JP2008088391A - Method for forming electrical wiring or electronic circuit using digital printing technique based on digital information, and electrical wiring or electronic circuit obtained using the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming an electrical wiring or an electronic circuit using a digital printing technique based on a digital information, and to provide the electrical wiring or the electronic circuit manufactured using the method. <P>SOLUTION: Modifier compounds for a silane atom or the like, the boiling points of which are 10-105°C respectively, are introduced in a gasification state into a fuel gas together with combustion air. The fuel gas is so burned that a mixing molar ratio of air/gaseous hydrocarbons is ≥23. A flame of the fuel gas burned is blasted on a surface of a substrate for the electrical wiring or the electronic circuit with electrical insulating properties so that the surface of the substrate is activated, wherein a wet index of the surface is ≥73 dyn/cm. A conductive paste such as a copper paste is printed on the surface by a bubble jet printing method using the digital printing technique to form the electrical wiring or the electronic circuit. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for forming an electrical wiring or an electronic circuit by a digital printing method based on digital information, and an electrical wiring or an electronic circuit obtained by the method.

  In recent years, technology related to the formation process of fine copper wiring, such as flexible printed wiring board (FPC) or printed wiring board (PCB), with the rise of the electronics equipment industry, such as mobile phones, digital cameras, liquid crystal or plasma televisions, notebook computers, etc. It has been improved and used in a large amount as a part of the various electronic devices, and it has come to meet the needs of small size, thinness and light weight. However, in the conventional technology related to the formation process of fine copper wiring such as flexible printed wiring board (FPC) or printed wiring board (PCB), the use of a photoresist and a photomask is an absolute requirement. Utilization of a chemical etching process by a wet method in forming a fine circuit as a process has been indispensable.

  Further, in the chemical etching process, all of the copper foil of the wiring or the circuit which does not affect the electric wiring or the electronic circuit formation is discarded as the etching processing waste liquid, or energy is input again to the etching processing waste liquid. Remaining copper must be recovered, and in view of the global trend of resource and energy savings in recent years, it must be said that the manufacturing process has a reverse flow, and the number of steps is complicated. Improvements and improvements were desired.

  In light of the social demands for resource saving, energy saving, and labor saving as described above, resist-free and etching-free methods are used on various insulating materials such as plastic, silver paste, copper paste, or aluminum paste. Establish a methodology for firmly attaching and bonding various conductive pastes to insulating substrates such as various plastics in order to directly provide electrical wiring or electronic circuits by using a digital printing method based on digital information. This was an urgent issue.

By the way, the present inventor has already developed and put into practical use a method for firmly attaching a conductive paste such as silver paste, copper paste or aluminum paste to the surface of an insulating base material such as various plastics. Attempted to utilize the "interface modification technology" disclosed in the following patent document, various plastics etc. with sufficient adhesion strength in a state where surface modification was performed under certain conditions It was confirmed that it adheres closely to the surface of the adherend, and it was discovered and confirmed that the “interface modification technology” works extremely effectively, leading to the present invention.
JP 2003-238710 (Patent No. 3557194)

    The above-mentioned “Patent Document 1” discloses an outline of an interface reforming method and apparatus for a solid substance, which is an interface modifier compound containing a silane atom, a titanium atom, and an aluminum atom, each having a boiling point of 10 A storage tank for storing a fuel gas containing a surface modifier compound at a temperature of from C to 105C, a transfer unit for transferring the fuel gas to the injection unit, and an injection unit for blowing a flame of the fuel gas An interfacial reforming technique that activates the processing section by preparing an interfacial reforming apparatus including a (burner), spraying silicic acid flame or the like entirely or partially on the surface of a solid material. It is disclosed.

    And in the said patent document 1, only the surface modification method common to various solid substances is described about the interface modification of each general solid substance, The specific subject which this invention tends to solve, That is, it is necessary to directly and firmly adhere and bond a conductive paste represented by silver paste, copper paste or aluminum paste to various electrically insulating plastics which are generally said to be difficult to adhere. However, there is no disclosure of specific techniques and methodologies for tightly adhering and adhering to the electrical insulating plastics.

In the present invention, a polyester terephthalate (PET) resin, a polyethylene naphthalate (PEN) resin, a polyamide (PA) resin, or the like, on an electrically insulating plastic film base represented by each resin film, a silane atom, a titanium atom Alternatively, a modifier compound containing aluminum atoms, each having a boiling point of 10 ° C. to 105 ° C., is introduced into the fuel gas together with the combustion air in a gasified state. A flame of a fuel gas, which is burned so that the mixed molar ratio of air / hydrocarbon gas becomes a value of 23 or more, is an electrical insulating plastic film base material having the electrical insulation characteristics and constituting an electrical wiring or an electronic circuit. After spraying the surface, after subjecting the substrate surface to a surface activation treatment so that the wetness index is 73 dyn / cm or more, Serial to a method for forming electrical wiring or an electronic circuit according to a digital printing method based on digital information and forming an electrical wiring or electronic circuits by the respective steps.
(1) Using a bubble jet printer on the surface of the substrate whose surface has been modified, a conductive metal paste such as gold paste, silver paste, copper paste or aluminum paste is formed on the basis of digital information to form an electrical wiring or an electronic circuit. A process that digitally prints and heat-deposits as necessary.
(2) A step of providing a protective layer for physically or electrically protecting the electric wiring or electronic circuit on the electric wiring or electronic circuit printed based on digital information by the bubble jet printer.

  Before explaining the details of the present invention, an electrically insulating plastic film group typified by a resin film such as a polyester terephthalate (PET) resin or a polyamide (PA) resin, which is said to be a difficult adhesion / hard adhesion substrate. First of all, it is described in “Patent Document 1: Japanese Patent Laid-Open No. 2003-238710 (Patent No. 3557194)”, which is an “interface modification technology” for modifying the surface of a material to an easily adhesive / adhesive interface. To do.

FIG. 1 is a flowchart for explaining an outline of an interface reforming apparatus according to the present invention, which will be described based on the flowchart.
1 is an interface modifier compound containing silane atoms, titanium atoms, and aluminum atoms, and includes an alkylsilane compound, an alkoxysilane compound, a siloxane compound, a silazane compound, and an alkyl titanium. A storage tank portion 102 for storing an interfacial modifier compound 101 selected from the group consisting of a compound, an alkoxytitanium compound, an alkylaluminum compound, and an alkoxyaluminum compound; and a jetting portion (burner) that is vaporized by a heating means 103 ) A transfer path 105 for transferring to 104, a fuel gas storage tank 106 such as propane gas and LPG gas, and air for conveying the fuel gas combustion air and the interface modifier compound are supplied. And a compressed air source 107. A first sub-mixer 108 is also provided in the transfer path 105 for uniformly mixing the vaporized interface modifier compound and air mixed gas and the fuel gas delivered from the storage tank 106. The second main mixer 109 is configured. Further, the delivery tanks 102 for storing the interfacial modifier compound 101, the compressed air source 107 for supplying air, and the delivery destination outlets of the fuel gas storage tank 106 have respective delivery flow rates. Flow control valves with flowmeters 110, 111, and 112 for control are provided, respectively, to constitute the interface reformer 100. Next, the detail of each said main structural member (part) is demonstrated.

"Storage tank for interfacial modifier compound"
As shown in FIG. 1, a heating means 103 such as a heater for heating is provided below the interfacial modifier compound storage tank 102, and the interfacial modifier compound 101 is liquid at room temperature and normal pressure. It is configured to vaporize. The heating means 103 is controlled by a CPU (not shown). That is, the CPU is electrically connected to each sensor such as a liquid quantity sensor of the interfacial modifier compound, a liquid temperature sensor, etc., and the liquid quantity and the liquid temperature of the interfacial modifier compound are within a specified range. The heating means is controlled to fit.
In the present invention, an example using a liquid interface modifying compound is given, but a gas or solid compound can also be used. When a gaseous interfacial modifier compound is used, the interfacial modifier compound storage tank section does not need to be provided with a heater, but instead may be provided with a flow regulating means such as a pressure regulating valve. . Further, when using a solid interfacial modifier compound, for example, the liquid transportation in which the solid compound is dissolved in a solvent or melted with heat and piped from the storage tank of this example to the vicinity of the flame of the burner. Interfacial reforming can also be performed by passing through a pipe and feeding directly into a burner.

"Transportation part"
As shown in FIG. 1, the transfer unit 105 has a “pipe” structure, and as shown in FIG. 1, the vaporized interface modifier compound supplied from the compressed air source 107 and delivered from the storage tank 102. The first submixer 108 for mixing the fuel gas, the mixed gas mixed by the first submixer 108, and the second gas for uniformly mixing the fuel gas delivered from the fuel gas storage tank 106. The main mixer 109 is provided.

"Injection part (burner)"
As shown in FIG. 1, the injection unit (burner) 104 burns the combustion gas sent through the transfer unit 105 and sprays the obtained flame 113 onto the surface to be reformed (not shown). The reformed surface is subjected to interfacial reforming, and the state of the flame 113 includes the flow rate of the vaporized interfacial modifier compound 101, the amount of combustion air sent from the compressed air source 107, and the fuel gas. Each flow rate of the amount of fuel gas delivered from the storage tank 106 is optimally adjusted by adjusting the opening degree of the flow rate adjustment valves 110, 111, 112 with flow meters provided in the respective gas flow paths. The The type of the burner is not particularly limited, and may be any of a premix burner, a diffusion burner, a partial premix burner, a spray burner, an evaporation burner, and the like. Further, the form of the burner is not particularly limited.

The interface modifier compound is not particularly limited as long as it is a compound containing a silane atom, a titanium atom or an aluminum atom and can burn in a flame of a general gas burner. In view of easy availability and handling, for example, a group consisting of an alkylsilane compound, an alkoxysilane compound, a siloxane compound, a silazane compound, an alkyl titanium compound, an alkoxy titanium compound, an alkyl aluminum compound, and an alkoxy aluminum compound. It is preferable that it is at least one compound selected from.
Preferred examples of the alkylsilane compound include methylsilane, dimethylsilane, trimethylsilane, tetramethylsilane, tetraethylsilane, dimethyldichlorosilane, dimethyldiphenylsilane, diethyldichlorosilane, diethyldiphenylsilane, methyltrichlorosilane, methyltriphenylsilane, and dimethyl. Substituents such as monosilane compounds that may have substituents such as diethylsilane, disilane compounds that may have substituents such as hexamethyldisilane, hexaethyldisilane, chloroheptamethyldisilane, and octamethyltrisilane A trisilane compound which may have
Preferred examples of the alkoxysilane compound include methoxysilane, dimethoxysilane, trimethoxysilane, tetramethoxysilane, ethoxysilane, diethoxysilane, triethoxysilane, tetraethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, and trimethylmethoxysilane. , Methyltriethoxysilane, dimethyldiethoxysilane, trimethylethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, dichlorodimethoxysilane, dichlorodiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, trichloromethoxysilane, trichloroethoxysilane , Triphenylmethoxysilane, triphenylethoxysilane and the like alone or in combination of two or more .
Preferred examples of the siloxane compound include tetramethyldisiloxane, pentamethyldisiloxane, hexamethyldisiloxane, octamethyltrisiloxane, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexa Examples thereof include siloxane.
Preferable examples of the silazane compound include hexamethyldisilazane. Moreover, as a suitable example of an alkyl titanium compound, tetramethyl titanium, tetraethyl titanium, tetrapropyl titanium, etc. are mentioned. Preferable examples of the alkoxytitanium compound include titanium methoxide and titanium ethoxide. Preferable examples of the alkyl aluminum compound include trimethyl aluminum, triethyl aluminum, tripropyl aluminum and the like. Preferable examples of the alkoxyaluminum compound include aluminum methoxide, aluminum ethoxide and the like. These compounds may be used alone or in combination.
Among the above preferable examples, silane compounds, alkoxysilane compounds, siloxane compounds, and silazane compounds are more preferable because they are easy to handle, easily vaporized, and easily available.

  Next, using the above-described interface reforming apparatus shown in FIG. 1, an electrically insulating plastic film substrate represented by polyester terephthalate (PET) resin or polyethylene naphthalate (PEN) and polyamide (PA) resin film is used. Next, the concept will be described with reference to FIG. 2 in connection with a method of forming an electrical wiring or electronic circuit by a digital printing method based on digital information by a bubble jet printer or the like.

  First, an electrically insulating plastic film substrate 201 represented by polyester terephthalate (PET) resin or polyethylene naphthalate (PEN) and polyamide (PA) resin film as shown in FIG. Then, using the interface reformer 100 shown in FIG. 1, a modifier compound containing a silane atom, a titanium atom, or an aluminum atom and having a boiling point of 10 ° C. to 105 ° C. is gasified. The fuel gas flame is introduced into the fuel gas together with the combustion air in a gasified state and burned so that the mixed molar ratio of air / hydrocarbon gas in the fuel gas becomes a value of 23 or more. The surface is uniformly sprayed on the surface of the electrically conductive plastic film substrate 201, and a number is applied to the surface layer interface of the electrically insulating plastic film substrate 201. When an interfacial modified layer composed of a silicon dioxide particle layer 202 having a particle size of nom to several tens of nanometers is formed, a digital composed of a conductive metal paste such as a gold paste, a silver paste, a copper paste, or an aluminum paste is used in the next step. It is possible to firmly adhere and bond the electrical wiring or electronic circuit by the printing method to the electrically insulating plastic film substrate 201.

Next, a method for forming an electrical wiring or an electronic circuit by a digital printing method will be described with reference to enlarged schematic diagrams conceptually shown in FIGS.
On the silicon dioxide particle layer 202 formed on the top surface of the electrically insulating plastic film substrate 201 in the previous step shown in FIG. 2A, a bubble jet printer is used, and silver paste, copper paste, aluminum paste, etc. When the conductive metal paste is digitally printed to form an electrical wiring or electronic circuit 203 based on digital information and heated to form a film as necessary, the electrical wiring or electronic circuit 203 and the electrically insulating plastic film substrate 201 Can be firmly adhered and bonded through the silicon dioxide particle layer 202, and a physically and electrically strong electrical wiring or electronic circuit 203 can be formed.

  Further, as a further process, in order to physically or electrically protect the electrical wiring or electronic circuit 203, as schematically shown in FIG. 2C, a coating formed on the basis of a film form or a coating technique. The protective layer 204 composed of layers is firmly adhered to complete the method of forming an electrical wiring or electronic circuit by a digital printing method based on the digital information of the present invention.

In addition, considering the reason and rationale for the electrical wiring or the electronic circuit 203 to be firmly adhered and bonded based on the digital information, the conductive metal paste molded by the digital printing method on the electrically insulating plastic film substrate 201, the above-mentioned When the silicon dioxide particle layer 202 having a particle diameter of several nanometers to several tens of nanometers formed on the surface interface of the electrically insulating plastic film substrate 201 is microscopically observed, as conceptually illustrated in FIG. The surface of the silicon dioxide particles (SiO ₂ ) 10 was confirmed to have a large number of polar groups (—OH) by reflection absorption spectroscopy (FT-IR), and the polar groups (— OH) and SiO ₂ in both intervention together, the electrical wiring or electronic circuit 203 electrically insulating plastic film substrate 201 bisection · By chemically binding, it is assumed that are firmly adhered and bonding.

The reason why a large number of hydroxyl groups (—OH), which are polar groups, are formed on the surface of SiO ₂ is that the molar ratio of air / hydrocarbon gas in the fuel gas in the interface reformer shown in FIG. Has been confirmed by the inventor to be generated in a situation adjusted to a value of 23 or more, and this fact is described in detail in the following patent application already filed by the inventor. ing.
Japanese Patent Application No. 2005-248364

  As described above, according to the present invention, a flexible printed wiring board (FPC), a printed wiring board (PCB), etc. without using any chemical etching process by a wet method that is generally performed conventionally, Fine copper wiring can be formed by a dry method, and it is possible to eliminate complicated and complicated processes with energy loss such as disposal and disposal of etching waste liquid in the conventional wet chemical etching process. It is possible to contribute to resource saving and energy saving worldwide.

  Hereinafter, with reference to the drawings, a method for forming electrical wiring or an electronic circuit by a digital printing method based on digital information according to the present invention and specific examples of electrical wiring or an electronic circuit obtained by the method will be described based on examples. This will be described in detail.

[Example 1]
According to the following procedure, copper electrical wiring was obtained on a polyamide resin film by a digital printing method based on digital information.
1. Preparation of Insulating Substrate First, a polyamide resin film having a thickness of 50 μm was prepared as the insulating substrate 201 shown in FIG. 2A, and the processing surface was sufficiently cleaned with isopropyl alcohol (IPA). 2. Interfacial Modification Treatment Next, the upper surface of the polyamide resin film 201 is subjected to interfacial modification on the cleaned polyamide resin film 201 using the interfacial reformer 100 shown in FIG. 1, as shown in FIG. An interface modified layer 202 was obtained. The modified state of the interface modified layer was 73 dyn / cm or more in terms of wetness index. Although the interface modification layer 202 is shown as a continuous layer in the drawing, it is actually a discontinuous layer. In addition, the interface reforming work in this example was performed under the following conditions.・ Flame treatment fuel: propane gas ・ Modifier compound: Tetramethylsilane (boiling point: 27 ° C.)
-Discharge amount of modifier compound containing air: 1.3 (liter / min)
・ Air flow rate (Air): 84 (liter / min)
・ Gas flow rate (propane gas): 3.0 (liter / min)
・ Molar ratio of air / propane gas: 28
Processing time: 4 seconds / 100 cm ²
-Environmental conditions: 25 ° C, 60% Rh
-Modifier compound content: about 0.0002 mol% (when the total amount of modifier compounds including air is 100 mol%)
3. Preparation of conductive metal paste Next, as a conductive metal paste, a conductive copper paste composition containing at least a copper powder, a phenoxy resin containing a hydroxyl group, and a salicyl alcohol was prepared.
4). Digital printing Subsequently, a conductive copper paste having the above composition is directly sprayed on the upper surface of the interface-modified layer 202 that has been interface-modified on the polyamide resin film 201 based on digital information using a bubble jet printer. An electrical wiring 203 was obtained.
5. Heat treatment of the digital printing layer As described above, the copper wiring made of the conductive copper paste formed on the polyamide resin film by the digital printing method is further dried at 160 ° C. · 0 after the preliminary drying at 60 ° C. for 3 hours is completed. After 5 hours of heating / curing process, it was firmly cured and adhered onto the polyamide resin film.
6). Formation of Protective Layer As the last step, the polyethersulfone resin (PEN) film layer 204 is formed on the copper wiring by using a dry lamination method in order to physically or electrically protect the electric (copper) wiring as required. A protective layer 203 was obtained by firmly laminating and adhering.

[Example 2]
According to the following procedure, a silver electric circuit was obtained on a polyethersulfone (PEN) resin film by a digital printing method based on digital information.
1. Preparation of Insulating Substrate First, as the insulating substrate 201 shown in FIG. 2A, a polyethersulfone resin film having a film thickness of 50 μm was prepared, and the treated surface was sufficiently cleaned with isopropyl alcohol (IPA).
2. Interfacial Modification Treatment Next, interfacial modification is performed on the upper surface of the polyethersulfone (PEN) resin film 201 on the cleaned polyethersulfone (PEN) resin film 201 using the interface reformer shown in FIG. An interface modified layer 202 as shown in FIG. 2A was obtained. The modified state of the interface modified layer was 73 dyn / cm or more in terms of wetness index. Although the interface modification layer 202 is shown as a continuous layer in the drawing, it is actually a discontinuous layer. The conditions for interfacial modification in this example are as follows.
・ Flame treatment fuel: propane gas ・ Modifier compound: Hexamethyldisiloxane (boiling point: 101 ° C.)
-Discharge amount of modifier compound containing air: 1.3 (liter / min)
・ Air flow rate (Air): 84 (liter / min)
・ Gas flow rate (propane gas): 3.0 (liter / min)
・ Molar ratio of air / propane gas: 28
Processing time: 4 seconds / 100 cm ²
-Environmental conditions: 25 ° C, 60% Rh
-Modifier compound content: about 0.0002 mol% (when the total amount of modifier compounds including air is 100 mol%)
3. Preparation of conductive metal paste Next, a conductive silver paste composition containing at least silver oxide powder and a phenoxy resin containing ethylene glycol as a reducing agent and salicyl alcohol was prepared as the conductive metal paste.
4). Next, the conductive silver paste having the above composition is directly applied to the upper surface of the interface-modified layer 202 that has been interface-modified on the polyethersulfone (PEN) film 201 using a bubble jet printer based on the digital information. The desired electric circuit 203 was obtained by spraying.
5. Heat treatment of digital printing layer As described above, the silver wiring made of the conductive silver paste formed on the polyethersulfone (PEN) resin film by the digital printing method is subjected to preliminary drying at 60 ° C. for 3 hours and then 150 ° C. -Hardened and adhered firmly onto a polyethersulfone (PEN) resin film by a 1 hour heating and curing process.
6). Finally, in order to physically or electrically protect the electrical (copper) circuit 203 as required, the polyethersulfone resin (PEN) film layer 204 is silver-coated using a dry lamination technique using a coating technique. A protective layer 203 was obtained by firmly laminating and adhering onto the wiring.

  As described in detail above, resource and energy saving and labor saving are achieved by utilizing the method of forming electrical wiring or electronic circuit by the digital printing method based on the digital information of the present invention and the electrical wiring or electronic circuit obtained by the method. In light of social demands, conductive pastes such as silver paste, copper paste, aluminum paste, etc. are converted into digital information on insulating substrates such as various plastics using resist-free and etching-free methods. The electric printing or electronic circuit can be directly provided by the digital printing method based on the digital printing method, and can greatly contribute to resource saving, energy saving and labor saving worldwide in recent years.

Outline of interface reformer An enlarged schematic diagram conceptually showing a method of molding electrical wiring or electronic circuit by digital printing technique Magnified schematic diagram for explaining the surface state of silicon dioxide particles (SiO ₂ )

Explanation of symbols

DESCRIPTION OF SYMBOLS 100: Interface modifier 101: Interface modifier compound 102: Storage tank part 103 for interface modifier compounds 103: Heating means 104: Injection part (burner)
105: Transfer unit 106: Fuel gas storage tank 107: Compressed air source 108: Submixer 109: Main mixer 110: Flow rate adjusting valve with flow meter 111: Flow rate adjusting valve with flow meter 112: Flow rate adjusting valve with flow meter 113: Flame 201: Electrically insulating plastic film substrate 202: Silicon dioxide particle layer 203: Electrical wiring or electronic circuit 204: Protective layer 10: Silicon dioxide particles (SiO ₂ )

Claims (7)

A modifier compound containing a silane atom, a titanium atom or an aluminum atom, each having a boiling point of 10 ° C. to 105 ° C. is introduced into the fuel gas together with combustion air in a gasified state, The surface of a base material that has an electrical insulation characteristic and constitutes an electric wiring or an electronic circuit, by burning a fuel gas flame that is burned so that the air / hydrocarbon gas mixture molar ratio in the fuel gas becomes a value of 23 or more The surface of the base material is subjected to an interface activation treatment so that the wettability index is 73 dyn / cm or more, and then an electric wiring or an electronic circuit is formed through the following steps. A method of forming an electrical wiring or an electronic circuit by a digital printing method based on digital information.
(1) Using a bubble jet printer on the surface of the substrate whose surface has been modified, a conductive metal paste such as a gold paste, a silver paste, a copper paste, an aluminum paste, etc. The process of digital printing to form and heating to form as needed.
(2) A step of providing a protective layer for physically or electrically protecting the electrical wiring or electronic circuit on the electrical wiring or electronic circuit printed on the digital information by the bubble jet printer.   An electrical wiring or an electronic circuit by a digital printing method based on digital information, wherein the insulating substrate according to claim 1 is glass.   The insulating substrate according to claim 1 is a polyethylene resin, polypropylene resin, polymethylpentene resin, polyester resin, polycarbonate resin, polyethersulfone resin, polyacrylic resin, polyetheretherketone resin, polyimide resin, polysulfone resin, polystyrene. Resin, polyamide resin, polyphenylene sulfide resin, ethylene-tetrafluoroethylene copolymer, polyvinyl fluoride resin, tetrafluoroethylene-perfluoroether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, polytetrafluoroethylene At least selected from the group consisting of resins, polyvinylidene fluoride resins, polytrifluorochloroethylene resins, and ethylene-trifluorochloroethylene resin copolymers Electrical wiring or an electronic circuit according to a digital printing method based on digital information, characterized in that also one of the thermoplastic resin.   The insulating base material according to claim 1 is made of silicone rubber, fluorine rubber, natural rubber, neoprene rubber, chloroprene rubber, urethane rubber, acrylic rubber, olefin rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, ethylene-propylene rubber, Digital information-based digital, characterized in that it is at least one rubber selected from the group consisting of ethylene propylene diene terpolymer, butadiene rubber, butyl rubber, styrene thermoplastic elastomer, and urethane thermoplastic elastomer Electric wiring or electronic circuit by printing method.   The digital information is characterized in that the insulating base material according to claim 1 is at least one thermosetting resin selected from the group consisting of an epoxy resin, a phenol resin, a cyanate resin, a urea resin, and a guanamine resin. Electrical wiring or electronic circuit by digital printing technique based.   The electrical wiring or electronic circuit by the digital printing method based on the digital information from which the protective layer of Claim 1 was selected from either the film form or the coating layer formed based on the coating method.   The interface modifier compound according to claim 1 is selected from the group consisting of alkylsilane compounds, alkoxysilane compounds, siloxane compounds, silazane compounds, alkyltitanium compounds, alkoxytitanium compounds, alkylaluminum compounds, and alkoxyaluminum compounds. An electrical wiring or electronic circuit by a digital printing method based on digital information, characterized in that it is at least one compound.

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