JP2008108566A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an anode voltage supply method having almost no risk of sparks with respect to a display device that forms an image by a collision of electrons from an electron source with a fluorescent face while the fluorescent face and an anode electrode applied with anode potential are formed internally on a front substrate and the electron source is arranged internally on a rear substrate into a matrix form. <P>SOLUTION: The display device is composed as follows. A through hole 20 is formed at the rear substrate 1. A high-voltage introduction terminal 26 is inserted into the through hole 20. The high-voltage introduction terminal 26 is electrically connected with a metal body 21. The metal body 21 is electrically connected to an anode pattern 27 of the front substrate. A conductive pattern 22 is formed around the internal through hole 20 of the rear substrate. Anode potential is applied to the anode pattern 27 and the conductive pattern 22. The through hole 20 is filled with a seal material 25 for maintaining a vacuum. By this, it is possible to suppress sparks generated near a high-voltage supply part in the rear substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flat image display device, and more particularly to an image display device in which the reliability of a high-pressure introducing portion is improved.

  Conventionally, a color cathode ray tube has been widely used as a display device excellent in high luminance and high definition. However, with the recent improvement in image quality of information processing devices and television broadcasts, there is an increasing demand for flat image display devices (flat panel displays, FPDs) that have high luminance and high definition characteristics and are lightweight and space-saving. ing.

  As typical examples, liquid crystal display devices, plasma display devices and the like have been put into practical use. In particular, a self-luminous display device using electron emission from an electron source to a vacuum (for example, an electron emission image display device, a field emission image display device, etc.) that can increase the brightness is available. In addition, various flat-type image display devices such as an organic EL display characterized by low power consumption have been put into practical use.

  Among flat image display devices, a self-luminous flat panel display is known in which electron sources are arranged in a matrix. In a self-luminous flat panel display, the cold cathode has a Spindt type, surface conduction type, carbon nanotube type, metal-insulator-metal stacked MIM (Metal-Insulator-Metal) type, metal-insulator An electron source such as a metal-insulator-semiconductor (MIS) type in which semiconductors are stacked or a metal-insulator-semiconductor-metal type is used.

  The flat-type image display device includes a rear substrate having the electron source as described above, and a phosphor layer and an anode that forms an acceleration electrode for projecting electrons emitted from the electron source onto the phosphor layer. There is known a display panel including a front substrate and a support serving as a sealing frame that seals an internal space facing both substrates in a predetermined vacuum state. An image display device is operated by combining a drive circuit with this display panel.

  In an image display device having an electron source, a plurality of first electrodes (for example, a cathode electrode and an image signal electrode) arranged in parallel in a second direction extending in the first direction and intersecting the first direction; An insulating film formed to cover the first electrode, and a plurality of second electrodes (for example, gate electrodes) extending in the second direction on the insulating film and arranged in parallel in the first direction , A scanning signal electrode), and a back substrate having an electron source provided near the intersection of the first electrode and the second electrode, the back substrate having a substrate made of an insulating material. The electrode is formed on the top.

  With this configuration, scanning signals are sequentially applied to the scanning signal electrodes in the first direction. On the substrate, the electron source is provided in the vicinity of each intersection of the scanning signal electrode and the image signal electrode. These electrodes and the electron source are connected by a feeding electrode, and current is supplied to the electron source. . Opposite to the rear substrate, a front substrate having a plurality of color phosphor layers and a third electrode (anode electrode, anode) on the opposing inner surface is provided. The front substrate is formed of a light transmissive material suitable for glass. And the support body used as a sealing frame is inserted and sealed to the bonding inner periphery of both board | substrates, and the inside formed with the said back substrate, a front substrate, and a support body is comprised in vacuum.

  The electron source has an intersection between the first electrode and the second electrode as described above, and the amount of electrons emitted from the electron source (including emission on / off) due to the potential difference between the first electrode and the second electrode. ) Is controlled. The emitted electrons are accelerated by a high voltage applied to the anode of the front substrate, and are also projected and excited by the phosphor layer of the front substrate, so that the emitted light is colored light according to the emission characteristics of the phosphor layer. Color develops.

Each electron source is paired with a corresponding phosphor layer to constitute a unit pixel. Usually red (R),
One pixel (color pixel, pixel) is composed of unit pixels of three colors of green (G) and blue (B). In the case of a color pixel, the unit pixel is also called a sub-pixel (sub-pixel).

In the flat-type image display device as described above, a plurality of spacing members (hereinafter referred to as spacers) are generally arranged and fixed in a display region surrounded by the support body between the rear substrate and the front substrate. The distance between the two substrates is maintained at a predetermined distance in cooperation with the support. This spacer
Generally, it consists of a plate-like body formed of an insulating material such as glass or ceramics, and is usually installed at a position where the operation of each pixel is not hindered.

Further, the support serving as a sealing frame is fixed to the inner peripheral edge of the rear substrate and the front substrate with a sealing member such as frit glass, and the fixing portion is hermetically sealed to form a sealing region. The degree of vacuum inside the display area formed by both the substrates and the support is, for example, 10 ⁻³ to 10 ⁻⁵ Pa.

  A first electrode lead terminal connected to the first electrode formed on the rear substrate and a second electrode lead terminal connected to the second electrode penetrate through the sealing region between the support and both substrates. In general, a support serving as a sealing frame is fixed to the rear substrate and the front substrate with a sealing member such as frit glass. The first electrode lead terminal and the second electrode lead terminal are led out through a sealing region which is an airtight attachment portion between the sealing frame and the rear substrate.

As another voltage supply means, for example, in “Patent Document 1”, an anode lead having one end pressed into contact with the anode terminal of the anode formed on the inner surface of the front panel is hermetically penetrated into the getter chamber at the other end. There is disclosed a field emission display device provided with connection means configured to be pulled out to the outside. Further, in “Patent Document 2”, image formation is configured such that an anode lead having one end connected to an anode lead-out wiring formed on the inner surface of the front panel is drawn out to the outside by airtightly penetrating the other end of the rear panel. An apparatus is disclosed.

Further, in “Patent Document 3” and “Patent Document 4”, an anode lead having one end connected to the anode terminal of the anode formed on the inner surface of the front panel and a back panel penetrating through a corner are provided. An image forming apparatus configured to be inserted into the mouth via an insulating member and pulled out is disclosed. Further, in “Patent Document 5”, an anode lead having one end connected to the anode terminal of the anode formed on the inner surface of the front panel is inserted into an insulator provided in the through-hole of the rear panel and pulled out to the outside. An image display device configured as described above is disclosed. In “Patent Document 6”, a through hole is provided in the back substrate, and a conductive member is applied to the upper surface, the lower surface, and the inner side of the through hole. A terminal provided on the front substrate and a conductive member provided on the rear substrate are electrically connected by an elastic structure. A configuration is disclosed in which a high voltage is supplied to an anode formed on a front substrate by supplying a high voltage to a conductive member provided on the rear substrate from the outside.

JP 10-31433 A Japanese Patent Laid-Open No. 10-326581 JP 2000-260359 A JP 2003-92075 A JP 2000-31636 A JP 2003-115271 A

  In the above prior art, the flat image display device adopts a configuration in which a high voltage is introduced to the front substrate. However, since the front substrate is a projection image plane, a high voltage is introduced from the rear substrate side and the front surface in the tube. In general, the structure is connected to an anode provided on a substrate. In this case, the high voltage introduction terminal from the back substrate passes through the through hole of the back substrate and reaches the front substrate where the anode exists, but low voltage wiring such as a cathode and a signal line is formed on the back substrate side. Therefore, the spark between these wires and the high voltage introduction terminal has been a problem. This is because only the insulator other than the high voltage introduction terminal is formed in the through-hole portion of the back substrate, so that the potential tends to become unstable in this vicinity.

  On the other hand, in Patent Document 6, a conductive film is formed in the through-hole portion of the back substrate to stabilize the potential of the through-hole portion of the back substrate. However, this method has a problem that it is difficult in terms of manufacturing technology because it is necessary to form a conductive film on all of the upper surface, inside, and lower surface of the through-hole portion.

  Accordingly, the present invention has been made to solve the above-described conventional problems, and a display device according to the present invention specifically has the following configuration.

(1) A phosphor screen and an anode electrode to which an anode potential is applied are formed inside the front substrate, an electron source is formed inside the back substrate, and the front substrate and the back substrate are separated by a support. Is maintained, and an image is formed by the electrons from the electron source projecting on the phosphor screen, and a through hole is formed in the back substrate, and a high voltage introduction terminal is provided in the through hole. The high voltage introduction terminal is electrically connected to a metal body, the metal body is electrically connected to an anode of the front substrate, and a conductive pattern is formed around a through hole inside the rear substrate. The display device is characterized in that the anode potential is applied to the anode electrode and the conductive pattern, and the through hole is filled with a sealing material for maintaining a vacuum.
(2) The display device according to (1), wherein a conductive paste is formed between the conductive pattern and the metal body.
(3) The display device according to (1), wherein a high resistance film is formed around the conductive pattern.
(4) The display device according to (1), wherein a conductive paste is formed between the anode electrode and the metal body.
(5) The display device according to (1), wherein an anode pattern different from the anode electrode is formed between the anode electrode and the metal body.
(6) The display device according to (1) or (5), wherein a high resistance film is formed around the anode electrode formed around the metal body.
(7) The display device according to (3) and (6), wherein the resistivity of the high resistance film is 10 GΩ · cm to 1000 TΩ · cm.
(8) The display device according to (1), wherein a sealing material for maintaining a vacuum is formed around a through hole inside the back substrate.
(9) The display device according to (1), wherein the metal body has a substantially cylindrical shape, and a convex portion that is inserted into the through hole of the rear substrate is formed at a lower portion of the metal body. .
(10) The display device according to (1), wherein the metal body and the high voltage introduction terminal are integrally formed.
(11) The display device according to (1), wherein the metal body has a spring structure in an axial direction.

  (12) A phosphor screen and an anode electrode to which an anode potential is applied are formed inside the front substrate, an electron source is formed inside the back substrate, and the front substrate and the back substrate are separated by a support. Is maintained, and an image is formed by the electrons from the electron source projecting on the phosphor screen, and a through hole is formed in the back substrate, and a high voltage introduction terminal is provided in the through hole. The high voltage introduction terminal is inserted and electrically connected to a metal body, the metal body is electrically connected to the anode electrode of the front substrate, and the inside of the back substrate is electrically conductive around the through hole. A pattern is formed, and the anode potential is applied to the anode electrode and the conductive pattern, and the conductive pattern does not extend to the outside of the back substrate, and the conductive pattern is electrically conductive between the conductive pattern and the metal body. A paste is formed, Kishirubeden paste does not extend to the outside of the rear substrate, a display device, characterized in that the sealant for keeping the vacuum is filled in the through hole.

  (13) A phosphor screen and an anode electrode to which an anode potential is applied are formed inside the front substrate, an electron source is formed inside the back substrate, and the front substrate and the back substrate are separated by a support. Is maintained, and an image is formed by the electrons from the electron source projecting on the phosphor screen, and a through hole is formed in the back substrate, and a high voltage introduction terminal is provided in the through hole. The high voltage introduction terminal is electrically connected to a metal body, the metal body is electrically connected to an anode electrode of the front substrate, and a conductive pattern is formed inside the back substrate and around the through hole. The anode potential is applied to the anode electrode and the conductive pattern, the through hole is filled with a sealing material for maintaining a vacuum, and the high voltage introduction terminal is. A display device, wherein the display device extends to the outside of the back substrate, and the high voltage introduction terminal is surrounded by silicon resin outside the back substrate.

  The effect of each means is as follows.

  According to the means (1), since the high voltage introduction pattern is provided in the periphery of the through hole of the back substrate, the potential distribution on the back substrate is stabilized, and the chance of spark is greatly reduced. In addition, since the high voltage introduction terminal is connected to the metal body, it is not necessary to form a conductive material on the through hole wall, so that the process is stabilized. Further, according to the present invention, since the through-hole portion essentially has only a sealing material, the reliability of vacuum sealing is improved.

According to the means (2), since the conductive paste is formed between the metal body and the conductive pattern, the electrical connection between the metal body and the conductive pattern is stabilized, so that the spark of the display device can be suppressed.
According to the means (3), the spark near the through hole can be prevented by the high resistance film.
According to the means (4), since the contact between the anode electrode and the metal body is stabilized, the anode electrode can be prevented from being damaged.
According to the means (5), since a conductive film suitable for conduction with a metal body made of a material different from the anode electrode can be used, supply of the anode potential is stabilized.
According to the means (6), it is possible to prevent a spark in the vicinity of the metal body that supplies the anode potential.
According to the means (7), by setting the high resistance film to the optimum value, it is possible to prevent a high voltage spark on the rear substrate and the front substrate.
According to the means (8), since the vicinity of the through hole is sealed twice, the reliability of vacuum sealing is improved.
(9) According to the present invention, since the position of the metal body is stabilized, the manufacturing yield and the reliability of the product are improved.
According to the means (10), since the metal body and the high voltage introduction terminal are integrated, the reliability of the high voltage supply is improved and the workability is improved.
According to the means (11), since the metal body has a spring structure in the axial direction, the electrical connection between the front substrate and the rear substrate is stabilized.
According to the means (12), the conductive pattern and the conductive paste do not extend to the outside of the back substrate, and only the sealing material is filled in the through holes, so that the reliability of vacuum-tightness is improved.
According to the means (13), since the silicon resin exists around the high voltage introduction terminal outside the back substrate, creeping discharge on the back side of the back substrate can be prevented.

  The best mode of the present invention will be described below in detail with reference to the drawings of the embodiments.

1 to 4 are views for explaining an embodiment of the image display device of the present invention. FIG. 1 (a) is a plan view seen from the front substrate side, and FIG. 1 (b) is FIG. 1 (a). 2 is a schematic plan view of the rear substrate with the front substrate of FIG. 1 removed, FIG. 3 is a schematic sectional view taken along the line AA of FIG. 1, and FIG. 4 is a line BB of FIG. FIG. 2 is a schematic cross-sectional view of a back substrate taken along a line and a schematic cross-sectional view of a portion of the front substrate corresponding to the back substrate.

1 to 4, reference numeral 1 is a rear substrate, 2 is a front substrate, and both the substrates 1 and 2 are made of a glass plate having a thickness of several millimeters, for example, about 3 mm. Reference numeral 3 denotes a support, and the support 3 is made of a glass plate or a frit glass sintered body having a thickness of several mm, for example, about 3 mm. An exhaust pipe 4 is fixed to the back substrate 1. The support 3 is inserted around the periphery of the substrates 1 and 2 and hermetically sealed with the substrates 1 and 2 via a sealing member 5 such as frit glass. The two substrates 1 and 2 are overlapped (
(Z direction) is arranged coaxially.

The space surrounded by the support 3, the substrates 1, 2 and the sealing member 5 is exhausted through the exhaust pipe 4, and the display area 6 is maintained by maintaining a vacuum of 10 ⁻³ to 10 ⁻⁵ Pa, for example. It is composed. The exhaust pipe 4 communicates with an exhaust hole 7 formed through the back substrate 1 in a substantially coaxial manner, and is attached to the outer surface of the back substrate 1 as described above, and is sealed after exhaust is completed.

Reference numeral 8 denotes a video signal electrode. The video signal electrode 8 extends in one direction (Y direction) on the inner surface of the rear substrate 1 and is arranged in parallel in the other direction (X direction). This video signal electrode 8 has a video signal electrode lead-out terminal 81 at its end, and the tip of this terminal hermetically passes through the hermetic joint between the support 3 and the back substrate 1 to form the back substrate 1. It extends to the end.

  Next, reference numeral 9 is a scanning signal electrode, and the scanning signal electrode 9 extends on the video signal electrode 8 in the other direction (X direction) intersecting therewith and arranged in parallel in the one direction (Y direction). Has been. The scanning signal electrode 9 has a scanning signal electrode lead-out terminal 91 at the end, and the tip of the terminal penetrates the hermetic joint between the support 3 and the back substrate 1 in an airtight manner. It extends to the end of the. Further, the video signal electrode 8 and the scanning signal electrode 9 and the through hole 7 are set so as to ensure an interval of at least 3 mm. If it is closer than this size, the electrode size may vary.

  Next, reference numeral 10 is an electron source, and the electron source 10 is provided in the vicinity of each intersection of the scanning signal electrode 9 and the video signal electrode 8, and the electron source 10 includes the scanning signal electrode 9 and the video signal electrode. 8 and connection electrodes 11 and 11A, respectively. An interlayer insulating film INS is disposed between the video signal electrode 8 and the electron source 10 and the scanning signal electrode 9. Here, for example, an Al / Nd film is used as the video signal electrode 8, and an Ir / Pt / Au film is used as the scanning signal electrode 9, for example.

  Next, reference numeral 12 denotes a spacer, which is made of a ceramic material, and is shaped into a rectangular thin plate shape. In this embodiment, every other spacer is arranged upright on the scanning signal electrode 9, and an adhesive member. 13 is fixed to both substrates 1 and 2. The spacer 12 is usually installed at a position that does not hinder the operation of each pixel.

The dimensions of the spacer 12 are set according to the substrate dimensions, the height of the support 3, the substrate material, the spacer arrangement interval, the spacer material, etc. In general, the height is substantially the same as the support 3 described above, A practical value is a thickness of several tens of μm to several mm or less, and a length of about 20 mm to 1000 mm, preferably about 80 mm to 120 mm. The spacer 12 has a resistance value of about 10 ⁸ to 10 ⁹ Ω · cm.

  On the inner surface of the front substrate, red, green, and blue phosphor layers 14 are partitioned and arranged by a light-shielding BM (black matrix) film 15, and further, for example, from a metal thin film provided by a vapor deposition method so as to cover them. The metal back 16 is formed, and the phosphor screen is constituted by these. A columnar metal body 21 according to the present invention is formed in the lower left corner of the portion surrounded by the support in FIGS. 1 and 2. A film structure described later is formed around the metal body 21.

  FIG. 5 shows a method of supplying an anode voltage in the present invention. A through hole 20 is formed in the back substrate 1. This hole is formed inside the support which is a frame. The conductive pattern 22 formed on the back substrate 1 and the conductive pattern 22 formed on the front substrate 2 are electrically connected by a metal body 21. A high voltage is supplied to the metal body 21 from a high voltage introduction terminal 26. A feature of the present invention is that the anode voltage is also supplied to the conductive pattern formed on the upper side of the through hole 20 of the back substrate 1, that is, on the vacuum side of the back substrate 1. By always applying a potential to the predetermined conductive pattern, it is possible to avoid the potential in the vicinity of the through hole 20 of the back substrate 1 from becoming unstable and to reduce the chance of sparking. At least on the back substrate 1 side, the metal body 21 is bonded to the back substrate 1 with a conductive adhesive. This conductive adhesive has a role of ensuring the electrical continuity between the metal body 21 and the conductive pattern 22. The conductive adhesive also serves to ensure electrical connection between the high voltage introduction terminal 26 and the metal body 21.

  A detailed configuration in the vicinity of the through hole 20 of the back substrate 1 will be described with reference to FIGS. FIG. 6 is a schematic cross-sectional view of the back substrate 1 near the through hole 20. FIG. 7 is a plan view of each layer on the upper side of the back substrate 1, that is, on the vacuum side.

  In FIG. 6, a conductive pattern 22 is formed in a circular shape around the upper portion of the through hole 20. The conductive pattern 22 is preferably a sputtered film such as Cr or AL, but may be formed by printing. A conductive paste is formed on the conductive film. This conductive paste is preferably one in which a low-resistance material such as Ag, AL, or Au is dispersed. The conductive paste ensures electrical continuity between the metal body 21 and the conductive pattern 22 and also has a role of fixing the metal body 21 in the vicinity of the through hole 20 of the back substrate 1.

  Electrical connection between the front substrate 2 and the conductive pattern 22 in the vicinity of the through hole 20 of the rear substrate 1 is made by a metal body 21. The metal body 21 has a cylindrical shape, and the diameter is larger than the diameter of the through hole 20 of the back substrate 1. The material of the metal body 21 is preferably a material having a thermal expansion coefficient close to that of glass. For example, 42% Ni-6% Cr-52% Fe is preferable. If the thermal expansion coefficient of the metal body 21 is significantly different from that of glass, a crack is generated in the back substrate 1.

  The conductive paste 23 for fixing the metal body 21 to the back substrate 1 also has a role of fixing the high voltage introduction terminal 26 from the outside and ensuring the connection between the metal body 21 and the high voltage introduction terminal 26. The high voltage introduction terminal 26 in the present embodiment is T-shaped in cross section, but the shape is a disc shape on the upper surface, and a line having a circular cross section is connected below it. The reason why the upper surface is disk-shaped is to increase the contact area with the conductive paste so as to reliably supply the anode voltage. The material of the high voltage introduction terminal 26 is also preferably a material having a thermal expansion coefficient close to that of glass. For example, 42% Ni-6% Cr-52% Fe is preferable. If the thermal expansion coefficient of the high voltage introduction terminal 26 is significantly different from that of glass, cracks are generated in the vicinity of the through hole 20 of the back substrate 1.

  After the high voltage introduction terminal 26 and the metal body 21 are electrically connected by the conductive paste, the through hole 20 of the back substrate 1 is filled with a frit glass 25 as a sealing material. This is for vacuum sealing. Here, since the frit glass 25 has only to fill the hole, the operation is easy and the sealing reliability is high. For the vacuum sealing, it is sufficient to fill the through hole 20 with the frit glass 25, but the frit glass 25 is also formed inside the back substrate 1 in order to increase the reliability. In this case, the frit glass 25 is formed so as to cover the conductive paste and the metal body 21 formed around the through hole 20.

  As described above, the conductive pattern 22, the conductive paste 23, and the sealing frit and the three kinds of thin films or thick films are formed in the vicinity of the through hole 20 inside the back substrate 1. 22 is the lowermost layer and has the largest area and extends outward from other films. The back substrate 1 has wirings with low potential such as scanning signal electrodes and image signal electrodes, and there is a risk of causing sparks with the conductive pattern 22 to which a high voltage is applied. In order to prevent this spark, a high resistance film 24 is formed around the conductive pattern 22. The high resistance film 24 is formed so as to overlap the conductive pattern 22.

  A preferable material as the high resistance material is, for example, iron oxide called “bengara”. Although it is not restricted to iron oxide, what is necessary is just the material of the range of about 10 Gohm * cm-1000 Tohm * cm as a resistivity. This high resistance material prevents the high voltage applied to the conductive pattern 22 from changing abruptly around the conductive pattern 22, and changes it to the removal through the high resistance material. Prevent sparks.

  FIG. 7 shows a schematic plan view of only a plurality of films formed around the through hole 20 of the back substrate 1. Each film is formed concentrically. First, the conductive pattern 22 is formed in a circular shape. On this, the conductive paste 23 is formed in a circular shape. The conductive paste 23 is formed by bridging the through holes 20. The conductive paste 23 is applied to the lower part of the columnar metal body 21, thereby closing the through holes 20 with the conductive paste 23. Another method of forming the conductive paste 23 in the through hole 20 may be applied to the disk portion at the tip of the high voltage introduction terminal 26 before the high voltage introduction terminal 26 is inserted into the through hole 20. Alternatively, the conductive paste 23 may be filled in a part of the through hole 20 before the high voltage introduction terminal 26 is inserted. In any case, the conductive paste 23 in the through hole 20 is to establish electrical continuity between the metal body 21 and the high voltage introduction terminal 26. After applying the conductive paste 23, the metal body 21 and the high voltage introduction terminal 26 are fixed to the through hole 20 by firing.

  The high resistance film 24 is formed around the conductive pattern 22 by printing concentrically with the conductive pattern 22. If the high resistance film 24 is applied before the conductive paste 23 is fired, the high resistance film 24 and the conductive paste 23 can be fired at the same time. The high resistance film 24 is formed so as to overlap the conductive pattern 22, but the overlap amount is preferably about 1 mm in width, and the non-overlap portion is preferably about 5 mm in width. The amount of overlap is determined by the process margin. The width of the non-overlapping portion is determined by the tolerance to sparks or the low efficiency of the high resistance film 24.

  Thereafter, the frit glass 25 as a sealing material for keeping the inside of the display panel in a vacuum is filled in the through holes 20. At the same time, a frit glass 25 as a sealing material is also formed on the inner side of the back substrate 1 so as to cover a part of the conductive paste 23 and the metal body 21. The frit glass 25 as a sealing material may be made of the same material as the adhesive member used to fix the support member, the spacing member, and the like as the frame members to the back substrate 1 and the front substrate 2, so when these adhesive members are fired May be fired simultaneously.

  FIG. 8 is a schematic cross-sectional view of the front substrate 2 side to which the metal body 21 is connected. The anode pattern 27 in FIG. 8 may be used as it is by extending the metal back 16 shown in FIG. When the metal back 16 is not a sufficient film thickness or when the strength is not sufficient, it is formed separately from the metal back 16 by sputtering or the like as on the rear substrate 1 side.

  When the metal body 21 and the anode pattern 27 are in direct contact, a point contact is likely to occur, and current is concentrated at the contact portion, so that the supply of a high voltage to the anode becomes unstable. Therefore, the conductive paste 23 is formed by printing on the portion that contacts the metal body 21. Since the anode current concentrates on the high voltage supply portion of the front substrate 2, if a thick film such as the conductive paste 23 is formed, the current concentration is suppressed and stable operation is possible. The material of the conductive paste 23 may be the same as that on the back substrate 1 side. The conductive paste 23 is applied in a circular shape but with a larger area than the metal body 21. This is because of the margin of the process.

  A high resistance film 24 is formed outside the anode pattern 27. The high resistance film 24 may be made of the same material as that on the back substrate 1 side. The function of the high resistance film 24 is to prevent the potential from rapidly changing around the anode pattern 27 in the same manner on the back substrate 1 side, and to gradually change the potential by the high resistance film 24. However, since the metal back 16 is formed on the anode side on the side where the phosphor screen is formed, the high resistance film 24 is not necessary. Therefore, the anode side may be formed outside the anode pattern 27 as shown in FIG. The point that the high resistance film 24 and the anode pattern 27 overlap and the width of the high resistance film 24 is preferably about 5 mm are the same as those on the back substrate 1 side. In FIG. 9, the high resistance film 24 is formed only in the vicinity of the metal body 21 that conducts the back substrate 1 and the front substrate 2, but if formed similarly over the entire periphery of the metal back 16, the risk of spark can be further reduced. it can.

  FIG. 10 shows a cross-sectional view of the second embodiment of the present invention. In Example 2, a convex portion is formed at the tip of the metal body 21, and the convex portion is inserted into the through hole 20 of the back substrate 1. Thereby, the positioning of the metal body 21 can be facilitated. At the same time, the convex portion can prevent problems such as the metal body 21 falling down during the process. In this case, the conductive paste 23 is formed around the convex portion of the metal body 21, and then the frit glass 25 is filled as a sealing material in the same manner as in the first embodiment.

  In the second embodiment, in order to prevent the high voltage introduction terminal 26 from being exposed from the rear substrate 1, the periphery of the high voltage introduction terminal 26 is surrounded by a silicon resin 28 having excellent insulating characteristics. Another role of the silicon resin 28 is to prevent high voltage from causing creeping discharge from the outer surface of the back glass. That is, when the high voltage introduction terminal 26 is directly connected by a socket or the like, it is possible to prevent the high voltage introduction terminal 26 from being directly exposed to the outside, but there is no defense against creeping discharge that travels through the back glass. Since an anode voltage of 7 to 10 KV is applied, creeping discharge becomes a serious problem when the back glass substrate is dirty or the humidity is high.

  In the present invention, since the silicon resin 28 is installed around the high voltage introduction terminal 26, creeping discharge passing through the back glass surface can be prevented. Since the silicon resin 28 has excellent characteristics for anti-creeping discharge, the creeping discharge through the surface of the silicon resin 28 does not occur. In order to prevent creeping discharge more reliably, as shown in FIG. 10, if a concave portion of the silicon resin 28 is formed around the high voltage introduction terminal 26 and the high voltage introduction terminal 26 is put in this concave portion, The creepage distance passing through the silicon resin 28 is increased, and the reliability against creeping discharge can be further increased.

  FIG. 11 shows a third embodiment of the present invention. In the third embodiment, the metal body 21 and the high voltage introduction terminal 26 are integrally formed. Thereby, the electrical connection between the metal body 21 and the high voltage introduction terminal 26 can be ensured. Further, steps such as adhesion of the high voltage introduction terminal 26 in the process can be omitted.

  In this case, the integral part of the metal body 21 and the high voltage introduction terminal 26 does not necessarily have to be integrally molded. A combination of the metal body 21 and the high voltage introduction terminal 26 may be used. For the combination, a conductive adhesive may be used, and if both are metals, spot welding may be used.

  In the third embodiment, since the metal body 21 and the high voltage introduction terminal 26 are integrated, the conductive paste 23 may be formed around the through hole 20 by printing. In this case, the through-hole 20 need only be filled with the frit glass 25. Other film configurations are the same as those in the first embodiment. Further, the point that the high voltage introduction terminal 26 is surrounded by the silicon resin 28 outside the back substrate 1 is the same as that of the second embodiment.

  FIG. 12 shows a cross-sectional view of the fourth embodiment of the present invention. In the fourth embodiment, the metal body 21 is provided with a spring structure in the axial direction. By providing the spring structure 211, the metal body 21 is always pressed against the front substrate 2 and the back substrate 1, so that electrical conduction can be ensured.

  In this case, the spring structure may be a coil spring or a plate spring. This spring structure is preferably provided in the middle of the metal body 21 for electrical stability. This is because it is desirable that the lower surface of the metal body 21 is flat with the conductive pattern 22 of the back substrate 1 and the upper surface side is securely connected with the anode pattern 27, so that both the upper surface and the lower surface are flat.

  In the case of such a structure, since the metal body 21 is always pressed against the periphery of the through hole 20 of the back substrate 1, the contact between the conductive pattern 22 and the metal body 21 is kept good. The conductive paste 23 is not always necessary. However, since the anode current flows on the anode side, the conductive paste 23 is necessary to avoid point contact.

  When the conductive paste 23 is not provided in the vicinity of the through hole 20 of the back substrate 1, it is essential that the metal body 21 and the high voltage introduction terminal 26 be integrated in advance. This is because, in the manufacturing process, the step of applying the conductive paste 23 to the back substrate 1 can be omitted completely. The method for integrating the metal body 21 and the high voltage introduction terminal 26 is the same as the method described in the third embodiment. In this case, the through hole 20 is filled with a frit glass 25 as a sealing material.

  The high voltage introduction terminal 26 is surrounded by the silicon resin 28 outside the through hole 20 of the back substrate 1 as in the second embodiment. The other film structure inside the through hole 20 of the back substrate 1 and the structure near the anode pattern 27 of the front substrate 2 are the same as those in the first embodiment.

1A and 1B are diagrams for explaining an embodiment of an image display device of the present invention, in which FIG. 1A is a plan view seen from the front substrate side, and FIG. 1B is a side view of FIG. FIG. 2 is a schematic plan view of a back substrate shown by removing the front substrate of FIG. 1. 1 is a schematic cross-sectional view of a display device to which the present invention is applied. FIG. 3 is a schematic cross-sectional view of a back substrate taken along line AA in FIG. 2 and a schematic cross-sectional view of a front substrate corresponding to the back substrate. It is a cross-sectional schematic diagram which shows the high voltage supply part by this invention. It is the A section enlarged view of FIG. This is a film structure in the vicinity of the through hole formed in the back substrate. It is the B section enlarged view of FIG. It is an enlarged plan view of a portion to which an anode voltage is supplied on the front substrate. It is another Example of this invention. It is a further embodiment of the present invention. It is a further embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Back substrate, 2 ... Front substrate, 3 ... Support body, 4 ... Exhaust pipe, 5 ... Sealing member, 6 ... Display area, 7 ... Exhaust hole, 8... Image signal electrode, 81... Image signal electrode extraction terminal, 9... Scanning signal electrode, 91.
Electron source 11, 11A ... connection electrode, 12 ... spacing member, 13 ... adhesive member 14 ... phosphor layer, 15 ... black matrix film, 16 ... metal back 16 (Anode electrode), 20 ... through hole, 21 ... metal body, 22 ... conductive pattern, 23 ... conductive paste, 24 ... high resistance film, 25 ... sealing material, 26. ..High voltage introduction terminal, 27... Anode pattern, 28.

Claims (13)

  A phosphor screen and an anode electrode to which an anode potential is applied are formed inside the front substrate, an electron source is formed inside the back substrate, and the front substrate and the back substrate are spaced by a support. A display device in which an image is formed by electrons from the electron source projecting on a fluorescent screen, wherein a through hole is formed in the back substrate, and a high voltage introduction terminal is inserted into the through hole, The high voltage introduction terminal is electrically connected to a metal body, the metal body is electrically connected to an anode electrode of the front substrate, and a conductive pattern is formed around a through hole inside the back substrate, The display device, wherein the anode potential is applied to the anode electrode and the conductive pattern, and the through hole is filled with a sealing material for maintaining a vacuum.   The display device according to claim 1, wherein a conductive paste is formed between the conductive pattern and the metal body.   The display device according to claim 1, wherein a high resistance film is formed around the conductive pattern.   The display device according to claim 1, wherein a conductive paste is formed between the anode electrode and the metal body.   The display device according to claim 1, wherein an anode pattern made of a material different from the anode electrode is formed between the anode electrode and the metal body.   The display device according to claim 1, wherein a high resistance film is formed around the anode electrode formed around the metal body.   The display device according to claim 3 or 6, wherein the resistivity of the high resistance film is 10 GΩ · cm to 1000 TΩ · cm.   The display device according to claim 1, wherein a sealing material for maintaining a vacuum is formed around a through hole inside the rear substrate.   2. The display device according to claim 1, wherein the metal body has a substantially cylindrical shape, and a convex portion that is inserted into a through hole of the rear substrate is formed at a lower portion of the metal body.   The display device according to claim 1, wherein the metal body and the high voltage introduction terminal are integrally formed.   The display device according to claim 1, wherein the metal body has a spring structure in an axial direction.   A phosphor screen and an anode electrode to which an anode potential is applied are formed inside the front substrate, an electron source is formed inside the back substrate, and the front substrate and the back substrate are spaced by a support. A display device in which an image is formed by electrons from the electron source projecting on a fluorescent screen, wherein a through hole is formed in the back substrate, and a high voltage introduction terminal is inserted into the through hole, The high voltage introduction terminal is electrically connected to a metal body, the metal body is electrically connected to an anode electrode of the front substrate, and a conductive pattern is formed around the through hole inside the back substrate. The anode potential is applied to the anode electrode and the conductive pattern, the conductive pattern does not extend outside the back substrate, and a conductive paste is formed between the conductive pattern and the metal body. Said conductive Paste does not extend to the outside of the rear substrate, a display device, characterized in that the sealant for keeping the vacuum is filled in the through hole.   A phosphor screen and an anode electrode to which an anode potential is applied are formed inside the front substrate, an electron source is formed inside the back substrate, and the front substrate and the back substrate are spaced by a support. A display device in which an image is formed by electrons from the electron source projecting on a fluorescent screen, wherein a through hole is formed in the back substrate, and a high voltage introduction terminal is inserted into the through hole, The high voltage introduction terminal is electrically connected to a metal body, the metal body is electrically connected to an anode electrode of the front substrate, and a conductive pattern is formed around the through hole inside the back substrate. The anode potential is applied to the anode electrode and the conductive pattern, the through hole is filled with a sealing material for keeping a vacuum, and the high voltage introduction terminal extends to the outside of the back substrate, The high voltage introduction terminal is In the outside of the substrate, a display device characterized by being surrounded by the silicone resin.

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