JP2008114347A - Planar base material cutting device and manufacturing method of plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide plate cutting device and plate manufacturing method for cutting a base material into a required dimension without causing lowering of quality such as burrs, whitening and deformation of a cutting surface. <P>SOLUTION: This cutting device cuts a planar base material into plate of a prescribed size. The cutting device is provided with at least a rotary blade travelable in a cutting direction and a supporting base arranged with a prescribed space from a cutting edge of the rotary blade. A cutting edge side opposed surface of the supporting base is made a curved surface swollen toward the cutting edge side. In this manufacturing method, the planar base material is introduced into a gap of the rotary blade and the supporting base arranged oppositely to the rotary blade, and the base material is cut by the rotary blade. In the method, the base material is cut by traveling the rotary blade, while holding the base material in a warped state along the cutting edge side opposed surface on the supporting base having the cutting edge side opposed surface formed into a curved shape swollen to the cutting edge side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plate-like substrate cutting device and a plate material manufacturing method. More specifically, the present invention relates to a cutting apparatus and a manufacturing method for manufacturing a plate material of a predetermined size by cutting a plate-like base material.

  Cutting machines equipped with rotating blades called running saws and panel saws (hereinafter simply referred to as “cutting devices”) are suitable for cutting long substrates, and are widely used in the plastic processing and furniture industries. in use. For example, Patent Document 1 discloses a cutting device with excellent cutting accuracy.

  However, in the conventional cutting apparatus, an excessive force is applied to the base material due to the contact pressure of the rotary blade at the time of cutting, and burr and burrs appear on the cut surface, and the appearance of the product may be impaired. In addition, when the periphery of the cut surface is whitened (whitening phenomenon), or particularly when a processed substrate having a hollow multilayer structure is cut, the hollow portion is crushed and deformed, and the appearance of the product is impaired. In addition, the strength of the product may be significantly reduced, causing quality problems.

Further, in the conventional cutting apparatus, a large amount of fine chips are generated at the time of cutting, and the chips are charged with static electricity and may be scattered, floated around, or attached to the product. Chips scattered and floated around not only require a lot of labor for cleaning, but also adhere to machinery and cause a failure or a worsening working environment. In addition, a great deal of labor is required to remove the chips adhering to the product, especially when cutting a processed substrate having a hollow multilayer structure, the chips enter the hollow interior from the cut surface. It was impossible to remove it.
JP-A-3-287308

  In view of the problems of the above-described conventional cutting apparatus, the present invention cuts a base material to a necessary size without generating chips and causing quality degradation such as burr, burr, whitening, and deformation of the cut surface. The main object is to provide a plate material cutting apparatus and a plate material manufacturing method.

  In order to solve the above problems, in the present invention, first, an apparatus for cutting a plate-like base material into a plate material of a predetermined size, the rotary blade capable of traveling in the cutting direction, the cutting edge of the rotary blade, and a predetermined And a support table disposed at a distance from each other, and a plate material cutting device in which a cutting edge side facing surface of the support table is a curved surface that bulges toward the cutting edge side is provided.

  Here, the “curved surface that bulges toward the cutting edge side” means a curved surface shape in which the entire cutting edge side facing surface of the support base is bent toward the cutting edge side, or a part of the cutting edge side facing surface protrudes toward the cutting edge side. The shape and the like can be widely included.

  The cutting apparatus includes a base material holding unit that holds the base material placed on the support base. The base material holding means holds the base material in a warped state along the cutting edge side facing surface on a support base having a curved surface shape in which the cutting edge side facing surface bulges toward the cutting edge side. In this way, by holding the base material in a state of being warped toward the blade edge side and performing the cutting with the rotary blade, it is possible to reduce the contact pressure of the rotary blade applied to the base material.

  Further, the rotary blade of this cutting device is configured to cut the substrate while rotating by a self-supporting drive means. If a rotating blade that does not have a self-supporting drive means is adopted, the substrate will be cut while the rotating blade is pressed against the substrate surface and rotated by friction with the substrate surface. In that case, a strong pressure is applied to the substrate surface by the rotary blade. Therefore, it has been devised to reduce the contact pressure of the rotary blade applied to the substrate by rotating the rotary blade with the self-supporting drive means.

  Further, the cutting operation is performed in a plurality of stages by causing the rotary blade to run a plurality of times on the cutting line of the base material. Thereby, the contact pressure of the rotary blade applied to the base material can be reduced as compared with the case where the rotary blade is caused to travel only once in one direction and the entire layer of the base material is cut. In addition, it is possible to prevent part of the base material from being left uncut.

  In addition to these configurations, this cutting apparatus employs a round thin blade with an arcuate cutting edge as a rotating blade, and is devised so that chips are not generated during cutting.

  Next, the present invention is a method for introducing a plate-like base material into a gap between a rotary blade and a support table arranged opposite to the rotary blade, and cutting the base material with the rotary blade, the cutting edge side On the support base having a curved surface shape in which the opposing surface bulges toward the blade edge side, while holding the base material in a state of being warped along the blade edge side opposing surface, the rotary blade is caused to travel to move the base material. The manufacturing method of the board | plate material which carries out a cutting process is provided.

  Here, the "curved surface shape that bulges toward the blade edge" means a curved surface shape in which the entire blade edge side facing surface of the support base is curved toward the blade edge side, or a shape in which a part of the blade edge side facing surface protrudes toward the blade edge Etc. can be widely included.

  As already described, by holding the base material in a state of being warped toward the blade edge side and performing cutting with the rotary blade, the contact pressure of the rotary blade applied to the base material can be reduced.

  By using the plate-like substrate cutting apparatus and plate material manufacturing method according to the present invention, the contact pressure of the rotary blade applied to the substrate at the time of cutting can be reduced, and the cut surface burr, burr, whitening, deformation, etc. It is possible to produce a plate material by cutting the base material into the required dimensions without causing a deterioration in quality.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments for carrying out the invention will be described with reference to the drawings. In addition, embodiment described below shows an example of typical embodiment of this invention, and, thereby, the range of this invention is not interpreted narrowly.

  First, based on FIG.1 and FIG.2, the whole structure of the board | plate material cutting device which concerns on this invention is demonstrated. FIG. 1 is a front view of the plate material cutting apparatus A, and FIG. 2 is a side view seen from the direction of arrow P in FIG.

  1 and 2, the plate material cutting device indicated by reference symbol A includes a rotary blade 1, a support base 2, and a base material pressing plate 3 as a base material holding means in a cutting work part. These structures can be made of metal, and other materials such as resin can be adopted as necessary. Regarding the plate material cutting apparatus A, the materials described below are not particularly limited.

  The base material B, which is an object to be cut, is introduced into the apparatus in the direction of arrow R by the conveying means 4 (see FIG. 1). The base material B is held by the base material pressing plate 3 at a portion placed on the support base 2, and is cut by the rotary blade 1 that travels in the cutting direction (arrow Q in FIG. 2). The cut base material B is carried out of the apparatus in the direction of arrow R by the conveying means 4. About the conveyance means 4, it is possible to employ | adopt widely the conveyance means normally used, such as a belt conveyor and a roller conveyor.

  Next, based on FIG. 3, the structure of the cutting operation part of the board | plate material cutting device A is demonstrated in detail.

  As described above, the plate material cutting apparatus A includes the rotary blade 1, the support base 2, and the base material pressing plate 3 in the cutting work unit, and places the base material B introduced from the outside of the apparatus on the support base 2. Then, it is cut by the rotary blade 1 while being held by the substrate pressing plate 3. In FIG. 3, the configuration other than the rotary blade 1 is shown as a cross-sectional view.

  The rotary blade 1 employs a round thin blade having an arcuate cutting edge 11 (see also FIG. 4 described later). Usually, rotary blades used in cutting devices include a circular saw blade with a saw blade and a thin blade with a thin blade edge like a knife or knife. Since a large amount of chips corresponding to the thickness of the material is generated, a round thin blade that does not generate chips is employed.

  The support table 2 has a cutting edge-side facing surface 22 having a curved surface shape that bulges toward the cutting edge 11 of the rotary blade 1. Here, the “curved surface shape that bulges toward the blade edge 11 side” is not only a curved surface shape in which the entire blade edge facing surface 22 of the support base 2 is curved toward the blade edge as shown in FIG. Widely includes a shape in which only a part of the surface 22 (particularly a portion directly below the blade edge 11) is protruded toward the blade edge 11 side, and the base material B held on the support base 2 is formed on the blade edge 11 as described below. Any shape that can be held in a state along the direction can be employed.

  With the configuration of the support base 2, the base material B held by the support base 2 and the base material pressing plate 3 is held in a state of being warped along the shape of the blade-side facing surface 22 of the support base 2. It becomes. In this way, by holding the base material B in a state of warping toward the cutting edge 11 of the rotary blade 1, it is possible to apply a tension for self-cleaving to the cut surface of the base material B. The applied contact pressure of the rotary blade 1 can be dispersed and reduced. Therefore, the occurrence of burr, burr, whitening, deformation and the like of the cut surface of the base material B can be effectively prevented.

  The structure of the base material pressing plate 3 and the method of holding the base material B by the base material pressing plate 3 and the support base 2 are configured such that the base material presser plate 3 can be moved up and down and introduced onto the support base 2. A method of pressing and holding the substrate B is conceivable. In addition to this, any configuration and holding method that can hold the base material B in a warped state along the shape of the cutting edge side facing surface 22 of the support base 2 can be adopted without any particular limitation. .

  Next, a traveling method during the cutting operation of the rotary blade 1 will be described based on FIG. 4 in addition to FIG. 3. FIG. 4 is a side view of the rotary blade 1 and its periphery as seen from the direction of arrow S in FIG. 4 corresponds to FIG. 3 (excluding the rotary blade 1). In FIG. 4, the product pressing plate 3 is not shown.

  The rotary blade 1 includes a driving means indicated by reference numeral 12 in FIG. 3 and is configured to be able to rotate independently. Moreover, it is latched by the traveling rail 5 through the traveling unit shown by the code | symbol 13, and it is set as the structure which can drive | work on the traveling rail 5 in a cutting | disconnection direction (arrow Q in FIG. 4). Here, the traveling unit 13 is powered by the driving means 51 (see FIG. 2), but the position where these driving means are provided, including the driving means 12, is not particularly limited. In addition, commonly used driving means such as a motor, a rack, and a pinion can be widely used.

  By rotating the rotary blade 1 in a self-rotating manner and cutting in the cutting direction Q (see also FIGS. 4 and 2), the rotary blade 1 is cut while being passively rotated by friction with the base material B. In comparison, since the contact pressure of the rotary blade 1 applied to the base material B can be reduced, occurrence of burr, burr, whitening, deformation and the like can be effectively prevented.

  Here, when cutting is performed while pressing the rotary blade 1 against the surface of the substrate and passively rotating it by friction, the rotational speed of the rotary blade 1 is equal to the traveling speed in the cutting direction Q. Accordingly, even when the rotary blade 1 is rotated independently, when the rotational speed of the rotary blade 1 is set to be equal to or less than the traveling speed in the cutting direction Q, the rotary blade 1 is pressed against the surface of the substrate and passively caused by friction. A large contact pressure is applied to the substrate as in the case of rotating the substrate. Therefore, it is desirable that the rotational speed of the rotary blade 1 be equal to or higher than the traveling speed in the cutting direction Q. That is, when the self-supporting rotational drive is not performed, a whitening phenomenon occurs on the cut surface. Further, when the rotating blade 1 was given a rotational speed twice as high as the traveling speed, problems such as whitening did not occur. However, when the rotational speed exceeds several tens of times the traveling speed, there is a possibility that problems such as dissolution of the base material due to frictional heat with the base material may occur.

  Moreover, in the board | plate material cutting device A, the system which makes the rotary blade 1 drive | work several times in the cutting direction Q and cut | disconnects the base material B is employ | adopted, and the system which divides | segments a cutting operation into several steps is employ | adopted. . Thereby, the contact pressure of the rotary blade 1 applied to the base material B can be reduced as compared with a method of cutting the entire layer of the base material B by causing the rotary blade 1 to travel only once in one direction.

Here, as an example of a base material that can be suitably cut by the plate material cutting apparatus A, FIG. 5 (A) shows two pieces of pins on a truncated cone (b in FIG. 5) arranged in a staggered lattice. A hollow honeycomb structure board (so-called synthetic resin cardboard) B in which resin sheets are welded at the tips of pins b is shown. In such a processed base material having a hollow multilayer structure, when the contact pressure of the rotary blade 1 is too large, the hollow portion is crushed and deformed, not only the appearance of the product is impaired, but also the strength of the product is significantly reduced. This will cause quality problems. Thus, upon cleavage of the hollow honeycomb structure structural board B, for example, as shown in FIG. 5 (B), the upper layer B ₁ of the hollow honeycomb plate B is cut by running a rotary blade 1 is first in the cutting direction Q _1, the following the rotary blade 1 is run in the cutting direction Q ₂ to perform a two-step cutting operations such as cutting the lower layer B _2, to reduce the contact pressure of the rotary blade 1, effectively deformation of the hollow portion It becomes possible to prevent. Of course, depending on the internal structure of the base material, the cutting operation may be performed in two or more stages.

  As described above, the plate material cutting apparatus A can cut the base material without causing quality deterioration such as burr, burr, whitening, deformation, etc. of the cut surface and without generating chips. At the same time, the plate material manufacturing method according to the present invention (claims 7 and 8) can be carried out.

  In the board material cutting apparatus A and the board material manufacturing method according to the present invention, the base material that can be suitably cut is not limited to the synthetic resin cardboard such as the above-described hollow honeycomb structure board B, but is made of paper cardboard or wood plywood. And various substrates such as a resin plywood and a plywood having a hollow structure among them.

  Next, a plate material manufacturing system using the plate material cutting apparatus A will be described.

  2. Description of the Related Art Conventionally, in the plastic processing industry, a plate material manufacturing system in which a base material cutting apparatus is connected to a base material extrusion molding apparatus is used.

  In a conventional plate material manufacturing system, a base material extruded from an extrusion molding apparatus is introduced into a cutting apparatus by a predetermined length to perform cutting. Therefore, until the cutting of the predetermined length of the base material introduced into the cutting device is completed, it is necessary to keep the base material extruded from the extrusion molding device at any time on the production line. It was a factor to decrease.

  In order to prevent a reduction in production efficiency due to the base material being in a standby state on the production line, it is effective to run the cutting device in a synchronized manner together with the base material moving on the production line. That is, the cutting device is allowed to perform the cutting operation while being synchronized with the moving base material, and is returned to the initial position after completion of the cutting, and then the cutting operation is performed while being synchronized with the next cutting portion again. By repeatedly performing a series of operations, the retention of the base material on the production line can be eliminated.

  However, in the conventional plate material manufacturing system, in order to realize such a synchronized running of the cutting device, the cutting device is integrated with the base material by pressing and holding the base material with a product holding plate provided in the cutting device. The cutting device itself did not have the ability to run independently in the direction of the production line. Therefore, when slip occurs between the product holding plate and the base material, it causes a variation in the cut length of the product after cutting.

  Therefore, in the present invention, the cutter table 6 (see FIGS. 1 and 2) is allowed to run on the guide rail 61 so as to improve the accuracy of the cutting length. The cutter table 6 is powered by the driving means 62 (see FIG. 1) and travels on the guide rail 61 in the production line direction. The drive means 62 is not particularly limited in position, and commonly used drive means such as a motor, a rack, and a pinion can be widely used.

  In the cutting apparatus A, the cutter base 6 runs in the direction of arrow R in FIG. 1 in synchronization with the introduction speed of the base material B into the apparatus. For this reason, the base material introduction speed to the plate material cutting apparatus A is measured, the introduction speed measurement means for outputting the introduction speed result signal, and the introduction speed result signal is received, and the traveling speed of the cutter table 6 is controlled. A plate material manufacturing system has been devised comprising at least a cutter table control means. FIG. 6 shows a conceptual diagram of the plate material manufacturing system.

  As shown in FIG. 6, in this board | plate material manufacturing system, the base material discharged | emitted from a shaping | molding apparatus is introduce | transduced into the cutting apparatus A by the conveyance means used normally. At this time, in step S1, the introduction speed measuring means measures the introduction speed of the base material into the cutting apparatus A. Next, in step S2, the introduction speed measuring means outputs the obtained introduction speed result signal to the cutter table control means. Next, in step 3, the cutter table control means controls the traveling speed of the cutter table based on the received introduction speed result signal. Here, the introduction speed measuring means and the cutter base control means may be configured separately from the cutting apparatus A as shown in (A), or as an integral part of the cutting apparatus A as shown in (B). May be.

  Next, a specific method for controlling the traveling speed of the cutter table 6 by the cutter table control means will be described with reference to FIG. FIG. 7 is a diagram schematically showing the cutter table 6, the rotary blade 1, and the base material B of the cutting apparatus A.

FIG. 7A is a schematic diagram showing the initial positions of the cutter base 6 and the rotary blade 1 before starting the cutting of the base material B. FIG. The base material B is assumed to be introduced in the direction of arrow R, and the introduction speed of the base material B measured by the introduction speed measuring means is assumed to be V _B. At this time, the cutter table control means causes the cutter table 6 to travel in the arrow R direction at a traveling speed V ₆ equal to the introduction speed V _B.

When the substrate B cutting operation of the rotary blade 1 is completed (see FIG. 7B), the cutter table 6 returns to the initial position (dotted line in FIG. 7B) and waits for the next substrate cutting site. Then, the cutting work is performed while traveling in synchronization again. In Figure 7, the round trip of the rotary blade 1 is indicated by arrows Q ₁ and Q _2, and illustrates a case where the cutting operation of the substrate B. The cutter base 6 manufactures a product having a uniform cutting length by repeating the above operation.

  INDUSTRIAL APPLICABILITY The present invention can be used in the plastic processing industry and the furniture industry for cutting long processed substrates such as plastic extrusions and wood plywood, and in particular, a processed substrate having a hollow multilayer structure. This is useful when cutting.

It is a front view about one embodiment of a board material cutting device concerning the present invention. 2 is a side view of a plate material cutting device A. FIG. FIG. 4 is an enlarged view of a cutting work section of the plate material cutting apparatus A (a part of which shows a cross section). It is an enlarged side view of the cutting work part of the plate material cutting device A They are the upper surface perspective view (A) and side view (B) which show an example of the base material which can be suitably cut | disconnected by the board | plate material cutting device A. FIG. 1 is a conceptual diagram of a plate material manufacturing system incorporating a plate material cutting device A. FIG. It is a schematic diagram explaining the self-supporting synchronous traveling of the cutter base.

Explanation of symbols

A plate cutting apparatus according to the present invention
B base material 1 rotating blade 11 cutting edge 12 driving means 13 traveling unit 2 support base 21 base material inlet 22 cutting edge side facing surface 3 base material pressing plate 4 conveying means 5 traveling rail 51 driving means 6 cutter base 61 guide rail 62 driving means

Claims (8)

An apparatus for cutting a plate-shaped base material into a plate material of a predetermined size,
A rotary blade capable of traveling in the cutting direction, and a support base arranged at a predetermined interval from the blade edge of the rotary blade,
The board | plate material cutting device by which the cutting edge side opposing surface of the said support stand was made into the curved surface which bulges toward the said cutting edge side.   The base material holding means which hold | maintains the said base material in the state mounted on the said support stand in the state cut | disconnected along the said blade edge | side opposing surface at the time of a cutting | disconnection. Board cutting device.   The plate material cutting device according to claim 1, wherein the rotary blade is rotated by a self-supporting drive unit.   The plate material cutting device according to claim 1, wherein the rotary blade travels a plurality of times on a cutting line of the base material. The cutting device according to claim 1, wherein a cutting edge of the rotary blade has an arc shape.   The said base material is a synthetic resin board | plate material, The board | plate material cutting device as described in any one of Claim 1 to 5 characterized by the above-mentioned. A method of introducing a plate-like base material into a gap between a rotary blade and a support table disposed opposite to the rotary blade, and cutting the base material with the rotary blade,
On the support base having a curved surface shape that bulges the cutting edge side facing surface toward the cutting edge side, while holding the base material in a state of being warped along the cutting edge side facing surface, the rotating blade is caused to travel and A method for producing a plate material by cutting a substrate. The said base material is a synthetic resin board | plate material, The manufacturing method of the board | plate material of Claim 7 characterized by the above-mentioned.

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