JP2008058860A - Liquid crystal device and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device whose heat resistance is reduced and which has high heat radiation properties by simplifying a heat conduction path to an outside of a light emitting element in an illumination structure. <P>SOLUTION: The liquid crystal device 100 is provided with the light emitting element 111, a light guide plate 112 so constituted that light emitted from the light emitting element is introduced in the inner part from its end surface and illumination light is emitted from its surface, a liquid crystal display body 120 illuminated by the illumination light and a wiring board 130 connected to the liquid crystal body. The light emitting element has a light radiating surface 111a radiating light and a packaged surface 111b formed on the side opposite to the light radiating surface, the wiring board extends to a rear surface side of the light guide plate passing through the side of the end surface of the light guide plate from the liquid crystal display body side and the light emitting element is packaged on the inner surface of the wiring board in such a state that its packaged surface is faced to the wiring board and its light radiating surface is opposed to the end surface of the light guide plate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a liquid crystal device and an electronic apparatus, and more particularly to a structure of a liquid crystal device including an illumination unit having a light emitting element and a light guide plate.

In general, in an illumination unit for illuminating a liquid crystal display, for example, a backlight,
As an illumination structure suitable for miniaturization, the light emitting surface of a light emitting element such as an LED is disposed facing the end surface of the light guide plate, and the light emitted from the light emitting element is incident from the end surface of the light guide plate and propagates inside. A sidelight type (edge light type) illumination structure in which a planar light source is configured so as to gradually emit light from the surface of a light guide plate is widely known.

Moreover, as a light emitting element used in the above illumination structure, a top view type LED (light emitting diode) that has high heat dissipation and easily achieves high output is known.
In general, a structure in which an LED is mounted on a light source substrate and the back surface of the light source substrate is fixed on the inner surface of a case body that accommodates the light guide plate is used (for example, Patent Document 1 below). And 2).
Registered Utility Model No. 3098463 JP 2006-11242 A

However, when a liquid crystal device that illuminates the liquid crystal display body with the illumination unit using the above-described illumination structure is configured, a wiring board (for example, a flexible wiring board) connected to the liquid crystal display body 10 as shown in FIG. The FPC) 13 is often configured to pass outside the end of the lighting unit that houses the light emitting element 1, so that the light source substrate 2 is brought into contact with the aluminum chassis (inner lower case) 6 or the like. Even in the case where the heat flow rate of the chassis 6 is maximized, the portions where the heat flow rate is maximum are the lighting bezel (inner upper case) 7, the wiring board 13, and the display bezel (outer case).
Since it is covered several times by 8 etc., there is a problem that heat generated in the light emitting element 1 is not easily dissipated. If the heat dissipation around the light emitting element is poor as described above, the light emitting efficiency of the light emitting element 1 is reduced due to overheating, the variation in chromaticity is increased, or when a plurality of light emitting elements are used, As the temperature difference between the light emitting elements increases, the luminance and chromaticity may vary.

Therefore, the present invention solves the above-mentioned problems, and the problem is to simplify the heat conduction path to the outside of the light emitting element in the illumination structure, thereby reducing the thermal resistance and providing a high heat dissipation liquid crystal device. Is to realize.

In view of such circumstances, the liquid crystal device of the present invention is a light-emitting element and a light guide that is configured so that light emitted from the light-emitting element is introduced into the inside from the end face and illumination light is emitted from the surface. In a liquid crystal device comprising a light plate, a liquid crystal display illuminated by the illumination light, and a wiring board connected to the liquid crystal display, the light emitting element emits light, and the light A mounting surface formed on the opposite side of the emission surface, and the wiring board passes from the liquid crystal display side to the side of the end surface of the light guide plate and extends to the back side of the light guide plate. The light emitting element is mounted on the inner surface of the wiring board in such a posture that the mounting surface faces the wiring substrate and the light emitting surface faces the end surface of the light guide plate. .

According to the present invention, by mounting a so-called top-view type light emitting element on the inner surface of a wiring board connected to a liquid crystal display body, a conventional dedicated light source board becomes unnecessary and the light emitting element is formed on the wiring board. Is directly mounted, so that the heat conduction path disposed on the outer side of the light emitting element is greatly simplified, so that the heat dissipation can be improved. Moreover, since the side outer side of the light emitting element can be made thin, it is possible to narrow the frame of the lighting device (narrow the frame portion outside the illumination area). Furthermore, since the number of parts is reduced, the number of assembly steps can be reduced, and the cost can be reduced.

In the present invention, it is preferable that the wiring board further includes an outer case body closely disposed on a surface opposite to the surface on which the light emitting element is mounted. According to this, heat from the light emitting element is directly and efficiently released to the outside through the outer case body. Further, if the wiring board is supported and fixed by the outer case body, the light emitting element can be positioned, and the stability and reproducibility of the illumination light can be improved. In particular, the outer case body is preferably made of a material having high thermal conductivity, such as a metal material.

In the present invention, an inner case body that accommodates at least one of the light guide plate and the liquid crystal display body is further provided, and a region where the light emitting element is mounted on the wiring board is supported and fixed to the inner case body. It is preferable. By supporting and fixing the area where the light emitting element is mounted in the wiring board to the inner case body, the light emitting element can be positioned,
The stability and reproducibility of the illumination light can be improved.

In the present invention, it is preferable that an inner case body that accommodates at least one of the light guide plate and the liquid crystal display body is further provided, and the wiring board is positioned by being engaged with the inner case body. Since the wiring board is engaged with the inner case body and positioned, the posture of the wiring board can be stabilized, and as a result, the light emitting element can be positioned.

The case body provided in the present invention generally includes an inner case body and an outer case body. Here, in the present invention, the inner case body is basically a case body having a side surface portion inside the wiring substrate, and the outer case body is a case body having a side surface portion outside the wiring substrate. In the embodiments described later, the inner case body is provided as a case body that accommodates the light guide plate, and the outer case body is provided as a case body that accommodates the liquid crystal display body, but these are merely examples. These case bodies generally have a function of positioning the light guide plate, the liquid crystal display body, etc., but are further composed of a metal such as aluminum or copper or other material having good thermal conductivity in order to improve heat dissipation. It is preferable that

In the present invention, there is an opening that allows the light emitting element to pass through a side surface portion interposed between the wiring board and the end face of the light guide plate in the inner case body or transmits light emitted from the light emitting element. It is preferable to be provided. An opening is provided in the side surface on the wiring board side of the inner case body that accommodates the light guide plate, and the light-emitting element is accommodated in a state where the light-emitting element is passed through the opening, or the light emitted from the light-emitting element opens the opening. Even if the light emitting element is mounted on the inner surface of the wiring board as in the present invention, the light emitted from the light emitting element can be guided without hindrance by the inner case body. The light can enter the light plate. Also,
Since the side surface portion of the inner case body is arranged inside the wiring board, the light emitting element can be positioned by the side surface portion and the heat dissipation can be improved.

The present invention further includes an outer case body that houses the inner case body and includes a side surface portion that faces the side surface portion of the inner case body, and the wiring board includes the side surface portion of the inner case body and the side surface portion. It is preferable to be sandwiched between the side surface portions of the outer case body. By sandwiching the wiring board between the inner case body and the outer case body, the wiring board is regulated and positioned from both the inner and outer sides, and the heat dissipation can be further enhanced by both the case bodies.

In the present invention, the wiring board includes a first wiring to be connected to the liquid crystal display body and a second wiring to be connected to the light emitting element, and at least in the region where the light emitting element is mounted. It is preferable that the first wiring and the second wiring are laminated in the thickness direction in an insulated state. According to this, in the area | region where the light emitting element in the wiring board is mounted, the 1st wiring and the 2nd wiring are laminated | stacked in the thickness direction in the insulated state, Therefore The handling aspect of the 1st wiring in a wiring board It is possible to set the position of the second wiring, the position of the electrode connected to the light emitting element, and the like without being influenced by the above. Further, since the rigidity of the substrate is increased by multilayering the wiring substrate in the above region, it becomes possible to more reliably support and fix the light emitting element by the wiring substrate. In the cross-sectional structure of the region of the wiring board, the first
It is preferable that the second wiring is disposed on the mounting surface side of the light emitting element rather than the wiring. The two-layer structure as described above can be constituted by an integral multilayer substrate, or can be constituted by partially overlapping two wiring substrates.

Next, an electronic apparatus according to the present invention includes the liquid crystal device according to any one of the above and a power supply unit that supplies power to the light emitting element and the liquid crystal display body via the wiring board. Features. According to this, power is supplied from the power supply unit to the light emitting element and the liquid crystal display body via the wiring substrate, so that the light guide plate illuminates the liquid crystal display body, and an appropriate display is displayed on the illuminated liquid crystal display body. An aspect can be formed.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is an exploded perspective view of a liquid crystal device 100 according to the present invention, FIG. 2 is an exploded perspective view showing an internal structure of an illumination unit 110, and FIG. 3 is an enlarged view showing a cross-sectional structure of an end portion on the light emitting element 111 side of the liquid crystal device 100. FIG. 4 is a schematic perspective view showing the structure of the back side of the liquid crystal display body 120.

The liquid crystal device 100 includes an illumination unit 110 and a liquid crystal display body 120 that receives illumination light emitted from the illumination unit 100. As shown in FIG. 2, the illumination unit 110 includes a light emitting element 111 made of a top-view type LED or the like, and light emitted from the light emitting element 111 is incident from the end face 112a and is emitted from the surface 112b while propagating through the inside. The light guide plate 112 is configured as described above. The light guide plate 112 is made of a light-transmitting material such as acrylic resin or polycarbonate resin, and has a rectangular plate shape in plan view. A reflection sheet 113 made of a white polyethylene sheet or the like is disposed behind the light guide plate 112, and is configured to reflect light leaked from the light guide plate 112 to the back side and return it to the light guide plate 112 to be emitted from the surface 112b. Yes. On the surface 112b of the light guide plate 112, an optical sheet group such as a light diffusing plate 114, prism sheets 115 and 116, and a reflective polarizing plate 117 is disposed.

In the illumination unit 110 having the above configuration, the constituent members of the light guide plate 112, the reflection sheet 113, and the optical sheet groups 114 to 117 are accommodated in the inner lower case 101 made of a metal body such as aluminum, and the same metal as this. The above-mentioned constituent members are positioned and held by covering the inner upper case 102 made of a body, synthetic resin, or the like from above. The inner upper case 102 is provided with an illumination opening 102a for allowing illumination light emitted from the surface 112b of the light guide plate 112 to pass therethrough, and a later-described liquid crystal display 120 is positioned at the opening edge of the illumination opening 102a. A stepped portion 102b is provided for support.

The inner lower case 101 and the inner upper case 102 are openings for allowing the light emitting element 111 to pass through the portion of the light guide plate 112 facing the end surface 112a or for allowing light emitted from the light emitting element 111 to pass therethrough. Portions 101x and 102x are formed. In the case of the illustrated example, the opening 101x provided in the inner lower case 101 is provided as a notch opened upward in the side surface portion 101s facing the end surface 112a in the inner lower case 101. Further, the opening 102x provided in the inner upper case 102 is formed by the inner upper case 1.
02 is provided as a notch that opens downward in the side surface portion 102s facing the end surface 112a.

In the case of the illustrated example, the light emitting element 111 is fitted in the openings 101x and 102x, and light is incident on the light incident surface 112a of the light guide plate 112 from the light emitting surface 111a without any trouble. . As a result, the light emitting element 111 and the light guide plate 112 can be accommodated in a compact or close proximity. However, in the present invention, it is sufficient that the light emitted from the light emitting element 111 can be incident on the light guide plate 112 through the openings 101x and 102x.
, 102x need not be fitted.

In the present embodiment, the inner lower case 101 and the inner upper case 102 constitute an inner case body that covers the lighting unit 110. However, in the present invention, the inner case body is the above case. Only the inner lower case 101 or only the inner upper case 102 may be used. That is, the inner case body is the lighting unit 110.
What is necessary is just to have the function to accommodate and position each structural member which comprises.

As shown in FIG. 3, the liquid crystal display 120 includes a transparent substrate 1 made of glass, plastic, or the like.
21 and 122 are bonded together using a sealing material 123, and a liquid crystal 124 is sealed between transparent substrates 121 and 122. Electrodes (not shown) are provided on the inner surfaces of the transparent substrates 121 and 122, respectively, and a planar overlapping range of the electrodes formed on the substrates 121 and 122 functions as a pixel. Further, the electrode is connected to a wiring having an appropriate plane pattern. The substrate overhanging portion 12 is formed on the transparent substrate 121 so as to project outward from the outer shape of the transparent substrate 122.
1T is provided, and a wiring pattern conductively connected to the plurality of electrodes is drawn on the substrate extension 121T, and an electronic component 125 is mounted as necessary. This electronic component 125
For example, a driver IC having a built-in liquid crystal driving circuit may be used.

The wiring board 130 is a flexible wiring board in which an appropriate wiring pattern is formed on a polyimide resin base material, and one end 131 thereof is mounted on the board overhanging part 121T. The wiring board 130 is bent to the back side from the board overhanging part 121T, and the lighting unit 110
It passes behind and extends behind. The other end (not shown) of the wiring board 130 may extend to the back side as it is, or may be further bent inward so as to wrap around the lighting unit 110. Usually, the other end of the wiring board 130 is directly connected to an external device, or connected to a circuit board (not shown, for example, a control circuit board 140 described later) disposed behind the lighting unit 110.

The light emitting element 111 is mounted on the inner surface of the wiring board 130 (the surface on the light guide plate 112 side). The light emitting element 111 has a so-called top view type LE having a light emitting surface 111a facing the light guide plate 112 and a mounting surface 111b provided on the opposite side of the light emitting surface 111a.
D (light emitting diode). However, in the present invention, the LED may not be the above-described LED as long as it is a top-view type light emitting element, and may be, for example, an organic EL element, a laser diode element, or the like. The light-emitting element 111 in the illustrated example is a surface-mounted element that is mounted in a state where the mounting surface 111 b is bonded to the inner surface of the wiring board 130. In this element, a light emitting chip (not shown) is generally mounted on a support substrate (frame) (not shown) made of aluminum or the like via an appropriate insulating layer. It has a rectangular parallelepiped or disk-shaped package structure that is sealed with a transparent resin for light transmission.

As shown in FIG. 1, the engagement holes 1 are formed on both sides in the width direction of the element mounting region 130G of the wiring board 130.
30x and 130x are provided, and the engagement hole 13 is formed in the side surface portion 102s of the inner upper case 102.
Engagement protrusions 102y and 102y are formed so as to be able to be fitted to 0x. Therefore, the wiring board 130 can be positioned (or fixed) with respect to the inner upper case 102 by fitting the engagement protrusions 102y into the engagement holes 130x. For the above engagement structure, the engagement protrusion may be simply fitted into the engagement hole, but the engagement protrusion is crimped and welded with the engagement protrusion fitted into the engagement hole. Etc., etc.
It is preferable to fix 30 with respect to an inner side case body.

The liquid crystal display body 120 is positioned in a state of being engaged with the inner surface of the inner side of the step portion 102b of the inner upper case 102 of the illumination unit 110, and the outer case 103 is covered from above.
The outer case 103 is provided with a display opening 103 a that exposes the display area of the liquid crystal display body 120. The display opening 103a is provided so as to avoid the upper side of the substrate overhanging portion 121T. That is, a covering portion 103 c that covers the upper portion of the substrate overhanging portion 121 </ b> T is formed at the opening edge of the outer case 103.

As shown in FIG. 3, the side surface portion 103 s of the outer case 103 on the substrate overhanging portion 121 </ b> T side is disposed outside the wiring substrate 130, and is a region where the light emitting element 111 is mounted on the wiring substrate 130. 130G is supported from the outside. In this case, the wiring board 13
0 is sandwiched between the side surface portion 102 s of the inner upper case 102 and the side surface portion 103 s of the outer case 103.

In the present embodiment described above, as shown in FIG. 3, only the side surface portion 103 s of the outer case 103 exists outside the wiring board 130 on which the light emitting element 111 is mounted. Heat is dissipated to the outside through the wiring board 130 and the outer case 103. Therefore, since a heat conduction path that is extremely simple and shortened compared to the heat conduction path from the conventional light emitting element to the outside is provided, the heat dissipation can be improved, and as a result, the light emitting element 11.
1 deterioration and fluctuations in luminance and chromaticity can be suppressed. It is to be noted that a heat conductive material such as a heat dissipation grease, a heat conductive tape, or an elastic member having a good heat conductivity is interposed between the wiring board 130 (element mounting region 130G) and the side surface portion 103s of the outer case 103 so that the outer side. The heat dissipation through the case 103 can be improved. Here, the outer case 103 is a material with good thermal conductivity,
For example, it is preferably composed of a metal such as aluminum, copper, or stainless steel. Also,
Similarly to the above, by interposing a heat conductive material between the wiring board 130 and the inner case body,
The heat dissipation through the inner case body can be improved. This inner case body is also preferably made of a material having good thermal conductivity, for example, a metal such as aluminum, copper, and stainless steel.

Further, in the present embodiment, the side outer side of the light emitting element 111 can be made thin, so that the frame of the lighting device can be narrowed (the frame portion outside the lighting area can be narrowed).
This also leads to a narrow frame of 00. This is more effective particularly when the light emitting element 111 is fitted in the openings 101x and 102x of the inner case body. In this embodiment, since the number of parts is reduced by eliminating the need for a light source board compared to the conventional structure, the number of assembly steps can be reduced and the cost can be reduced.

In the illustrated example of the embodiment described above, the single light emitting element 111 is provided. However, the plurality of light emitting elements 111 are arranged and mounted in the width direction of the wiring board 130, and the plurality of light emitting elements 11 are mounted.
The light emitted from each of the light guides 1 may enter the end face 112a of the light guide plate 112. In this case, the openings 101x and 102x are provided so as to correspond to the plurality of light emitting elements 111, respectively. However, instead of this, a continuous opening in the arrangement range of the plurality of light emitting elements 111 may be provided.

Furthermore, in the present embodiment, by using the light emitting element 111 (so-called top view type light emitting element) having the mounting surface 111b on the opposite side of the light emitting surface 111a, the heat dissipation of the light emitting element 111 itself is improved. Therefore, a single light emitting element 111 is sufficient, for example, an element having a large light emission amount, for example, a power LED (power consumption exceeding 0.5 W, for example, 0.5 to 1.0 W) can be used. Brightness can be obtained. In the illustrated light emitting element 111, the chip constituting the light emitting element is mounted on a support substrate (frame) made of a material having good heat conduction such as aluminum as described above, and the outer surface of the support substrate is the mounting surface 1 described above.
11b or a surface-mount type light emitting device comprising a supporting surface behind the surface 11b. Since this type of light emitting element can reduce the thickness seen in the light emission direction, there is an advantage that an increase in the external dimension of the illumination unit 110 due to the thickness of the light emitting element 111 can be suppressed.

FIG. 5 is a schematic explanatory diagram illustrating an installation example of the wiring board 130 in the present embodiment. In this example, a control circuit board 140 is disposed behind the lighting unit 110, and the control circuit board 1
40, the other end 132 of the wiring board 130 is mounted. The control circuit board 140 constitutes an electrode supply unit that supplies power to the light emitting element 111 and the liquid crystal display body 120. In the present embodiment, since the vicinity of the element mounting region 130G of the wiring board 130 is positioned by the engagement structure (engagement protrusion) 102y, the position of the light emitting element 111 in the illumination unit 110 is determined. Lighting characteristics with high reproducibility can be obtained.

FIG. 6 is a schematic explanatory view showing different installation examples of the wiring board 130. In this example, the wiring board 130 is positioned on the illumination unit 110 by fitting the engagement protrusion 101 y provided on the back side of the illumination unit 110 into the engagement hole 130 y provided in the wiring board 130.

In addition, the engagement structure for positioning the wiring board 130 in the present embodiment is the engagement hole 1.
The wiring board 1 is composed of a combination of 30x, 130y and engaging protrusions 102y, 101y.
30 and the inner case body (the inner lower case 101 or the inner upper case 102) only need to be relatively positioned, not limited to the above structure, but various known engagement structures, for example, screw fixing, sandwiching structure, A hook structure or the like can be used. Further, the wiring board 130 may be fixed to the case body simply by welding, bonding or the like.

The wiring board 130 includes a first wiring that is connected to the liquid crystal display 120 and supplies power (signal), and a second wiring that supplies power to the light emitting element 111, and has various structures. can do. FIGS. 7A to 7D are schematic explanatory views showing a state in which the liquid crystal display body 120 and the wiring board 130 of the above embodiment are developed and viewed from the back side.

In the configuration shown in FIG. 7A, the first wiring board 130A in which the wiring board 130 is connected to the liquid crystal display body 120, and the second wiring board 13 connected to the outside or an electrode supply unit such as the control circuit board.
0B, and the second wiring board 130B is stacked on the inner surface of the first wiring board 130A. The first wiring 133 is formed on the second wiring board 130B, and the first wiring 133 has a via hole structure, A in the region where the first wiring board 130A and the second wiring board 130B are stacked.
The first wiring 134 formed on the first wiring substrate 130A is conductively connected by a CF (anisotropic conductive film) structure or the like. A second wiring 135 is formed on the second wiring board 130B, and the second wiring 135 is conductively connected to the light emitting element 111 mounted in the region as it is.

In the illustrated example, the first wiring board 130A is a single-layer board having only the conductive pattern layer on which the first wiring 134 is formed. The second wiring board 130B is a multilayer board (two-layer board) in which the first wiring 133 and the second wiring 135 are formed in different conductive pattern layers. Accordingly, the mounting of the light emitting element 111 on the second wiring board 130B and the first
It becomes possible to easily mount the second wiring board 130B on the wiring board 130A.
In the illustrated example, in the second wiring board 130B, the second wiring 135 is formed on the inner surface side (light guide plate 1112 side) than the first wiring 133. However, the second wiring board 130B may be formed of a single-layer wiring board. As described above, in this example, the second wiring board 1 on the power supply unit side.
30B has a two-layer structure, and the light emitting element 111 is mounted on the inner surface of the second wiring board 130B.

In the example shown in FIG. 7B, the wiring board 130 is connected to the liquid crystal display body 120 and is mounted on the first wiring board 130A having a multilayer board structure (two-layer board structure) and the first wiring board 130A. And a second wiring board 130B. In this example, the light emitting element 111 is mounted on the inner surface of the first wiring board 130A. Although not particularly limited, in the illustrated example, the second wiring board 130B is a single-layer board. In this example, the first formed on the second wiring board 130B.
The wiring 133 is conductively connected to the first wiring 134 formed on the first wiring board 130A by a via hole structure, an ACF structure, or the like. Further, the second wiring 13 formed on the second wiring board 130B.
Reference numeral 5 denotes a second wiring 1 formed on the first wiring board 130A by a via hole structure, an ACF structure, or the like.
The second wiring 136 is connected to the light emitting element 111 mounted on the inner surface of the first wiring board 130A. Here, in the first wiring board 130A, the second wiring 1
36 is formed on the inner surface side of the first wiring 134. As described above, in this example, the first wiring board 130A on the liquid crystal display 120 side has a two-layer structure, and the light emitting element 111 is mounted on the inner surface of the first wiring board 130A.

In the example shown in FIG. 7C, the wiring board 130 has a single layer and an integrated board structure, and the first wiring 1
33 and the second wiring 135 are formed in the same layer. This wiring board 13
In the case of 0, it is necessary to form a dedicated wiring pattern for mounting the light emitting element 111, but it is not necessary to make the substrate structure multi-layered, and a conductive connection portion such as a via hole or a mounting portion such as an ACF structure There is an advantage that it is not necessary to provide.

In the example shown in FIG. 7D, the wiring board 130 includes a single-layer first wiring board 130A connected between the liquid crystal display 120 and a power supply unit such as an external or control circuit board, and the first wiring. And a single-layer second wiring board 130B stacked on the board 130A. Second wiring board 130
A light emitting element 111 is mounted on the inner surface of B. The first wiring 1 is provided on the second wiring board 130A.
33 and the second wiring 135 are formed, and the first wiring 133 is conductively connected to the first wiring 134 formed on the first wiring board 130B by a via hole structure, an ACF structure, or the like.
4 is directly conductively connected to the liquid crystal display 120. The second wiring 135 is the second wiring board 130.
The light emitting element 111 mounted on the inner surface of B is directly conductively connected. As described above, in this example, the first wiring substrate 130A and the second wiring substrate 130B each have a single-layer structure, but the portion where both substrates are stacked in the thickness direction has a two-layer structure as a whole, and the portion Light emitting element 11
1 is implemented.

Among the various examples of the wiring substrate 130 described above, in the example illustrated in FIGS. 7A, 7 </ b> B, and 7 </ b> D, the element mounting region 130 </ b> G on which the light emitting element 111 is mounted has a multilayer substrate structure (two-layer substrate (Structure) increases the degree of freedom in planar handling of the first wiring connected to the liquid crystal display and the second wiring connected to the light emitting element 111, so that the element mounting region 130G can be designed. Since it becomes easy and the element mounting region 130G becomes thick and the rigidity is increased, the light emitting element 1
11 can be more securely fixed.

In this case, in the cross-sectional structure of the multilayer substrate structure, in order to easily connect the light emitting element 111 and the second wiring, the second wiring is on the inner surface side (the mounting surface side of the light emitting element 111) than the first wiring.
It is preferable to arrange | position. In the multilayer substrate structure, it goes without saying that an intermediate insulating layer made of polyimide resin or the like is formed between the first wiring and the second wiring. For example, the cross section of the multilayer substrate structure of the wiring board 130 has a five-layer structure of an outer surface insulating layer, a first wiring, an intermediate insulating layer, a second wiring, and an inner surface insulating layer in order from the outside. In this case, by providing an opening in the inner surface insulating layer, the terminal portion of the second wiring is exposed and conductively connected to the light emitting element 111.

[Electronics]
Finally, an embodiment of an electronic apparatus equipped with the liquid crystal device will be described with reference to FIG. FIG. 9 is a schematic perspective view showing an appearance of an example of an electronic apparatus according to the invention. The electronic apparatus 1000 in the illustrated example is an in-car car navigation system, and includes a main body 1010 and the main body 1.
And a display unit 1020 connected to 010. The main body 1010 is provided with an operation surface 1011 provided with operation buttons and the like, and a storage unit 101 for a recording medium such as a DVD or HD.
2 is provided. The liquid crystal device 100 is stored inside the display unit 1020, and the display by the liquid crystal device 100, that is, the display of the navigation image can be visually recognized on the display screen 1020a of the display unit 1020.

In this electronic apparatus 1000, the above-described liquid crystal device 100 with good heat dissipation is mounted, so that the allowable range of the environmental temperature can be expanded, and the luminance and color of the display light emitted from the display screen. The fluctuation of the degree can be suppressed, and stable display quality can be secured.

In addition, the liquid crystal device and the electronic apparatus of the present invention are not limited to the above illustrated examples,
Of course, various modifications can be made without departing from the scope of the present invention. For example, in the liquid crystal device of the above embodiment, an example in which an illumination unit is used as a backlight is shown.
The lighting unit may be used as a front light.

1 is an exploded perspective view of an embodiment of a liquid crystal device according to the present invention. The disassembled perspective view which shows the internal structure of the illumination unit of the embodiment. The expanded partial longitudinal cross-sectional view which expands and shows the cross-section of the edge part of the embodiment. The schematic perspective view which shows the structure of the liquid crystal display body and wiring board of the embodiment. The schematic sectional drawing which shows typically the whole structure of the embodiment. The schematic sectional drawing which shows typically the whole structure of different embodiment. The liquid crystal display body for showing the structural example of a wiring board, and the back surface expanded view (a)-(d) of a wiring board. The expanded partial longitudinal cross-sectional view of a comparative example. The schematic perspective view which shows the external appearance of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Liquid crystal device, 101 ... Inner lower case, 101x, 102x ... Opening part, 101y, 1
02y ... engaging projection, 102 ... inner upper case, 103 ... outer case, 110 ... lighting unit, 111 ... light emitting element, 111a ... light emitting surface, 111b ... mounting surface, 112 ... light guide plate, 112
a ... end face, 112b ... surface, 113 ... reflection sheet, 114-117 ... optical sheet, 120
... Liquid crystal display, 130 ... wiring substrate, 130x ... engagement hole, 130G ... element mounting region, 133
134, first wiring, 135, 136, second wiring

Claims (8)

A light-emitting element, a light guide plate configured such that light emitted from the light-emitting element is introduced into the inside thereof from the end face and emitted from the surface as illumination light, and a liquid crystal display illuminated by the illumination light In a liquid crystal device comprising a wiring substrate connected to the liquid crystal display body,
The light emitting device has a light emitting surface for emitting light, and a mounting surface formed on the opposite side of the light emitting surface,
The wiring board extends from the liquid crystal display side to the back side of the light guide plate through the side of the end face of the light guide plate,
The liquid crystal device, wherein the light emitting element is mounted on an inner surface of the wiring board in a posture in which the mounting surface faces the wiring substrate and the light emission surface faces the end surface of the light guide plate. 2. The liquid crystal device according to claim 1, further comprising an outer case body arranged in close contact with a surface opposite to a surface on which the light emitting element is mounted of the wiring board. It further comprises an inner case body that accommodates at least one of the light guide plate and the liquid crystal display body, and a region where the light emitting element is mounted on the wiring board is supported and fixed to the inner case body. The liquid crystal device according to claim 1 or 2. 3. The apparatus according to claim 1, further comprising an inner case body that accommodates at least one of the light guide plate and the liquid crystal display body, wherein the wiring board is positioned by engaging with the inner case body. The liquid crystal device described. Further comprising an inner case body for accommodating the light guide plate;
An opening for allowing the light emitting element to pass through or transmitting light emitted from the light emitting element is provided in a side surface portion interposed between the wiring board and the end face of the light guide plate in the inner case body. The liquid crystal device according to claim 1. The inner case body is accommodated, and further comprises an outer case body provided with a side portion facing the side portion of the inner case body,
The liquid crystal device according to claim 5, wherein the wiring board is sandwiched between the side surface portion of the inner case body and the side surface portion of the outer case body. The wiring board includes a first wiring to be connected to the liquid crystal display and a second wiring to be connected to the light emitting element, and at least in the region where the light emitting element is mounted, The liquid crystal device according to claim 1, wherein the liquid crystal device is stacked in a thickness direction in a state where the second wiring is insulated. An electronic device comprising: the liquid crystal device according to claim 1; and a power supply unit that supplies power to the light emitting element and the liquid crystal display body through the wiring board. machine.

Images