JP2008117665A - Flat wiring connector soldered to electronic substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector having a structure in which heat is hardly transmitted to a terminal main body at soldering, and which is improved in connection reliability without melting a base of a membrane circuit, without requiring a component such as a male housing, and reducing connection parts. <P>SOLUTION: The connector has a terminal main body 3 having a membrane connection part 2 for connecting to a membrane circuit 10 and a tongue piece 4 in which one end side of this terminal main body 3 is bent. The bent portion of this tongue piece 4 and its vicinity form a flat connecting part 5 and this connection part 5 is extended to form both wing parts 6A, 6B, which form a soldering portion 6 of U-shape having a larger width and area than the connecting part 5. The connecting part 5 and the soldering portion 6 are inserted into a slit 21 of U-shape formed in an electronic substrate 20, and thereby the soldering portion 6 is soldered on the rear side of the electronic substrate 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flat wiring connector that is soldered to an electronic substrate in order to connect the membrane circuit and the electronic substrate.

  Conventionally, when a membrane circuit attached to a terminal fitting is to be connected directly to an electronic board by soldering, the surface area of the terminal is large, so the temperature of the solder connection does not rise due to the heat dissipation effect, and it must be heated for a long time. It was. Therefore, the heat of the terminal melts an insulator such as PET that forms the base of the membrane circuit, making soldering difficult (see Patent Document 1).

As shown in FIG. 7, the terminal fitting as shown in Patent Document 1 constitutes a female housing 101 having a female terminal 100 (having an insertion port into which a male terminal is inserted). Since it is difficult to connect the membrane circuit 102 to the terminal board and solder the terminal fitting itself to the electronic board 200, the male housing 202 containing the male terminal 201 is attached to the electronic board 200, and the female terminal is connected to one end of the male terminal 201. 100 was connected, and the method of soldering the other end of the male terminal 201 to the electronic substrate 200 was considered.
JP 2006-172751 A (page 3, FIG. 1)

  With the device described in Patent Document 1, it is difficult to solder the terminal fitting to the electronic board. In the conventional example in which the male housing 202 is attached to the electronic board 200, the number of parts increases, the number of processing steps increases, and the cost increases. It led to up. Further, in the case where the male housing 202 is used, there are many connection points, and there is a possibility that the connection reliability is lowered.

  Therefore, the present invention has a structure in which the heat is not easily transmitted to the terminal body when soldering, does not melt the base of the membrane circuit, eliminates the need for parts such as a male housing, and reduces the number of connection points. An object of the present invention is to provide a flat wiring connector soldered to an electronic board with improved connection reliability.

  In order to achieve the above-mentioned object, the present invention has a terminal body provided with a membrane connecting part for connecting to a membrane circuit, and a tongue piece obtained by bending one end side of the terminal body, and the bent portion of the tongue piece is provided. And its vicinity are formed in a flat crossover part, and this crossover part is extended to form both wing parts to form a U-shaped soldering part having a larger width and area than the crossover part, and formed on the electronic substrate The crossing portion and the soldering portion are inserted into the U-shaped slit, and the soldering portion is soldered on the back surface of the electronic substrate.

  According to the present invention, a terminal body having a membrane connecting portion for connecting to a membrane circuit and a tongue piece obtained by bending one end side of the terminal body are formed, and the bent portion of the tongue piece and the vicinity thereof are flat. In addition to forming the crossover portion, the crossover portion is extended to form both wings to form a U-shaped soldering portion having a width and area larger than that of the crossover portion. Since the crossing part and the soldering part are inserted into the slit so that the soldering part can be soldered on the back side of the electronic board, the area of the U-shaped soldering part is larger than that of the crossing part. When doing so, the heat tends to be trapped in the soldered portion, and is difficult to be transmitted to the terminal body. Therefore, soldering can be performed in a short time, and damage to the PET or the like that forms the base of the membrane circuit can be avoided. In addition, since the connector is soldered directly to the electronic board without using male housing or other parts as in the past, not only can the number of parts and processing man-hours be reduced, but also the number of connection points is reduced. Connection reliability is also improved.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a flat wiring connector 1, which is bent in the Z direction from one end of the terminal body 3 provided with a membrane connecting portion 2 for connecting to a membrane circuit 10 to be described later. The tongue piece 4 is formed. The bent portion of the tongue piece 4 and its vicinity are formed in a flat crossover portion 5, and this crossover portion 5 is extended to form a U-shaped soldering portion 6 having both wing portions 6A and 6B. The width and area in the X direction where both wings 6A and 6B of the soldering part 6 are opened are formed larger than the width and area of the crossover part 5.

  The soldering portion 6 of the flat wiring connector 1 has a thickness of 0.2 mm and a height (vertical direction of both wing portions 6A and 6B) of 1.9 mm. The connector 1 is made of a highly conductive material.

  2, the soldering portion 6 and the crossover portion 5 are inserted into the U-shaped slit 21 of the electronic substrate 20 shown in FIG. 3, and the soldering portion 6 is soldered to the electronic substrate 20 on the back surface side of the electronic substrate 20. A state (solder part 30) is shown. As will be described later, an insulating film 10A is provided on the back surface of the membrane circuit 10 and a reinforcing plate 11 attached to the back surface of the film 10A is connected by the membrane connecting portion 2.

  FIGS. 4 and 5 show another embodiment of the present invention, which is for enabling the connector 1 to be soldered on the surface of the electronic board 20, and the connecting portion 5 extending straight from the terminal body 3 is shown in FIG. As shown in FIG. 1, the soldering part 6 was formed so as to extend flat in the Y direction without being bent in the Z direction, and to have a larger width and area than the transition part 5 at the tip of the transition part 5. The soldering portion 6 and the crossover portion 5 are located on the same flat surface.

  FIG. 6 is a perspective view showing the details of the membrane connecting portion 2 of the connector 1, and an insulating film 10A is provided on the back surface (non-printing surface) of the membrane circuit 10, and a part of the back surface of the film 10A is made of a hard resin. A reinforcing plate 11 is attached, and a plurality of holes 12 for fixing terminals are formed so as to penetrate the reinforcing plate 11 and the membrane circuit 10. A membrane fixing hole 13 is also formed. The barrel 2A of the membrane connecting portion 2 of the connector 1 is passed from the bottom of the hole 12, bent at the top, and the plate 2B is fixed. A convex portion (not shown) is formed on the lower surface of the plate 2B, and comes into contact with the printed surface of the membrane circuit 10. The reinforcing plate 11 is fixed to the base 2C (see FIG. 5) on which the barrel 2A is formed. And the connection of the membrane circuit 10 and the connector 1 is reliable.

The perspective view which shows the connector of this invention. The side view which shows the state which attached the connector of FIG. 1 to the electronic substrate. The top view of an electronic substrate. The top view which shows other embodiment. The side view of FIG. The perspective view which shows the detail of a membrane connection part. The perspective view which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Connector for flat wiring 2 Membrane connection part 3 Terminal body 4 Tongue piece 5 Transition part 6 Soldering part 6A, 6B Both wing parts 10 Membrane circuit 20 Electronic board 21 Slit

Claims (2)

A terminal body provided with a membrane connecting portion for connecting to a membrane circuit, and a tongue piece bent at one end of the terminal body;
The bent portion of the tongue piece and the vicinity thereof are formed in a flat crossover portion, and the crossover portion is extended to form both wing portions so that a U-shaped soldering portion having a larger width and area than the crossover portion is formed. Forming,
Soldered to the electronic board, wherein the soldering part is soldered on the back surface of the electronic board by inserting the crossing part and the soldering part into the U-shaped slit formed on the electronic board. Flat wiring connector.   The tongue piece according to claim 1 is not bent but extends straight from the terminal main body to form a crossing portion and a soldering portion, and both the wing portions are not bent and the soldering portion is formed flat, and the soldering portion is formed on the electronic substrate. A flat wiring connector soldered to an electronic board, characterized by being soldered to the surface of the wire.

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