JP2008090163A - Electronic apparatus and electronic camera - Google Patents

Electronic apparatus and electronic camera Download PDF

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JP2008090163A
JP2008090163A JP2006273039A JP2006273039A JP2008090163A JP 2008090163 A JP2008090163 A JP 2008090163A JP 2006273039 A JP2006273039 A JP 2006273039A JP 2006273039 A JP2006273039 A JP 2006273039A JP 2008090163 A JP2008090163 A JP 2008090163A
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housing
electronic device
heat
electronic
electronic camera
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JP5061566B2 (en
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Akinori Ito
彰則 伊藤
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Nikon Corp
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Nikon Corp
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Priority to JP2006273039A priority Critical patent/JP5061566B2/en
Priority to EP07829233.1A priority patent/EP2071399B1/en
Priority to PCT/JP2007/069495 priority patent/WO2008041753A1/en
Priority to US12/073,041 priority patent/US7664386B2/en
Publication of JP2008090163A publication Critical patent/JP2008090163A/en
Priority to US12/651,092 priority patent/US7920784B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To properly dissipate heat generated by a heating member of an electronic apparatus. <P>SOLUTION: The electronic apparatus includes a heat transfer member 35 of a three-dimensional shape having at least a first surface 35a bonded to the heating member 30 and a second surface 35b bonded to an internal surface 1 of a case. The first surface 35a has an area not less than the area to be bonded to the heating member 30, and the entire surface of the second surface 35b is bonded to the internal surface 1 of the case. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子機器および電子カメラに関する。   The present invention relates to an electronic device and an electronic camera.

投影機能を有する電子機器が知られている(特許文献1参照)。   An electronic device having a projection function is known (see Patent Document 1).

特開2005−250392号公報JP 2005-250392 A

この種の電子機器では、投影光の輝度を高くすると、光源部による発熱の問題が生じる。   In this type of electronic apparatus, when the brightness of the projection light is increased, a problem of heat generation by the light source unit occurs.

(1)本発明による電子機器は、発熱部材と接合される第1の面、および筐体の内側面と接合される第2の面を少なくとも有する立体形状の伝熱部材であって、第1の面は発熱部材と接合する面積以上の面積を有し、第2の面の全面が筐体の内側面と接合される伝熱部材を備えることを特徴とする。
(2)請求項1に記載の電子機器において、伝熱部材の形状は、略四辺形で囲まれた6面体であってもよい。
(3)請求項2に記載の電子機器において、第2の面を構成する四辺形の短辺の長さは、第1の面を構成する四辺形の長辺の長さの1/2以上であることが好ましい。
(4)請求項1〜3のいずれか一項に記載の電子機器において、第2の面にねじと螺合する穴が設けられ、第2の面および筐体の内側面はねじで固着されることが好ましい。
(5)請求項1〜4のいずれか一項に記載の電子機器において、発熱部材は発光素子が実装されている基板であってもよい。
(6)請求項1〜5のいずれか一項に記載の電子機器において、伝熱部材はアルミニウムで構成されることが好ましい。
(7)請求項1〜6のいずれか一項に記載の電子機器において、筐体は金属製であることが好ましい。
(8)請求項1〜7のいずれか一項に記載の電子機器において、第1の面と発熱部材との間、第2の面と筐体の内側面との間は、それぞれ熱伝導性部材を挟んで接合されることが好ましい。
(9)本発明による電子カメラは、請求項1〜8のいずれか一項に記載の伝熱部材を備えることを特徴とする。
(10)請求項9に記載の電子カメラにおいて、伝熱部材の第2の面は、筐体前側の面と接合されることが好ましい。
(1) An electronic device according to the present invention is a three-dimensional heat transfer member having at least a first surface bonded to a heat generating member and a second surface bonded to an inner side surface of a housing. The surface has an area equal to or larger than the area to be joined to the heat generating member, and the second surface has a heat transfer member to be joined to the inner side surface of the housing.
(2) In the electronic device according to claim 1, the shape of the heat transfer member may be a hexahedron surrounded by a substantially quadrilateral.
(3) In the electronic device according to claim 2, the length of the short side of the quadrilateral that forms the second surface is equal to or longer than the length of the long side of the quadrilateral that forms the first surface. It is preferable that
(4) In the electronic device according to any one of claims 1 to 3, a hole to be screwed with a screw is provided on the second surface, and the second surface and the inner surface of the housing are fixed with the screw. It is preferable.
(5) In the electronic apparatus according to any one of claims 1 to 4, the heat generating member may be a substrate on which a light emitting element is mounted.
(6) In the electronic device according to any one of claims 1 to 5, the heat transfer member is preferably made of aluminum.
(7) In the electronic device according to any one of claims 1 to 6, the casing is preferably made of metal.
(8) In the electronic device according to any one of claims 1 to 7, thermal conductivity is provided between the first surface and the heat generating member, and between the second surface and the inner side surface of the housing. It is preferable that the members are joined together.
(9) An electronic camera according to the present invention includes the heat transfer member according to any one of claims 1 to 8.
(10) In the electronic camera according to the ninth aspect, it is preferable that the second surface of the heat transfer member is joined to a surface on the front side of the housing.

本発明による電子機器では、発熱部材による熱を適切に放熱できる。   In the electronic apparatus according to the present invention, the heat generated by the heat generating member can be appropriately radiated.

以下、図面を参照して本発明を実施するための最良の形態について説明する。図1は、本発明の一実施の形態によるプロジェクタ付き電子カメラ(以下、PJ内蔵電子カメラと呼ぶ)を前方から見た図である。図1において、PJ内蔵電子カメラの筐体前面1には、撮影光学系12と、投影光学系21とが設けられている。PJ内蔵電子カメラの上面には、レリーズボタン11が設けられている。PJ内蔵電子カメラは、机上などに載置された状態、または不図示のクレードル上に載置された状態で、PJ内蔵電子カメラの前方に配設されるスクリーンなどに向けて、内蔵する投射部20(プロジェクタ)による画像などの投影情報を投影光学系21から投影する。   The best mode for carrying out the present invention will be described below with reference to the drawings. FIG. 1 is a front view of an electronic camera with a projector (hereinafter referred to as a PJ built-in electronic camera) according to an embodiment of the present invention. In FIG. 1, a photographing optical system 12 and a projection optical system 21 are provided on the front surface 1 of the housing of the electronic camera with a built-in PJ. A release button 11 is provided on the top surface of the PJ built-in electronic camera. The PJ built-in electronic camera is a projection unit that is built on a desk or the like, or is placed on a cradle (not shown) and directed toward a screen disposed in front of the PJ built-in electronic camera. Projection information such as an image by 20 (projector) is projected from the projection optical system 21.

図2は、図1のPJ内蔵電子カメラを底面側から見た図である。図2において、PJ内蔵電子カメラの筐体後面2には、液晶モニタ14が設けられている。PJ内蔵電子カメラの筐体前面1は、曲面を有している。筐体前面1および筐体後面2のうち、少なくとも筐体前面1は金属製である。   2 is a view of the PJ built-in electronic camera of FIG. 1 as viewed from the bottom side. In FIG. 2, a liquid crystal monitor 14 is provided on the rear surface 2 of the housing of the PJ built-in electronic camera. The housing front surface 1 of the PJ built-in electronic camera has a curved surface. Of the housing front surface 1 and the housing rear surface 2, at least the housing front surface 1 is made of metal.

図1および図2によれば、撮像部10(破線で表示)が向かって右側に配設される。具体的には、撮影光学系12が筐体前面1の右上部に配設され、撮像素子13が右底面寄りに配設される。投射部20(破線で表示)は、PJ内蔵電子カメラの筐体の略中央(左右方向において中央)上端部に撮像部10と並べて配設される。   According to FIGS. 1 and 2, the imaging unit 10 (indicated by a broken line) is disposed on the right side. Specifically, the photographing optical system 12 is disposed at the upper right portion of the front surface 1 of the housing, and the image sensor 13 is disposed near the right bottom surface. The projection unit 20 (indicated by a broken line) is arranged side by side with the imaging unit 10 at the upper end of the approximate center (center in the left-right direction) of the housing of the PJ built-in electronic camera.

撮像部10を構成する撮影光学系12は、筐体前面1側から入射された被写体光束をカメラ筐体内で折り曲げて撮像素子13へ導く屈折光学系である。このような屈折光学系を用いることにより、PJ内蔵電子カメラの筐体前面1と筐体後面2との間が薄く構成されている。   The imaging optical system 12 constituting the imaging unit 10 is a refractive optical system that guides the subject luminous flux incident from the front surface 1 side of the housing to the imaging device 13 by bending the light beam in the camera housing. By using such a refractive optical system, the space between the housing front surface 1 and the housing rear surface 2 of the electronic camera with a built-in PJ is made thin.

投射部20を構成する熱伝導部材35は、ビス37によってPJ内蔵電子カメラの筐体前面1の内側に固着されている。熱伝導部材35の筐体前面1側の面35bは、筐体前面1の内側面に沿うように曲面加工されている。熱伝導部材35の面35bが熱伝導性シール部材36(図3)を挟んで筐体前面1にビス止めされることにより、熱伝導部材35は筐体前面1と面接触するように固着される。また、熱伝導部材35の筐体後面2側の面35dは、液晶モニタ14のバックプレート14bの面に沿うように平面加工されている。バックプレート14bは、金属製パネル部材によって構成されている。筐体前面1と筐体後面2とが接合された状態では、バックプレート14bと熱伝導部材35とが不図示の熱伝導性シール部材を挟んで当接するように構成される。   The heat conduction member 35 constituting the projection unit 20 is fixed to the inside of the front surface 1 of the housing of the electronic camera with a built-in PJ by screws 37. The surface 35b of the heat conducting member 35 on the front surface 1 side of the housing is curved so as to follow the inner surface of the front surface 1 of the housing. The surface 35b of the heat conductive member 35 is screwed to the front surface 1 of the housing with the heat conductive seal member 36 (FIG. 3) interposed therebetween, so that the heat conductive member 35 is fixed so as to be in surface contact with the front surface 1 of the housing. The Further, the surface 35 d on the housing rear surface 2 side of the heat conducting member 35 is processed to be flat along the surface of the back plate 14 b of the liquid crystal monitor 14. The back plate 14b is configured by a metal panel member. In a state where the housing front surface 1 and the housing rear surface 2 are joined, the back plate 14b and the heat conducting member 35 are configured to contact each other with a heat conducting seal member (not shown) interposed therebetween.

投射部20の詳細について、図3および図4を参照して説明する。図3は、投射部20の光学系を図1における左側方から見た図である。図4は、図3の光学系を前面側から見た図であり、筐体前面1および投影光学系21を省略してある。   The detail of the projection part 20 is demonstrated with reference to FIG. 3 and FIG. 3 is a view of the optical system of the projection unit 20 as viewed from the left side in FIG. FIG. 4 is a view of the optical system of FIG. 3 as viewed from the front side, and the housing front surface 1 and the projection optical system 21 are omitted.

投射部20の光学系は、1辺が約10mmの略正方形を底面とする四角柱形状のモジュール(以降投射モジュールと呼ぶ)として構成される。投射モジュールは長手方向を縦(上下)に配設され、その底面(下面)に熱伝導部材35が接合される。なお、図3および図4は、内部構成をわかりやすく図示するために、四角柱の長手方向のサイズを実際より長く表している。   The optical system of the projection unit 20 is configured as a quadrangular prism-shaped module (hereinafter referred to as a projection module) having a substantially square shape with a side of about 10 mm. The projection module is arranged in the longitudinal direction vertically (up and down), and the heat conducting member 35 is joined to the bottom surface (lower surface). 3 and 4 show the size of the rectangular column in the longitudinal direction longer than the actual size for easy understanding of the internal configuration.

投射モジュールには、LED23(LED基板30)と、集光光学系24と、偏光板25と、PBS(偏光ビームスプリッタ)ブロック26と、液晶パネル22と、投影光学系21とが含まれる。上記部材のうち、投影光学系21を除く部材はシェル部材40内に一体化構成される。具体的には、アルミ製薄板部材をコ字形に折り曲げ加工した部材40の下部開放面に、LED基板30が配設される。LED基板30はアルミ基板で構成され、当該基板の絶縁層上に形成されているパターン上に、発光素子であるLED23が実装される。   The projection module includes an LED 23 (LED substrate 30), a condensing optical system 24, a polarizing plate 25, a PBS (polarizing beam splitter) block 26, a liquid crystal panel 22, and a projection optical system 21. Of the above members, members other than the projection optical system 21 are integrally formed in the shell member 40. Specifically, the LED substrate 30 is disposed on the lower open surface of the member 40 obtained by bending an aluminum thin plate member into a U-shape. The LED substrate 30 is made of an aluminum substrate, and the LED 23 that is a light emitting element is mounted on a pattern formed on the insulating layer of the substrate.

シェル部材40にはさらに、集光光学系24およびPBSブロック26が接着される。PBSブロック26は、入射光軸に対して45度の角度をなす偏光分離部26aを2つの三角プリズムで挟んだ偏光ビームスプリッタである。PBSブロック26の面26bには、たとえば、黒色処理などの無反射処理が施される。   Further, the condensing optical system 24 and the PBS block 26 are bonded to the shell member 40. The PBS block 26 is a polarization beam splitter in which a polarization separation unit 26a that forms an angle of 45 degrees with respect to an incident optical axis is sandwiched between two triangular prisms. The surface 26b of the PBS block 26 is subjected to non-reflective processing such as black processing, for example.

PBSブロック26の下側面(集光光学系24側の面)には偏光板25が配設され、PBSブロック26の上側面には反射型液晶素子(LCOS)によって構成される液晶パネル22が配設される。   A polarizing plate 25 is disposed on the lower surface of the PBS block 26 (the surface on the condensing optical system 24 side), and a liquid crystal panel 22 composed of a reflective liquid crystal element (LCOS) is disposed on the upper surface of the PBS block 26. Established.

熱伝導部材35は、たとえば四辺形で囲まれた立体形状のアルミブロックで構成される。熱伝導部材35の材質はアルミでなくても、銅やグラファイトなどの熱伝導性が高い部材であればよい。熱伝導部材35は熱伝導経路を構成する部材なので、熱抵抗を小さくすることが好ましい。したがって、熱伝導経路の断面を小さくする加工(たとえば、熱伝導部材35の表面を削ってフィンを形成する)を避ける。また、熱伝導部材35の厚み(図3において縦方向のサイズであって、面35bを構成する四辺形の短辺)は所定値(たとえば5mm)以上を確保するとともに、熱伝導部材35の長さ(図3において横方向のサイズであって、面35aを構成する四辺形の長辺)は厚みの2倍以下に抑える。   The heat conducting member 35 is formed of, for example, a three-dimensional aluminum block surrounded by a quadrilateral. The material of the heat conducting member 35 is not limited to aluminum but may be any member having high heat conductivity such as copper or graphite. Since the heat conducting member 35 is a member constituting a heat conducting path, it is preferable to reduce the thermal resistance. Therefore, processing for reducing the cross section of the heat conduction path (for example, cutting the surface of the heat conduction member 35 to form fins) is avoided. Further, the thickness of the heat conductive member 35 (the vertical size in FIG. 3 and the short side of the quadrilateral forming the surface 35b) is not less than a predetermined value (for example, 5 mm), and the length of the heat conductive member 35 is long. The length (the long side of the quadrilateral that forms the surface 35a in FIG. 3) is suppressed to twice or less the thickness.

熱伝導部材35は、発熱部材(本実施形態ではLED基板30)からの熱伝導をよくするようにLED基板30と面接合される。具体的には、熱伝導部材35の面35aおよびLED基板30間に熱伝導性が高い充填材を充填したり、熱伝導性シール部材を挟んだりする。熱伝導部材35の面35bにはビス穴35cが設けられている。上述したように、熱伝導部材35の面35bおよび筐体前面1は、両者間に熱伝導性シール部材36を挟んで面接触するようにビス37によって固着される。   The heat conducting member 35 is surface-bonded to the LED substrate 30 so as to improve heat conduction from the heat generating member (the LED substrate 30 in this embodiment). Specifically, a filler having high thermal conductivity is filled between the surface 35a of the heat conductive member 35 and the LED substrate 30, or a heat conductive seal member is sandwiched. A screw hole 35 c is provided in the surface 35 b of the heat conducting member 35. As described above, the surface 35b of the heat conductive member 35 and the front surface 1 of the housing are fixed by the screws 37 so as to be in surface contact with the heat conductive seal member 36 therebetween.

上記構成の投射モジュールにおいて、不図示のハーネスおよびパターンを介してLED基板30上のLED23に駆動電流が供給される。LED基板30で消費される電力は約2Wである。LED23は、駆動電流に応じた明るさの光を集光光学系24へ向けて射出する。集光光学系24はLED光を略平行光にして偏光板25へ入射させる。偏光板25は入射光を直線偏光に変換(または抽出)し、変換(または抽出)後の偏光光をPBSブロック26へ向けて射出する。   In the projection module having the above configuration, a drive current is supplied to the LED 23 on the LED substrate 30 through a harness and a pattern (not shown). The power consumed by the LED board 30 is about 2W. The LED 23 emits light with brightness according to the drive current toward the condensing optical system 24. The condensing optical system 24 makes the LED light substantially parallel light and enters the polarizing plate 25. The polarizing plate 25 converts (or extracts) incident light into linearly polarized light, and emits the converted (or extracted) polarized light toward the PBS block 26.

PBSブロック26へ入射された偏光光束(たとえばP偏光)は、PBSブロック26を透過して液晶パネル22を照明する。液晶パネル22は、赤、緑、青のフィルターが形成された複数の画素から構成され、カラーの画像を生成するように駆動されている。液晶パネル22の液晶層を透過する光は、液晶パネル22へ入射されると当該液晶層を上向きに進行し、液晶パネル22の反射面で反射された後、液晶層を下向きに進行して液晶パネル22から射出され、PBSブロック26へ再度入射される。電圧が印加された液晶層は位相板として機能するので、PBSブロック26へ再度入射される光は、S偏光である変調光とP偏光である非変調光との混合光である。PBSブロック26は、再入射された光束のうちS偏光成分である変調光のみを偏光分離部26aで反射(折り曲げる)し、右方の投影光学系21へ向けて投影光として射出する。投影光学系21および鏡筒は、筐体前面1側に配設する。   A polarized light beam (for example, P-polarized light) incident on the PBS block 26 passes through the PBS block 26 and illuminates the liquid crystal panel 22. The liquid crystal panel 22 includes a plurality of pixels on which red, green, and blue filters are formed, and is driven to generate a color image. When the light transmitted through the liquid crystal layer of the liquid crystal panel 22 enters the liquid crystal panel 22, the light travels upward in the liquid crystal layer, is reflected by the reflective surface of the liquid crystal panel 22, and then travels downward in the liquid crystal layer to liquid crystal. The light is ejected from the panel 22 and again incident on the PBS block 26. Since the liquid crystal layer to which the voltage is applied functions as a phase plate, the light incident again on the PBS block 26 is a mixed light of modulated light that is S-polarized light and unmodulated light that is P-polarized light. The PBS block 26 reflects (folds) only the modulated light, which is the S-polarized component, of the re-incident light beam by the polarization separation unit 26a, and emits it as projection light toward the right projection optical system 21. The projection optical system 21 and the lens barrel are disposed on the housing front surface 1 side.

上述した筐体前面1においてビス37を含む所定範囲(少なくとも熱伝導部材35と接する面積より広い)について、断熱材で構成されるシールを貼付することが好ましい。貼付シールでビス37を覆ってビス37を見えなくすること、ビス37の緩みを防止すること、筐体前面1において温度が上昇しやすい部分にユーザが直接触れないようにすることができる。   It is preferable to affix a seal made of a heat insulating material on a predetermined range including the screw 37 on the front surface 1 of the housing described above (at least wider than the area in contact with the heat conducting member 35). It is possible to cover the screw 37 with the sticker seal so that the screw 37 cannot be seen, to prevent the screw 37 from loosening, and to prevent the user from directly touching the portion of the front surface 1 where the temperature is likely to rise.

以上説明した実施形態によれば、次の作用効果が得られる。
(1)LED23の点灯時に発熱するLED基板30を6面体のブロックで構成した熱伝導部材35の一面35aと面接合し、熱伝導部材35の他の面35bをPJ内蔵電子カメラの金属製筐体(筐体前面1)の内側面に面接合させた。熱伝導経路にヒートスプレッダを含まないのでLED基板30→熱伝導部材35→筐体前面1への熱抵抗が小さくなり、LED23で発生した熱を筐体外側の空間へ効率よく放熱できる。また、ヒートスプレッダを含まないので小型化にも貢献し、屈折タイプの撮影光学系を有する薄型筐体の電子カメラにとくに有効である。
According to the embodiment described above, the following operational effects can be obtained.
(1) The LED substrate 30 that generates heat when the LED 23 is turned on is surface-bonded to one surface 35a of a heat conducting member 35 constituted by a hexahedral block, and the other surface 35b of the heat conducting member 35 is made of a metal housing of the PJ built-in electronic camera. Surface bonding was performed on the inner surface of the body (front surface 1 of the housing). Since the heat spreader is not included in the heat conduction path, the thermal resistance from the LED substrate 30 to the heat conduction member 35 to the front surface 1 of the housing is reduced, and the heat generated by the LEDs 23 can be efficiently radiated to the space outside the housing. Further, since it does not include a heat spreader, it contributes to miniaturization, and is particularly effective for a thin housing electronic camera having a refraction type photographing optical system.

(2)筐体前面1は、液晶モニタ14が配設される筐体背面2に比べて筐体面積が広い。熱伝導部材35を筐体面積が広い被写体側の面(すなわち筐体前面1)に接合したことにより、筐体後面2に接合する場合に比べて筐体外側の空間へ効率よく放熱できる。 (2) The housing front surface 1 has a larger housing area than the housing back surface 2 on which the liquid crystal monitor 14 is disposed. By joining the heat conducting member 35 to the subject-side surface (that is, the housing front surface 1) having a large housing area, heat can be efficiently radiated to the space outside the housing as compared with the case of joining to the housing rear surface 2.

(3)熱伝導部材35を熱伝導性が高いアルミブロックで構成し、LED基板30と熱伝導部材35との間、熱伝導部材35と金属製筐体面との間に伝導性シール部材を挟んで接合するようにした。これによって熱伝導経路の熱抵抗がさらに下がり、放熱効率をさらに高めることができる。 (3) The heat conductive member 35 is made of an aluminum block having high heat conductivity, and a conductive seal member is sandwiched between the LED substrate 30 and the heat conductive member 35 and between the heat conductive member 35 and the metal housing surface. It was made to join with. As a result, the thermal resistance of the heat conduction path is further lowered, and the heat dissipation efficiency can be further increased.

(4)熱伝導部材35の面35aの面積は、LED基板30と接合する面積より広く、熱伝導部材35の面35bは全てが筐体前面1aと面接合する。このとき、熱伝導部材35の厚み(図3において縦方向のサイズ)を5mm以上確保し、熱伝導部材35の長さ(図3において横方向のサイズ)を厚みの2倍以下に抑えたので、熱伝導経路の熱抵抗を小さくできる。 (4) The area of the surface 35a of the heat conducting member 35 is larger than the area to be joined to the LED substrate 30, and all the faces 35b of the heat conducting member 35 are surface joined to the housing front face 1a. At this time, the thickness of the heat conduction member 35 (vertical size in FIG. 3) is secured to 5 mm or more, and the length of the heat conduction member 35 (lateral size in FIG. 3) is suppressed to twice or less the thickness. The thermal resistance of the heat conduction path can be reduced.

(5)熱伝導部材35と金属製筐体面とをビス止めしたので、金属製筐体面が撓む場合でも熱伝導部材35と金属製筐体面との間に隙間ができず、熱伝導経路の熱抵抗が低い状態を維持できる。 (5) Since the heat conducting member 35 and the metal housing surface are screwed, there is no gap between the heat conducting member 35 and the metal housing surface even when the metal housing surface is bent, and the heat conducting path A state with low thermal resistance can be maintained.

(6)熱伝導部材35の面のうちLED基板30にも金属製筐体面にも接合しない他の面35dを、伝導性シール部材を挟んで液晶モニタ14のバックプレート14bの面と当接するように構成したので、LED23で発生した熱を液晶モニタ14からも筐体内外の空間へ効率よく放熱できる。 (6) Of the surfaces of the heat conducting member 35, the other surface 35d that is not bonded to the LED substrate 30 or the metal housing surface is brought into contact with the surface of the back plate 14b of the liquid crystal monitor 14 with the conductive sealing member interposed therebetween. Thus, the heat generated by the LED 23 can be efficiently radiated from the liquid crystal monitor 14 to the space inside and outside the housing.

(変形例1)
熱伝導部材35の形状は、必ずしも6面体形状でなくてもよい。たとえば、アルミ球体の一部を切断し、残った元球体を先の切断面と交わる面でさらに切断すると、2面を有する元球体が得られる。この元球体の一方の切断面をLED基板30と接合し、他方の切断面を筐体前面1と接合しても、上記(1)〜(6)と同様の作用効果が得られる。
(Modification 1)
The shape of the heat conducting member 35 is not necessarily a hexahedral shape. For example, when a part of an aluminum sphere is cut and the remaining original sphere is further cut at a surface intersecting with the previous cut surface, an original sphere having two surfaces is obtained. Even if one cut surface of the original sphere is joined to the LED substrate 30 and the other cut surface is joined to the housing front surface 1, the same effects as the above (1) to (6) can be obtained.

(変形例2)
PJ内蔵電子カメラの筐体前面1に撮影光学系12および投影光学系21を保護するスライドカバーを設けてもよい。図5は、この場合のPJ内蔵電子カメラを前方から見た図である。実線で示すスライドカバー15は開状態(使用位置)を表し、破線で示すスライドカバー15aは閉状態(収納位置)を表す。
(Modification 2)
A slide cover for protecting the photographing optical system 12 and the projection optical system 21 may be provided on the front surface 1 of the PJ built-in electronic camera. FIG. 5 is a view of the electronic camera with a built-in PJ in this case as viewed from the front. A slide cover 15 indicated by a solid line represents an open state (use position), and a slide cover 15a indicated by a broken line represents a closed state (storage position).

図5によれば、ビス37を含む所定範囲(少なくとも熱伝導部材35と接する面積より広い)がスライドカバー15(15a)の位置にかかわらず常にスライドカバー15(15a)で覆われる。これにより、ビス37を見えなくすること、筐体前面1において温度が上昇しやすい部分にユーザが直接触れないようにすること、収納位置において撮影光学系12および投影光学系21を保護することができる。   According to FIG. 5, a predetermined range including the screw 37 (at least wider than the area in contact with the heat conducting member 35) is always covered with the slide cover 15 (15a) regardless of the position of the slide cover 15 (15a). Thereby, the screw 37 is made invisible, the user does not directly touch the portion where the temperature is likely to rise on the front surface 1 of the housing, and the photographing optical system 12 and the projection optical system 21 can be protected at the storage position. it can.

(変形例3)
図6は、投射部20Aおよび撮像部10を有する他のPJ内蔵電子カメラを例示する図である。図6において、投射部20A(破線で表示)は、PJ内蔵電子カメラの筐体の向かって右側端部に長手方向を縦にして配設される。撮像部10(破線で表示)は、長手方向を縦にして投射部20Aと並べて配設される。
(Modification 3)
FIG. 6 is a diagram illustrating another PJ built-in electronic camera having the projection unit 20 </ b> A and the imaging unit 10. In FIG. 6, the projection unit 20 </ b> A (indicated by a broken line) is arranged with the longitudinal direction at the right end toward the housing of the PJ built-in electronic camera. The imaging unit 10 (indicated by a broken line) is arranged side by side with the projection unit 20A with the longitudinal direction being vertical.

投射部20Aにおける投射モジュールと熱伝導部材35との接合の向きは、投射部20の場合と比べて、LED30からの射出光軸の周りに90度回転されている。これにより、熱伝導部材35が筐体前面1にビス止めされた状態で、投射部20Aによる投影光は右方向へ射出される。   The direction of joining of the projection module and the heat conducting member 35 in the projection unit 20 </ b> A is rotated by 90 degrees around the optical axis emitted from the LED 30 compared to the projection unit 20. Thereby, the projection light by the projection unit 20A is emitted in the right direction in a state where the heat conducting member 35 is screwed to the front surface 1 of the housing.

(変形例4)
図7は、投射部20Bおよび撮像部10を有する他のPJ内蔵電子カメラを例示する図である。図7において、投射部20B(破線で表示)は、PJ内蔵電子カメラの筐体の略中央上端部に長手方向を横にして配設される。撮像部10(破線で表示)は、長手方向を横にして投射部20Bと並べて配設される。
(Modification 4)
FIG. 7 is a diagram illustrating another PJ built-in electronic camera having the projection unit 20 </ b> B and the imaging unit 10. In FIG. 7, the projection unit 20 </ b> B (indicated by a broken line) is disposed with the longitudinal direction being set laterally at the substantially center upper end portion of the housing of the PJ built-in electronic camera. The imaging unit 10 (indicated by a broken line) is arranged side by side with the projection unit 20B with the longitudinal direction being horizontal.

投射部20Bにおける投射モジュールと熱伝導部材35との接合の向きは、投射部20Aの場合と比べて、LED30からの射出光軸の周りに180度回転されている。これにより、熱伝導部材35が筐体前面1にビス止めされた状態で、投射部20Bによる投影光は上方向へ射出される。   The direction of joining of the projection module and the heat conducting member 35 in the projection unit 20B is rotated by 180 degrees around the optical axis emitted from the LED 30 as compared to the projection unit 20A. Thereby, the projection light by the projection unit 20B is emitted upward in a state where the heat conducting member 35 is screwed to the front surface 1 of the housing.

上記変形例3および変形例4の場合にも、それぞれ上記実施形態の作用効果(1)〜(6)が得られる。   Also in the case of the said modification 3 and the modification 4, the effect (1)-(6) of the said embodiment is obtained, respectively.

なお、変形例3および変形例4においては、筐体前面1においてビス37を含む所定範囲(少なくとも熱伝導部材35と接する面積より広い)について、断熱材で構成されるシールを貼付するのが好ましい。あるいは、筐体前面1において撮影光学系12を保護するスライドカバーを設け、スライドカバーの開状態、閉状態にかかわらず、常にビス37を含む所定範囲(少なくとも熱伝導部材35と接する面積より大きい)がスライドカバーで覆われる構成とするのが好ましい。   In Modification 3 and Modification 4, it is preferable to stick a seal made of a heat insulating material on a predetermined range including at least the screw 37 on the front surface 1 of the housing (at least wider than the area in contact with the heat conducting member 35). . Alternatively, a slide cover that protects the photographing optical system 12 is provided on the front surface 1 of the housing, and a predetermined range that always includes the screw 37 regardless of whether the slide cover is open or closed (at least larger than the area in contact with the heat conducting member 35). Is preferably covered with a slide cover.

(変形例5)
筐体前面1が曲面を有する例を説明したが、平面で構成されている場合にも本発明を適用して構わない。
(Modification 5)
Although an example in which the housing front surface 1 has a curved surface has been described, the present invention may be applied to a case where the housing front surface 1 is a flat surface.

以上の説明はあくまで一例であり、上記の実施形態の構成に何ら限定されるものではない。   The above description is merely an example, and is not limited to the configuration of the above embodiment.

本発明についてPJ内蔵電子カメラを例示して説明したが、投射部20(20Aまたは20B)を搭載するものであれば、投影装置、PJ内蔵携帯電話機、PJ内蔵PDA(personal digital assistant)、PJ内蔵録音/再生機などの電子機器にも適用できる。   The present invention has been described with reference to an electronic camera with a built-in PJ. However, as long as the projector 20 (20A or 20B) is mounted, the projector, a mobile phone with a built-in PJ, a PDA with a built-in PJ (personal digital assistant), a built-in PJ. It can also be applied to electronic devices such as recording / playback machines.

本発明の一実施の形態によるPJ内蔵電子カメラを前方から見た図であるIt is the figure which looked at the electronic camera with a built-in PJ according to an embodiment of the present invention from the front. 図1のPJ内蔵電子カメラを底面側から見た図である。It is the figure which looked at the electronic camera with a built-in PJ in FIG. 1 from the bottom side. 投射部の光学系を図1における左側方から見た図である。It is the figure which looked at the optical system of the projection part from the left side in FIG. 図3の光学系を正面から見た図である。It is the figure which looked at the optical system of Drawing 3 from the front. 変形例2のPJ内蔵電子カメラを前方から見た図である。It is the figure which looked at the PJ built-in electronic camera of the modification 2 from the front. 変形例3のPJ内蔵電子カメラを前方から見た図である。It is the figure which looked at the PJ built-in electronic camera of the modification 3 from the front. 変形例4のPJ内蔵電子カメラを前方から見た図である。It is the figure which looked at the PJ built-in electronic camera of the modification 4 from the front.

符号の説明Explanation of symbols

1…筐体前面
23…LED
30…LED基板
35…熱伝導部材
35a…LED基板と接する面
35b…筐体前面と接する面
35c…ビス穴
36…熱伝導シール部材
1 ... front surface 23 ... LED
30 ... LED substrate 35 ... heat conduction member 35a ... surface 35b in contact with the LED substrate ... surface 35c in contact with the front surface of the casing ... screw hole 36 ... heat conduction seal member

Claims (10)

発熱部材と接合される第1の面、および筐体の内側面と接合される第2の面を少なくとも有する立体形状の伝熱部材であって、前記第1の面は前記発熱部材と接合する面積以上の面積を有し、前記第2の面の全面が前記筐体の内側面と接合される伝熱部材を備えることを特徴とする電子機器。   A three-dimensional heat transfer member having at least a first surface to be joined to the heat generating member and a second surface to be joined to the inner side surface of the housing, wherein the first surface is joined to the heat generating member. An electronic apparatus comprising: a heat transfer member having an area equal to or larger than an area, wherein the entire surface of the second surface is bonded to an inner surface of the housing. 請求項1に記載の電子機器において、
前記伝熱部材の形状は、略四辺形で囲まれた6面体であることを特徴とする電子機器。
The electronic device according to claim 1,
The shape of the heat transfer member is a hexahedron surrounded by a substantially quadrilateral.
請求項2に記載の電子機器において、
前記第2の面を構成する四辺形の短辺の長さは、前記第1の面を構成する四辺形の長辺の長さの1/2以上であることを特徴とする電子機器。
The electronic device according to claim 2,
The length of the short side of the quadrilateral that constitutes the second surface is not less than ½ of the length of the long side of the quadrilateral that constitutes the first surface.
請求項1〜3のいずれか一項に記載の電子機器において、
前記第2の面にねじと螺合する穴が設けられ、前記第2の面および前記筐体の内側面はねじで固着されることを特徴とする電子機器。
In the electronic device as described in any one of Claims 1-3,
An electronic device, wherein a hole to be screwed with a screw is provided in the second surface, and the second surface and an inner surface of the housing are fixed with a screw.
請求項1〜4のいずれか一項に記載の電子機器において、
前記発熱部材は発光素子が実装されている基板であることを特徴とする電子機器。
In the electronic device as described in any one of Claims 1-4,
The electronic device, wherein the heat generating member is a substrate on which a light emitting element is mounted.
請求項1〜5のいずれか一項に記載の電子機器において、
前記伝熱部材はアルミニウムで構成されることを特徴とする電子機器。
In the electronic device as described in any one of Claims 1-5,
The electronic device, wherein the heat transfer member is made of aluminum.
請求項1〜6のいずれか一項に記載の電子機器において、
前記筐体は金属製であることを特徴とする電子機器。
In the electronic device as described in any one of Claims 1-6,
The electronic device is characterized in that the casing is made of metal.
請求項1〜7のいずれか一項に記載の電子機器において、
前記第1の面と前記発熱部材との間、前記第2の面と前記筐体の内側面との間は、それぞれ熱伝導性部材を挟んで接合されることを特徴とする電子機器。
In the electronic device as described in any one of Claims 1-7,
An electronic apparatus, wherein the first surface and the heat generating member, and the second surface and the inner surface of the housing are joined with a heat conductive member interposed therebetween, respectively.
請求項1〜8のいずれか一項に記載の伝熱部材を備えることを特徴とする電子カメラ。   An electronic camera comprising the heat transfer member according to claim 1. 請求項9に記載の電子カメラにおいて、
前記伝熱部材の第2の面は、筐体前側の面と接合されることを特徴とする電子カメラ。
The electronic camera according to claim 9,
An electronic camera, wherein the second surface of the heat transfer member is joined to a front surface of the housing.
JP2006273039A 2006-10-04 2006-10-04 Electronic camera with projector, electronic device and electronic camera Expired - Fee Related JP5061566B2 (en)

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JP2006273039A JP5061566B2 (en) 2006-10-04 2006-10-04 Electronic camera with projector, electronic device and electronic camera
EP07829233.1A EP2071399B1 (en) 2006-10-04 2007-10-04 Electronic device, electronic camera, light source device, illuminating device and projector device
PCT/JP2007/069495 WO2008041753A1 (en) 2006-10-04 2007-10-04 Electronic device, electronic camera, light source device, illuminating device and projector device
US12/073,041 US7664386B2 (en) 2006-10-04 2008-02-28 Electronic device having light source and heat transmission member
US12/651,092 US7920784B2 (en) 2006-10-04 2009-12-31 Electronic device, electronic camera, light source device, illumination device, and projector device

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JP2010066426A (en) * 2008-09-10 2010-03-25 Nikon Corp Electronic equipment and photographing device
JP2013003567A (en) * 2011-06-22 2013-01-07 Seiko Epson Corp Projector
US9316896B2 (en) 2011-06-22 2016-04-19 Seiko Epson Corporation Projector with housing inserts
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WO2013085024A1 (en) * 2011-12-07 2013-06-13 株式会社神戸製鋼所 Led lighting heat sink and method for manufacturing same
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JP2019174781A (en) * 2017-08-24 2019-10-10 キヤノン株式会社 Catoptric element and stereo camera device
US11693222B2 (en) 2017-08-24 2023-07-04 Canon Kabushiki Kaisha Reflective optical element and stereo camera device

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