JP2008124807A - Speaker equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide speaker equipment, equipped with a support having an installation structure for speaker equipment wiring which allows the speaker equipment to be surely installed on a body, without causing the sensitivity to be lowered. <P>SOLUTION: The speaker equipment comprises the speaker equipment wiring (cables), a magnetic circuit, and a frame (support) for supporting these components. The frame includes an installation face for installing the magnetic circuit and a cable securing portion for securing the cables. The cable-securing portion is formed on the opposite face of the installation face in the frame. According to this structure, when the speaker equipment is installed on the body, by setting the speaker equipment in a speaker installation hole, the cables can be secured in the cable-securing portion so that the cables and the cable-securing portion don't use extra space at the position of the speaker installation hole. For this reason, the magnitude of the magnetic circuit in the radial direction can be made as large as possible, which prevents deterioration of the sensitivity of the speaker equipment. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring structure for a speaker device.

  Generally, a speaker is provided with a speaker terminal electrically connected to a voice coil and a speaker device wiring (speaker cable) for electrically connecting an amplifier. Usually, this speaker cable is fixed to a frame that supports a magnetic circuit or the like, and is drawn out from the speaker terminal side (see, for example, Patent Document 1).

  Patent Document 2 discloses a structure of a magnetic circuit for improving speaker output sound pressure. Specifically, in this speaker, a groove is provided on the outer circumference of the plate constituting the magnetic circuit on the magnet side. This prevents the adhesive used for bonding the plate and the magnet from sticking out of the magnetic gap when bonding, eliminates the plate wrinkles that were previously used to prevent the adhesive from sticking, and is restricted by wrinkles. The diameter of the magnet was increased, and the output sound pressure of the speaker was improved.

JP 2002-142284 A JP 2003-78991 A

  The above-described speaker is suitably used for in-vehicle use. Here, the vehicle-mounted speaker is attached to the attached portion in a state of being fitted into a speaker attachment hole provided in the attached portion such as a vehicle door inner panel or a rear tray. The size of the speaker mounting hole is determined by the type of vehicle. For this reason, when the speaker according to Patent Document 1 described above is used for in-vehicle use, the following problems may occur.

  That is, in the speaker cable mounting structure according to Patent Document 1 described above, the speaker cable is routed along the side surface of the frame, and is further fixed to the side surface of the frame or the like by the speaker cable fixing portion. For this reason, the speaker cable and the speaker cable fixing portion located on the side surface of the frame take up an extra space at the position of the speaker mounting hole, and depending on the type of the vehicle, the speaker is fixed due to restrictions on the size of the speaker mounting hole. The speaker cannot be fitted into the speaker mounting hole, and the speaker cannot be mounted on the mounted portion.

  Therefore, in this case, the size of the entire speaker can be reduced by reducing the size of the magnetic circuit constituting the speaker (the size in the radial direction of the magnetic circuit) without changing the speaker cable mounting structure. Thus, it is possible to solve the above problems. In addition, such a subject may arise not only when attaching to the attachment part of a vehicle but when attaching to attachment parts, such as an electronic device.

  However, when such a method is adopted, for example, the Lorentz force (also referred to as “electromagnetic force”) acting on the voice coil becomes smaller than before the size of the magnetic circuit is reduced, and as a result, the vibration width of the diaphragm is reduced. Get smaller. That is, there arises a new problem that the sensitivity of the speaker is lowered by the amount of the magnetic circuit that has become smaller.

  Examples of problems to be solved by the present invention include the above. The present invention provides a support body having a speaker device wiring mounting structure that can be securely mounted to a mounted portion of a vehicle or the like without reducing sensitivity, and a speaker device wiring mounting structure for speaker device wiring. It is an object of the present invention to provide a speaker device including a support body that can be smoothly attached to a speaker.

  The invention according to claim 1 is a speaker device, comprising: a wiring; a magnetic circuit; and a support that supports the wiring and the magnetic circuit, wherein the support is for attaching the magnetic circuit. An attachment surface; and a wiring fixing portion for fixing the wiring, wherein the wiring fixing portion is provided on a surface of the support opposite to the attachment surface. To do.

  In one embodiment of the present invention, a speaker device includes a wiring, a magnetic circuit, and a support that supports the wiring and the magnetic circuit, and the support is an attachment surface for mounting the magnetic circuit. And a wiring fixing part for fixing the wiring, and the wiring fixing part is provided on a surface of the support opposite to the mounting surface.

  The speaker device includes a wiring, a magnetic circuit, and a support that supports the wiring and the magnetic circuit. The wiring is preferably wiring that electrically connects the voice coil and the amplifier. The support has an attachment surface for attaching the magnetic circuit and a wiring fixing portion for fixing the wiring. In a preferred example, the mounting surface is a surface located in the acoustic radiation direction, and the opposite surface is a surface located on the opposite side to the acoustic radiation direction.

  In this speaker device, in particular, the wiring fixing portion is provided on the surface of the support opposite to the mounting surface. As a result, when the speaker device is attached to the attachment portion by being fitted into the speaker attachment hole, the wiring and the wiring fixing portion do not take up extra space at the position of the speaker attachment hole. Therefore, the size of the magnetic circuit in the radial direction can be increased as much as possible, and the sensitivity of the speaker device can be prevented from being lowered. In addition, the wiring can be reliably fixed to the wiring fixing portion provided on the opposite surface of the support.

  In a preferred example, one end side of the wiring is electrically connected to a speaker terminal provided on the reverse side surface, and the other end side of the wiring drawn from the speaker terminal is the reverse side surface. It is preferable that the insertion hole is inserted through the insertion hole of the wiring fixing portion and further drawn out to the outside.

  In one aspect of the above speaker device, the wiring fixing portion has an insertion hole for inserting the wiring and has a shape protruding to the opposite side with respect to the acoustic radiation direction. In a preferred example, the wiring fixing part preferably has a concave cross-sectional shape. With these structures, the mold structure for forming the wiring fixing portion is simplified, and the number of man-hours can be reduced. Thereby, the strength of the support can also be increased.

  Further, since the wiring fixing portion is formed so as to cover the wiring arranged in the insertion hole, for example, when the wiring is fixed by a claw-shaped wiring fixing portion (not shown), an external force However, even if an external force acts on the wiring, it can be prevented from coming off the wiring fixing portion.

  In another aspect of the speaker device, a groove is formed at a position surrounding the wiring fixing portion on the mounting surface. As a result, the groove serves as an adhesive reservoir that prevents a part of the adhesive from protruding to the wiring fixing portion side when the magnetic circuit is attached to the mounting surface of the support via the adhesive. Have a role. Therefore, it is possible to prevent a part of the adhesive from protruding into the insertion hole of the wiring fixing portion, thereby preventing the wiring from being inserted into the insertion hole of the wiring fixing portion. It can be smoothly inserted into the hole.

  In another aspect of the speaker device, the insertion hole is formed so as to penetrate from the wiring fixing portion to the magnetic circuit. Thereby, the mold structure for forming the wiring fixing part can be simplified, and further, if such a mold is used, the resin molding of the support having the wiring fixing part becomes easy.

  In another aspect of the above speaker device, the support is made of a resin material. Thereby, the shaping | molding process of the support body containing a wiring fixing | fixed part and a groove | channel becomes easy.

  Various preferred embodiments of the present invention will be described below with reference to the drawings.

[Configuration of speaker device]
FIG. 1 is a rear view of the speaker device 100 according to the embodiment of the present invention, which is located on the opposite side to the acoustic radiation direction Y1. FIG. 2 is a sectional view taken along a cutting line AA ′ passing through the central axis L1 of the speaker device 100 shown in FIG.

  The speaker device 100 mainly includes an internal magnetic circuit 30 having a yoke 1, a magnet 2 and a plate 3, a voice coil bobbin 4, a voice coil 5, a diaphragm 6, and an edge 7. And a support body (hereinafter also referred to as “frame”) 8 that supports the magnetic circuit 30 and the vibration body 31, and other elements. Here, the other elements include the sound absorbing material 9, the speaker device terminal 10, the spacer 11, the speaker device wiring 50, and the like.

(Configuration of magnetic circuit)
The configuration of the magnetic circuit 30 is as follows.

  The yoke 1 has a bottomed cylindrical shape and is attached to an attachment surface 8a of a frame 8 described later via an adhesive (not shown). The magnet 2 has a disk shape and is attached to the bottom surface of the yoke 1. The plate 3 has an annular shape and is mounted on the magnet 2. A magnetic gap 32 in which the magnetic flux of the magnet 2 concentrates is formed between the outer peripheral surface of the plate 3 and the inner peripheral surface of the upper end portion of the yoke 1. On the plate 3, a sound absorbing material 9 made of a material having air permeability is provided.

(Frame structure)
The frame 8 has a shape surrounding the magnetic circuit 30. The frame 8 has an attachment surface 8a for attaching the yoke 1 via an adhesive (not shown). The attachment surface 8a is the bottom surface of the frame 8 located in the acoustic radiation direction Y1. The characteristic configuration of the frame 8 will be described later.

(Structure of vibrating body)
The vibrating body 31 includes the diaphragm 6, the edge 7, the voice coil bobbin 4 and the voice coil 5 as constituent members, and the constituent members are as follows.

  The voice coil bobbin 4 has a cylindrical shape. The lower end portion of the voice coil bobbin 4 is located in the magnetic gap 32. In the present invention, the position of the lower end portion of the voice coil bobbin 4 does not have to be in the magnetic gap 32 and may be in the vicinity of the magnet 2.

  The voice coil 5 is wound around the outer peripheral surface of the lower end portion of the voice coil bobbin 4 and is located in the magnetic gap 32. The voice coil 5 has a pair of plus / minus lead wires (not shown). The positive lead wire is an input wiring for an L (or R) channel signal, and the negative lead wire is an input wiring for a ground (GND) signal. Although not shown, the pair of plus / minus lead wires are electrically connected to the speaker device terminal 10 provided on the back surface 8b of the frame 8 located on the opposite side to the acoustic radiation direction Y1. Yes. One end side of the pair of plus / minus speaker device wirings 50 is electrically connected to the speaker device terminal 10 and the other end side of the pair of plus / minus speaker device wirings 50 is It is electrically connected to the amplifier side (not shown).

  The diaphragm 6 has a dome shape, and an outer peripheral portion thereof is attached to an upper end portion of the voice coil bobbin 4. The edge 7 has a semicircular cross-sectional shape. The inner peripheral edge portion of the edge 7 is attached to the outer peripheral surface of the upper end portion of the voice coil bobbin 4, and the outer peripheral portion of the edge 7 is attached to an annular spacer 11 provided at the upper end portion of the frame 8. .

  In the speaker device 100 having the above configuration, the audio current output from the amplifier side is a pair of plus / minus speaker device wiring 50, speaker device terminal 10, and a pair of plus / minus lead wires of the voice coil 5. And input to the voice coil 5. Thereby, based on Fleming's left-hand rule, an electromagnetic force (Lorentz force) acts on the voice coil 5 in the magnetic gap 32, and the diaphragm 6 moves in the acoustic radiation direction Y1 and the opposite direction together with the voice coil 5. Sound waves are radiated through the diaphragm 6 in the acoustic radiation direction Y1.

[Speaker device wiring mounting structure]
Next, the mounting structure of the speaker device wiring 50 will be described with reference to FIGS.

  FIG. 3A shows a front view of the frame 8 in FIG. 2 (a diagram for explaining the inside of the frame). FIG. 3B shows a cross-sectional view through the central axis L1 of the frame 8 along the cutting line BB ′ of FIG. FIG. 3C is a cross-sectional view of the main part of the frame 8 taken along the cutting line CC ′ of FIG.

  First, the characteristic configuration of the frame 8 is as follows. The basic configuration of the frame 8 is as described above. The frame 8 further includes a wiring fixing portion 8d for fixing the pair of plus / minus speaker device wirings 50 and a concave groove 8ab. Have.

  In the frame 8, the wiring fixing portion 8d is provided on a surface 8b opposite to the mounting surface 8a (a surface located on the opposite side to the acoustic radiation direction Y1) 8b. The wiring fixing portion 8d is provided so as to protrude from the opposite surface 8b to the opposite side with respect to the acoustic radiation direction Y1. The wiring fixing portion 8d has an insertion hole 8da for inserting the pair of plus / minus speaker device wirings 50, and has a shape protruding to the opposite side with respect to the acoustic radiation direction Y1. In this example, the wiring fixing portion 8d has a concave cross-sectional shape. Further, the insertion hole 8da is formed so as to penetrate the acoustic radiation direction Y1 side from the wiring fixing portion 8d, in other words, from the wiring fixing portion 8d to the magnetic circuit 30.

  The groove 8ab is formed at a position surrounding the wiring fixing portion 8d on the mounting surface 8a. In this example, the groove 8ab has a U-shaped planar shape. However, the present invention is not limited to this, and the groove 8ab may have an annular planar shape. The groove 8ab serves as an adhesive reservoir that prevents a part of the adhesive from protruding to the wiring fixing portion 8d side when the yoke 1 is attached to the attachment surface 8a of the frame 8 via an adhesive. Have

  Next, the attachment structure of the pair of plus / minus speaker device wires 50 to the wire fixing portion 8d of the frame 8 is as follows.

  One end side of the pair of plus / minus speaker device wirings 50 is electrically connected to the speaker device terminal 10 provided on the opposite surface 8 b of the frame 8, and is further drawn from the speaker device terminal 10. The other end side of the pair of plus / minus speaker device wires 50 is inserted into the insertion hole 8da of the wire fixing portion 8d along the opposite surface 8b of the frame 8, and is further drawn to the outside. ing. Thus, the pair of plus / minus speaker device wires 50 is fixed to the wire fixing portion 8 d and attached to the opposite surface 8 b of the frame 8.

  Next, a characteristic point about the speaker device wiring mounting structure according to this embodiment will be described.

  Such a speaker device 100 can be suitably used for in-vehicle use. In this case, as schematically shown in FIGS. 1 and 2, the speaker device 100 is fitted in a speaker mounting hole 40a provided in a mounted portion 40 such as a door inner panel or rear tray of a vehicle. It is attached to the attachment part 40. The size d1 of the speaker mounting hole 40a is determined by the type of vehicle.

  For this reason, in this speaker device 100, when a structure (comparative example) in which the wiring fixing portion 8 d is provided on the outer side surface 8 c of the frame 8 is assumed, the speaker device 100 is positioned on the outer side surface 8 c of the frame 8. A pair of plus / minus speaker device wiring 50 and wiring fixing portion 8d take up an extra space at the position of the speaker mounting hole 40a, and depending on the type of vehicle, due to the restriction of the size d1 of the speaker mounting hole 40a, The speaker device 100 cannot be fitted into the speaker mounting hole 40a, and the speaker device 100 cannot be mounted to the mounted portion 40.

  Therefore, in this case, by reducing the size of the magnetic circuit 30 (the size in the radial direction of the magnetic circuit 30) without changing the mounting structure of the speaker device wiring, the overall size of the speaker device can be reduced. It is possible to solve the above problems.

  However, when such a method is adopted, for example, the Lorentz force (also referred to as “electromagnetic force”) acting on the voice coil becomes smaller than before the size of the magnetic circuit 30 is reduced, resulting in the vibration width of the diaphragm. Becomes smaller. That is, there arises a new problem that the sensitivity of the speaker device is reduced by the amount of the magnetic circuit 30 that is reduced.

  In this regard, in the speaker device wiring mounting structure according to the present embodiment, the wiring fixing portion 8d for fixing the pair of plus / minus speaker device wiring 50 is opposite to the mounting surface 8a in the frame 8. Side surface (surface located on the opposite side to the acoustic radiation direction Y1) 8b.

  Therefore, when the speaker device 100 is attached to the attached portion 40, the pair of plus / minus speaker device wiring 50 and the wiring fixing portion 8d may take an extra space at the position of the speaker attachment hole 40a. Disappear. Therefore, compared with the above comparative example, the size of the magnetic circuit 30 in the radial direction can be increased as much as possible, and the sensitivity of the speaker device 100 can be prevented from being lowered. Further, the pair of plus / minus speaker device wires 50 can be securely fixed to the wire fixing portion 8 d provided on the opposite surface 8 b of the frame 8.

  In this embodiment, the wiring fixing portion 8d of the frame 8 has an insertion hole 8da for inserting the pair of plus / minus speaker device wirings 50 and protrudes in the opposite direction with respect to the acoustic radiation direction Y1. Have a shape to In this example, the wiring fixing portion 8d has a concave cross-sectional shape. Thereby, the mold structure for forming the wiring fixing portion 8d is simplified, and the number of man-hours can be reduced. Thereby, the strength of the frame 8 can be increased. Furthermore, since the wiring fixing portion 8d is formed so as to cover the pair of plus / minus speaker device wirings 50 arranged in the insertion hole 8da, for example, a claw-like wiring fixing portion (not shown) is provided. When the speaker device wiring 50 is fixed, there is a problem that the speaker device wiring 50 is disconnected due to an external force. However, even if the external force acts on the speaker device wiring 50, the speaker device wiring 50 is disconnected from the wiring fixing portion 8d. Can be prevented.

  In the present embodiment, a groove 8ab is formed at a position surrounding the wiring fixing portion 8d on the mounting surface 8a of the frame 8. Accordingly, the groove 8ab prevents the adhesive from partially protruding to the wiring fixing portion 8d side when the yoke 1 is attached to the attachment surface 8a of the frame 8 via the adhesive. It has a role as a reservoir. Therefore, a part of the adhesive protrudes into the insertion hole 8da of the wiring fixing portion 8d, which hinders the insertion of the pair of plus / minus speaker device wirings 50 into the insertion hole 8da of the wiring fixing portion 8d. The pair of plus / minus speaker device wires 50 can be smoothly inserted into the insertion hole 8da of the wire fixing portion 8d.

  Further, in this embodiment, the insertion hole 8da is formed so as to penetrate from the wiring fixing portion 8d to the magnetic circuit 30. Thereby, the mold structure for forming the wiring fixing portion 8d can be simplified, and further, if such a die is used, the resin molding of the frame 8 having the wiring fixing portion 8d becomes easy.

  In a preferred example, the frame 8 is preferably made of a resin material. Thereby, the shaping | molding process of the flame | frame 8 containing the wiring fixing | fixed part 8d and the groove | channel 8ab becomes easy.

The rear view of the speaker apparatus which concerns on the Example of this invention. Sectional drawing cut | disconnected in the position which passes along the central axis of the speaker apparatus which concerns on a present Example. The front view and various sectional drawing of the flame | frame which concern on a present Example.

Explanation of symbols

8 frame (support)
8a mounting surface 8ab groove 8b back surface 8d wiring fixing portion 8da insertion hole 10 speaker device terminal 40 mounted portion 40a speaker mounting hole 50 speaker device wiring 100 speaker device

Claims (8)

A wiring, a magnetic circuit, and a support that supports the wiring and the magnetic circuit;
The support has an attachment surface for attaching the magnetic circuit, and a wiring fixing portion for fixing the wiring.
The speaker device according to claim 1, wherein the wiring fixing portion is provided on a surface of the support opposite to the mounting surface. The mounting surface is a surface located in the acoustic radiation direction,
The speaker device according to claim 1, wherein the opposite surface is a surface located on the opposite side to the acoustic radiation direction.   The speaker device according to claim 1, wherein the wiring fixing portion has an insertion hole through which the wiring is inserted and has a shape protruding to the opposite side with respect to the acoustic radiation direction.   The speaker device according to claim 3, wherein the wiring fixing portion has a concave cross-sectional shape.   The speaker device according to claim 1, wherein a groove is formed at a position surrounding the wiring fixing portion on the mounting surface. One end side of the wiring is electrically connected to a speaker terminal provided on the opposite surface,
The other end side of the wiring drawn out from the speaker terminal is inserted into the insertion hole of the wiring fixing portion along the opposite surface, and is further drawn out to the outside. The speaker device according to any one of 1 to 5.   The speaker device according to claim 6, wherein the insertion hole is formed so as to penetrate from the wiring fixing portion to the magnetic circuit.   The speaker device according to claim 1, wherein the support is made of a resin material.

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