JP2008119647A - Pattern forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the unevenness of a pattern formed on a substrate by using a nozzle part. <P>SOLUTION: In a pattern forming apparatus, the nozzle part 421 and a light irradiation part 43 are moved continuously and relatively to the substrate 9 to make the nozzle part 421 precede in the moving direction along the substrate 9 while a pattern forming material 80 having light curing property is discharged from a plurality of discharge ports 422 of the nozzle part 421 and a mask 46 is moved parallel to the substrate 9 between the light irradiation part 43 and the substrate 9 by a mask moving mechanism 45. The illuminance distribution of irradiation light in the irradiating zone on the substrate 9 is irregularly changed with time because the a plurality of rectangular zones where the respective transmissivity is irregularly different are two-dimensionally arranged and set on the mask 46. As a result, the unevenness of the pattern of a lib formed when the libs each having different width are mixed on the substrate 9 due to the unevenness or the like of a plurality of the discharge ports is suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pattern forming apparatus for forming a pattern on a substrate.

  Conventionally, various methods for forming a rib on a glass substrate used in a flat display device such as a plasma display device are known. For example, in Patent Document 1, a paste-like rib forming material is discharged onto a substrate. The rib portion is formed on the substrate by moving the nozzle portion that performs the irradiation and the light irradiation portion that irradiates the rib forming material discharged onto the substrate with ultraviolet rays relative to the substrate along the main surface of the substrate. Rib forming devices have been proposed.

  In Patent Document 2, when an electron beam irradiation position is moved between fields on a resist film and main scanning is performed in each field, a plurality of identical figures are sequentially drawn on the resist film. There has been disclosed a technique for eliminating variations in pattern dimensions that appear in the period of a field by randomly varying the irradiation amount of an electron beam in a figure.

Moreover, although it is not pattern formation by continuous discharge | emission of a fluid material, in patent document 3, as a method of manufacturing the color filter of display apparatuses, such as a liquid crystal, several droplet weights from each nozzle with respect to a glass substrate. A method for preventing unevenness of three colors of R (red), G (green), and B (blue) by randomly ejecting droplets is disclosed.
JP 2002-184303 A JP-A-5-335223 JP 2003-279724 A

  By the way, when a plurality of rib patterns are formed on a substrate by moving a nozzle portion having a plurality of discharge ports relative to the substrate, for example, processing errors in the discharge ports that occur during machining, Changes in wettability due to uneven dispersion of fine particle components in the flowable material that forms the pattern, differences in surface characteristics due to slight contamination near the discharge port, or illuminance distribution of light from the light irradiation part (ie, illuminance (Non-uniform distribution) or the like, the widths of the plurality of ribs respectively corresponding to the plurality of discharge ports vary. Actually, the width of each rib is almost constant in the scanning direction, and unevenness in the rib pattern on the substrate (non-uniformity that is easily recognized visually) occurs due to the variation in the width between the plurality of ribs. Resulting in.

  The present invention has been made in view of the above problems, and an object thereof is to suppress unevenness of a pattern formed on a substrate using a nozzle portion.

  The invention according to claim 1 is a pattern forming apparatus for forming a pattern on a substrate, wherein a nozzle part for discharging a pattern forming material having photocurability from a plurality of discharge ports onto the substrate, and on the substrate A light irradiation unit that irradiates the discharged pattern forming material with irradiation light; and while the pattern forming material is discharged from the nozzle unit, the nozzle unit and the light irradiation unit are moved in the moving direction along the substrate. By moving relatively and continuously with respect to the substrate while preceding the pattern, a pattern composed of a plurality of linear pattern elements arranged at an equal pitch in a direction perpendicular to the moving direction is obtained. While the pattern forming material is ejected from the moving mechanism formed on the substrate and the nozzle portion, the irradiation area of the irradiation light on the substrate and the pattern forming material is almost entirely covered. Or, in a plurality of partial areas arranged in the direction perpendicular to the movement direction in the irradiation area, the illuminance of the irradiation light, the illuminance distribution on the pattern forming material, or the irradiation range in the movement direction And an irradiation light changing unit that irregularly changes.

  Invention of Claim 2 is the pattern formation apparatus of Claim 1, Comprising: The transmittance | permeability of the mask by which the said irradiation light change part is arrange | positioned on the optical path between the said light irradiation part and the said board | substrate Is a mechanism for irregularly changing the distribution of the pattern forming material while it is discharged from the nozzle portion.

  According to a third aspect of the present invention, in the pattern forming apparatus according to the second aspect, when the mask moves in parallel with the substrate, the distribution of the transmittance of the mask on the optical path is changed. .

  Invention of Claim 4 is a pattern formation apparatus of Claim 1, Comprising: The irradiation area | region on the said board | substrate of the said irradiation light from the said light irradiation part is a linear form crossing the said pattern formation material The irradiation light changing unit irregularly minutely moves the irradiation region with respect to the plurality of discharge ports in the movement direction while the pattern forming material is discharged from the nozzle unit, or the irradiation region It is a mechanism that irregularly rotates about a rotation axis parallel to the normal direction of the substrate.

  A fifth aspect of the present invention is the pattern forming apparatus according to the first aspect, wherein the light irradiation unit is configured to place the light irradiation unit on the substrate while the pattern forming material is discharged from the nozzle unit. It is a mechanism that moves irregularly in the normal direction.

  Invention of Claim 6 is the pattern formation apparatus in any one of Claim 1 thru | or 5, Comprising: The fluctuation range of the said illumination intensity of the said irradiation light changed irregularly by the said irradiation light change part is, It is 2% or more and 10% or less of the average value of spatial and temporal illuminance in the irradiation region.

  ADVANTAGE OF THE INVENTION According to this invention, the nonuniformity of the pattern formed on a board | substrate using a nozzle part can be suppressed.

  In the inventions of claims 2 and 3, the illuminance distribution of the irradiated light can be easily and irregularly changed using a mask.

  Moreover, in the invention of claim 4, the irradiation range of the irradiation light can be irregularly changed with respect to the discharge port in the moving direction. In the invention of claim 5, the light irradiation part is arranged on the substrate with respect to the nozzle part. By moving in the normal direction, the illuminance of the irradiation light can be easily and irregularly changed.

  FIG. 1 is a diagram showing a configuration of a pattern forming apparatus 1 according to a first embodiment of the present invention. The pattern forming apparatus 1 is an apparatus for forming a rib pattern on a glass substrate (hereinafter referred to as “substrate”) 9 for a flat display device such as a plasma display device. Through this process, a panel which is an assembly part of the flat display device is obtained.

  In the pattern forming apparatus 1, the stage moving mechanism 2 is provided on the base 11, and the stage 20 that holds the substrate 9 horizontally by the stage moving mechanism 2 is movable in the Y direction shown in FIG. A frame 12 is fixed to the base 11 so as to straddle the stage 20, and the head portion 4 is attached to the frame 12 via the head moving mechanism 3.

  The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21 and a nut 23 fixed to the stage 20 is attached to the ball screw 22. When the guide rail 24 is fixed above the ball screw 22 and the motor 21 rotates, the stage 20 moves smoothly along the guide rail 24 in the Y direction along with the nut 23 (that is, the head portion 4 moves relative to the substrate 9). Relatively main scanning.)

  The head moving mechanism 3 includes a motor 31 supported by the frame 12, a ball screw 32 connected to the rotation shaft of the motor 31, and a nut 33 attached to the ball screw 32. 33 moves in the X direction in FIG. A base 40 of the head unit 4 is attached to the nut 33, and thus the head unit 4 can be moved (sub-scanned) in the X direction. The base 40 is connected to a guide rail 34 fixed to the frame 12 and is smoothly guided by the guide rail 34.

  The head unit 4 includes a discharge unit 42 that discharges a paste-form pattern forming material having fluidity on the substrate 9, and a light irradiation unit 43 that cures the pattern forming material on the substrate 9. The light irradiation part 43 is attached to the lower part of the raising / lowering mechanism 41 fixed to the base 40. The pattern forming material includes a photoinitiator that starts curing (crosslinking reaction) by ultraviolet rays, a resin that is a binder, and a low softening point glass frit that is a glass powder, and has insulating properties. A nozzle portion 421 having a plurality of discharge ports arranged in the X direction is detachably attached to the lower surface of the discharge portion 42.

  The nozzle part 421 is connected to a container 442 for storing pattern forming material via a supply pipe 441, and an air supply part 444 for supplying high-pressure air is connected to the container 442 via a regulator 443. The container 442 can be replaced. In the pattern forming apparatus 1, when the remaining amount of the pattern forming material in the container 442 is equal to or less than a predetermined amount, the operator replaces the container 442 with another container 442 filled with the pattern forming material. At the time of forming a rib pattern, which will be described later, the regulator 443 raises the pressure of the air in the container 442 above atmospheric pressure, and the pattern forming material stored in the container 442 is pressurized. That is, the pressure difference between the air pressure in the container 442 and the atmospheric pressure (hereinafter referred to as “air differential pressure”) is applied to the pattern forming material in the container 442, thereby causing the pattern to the nozzle portion 421. The forming material is supplied, and the pattern forming material is discharged from the discharge port of the nozzle portion 421. As described above, in the pattern forming apparatus 1, the material supply unit 44 (also called a dispenser system) that supplies the pattern forming material to the nozzle unit 421 is constructed by the supply pipe 441, the container 442, the regulator 443, and the air supply unit 444. . When the pattern forming material is not discharged from the nozzle portion 421, the air differential pressure is set to 0 (that is, the air pressure in the container 442 is set to atmospheric pressure, and the material supply portion 44 The pattern forming material in the container 442 is not pressurized.)

  The light irradiation unit 43 is connected to the light source unit 432 via a bundle of many optical fibers 431 (indicated by one thick line in FIG. 1 and simply referred to as “optical fiber 431” hereinafter). The light source unit 432 includes a light source that emits ultraviolet light (for example, a xenon lamp), and light from the light source is guided to the light irradiation unit 43 by the optical fiber 431. Actually, in the light irradiation unit 43, the ends of the many optical fibers opposite to the light source unit 432 are arranged in the X direction, and a plurality of discharge ports are arranged on the (−Y) side of the nozzle unit 421. Ultraviolet rays are irradiated to a substantially linear region on the substrate 9 extending along the arrangement direction (that is, the X direction). In the following description, the light irradiated from the light irradiation unit 43 onto the substrate 9 is referred to as irradiation light.

  FIG. 2 is an enlarged view showing the vicinity of the tips of the nozzle part 421 and the light irradiation part 43. As shown in FIG. 2, a flow path 423 that continues to each discharge port 422 in the nozzle portion 421 (in FIG. 2, only one discharge port 422 and one flow path 423 are denoted by reference numerals). It extends in a direction parallel to the YZ plane and inclined with respect to the Z direction (for example, a direction inclined by 45 degrees). As a result, the main surface of the substrate 9 on the (+ Z) side (which is a main surface on which a rib pattern is to be formed as will be described later, hereinafter also referred to as “target surface”) 91 and the target surface 91. On the other hand, the pattern forming material 80 is discharged from the discharge port 422 in the discharge direction inclined. Similarly, the opening surface 424 of the nozzle portion 421 (the surface including the plurality of discharge ports 422 at the tip of the nozzle portion 421) has a normal line parallel to the YZ plane and inclined with respect to the Z direction. A facing surface 425 parallel to the target surface 91 of the substrate 9 is formed in a portion on the (−Z) side of the nozzle portion 421 in FIG. 2. In the pattern forming apparatus 1, the lifting mechanism 41 is connected to the nozzle portion as necessary. By moving 421 in the Z direction, the gap between the facing surface 425 of the nozzle portion 421 and the target surface 91 of the substrate 9 at the time of forming the rib pattern is maintained at a substantially constant minute width, and the nozzle portion 421 Is always close to the target surface 91 of the substrate 9. The shape of each ejection port 422 when viewed from the (−Y) side toward the (+ Y) direction is a rectangle, the width of the shape in the X direction is, for example, 100 μm, and the pitch of the ejection ports 422 in the X direction Is 300 μm. The arrangement direction of the plurality of discharge ports 422 may be inclined with respect to the direction (X direction) perpendicular to the moving direction of the substrate 9 and along the target surface 91.

  In addition, two lower rollers 451 and 452 are arranged in the vicinity of the irradiation surface ((−Z) side surface) of the irradiation light of the light irradiation unit 43 with the light irradiation unit 43 interposed therebetween in the Y direction. Upper rollers 453 and 454 are provided above the lower roller 451 opposite to the nozzle portion 421 ((−Y) side) and the lower roller 452 on the nozzle portion 421 side, respectively. , 454 are connected to the rotating shafts of motors 457, 458 via annular belts 455, 456. A film-like mask 46 is provided between the upper rollers 453 and 454 via the lower rollers 451 and 452, and the emission surface (surface on the (−Z) side) of the light irradiation unit 43 and the target surface 91 of the substrate 9. Is partitioned by a part of the mask 46. Most of the mask 46 is wound around the outer periphery of the upper roller 454. When the rib pattern described later is formed, the upper roller 453 for winding on the (−Y) side is rotated by the motor 457, so that the (+ Y) side is rotated. The portion of the mask 46 wound around the outer circumference of the upper roller 454 for feeding is sequentially fed out, moves in parallel with the substrate 9 between the light irradiation unit 43 and the target surface 91, and is taken up by the upper roller 453. . In this manner, the lower roller 451, 452, the upper roller 453, 454, the annular belt 455, 456, and the motor 457, 458, the mask 46 disposed on the optical path between the light irradiation unit 43 and the substrate 9 is the substrate. A mask moving mechanism 45 that moves in parallel with 9 is constructed. The motor 458 is used for rewinding the mask 46.

  FIG. 3 is a diagram illustrating a part of the mask 46 disposed between the light irradiation unit 43 and the substrate 9. As indicated by a two-dot chain line in FIG. 3, a plurality of rectangular areas 461 are set in a two-dimensional array on the mask 46, and the transmittance of the irradiated light is not uniform for each rectangular area 461 in the plurality of rectangular areas 461. The rules are different. The width of the rectangular region 461 with respect to the X direction is a multiple of the pitch of the discharge ports 422 (may be 1 time), and the length in the Y direction is, for example, 2 to 3 millimeters (mm). . Further, the transmittance of the irradiation light is changed in a range of approximately 87 to 93%. In FIG. 3, the difference in the transmittance in the rectangular region 461 is changed by changing the interval between the parallel oblique lines attached to the rectangular region 461. Show. Actually, the average value (average transmittance) of the transmittance of the entire mask 46 is about 90%, and the fluctuation range of the transmittance of the mask 46 is 6% of the average value. Thus, the mask 46 is a neutral density filter in which the transmittance at each position is changed at random. Note that the mask 46 can be manufactured by, for example, performing printing (attaching a pigment) on a fluorine-based resin film. Further, the light irradiation unit 43 or the light source unit 432 is provided with a heat ray cut filter, and the mask 46 is not deformed by heat due to irradiation of irradiation light.

  As shown in FIG. 1, the motor 21 of the stage moving mechanism 2, the regulator 443, the light source unit 432, the motor 31 of the head moving mechanism 3, the lifting mechanism 41 of the head unit 4, and the motors 457 and 458 of the mask moving mechanism 45 ( 2) is connected to the control unit 5, and the configuration is controlled by the control unit 5, whereby the pattern forming apparatus 1 forms a rib pattern on the substrate 9.

  Next, an operation in which the pattern forming apparatus 1 forms a rib pattern on the substrate 9 will be described with reference to FIG. In the pattern forming apparatus 1 of FIG. 1, first, the substrate 9 is placed on the stage 20, and the nozzle portion 421 is positioned above the (−Y) side end of the substrate 9 by the stage moving mechanism 2 and the head moving mechanism 3. Be placed. Subsequently, emission of irradiation light from the light irradiation unit 43 is started (step S11), and movement of the mask 46 between the light irradiation unit 43 and the substrate 9 is started by driving the mask moving mechanism 45, which will be described later. As described above, the illuminance distribution in the irradiation area of the irradiation light on the substrate 9 is irregularly changed (step S12). Thereafter, the substrate 9 on the stage 20 is moved in the (−Y) direction below the discharge unit 42 by the stage moving mechanism 2, and the nozzle unit 421 and the light irradiation unit 43 are in the (+ Y) direction with respect to the substrate 9. The relative movement is started (step S13). Further, by setting the differential pressure of the air in the container 442 (that is, the difference between the pressure of the air in the container 442 and the atmospheric pressure) to a predetermined value, the pattern forming material from each discharge port 422 of the nozzle portion 421 is continuously formed. Discharging is also started (step S14).

  Actually, as shown in FIG. 2, in parallel with the relative continuous movement of the nozzle part 421 with respect to the substrate 9 in the direction along the target surface 91, the relative movement direction of the nozzle part 421 from each discharge port 422 is The pattern forming material is continuously discharged in the opposite direction (that is, in the (−Y) direction) without interruption, so that the pattern forming material 80 discharged from each discharge port 422 is sequentially deposited on the substrate 9. . At this time, the opening surface 424 of the nozzle portion 421 is inclined so that the normal line intersects the target surface 91 of the substrate 9 on the discharge side ((−Y) side). At each position in the direction, the pattern forming material is discharged from the discharge port 422 such that the pattern forming material is stacked from the (−Z) side to the (+ Z) side. As a result, the pattern forming material adheres to the substrate 9 with a high aspect ratio.

  The pattern forming material 80 discharged onto the substrate 9 is masked from a position above the discharge port 422 by a light irradiation unit 43 disposed behind the nozzle unit 421 in the direction of travel relative to the substrate 9. Irradiation light is irradiated via As described above, the pattern forming material is added with a photoinitiator and has photocurability, and the pattern forming material 80 on the substrate 9 is easily cured by irradiation with irradiation light from the light irradiation unit 43. It is possible. Thereby, while extending in the relative movement direction (Y direction) of the nozzle part 421, the fine linear rib used as the element of a rib pattern is formed.

  Further, while the pattern forming material 80 is discharged from the nozzle portion 421, the mask 46 is moved in the same direction ((−Y) side) at the same speed as the substrate 9 between the light irradiation portion 43 and the target surface 91. By continuously moving with respect to the light irradiation unit 43, each part of the mask 46 is fixed relative to the target surface 91 of the substrate 9, and in this state, the irradiation light from the light irradiation unit 43 is masked. The pattern forming material 80 immediately after being discharged onto the substrate 9 through 46 is irradiated. Thereby, the distribution of the transmittance of the portion of the mask 46 located on the optical path between the light irradiation unit 43 and the substrate 9 (that is, the transmission of the mask 46 to the pattern forming material 80 immediately after being discharged onto the substrate 9). The rate distribution is irregularly changed every time the substrate 9 moves by 2 to 3 mm in accordance with the arrangement of the plurality of rectangular regions 461 on the mask 46 in FIG. The distribution of illuminance (intensity of light irradiated per unit area) is changed. As a result, the illuminance of the irradiation light applied to the pattern forming material 80 (corresponding to one rib) discharged from each discharge port 422 and attached onto the target surface 91 depends on the position in the Y direction on the substrate 9. Even at each position in the Y direction on the substrate 9, the illuminance of the irradiation light with respect to the pattern forming material 80 discharged from the plurality of discharge ports 422 changes according to the position in the X direction.

  Actually, since the irradiation light from the light irradiation unit 43 slightly spreads toward the substrate 9, the transmittance distribution of the mask 46 is accurately reflected in the illuminance distribution of the irradiation light irradiated on the substrate 9. Although the distance between the light irradiation unit 43 and the substrate 9 is very small and the spread angle of the irradiation light is small, the transmittance distribution of the mask 46 is substantially reflected in the illuminance distribution of the irradiation light. Is done. Of course, in the pattern forming apparatus 1, the mask 46 is brought close to the target surface 91 within a range that does not interfere with the pattern forming material on the substrate 9, whereby the transmittance distribution in the mask 46 is determined by the illuminance distribution of the irradiation light on the substrate 9. It is possible to reflect accurately. Note that the illuminance of the irradiation light at each position on the substrate 9 by moving the portion of the mask 46 between the light irradiation unit 43 and the substrate 9 in a state of being fixed relative to the target surface 91 of the substrate 9. Can be changed to match the pattern of the mask 46, but the mask 46 does not necessarily have to be moved in a state of being relatively fixed with respect to the target surface 91 of the substrate 9.

  In this way, while the pattern forming material is discharged from the nozzle portion 421, the illuminance distribution of the irradiation light on the pattern forming material is the entire irradiation region of the irradiation light on the substrate 9 and the discharged pattern forming material. By changing irregularly over time, the time until the curing is completed after the discharge of the pattern forming material at a plurality of portions in the Y direction of each rib is different, and the shape collapsed due to gravity or the like ( (Dare condition) will vary. As described above, the variation width of the transmittance in the mask 46 is set to 6% of the average transmittance in the entire mask 46, so that the variation width of the illuminance on the pattern forming material of the irradiation light irregularly changed is The average value of the illuminance of the entire irradiation area during the period during which rib formation is performed, that is, 6% of the average value of the spatial and temporal illuminance in the irradiation area.

  When the discharge of the pattern forming material is continued and the vicinity of the (+ Y) side end of the substrate 9 reaches directly below the nozzle portion 421, the discharge of the pattern forming material is stopped (step S15). Thereafter, the movement of the substrate 9 is stopped (step S16), and the movement of the mask 46 and the emission of the irradiation light from the light irradiation unit 43 are also stopped (steps S17 and S18).

  FIG. 5 is a plan view showing a part of the rib 81 formed on the substrate 9. On the substrate 9, the same number of ribs 81 as the ejection ports 422 are arranged at an equal pitch in the X direction perpendicular to the relative movement direction of the nozzle portion 421 (actually, the pitch of the ejection ports 422 is 300 μm). A pattern 8 of a plurality of ribs 81 is formed on 9. In most of each rib 81, the maximum or minimum width in the X direction (or the width Y in the width direction) is 2 to 3 mm in the Y direction (approximately 10 times the pitch of the discharge ports 422) depending on the illuminance of the irradiation light. The position where the rate of change with respect to the direction becomes 0) appears once, and the width changes irregularly. Further, the width in the X direction of the rib 81 at each position in the Y direction on the substrate 9 varies irregularly among the plurality of ribs 81 (irregularly for every several ribs 81 in FIG. 5). In the pattern forming material used in the present embodiment, the range of transmittance variation in the mask 46 is ± 3% of the average transmittance, so that the width in the X direction of each rib 81 is also the average of the rib 81. It fluctuates in the range of ± 3% from the typical width. Actually, the rib 81 also varies in the height direction (Z direction). In FIG. 5, the rib 81 is illustrated with different magnifications in the X direction and the Y direction.

  In the present embodiment, the formation of the rib pattern on the substrate 9 is completed by only one scan of the nozzle portion 421, but depending on the size of the substrate 9, a large number of scans of the nozzle portion 421 are performed on the entire substrate 9. The rib 81 may be formed. In this case, each time scanning of the nozzle portion 421 is completed, the head portion 4 is moved by a predetermined distance in the X direction, and the substrate 9 is also moved to the initial position, and then the above operation is repeated.

  The rib pattern formed in the above process is baked in another process, the resin content in the pattern forming material is removed, and the low softening point glass frit is fused. And the panel which is an assembly part of a flat display apparatus is completed suitably through other required processes.

  As described above, in the pattern forming apparatus 1 of FIG. 1, the movement direction of the nozzle part 421 and the light irradiation part 43 along the substrate 9 is while the pattern forming material having photocurability is ejected from the nozzle part 421. The nozzle portion 421 precedes the substrate 9 and moves relative to the substrate 9 continuously, and the mask moving mechanism 45 moves the mask 46 parallel to the substrate 9 between the light irradiation unit 43 and the substrate 9. Thus, the illuminance distribution of the irradiation light in the irradiation region on the substrate 9 is easily and irregularly changed using the mask 46. Thereby, ribs having different widths are mixedly formed due to variations in the opening area of the plurality of discharge ports 422, variations in the surface state of the flow path, or the intensity distribution of light emitted from the light irradiation unit 43. By doing so, it is possible to suppress the unevenness of the rib pattern on the substrate 9.

  If unevenness of the pattern on the substrate 9 is suppressed, the transmittance is randomly changed at the central portion in the X direction, and each end portion (for example, the range in the X direction covers all discharges). A mask 46 having a constant transmittance may be used in a portion that occupies only 20% or less of the range corresponding to the outlet 422. That is, in the pattern forming apparatus 1, while the pattern forming material is discharged from the nozzle portion 421, the illuminance distribution of the irradiation light on the pattern forming material may be irregularly changed in almost the entire irradiation region of the irradiation light. (The same applies to the second and third embodiments described later).

  In the pattern forming apparatus 1 of FIG. 1, the variation width of the transmittance in the mask 46 is set to 6% of the average transmittance, and the width at each of a plurality of positions in the Y direction is ± 3% from the average width of the rib. By varying in the range, the influence of the width variation in the range of ± 2 to 3% of the average width generated in the plurality of ribs when the mask 46 is not provided is reduced, and the rib pattern on the substrate 9 is reduced. Is effectively suppressed. Usually, when the mask 46 is not provided, the variation range of the width generated in the plurality of ribs is ± 1% to ± 5% of the average width. In this case, the variation range of the transmittance in the mask 46 is equal to the average transmittance. The fluctuation range of the illuminance on the pattern forming material of the irradiation light irregularly changed as 2% or more and 10% or less is 2% or more and 10% or less of the average value of the spatial and temporal illuminance in the irradiation region. In this case, unevenness of the rib pattern on the substrate 9 is appropriately suppressed. Further, in the pattern forming apparatus 1, the substrate is arranged such that a peak (maximum or minimum) appears once in each rib at 1 to 100 times (more preferably 5 to 10 times) the pitch (rib pitch) of the discharge ports 422. It is preferable that the illuminance distribution of the irradiation light with respect to the pattern forming material immediately after being discharged onto the substrate 9 is changed (the same applies to the second and third embodiments described later).

  Here, a manufacturing method other than printing of the mask 46 of FIG. 3 will be described. FIG. 6 is a diagram showing the relationship between the transmittance of the resin film and the wavelength. In FIG. 6, the line labeled A1 represents the transmittance of a 25 μm thick PCTFE (polychlorotrifluoroethylene) film, and the line labeled A2 represents a 25 μm thick ETFE (tetrafluoroethylene / ethylene copolymer weight). The line with the symbol A3 indicates the transmittance of the FEP (tetrafluoroethylene / hexafluoropropylene copolymer) film having a thickness of 25 μm, and the line with the symbol A4 has a thickness of 25 μm. The transmittance of a film of PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer) is indicated, and the line labeled A5 indicates the transmittance of a film of PE (polyethylene) having a thickness of 25 μm, and the line labeled A6. Indicates the transmittance of a glass with a thickness of 135 μm, and the line denoted by A7 is PVC (polyvinyl chloride) with a thickness of 40 μm. It shows the transmission of the film.

  As shown in FIG. 6, the fluorine-based films of PCTFE, ETFE, FEP and PFA have a high transmittance in the ultraviolet wavelength band (for example, 250 to 400 nm), and are embossed with respect to the fluorine-based film. A mask having an irregular transmittance distribution can be easily manufactured by performing processing or the like to partially change the thickness. Of course, depending on the intensity of the irradiation light from the light irradiation unit 43, a mask may be produced using a film having a relatively low transmittance of ultraviolet rays such as polyethylene, and the wavelength band of light used for curing the pattern forming material. Depending on the case, it is also possible to use a film such as PET (polyethylene terephthalate).

  Next, another example of the pattern forming apparatus 1 will be described. FIG. 7 is a diagram illustrating a mask moving mechanism 45a of the pattern forming apparatus 1 according to another example, and is viewed from the side opposite to the nozzle portion 421 (that is, from the (−Y) side toward the (+ Y) direction). The lower part vicinity of the light irradiation part 43 in the case of seeing is shown.

  In the mask moving mechanism 45a of FIG. 7, lower rollers 451 and 452 are provided in the X direction with the light irradiation unit 43 interposed therebetween, and motors 457 are disposed above the lower rollers 451 and 452 via annular belts 455 and 456, respectively. , 458 are connected to upper rollers 453, 454. In the pattern forming apparatus 1, the portion of the mask 46a on the optical path of the irradiation light from the light irradiation unit 43 is moved along the arrangement direction (that is, the X direction) of the discharge ports 422 of the nozzle unit 421 by the mask moving mechanism 45a. .

  FIG. 8 is a view showing a part of the mask 46 a arranged between the light irradiation unit 43 and the substrate 9. The mask 46a in FIG. 8 has only one row of rectangular regions 461 arranged in the Y direction in the mask 46 in FIG. 3 (however, the aspect ratio of the mask 46a in FIG. 8 is different). Similarly, in the plurality of rectangular regions 461, the transmittance of the irradiation light is irregularly different.

  Also in the pattern forming apparatus 1 having the mask moving mechanism 45 a of FIG. 7, while the pattern forming material is discharged from the nozzle portion 421, the nozzle portion 421 and the light irradiation portion 43 move the nozzle portion 421 in the moving direction along the substrate 9. While moving in a relative and continuous manner with respect to the substrate 9 in advance, the distribution of the transmittance of the portion of the mask 46a with respect to the pattern forming material immediately after being discharged onto the substrate 9 is irregularly changed. Thereby, the illuminance distribution of the irradiation light can be easily and irregularly changed using the mask 46a, and unevenness of the pattern of the ribs formed on the substrate 9 can be suppressed.

  In the mask moving mechanism 45 in FIG. 2, the upper roller 454 is disposed in a narrow space between the light irradiation unit 43 and the nozzle unit 421, whereas in the mask moving mechanism 45a in FIG. Since the upper rollers 453 and 454 are arranged in a relatively wide space outside the irradiation unit 43, the pattern forming apparatus 1 can be easily assembled as compared with the pattern forming apparatus 1 having the mask moving mechanism 45 of FIG. be able to. However, in order to cause irregularities in the ribs formed on the substrate 9 in accordance with the pattern of the mask 46, it is arranged between the light irradiation unit 43 and the substrate 9 as in the mask moving mechanism 45 of FIG. It is preferable to move the mask to be moved in the moving direction of the nozzle portion 421.

  FIG. 9 is a diagram showing the configuration of the light source unit 432a of the pattern forming apparatus according to the second embodiment of the present invention. The light source unit 432a in FIG. 9 has a light source 433 that emits ultraviolet light (however, only the light emission part of the light source 433 is shown in FIG. 9), and the light source 433 (the light emission part) and the optical fiber 431 (actually). Is a bundle of optical fibers), and a disk-shaped filter 434 and a lens 435 are disposed between them. The filter 434 is rotated about a rotation axis J2 parallel to the optical axis J1 between the light source 433 and the optical fiber 431 by the motor 436, and is divided into a plurality of parts (regularly or irregularly divided) on the filter 434. In a plurality of regions), the transmittance of ultraviolet rays is irregularly different. Other configurations of the pattern forming apparatus are the same as those in FIG.

  Next, an operation in which the pattern forming apparatus having the light source unit 432 in FIG. 9 forms a rib pattern on the substrate 9 will be described with reference to FIG. In the pattern forming apparatus, when the substrate 9 is placed on the stage 20, the shutter in the light source 433 is opened and ultraviolet rays are emitted from the light source 433, whereby emission of irradiation light from the light irradiation unit 43 starts. (Step S11). In addition, when the rotation of the filter 434 is started by the motor 436, the intensity of the emitted light from the light irradiation unit 43 is irregularly changed (step S12). Thereafter, relative movement of the nozzle unit 421 and the light irradiation unit 43 with respect to the substrate 9 and the discharge of the pattern forming material from each discharge port 422 of the nozzle unit 421 are started (steps S13 and S14), and pattern formation is performed on the substrate 9. While the material is being discharged, the pattern forming material immediately after being discharged onto the substrate 9 is irradiated with the irradiation light from the light irradiation unit 43.

  At this time, the intensity of the irradiation light from the light irradiation unit 43 is irregularly changed with time, so that the pattern forming material discharged from the plurality of discharge ports 422 and attached to the target surface 91 is irradiated. The illuminance of light changes according to the position in the Y direction on the substrate 9. Thus, while the pattern forming material is discharged from the nozzle portion 421, the illuminance of the irradiation light on the pattern forming material is irregular in the entire irradiation region of the irradiation light on the substrate 9 and the discharged pattern forming material. By changing to, the widths at a plurality of positions in the Y direction in each rib vary irregularly according to the illuminance of the irradiation light. It should be noted that all ribs formed on the substrate 9 have substantially the same position in the Y direction where the width is minimized or maximized.

  Then, when the vicinity of the end on the (+ Y) side of the substrate 9 reaches directly below the nozzle portion 421, the discharge of the pattern forming material is stopped (step S15). Thereafter, the movement of the substrate 9 is stopped (step S16), and the rotation of the filter 434 and the emission of the irradiation light from the light irradiation unit 43 are also stopped (steps S17 and S18).

  As described above, in the pattern forming apparatus having the light source unit 432 in FIG. 9, irradiation of the entire pattern forming material immediately after being discharged onto the substrate 9 while the pattern forming material is being discharged from the nozzle portion 421. By changing the illuminance of light irregularly, the widths at a plurality of positions in the Y direction can be irregularly changed in each rib. Actually, the rate of change of the width at each position in the direction in which the ribs extend in all the ribs on the substrate 9 is substantially the same. Is suppressed.

  Further, the irregular change of the illuminance of the irradiation light with respect to the entire pattern forming material immediately after being discharged onto the substrate 9 can be realized by other methods. FIG. 10 is a diagram illustrating another example of the head portion of the pattern forming apparatus. In the head unit 4 a of FIG. 10, a cylinder mechanism 47 is provided below the lifting mechanism 41, and the movable unit 471 of the cylinder mechanism 47 is fixed to the light irradiation unit 43, so that the light irradiation unit 43 is normal to the substrate 9. It is possible to move in a direction parallel to the direction (Z direction in FIG. 10). Further, the light irradiation unit 43 is smoothly guided in the Z direction by the guide unit 48.

  When the rib pattern is formed on the substrate 9 by the pattern forming apparatus having the head portion 4a of FIG. 10, first, the substrate 9 is placed on the stage 20, and subsequently, the irradiation light from the light irradiation unit 43 is irradiated. Is started (FIG. 4: Step S11). In addition, when the driving of the cylinder mechanism 47 is started, the light irradiation unit 43 is indistinguishable by a slight distance in the normal direction of the substrate 9 (for example, within ± 1 mm in the Z direction from the reference position). It starts moving to the rule (step S12). Thereafter, relative movement of the nozzle unit 421 and the light irradiation unit 43 with respect to the substrate 9 and the discharge of the pattern forming material from each discharge port 422 of the nozzle unit 421 are started (steps S13 and S14), and pattern formation is performed on the substrate 9. While the material is being discharged, the pattern forming material immediately after being discharged onto the substrate 9 is irradiated with the irradiation light from the light irradiation unit 43.

  At this time, the light irradiation unit 43 moves irregularly by a slight distance in the normal direction of the substrate 9 to irradiate the pattern forming material discharged from the plurality of discharge ports 422 and attached on the target surface 91. The illuminance of the irradiation light changes irregularly according to the position in the Y direction on the substrate 9. As a result, in all the ribs formed on the substrate 9, the widths at a plurality of positions in the Y direction change irregularly.

  Then, when the vicinity of the end on the (+ Y) side of the substrate 9 reaches directly below the nozzle portion 421, the discharge of the pattern forming material is stopped (step S15). Thereafter, the movement of the substrate 9 is stopped (step S16), and the driving of the cylinder mechanism 47 and the emission of irradiation light from the light irradiation unit 43 are also stopped (steps S17 and S18).

  As described above, in the pattern forming apparatus having the head unit 4a of FIG. 10, the light irradiation unit 43 is normal to the nozzle unit 421 while the pattern forming material is ejected from the nozzle unit 421. By irregularly moving in a direction by a slight distance, the illuminance of irradiation light on the entire pattern forming material immediately after being discharged onto the substrate 9 is easily changed irregularly. As a result, the widths of the ribs on the substrate 9 at a plurality of positions in the Y direction can be irregularly varied, and unevenness of the rib pattern on the substrate 9 can be suppressed. The mechanism for moving the light irradiation unit 43 in the Z direction may be realized by a solenoid, a vibrator, or the like.

  As shown in FIG. 11, when the light source unit 432 is provided with a power source 437 capable of external modulation control, the magnitude of the voltage applied from the power source 437 to the light source 433 is controlled by the control unit 5. It is also possible to change the intensity of the irradiation light from the light irradiation unit 43 irregularly by changing it irregularly. However, such a power source 437 is relatively expensive.

  FIG. 12 is a diagram showing the configuration of the head portion 4b of the pattern forming apparatus according to the third embodiment of the present invention. In FIG. 12, only the vicinity of the ends of the light irradiation portion 43 and the nozzle portion 421 is shown. In the head unit 4b of FIG. 12, a rotation mechanism 47a that rotates the light irradiation unit 43 by a minute angle around a rotation axis J3 parallel to the arrangement direction of the discharge ports 422 (that is, the X direction) is provided.

  When a rib pattern is formed on the substrate 9 by the pattern forming apparatus having the head portion 4b of FIG. 12, first, emission of light from the light irradiation portion 43 is started (FIG. 4: step S11). When the rotation mechanism 47a starts to be driven, the light irradiation unit 43 starts to rotate irregularly within a predetermined minute rotation angle centering on the rotation axis J3 (step S12). Thereafter, the relative movement of the nozzle part 421 and the light irradiation part 43 with respect to the substrate 9 and the discharge of the pattern forming material from each discharge port 422 of the nozzle part 421 are started (steps S13 and S14). Thereby, the pattern forming material is discharged onto the substrate 9 while being arranged in the X direction from the plurality of discharge ports 422, and a linear irradiation region that crosses the pattern forming material immediately after being discharged onto the substrate 9 Then, the irradiation light from the light irradiation unit 43 is irradiated.

  At this time, the light irradiation unit 43 rotates irregularly about the rotation axis J3, so that the irradiation range in the Y direction of the irradiation light irradiated on the substrate 9 (indicated by the arrow labeled R1 in FIG. 12). Is slightly changed with respect to the discharge port 422 (for example, within a range of ± 1 mm in the Y direction from the position where the rotation angle is 0 degree). Thereby, in each rib formed on the substrate 9, the time until the irradiation light is irradiated after the discharge of the pattern forming material is different in a plurality of portions in the Y direction, and the shape collapsed due to gravity or the like varies. It will be. In addition, in FIG. 12, the light irradiation part 43 at the time of rotating only a certain rotation angle is shown with the dashed-two dotted line.

  Then, when the vicinity of the end on the (+ Y) side of the substrate 9 reaches directly below the nozzle portion 421, the discharge of the pattern forming material is stopped (step S15). Thereafter, the movement of the substrate 9 is stopped (step S16), and the driving of the rotation mechanism 47a and the emission of the irradiation light from the light irradiation unit 43 are also stopped (steps S17 and S18).

  As described above, in the pattern forming apparatus having the head part 4b of FIG. 12, the light irradiation part 43 is rotated irregularly around the rotation axis J3 while the pattern forming material is discharged from the nozzle part 421. By moving, the irradiation region of the irradiation light minutely moves irregularly with respect to the discharge port 422 with respect to the relative movement direction of the nozzle portion 421 with respect to the substrate 9 and is discharged onto the substrate 9 from the plurality of discharge ports 422. The irradiation range in the moving direction of the irradiation light with respect to the entire pattern forming material immediately after is changed irregularly. As a result, the widths of the ribs on the substrate 9 at a plurality of positions in the Y direction can be irregularly varied, and unevenness of the rib pattern on the substrate 9 can be suppressed. It should be noted that all ribs formed on the substrate 9 have substantially the same position in the Y direction where the width is minimized or maximized. Further, the method of moving the irradiation region of the irradiation light minutely with respect to the ejection port 422 may be realized by providing a mechanism for moving the light irradiation unit 43 in the Y direction with respect to the nozzle unit 421, for example.

  As described above, in the pattern forming apparatus according to the first to third embodiments, irradiation light on the substrate 9 and the discharged pattern forming material while the pattern forming material is discharged from the nozzle portion 421. Irregularly changing the illumination distribution, illumination intensity, or irradiation range in the moving direction of the irradiation light on the pattern forming material in almost the entire irradiation area of the pattern, the unevenness of the rib pattern is suppressed. It is not always necessary to change the illumination distribution, the illumination intensity, or the irradiation range in the moving direction of the light.

  For example, in the pattern forming apparatus 1 of FIG. 1, the mask 46 b shown in FIG. 13 may be used instead of the mask 46 of FIG. 3. In the mask 46 b, the Y direction in a plurality of rectangular regions 461 arranged two-dimensionally. The rectangular regions 461 arranged in a row are defined as rectangular region columns 462, and only the rectangular regions 461 included in some of the rectangular region columns 462a (hereinafter referred to as “specific rectangular region columns 462a”) have irregularly changed transmittance. In the remaining rectangular area row 462, the transmittance of each rectangular area 461 is constant. Further, in the mask 46b of FIG. 13, a plurality of specific rectangular area rows 462a are provided adjacent to each other.

  In the pattern forming apparatus having the mask 46b, while the pattern forming material is discharged from the nozzle portion 421, the specific rectangular region row 462a is substantially arranged in the irradiation region of the irradiation light on the substrate 9 and the discharged pattern forming material. The illuminance distribution of the irradiation light on the pattern forming material is irregularly changed in a plurality of partial regions arranged in the X direction that are opposed to each other. Thereby, in each rib whose position is included in the range of the partial region with respect to the X direction, the width in the X direction changes irregularly at a plurality of portions in the Y direction, and in this case also, the rib is formed on the substrate 9. It is possible to suppress unevenness of the rib pattern. However, when the illuminance distribution is irregularly changed over time only in a plurality of partial regions in this way, from the viewpoint of appropriately suppressing unevenness of the rib pattern, the total number of ribs formed on the substrate 9 Of these, the width is preferably irregularly changed in the Y direction in the number of ribs of 30% or more (preferably 50% or more), and more preferably, a plurality of (for example, 3) the illuminance distribution is irregularly changed. The above partial areas are evenly arranged in the X direction in the irradiation area.

  Further, a mask 46c shown in FIG. 14 may be used instead of the mask 46b of FIG. 13, and in the mask 46c of FIG. 14, the specific rectangular region rows 462a are provided apart from each other. In this case, while the pattern forming material is being discharged from the nozzle portion 421, the region substantially opposite to the specific rectangular region row 462a in the irradiation region of the irradiation light on the substrate 9 and the discharged pattern forming material. In the plurality of partial regions arranged in the X direction, the illuminance of the irradiation light on the pattern forming material is irregularly changed, and unevenness of the pattern of the ribs formed on the substrate 9 can be suppressed. It becomes possible. In the masks 46b and 46c in FIGS. 13 and 14, it is preferable that the transmittances at the respective positions in the Y direction are irregularly different from each other in the plurality of specific rectangular region rows 462a, but the plurality of specific rectangular region rows 462a. Even in the case where the transmittance at each position in the Y direction is the same, as long as the transmittance changes irregularly at a plurality of positions in the Y direction, it is possible to suppress unevenness of the rib pattern on the substrate 9. Is possible.

  Further, as shown in FIG. 15, the light irradiation unit 43 is provided as a set of a plurality of irradiation blocks 430, and each of some irradiation blocks (indicated by reference numeral 430a in FIG. 15). 10 is provided, the other irradiation block 430 is fixed to the nozzle portion 421, and the irradiation block 430a is irregularly moved in the Z direction when the rib pattern is formed. Pattern formation is performed in a plurality of partial regions (in this case, the plurality of partial regions occupy an area of approximately 50% of the irradiation region) that are substantially opposed to the irradiation block 430a in the irradiation region irradiated with the irradiation light. The illuminance of the irradiation light on the material may be changed irregularly.

  FIG. 16 is a diagram showing a head portion 4c of a pattern forming apparatus according to still another example. In the head part 4c of FIG. 16, the light irradiation part 43 (in the light irradiation part 43 shown in FIG. 16, the upper part is thicker in the Y direction than that of FIG. 2) is set in the normal direction of the substrate 9 (that is, A rotation mechanism 47b that rotates about a rotation angle irregularly around a rotation axis J4 parallel to the (Z direction) is provided.

  FIG. 17 is a diagram for explaining the rotation operation of the light irradiation unit 43. In FIG. 17, the irradiation area of the irradiation light on the substrate 9 is indicated by a broken-line rectangle denoted by reference numeral B <b> 1, and the irradiation area B <b> 1 when the light irradiation unit 43 is rotated by a certain angle is also indicated by a two-dot chain line. .

  As shown in FIG. 17, the irradiation region B1 of the irradiation light from the light irradiation unit 43 is a pattern forming material immediately after being discharged onto the substrate 9 from the plurality of discharge ports 422 (in FIG. 17, the substrate is indicated by a two-dot chain line). The pattern forming material 80 ejected on the substrate 9 is shown in a line that crosses the surface. As shown by the solid line and the two-dot chain line in FIG. The range in the Y direction changes greatly as the distance from the rotation axis J4 increases as the distance from the rotation axis J4 increases in the portion away from the rotation axis J4 with respect to the X direction due to the rotation of the light irradiation unit 43. Then it hardly changes.

  As described above, in the pattern forming apparatus having the head portion 4c of FIG. 16, while the pattern forming material is discharged from the nozzle portion 421, the rotation mechanism 47b focuses the irradiation region B1 of the irradiation light around the rotation axis J4. The partial region corresponding to each discharge port 422 that is separated from the rotation axis J4 in the X direction in the irradiation region B1 of the irradiation light on the substrate 9 and the discharged pattern forming material by irregularly rotating slightly. The irradiation range in the Y direction of the irradiation light on the pattern forming material is irregularly changed. Thereby, unevenness of the pattern of the ribs formed on the substrate 9 can be suppressed.

  As described above, in the pattern forming apparatus, the mask moving mechanism 45 in FIG. 2, the mask moving mechanism 45 a in FIG. 7, while the pattern forming material is discharged from the nozzle portion 421 that moves relatively along the substrate 9. The motor 436 in FIG. 9, the cylinder mechanism 47 in FIG. 10, the power source 437 in FIG. 11, the rotation mechanism 47a in FIG. 12, and the rotation mechanism 47b in FIG. 9 and irradiation on the pattern forming material in almost the entire irradiation region of the irradiation light on the discharged pattern forming material or in a plurality of partial regions arranged in a direction perpendicular to the moving direction in the irradiation region. The illuminance distribution, the illuminance, or the irradiation range in the moving direction is irregularly changed, and the unevenness of the rib pattern formed on the substrate 9 is suppressed. Depending on the design of the pattern forming apparatus, it is possible to irregularly change the illuminance distribution and irradiation range of the irradiation light, or both the illuminance and irradiation range.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made.

  For example, the pattern formed by the pattern forming apparatus may be a lattice pattern. FIG. 18 is a view showing a part of the lattice-like pattern 8a, and FIG. 19 is a longitudinal sectional view of the pattern 8a at the position of the arrow AA in FIG. When the lattice pattern 8a is formed, first, a pattern composed of a plurality of stripe-shaped ribs 81a is formed on the substrate 9, and then the nozzle portion 421 has a different pitch of the discharge ports 422. The pattern of the plurality of pattern elements 81b is formed on the rib 81a by changing the orientation of the substrate 9 by 90 degrees (however, the nozzle portion 421 is provided so as not to interfere with the rib 81a on the substrate 9). And the distance between the substrate 9 and the substrate 9 is adjusted). Then, the pattern 8a is baked to form, for example, a rib for a plasma display device. Even when the ribs 81a and 81b are formed, as in the first to third embodiments, the illuminance distribution, illuminance, or irradiation range in the movement direction of the irradiated light on the discharged pattern forming material By irregularly changing over time, it is possible to suppress unevenness of the lattice-shaped rib pattern 8 a formed on the substrate 9.

  The photocurable pattern forming material used for pattern formation may have a curability for light in a wavelength band other than ultraviolet rays. In this case, the light emitted from the light irradiation unit 43 includes the wavelength band. The pattern forming material preferably contains a low softening point glass frit, but other materials can be used depending on the use of the substrate on which the pattern is formed. The pattern forming material is fired after the pattern is formed. May not be performed.

  In the pattern forming apparatus, the substrate 9 on the stage 20 moves in the Y direction with respect to the head unit, but the head unit may move in the Y direction with respect to the substrate 9. That is, the movement of the nozzle part 421 and the light irradiation part 43 in the Y direction with respect to the substrate 9 in the pattern forming apparatus may be relative.

  Further, the pattern forming apparatus may be used for forming a spacer pattern on a substrate for a field emission display, and is used for a glass substrate, a circuit board, a ceramic substrate, a semiconductor other than the display device. It may be used when a pattern is formed on a substrate or the like. In the pattern forming apparatus, it is possible to form a pattern composed of a plurality of linear pattern elements arranged at equal pitches in one direction while suppressing unevenness of the pattern on various substrates. .

It is a figure which shows the structure of the pattern formation apparatus which concerns on 1st Embodiment. It is a figure which expands and shows the tip vicinity of a nozzle part and a light irradiation part. It is a figure which shows a part of mask. It is a figure which shows the flow of the operation | movement which forms a rib pattern on a board | substrate. It is a top view which shows the rib formed on a board | substrate. It is a figure which shows the relationship between the transmittance | permeability of a resin film, and a wavelength. It is a figure which shows the other example of a mask moving mechanism. It is a figure which shows the other example of a mask. It is a figure which shows the structure of the light source unit which concerns on 2nd Embodiment. It is a figure which shows the other example of a head part. It is a figure which shows the other example of a light source unit. It is a figure which shows the structure of the head part which concerns on 3rd Embodiment. It is a figure which shows the further another example of a mask. It is a figure which shows the further another example of a mask. It is a figure which shows the other example of a light irradiation part. It is a figure which shows the further another example of a head part. It is a figure for demonstrating rotation operation | movement of a light irradiation part. It is a figure which shows a part of lattice-like pattern. It is sectional drawing of a grid | lattice-like pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern formation apparatus 2 Stage moving mechanism 8, 8a Pattern 9 Substrate 43 Light irradiation part 45, 45a Mask moving mechanism 46, 46a-46c Mask 47 Cylinder mechanism 47a, 47b Rotating mechanism 80 Pattern forming material 81, 81a, 81b Rib 421 Nozzle part 422 Discharge port 436 Motor 437 Power supply B1 Irradiation area

Claims (6)

A pattern forming apparatus for forming a pattern on a substrate,
A nozzle part for discharging a pattern forming material having photocurability from a plurality of discharge ports onto a substrate;
A light irradiation unit for irradiating the pattern forming material discharged on the substrate with irradiation light;
While the pattern forming material is discharged from the nozzle portion, the nozzle portion and the light irradiation portion move relatively and continuously with respect to the substrate while the nozzle portion is advanced in the moving direction along the substrate. A moving mechanism for forming on the substrate a pattern composed of a plurality of linear pattern elements arranged at an equal pitch with respect to a direction perpendicular to the moving direction;
While the pattern forming material is discharged from the nozzle portion, the irradiation region of the irradiation light on the substrate and the pattern forming material is almost entirely or in a direction perpendicular to the moving direction in the irradiation region. In the plurality of partial regions that are arranged, the illumination light changing unit that irregularly changes the illumination intensity of the illumination light on the pattern forming material, the illumination distribution, or the illumination range in the moving direction;
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 1,
The irradiation light changing unit irregularly changes the distribution of transmittance of a mask disposed on the optical path between the light irradiation unit and the substrate while the pattern forming material is discharged from the nozzle unit. A pattern forming apparatus characterized by being a mechanism. The pattern forming apparatus according to claim 2,
The pattern forming apparatus, wherein the mask is moved in parallel with the substrate to change the transmittance distribution of the mask on the optical path. The pattern forming apparatus according to claim 1,
The irradiation region on the substrate of the irradiation light from the light irradiation unit is a line that crosses the pattern forming material,
The irradiation light changing unit irregularly minutely moves the irradiation region with respect to the plurality of discharge ports in the movement direction while the pattern forming material is discharged from the nozzle unit, or A pattern forming apparatus, characterized in that it is a mechanism that irregularly rotates about a rotation axis parallel to the normal direction of the substrate. The pattern forming apparatus according to claim 1,
The pattern forming apparatus, wherein the irradiation light changing unit is a mechanism that irregularly moves the light irradiation unit in a normal direction of the substrate while a pattern forming material is discharged from the nozzle unit. The pattern forming apparatus according to any one of claims 1 to 5,
The fluctuation range of the illuminance of the irradiation light irregularly changed by the irradiation light changing unit is 2% to 10% of an average value of spatial and temporal illuminance in the irradiation region, Pattern forming apparatus.

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