JP2008086087A - Power conversion equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide power conversion equipment which satisfies making its inductance lower, as well as, improves its cooling performance. <P>SOLUTION: This power conversion equipment has a board, where each capacitor is juxtaposed in the same direction and also facing face of a semiconductor element is arranged and fixed at right angles with the array direction of the capacitor, and a snubber capacitor is arranged adjacent to the semiconductor element; a connecting conductor L-shaped in cross section which electrically connects the terminals of the several capacitors; the power terminals of the semiconductor elements; and the terminals of the snubber capacitors with one another; a cooling fan which cools a heat-radiating fin constituting a radiator, arranged adjacent to the heat radiator being in a position different from the array position of the capacitor; and an air current baffle which regulates the direction of air current so that the wind, generated by the cooling fan, does not directly hit the capacitor. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a power conversion device in which a semiconductor element and a capacitor are connected as short as possible.

  Conventionally, there are various patent proposals for reducing power wiring inductance between a semiconductor element and a capacitor in a power conversion device or the like. Patent Document 1 is one example, and in order to connect the semiconductor element and the capacitor as shortest as possible, the positive DC terminal and the negative DC terminal are stacked with an insulator interposed therebetween, and the capacitor corresponds to this. It describes what is directly connected to the poles. With this configuration, the wiring inductance can be reduced.

On the other hand, Patent Document 2 describes a problem in a power conversion device in which a plurality of module type power conversion elements constituting a power conversion device is attached to a cooling plate and is housed in a casing, that is, leakage current of the power conversion device. It describes the measures to reduce.
JP 2004-194382 A JP 2005-237197 A

  In the above-described Patent Document 1, although it is possible to reduce the inductance, there is a problem in terms of cooling performance, so it is necessary to take some measures.

  In Patent Document 2 described above, although there is no problem in terms of cooling performance, no consideration is given to measures for reducing the inductance.

  It is an object of the present invention to provide a power conversion device that satisfies low inductance and has improved cooling performance.

In order to achieve the above object, the invention corresponding to claim 1 suppresses a plurality of semiconductor elements, a plurality of capacitors for mitigating voltage changes when the semiconductor elements are driven, and a surge generated when the semiconductor elements are driven. A semiconductor capacitor is connected in combination to perform power conversion between a power source and a load, and each of the semiconductor elements has a plane parallel to the opposed position, and one of these planes has a power source A power conversion device having a terminal and a radiator having a plurality of radiation fins on the other surface, each capacitor having a columnar shape and having a terminal orthogonal to the axial end surface In
A connection conductor having an L-shaped cross section for electrically connecting a terminal of each capacitor, a power supply terminal of the semiconductor element, and a terminal of the snubber capacitor;
A cooling fan that is disposed at a position different from the arrangement position of the capacitors and close to the radiator, and cools the radiating fins constituting the radiator by wind;
An air flow restricting body for restricting an air flow direction so that the wind generated by the cooling fan does not directly hit the condenser;
Comprising
The capacitors are juxtaposed in the same direction, the opposing surfaces of the semiconductor elements are arranged and fixed at right angles to the arrangement direction of the capacitors, and the snubber capacitors are arranged close to the semiconductor elements. It is a power converter device.

In order to achieve the above object, the invention corresponding to claim 2 suppresses a plurality of semiconductor elements, a plurality of capacitors for relaxing a voltage change when the semiconductor elements are driven, and a surge generated when the semiconductor elements are driven. A semiconductor capacitor is connected in combination to perform power conversion between a power source and a load, and each of the semiconductor elements has a plane parallel to the opposed position, and one of these planes has a power source A power conversion device having a terminal and a radiator having a plurality of radiation fins on the other surface, each capacitor having a columnar shape and having a terminal orthogonal to the axial end surface In
A connection conductor for electrically connecting the terminals of each capacitor, the power supply terminal of the semiconductor element, and the terminals of the snubber capacitor, having a high and low portion and connecting the high and low portions,
A cooling fan that is disposed at a position different from the arrangement position of the capacitors and close to the radiator, and cools the radiating fins constituting the radiator by wind;
An air flow restricting body for restricting an air flow direction so that the wind generated by the cooling fan does not directly hit the condenser;
Comprising
The capacitors are juxtaposed in the same direction, the opposing surfaces of the semiconductor elements are arranged and fixed in the same direction as the arrangement direction of the capacitors, and the snubber capacitors are arranged close to the semiconductor elements. It is the power converter device characterized.

  ADVANTAGE OF THE INVENTION According to this invention, the power converter device which satisfies the low inductance reduction and can improve cooling performance can be provided.

  Embodiments of the present invention will be described below with reference to the drawings, but before that, an overview of the present invention will be described with reference to FIGS. Here, the distribution board of the present invention includes an intake panel such as a monitoring panel 10 and a control protection panel 20, a wind tunnel panel such as four power converter panels 30 and an interconnection transformer panel 40, and an exhaust panel such as an auxiliary panel 50. Are sequentially juxtaposed in a straight line in a predetermined direction and communicated between the panels, and an intake opening formed on a side surface of the casing 21 is provided in a casing 21 of the control protection panel 20, for example, a casing constituting the intake panel. The intake fan 22 is built in at a predetermined distance from the parts 121 and 122, and an exhaust opening formed on a side surface of the casing 51 is provided in the casing 51 constituting the exhaust panel, for example, the auxiliary machine panel 50. An exhaust fan 53 is incorporated at a predetermined distance from the section 52, the wind in the intake panel taken in by the intake fan 22 is sent to the wind tunnel panel, and finally discharged to the outside by the exhaust fan 53 in the exhaust panel. With forced cooling and cross-cooling That.

  The monitoring panel 10 is a side wall of the monitoring panel casing 11 and has openings 121 and 122 for intake on the back side and the back side of the left side wall, respectively, and can charge and discharge a load such as a sodium-sulfur battery. This is for monitoring the entire device with a configuration capable of supplying power to the battery.

  The control protection board 20 includes, for example, four intake fans 22 in the vertical direction in a room on the back side in the control protection board casing 21 and protects the entire board. It contains equipment. This protective device includes a control board (not shown) that should not be directly exposed to the cooling air described later.

  The power converter board 30 is composed of, for example, four units, each of which supplies power to the load, which is obtained by converting AC power from a power supply source, for example, power system, into DC power in the converter board casing 31. Each of the semiconductor devices that house the converter and that constitute the power converter includes a semiconductor element 32, for example, an IGBT, in which a radiation fin 33 and a mini fan 34 are integrally formed. Here, the wind generated by the mini fan 34 hits the heat radiating fins 33, thereby cooling the heat radiating fins 33, thereby cooling each semiconductor element 32. Panels 35 are integrally formed on the heat radiation fins 33 so that the air after cooling the semiconductor elements 32 circulates in the casing 31 of the power converter board 30 as indicated by arrows in FIG.

  In the interconnection transformer panel 40, an interconnection transformer 42 that steps down an AC voltage from a power supply source, for example, an electric power system, is housed in an enclosure 41 for the interconnection transformer panel, and a miniature transformer is provided on the entrance side of the enclosure 41. A fan 44 (for example, the same one provided in each power converter panel 30) is provided. This is the power converter board 30 and circuit elements other than the semiconductor elements 32, such as capacitors and reactors, outside the panel 35, are cooled by cooling air generated by the intake fan 22 and the exhaust fan 53. A mini fan 44 is provided so that the cooling air is guided into the interconnection transformer casing 41.

  The auxiliary machine panel 50 has an exhaust opening 52 formed in the side wall of the auxiliary machine casing 51, and is located in the auxiliary machine casing 51 within a predetermined distance from the exhaust opening. 53 is stored and installed, and AC power from the power system can be taken in.

  The monitoring board 10, the control protection board 20, the power converter board 30, the interconnection transformer board 40, and the auxiliary machine board 50 are sequentially arranged in a straight line in a predetermined direction. The panels communicate with each other, the intake fan 22 sucks outside air into the row board via the intake openings 121 and 122, and the exhaust fan 53 discharges the outside of the row board through the exhaust opening 52. By doing so, the power distribution board is configured to cool the power converter and the interconnection transformer with cooling air generated inside the casing 21 for control protection board.

  Since the distribution board described above is a forced air-cooling transverse cooling system, it is used, for example, for charging sodium ion batteries.

Next, an embodiment of the present invention will be described with reference to FIGS. First, the first embodiment will be described with reference to FIGS. 4, 5, and 7 to 13. The conventional power conversion device includes a plurality of semiconductor elements 01, a plurality of capacitors 02 for relaxing voltage changes when the semiconductor elements 01 are driven, and a snubber capacitor 04 for suppressing a surge generated when the semiconductor elements 01 are driven. The semiconductor elements 01 are connected in combination and perform power conversion between a power source and a load (not shown). Each semiconductor element 01 has surfaces 011 and 012 parallel to the opposing positions, and one of these surfaces 011 has a power source. Each of the capacitors 02 has a column shape and is orthogonal to the axial end surface. The capacitor 0 has a terminal 013 and the other surface 012 has a heat radiator 06 including a plurality of heat radiating fins 061. It is provided.

  The power converter having such a configuration has the following configuration. That is, the capacitors 02 are juxtaposed in the same direction, the opposing surfaces 011 and 012 of the semiconductor element 01 are arranged and fixed at right angles to the arrangement direction of the capacitors 02, and the snubber capacitor 04 is arranged close to the semiconductor element 01. It is set. An arrangement of the connection conductor 03 having an L-shaped cross section for electrically connecting the terminal 021 of each capacitor 02, the power supply terminal 013 of the semiconductor element 01, and the terminal of the snubber capacitor 04, and the capacitor 02 The cooling fan 05 is disposed at a position different from the position and close to the radiator 06 and cools the radiating fins 061 constituting the radiator 06 by wind, and the wind generated by the cooling fan 05 is directly applied to the capacitor 02. A wind flow restricting body (wind tunnel) 07 for restricting the wind flow direction so as not to hit is provided.

  Thus, according to the first embodiment, the following operational effects can be obtained.

  1) The capacitors 02 are juxtaposed in the same direction, and the opposing surfaces 011 and 012 of the semiconductor element 01 are arranged and fixed at right angles to the arrangement direction of the capacitors 02, and the terminals 021 of the capacitors 02 and the power supply of the semiconductor element 01 Since the terminal 013 and the terminal of the snubber capacitor 04 are electrically connected by the connection conductor 03 having an L-shaped cross section, the inductance can be reduced and the installation space can be saved.

2) Since the wind flow restricting body (wind tunnel) 07 for restricting the wind flow direction that prevents the wind generated by the cooling fan 05 from directly hitting the condenser 02 is provided, the condenser 02 is prevented from being exhausted by the cooling fan 05, and the condenser 02 The cooling performance can be improved.
Next, Embodiment 2 will be described with reference to FIG. Similar to the first embodiment, a conventional power conversion device has the following configuration. That is, the capacitors 02 are juxtaposed in the same direction, the opposing surfaces 011 and 012 of the semiconductor element 01 are arranged and fixed in the same direction as the arrangement direction of the capacitors 02, and the snubber capacitor 04 is placed close to the semiconductor element 01. It is arranged. In addition, the terminal 021 of each capacitor 02, the power supply terminal 013 of the semiconductor element 01, and the terminal of the snubber capacitor 04 are electrically connected to each other, having a high and low part and connecting the high and low parts. A cooling fan 05 that is disposed at a position different from the arrangement position of the conductor 09 and the capacitor 02 and close to the radiator 06 and cools the radiating fins 061 constituting the radiator 06 by wind, and a cooling fan 05 A wind flow regulating body (wind tunnel) 07 that regulates the wind flow direction so that the generated wind does not directly hit the condenser 02 is provided.

  Thus, according to the second embodiment, the following operational effects can be obtained.

  3) The capacitors 02 are juxtaposed in the same direction, and the opposing surfaces 011 and 012 of the semiconductor element 01 are arranged and fixed in the same direction as the arrangement direction of the capacitors 02, and the terminals 021 of each capacitor 02 and the semiconductor elements 01 Since the power supply terminal 013 and the terminal of the snubber capacitor 04 are electrically connected by the connection conductor 03 having an L-shaped cross section, the inductance can be reduced.

  4) Since the wind flow restricting body (wind tunnel) 07 for restricting the wind flow direction that prevents the wind generated by the cooling fan 05 from directly hitting the condenser 02 is provided, the condenser 02 is prevented from being exhausted by the cooling fan 05, and the condenser 02 The cooling performance can be improved.

The perspective view which shows the power distribution panel to which this invention is applied. The schematic perspective view for demonstrating the structure of FIG. The cross-sectional view for demonstrating the board inside of FIG.1 and FIG.2. The sectional side view which shows only the principal part of Embodiment 1 of the power converter device of this invention. The figure which expands and shows the Z section of FIG. The sectional side view which shows only the principal part of Embodiment 2 of the power converter device of this invention. The perspective view which shows the image which actualized Embodiment 1 of FIG. 4 more. The perspective view which shows the image which actualized Embodiment 1 of FIG. 4 more more, and differs in the direction seen from FIG. FIG. 8 is a top view of FIG. 7. The front view of FIG. The bottom view of FIG. The left view of FIG. The right view of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 01 ... Semiconductor element, 02 ... Capacitor, 03 ... Connection conductor, 04 ... Snubber capacitor, 05 ... Cooling fan, 06 ... Radiator, 07 ... Air flow regulator, 09 ... Connection conductor, 10 ... Monitoring board, 11 ... For monitoring board Housing, 011 ... One surface, 012 ... The other surface, 013 ... Power supply terminal, 20 ... Control protection board, 21 ... Housing, 21 ... Control protection board case, 021 ... Terminal, 22 ... Intake fan, DESCRIPTION OF SYMBOLS 30 ... Power converter board, 31 ... Case for converter boards, 31 ... Housing, 32 ... Semiconductor element, 33 ... Radiation fin, 34 ... Mini fan, 35 ... Panel, 40 ... Interconnection transformer board, 41 ... Casing for interconnection transformer panel, 41 ... casing, 42 ... interconnection transformer, 44 ... mini fan, 50 ... auxiliary machine panel, 51 ... casing, 51 ... casing for auxiliary machine board, 52 ... for exhaust Opening 53, exhaust fan, 061, heat radiating fins 121, 122, intake opening .

Claims (2)

A combination of a plurality of semiconductor elements, a plurality of capacitors for alleviating voltage changes when the semiconductor elements are driven, and a snubber capacitor for suppressing a surge generated when the semiconductor elements are driven, are connected between the power source and the load. Each of the semiconductor elements has a surface parallel to the opposing position, has a power supply terminal on one surface, and a plurality of heat radiation fins on the other surface. In the power converter provided with a radiator, each capacitor is columnar and has a terminal so as to be orthogonal to this axial end face,
A connection conductor having an L-shaped cross section for electrically connecting a terminal of each capacitor, a power supply terminal of the semiconductor element, and a terminal of the snubber capacitor;
A cooling fan that is disposed at a position different from the arrangement position of the capacitors and close to the radiator, and cools the radiating fins constituting the radiator by wind;
An air flow restricting body for restricting an air flow direction so that the wind generated by the cooling fan does not directly hit the condenser;
Comprising
The capacitors are juxtaposed in the same direction, the opposing surfaces of the semiconductor elements are arranged and fixed at right angles to the arrangement direction of the capacitors, and the snubber capacitors are arranged close to the semiconductor elements. A power converter. A combination of a plurality of semiconductor elements, a plurality of capacitors for alleviating voltage changes when the semiconductor elements are driven, and a snubber capacitor for suppressing a surge generated when the semiconductor elements are driven, are connected between the power source and the load. Each of the semiconductor elements has a surface parallel to the opposing position, has a power supply terminal on one surface, and a plurality of heat radiation fins on the other surface. In the power converter provided with a radiator, each capacitor is columnar and has a terminal so as to be orthogonal to this axial end face,
A connection conductor for electrically connecting the terminals of each capacitor, the power supply terminal of the semiconductor element, and the terminals of the snubber capacitor, having a high and low portion and connecting the high and low portions,
A cooling fan that is disposed at a position different from the arrangement position of the capacitors and close to the radiator, and cools the radiating fins constituting the radiator by wind;
An air flow restricting body for restricting an air flow direction so that the wind generated by the cooling fan does not directly hit the condenser;
Comprising
The capacitors are juxtaposed in the same direction, the opposing surfaces of the semiconductor elements are arranged and fixed in the same direction as the arrangement direction of the capacitors, and the snubber capacitors are arranged close to the semiconductor elements. A power conversion device.

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