JP2008141131A - Wafer transport case - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer transport case which can be sealed up with simple means without occupying a large volume. <P>SOLUTION: The wafer transport case 10, which covers a plurality of stacked units wherein wafers 1 are mounted on ring-like wafer housing vessels 12, respectively, includes: a disk-like placement table 22 for mounting the wafer housing vessel 12; a cover body 24 which comprises a dome part 35 having a dome-like shape and a collar part 37 extending from an opening end of the dome part 35 toward the outside of the circumference direction, to be placed on the placement table 22 so as to cover the entire wafer housing vessel 12; a ring-like gasket 28 arranged on the placement table 22; and a fixing member 26 for gripping the collar part 37 and an outer peripheral part 22b of the placement table 22 to fix them. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wafer transport case for storing and transporting wafers.

  In recent years, with the expansion of demand for electronic equipment, demand for semiconductor wafers has also increased. Therefore, a wafer transport case for transporting a large amount of wafers in a safe state is required. As a conventional wafer transport case, a wafer is separately stored in a plurality of U-shaped grooves formed in a case body, and the wafer is transported or stored in this state (for example, patents). Reference 1).

JP-A-6-56185 (FIGS. 1 to 3)

  However, in the case of the wafer transport case disclosed in Patent Document 1, since a U-shaped opening for inserting a wafer has to be formed, the case body is compared with the volume for accommodating a circular wafer. A large volume is required. As a result, there is a problem that the case body is enlarged and the wafer transport case is enlarged accordingly. Further, in the wafer transport case disclosed in Patent Document 1, the locking wing-like member provided on the case lid is fitted to the protrusion provided on the case body to seal the wafer transport case. Therefore, a complicated mechanism is required to seal the wafer transport case.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a wafer transport case that does not occupy a large volume and can be sealed by an easy means.

  In order to solve the above problems, the present invention provides a wafer transport case that covers a plurality of units in which a wafer is placed on a ring-shaped wafer storage container in a stacked state, and is a disk-like shape for mounting the wafer storage container. And a dome portion having a dome-like shape, and a flange portion extending outward in the circumferential direction from the opening end of the dome portion, and the entire wafer storage container on the placement table A lid that is disposed so as to cover the ring, a ring-shaped gasket that is disposed on the mounting table, and a fixing member that clamps the outer periphery of the mounting unit and the mounting table and fixes them together. is there.

  When configured in this way, the wafer storage container can be stored inside the wafer transport case by an easy method of mounting the wafer storage container storing the wafer on the mounting table and covering the lid. . Furthermore, since the lid has a dome shape, the lid can be shaped according to the size of the wafer storage container. As a result, the volume occupied by the lid can be minimized. Accordingly, the wafer transport case can be made compact. Further, since the mounting table is provided with a gasket, the wafer transport case can be hermetically sealed by covering the lid. Therefore, the wafer transport case can be sealed with an easy means such as covering the lid. In addition, the lid can be fixed to the mounting table by an easy method of covering the mounting table with a lid and attaching a fixing member from the outside. Therefore, the wafer storage container can be easily stored.

  In another invention, in addition to the above-described invention, at least one of the mounting table and the lid is made of polycarbonate, cycloolefin polymer, polystyrene, ABS resin, methacrylic resin or AS resin.

  When configured in this way, the transparency and impact resistance of the wafer transport case are improved. Moreover, it is possible to impart antistatic properties by blending carbon fiber, conductive resin, or the like with these resins.

  Furthermore, in another invention, in addition to the above-described invention, the wafer storage container further has a convex portion protruding upward, and the mounting table has an engaging portion for engaging with the convex portion of the wafer storage container. It is provided.

  When configured in this way, the wafer storage container can be positioned with respect to the wafer transport case. Further, it is possible to prevent the wafer storage container from rattling or being displaced within the wafer transport case.

  In addition to the above-mentioned invention, in another invention, a mark for indicating the directionality of the wafer stored in the wafer storage container is provided in the vicinity of the outer peripheral portion of the mounting table.

  When configured in this manner, the wafer storage container can be taken out of the wafer transport case while giving a certain direction to the wafer.

  Furthermore, in another invention, in addition to the above-described invention, a filter for removing dust and dust is disposed on the mounting table.

  In such a configuration, contaminants such as dust and dust can be prevented from entering the wafer transport case, and as a result, the wafer can be prevented from being contaminated.

  According to the present invention, it is possible to provide a wafer transport case that can be sealed by an easy means without occupying a large volume.

  Hereinafter, a wafer transport case 10 according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a configuration of a wafer storage container 12 stored in a wafer transport case 10 according to an embodiment of the present invention. In the following description, the arrow Z1 direction shown in FIGS. 1 to 3 and 5 is defined as the upper direction and the arrow Z2 direction is defined as the lower direction, respectively.

  Before the wafer 1 is transported in the wafer transport case 10, the wafer 1 is stored in the wafer storage container 12. As shown in FIG. 1, the wafer storage container 12 has a substantially ring shape on a plane. In addition, the wafer storage container 12 has a ring-shaped circumferential portion 14 provided on the outer peripheral side thereof, and a mounting portion 16 provided on the inner side of the circumferential portion 14. For example, when the outer diameter of the wafer 1 is 450 mm, the outer dimension in the radial direction of the wafer storage container 12 is preferably in the range of 500 to 550 mm. Correspondingly, it can be changed appropriately.

  The circumferential portion 14 has a form in which the unevenness is alternately repeated four times along the circumferential direction on the ring-shaped flat plate. Specifically, the circumferential portion 14 includes a substantially arc-shaped convex portion 18 that protrudes upward and a substantially arc-shaped concave portion 20 that is recessed downward. The radial length of the circumferential portion 12 is preferably in the range of 20 to 30 mm, but is not limited to this range.

  As shown in FIG. 1, when the wafer storage container 12 is transported by the wafer transport case 10, a plurality of wafer storage containers 12 are stacked in a state where the wafer 1 is placed on the placement unit 16. The wafer storage container 12 is stacked on another wafer storage container 12 such that the convex portions 18 and the concave portions 20 are aligned with each other. In a state where the wafer storage containers 12 are stacked, the convex portions 18 and the concave portions 20 of the wafer storage containers 12 are in contact with each other, so that the wafer storage containers 12 are not displaced or rattled.

  FIG. 2 is an exploded perspective view of the wafer transport case 10.

  As shown in FIG. 2, the wafer transport case 10 includes a mounting table 22 on which the wafer storage container 12 storing the wafer 1 is mounted, a lid body 24 placed thereon, a mounting table 22 and a lid body 24. Are mainly composed of a fixing member 26 for fixing the wafer storage container 12, a gasket 28, and a pressing member 30 for pressing the wafer storage container 12 from above.

  The mounting table 22 has a disk shape. Further, from the vicinity of the outer peripheral portion of the mounting table 22, a circumferential protruding portion 32 is provided that protrudes upward in a circumferential shape. By this circumferential protrusion 32, the mounting table 22 is divided into a mounting portion 22a and an outer peripheral portion 22b. The placement portion 22a is a portion on which the stacked wafer storage containers 12 are placed. The outer peripheral part 22b is a part which overlaps with the collar part 37 in the cover body 24 mentioned later. The mounting table 22 is made of a resin such as polycarbonate (PC), cycloolefin polymer (COP), polystyrene (PS), ABS resin, methacryl (PMMA) resin, or AS resin. However, the present invention is not limited to these resins, and other resins having transparency, impact resistance or charge resistance may be employed.

  The lid body 24 includes a dome-shaped dome portion 35 including a circular disk portion 33 and a cylindrical peripheral wall portion 34 extending downward from the outer edge thereof, and an entire circumference from the opening end of the dome portion 35. And an eaves portion 37 extending outward. A hollow space 39 is formed inside the dome 35 (see FIG. 4A). The lid 24 is made of a resin such as PC, COP, PS, ABS resin, PMMA resin, or AS resin. However, the present invention is not limited to these resins, and other resins having transparency, impact resistance or charge resistance may be employed.

  The fixing member 26 is an arcuate member having a substantially U-shaped cross section having two leg portions 26a, 26a. Further, the fixing member 26 has an arc-shaped groove portion 26b along the circumferential direction on the inner side thereof. The fixing member 26 is attached in such a manner that the flange portion 37 and the outer peripheral portion 22b are fitted into the groove portion 26 from the outside in a state where the mounting base 22 is covered with the lid body 24. In the present embodiment, a total of four fixing members 26 are used. However, the number of fixing members 26 is not limited to four. The gasket 28 has a ring shape and is disposed outside the circumferential protrusion 32 in the mounting table 22. The gasket 28 is a member for providing airtightness when the mounting table 22 is covered with the lid 24. Examples of the material of the gasket 28 include silicone rubber, fluororubber, or thermoplastic elastomer.

  The pressing member 30 is a member having a ring shape that is substantially the same diameter as the wafer storage container 12. The holding member 30 is disposed between the wafer storage container 12 and the lid body 24. By disposing the pressing member 30 between the wafer storage container 12 and the lid body 24, it is possible to prevent the wafer storage container 12 stored in the wafer transport case 10 from rattling or displacement. As a material of the pressing member 30, polyethylene (PE) resin, thermoplastic elastomer (TPE), polyphenylene sulfide (PPS) resin, PC, polybutylene terephthalate (PBT), polyether ether ketone (PEEK), polyether sulfone ( Engineering plastics such as PES) or polyetherimide (PEI). However, the material of the pressing member 30 is not limited to these materials. Among these materials, it is preferable to use PE resin, TPE or PBT as the material of the pressing member 30.

  Next, the assembly process of the wafer transport case 10 will be described.

  FIG. 3 is a view for explaining a process for storing the wafer storage container 12 in the wafer transport case 10 and shows a state in which the wafer storage container 12 is mounted on the mounting table 22. FIG. 4 is a view for explaining a process for storing the wafer storage container 12 in the wafer transport case 10, and (A) is a view showing a state in which the pressing member 30 is attached to the lid 24. FIG. 4B is a perspective view of the wafer transport case 10 after the wafer storage container 12 is stored.

  First, as shown in FIG. 3, the gasket 28 is attached to the outside of the circumferential protrusion 32 in the mounting table 22. Then, the stacked wafer storage containers 12 are placed on the placement portion 22a. Next, as shown in FIGS. 3 and 4A, the pressing member 30 is attached to the back side of the disc portion 33 in the lid 24. Since the outer diameter of the pressing member 30 and the inner diameter of the peripheral wall portion 34 are substantially the same size, the pressing member 30 can be fixed inside the lid body 24 by fitting the pressing member 30 into the space portion 39. it can. Next, the lid body 24 to which the pressing member 30 is attached is placed on the mounting table 22 on which the wafer storage container 12 is mounted. At this time, the lid body 24 is arranged on the mounting table 22 so that the inner peripheral surface of the peripheral wall portion 34 is outside the gasket 28. In this state, the inner peripheral surface of the peripheral wall portion 34 and the outer peripheral surface of the gasket 28 are in close contact with each other, so that the space portion 39 is sealed by the mounting table 22 and the lid body 24. Further, in a state where the lid body 24 is disposed on the mounting table 22, the pressing member 30 comes into contact with both the disk portion 33 of the lid body 24 and the wafer storage container 12. Therefore, the wafer storage container 12 is pressed downward by the pressing member 30. In addition, in the state where the mounting table 22 is covered with the lid 24, the flange portion 37 and the outer peripheral portion 22b overlap each other. Next, a total of four fixing members 26 are attached to the outside of the overlapping flange portion 37 and outer peripheral portion 22b. Then, as shown in FIG. 4B, the wafer storage container 12 is stored inside the wafer transport case 10. The four fixing members 26 are preferably attached at equal intervals along the circumferential direction. The fixing member 26 is attached in such a manner that the flange portion 37 and the outer peripheral portion 22b that overlap the groove portion 26b are fitted. Then, the flange portion 37 and the outer peripheral portion 22b are held between the leg portions 26a and 26a, and the lid body 24 is fixed to the mounting table 22.

  FIG. 5 is a view for explaining a state in which the wafer storage container 12 is stored in the wafer transport case 10, and FIG. 5A is an overall view in a state in which a part of the lid 24 and the pressing member 30 is cut. , (B) is an enlarged view of a portion surrounded by an alternate long and short dash line A in (A).

  As shown in FIG. 5A, the lid 24 is fixed to the mounting table 22 by attaching the fixing member 26. The pressing member 30 is disposed so as to be interposed between the wafer storage container 12 and the disk portion 33. In a state where the lid body 24 is fixed to the mounting table 22, the pressing member 30 receives a downward pressure from the disk portion 33. The pressing member 30 presses the wafer storage container 12 using the pressure. As shown in FIG. 5B, the pressing member 30 has a ring shape and a flat plate-like peripheral plate portion 40, and extends substantially vertically downward from the outer periphery of the peripheral plate portion 40 over the entire circumference. An outer peripheral portion 42, an upper peripheral portion 44 extending substantially obliquely upward from the inner periphery to the entire circumference of the peripheral plate portion 40, and an inner side from the inner periphery to the entire periphery of the peripheral plate portion 40. It is comprised from the lower peripheral part 46 extended toward diagonally downward.

  As shown in FIG. 5B, the pressing member 30 is disposed so as to cover the circumferential portion 14 of the wafer storage container 12 that is disposed at the uppermost position in the stacked wafer storage containers 12. In the state where the pressing portion 30 is disposed, the pressing portion 30 is in contact with the convex portion 18. Specifically, the outer peripheral portion 42 and the lower peripheral portion 46 in the pressing portion 30 are in contact with the convex portion 18. The pressing portion 30 is also in contact with the inner side surface 33 a of the disc portion 33. Specifically, the upper peripheral portion 44 and the top portion 48 where the peripheral plate portion 40 and the outer peripheral portion 42 intersect with each other are in contact with the inner side surface 33a. When the pressing member 30 receives pressure downward from the disk portion 33, the upper peripheral portion 44 bends downward and the top portion 48 receives the force. A force is transmitted to the lower peripheral portion 46 as the upper peripheral portion 44 bends. And the lower peripheral part 46 presses the convex part 18 in the contact by the force transmitted from the upper peripheral part 44. The force received by the top portion 48 is transmitted to the outer peripheral portion 42, and the outer peripheral portion 42 presses the convex portion 18 at the contact point. That is, the pressing member 30 presses the convex portion 18 from both the outer peripheral side and the inner peripheral side by the outer peripheral portion 42 and the lower peripheral portion 46. Therefore, the wafer storage container 12 is not rattled or displaced.

  In the wafer transport case 10 configured as described above, the wafer storage container 12 is transported by a simple method such as placing the wafer storage container 12 storing the wafer 1 on the mounting table 22 and covering the lid 24. It can be stored inside the case 10. Furthermore, since the lid 24 has a dome shape, the lid 24 can be shaped according to the size of the wafer storage container 12. As a result, the volume occupied by the lid 24 can be minimized. Accordingly, the wafer transport case 10 can be made compact. Further, since the gasket 28 is disposed on the mounting table 22, the wafer transport case 10 can be hermetically sealed with the cover 24 covered. Therefore, the wafer transport case 10 can be sealed with an easy means such as covering the lid 24. In addition, the lid 24 can be fixed to the mounting table 22 by an easy method of covering the mounting table 22 with the lid 24 and attaching the fixing member 26 from the outside. Therefore, the wafer storage container 12 can be easily stored.

  In the wafer transport case 10, a pressing member 30 is disposed between the wafer storage container 12 and the lid body 24. Therefore, it is possible to prevent the wafer storage container 12 from rattling or being displaced. Further, the pressing member 30 is configured such that a force is transmitted to the lower peripheral portion 46 when the upper peripheral portion 44 is bent. Therefore, the wafer storage container 12 can be elastically held, and the wafer storage container 12 can be held with an appropriate force. The pressing member 30 holds the wafer storage container 12 by pressing it from both the outer peripheral side and the inner peripheral side with the outer peripheral part 42 and the lower peripheral part 46. Therefore, it is possible to more effectively prevent the wafer storage container 12 from rattling or displacement. In addition, by using a resin such as PE resin or TPE as the material of the pressing member 30, it is possible to impart elasticity to the pressing member 30.

  The mounting table 22 and the lid 24 in the wafer transport case 10 are made of a resin such as PC, COP, PS, ABS resin, PMMA resin, or AS resin. For this reason, the transparency and impact resistance of the wafer transport case 10 are improved. Moreover, it is possible to impart antistatic properties by blending carbon fiber, conductive resin, or the like with these resins.

  In the wafer transport case 10, the number of wafers 1 stored in the wafer transport case 10 (the number of stacked wafer storage containers 12) is changed by adjusting the height of the dome portion 35 of the lid 24. It can be adapted to the case. Specifically, if a plurality of types of lids 24 having different heights are prepared in advance, it is possible to easily adapt to changes in the number of wafers 1. For example, as shown in FIGS. 6A and 6B, when the number of wafer storage containers 12 to be stacked is small, the height of the dome portion 35 of the lid body 24 is reduced, so that the wafer storage container 12 is appropriately Can be stored.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and can be implemented in various modifications.

  In the embodiment described above, the wafer transport case 10 is not provided with a filter, but as shown in FIGS. 7A and 7B, a circular circular hole 50 is formed in the approximate center of the mounting table 22. A circular filter 51 may be attached to the circular hole 50. As the filter 51, an anion filter, a cation filter, an activated carbon filter, or the like can be adopted in addition to a general high-performance air filter, but the filter 51 is not limited to these types of filters. By disposing the filter 51, contaminants such as dust and dust can be prevented from entering the wafer transport case 10. As a result, the wafer 1 can be prevented from being contaminated by contaminants. Further, the shape of the filter 51 is not limited to a circular shape, and may be another shape. Further, the attachment position of the filter 51 is not limited to the approximate center of the mounting table 22, and may be another position in the wafer transport case 10.

  In the above-described embodiment, the mounting table 22 is not provided with a rib serving as an engaging portion. However, as shown in FIG. 8, in the vicinity of the outer periphery of the mounting portion 22 a, You may make it provide the rib 53 corresponding to the space part 55 formed in the back side of the convex part 18. FIG. With such a configuration, the rib 53 is fitted into the space 55 formed on the back side of the convex portion 18, and the wafer storage container 12 can be positioned with respect to the mounting table 22. Further, it is possible to prevent backlash and positional deviation of the wafer storage container 12. Further, the number of ribs 53 is not limited to one, and may be provided within a range of 2 or more and 4 or less so as to correspond to the convex portion 18.

  Further, in the above-described embodiment, the mounting table 22 is not provided with a notch serving as a mark for indicating the directionality of the wafer 1, but as shown in FIG. 8, a notch 56 is provided in the outer peripheral portion 22a. You may do it. With such a configuration, the wafer storage container 12 can be stored while giving a certain direction to the wafer 1. Therefore, even when the wafer storage container 12 is taken out from the wafer transport case 10 by an apparatus or the like, the wafer 1 can be taken out with directionality, and the working efficiency is improved. Further, as a mark, a tab may be provided or printed instead of the notch 56.

  Further, in the above-described embodiment, the lid 24 is not provided with means for fixing the pressing member 30, but as shown in FIG. You may make it provide the engaging means 58 extended in a substantially L shape toward the downward direction in the part along a direction. By adopting such a configuration, the upper peripheral portion 44 is engaged with the engaging means 58, and the fixing member 26 can be reliably fixed to the lid body 24.

  In the above-described embodiment, both the mounting table 22 and the lid body 24 are made of a resin such as PC, COP, PS, ABS resin, PMMA resin, or AS resin. Any one of the above may be made of a resin other than the above resin.

  The wafer transport container of the present invention can be used in industries that manufacture or use transport cases for transporting wafers.

It is a perspective view which shows the structure of the wafer storage container accommodated in the wafer transport case which concerns on one embodiment of this invention. It is a disassembled perspective view of the wafer transport case which concerns on one embodiment of this invention. It is a figure for demonstrating the process for accommodating a wafer storage container in a wafer transport case, and is a figure which shows the state which mounted the wafer storage container on the mounting base. It is a figure for demonstrating the process for accommodating a wafer storage container in a wafer transport case, (A) is a figure which shows the state which attached the pressing member to the cover body, (B) is a wafer storage container. It is a perspective view of the wafer transportation case after storing. It is a figure for demonstrating the state which accommodated the wafer storage container in the wafer transport case, (A) is a whole figure of the state which cut | disconnected a cover body and a part of pressing member, (B) is (A) It is an enlarged view of the part enclosed with the dashed-dotted line A in FIG. It is a figure for demonstrating the structure of the wafer transport case at the time of changing the number of the wafers accommodated, (A) is a figure which shows the state before accommodation, (B) is the state after accommodation. FIG. It is a figure which shows the modification of this invention, and is a figure which shows the structure of the wafer transport case at the time of providing a filter in the mounting base. It is a figure which shows the modification of this invention, and is a figure which shows the structure of the wafer transport case at the time of providing a rib and a notch in a mounting base. It is a figure which shows the modification of this invention, and is a figure for demonstrating the structure of the wafer transport case at the time of providing an engaging means in a cover body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wafer 10 ... Wafer transport case 12 ... Wafer storage container 18 ... Convex part 20 ... Concave part 22 ... Mounting stand 24 ... Lid body 26 ... Fixing member 28 ... Gasket 30 ... Holding member 35 ... Dome part 37 ... Gutter part 51 ... Filter 53 ... Rib (engagement part)
56 ... Notch

Claims (5)

A wafer transport case that covers a plurality of units in which a wafer is placed in a ring-shaped wafer storage container,
A disk-shaped mounting table for mounting the wafer storage container;
A dome portion having a dome shape and a flange portion extending outward in the circumferential direction from the opening end of the dome portion so as to cover the entire wafer storage container on the mounting table. A lid disposed on the
A ring-shaped gasket disposed on the mounting table;
A fixing member that holds both the flange and the outer peripheral portion of the mounting table to fix both;
A wafer transport case comprising:   2. The wafer transport case according to claim 1, wherein at least one of the mounting table and the lid is made of polycarbonate, cycloolefin polymer, polystyrene, ABS resin, methacrylic resin, or AS resin.   The said wafer storage container has a convex part which protrudes upwards, The engagement part for engaging with the said convex part of the said wafer storage container was provided in the said mounting base. 2. The wafer transport case according to 2.   4. The mark according to claim 1, wherein a mark for indicating the directionality of the wafer stored in the wafer storage container is provided near the outer periphery of the mounting table. 5. Wafer transport case.   5. The wafer transport case according to claim 1, wherein a filter for removing dust and dust is disposed on the mounting table.

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