JP2008096609A - Positive photosensitive composition and organic film comprising the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition having high sensitivity, high resolution, high heat resistance, a good profile, a sufficient focus latitude and little residue on development and capable of forming a patterned organic film obtained by development with an alkaline aqueous solution. <P>SOLUTION: The positive photosensitive composition contains a photosensitive compound and an alkali-soluble resin and may further contain an additive, wherein a compound having an adamantane ring is contained in at least one of the photosensitive compound and the additive, a quinonediazidosulfonic ester compound having an adamantane ring is contained as the photosensitive compound, and a phenol compound which is a precursor thereof is contained as the additive. An organic film formed of the positive photosensitive composition is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a positive photosensitive composition for producing a semiconductor element, a liquid crystal display element, an EL display element and the like. Further, the present invention relates to an organic film such as an insulating film manufactured from the composition, and an element including the organic film.

  In general, it is known to convert a compound having phenolic OH into a quinonediazide sulfonate ester and use it as a photosensitive agent in a photosensitive composition for semiconductor microfabrication (see, for example, Patent Documents 1, 2, and 3).

  That is, when a positive photosensitive composition containing a compound having quinonediazide and an alkali-soluble resin soluble in alkali is applied on a substrate such as a metal substrate, and irradiated with light having a wavelength of 300 to 500 nm, After the quinonediazide of the compound is decomposed, it reacts with the coexisting water or the water of the developer to produce carboxyl. Thereby, the said compound changes from an alkali-insoluble state to an alkali-soluble state. By utilizing this change in state caused by light irradiation, such a composition is used for producing a resist film or a resin film on which a pattern with a positive resist is formed. A positive resist has a feature of being excellent in resolving power as compared with a negative resist, and is therefore used for manufacturing various integrated circuits for semiconductors.

  In recent years, integrated circuits in the semiconductor industry have been miniaturized due to high integration, and in this technical field, submicron pattern formation is now required. Among them, the lithography process occupies an important position at the time of manufacturing an integrated circuit, and even a positive resist is required to have a higher resolution, that is, a higher γ value.

  For positive photosensitive compositions containing a quinonediazide compound and an alkali-soluble resin, many proposals have been made for combinations of components. For example, Patent Document 4 describes that a compound obtained by converting a triphenylmethane-based compound having at least two phenolic OHs into a quinonediazide sulfonate ester is used as a photosensitive agent.

  However, these known photosensitizers are still subject to investigation from the viewpoint of the production of finer circuits as photosensitizers for ultra-fine processing for the production of ultra-high integrated circuits, so-called submicron lithography. Yes.

  In general, an electronic component such as a thin film transistor type liquid crystal display element or a solid-state imaging element is provided with an insulating film for insulating between wirings arranged in layers. As a material for forming the insulating film, a positive photosensitive composition having a small number of steps for obtaining an insulating film having a required pattern shape is widely used. The positive photosensitive composition needs to have a wide process margin in the process of forming the insulating film.

  Furthermore, when forming a transparent electrode on an insulating film, the further reduction of the resistance value of this transparent electrode is calculated | required. In order to reduce the resistance value of the transparent electrode on the insulating film, it is desired to form the transparent electrode on the patterned insulating film by sputtering at a higher temperature. If the positive photosensitive composition has insufficient heat resistance, the sputtering may cause wrinkles in the insulating film, thereby reducing the quality of the product. For this reason, further heat resistance is required for the photosensitizer used when forming a low-resistance transparent electrode on the insulating film.

  For this reason, various studies for improving the resist performance such as sensitivity, resolving power, heat resistance and the like have been conducted on the photosensitive agent.

On the other hand, studies using a compound having phenolic OH as an alkali-soluble low molecular weight additive in a photosensitive composition containing a quinonediazide compound and an alkali-soluble resin have been conducted to increase the sensitivity of the resist (for example, (See Patent Documents 4, 5, 6, and 7).
Japanese Patent Laid-Open No. 3-48249 JP-A-3-185447 JP-A-5-297582 JP-A-9-194413 Japanese Patent Laid-Open No. 3-191351 JP-A-3-2000025 JP-A-5-297583

  An object of the present invention is to provide a novel quinonediazide sulfonic acid ester compound having an adamantane ring, which is useful as a photosensitizer component of a photosensitive composition, and a compound having a phenolic OH as a precursor thereof. Providing as a suitable additive in the product.

  Another object of the present invention is to use such a phenolic OH-containing compound or its quinonediazide sulfonic acid ester compound, with high sensitivity, high resolution, high heat resistance, good profile, good focus tolerance, little development residue, etc. It is an object of the present invention to provide a photosensitive composition that forms an organic film in which various resist performances are balanced.

  As a result of intensive research, the present inventors have found a phenol derivative having a specific structure having phenolic OH, and a quinonediazide sulfonate esterified from this compound is useful as a photosensitizer. The present inventors have found that excellent results can be obtained even when used as an alkali-soluble low molecular weight additive in an adhesive composition, and have completed the present invention based on this finding.

[1] The present invention provides a positive photosensitive composition containing an alkali-soluble resin soluble in alkali and a quinonediazide sulfonic acid ester of a phenol compound represented by the following general formula (I).

In general formula (I), R ¹ and R ² are each independently halogen, cyano, alkyl having 1 to 5 carbons, alkoxy having 1 to 5 carbons, alkenyl having 2 to 5 carbons, or 2 carbons. Represents an alkynyl group having 5 to 5 carbon atoms, a cycloalkyl group having 3 to 8 carbon atoms, a cycloalkenyl group having 3 to 8 carbon atoms, or phenyl, and any hydrogen in the ring in the cycloalkyl, cycloalkenyl and phenyl each independently represents a halogen atom. , Cyano, alkyl having 1 to 5 carbon atoms, alkoxy having 1 to 5 carbon atoms or alkenyl having 2 to 5 carbon atoms, m represents an integer of 0 to 7, and n is independently 0 to 0. Represents an integer of 4.

[2] The present invention also provides the positive photosensitive composition as described in [1], wherein all of R ¹ are the same and all of R ² are the same.

[3] The positive photosensitive property as described in [1] or [2], wherein the phenyl bonded to the adamantane ring in the general formula (I) has a hydroxyl group at the 4-position. A composition is provided.

[4] The present invention provides the positive photosensitive composition as described in [3], wherein m is 0, and R ² is independently alkyl, cycloalkyl, or phenyl. To do.

[5] The present invention also provides the positive photosensitive composition as described in [4], wherein n is 0.

[6] The present invention is also characterized in that the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3 and 5 positions, and R ² is both methyl. [4] The positive photosensitive composition described in [4] is provided.

[7] Further, the present invention is characterized in that the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position, and R ² is cyclohexyl. A positive photosensitive composition is provided.

[8] Further, the present invention is characterized in that the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position, and R ² is phenyl. A positive photosensitive composition is provided.

[9] Further, in the present invention, the quinonediazide sulfonic acid ester of the phenol compound represented by the general formula (I) is a quinonediazide-4-sulfonic acid or quinonediazide-phenol compound represented by the general formula (I). The positive photosensitive composition according to any one of [1] to [8], which is an ester with 5-sulfonic acid.

[10] In the present invention, the quinonediazide sulfonic acid ester of the phenol compound represented by the general formula (I) is an ester of the phenol compound represented by the general formula (I) and quinonediazide-5-sulfonic acid. The positive photosensitive composition according to any one of [5], [6] and [8], which is characterized in that

[11] Further, in the present invention, the quinonediazide sulfonic acid ester of the phenol compound represented by the general formula (I) is an ester of the phenol compound represented by the general formula (I) and quinonediazide-4-sulfonic acid. The positive photosensitive composition as described in [7], wherein:

[12] Further, the present invention further comprises a phenol compound represented by the general formula (I) according to any one of claims 1 to 8, wherein [1] to [11] The positive photosensitive composition as described in any one of the above is provided.

[13] The present invention also includes an alkali-soluble resin that is soluble in alkali, a photosensitive compound that is soluble in alkali upon irradiation with radiation, and a phenol compound represented by the following general formula (I). A positive photosensitive composition is provided.

In general formula (I), R ¹ and R ² are each independently halogen, cyano, alkyl having 1 to 5 carbons, alkoxy having 1 to 5 carbons, alkenyl having 2 to 5 carbons, or 2 carbons. Represents an alkynyl group having 5 to 5 carbon atoms, a cycloalkyl group having 3 to 8 carbon atoms, a cycloalkenyl group having 3 to 8 carbon atoms, or phenyl, and any hydrogen in the ring in the cycloalkyl, cycloalkenyl and phenyl each independently represents a halogen atom. , Cyano, alkyl having 1 to 5 carbon atoms, alkoxy having 1 to 5 carbon atoms or alkenyl having 2 to 5 carbon atoms, m represents an integer of 0 to 7, and n is independently 0 to 0. Represents an integer of 4.

[14] Further, the present invention provides the positive photosensitive composition as described in [13], wherein R ¹ is all the same and R ² is all the same.

[15] The positive photosensitive composition as described in [13] or [14], wherein the phenyl bonded to the adamantane ring in the general formula (I) has a hydroxyl group at the 4-position. Offer things.

[16] Further, the present invention provides the positive photosensitive composition as described in [15], wherein m is 0 and R ² is independently alkyl, cycloalkyl or phenyl. To do.

[17] The present invention also provides the positive photosensitive composition as described in [16], wherein n is 0.

[18] Further, the present invention is characterized in that the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3 and 5 positions, and R ² is both methyl. [16] The positive photosensitive composition as described in [16].

[19] Moreover, the present invention is characterized in that the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position, and R ² is cyclohexyl. A positive photosensitive composition is provided.

[20] Further, the present invention is characterized in that the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position, and R ² is phenyl. A positive photosensitive composition is provided.

[21] Further, the present invention provides the positive photosensitive composition as described in any one of [13] to [20], wherein the photosensitive compound is a quinonediazide sulfonic acid ester.

[22] Moreover, this invention provides the organic film which consists of a positive photosensitive composition as described in any one of [1]-[21].

[23] The present invention also provides an organic film according to [22], which is obtained by firing a film of the positive photosensitive composition.

[24] The present invention also provides the organic film according to [22] or [23], which has a pattern.

[25] Further, the present invention provides the positive photosensitive composition in which the photosensitive compound is exposed by irradiation of the film of the positive photosensitive composition through a mask having an opening for forming a pattern. The organic film according to [24], wherein the product has a pattern formed by developing with an alkali.

In this specification, in order to show one or both of acrylic acid and methacrylic acid, it may be expressed as “(meth) acrylic acid”. Similarly, in order to indicate one or both of acrylate and methacrylate, it may be expressed as “(meth) acrylate”.
In the present specification, “alkyl” is linear or branched alkyl, and examples thereof include methyl, ethyl, propyl, n-butyl, t-butyl, pentyl, hexyl and the like.
In the present specification, “alkenyl” is linear or branched alkenyl having 1 to 3 double bonds, such as ethenyl, 1-propenyl, 2-propenyl, 1-methylethenyl and 1-butenyl. 2-butenyl, 3-butenyl, 2-methyl-2-propenyl, 1-pentenyl, 2-pentenyl, 4-pentenyl, 3-methyl-2-butenyl, 1-hexenyl, 2-hexenyl, 1-heptenyl, 2 -Heptenyl, 1-octenyl, 2-octenyl, 1,3-octadienyl, 2-nonenyl, 1,3-nonadienyl, 2-decenyl and the like can be mentioned.
In the present specification, “alkynyl” is linear or branched alkynyl having 1 to 3 triple bonds, for example, ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, 2-butynyl. , 3-butynyl, 1-pentynyl, 2-pentynyl, 4-pentynyl, 1-octynyl, 6-methyl-1-heptynyl, 2-decynyl and the like.

  The positive photosensitive composition of the present invention includes, for example, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, and high transparency generally required for a photosensitive composition. And adhesion to the substrate.

  Further, the quinonediazide sulfonic acid ester compound used in the present invention is an adamantane derivative. A positive photosensitive composition using a quinonediazide sulfonic acid ester compound having a novel adamantane ring, which is useful as a photosensitive agent component of the photosensitive composition, can be provided.

  The compound having phenolic OH used in the present invention is an adamantane derivative. A positive photosensitive composition using a phenolic OH-containing compound, which is a precursor of a quinonediazide sulfonic acid ester compound having a novel adamantane ring, useful as a photosensitive agent component of a photosensitive composition as an additive in the composition Can be provided.

  In addition, since the positive photosensitive composition of the present invention contains an alkali-soluble resin and the photosensitive compound of the present invention, it has high sensitivity, high resolution, high heat resistance, good profile, and good focus tolerance. It is possible to provide a photosensitive composition that forms an organic film in which various resist performances such as the development property and the small development residue are balanced.

  Further, since the positive photosensitive composition of the present invention contains an alkali-soluble resin, a photosensitive compound, and the additive of the present invention, it is particularly excellent in resist performances such as heat resistance and sputtering resistance. A photosensitive composition can be provided.

  Further, the organic film of the present invention is formed from a photosensitive composition containing one or both of the photosensitive compound of the present invention and the phenolic OH-containing compound, which is an adamantane derivative, and therefore has high sensitivity and development. An organic film with little residue, high resolution, high heat resistance, and high adhesion on a substrate can be provided.

<1 Positive photosensitive composition containing quinonediazide sulfonic acid ester of the present invention>
A first aspect of the present invention is a positive type containing an alkali-soluble resin soluble in alkali and a quinonediazide sulfonic acid ester of a phenol compound having an adamantane ring (hereinafter also referred to as “photosensitive compound of the present invention”). The present invention relates to a photosensitive composition.

<1-1 Quinonediazide sulfonate used in the present invention>
The photosensitive compound of the present invention may be a compound of an ester of a phenol compound represented by the following general formula (I) and quinonediazide sulfonic acid, or may be two or more compounds. The photosensitive compound of the present invention can be obtained by esterification of a phenol compound represented by the following general formula (I) and quinonediazidesulfonic acid.

In general formula (I), R ¹ and R ² are each independently halogen, cyano, alkyl having 1 to 5 carbons, alkoxy having 1 to 5 carbons, alkenyl having 2 to 5 carbons, or 2 carbons. Represents an alkynyl group having 5 to 5 carbon atoms, a cycloalkyl group having 3 to 8 carbon atoms, a cycloalkenyl group having 3 to 8 carbon atoms, or phenyl, and any hydrogen in the ring in the cycloalkyl, cycloalkenyl and phenyl each independently represents a halogen atom. , Cyano, alkyl having 1 to 5 carbon atoms, alkoxy having 1 to 5 carbon atoms or alkenyl having 2 to 5 carbon atoms, m represents an integer of 1 to 7, and n is independently 1 to 1 Represents an integer of 4.

  The phenol compound having an adamantane ring represented by the general formula (I) can be synthesized, for example, according to the method described in JP-A-2003-306461. That is, the phenol compound represented by the general formula (I) is industrially produced by reacting adamantane-1,3,5-triols with phenols in the presence of an acid catalyst and purifying as necessary. It can be produced in good yield under reaction conditions that are easy to implement.

The phenolic hydroxyl group in the phenol compound represented by the general formula (I) may be bonded to any position of o, p and m with respect to the adamantane ring. Moreover, the phenolic compound represented by the general formula (I) may be a compound in which the phenolic hydroxyl group is bonded to all the hydroxyl groups at the same position (for example, para position), or a plurality of the phenolic hydroxyl groups. It may be a mixture of regioisomers. In the general formula (I), it is preferable from the viewpoint of the simplicity of the production process and the production cost that R ¹ is all the same and R ² is also the same.

Among the phenol compounds represented by the general formula (I), specific examples of compounds that can be easily obtained as industrial materials include structural formulas (II) to (V) shown below. The phenolic compound represented by the formula (I) is not limited to these.

A well-known method is used for the manufacturing method of quinonediazide sulfonic acid ester of said phenol compound. That is, the photosensitive compound of the present invention can be obtained by performing an esterification reaction using various sulfonic acid derivatives having a 1,2-quinonediazide skeleton as an esterifying agent. The esterifying agent is preferably 1,2-naphthoquinonediazide-4-sulfonyl halide, 1,2-naphthoquinonediazide-5-sulfonylhalide, 1,2-naphthoquinonediazide-6-sulfonylhalide, 1,2- Naphthoquinonediazide-7-sulfonyl halide or 1,2-naphthoquinonediazide-8-sulfonyl halide is used. More preferably, 1,2-naphthoquinonediazide-4- or -5-sulfonyl halide is used.

  Examples of the halogen constituting the sulfonyl halide include chlorine and bromine, but it is usually preferable to use chlorine. Therefore, 1,2-naphthoquinonediazide-4- or -5-sulfonyl chloride is preferably used as the esterifying agent. A mixture of 1,2-naphthoquinonediazide-4-sulfonyl halide and 1,2-naphthoquinonediazide-5-sulfonyl halide can also be used as the esterifying agent.

  In the esterification reaction, the amount of 1,2-naphthoquinonediazide-4- and / or -5-sulfonyl halide used is usually 0 in total with respect to the total amount of compounds of structural formulas (II) to (V), for example. The molar ratio is from 0.5 to 4.0, and preferably from 1.0 to 3.3.

  The esterification reaction is usually performed in the presence of a dehydrohalogenating agent. As the dehydrohalogenating agent, a basic compound is generally used. For example, an inorganic base such as sodium carbonate or sodium hydrogen carbonate, ethylamine, ethanolamine, diethylamine, diethanolamine, triethylamine, N, N-dimethylaniline. And amines such as N, N-diethylaniline. The amount of the dehydrohalogenating agent to be used is usually 1.05 to 1.5, preferably 1.05, in a molar ratio to 1,2-naphthoquinonediazide-4- or -5-sulfonyl halide. It is -1.2, More preferably, it is 1.1-1.2.

  The esterification reaction is usually performed in a solvent. Examples of the reaction solvent in the esterification reaction include ethers, lactones, and aliphatic ketones. Among these reaction solvents, a solvent selected from dioxolane, 1,4-dioxane, tetrahydrofuran, γ-butyrolactone, acetone and 2-heptanone is preferable. These solvents can be used alone or in combination of two or more as the reaction solvent. The reaction solvent is particularly preferably 1,4-dioxane. The amount of the reaction solvent used is usually 2 to 6 times by weight, preferably 3 to 5 times by weight, more preferably 4 to 5 times by weight with respect to the total amount of the phenol compound and quinonediazide sulfonyl halide. It is.

  The esterification reaction proceeds sufficiently even under normal pressure and near room temperature, and is generally performed at a temperature in the range of 20 to 30 ° C. and is performed for about 2 to 10 hours.

  After completion of the reaction, the dehydrohalogenating agent is neutralized with an aqueous solution of a known acid such as acetic acid, and the resulting precipitate is filtered off, washed with water and dried to obtain the target product, quinonediazidesulfonic acid. Esters can be removed. The known acid aqueous solution is, for example, an acetic acid aqueous solution or a hydrochloric acid aqueous solution having a concentration of about 0.1 to 2% by weight.

  In the esterification reaction, although depending on the molar ratio of 1,2-naphthoquinonediazidosulfonyl halide used, a compound (monoester) in which any one of the three OHs in the general formula (I) is converted to quinonediazidesulfonyl is usually used. ), A mixture of two or more of a compound (diester) in which any two are quinonediazidosulfonyl and a compound (triester) in which all three are quinonediazidesulfonyl. This mixture can usually be used as it is as the photosensitive compound of the present invention.

  In addition, individual esters obtained by separating and purifying the mixture can also be used as the photosensitive compound of the present invention. The separation and purification of the mixture can be performed by a known separation and purification technique such as column chromatography or recrystallization, although it depends on the composition in the mixture.

  The photosensitive compound of the present invention thus obtained can be advantageously used as a photosensitizer that is sensitive to radiation, particularly ultraviolet rays and some visible rays, and even ultraviolet rays. This photosensitizer is particularly effective when used in combination with alkali-soluble resins such as acrylic resin, phenol resin, polyimide precursor resin, and polybenzoxazole precursor resin to form a positive resist composition. To do.

  The photosensitive compound of the present invention has a derivative having an adamantane ring as a basic structure, and is excellent in high sensitivity, high resolution, high heat resistance, good profile, good focus tolerance, few development residues, etc. The photosensitive composition has a balanced performance.

  Hereinafter, the alkali-soluble resin, the 1,2-quinonediazide compound that can be used in combination, the solvent, and others will be sequentially described.

<1-2 Alkali-soluble resin>
The alkali-soluble resin used in the present invention is a film having a thickness of 0.01 to 100 μm formed by spin coating of a solution and heating at 120 ° C. for 30 minutes, for example, 2.38 wt% tetramethyl at about 25 ° C. This resin is soluble in alkali to such an extent that the film does not remain when immersed in an aqueous solution of ammonium hydroxide for 5 minutes and then rinsed with pure water. The alkali-soluble resin may be a single resin or two or more resins. Examples of the alkali-soluble resin include, but are not limited to, an acrylic resin, a phenol resin, a polyimide precursor resin, a polybenzoxazole precursor resin, and the like.

<1-2-1 Acrylic resin>
The acrylic resin used in the present invention may be a homopolymer or a copolymer as long as it is alkali-soluble, but polymerizes a mixture of monomer A and alkali-soluble monomer B described below. It is preferable that it is a copolymer obtained by making it. In such a copolymer, the mixing ratio (weight) of the monomer A and the alkali-soluble monomer B is preferably 95: 5 to 50:50 in total.

Specific examples of the monomer A include styrene, methyl styrene, vinyl toluene, chloromethyl styrene, tricyclo [5.2.1.0 ^2,6 ] decanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, cyclohexyl (meth) acrylate, butyl (meth) acrylate, phenyl (meth) acrylate, Glycerol mono (meth) acrylate, hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate , 4-hydroxybutyl (meth) acrylate, glycidyl (meth) acrylate, methyl glycidyl (meth) acrylate, α-ethyl acrylate glycidyl ester, 3,4-epoxycyclohexyl (meth) acrylate, (3-methyl-3-oxetanyl ) Methyl (meth) acrylate, (3-ethyl-3-oxetanyl) methyl (meth) acrylate, (3-methyl-3-oxetanyl) ethyl (meth) acrylate, (3-ethyl-3-oxetanyl) ethyl (meth) Acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, (2-ethyl-2-oxetanyl) methyl (meth) acrylate, p-vinylphenyl-3-ethyloxetanyl-
3-ylmethyl ether, 2-phenyl-3- (meth) acryloxymethyl oxetane, 2-trifluoromethyl-3- (meth) acryloxymethyl oxetane, 4-trifluoromethyl-2- (meth) acryloxymethyl One or two or more monomers such as oxetane, N-phenylmaleimide, polystyrene macromonomer, polymethylmethacrylate macromonomer, N-acryloylmorpholine, and indene can be used.

  Specific examples of the alkali-soluble monomer B in the present invention include (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, maleic anhydride, itaconic anhydride, p-hydroxystyrene. , Isopropenyl phenol, (meth) acrylamide and the like, or one or more monomers.

<1-2-1-1 Acrylic Resin Polymerization Method>
The alkali-soluble acrylic resin can be preferably obtained by polymerizing a mixture of monomer A and monomer B.

  The method for polymerizing the acrylic resin as the alkali-soluble resin is not particularly limited, but radical polymerization in a solution using a solvent is preferable. The polymerization temperature is not particularly limited as long as radicals are sufficiently generated from the polymerization initiator used. The polymerization time is not particularly limited, but is usually in the range of 3 to 24 hours. Further, the polymerization can be carried out under any pressure of pressure, reduced pressure or atmospheric pressure.

<1-2-1-2 Acrylic resin polymerization solvent>
The solvent used for the polymerization reaction is preferably a solvent that dissolves the monomer A, the monomer B, and the alkali-soluble acrylic resin to be formed. Specific examples of the solvent include methanol, ethanol, 1-propanol, 2-propanol, acetone, 2-butanone, methyl-2-n-amyl ketone, cyclopentanone, cyclohexanone, ethyl acetate, propyl acetate, butyl acetate, and ethyl lactate. , Ethyl pyruvate, tetrahydrofuran, acetonitrile, dioxane, toluene, xylene, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether , Diethylene glycol monobutyl ether, diethylene glycol dimethyl ether Diethylene glycol methyl ethyl ether, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, acetic acid, water, etc. . One or a mixture of two or more of these can be used as the solvent.

  Polymerization initiators used when synthesizing alkali-soluble acrylic resins include compounds that generate radicals by heat, azo initiators such as azobisisobutyronitrile, and peroxide initiators such as benzoyl peroxide. Can be used. In order to adjust the molecular weight, a suitable amount of a chain transfer agent such as thioglycolic acid may be added.

<1-2-2 Phenolic resin>
The phenol resin is, for example, a condensation reaction product of phenols and aldehydes, a condensation reaction product of phenols and ketones, a polymer using hydroxystyrenes, a polymer using isopropenyl phenols, and these phenol resins. And the like.

  Among these, those obtained by addition-condensation with aldehydes in the presence of an acidic catalyst containing phenols as a main component are called novolak resins.

  Examples of the phenols include cresols such as phenol, m-cresol, p-cresol, and o-cresol; xylenols such as 2,5-xylenol, 3,5-xylenol, 3,4-xylenol, and 2,3-xylenol. Alkyl alkyls such as m-ethylphenol, p-ethylphenol, o-ethylphenol, pt-butylphenol; trialkylphenols such as 2,3,5-trimethylphenol and 2,3,4-trimethylphenol; p-methoxyphenol, m-methoxyphenol, 3,5-dimethoxyphenol, 2-methoxy-4-methylphenol, m-ethoxyphenol, p-ethoxyphenol, m-propoxyphenol, p-propoxyphenol, m-butoxyphenol , P-but Alkoxyphenols such as siphenol; bisalkylphenols such as 2-methyl-4-isopropylphenol; halogenated phenols such as m-chlorophenol, p-chlorophenol, o-chlorophenol; dihydroxybiphenyl, bisphenol A, phenyl And hydroxy aromatic compounds such as phenol, resorcinol and naphthol. One or more of these compounds can be used for the phenols.

  Examples of aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-chloro. Benzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, p-ethylbenzaldehyde, pn -Butylbenzaldehyde, furfural, chloroacetaldehyde, etc. are mentioned. One or more of these compounds can be used for the aldehydes.

  As the acidic catalyst, hydrochloric acid, sulfuric acid, acetic acid, oxalic acid, perchloric acid, p-toluenesulfonic acid, trichloroacetic acid, phosphoric acid and the like can be used. One or more of these compounds can be used for the acidic catalyst.

  Examples of ketones used as a condensation reaction product of phenols and ketones include acetone, methyl ethyl ketone, diethyl ketone, and diphenyl ketone. One or more of these compounds can be used for the ketones.

<1-2-2-1 Phenolic Resin Polymerization Method>
The addition condensation reaction in the production of the phenol resin is performed according to a conventional method. The reaction is usually carried out at 60 to 120 ° C. for 2 to 30 hours, and may be carried out in bulk or an appropriate solvent may be used.

<1-2-2-2 Phenolic Resin Polymerization Method>
Polymers using hydroxystyrenes and polymers using isopropenylphenols can be obtained as various copolymers by the above-described acrylic resin polymerization method.

<1-2-2-3 Hydrogenated product of phenol resin>
The hydrogenated product of the phenol resin can be obtained by a known method. That is, it can be obtained by dissolving a phenol resin in a solvent and introducing hydrogen in the presence of a hydrogenation catalyst.

<1-2-2-4 Solvent used for phenol resin solution>
The solvent used for the phenol resin solution is preferably a solvent that dissolves the resin. Specific examples of the solvent include methanol, ethanol, 1-propanol, 2-propanol, acetone, 2-butanone, methyl-2-n-amyl ketone, cyclopentanone, cyclohexanone, ethyl acetate, propyl acetate, butyl acetate, and ethyl lactate. , Ethyl pyruvate, tetrahydrofuran, acetonitrile, dioxane, toluene, xylene, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether , Diethylene glycol monobutyl ether, diethylene glycol dimethyl ether Diethylene glycol methyl ethyl ether, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, acetic acid, water, etc. . One or a mixture of two or more of these can be used as the solvent.

<1-2-3 Polyimide precursor resin>
The polyimide precursor resin used in the present invention is generally obtained by condensation polymerization of a mixture of tetracarboxylic dianhydride and diamine.

  Specific examples of tetracarboxylic dianhydrides in the present invention include, as aromatic tetracarboxylic dianhydrides, pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic acid Anhydride, 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenone Tetracarboxylic dianhydride, 2,2 ′, 3,3′-benzophenone tetracarboxylic dianhydride, 2,3,3 ′, 4′-benzophenone tetracarboxylic dianhydride, bis- (3,4- Dicarboxyphenyl) ether dianhydride, bis- (3,4-dicarboxyphenyl) sulfone dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride, 2,3,6,7-naphthalene Examples include tetracarboxylic dianhydride and 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride. Examples of alicyclic tetracarboxylic dianhydride include cyclobutanetetracarboxylic dianhydride. Products, methylcyclobutanetetracarboxylic dianhydride, and the like, and examples of the aliphatic tetracarboxylic dianhydride include known compounds such as 1,2,3,4-tetracarboxybutane dianhydride. One or more of these compounds can be used for the tetracarboxylic dianhydride.

Specific examples of diamines in the present invention include, as aromatic diamines, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylsulfone. 4,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfide, 4,4′-di (m-aminophenoxy) diphenylsulfone, 4,4′-di (p-aminophenoxy) diphenylsulfone, o -Phenylenediamine, m-phenylenediamine, p-phenylenediamine, benzidine, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 4,4'-diaminodiphenyl-2,2-propane, 1,5- Diaminonaphthalene, 1,8-diaminonaphthalene, 4,4'-bi (4-aminophenoxy) biphenyl, 2,2-bis {4- (4-aminophenoxy) phenyl} hexafluoropropane, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-amino) Phenoxy) benzene, 4,4′-diamino-3,3′-diethyl-5,5′-dimethyldiphenylmethane, 4,4′-diamino-3,3′-diethyl-5,5′-tetramethyldiphenylmethane, 1 , 4-diaminotoluene, m-xylylenediamine, 2,2′-dimethylbenzidine and the like. Examples of the alicyclic diamine include 1,4-diaminocyclohexane, bis (4-aminocyclohexyl) methane, and isophoronediamine. Aliphatic diamines include trimethylene diamine, tetramethylene diamine, hexamethylene diamine,
2,11-dodecanediamine and the like can be mentioned. Examples of guanamines include acetoguanamine and benzoguanamine. Examples of silicon-based diamines include bis (p-aminophenoxy) dimethylsilane and 1,4-bis (3-amino). Propyldimethylsilyl) benzene, diaminopolysiloxane and the like. One or more of these compounds can be used for the diamine.

<1-2-3-1 Polymerization Method of Polyimide Precursor Resin>
The condensation polymerization reaction in the production of the polyimide precursor resin is performed according to a conventional method. In general, the reaction is usually carried out at 0 to 70 ° C. for 2 to 30 hours, using a suitable solvent. In addition, as the polyimide precursor resin, one obtained by imidizing or isoimidizing a part of the polyamic acid of the polyimide precursor can also be used.

<1-2-3-2 Polymerization solvent for polyimide precursor resin>
Specific examples of preferable solvents used for polymerization of the polyimide precursor resin include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, N, N-diethylacetamide, N, N-diethyl. Formamide, N, N-dimethylmethoxyacetamide, dimethylsulfoxide, tetramethylurea, pyridine, hexamethylphosphoramide, methylformamide, N-acetyl-2-pyrrolidone, γ-butyrolactone, isophorone, ethylene glycol monomethyl ether, ethylene glycol mono Ethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol Monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, acetone, 2-butanone, methyl-2-n-amyl ketone, cyclopentanone, cyclohexanone , Ethyl acetate, propyl acetate, butyl acetate, ethyl lactate, ethyl pyruvate, cresol, tetrahydrofuran, N-methyl-ε-caprolactam, tetrahydrothiophene dioxide [sulfolan] and the like. One or a mixture of two or more of these can be used as the solvent.

  When the above-mentioned alkali-soluble resin has a weight average molecular weight in the range of 1,000 to 100,000 determined by GPC analysis using polyethylene oxide as a standard, the development time until the exposed portion is dissolved with an alkali developer is appropriate. And the surface of the film is less likely to be rough during development. Furthermore, when the weight average molecular weight is in the range of 1,500 to 50,000, the development time until the unexposed portion is dissolved with an alkali developer is appropriate, and the surface of the film is not rough during development. Since the development residue is also extremely small, it is more preferable. For the same reason, the weight average molecular weight is particularly preferably in the range of 2,000 to 20,000.

  The positive photosensitive composition of the present invention may contain components other than the photosensitive compound of the present invention and the alkali-soluble resin described above. Examples of such other components include photosensitive compounds other than the photosensitive compound of the present invention, solvents, additives, and phenol compounds represented by the general formula (I).

<1-3 Combinable 1,2-quinonediazide compound>
In this embodiment, the photosensitive compound contained in the positive photosensitive composition contains a quinonediazide sulfonic acid ester compound having an adamantane ring, but the positive photosensitive composition contains other photosensitive compounds of the present invention and other photosensitive compounds. A photosensitive compound can also be used in combination. The photosensitive compound that can be used in combination is a compound that is soluble in alkali upon irradiation with radiation, that is, photosensitivity to the extent that exposure and development under the manufacturing conditions of a semiconductor integrated circuit and alkali solubility upon irradiation with radiation are possible. If it has, it will not specifically limit. Such photosensitive compounds that can be used in combination include
Other known 1,2-benzoquinone diazide sulfonic acid ester, 1,2-naphthoquinone diazide sulfonic acid ester, 1,2-benzoquinone diazide sulfonamide, 1,2-naphthoquinone diazide sulfonamide, and the like, preferably quinone diazide sulfone It is an acid ester. One or two or more of these compounds can be used as the photosensitive compound that can be used in combination.

  Specific examples of photosensitive compounds that can be used in combination include the following phenol compounds, 1,2-benzoquinonediazide-4-sulfonic acid, 1,2-benzoquinonediazide-5-sulfonic acid, and 1,2-naphthoquinonediazide-4-. Sulfonic acid or ester with 1,2-naphthoquinonediazide-5-sulfonic acid; and a compound in which the hydroxyl group of the following phenol compound is replaced with an amino group, 1,2-benzoquinonediazide-4-sulfonic acid, 2-benzoquinonediazide-5-sulfonic acid, 1,2-naphthoquinonediazide-4-sulfonic acid, or sulfonamide with 1,2-naphthoquinonediazide-5-sulfonic acid.

2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2,3,3 ′, 4-tetrahydroxybenzophenone, 2,3 , 4,4'-tetrahydroxybenzophenone,
Bis (2,4-dihydroxyphenyl) methane, bis (p-hydroxyphenyl) methane, tri (p-hydroxyphenyl) methane, 1,1,1-tri (p-hydroxyphenyl) ethane, bis (2,3,3) 4-trihydroxyphenyl) methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol, bis (2,5-dimethyl-4-hydroxyphenyl) -2-hydroxy Phenylmethane, 3,3,3 ′, 3′-tetramethyl-1,1′-spirobiindene-5,6,7,5 ′, 6 ′, 7′-hexanol, 2,2,4- Trimethyl-7,2 ′, 4′-trihydroxyflavan and the like.

  Moreover, in the positive photosensitive composition of this invention, it is preferable that a photosensitive compound is 5-50 weight part in total with respect to 100 weight part of alkali-soluble resin. Among the photosensitive compounds, the photosensitive compound of the present invention, that is, the quinonediazide sulfonic acid ester compound having an adamantane ring may be a main component of the photosensitive compound, and the total amount is 30 to 100% by weight based on the total amount of the photosensitive compound. It is preferable that it is 50 to 100% by weight.

<1-4 Solvent>
The positive photosensitive composition of the present invention preferably further contains a solvent in addition to the photosensitive compound of the present invention and the alkali-soluble resin contained in the composition. The solvent used in this case is preferably a solvent that dissolves the photosensitive compound and alkali-soluble resin used in the present invention.

Moreover, it is preferable that the solvent used by this invention is a mixed solvent containing 20 weight% or more of at least 1 of the compounds whose boiling point is 100 to 300 degreeC. The solvent having a boiling point of 100 ° C. to 300 ° C. includes water, butyl acetate, butyl propionate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, Methyl ethoxy acetate, ethyl ethoxy acetate, methyl 3-oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, Methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, 2 -Etoki Ethyl propionate, 2-oxy-2-methylpropionic acid methyl,
Ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, aceto Ethyl acetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, dioxane, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,4-butanediol, ethylene glycol monoisopropyl ether, Ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate , Propylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol Examples include dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, toluene, xylene, γ-butyrolactone, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide and the like. .

  Further, in the positive photosensitive composition of the present invention, the total amount of the photosensitive compound and the alkali-soluble resin as solids is 5 to 50% by weight with respect to the total amount of the photosensitive compound, the alkali-soluble resin and the solvent. It is preferable that a solvent is blended.

<1-5 additive>
Various additives can be further added to the positive photosensitive composition of the present invention in order to improve resolution, coating uniformity, developability, and adhesion. Examples of additives include acrylic, styrene, polyethyleneimine or urethane polymer dispersants, anionic, cationic, nonionic or fluorine surfactants, silicone resin coating improvers, silane cups. Adhesion improvers such as ring agents, ultraviolet absorbers such as alkoxybenzophenones, anti-aggregation agents such as sodium polyacrylate, thermal crosslinking agents such as epoxy compounds, melamine compounds or bisazide compounds, and alkali solubility such as organic carboxylic acids Accelerators and the like.

Specific examples of the additive include Polyflow No. 45, polyflow KL-245, polyflow no. 75, Polyflow No. 90, polyflow no. 95 (all are trademarks, manufactured by Kyoeisha Chemical Co., Ltd.), Disperbak 161, Disperse Bake 162, Disperse Bake 163, Disperse Bake 164, Disperse Bake 166, Disperse Bake 170, Disperse Bake 180, Disperse Bake 181, Disper Bake 182, BYK300, BYK306, BYK310, BYK320, BYK330, BYK344, BYK346 (all of which are trademarks, manufactured by Big Chemie Japan Co., Ltd.), KP-341, KP-358, KP-368, KF-96-50CS, KF -50-100CS (all are trademarks, manufactured by Shin-Etsu Chemical Co., Ltd.), Surflon SC-101, Surflon KH-40 (all are trademarks, manufactured by Seimi Chemical Co., Ltd.), Target 222F, Foot 251, FTX-218 (all are trademarks, manufactured by Neos Co., Ltd.), EFTOP EF-351, EFTOP EF-352, EFTOP EF-601, EFTOP EF-801, EFTOP EF-802 (all above) Trademark, manufactured by Mitsubishi Materials Corporation, MegaFuck F-171, MegaFuck F-177, MegaFuck F-475, MegaFuck R-08, MegaFuck R-30 (all of which are trademarks, Dainippon Ink and Chemicals, Inc.) Co., Ltd.), fluoroalkylbenzene sulfonate, fluoroalkyl carboxylate, fluoroalkyl polyoxyethylene ether, fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkyl sulfonate, diglycerin tetrakis ( Fluoroalkylpolyoxyethylene ether), fluoroalkyltrimethylammonium salt, fluoroalkylaminosulfonate, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene alkyl ether, polyoxyethylene lauryl ether, polyoxyethylene Oleyl ether, polyoxyethylene tridecyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene laurate, polyoxyethylene oleate, polyoxyethylene stearate, polyoxyethylene laurylamine, sorbitan laurate, Sorbitan palmitate, sorbitan stearate, sorbitan oleate, sorbitan fatty acid es , Polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan palmitate, polyoxyethylene sorbitan stearate, polyoxyethylene sorbitan oleate, polyoxyethylene naphthyl ether, alkyl benzene sulfonate, alkyl diphenyl ether disulfonate, etc. It is preferable to use at least one selected from these.

  Among these additives, fluoroalkyl benzene sulfonate, fluoroalkyl carboxylate, fluoroalkyl polyoxyethylene ether, fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkyl sulfonate, diglycerin tetrakis (fluoroalkyl polyoxyethylene) Oxyethylene ether), fluorosurfactants such as fluoroalkyltrimethylammonium salts, fluoroalkylaminosulfonates, silicone resin coating properties such as BYK306, BYK344, BYK346, KP-341, KP-358, KP-368 Addition of at least one selected from improvers is preferred because the coating uniformity of the positive photosensitive composition is increased.

<1-6 Phenol Compound Represented by General Formula (I)>
The positive photosensitive composition of the present invention may further contain a phenol compound represented by the general formula (I). Among the phenolic compounds represented by the general formula (I), specific examples of compounds that can be easily obtained as industrial materials include the structural formulas (II) to (V) shown below as described above. However, the phenol compound represented by the general formula (I) is not limited thereto.

  The phenol compound represented by the general formula (I) improves various physical properties such as photosensitivity in the positive photosensitive composition, insolubility in the non-exposed area, and solubility in the exposed area. Therefore, the phenol compound represented by the general formula (I) is blended with the positive photosensitive composition to produce various integrated circuits for semiconductors manufactured using the positive photosensitive composition. The quality and productivity of products such as electronic components such as liquid crystal display elements and solid-state imaging elements can be improved.

  Since the phenol compound represented by the general formula (I) has a basic structure of a derivative having an adamantane ring, like the photosensitive compound of the present invention, the phenol compound is excellent in compatibility with the compound.

  The phenol compound represented by the general formula (I) is preferably 0.5 to 20 parts by weight, and more preferably 1 to 10 parts by weight with respect to 100 parts by weight of the alkali-soluble resin.

<2 Positive Photosensitive Composition Containing Phenol Compound Represented by General Formula (I)>
The second aspect of the present invention contains an alkali-soluble resin soluble in alkali, a photosensitive compound that becomes soluble in alkali upon irradiation with radiation, and a phenol compound represented by the general formula (I). It is a positive photosensitive composition. The phenol compound represented by the general formula (I) is an adamantane derivative. According to this aspect, the phenol compound represented by the general formula (I), which is a precursor of a quinonediazide sulfonic acid ester compound having a novel adamantane ring, which is useful as a photosensitizer component of a photosensitive composition, The positive photosensitive composition used as an additive in the product can be provided.

  As the alkali-soluble resin in this embodiment, the alkali-soluble resin of the first embodiment described above can be used in the same manner as in the first embodiment. Moreover, the photosensitive compound which can be used together with the 1st aspect mentioned above can be used for the photosensitive compound in this aspect similarly to the 1st aspect. Furthermore, the phenol compound represented by the general formula (I) in the first aspect described above can be used in the same manner as the first aspect for the phenol compound represented by the general formula (I) in the present aspect. Furthermore, the positive photosensitive composition in this embodiment can further contain other components such as the additive and solvent of the first embodiment as in the first embodiment.

  In this embodiment, the phenol compound represented by the general formula (I) is, as in the first embodiment, such as photosensitivity in the positive photosensitive composition, insolubility in the non-exposed area, and solubility in the exposed area. Improve various physical properties. Therefore, the phenol compound represented by the general formula (I) is blended with the positive photosensitive composition to produce various integrated circuits for semiconductors manufactured using the positive photosensitive composition. The quality and productivity of products such as electronic components such as liquid crystal display elements and solid-state imaging elements can be improved.

<3 Preservation of positive photosensitive composition>
When the positive photosensitive composition of the present invention is stored in the light-shielded state at a temperature in the range of -30 ° C to 25 ° C, it is preferable because the stability with time of the composition is good. If the storage temperature is −20 ° C. to 10 ° C., there is no precipitate and it is more preferable.

<4 Organic Film Formed by Positive Photosensitive Composition of the Present Invention>
A third aspect of the present invention relates to an organic film formed from the photosensitive composition of the present invention. The organic film of the present invention has a relatively high resolution during patterning, and is optimal for forming a patterned organic film or insulating film having a small hole of 10 μm or less. Here, the organic film is a thin film of the photosensitive composition having a thickness of 0.01 to 100 μm, more preferably 0.10 to 50 μm, and still more preferably 0.10 to 20 μm. The film is subjected to appropriate treatment such as pattern formation), drying, and baking. Examples of such an organic film include an etching mask film provided for forming a metal wiring, and an insulating film (interlayer insulating film) provided for insulating between wirings arranged in layers.

  The organic film can be formed by a usual method in photoresist technology using the photosensitive composition of the present invention. Specifically, the organic film is formed as follows.

  First, a positive photosensitive composition is applied onto a substrate such as glass or wafer by a known method such as spin coating, roll coating, or slit coating. Examples of the substrate include transparent glass substrates such as white plate glass, blue plate glass, and silica coated blue plate glass; synthetic resins such as polycarbonate, polyethersulfone, polyester, acrylic resin, vinyl chloride resin, aromatic polyamide resin, polyamideimide, and polyimide. Sheets, films or substrates; metal substrates such as silicon wafers, aluminum plates, copper plates, nickel plates, stainless steel plates; other ceramic plates; semiconductor substrates having photoelectric conversion elements; If necessary, these substrates can be subjected to pretreatment such as chemical treatment such as a silane coupling agent, plasma treatment, ion plating, sputtering, gas phase reaction method, and vacuum deposition.

  In the formation of the organic film, it is preferable to dry the film of the positive photosensitive composition obtained by the above coating. This drying usually includes, for example, drying at 60 to 120 ° C. for 1 to 5 minutes using a hot plate or an oven.

  Furthermore, in the formation of the organic film, it is preferable to fire the film of the positive photosensitive composition obtained by the coating or the film after drying. This baking includes baking at 120 to 400 ° C. for 2 to 120 minutes.

Regarding the formation of the pattern in the organic film, the positive photosensitive composition is exposed by irradiating the dried film of the positive photosensitive composition on the substrate with radiation through a mask having an opening having a desired pattern shape. . The radiation is not particularly limited as long as the photosensitive compound is sensitive to light. For example, if the photosensitive compound is an ester of a phenol compound and quinonediazidesulfonic acid, ultraviolet rays or visible rays (wavelength: 400 to 500 nm) are preferable. For example, in the case of ultraviolet rays, the irradiation condition of radiation is suitably 5 to 1000 mJ / cm ^{2 for} i-line.

  Next, development is performed by supplying a developer to the film of the positive photosensitive composition irradiated with radiation. For development, a general development method (shower development, spray development, paddle development, dip development, or the like) can be used. The 1,2-quinonediazide compound in the film of the positive photosensitive composition exposed to radiation becomes indenecarboxylic acid, and quickly dissolves in the developer in the development step.

  As the developer, a known developer can be used. The developer is preferably an alkaline solution. Specific examples of the alkali contained in the alkaline solution include tetramethylammonium hydroxide, tetraethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate, sodium hydroxide, water Potassium oxide and the like. As the developer, an aqueous solution of these alkalis is preferably used. More specifically, as the developing solution, organic alkalis such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, etc., and sodium carbonate, sodium hydroxide, potassium hydroxide, etc. Mention may be made of aqueous solutions of inorganic alkalis.

  Methanol, ethanol, or a surfactant may be added to the developer for the purpose of reducing development residue and optimizing the pattern shape. The surfactant can be selected from, for example, anionic, cationic, and nonionic surfactants. Among these, the addition of nonionic polyoxyethylene alkyl ether is particularly preferable because the resolution is increased.

After the development step described above, the developed positive photosensitive composition film is sufficiently rinsed with pure water, and then the above baking is performed, whereby an organic film in which a desired pattern is formed can be suitably obtained. .

In addition, after rinsing with pure water and before firing, the entire surface of the substrate may be irradiated again with an intensity of 100 to 1000 mJ / cm ² . As a result, a highly transparent organic film can be suitably obtained.

  The patterned organic film thus obtained can be used as an etching mask film or as an insulating film. The shape of the hole formed in the organic film is preferably a square, a rectangle, a circle, or an ellipse when viewed from directly above. Furthermore, a transparent electrode may be formed over the insulating film, and after patterning by etching, a film for performing an alignment process may be formed. Since the insulating film has high sputtering resistance, wrinkles are not generated in the insulating film even when a transparent electrode is formed, and high transparency can be maintained.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not limited by these.

[Synthesis Example 1] Synthesis of quinonediazide sulfonic acid ester compound having adamantane ring (photosensitive agent a) In a three-necked flask with a stirrer, 4.1 g (0.010 mol) of the compound of the structural formula (II), 1,2- 5.4 g (0.020 mol) of naphthoquinonediazide-5-sulfonyl chloride was dissolved in 120 g of 1,4-dioxane, and 2.0 g (0.020 mol) of triethylamine was dissolved in the obtained solution in a water bath at about 15 ° C. A solution in which 30 g of 1,4-dioxane was dissolved was gradually added dropwise. After confirming that the exotherm had subsided, the water bath was removed and the mixture was stirred at room temperature for 20 hours. This reaction solution is poured into 450 g of 1% aqueous hydrochloric acid, and the resulting precipitate is filtered off, washed with water and vacuum dried at 40 ° C. to give 1,2-naphthoquinonediazide-5-sulfone of the compound of structural formula (II). 7.6 g of acid ester (photosensitive agent a) was obtained.

[Synthesis Example 2] Synthesis of a quinonediazide sulfonic acid ester compound having adamantane ring (photosensitive agent b) In the same apparatus and method as in Synthesis Example 1, 5.0 g (0.010 mol) of the compound of the structural formula (III), 1, 5.4 g (0.020 mol) of 2-naphthoquinonediazide-5-sulfonyl chloride was dissolved in 120 g of 1,4-dioxane, and 2.0 g of triethylamine (0.2 g) was added to the resulting solution in a water bath at about 15 ° C. 020 mol) in 30 g of 1,4-dioxane was slowly added dropwise. After confirming that the exotherm had subsided, the water bath was removed and the mixture was stirred at room temperature for 20 hours. The reaction solution was poured into 450 g of 1% aqueous hydrochloric acid, and the resulting precipitate was filtered off, washed with water and dried in vacuo at 40 ° C., and 1,2-naphthoquinonediazide-5-sulfone of the compound of structural formula (III) 8.8 g of acid ester (photosensitive agent b) was obtained.

[Synthesis Example 3] Synthesis of a quinonediazide sulfonic acid ester compound having an adamantane ring (photosensitive agent c) In the same apparatus and method as in Synthesis Example 1, 6.4 g (0.010 mol) of the compound of structural formula (IV), 1, 5.4 g (0.020 mol) of 2-naphthoquinonediazide-4-sulfonyl chloride was dissolved in 120 g of 1,4-dioxane, and the resulting solution was dissolved in 2.0 g of triethylamine in a water bath at about 15 ° C. 020 mol) in 30 g of 1,4-dioxane was slowly added dropwise. After confirming that the exotherm had subsided, the water bath was removed and the mixture was stirred at room temperature for 20 hours. This reaction solution is poured into 450 g of 1% aqueous hydrochloric acid, and the resulting precipitate is filtered off, washed with water and vacuum dried at 40 ° C., and 1,2-naphthoquinonediazide-4-sulfone of the compound of structural formula (IV). 9.3 g of acid ester (photosensitive agent c) was obtained.

[Synthesis Example 4] Synthesis of a quinonediazide sulfonic acid ester compound having adamantane ring (photosensitive agent d) In the same apparatus and method as in Synthesis Example 1, 6.6 g (0.010 mol) of the compound of structural formula (V), 1, 6.8 g (0.025 mol) of 2-naphthoquinonediazide-5-sulfonyl chloride was dissolved in 120 g of 1,4-dioxane, and 2.5 g of triethylamine (0.2 g) was added to the resulting solution in a water bath at about 15 ° C. 025 mol) dissolved in 30 g of 1,4-dioxane was gradually added dropwise. After confirming that the exotherm had subsided, the water bath was removed and the mixture was stirred at room temperature for 20 hours. This reaction solution is poured into 450 g of 1% aqueous hydrochloric acid, and the resulting precipitate is filtered off, washed with water, dried under reduced pressure at 40 ° C., and 1,2-naphthoquinonediazide-5-sulfone of the compound of structural formula (V). 12.0 g of acid ester (photosensitive agent d) was obtained.

[Synthesis Example 5] Synthesis of alkali-soluble resin (1) In a four-necked flask with a stirrer, 200.0 g of 2-butanone as a solvent, 40.0 g of benzyl methacrylate as monomer A, 30.0 g of glycidyl methacrylate, 2-hydroxyethyl 10.0 g of methacrylate, 18.0 g of methacrylic acid as the monomer B, and 2.0 g of 2,2′-azobis (2,4-dimethylvaleronitrile) as the polymerization initiator are charged, and the reflux temperature of 2-butanone is 4 hours. Polymerization was performed by heating.

The resulting reaction solution was cooled to room temperature and charged into a large amount of hexane. The generated precipitate was dissolved in N-methyl-2-pyrrolidone (hereinafter referred to as “NMP”), and 2-butanone and hexane as polymerization solvents were distilled off at 100 ° C. under a reduced pressure of 1.33 × 10 ⁴ Pa. An NMP solution of the alkali-soluble resin (1) was obtained.

  A portion of the obtained NMP solution is sampled, dried at 220 ° C. for 30 minutes, and the weight of the sample is determined. The weight value is used as the weight of the polymer to determine the yield. As a result of preparing a solution by adding NMP so that the polymer concentration was 30% by weight and measuring the weight average molecular weight, the yield of the obtained alkali-soluble resin (1) was 76%. The obtained alkali-soluble resin (1) had a weight average molecular weight of 5,500 as determined by GPC analysis (polyethylene oxide standard).

[Synthesis Example 6] Synthesis of Alkali-Soluble Resin (2) To a four-necked flask equipped with a stirrer, a cooler, and a decompression device, metacresolic acid (JIS)
K2437, equivalent to metacresolic acid No. 1) 360 g, 37% formalin 207.9 g and oxalic acid dihydrate 5.04 g were charged, and the mixture was heated and stirred in an oil bath at a temperature of 106 ° C. for 2 hours in a nitrogen atmosphere. I let you.

Subsequently, after performing dehydration operation of gradually heating and depressurizing until the temperature reaches 140 ° C. and the pressure becomes 4.8 × 10 ⁴ Pa, the temperature is 180 ° C. and the pressure is 2.0 × 10 ³ in order to remove the residual monomer. Heating and depressurization were gradually performed until Pa was reached.

After the distillation, the distillate was poured into a cooling dish and cooled and solidified at room temperature to obtain 311.4 g of a cresol novolac resin.

  NMP was added to the obtained cresol novolac resin so that the solid concentration was 30% by weight to prepare a solution. The obtained alkali-soluble resin (2) had a weight average molecular weight of 8,300 determined by GPC analysis (polyethylene oxide standard).

[Synthesis Example 7] Synthesis of Alkali-Soluble Resin (3) A flask equipped with a stirrer, a dropping funnel, a thermometer, a condenser, and a nitrogen substitution device was fixed in a thermostatic bath. 385 g of dehydrated and purified NMP and 2,2-bis [4-
51.8 g of (4-aminophenoxy) phenyl] hexafluoropropane was added and stirring was continued. To the obtained solution, 44.4 g of 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride was added, and a polyamic acid solution was obtained by a reaction at 20 to 30 ° C. for 8 hours.

  To this solution, 28.9 g of N, N'-dicyclohexylcarbodiimide was added and reacted at this temperature for another 30 minutes to effect polyisoimidation. Then, reaction was performed at 50-60 degreeC for 12 hours. After the white precipitate N, N′-dicyclohexylurea formed was removed by filtration, the resulting solution was dropped into a large amount of ethanol, and the resulting precipitate was filtered and dried under reduced pressure at 50 ° C. overnight to obtain an alkali. A polyimide precursor which is a soluble resin (3) was obtained.

  20.0 g of the polyimide precursor obtained by drying under reduced pressure was dissolved in 60.0 g of NMP to obtain a solution having a solid content concentration of 25.0% by weight. The obtained alkali-soluble resin (3) had a weight average molecular weight of 14,900 determined by GPC analysis (polyethylene oxide standard).

[Example 1]
[Production of positive photosensitive composition]
The quinonediazide sulfonic acid ester compound having an adamantane ring obtained in Synthesis Example 1 (photosensitive agent a), the alkali-soluble resin (1) obtained in Synthesis Example 5, and Seimi Chemical Co., Ltd. which is a fluorosurfactant as an additive Surflon SC-101 (hereinafter abbreviated as SC-101) and NMP as a solvent were mixed and dissolved at the following weights to obtain a positive photosensitive composition.
Photosensitizer a 0.75g
10.00 g of 30 wt% solution of alkali-soluble resin (1)
NMP 1.75g
SC-101 0.006g

[Evaluation method of positive photosensitive composition]
1) Formation of Patterned Organic Film The positive photosensitive composition prepared in Example 1 was spin coated on a glass substrate at 800 rpm for 10 seconds and dried on a hot plate at 100 ° C. for 2 minutes. This substrate is passed through a mask for hole pattern formation in the air using a TOPCON CO., LTD. Proximity exposure machine TME-150PRC, and the light of 350 nm or less is cut through the wavelength cut filter to remove g, h, i lines. The film was taken out and exposed with an exposure gap of 100 μm. The exposure amount was 150 mJ / cm ^{2 as} measured with an integrated light meter UIT-102 manufactured by USHIO INC. And a photoreceiver UVD-365PD. The exposed glass substrate was dip-developed with an aqueous 2.38 wt% tetramethylammonium hydroxide solution for 60 seconds to remove the exposed portion. The substrate after development was washed with pure water for 60 seconds and then dried on a hot plate at 100 ° C. for 2 minutes. This substrate was post-baked in an oven at 230 ° C. for 30 minutes to form a patterned organic film having a thickness of 3 μm.

2) Film thickness The film thickness used the stylus type film thickness meter (alpha) step 200 by KLA-Tencor, Inc., and made the average value of the measurement of three places into the film thickness.

3) Heat resistance The substrate after post-baking was further baked at 230 ° C. for 30 minutes, and the heat resistance was confirmed using the average value of three measurements in the same manner as the film thickness. The value of (film thickness after additional baking) / (film thickness after post-baking) was used as an index of heat resistance.

4) Sensitivity and remaining film ratio after development The sensitivity was determined as an exposure amount at which the remaining film ratio after development in the following unexposed area was 93% or more and the exposed area was completely dissolved.
The post-development residual film ratio was calculated from the following equation by measuring the film thickness of the unexposed portion before and after development.
(Film thickness after unexposed portion development / film thickness before unexposed portion development) × 100 (%)

5) Resolution The post-baked patterned organic film substrate obtained in 1) above was observed at 400 times with an optical microscope, and the mask size at which the glass was exposed at the bottom of the hole pattern was confirmed.

6) Adhesiveness The substrate of the patterned organic film obtained in 1) above was evaluated by a cross-cut peel test (cross cut test). The evaluation represents the number of remaining grids after tape peeling in 100 1 mm square grids.

  Table 1 shows the results obtained by the evaluation method described above for the positive photosensitive composition synthesized in Example 1.

[Example 2]
Quinonediazide sulfonic acid ester compound having an adamantane ring obtained in Synthesis Example 2 (photosensitive agent b), alkali-soluble resin (2) obtained in Synthesis Example 6, fluorine-based surfactant SC-101 as an additive, and solvent NMP was mixed and dissolved in the following weights to prepare a positive photosensitive composition, and the composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
Photosensitizer b 0.75g
10.00 g of 30 wt% solution of alkali-soluble resin (2)
NMP 1.75g
SC-101 0.006g

[Example 3]
A quinonediazide sulfonic acid ester compound having an adamantane ring obtained in Synthesis Example 3 (photosensitive agent c), an alkali-soluble resin (3) obtained in Synthesis Example 7, a fluorine-based surfactant SC-101 as an additive, and a solvent NMP was mixed and dissolved in the following weights to prepare a positive photosensitive composition, and the composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
Photosensitizer c 0.625g
10.00 g of 25 wt% solution of alkali-soluble resin (3)
NMP 2.96g
SC-101 0.007g

[Example 4]
The quinonediazide sulfonic acid ester compound having an adamantane ring obtained in Synthesis Example 4 (photosensitive agent d), the alkali-soluble resin (3) obtained in Synthesis Example 7, and Shin-Etsu Chemical Co., Ltd. which is a silicon surfactant as an additive A positive photosensitive composition was prepared by mixing and dissolving KP-341 manufactured by company and NMP as a solvent in the following weights, and the composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
Photosensitizer d 0.625g
10.00 g of 25 wt% solution of alkali-soluble resin (3)
NMP 2.96g
KP-341 0.014g

[Example 5]
The quinonediazide sulfonic acid ester compound having an adamantane ring obtained in Synthesis Example 1 (photosensitive agent a), the compound of the structural formula (II), the alkali-soluble resin (1) obtained in Synthesis Example 5, and a fluorine-based interface as an additive SC-101 as an activator and NMP as a solvent were mixed and dissolved in the following weights to prepare a positive photosensitive composition. The composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
Photosensitizer a 0.75g
0.15 g of compound of structural formula (II)
10.00 g of 30 wt% solution of alkali-soluble resin (2)
NMP 2.31g
SC-101 0.007g

[Example 6]
2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonic acid ester (NT-200 manufactured by Toyo Gosei Co., Ltd., photosensitive agent e) as a photosensitive agent e, a compound of the structural formula (II), A positive photosensitive composition was prepared by mixing and dissolving the alkali-soluble resin (2) obtained in Synthesis Example 6, SC-101 which is a fluorosurfactant as an additive, and NMP as a solvent in the following weights. The composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
Photosensitizer e (NT-200) 0.84g
0.15 g of compound of structural formula (II)
10.00 g of 30 wt% solution of alkali-soluble resin (2)
NMP 2.31g
SC-101 0.007g

[Example 7]
A positive photosensitive composition was prepared in the same manner as in Example 6 except that the compound of structural formula (III) was used instead of the compound of structural formula (II), and evaluated in the same manner as in Example 1. The results are shown in Table 1.

[Example 8]
A positive photosensitive composition was prepared in the same manner as in Example 6 except that the compound of structural formula (IV) was used in place of the compound of structural formula (II), and evaluated in the same manner as in Example 1. The results are shown in Table 1.

[Example 9]
A positive photosensitive composition was prepared in the same manner as in Example 6 except that the compound of structural formula (V) was used instead of the compound of structural formula (II), and evaluated in the same manner as in Example 1. The results are shown in Table 1.

[Comparative Example 1]
A positive photosensitive composition was prepared and evaluated in the same manner as in Example 1 except that the photosensitive agent e was used instead of the photosensitive agent a. The results are shown in Table 2.

[Comparative Example 2]
4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol-1,2-naphthoquinonediazide-5-sulfonic acid instead of sensitizer a A positive photosensitive composition was prepared and evaluated in the same manner as in Example 1 except that ester (P-200 manufactured by Toyo Gosei Kogyo Co., Ltd., photosensitive agent f) was used. The results are shown in Table 2.

[Comparative Example 3]
The positive photosensitive composition was the same as in Example 6 except that the compound of the structural formula (II) was excluded from the components of the positive photosensitive composition used in Example 6 and NMP was mixed and dissolved in the following weights. A product was prepared and the composition was evaluated in the same manner as in Example 1. The results are shown in Table 2.
Photosensitizer e (NT-200) 0.84g
10.00 g of 30 wt% solution of alkali-soluble resin (2)
NMP 1.96g
SC-101 0.007g

  As is apparent from Tables 1 and 2, it can be seen that the compositions of the examples are clearly superior to the compositions of the comparative examples in heat resistance. In addition, it can be seen that the compositions of the examples are equivalent to or better than the compositions of the comparative examples in sensitivity, remaining film ratio after development, and resolution. In particular, when Example 1 is compared with Comparative Examples 1 and 2, and when Example 6 and Comparative Example 3 are compared, the composition of the Example is clearly the composition of the Comparative Example in both sensitivity and heat resistance. It turns out that it is superior. Furthermore, it turns out that the composition of an Example is equivalent to the composition of a comparative example in adhesiveness. As described above, the compositions of the examples show high resistivities, high resolving power, high heat resistance, good profile, good focus tolerance, and low resist performance such as development residue, and these performances are balanced. It can be seen that an organic film is formed.

  The positive photosensitive composition of the present invention can be used, for example, in the production process of a semiconductor element, a liquid crystal display element and an EL display element.

Claims (25)

A positive photosensitive composition containing an alkali-soluble resin soluble in alkali and a quinonediazide sulfonic acid ester of a phenol compound represented by the following general formula (I).

(Wherein R ¹ and R ² are each independently halogen, cyano, alkyl having 1 to 5 carbons, alkoxy having 1 to 5 carbons, alkenyl having 2 to 5 carbons, or 2 to 5 carbons) Represents alkynyl, cycloalkyl having 3 to 8 carbon atoms, cycloalkenyl having 3 to 8 carbon atoms, or phenyl, and any hydrogen in the ring in the cycloalkyl, cycloalkenyl and phenyl is independently halogen, cyano, C 1-5 alkyl, C 1-5 alkoxy or C 2-5 alkenyl may be substituted, m represents an integer of 0-7, and n is an integer of 0-4 independently. Represents.) ^2. The positive photosensitive composition according to claim 1, wherein all of R ¹ are the same and all of R ² are the same.   3. The positive photosensitive composition according to claim 1, wherein the phenyl bonded to the adamantane ring in the general formula (I) has a hydroxyl group at the 4-position. 4. The positive photosensitive composition according to claim 3, wherein m is 0, and R ² is independently alkyl, cycloalkyl, or phenyl.   The positive photosensitive composition according to claim 4, wherein n is 0. 5. The positive photosensitive resin according to claim 4, wherein the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3 and 5 positions, and both R ² are methyl. Composition. The positive photosensitive composition according to claim 4, wherein the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position thereof, and R ² is cyclohexyl. The positive photosensitive composition according to claim 4, wherein the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position thereof, and R ² is phenyl. The quinonediazide sulfonic acid ester of the phenol compound represented by the general formula (I) is an ester of the phenol compound represented by the general formula (I) and quinonediazide-4-sulfonic acid or quinonediazide-5-sulfonic acid. The positive photosensitive composition as described in any one of Claims 1-8 characterized by the above-mentioned. The quinonediazide sulfonic acid ester of the phenol compound represented by the general formula (I) is
9. The positive photosensitive composition according to claim 5, wherein the positive photosensitive composition is an ester of a phenol compound represented by the general formula (I) and a quinonediazide-5-sulfonic acid. . The quinonediazide sulfonic acid ester of the phenol compound represented by the general formula (I) is an ester of the phenol compound represented by the general formula (I) and quinonediazide-4-sulfonic acid. 7. The positive photosensitive composition according to 7.   The positive photosensitive resin according to any one of claims 1 to 11, further comprising a phenol compound represented by the general formula (I) according to any one of claims 1 to 8. Sex composition. A positive photosensitive composition containing an alkali-soluble resin soluble in alkali, a photosensitive compound that becomes soluble in alkali upon irradiation with radiation, and a phenol compound represented by the following general formula (I).

(Wherein R ¹ and R ² are each independently halogen, cyano, alkyl having 1 to 5 carbons, alkoxy having 1 to 5 carbons, alkenyl having 2 to 5 carbons, or 2 to 5 carbons) Represents alkynyl, cycloalkyl having 3 to 8 carbon atoms, cycloalkenyl having 3 to 8 carbon atoms, or phenyl, and any hydrogen in the ring in the cycloalkyl, cycloalkenyl and phenyl is independently halogen, cyano, C 1-5 alkyl, C 1-5 alkoxy or C 2-5 alkenyl may be substituted, m represents an integer of 0-7, and n is an integer of 0-4 independently. Represents.) The positive photosensitive composition according to claim 13, wherein all of R ¹ are the same and all of R ² are the same.   15. The positive photosensitive composition according to claim 13 or 14, wherein the phenyl bonded to the adamantane ring in the general formula (I) has a hydroxyl group at the 4-position thereof. 16. The positive photosensitive composition according to claim 15, wherein m is 0, and R ² is independently alkyl, cycloalkyl, or phenyl.   The positive photosensitive composition according to claim 16, wherein the n is 0. 17. The positive photosensitive resin according to claim 16, wherein the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3 and 5 positions, and both R ² are methyl. Composition. The positive photosensitive composition according to claim 16, wherein the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position, and R ² is cyclohexyl. The positive photosensitive composition according to claim 16, wherein the phenyl bonded to the adamantane ring in the general formula (I) has R ² only at the 3-position, and R ² is phenyl.   21. The positive photosensitive composition according to any one of claims 13 to 20, wherein the photosensitive compound is a quinonediazide sulfonate ester.   The organic film which consists of a positive photosensitive composition as described in any one of Claims 1-21.   The organic film according to claim 22, wherein the film of the positive photosensitive composition is baked.   24. The organic film according to claim 22 or 23, wherein the organic film has a pattern.   Formed by developing the positive photosensitive composition in which the photosensitive compound is exposed to radiation by irradiating the film of the positive photosensitive composition through a mask having an opening for forming a pattern with an alkali. The organic film according to claim 24, wherein the organic film has a patterned pattern.