 14, the first prism sheet 15, the second prism sheet 16, the polarization reflection transflective sheet 17, and the liquid crystal display panel 13. It passes through in this order. At this time, alignment control of the liquid crystal layer 4 is performed, and a desired display image is visually recognized by an observer.

(Light source mounting structure on flexible substrate)
Next, the mounting structure of the light source 18 on the flexible substrate 19 will be described with reference to FIG.

  First, a detailed configuration of the light source 18 will be described with reference to FIG. 2A is a plan view showing a mounting structure of the light source 18 on the flexible substrate 19 when the light source 18 side is viewed from the light guide plate 13 side in FIG.

  The light source 18 includes a semiconductor light emitting element 18a typified by an LED (Light Emitting Diode), a pair of positive electrodes (anodes) 18b and a negative electrode electrically connected to the semiconductor light emitting element 18a through respective conductors (wires) 18d. (Cathode) 18c and a semiconductor light emitting element 18a are mounted, and has a function of radiating heat generated when the semiconductor light emitting element 18a emits light, and a plurality of heat radiating elements that are electrically non-conductive with the semiconductor light emitting element 18a A terminal 18e and a housing 18f covering at least the semiconductor light emitting element 18a are provided. Note that the semiconductor light emitting element 18a, each conductive wire 18d, a part of each of the pair of plus electrode 18b and the minus electrode 18c, and a part of each of the heat radiating terminals 18e are, for example, resin-molded in the housing 18f. Is preferred.

  Here, the semiconductor light emitting element 18a is preferably a thin top view type power LED. Each of the heat radiating terminals 18e is preferably formed of a metal material having high thermal conductivity. Furthermore, in order to further enhance the heat dissipation effect by each heat radiating terminal 18e, it is desirable to increase the surface area of each heat radiating terminal 18e as much as possible. Therefore, the surface area of each heat radiating terminal 18e has a pair of positive electrodes 18b and It is desirable that each surface area of the negative electrode 18c be larger.

  Next, a basic layer structure of the flexible substrate 19 will be described with reference to FIG. FIG. 2B is a cross-sectional view showing a basic layer structure of the flexible substrate 19 taken along a cutting line A-A ′ in FIG.

  The flexible substrate 19 has a multilayer structure in which a plurality of layer structures including an insulating layer and a metal layer are stacked. Specifically, the flexible substrate 19 has a two-layer structure in which a first layer structure 90 and a second layer structure 91 are stacked. Here, the first layer structure 90 and the second layer structure 91 are joined together by an insulating adhesive layer 19x that functions as an insulating layer.

  The first layer structure 90 has a first metal layer 19b and a first insulating layer 19a laminated on one surface of the first metal layer 19b with an adhesive (not shown). Configured. The first insulating layer 19a is formed of an insulating material such as polyimide resin. One surface of the first insulating layer 19a is a mounting surface 19aa for mounting the light source 18 via the pair of positive electrodes 18b and negative electrodes 18c and the respective heat radiation terminals 18e. The first metal layer 19b is formed of a metal material such as copper having high thermal conductivity and electrical conductivity. The first metal layer 19b is provided across the first insulating layer 19a with respect to the light source 18, is electrically connected to the pair of plus electrode 18b and minus electrode 18c, and is supplied from a power supply unit (not shown). It has a function as a conductive layer that conducts current to the light source 18.

  On the other hand, the second layer structure 91 includes a second insulating layer 19d, a second metal layer 19c laminated on one surface of the second insulating layer 19d with an adhesive (not shown), It is comprised. The second metal layer 19c is formed of the same material as that of the first metal layer 19b. The second metal layer 19c is a second insulating layer to be described later from the mounting surface 19aa of the flexible substrate 19 among the plurality of metal layers of the first metal layer 19b and the second metal layer 19c in the flexible substrate 19. It is provided at a position farthest away from the attached surface 19da of 19d. The second metal layer 19c functions as a non-conductive layer that is electrically non-conductive with other metal layers, and also functions as a heat radiating portion for transferring heat generated by the light source 18 to the first frame 11 side. . Here, the “non-conductive layer” means a layer that does not have a function as a wiring for conducting current. The second insulating layer 19d is formed of the same material as that of the first insulating layer 19a. The other surface of the second insulating layer 19 d is a mounting surface 19 da that is attached to the substrate support surface 11 a of the first frame 11 via the heat conductive adhesive tape 20.

  Next, a characteristic configuration of the flexible substrate 19 and a characteristic mounting structure of the light source 18 on the flexible substrate 19 will be described.

  First, with reference to FIG.2 (c), the thermal radiation path | route for conducting the heat which generate | occur | produces with the light source 18 to the flexible substrate 19 side is demonstrated. FIG. 2C is a cross-sectional view taken along the cutting line BB ′ of FIG. 2A, and particularly shows a heat dissipation path for conducting heat generated by the light source 18 to the flexible substrate 19 side. It is sectional drawing.

  The flexible substrate 19 is located at a position corresponding to each heat radiation terminal 18e of the light source 18, and at a position penetrating the first insulating layer 19a, the first metal layer 19b, and the adhesive layer 19x. An interlayer contact portion (heat conduction through hole) 19h is further provided.

  A part of the second metal layer 19c is formed so as to penetrate into each heat conduction interlayer contact portion 19h, and the second metal layer 19c and each heat radiation terminal 18e of the light source 18 are provided for each heat conduction. They are connected through the interlayer contact portion 19h. The second metal layer 19c and each heat radiation terminal 18e of the light source 18 are electrically connected by a bonding metal such as solder using surface mounting technology (for example, SMT). In addition, a part of the first insulating layer 19a is inserted between each heat conduction interlayer contact portion 19h and the first metal layer 19b, and the second contact in each heat conduction interlayer contact portion 19h. The metal layer 19c and the first metal layer 19b are separated and insulated by the first insulating layer 19a. With this structure, in the present embodiment, the heat generated when the light source 18 emits light, as shown in the direction of the arrow Y1 in FIG. 2 (c), passes through each heat radiating terminal 18e and the first metal layer of the flexible substrate 19. 19c. For this reason, the first metal layer 19c functions as a heat conductive layer. Therefore, the flexible substrate 19 has a “heat dissipating part” including a heat dissipating path constituted by each heat dissipating terminal 18e of the light source 18, each heat conducting interlayer contact part 19h, and the second metal layer 19c.

  Next, with reference to FIG. 2D, a conduction path for conducting a drive current supplied from a power supply unit (not shown) to the light source 18 side through the flexible substrate 19 will be described. FIG. 2D is a cross-sectional view taken along the cutting line CC ′ of FIG. 2A. In particular, a drive current supplied from a power supply unit (not shown) is conducted to the light source 18 side through the flexible substrate 19. It is sectional drawing which shows the conduction | electrical_connection path | route for.

  The flexible substrate 19 is located at a position corresponding to the pair of positive electrodes 18b and the negative electrode 18c of the light source 18 and through the first insulating layer 19a. Hall) 19t is further provided. In addition, the first metal layer 19b includes a first conductive layer 19ba for electrical connection with the positive electrode 18b of the light source 18 and a second conductive layer for electrical connection with the negative electrode 18c of the light source 18. A layer 19bb.

  A part of the first conductive layer 19ba and a part of the second conductive layer 19bb are formed so as to penetrate into the corresponding conductive interlayer contact portions 19t. Therefore, the first conductive layer 19ba and the positive electrode 18b of the light source 18 are electrically connected through the corresponding conductive interlayer contact portion 19t, and the second conductive layer 19bb and the negative electrode 18c of the light source 18 are connected. Are electrically connected through the corresponding interlayer contact portions 19t for conduction. It should be noted that surface mounting technology is used for electrical connection between the first conductive layer 19ba and the positive electrode 18b of the light source 18, and electrical connection between the second conductive layer 19bb and the negative electrode 18c of the light source 18. Is preferably used. With this structure, in this embodiment, a pair of positive electrode 18b and negative electrode 18c of the light source 18 are supplied with a driving current supplied from a power supply unit (not shown) through the pair of first conductive layer 19ba and second conductive layer 19bb. The light source 18 can emit light. Therefore, the flexible substrate 19 includes a pair of first conductive layer 19ba and second conductive layer 19bb, a pair of conductive interlayer contact portions 19t, and a pair of positive electrode 18b and negative electrode 18c of the light source 18. It has a “conduction part” including a conduction path.

(Principles of heat dissipation by lighting equipment)
Next, with reference to FIG. 3A, a heat radiation principle by the lighting device 30 according to the present embodiment will be described. FIG. 3A is a cross-sectional view of a main part corresponding to FIG. 2C including the heat conductive adhesive tape 20 and the first frame 11.

  In the illuminating device 30, the light source 18 emits light when a driving current is supplied from a power supply unit (not shown) to the semiconductor light emitting element 18 a of the light source 18 through the above-described conduction unit. Along with this, the light source 18 generates heat with the passage of time. The heat generated in the light source 18 is, as indicated by the arrow Y1 in FIG. 3A, each heat dissipation terminal 18e, each heat conduction interlayer contact portion 19h, and the second metal layer 19c of the light source 18. Is transmitted to the second insulating layer 19d of the flexible substrate 19 via the heat dissipating section constituted by the heat conductive adhesive tape 20 and the first frame as indicated by an arrow Y2 in FIG. The heat is radiated to the outside via 11.

  Next, a specific operation and effect of the lighting device 30 having the mounting structure of the light source 18 on the flexible substrate 19 according to the present embodiment compared to the comparative example will be described.

  Here, assuming an illumination device (comparative example) having a light source mounting structure on a flexible substrate, which simply has a multilayer structure in which a plurality of layer structures each including an insulating layer and a metal layer are stacked, It has the following problems.

  In the comparative example having such a configuration, heat generated by the light source passes through each layer of the flexible substrate and escapes to the metal frame side. However, since there are a plurality of layers that block heat, that is, insulating layers, the heat dissipation is improved if the insulating layers are omitted as much as possible. However, in order to cause the light source to emit light, it is necessary to provide the conductive layer as described above on the flexible substrate, and for that purpose, it is also necessary to improve insulation. If it does so, in the comparative example which has such a structure, there exists a subject that heat dissipation and insulation have a trade-off relationship, and it is difficult to make them compatible.

  In this regard, in the present embodiment, the lighting device 30 includes the semiconductor light emitting element 18a, a pair of the plus electrode 18b and the minus electrode 18c that are electrically connected to the semiconductor light emitting element 18a, and the semiconductor light emitting element 18a that is not electrically connected. A light source 18 including a plurality of conductive heat dissipating terminals 18e; a first layer structure 90 including a first insulating layer 19a and a first metal layer 19b; a second insulating layer 19d; A flexible substrate 19 having a two-layer structure in which a second layer structure 91 including two metal layers 19c is laminated. The flexible substrate 19 includes a pair of a positive electrode 18b, a negative electrode 18c, and a plurality of layers. A mounting surface 19aa on the mounting side made of an insulating layer for mounting the light source 18 via the heat radiating terminal 18e and a plurality of metal layers are provided with the first insulating layer 19a sandwiched between the light source 18 and the mounting surface 19aa. A metal layer as a conductive layer electrically connected to each of the pair of positive electrode 18b and negative electrode 18c, and a pair of first metal layers as elements of the first metal layer 19b as the conductive layer. A conductive interlayer contact 19t that electrically connects the conductive layer 19ba and the second conductive layer 19bb and a plurality of metal layers provided at a position farthest from the mounting surface 19aa, and other metal layers A second metal layer 19c as an electrically non-conductive layer; and heat conduction interlayer contact portions 19h connecting the plurality of heat radiation terminals 18e and the second metal layer 19c. Is done.

  As a result, the drive current supplied from the power supply unit (not shown) is supplied to the light source by the conduction path including the pair of first conductive layer 19ba and second conductive layer 19bb of the flexible substrate 19 and the conductive interlayer contact portion 19t. 18 can be supplied to the pair of plus electrode 18b and minus electrode 18c, and the semiconductor light emitting element 18a can emit light. In addition, heat generated by the light emitting semiconductor light emitting element 18a of the light source 18 is used as a heat dissipation path including each heat dissipation terminal 18e, each heat conduction interlayer contact portion 19h, and the second metal layer 19c as a non-conductive layer. It is possible to dissipate heat by going through.

  Further, in the lighting device 30, the first insulating layer 19a corresponding to the mounting surface 19aa on which the light source 18 is mounted is an insulating layer, and the above-described heat dissipation path is a path separate from the conduction path. And since it functions as a non-conducting part and a non-conducting layer that do not have electrical characteristics, it is possible to improve heat dissipation efficiency while maintaining insulation.

  Therefore, it is possible to prevent the junction temperature of the light source 18 from increasing, and it is possible to prevent changes in the characteristics of the light source 18 and a decrease in reliability.

  Further, in this embodiment, the lighting device 30 includes the first frame 11 having the substrate support surface 11a that supports the flexible substrate 19 formed of a material having heat dissipation, and the mounting surface 19aa of the flexible substrate 19 is provided on the mounting surface 19aa. The attached surface 19da of the second insulating layer 19d, which is located on the opposite side and attached to the substrate support surface 11a, is in close contact with the substrate support surface 11a of the first frame 11 via the heat conductive adhesive tape 20. It is attached in a state.

  As a result, the heat generated by the light emission of the semiconductor light emitting element 18a of the light source 18 is caused by the heat radiating terminals 18e, the heat conductive interlayer contact portions 19h, the second metal layer 19c as the non-conductive layer, and the first Heat is radiated to the outside (in the atmosphere) via a heat dissipation path including the substrate support surface 11a of the frame 11. In addition, since the attached surface 19da of the second insulating layer 19d of the flexible substrate 19 is attached in close contact with the substrate support surface 11a of the first frame 11 via the heat conductive adhesive tape 20, this At this time, the heat transferred to the second insulating layer 19d is transferred to the first frame 11 via the heat conductive adhesive tape 20 without reducing the heat radiation efficiency.

  The second metal layer 19c also functions as a heat dissipation layer in addition to the function as a non-conducting layer. Therefore, in order to further increase the heat dissipation efficiency, it is preferable to increase the surface area of the second metal layer 19c as much as possible. For this purpose, the second metal layer 19c is formed on one surface of the second insulating layer 19d. (Formation surface) It is preferable that the surface is substantially solid with respect to 19 db.

  The lighting device 30 includes a heat dissipation portion including a heat dissipation path constituted by each heat dissipation terminal 18e of the light source 18, each heat conduction interlayer contact portion 19h, and the second metal layer 19c as a non-conductive layer; A conduction part including a conduction path constituted by a pair of plus electrode 18b and minus electrode 18c of the light source 18, a pair of conduction interlayer contact parts 19t, and a pair of first conductive layer 19ba and second conduction layer 19bb; The heat radiating portion and the conducting portion are insulated through the first insulating layer 19a, the insulating adhesive layer 19x, and the like.

  In other words, according to this configuration, the light source 18 shown in FIGS. 2 (c) and 3 (a) emits light separately from the conductive portion shown in FIG. 2 (d) for causing the light source 18 to emit light. In order to dissipate the heat generated, the above-described dedicated heat dissipating part is provided, and the heat dissipating part and the drive part include the first insulating layer 19a, the insulating adhesive layer 19x, etc. Therefore, it is possible to improve heat dissipation while maintaining insulation.

  In addition, the lighting device 30 includes a second frame 21 that is formed of an insulating material and is fitted to the first frame 11, and the first frame 11 is guided from one end side of the substrate support surface 11a. A pair of positive electrodes 18b and negative electrodes 18c of the light source 18 has a bent surface (bottom surface of the first frame 11) 11b that bends toward the optical plate 13, and the second frame 21 side as shown in a broken line area A1 in FIG. In addition, each heat radiating terminal 18e of the light source 18 is arranged on the bent surface 11b side of the first frame 11 as shown by a broken line area A2 in FIG.

  As a result, the pair of positive electrode 18b and negative electrode 18c of the light source 18 and the pair of first conductive layer 19ba and second conductive layer 19bb of the flexible substrate 19 are each bonded to a surface mounting technique, for example, a bonding metal such as solder. Even when the bonding metal protrudes greatly from the bonded portion to the surroundings when electrically connected, the bonding metal protrudes not to the first frame 21 side but to the second frame 21 side. Therefore, it does not come into contact with the conductive first frame 11 formed of a metal material. Therefore, it is possible to prevent a short circuit from occurring between the light source 18 and the flexible substrate 19 and the conductive first frame 11.

  On the other hand, when each heat radiation terminal 18e of the light source 18 and the second metal layer 19c of the flexible substrate 19 are electrically connected using a surface mounting technology, for example, a bonding metal such as solder, the bonding metal is In the case where the joint portion protrudes outward from the joint portion, the joint metal protrudes not to the second frame 21 side but to the first frame 11 side having conductivity and formed from a metal material. The heat radiating terminals 18e and the first frame 11 are merely thermally connected through the bonding metal, and are not electrically connected. Therefore, it is possible to prevent a short circuit from occurring between the light source 18 and the conductive first frame 11.

[Modification 1]
In the above embodiment, in the flexible substrate 19, the adhesive layer 19x having an insulating property is provided between the first metal layer 19b and the second metal layer 19c, but in the present invention, the adhesive layer 19x is provided on the adhesive layer 19x. Instead, an insulating layer such as the first insulating layer 19a or the second insulating layer 19d may be provided between the first metal layer 19b and the second metal layer 19c.

[Modification 2]
Moreover, in this invention, it is not essential to provide the heat conductive adhesive tape 20 with respect to the illuminating device 30. FIG. Therefore, in the present invention, as shown in FIG. 3B, the mounted surface 19da of the second insulating layer 19d is directly attached in close contact with the substrate support surface 11a of the first frame 11. It doesn't matter.

[Modification 3]
In the present invention, the flexible substrate 19 may be configured such that the second insulating layer 19d is not provided on the other surface of the second metal layer 19c functioning as a non-conductive layer. In other words, in the present invention, as shown in FIG. 4A, in the flexible substrate 19, the other surface (attached surface) 19 ca of the second metal layer 19 c passes through the heat conductive adhesive tape 20 to the first frame 11. You may comprise so that it may attach in the state closely_contact | adhered to the board | substrate support surface 11a.

[Modification 4]
Further, in the present invention, it is not essential to provide the lighting device 30 with the heat conductive adhesive tape 20 and the second insulating layer 19d of the flexible substrate 19, respectively. That is, in the present invention, as shown in FIG. 4B, the other surface (attached surface) 19ca of the second metal layer 19c is in direct contact with the substrate support surface 11a of the first frame 11. You may comprise so that it may be attached in a state. As a result, the heat dissipation efficiency can be further enhanced by the amount that the second insulating layer 19d is not provided while ensuring insulation.

  In such a configuration, a rust-preventing protective film (not shown) may be applied to prevent rust from being generated on the other surface (attached surface) 19ca of the second metal layer 19c. I do not care. Since the second metal layer 19c functions as a non-conducting layer, it is not necessary to consider its insulating properties, and the thickness of the protective film to be formed can be reduced.

[Modification 5]
Further, in the above embodiment, the flexible substrate 19 has a two-layer structure in which the first layer structure 90 and the second layer structure 91 are laminated. Then, the flexible substrate 19 may have a multilayer structure in which a plurality of layer structures are stacked.

  As an example, FIG. 5 shows a cross-sectional configuration of a flexible substrate according to Modification 5 having a three-layer structure in which three layer structures are stacked.

  Here, with reference to FIG. 5A, a basic layer structure of the flexible substrate 19z according to the modified example 5 will be described. In the following, the same elements as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted. FIG. 5A is a cross-sectional view showing a basic layer structure of a flexible substrate 19z according to Modification 5 corresponding to FIG.

  The flexible substrate 19z has a three-layer structure in which a first layer structure 90x, a second layer structure 91x, and a third layer structure 92x are stacked, and has another insulating layer 19i.

  The first layer structure 90x includes a first metal layer 19b and a first insulating layer 19a laminated on one surface of the first metal layer 19b with an adhesive (not shown). Configured.

  The second layer structure 91x has a second metal layer 19f and a second insulating layer 19e laminated on one surface of the second metal layer 19f with an adhesive (not shown). Configured. The second metal layer 19f is formed of the same material as that of the first metal layer 19b, and the second insulating layer 19e is formed of the same material as that of the first insulating layer 19a. .

  The third layer structure 92x includes a third metal layer 19k and a third insulating layer 19g laminated on one surface of the third metal layer 19k with an adhesive (not shown). Configured. The third metal layer 19k is formed of the same material as that of the first metal layer 19b, and the third insulating layer 19g is formed of the same material as that of the first insulating layer 19a. . The third metal layer 19k functions as a heat radiating part for transferring heat generated by the light source 18 to the first frame 11 side, and is electrically non-conductive with the semiconductor light emitting element 18a.

  The other insulating layer 19i is provided on the other surface side of the third metal layer 19k. The other surface of the other insulating layer 19 i is a mounted surface 19 ia that is attached to the substrate support surface 11 a of the first frame 11 via the heat conductive adhesive tape 20. In the present invention, it is not essential to provide the insulating layer 19i on the other surface of the third metal layer 19k.

  Next, with reference to FIG.5 (b), the structure of the thermal radiation part of the flexible substrate 19z which concerns on the modification 5 is described easily.

  In the flexible substrate 19z according to Modification 5, among the plurality of metal layers, the third metal layer provided on the other surface from the mounting surface 19aa at the most distant position toward the mounting surface 19ia of the insulating layer 19i. 19 k functions as a non-conducting layer having no electrical characteristics, and the third metal layer 19 k and each heat radiation terminal 18 e are connected through a plurality of heat conduction interlayer contact portions 19 h provided on the flexible substrate 19. Has been. The portion of the third metal layer 19k provided in each thermal conduction interlayer contact portion 19h, the first metal layer 19b, and the second metal layer 19f are the first insulating layer 19a and the second metal layer 19f. The insulating layer 19e and the third insulating layer 19g are insulated. Although not shown, the mounting surface 19 ia of the insulating layer 19 i of the flexible substrate 19 located on the opposite side of the mounting surface 19 aa is supported on the substrate of the first frame 11 via the heat conductive adhesive tape 20. Attached in close contact with the surface 11a.

  Thereby, the heat generated when the light source 18 emits light is transmitted to each heat radiation terminal 18e of the light source 18 as shown by an arrow Y1 in FIG. 5B, and subsequently, each heat conduction interlayer contact portion. 19h and the third metal layer 19h, then to the other insulating layer 19i, subsequently to the first frame 11 through the heat conductive adhesive tape 20, and finally to the outside through the first frame 11. The heat is dissipated. In addition, the attached surface 19ia of the insulating layer 19i is attached in close contact with the substrate support surface 11a of the first frame 11 via the heat conductive adhesive tape 20, and at this time, it is transmitted to the insulating layer 19i. The generated heat is transmitted to the first frame 11 through the heat conductive adhesive tape 20 without lowering the heat radiation efficiency. Further, each heat radiation terminal 18e, each heat conduction interlayer contact portion 19h and the third metal layer 19k constituting the heat radiation portion function as a non-conductive portion and a non-conductive layer having no electrical characteristics. Heat insulation efficiency can be improved while maintaining insulation.

  Therefore, it is possible to prevent the junction temperature of the light source 18 from increasing, and it is possible to prevent changes in the characteristics of the light source 18 and a decrease in reliability.

  Next, with reference to FIG.5 (c), the structure of the conduction | electrical_connection part of the flexible substrate 19z which concerns on a modification is described easily.

  The flexible substrate 19z according to the modified example 5 is a position corresponding to the pair of the positive electrode 18b and the negative electrode 18c of the light source 18, and the first insulating layer 19a, the first metal layer 19b, and the second metal. A pair of conductive interlayer contact portions 19t are further provided at positions penetrating the layer 19f and the second insulating layer 19e. The first metal layer 19b is provided with the first insulating layer 19a interposed between the light source 18 and the first conductive layer 19ba for electrically connecting to the plus electrode 18b of the light source 18, and the light source And a second conductive layer 19bb for electrical connection with the 18 negative electrodes 18c, and the second metal layer 19f is connected to the light source 18 by the first insulating layer 19a and the second insulating layer. A first conductive layer 19fa provided between 19e and electrically connected to the plus electrode 18b of the light source 18, and a second conductive layer 19fb electrically connected to the minus electrode 18c of the light source 18. Have. The positive electrode 18b of the light source 18, the first conductive layer 19ba, and the first conductive layer 19fa are electrically connected through the corresponding conductive interlayer contact portion 19t, and the negative electrode 18c of the light source 18 The second conductive layer 19bb and the second conductive layer 19fb are electrically connected through the corresponding conductive interlayer contact portion 19t.

  With this structure, in the fifth modification, a driving current supplied from a power supply unit (not shown) is used as a pair of first conductive layer 19ba and second conductive layer 19bb, or a pair of first conductive layer 19fa and second. Through the conductive layer 19fb, the light source 18 can be supplied to the pair of the positive electrode 18b and the negative electrode 18c of the light source 18, and the light source 18 can emit light.

  Moreover, in the modification 5, the thermal radiation part containing the thermal radiation path comprised by each thermal radiation terminal 18e of the light source 18, each thermal contact interlayer contact part 19h, and the 3rd metal layer 19k as a non-conduction layer, and a light source A pair of positive electrodes 18b and a negative electrode 18c, a pair of conductive interlayer contacts 19t, a pair of first conductive layers 19ba and a second conductive layer 19bb, and a pair of first conductive layers 19fa and a second A conduction portion including a conduction path constituted by the conductive layer 19fb, and the heat dissipation portion and the conduction portion are connected through the first insulating layer 19a, the second insulating layer 19e, the third insulating layer 19g, and the like. Insulated.

  That is, according to this configuration, heat generated by light emission from the light source 18 shown in FIG. 5B, separately from the conductive portion for causing the light source 18 to emit light, shown in FIG. 5C. The above-described dedicated heat dissipating part is provided to dissipate heat, and the heat dissipating part and the driving part are passed through the first insulating layer 19a, the second insulating layer 19e, the third insulating layer 19g, and the like. Since it is insulated, heat dissipation can be improved while maintaining insulation.

[Modification 6]
In the above embodiment, each heat radiating terminal 18e of the light source 18 and the second metal layer 19c of the flexible substrate 19 are connected through one heat conduction interlayer contact portion 19h. In the present invention, as shown in FIG. 6A, each of the heat dissipation terminals 18e of the light source 18 and the second metal layer 19c of the flexible substrate 19 are each provided with a plurality of heat conduction interlayer contact portions 19h. You may be connected through.

[Modification 7]
In the present invention, the flexible substrate 19 is bent toward the light guide plate 13, and the second metal layer 19 c as a non-conductive layer in the flexible substrate 19 and the first frame 11 are directly or indirectly contacted. You may comprise so that heat dissipation efficiency may be improved more by increasing an area.

  For example, in the modified example 7, as shown in FIG. 6B, the first frame 11 has a recess 11ba formed on a bent surface 11b that is bent from the substrate support surface 11a to the light guide plate 13 side. The flexible substrate 19 has the same basic configuration as that of the above-described embodiment, and further includes a bent portion 19y disposed at a position facing the bottom surface (bending surface) 11b of the first frame 11. The attached surface 19ya of the bent portion 19y is attached in close contact with the bent surface 11b of the recess 11ba of the first frame 11 via the heat conductive adhesive tape 20. Thereby, compared with above-mentioned embodiment, the contact area via the heat conductive adhesive tape 20 with the 2nd metal layer 19c of the flexible substrate 19 and the 1st flame | frame 11 can be increased, and more heat dissipation efficiency. Can be increased.

  In the modified example 7, the concave portion 11ba is provided in the bent surface 11b of the first frame 11 located in the vicinity of the substrate support surface 11a. However, in the present invention, the bent surface 11b of the first frame 11 is provided. It is not essential to provide the recess 11ba.

[Other variations]
In the above embodiment and the like, the light source 18 is provided with two heat radiating terminals 18e. However, the present invention is not limited to this, and in the present invention, only one or three or more heat radiating terminals 18e are provided. It doesn't matter.

  In the present invention, the heat conduction interlayer contact portion 19h may be filled with metal or resin. Here, it is desirable that the metal and resin to be poured are materials having better thermal conductivity than other layers (insulating layer or the like) through which the thermal conductive interlayer contact portion 19h passes. Thereby, in the above-described embodiment or modification 5, heat can be quickly transferred to the second metal layer 19c or the third metal layer 19k as the non-conductive layer.

Moreover, in said embodiment, although the flexible substrate 19 was attached in the state closely_contact | adhered to the board | substrate support surface 11a of the 1st flame | frame 11 via the heat conductive adhesive tape 20, it is not restricted to this, In this invention, The flexible substrate 19 may be attached in close contact with the substrate support surface 11a of the first frame 11 by various known methods. For example, a fixing portion (not shown, for example, a sandwiching structure) for fixing the outer peripheral portion of the flexible substrate 19 is provided so as to be in close contact with the substrate support surface 11a of the first frame 11, and the flexible substrate 19 is passed through the fixing portion. May be attached in close contact with the substrate support surface 11 a of the first frame 11.
In the above embodiment and the modification, the flexible substrate having flexibility has been described as an example of the substrate on which the light source of the lighting device is mounted. However, in addition to the flexible substrate, a rigid substrate having no flexibility is used. Can adopt the same configuration.

[Electronics]
Next, a specific example of an electronic apparatus including the liquid crystal device 100 according to the above-described embodiment will be described with reference to FIG.

  First, an example in which the liquid crystal device 100 according to the present embodiment is applied to a display unit of a portable personal computer (so-called notebook personal computer) will be described. FIG. 7A is a perspective view showing the configuration of this personal computer. As shown in the figure, a personal computer 710 includes a main body 712 having a keyboard 711 and a display 713 to which the liquid crystal device 100 according to the present invention is applied.

  Next, an example in which the liquid crystal device 100 according to the present embodiment is applied to a display unit of a mobile phone will be described. FIG. 7B is a perspective view showing the configuration of the mobile phone. As shown in the figure, a cellular phone 720 includes a plurality of operation buttons 721, a receiving port 722, a transmitting port 723, and a display unit 724 to which the liquid crystal device 100 according to the present invention is applied.

  In addition to the personal computer shown in FIG. 7A and the mobile phone shown in FIG. 7B, electronic devices to which the liquid crystal device 100 according to this embodiment can be applied include a liquid crystal television and a viewfinder. Type / monitor direct-view type video tape recorder, car navigation device, pager, electronic notebook, calculator, word processor, workstation, videophone, POS terminal, digital still camera, etc.

Sectional drawing which shows the structure of the liquid crystal device which has an illuminating device which concerns on embodiment of this invention. The top view and various sectional drawings which show the mounting structure of the light source in the flexible substrate of the illuminating device which concerns on this embodiment. Sectional drawing which shows the thermal radiation structure of the illuminating device which concerns on various embodiment of this invention. Sectional drawing which shows the thermal radiation structure of the illuminating device which concerns on various embodiment of this invention. Sectional drawing which shows the mounting structure of the light source in the flexible substrate of the illuminating device which concerns on the modification 5. FIG. The top view and sectional drawing which show the mounting structure of the light source in the flexible substrate of the illuminating device which concerns on the modifications 6 and 7. FIG. An example of an electronic device including a liquid crystal device including a lighting device according to an embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display panel, 11 ... Frame, 11a ... Substrate support surface, 18 ... Light source, 18a ... Semiconductor light emitting element, 18b ... Positive electrode, 18c ... Negative electrode, 18e ... Radiation terminal, 19 ... Flexible substrate, 19a ... DESCRIPTION OF SYMBOLS 1 insulating layer, 19b ... 1st metal layer, 19c ... 2nd metal layer, 19d ... 2nd insulating layer, 19h ... Interlayer contact part for heat conduction, 19t ... Interlayer contact part for conduction, 20 ... Thermal conduction Adhesive tape, 30 ... lighting device, 90 ... first layer structure, 91 ... second layer structure, 100 ... liquid crystal device.

Claims (9)

A light source comprising: a light emitting element; an electrode electrically connected to the light emitting element; and a heat dissipating terminal electrically non-conductive with the light emitting element.
A substrate having a multilayer structure in which a plurality of insulating layers and metal layers are laminated,
The substrate is
A mounting side surface comprising an insulating layer for mounting the light source via the electrode and the heat radiating terminal;
Among the plurality of metal layers, the metal layer is provided as a conductive layer that is provided with the insulating layer interposed between the light source and electrically connected to the electrode, and the metal layer as the conductive layer. A conductive interlayer contact portion for electrically connecting
Among the plurality of metal layers, a metal layer serving as a non-conductive layer that is provided at a position farthest from the surface on the mounting side and is electrically non-conductive with the other metal layers, the heat radiating terminal, and the non-conductive layer An illuminating device comprising: a heat conduction interlayer contact portion connecting the metal layer as a conductive layer. The lighting device includes a frame having a substrate support surface that supports the substrate formed of a material having heat dissipation properties,
The mounting surface of the substrate, which is located on the opposite side to the mounting surface and is attached to the substrate support surface, is attached in close contact with the substrate support surface of the frame. The lighting device according to claim 1.   The lighting device according to claim 2, wherein a thermally conductive adhesive material having thermal conductivity and adhesiveness is interposed between the mounted surface and the substrate support surface.   4. The lighting device according to claim 1, wherein a surface area of the heat radiation terminal is larger than each surface area of the electrode. 5. It is formed of an insulating material and has another frame that fits with the frame.
The frame is formed of a metal material, and has a bent surface that bends from one end side of the substrate support surface,
5. The electrode according to claim 2, wherein the electrode is disposed on the other frame side, and the heat dissipation terminal is disposed on the bent surface side of the frame. Lighting device. A heat dissipating part including a heat dissipating path composed of the heat dissipating terminal, the heat conducting interlayer contact part, and the metal layer as the non-conductive layer;
A conductive portion including a conductive path constituted by the electrode, the conductive interlayer contact portion, and the metal layer as the conductive layer;
The lighting device according to claim 1, wherein the heat radiating portion and the conductive portion are insulated through at least one of the plurality of insulating layers.   The lighting device according to any one of claims 1 to 6, wherein the substrate is a flexible substrate having flexibility. A display panel;
An electro-optical device comprising: the illumination device according to claim 1 that illuminates the display panel.   An electronic apparatus comprising the electro-optical device according to claim 8 as a display unit.

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