JP2008028199A - Manufacturing method of hybrid integrated circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively wire terminals formed on the inner side of a wiring board without the need of a wiring space for a special lead-out line for plating on the wiring board of an assembled structure for which a plurality of hybrid integrated circuits are formed, and to accurately measure the electric characteristics of the respective hybrid integrated circuits in the state of the assembled structure of the hybrid integrated circuits. <P>SOLUTION: A wiring board assembly 2 has a terminal 3 to which electrolytic plating is to be executed is provided, and the plurality of wiring boards 1 with the hybrid integrated circuit formed thereon. Its manufacturing method includes: (1) a process of connecting the pull-out line 4 for plating connected to the terminal 3 to a pattern 5 for plating voltage application provided at least near the outer periphery edge of the wiring board assembly 2 crossing a first scribe line 6, and forming the prescribed part of the pull-out line 4 for plating on a second scribe line 7 in the wiring board assembly 2; and (2) a process of executing the electrolytic plating to the terminal, by applying a voltage between the pattern 5 for plating voltage application and an opposite electrode in an electrolytic plating solution. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  Generally, a wiring board on which a hybrid integrated circuit is formed includes terminals for mounting electronic components by soldering or bonding and terminals for connection to external electrodes. A metal film is formed on the surface of these terminals as necessary, for example, to improve solderability, conductivity, and wear resistance. As a method for forming this metal film, there is an electrolytic plating method.

  Here, the “electrolytic plating method” is a method in which a wiring board is immersed in an electrolytic solution, and a voltage is applied between the terminal of the wiring board and the counter electrode in the electrolytic solution as a metal. This is a method of depositing a film.

  When a metal film is formed by the electrolytic plating method, a wiring pattern is drawn out from the terminal of the wiring board to the vicinity of the outer periphery of the wiring board, and the wiring pattern and the power source for plating are connected in the vicinity of the outer periphery of the wiring board. Thus, the terminal becomes an electrode.

  Recently, hybrid integrated circuits and their wiring boards have been required to have higher density in order to reduce the size and performance of electrical products. Therefore, a large number of terminals and a complicated wiring pattern are formed on a small wiring board. As the density of the wiring board increases, the wiring (plating lead line) cannot be drawn from the terminal formed on the inner side of the wiring board to the vicinity of the outer peripheral edge, and the terminal is connected to the power source for plating. It may not be possible. Thus, the terminal which is not connected to the power supply for plating cannot constitute an electrode at the time of electrolytic plating, and a metal film is not formed.

  In order to form the surface layer of the metal film on the terminal, a special wiring space dedicated to the lead wire for plating is required to draw the wiring from the terminal formed on the inner side of the wiring board to the vicinity of the outer peripheral edge. This wiring space hinders high density of the wiring board.

  In a wiring board having a collective structure in which a plurality of hybrid integrated circuits are formed, as disclosed in Patent Document 1, the terminals of adjacent hybrid integrated circuits are connected to each other by a wiring pattern, so that a dedicated lead wire for plating is used. Without requiring a special wiring space, the wiring pattern can be drawn from the terminal to the vicinity of the outer peripheral edge of the wiring board. However, in this case, since a plurality of hybrid integrated circuits are electrically connected, it is difficult to confirm accurate electrical characteristics unless they are divided into individual hybrid integrated circuits.

Japanese Patent Laid-Open No. 11-176974

  The present invention has been made in view of the above technical problem, and in a wiring board assembly having an aggregate structure in which a plurality of hybrid integrated circuits having terminals to be subjected to electrolytic plating are formed, on the inner side of the wiring board assembly. It can be effectively wired without the need for a special wiring space dedicated to the lead wire for plating drawn out from the formed terminal, and the metal film can be reliably formed on the terminal surface by applying electrolytic plating, and the hybrid integrated circuit It is an object of the present invention to provide a method for manufacturing a hybrid integrated circuit board that can accurately measure the electrical characteristics of each hybrid integrated circuit without dividing the formed wiring board into individual parts.

In order to achieve the above object, a method of manufacturing a hybrid integrated circuit board according to the present invention includes a wiring board assembly having a terminal to which electrolytic plating is applied and a plurality of wiring boards on which the hybrid integrated circuit is formed. The following steps are included as a pre-process for sequentially cutting along the first scribe line and the second scribe line intersecting the first scribe line.
(1) In the wiring board assembly, a plating voltage application pattern provided at least in the vicinity of the outer peripheral edge of the wiring board assembly has a lead-out line for plating connected to the terminal across the first scribe line. A step of connecting and forming a predetermined portion of the lead wire for plating overlapping the second scribe line.
(2) A step of subjecting the terminal to electrolytic plating by applying a voltage between the plating voltage application pattern and the counter electrode in the electrolytic plating solution.

  The hybrid integrated circuit board manufacturing method is characterized in that, in the first scribe line cutting step, the lead wire for plating led out from the wiring board is electroplated with the cutting of the first scribe line. The wiring boards that are cut off from each other and thereby formed as a hybrid integrated circuit are electrically independent from each other.

  Furthermore, in the method of manufacturing the hybrid integrated circuit board, in the first scribe line cutting step, the wiring board has a collective structure in which at least one side thereof is connected to an adjacent wiring board or a wiring board assembly outer peripheral part. It is characterized by.

  Furthermore, the method for manufacturing a hybrid integrated circuit board is characterized in that in the second scribe line cutting step, the means for dividing the wiring board on which the hybrid integrated circuit is formed is a dicer.

  In addition, in the method of manufacturing the hybrid integrated circuit board, when dividing the wiring board on which the hybrid integrated circuit is formed in the second scribe line cutting step, the lead lines for plating on the second scribe line are arranged. It is characterized by being removed by a dicer.

  According to the present invention, in a wiring board assembly having a collective structure in which a plurality of hybrid integrated circuits having terminals to be subjected to electrolytic plating are formed, a plating lead drawn from a terminal formed on the inner side of the wiring board assembly Since the line is formed so as to overlap the scribe line, the wiring pattern can be effectively wired without requiring a special wiring space.

  Further, since the terminals to be electroplated formed on the inner side of the wiring board assembly are connected by the lead wires for plating, the metal film can be reliably formed on the surface of the terminals by performing electroplating.

  Further, since only the plated lead lines are cut by the first scribe line, the hybrid integrated circuit is not divided individually, and the wiring substrate on which each hybrid integrated circuit is formed is electrically independent. Since it is formed as a substrate assembly, the electrical characteristics can be accurately measured while the hybrid integrated circuit remains as a wiring substrate assembly. Further, when dividing into individual wiring boards by cutting with the second scribe line, a predetermined portion of the plated lead line is removed, so that the plated lead line unnecessary for the hybrid integrated circuit can be removed.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<Embodiment 1>
1 is a plan view of a wiring board assembly for forming a hybrid integrated circuit having an assembly structure according to Embodiment 1 of the present invention, and FIG. 2 is an individual hybrid integrated circuit obtained by dividing the wiring board assembly of FIG. It is a top view of the wiring board in which was formed. In FIG. 2, electronic components mounted to form a hybrid integrated circuit are omitted.

  1 and 2, reference numeral 1 denotes a wiring board, and 2 denotes a wiring board assembly.

  Each hybrid integrated circuit is formed on the wiring board 1. On the inner surface of the wiring board 1, a pair of left and right terminals 3 to which electrolytic plating is applied are formed. The terminals 3 to which these electrolytic platings are applied have a rectangular shape.

  The wiring board assembly 2 has a rectangular shape by continuously forming 4 (vertical) × 2 (horizontal) wiring boards 1. A plating voltage application pattern 5 is formed in a margin portion near the outer peripheral edge of the wiring board assembly 2 and a central margin portion. Specifically, the plating voltage application pattern 5 formed in the blank portion near the outer peripheral edge has a rectangular frame shape along the upper side, lower side, left side, and right side of the wiring board assembly 2.

  On the other hand, the plating voltage application pattern 5 formed in the central blank portion extends in the vertical direction in parallel with the plating voltage application pattern 5 extending in the vertical direction along the left side and the right side of the wiring board assembly 2. Both ends of the plating voltage applying pattern 5 in the central margin are joined to the plating voltage applying pattern 5 extending in the lateral direction along the upper side and the lower side of the wiring board assembly 2.

  The plating voltage application pattern 5 formed in the left side margin part and the right side margin part of the wiring board assembly 2 and the plating voltage application pattern 5 formed in the central margin part are respectively inward of the wiring board 1. Plating lead wires 4 drawn from the respective terminals 3 on the side are connected.

  Specifically, the lead wire 4 for plating connected to the plating voltage application pattern 5 in the left margin is drawn from the upper side of the terminal 3 on the left side of each wiring board 1 belonging to the first column in the vertical direction. Yes. The lead wire 4 for plating connected to the left side of the plating voltage application pattern 5 in the central margin is drawn from the lower side of the terminal 3 on the right side of each wiring board 1 belonging to the first column.

On the other hand, the lead wire 4 for plating connected to the plating voltage application pattern 5 in the right side margin is drawn from the lower side of the terminal 3 on the right side of each wiring board 1 belonging to the second column in the vertical direction.
The lead wire 4 for plating connected to the right side of the plating voltage application pattern 5 in the central margin is drawn from the upper side of the terminal 3 on the left side of each wiring board 1 belonging to the second row.

  Each of the lead wires 4 for plating is routed by being bent at a right angle from the other end of the pattern bonding portion 41 toward the terminal 3 at one end thereof to the plating voltage application pattern 5. The tip is composed of a terminal joint portion 42 that joins the terminal 3.

  The wiring board assembly 2 is finally cut vertically and horizontally along the four first scribe lines 6 and the five second scribe lines 7 orthogonal to the first scribe lines 6. It is divided into individual hybrid integrated circuits (that is, eight wiring boards 1).

  The first scribe line 6 is a line for cutting the wiring board assembly 2 along the vertical direction. These first scribe lines 6 extend in the vertical direction along the left side and the right side of the wiring board assembly 2, respectively.

  In particular, the two first scribe lines 6 related to the wiring board group belonging to the first row are between the plating voltage application pattern 5 in the left margin and the plating voltage application pattern 5 in the central margin. Each of the lead wires 4 for plating 4 formed so as to sandwich the pair of left and right terminals 3 of each wiring board 1 belonging to the first row and connected to each terminal 3 on the wiring board 1 belonging to the first row. Is crossing.

  On the other hand, the two first scribe lines 6 related to the wiring board group belonging to the second row are between the plating voltage application pattern 5 in the right side margin portion and the plating voltage application pattern 5 in the central margin portion. Each of the lead wires 4 for plating 4 formed so as to sandwich the pair of left and right terminals 3 of each wiring board 1 belonging to the second row and connected to each terminal 3 of each wiring board 1 belonging to the second row. Is crossing.

  The length of each first scribe line 6 is such that the upper end passes through the uppermost second scribe line 7 and is spaced apart from the plating voltage application pattern 5 formed in the upper margin. The lower end passes through the lowermost second scribe line 7 and is set so as to be separated from the plating voltage application pattern 5 formed in the lower margin.

  The second scribe line 7 is a line for cutting the wiring board assembly 2 along the horizontal direction. These second scribe lines 7 extend in the lateral direction along the upper and lower sides of the wiring board assembly 2. On the second scribe line 7, the pattern joining portions 41 of the lead wires 4 for plating are formed so as to overlap each other. The length dimension of each second scribe line 7 is set so as to exist over the entire length in the length direction of the upper side and the lower side of the wiring board assembly 2.

  FIG. 4 is a flowchart showing a method of manufacturing a hybrid integrated circuit board in the order of steps.

  4 includes a pattern forming step 8, an electrolytic plating step 9, a first scribe line cutting step 10, an assembling step 11, an electrical characteristic, and the like. A measurement step 12 and a second scribe line cutting step 13 are included.

  In the pattern forming step 8, the pattern joining portion 41 of the lead wire 4 for plating drawn out from the terminal 3 on which the electrolytic plating is formed formed on the inner side of the wiring substrate 1 on which the hybrid integrated circuit is formed, Overlaid on the scribe line 7, the lead wire 4 for plating is connected to the left side margin portion, right side margin portion, and center margin portion of the wiring board assembly 2 so that the pattern joining portion 41 crosses the first scribe line 6. Are pulled out to the plating voltage application pattern 5 respectively provided to the plating voltage application pattern 5.

  By connecting the wiring patterns in this manner, in the electrolytic plating step 9, the wiring board assembly 2 is immersed in the electrolytic solution, and a voltage is applied between the plating voltage application pattern 5 and the counter electrode in the electrolytic plating solution. As a result, as shown in FIG. 3, the terminal 3 formed on the inner side of the wiring substrate 1 can be electroplated to form a metal film 15 on the terminal surface. In FIG. 3, reference numeral 14 denotes a substrate of the wiring board.

  Next, in the first scribe line cutting step 10, the wiring board assembly 2 is cut in the vertical direction along the first scribe line 6 by a predetermined cutting means such as a dicer. As a result of this cutting, the wiring board 1 has a collective structure connected to the outer peripheral portion of the adjacent wiring board 1 or the wiring board assembly 2 (hereinafter, this state is referred to as “a collective structure of the wiring board 1”). However, electrically, each wiring board 1 (which will be an individual hybrid integrated circuit later) is in an independent state.

  Thereafter, in the assembling process 11, electronic components for forming a hybrid integrated circuit are mounted as necessary.

  In the subsequent electrical characteristic measurement step 12, the electrical characteristics for confirming the function of the hybrid integrated circuit are measured. As described above, the wiring board on which each hybrid integrated circuit is already formed is in an electrically independent state. The electrical characteristics of each hybrid integrated circuit can be accurately measured with the above aggregate structure.

  Then, in the second scribe line cutting step 13, the assembly structure of the wiring board 1 (that is, the assembly of the individual hybrid integrated circuits) is cut laterally along the second scribe line 7 by a dicer, Divided into wiring boards on which the individual hybrid integrated circuits shown in FIG. 2 are formed. At the same time, in the lead wire 4 for plating on the second scribe line 6, the pattern joint portion 41 is removed by the dicer, while a part of the terminal joint portion 42 remains on the wiring board 1.

  In the first embodiment, prior to sequentially cutting the wiring board assembly along the first scribe line and the second scribe line, (1) on the wiring board assembly, on the inner side of the wiring board. Predetermined portions of the lead wires for plating (this embodiment) so that the lead wires 4 for plating connected to the terminals cross the first scribe line and connect to the respective patterns for applying a plating voltage of the wiring board assembly. In the first embodiment, the pattern joining portion 41) is formed so as to overlap the second scribe line, and (2) a voltage is applied to the terminal by applying a voltage between the plating voltage application pattern and the counter electrode in the electrolytic plating solution. Since the electrolytic plating is performed, the following effects are obtained.

  (1) Conventionally, since adjacent wiring boards (hybrid integrated circuits) are connected to each other in order to perform electrolytic plating on terminals, electrical characteristics cannot be measured in the aggregate structure, and individual hybrid integrated circuits are formed. In the first embodiment, since the electrical characteristics of each hybrid integrated circuit can be accurately measured with the aggregate structure, automatic characteristics using the aggregate structure are measured. A measuring device can be used.

  (2) Conventionally, a special wiring space dedicated to the lead wire for plating led out from the terminal is required and the density of the wiring board is hindered. In the first embodiment, each hybrid integrated circuit Since the space of the scribe line necessary for the division can also be used for the wiring of the lead wire for plating, effective use of the wiring board is achieved.

  In the first embodiment, the plating voltage application pattern provided in the vicinity of the outer peripheral edge of the wiring board assembly in a state in which the terminals to be electroplated on the individual wiring boards and the lead wires for plating are made independent. Electrolytic plating was performed by connecting to the substrate, but electrolytic plating was also performed by using a through hole to connect to the plating voltage application pattern in a state where the lead lines for plating were bundled with the inner layer pattern and the back surface pattern of the wiring board. be able to.

<Embodiment 2>
5 is a plan view of a wiring board assembly for forming a hybrid integrated circuit having an assembly structure according to Embodiment 2 of the present invention, and FIG. 6 is a rear view of the wiring board assembly.

  The features of the wiring board assembly for forming a hybrid integrated circuit having the collective structure according to the second embodiment shown in FIGS. 5 and 6 are (1) four terminals 3 on the inner surface of each wiring board 1. (2) The point that the pattern 5 for plating voltage application is formed on both the front and back surfaces of the wiring board assembly 2, and (3) the wiring board from the third and fourth terminals 3 The point where the lead wire 4 for plating is drawn out to the back side of the wiring board assembly 2 through two wiring through holes 16 formed on the inner side of each 1 and connected to the plating voltage application pattern 5 The other configurations are substantially the same as those of the first embodiment.

  One wiring through hole among the wiring through holes 16 related to the wiring board group belonging to the first column in the vertical direction is adjacent to the plating voltage application pattern 5 formed in the left margin of the wiring board assembly 2. The other wiring through hole is disposed on the first scribe line 6 and is disposed on the first scribe line 6 adjacent to the plating voltage application pattern 5 formed in the central margin of the wiring board assembly 2. Has been.

  On the other hand, one wiring through hole among the wiring through holes 16 related to the wiring board group belonging to the second column in the vertical direction is formed in the plating voltage application pattern 5 formed in the right side margin of the wiring board assembly 2. The other wiring through-hole is disposed on the first scribe line 6 formed in the central blank portion of the wiring board assembly 2 and disposed on the adjacent first scribe line 6. By providing the wiring through holes 16 on the first scribe lines 6 in this way, the density of the wiring substrate on which the hybrid integrated circuit is formed is ensured.

  The lead wire 4 for plating led out from the upper side of the terminal 3 on the upper left side of each of the wiring boards 1 belonging to the first column in the vertical direction has a pattern joint 41 on the front side of the wiring board assembly 2 and the second scribe line 7. It is connected to the plating voltage application pattern 5 in the left margin on the front side so as to overlap the upper side and cross the first scribe line 6.

  The lead wire 4 for plating led out from the lower side of the terminal 3 on the lower right side of each wiring board 1 belonging to the first row has a pattern joint 41 on the front side of the wiring board assembly 2 and the second scribe line 7. It is connected to the left side of the plating voltage application pattern 5 in the central margin on the front side so as to overlap the upper side and cross the first scribe line 6.

  On the other hand, the lead wire 4 for plating led out from the lower side of the terminal 3 on the lower right side of each wiring board 1 belonging to the second column in the vertical direction has a pattern joint 41 on the front side of the wiring board assembly 2. It is connected to the plating voltage application pattern 5 on the right side margin on the front side so as to overlap the scribe line 7 and cross the first scribe line 6. The lead wire 4 for plating led out from the upper side of the terminal 3 on the upper left side of each wiring board 1 belonging to the second row has a pattern joint 41 on the second scribe line 7 on the front side of the wiring board assembly 2. Are connected to the right side of the plating voltage application pattern 5 in the central margin on the front side so as to overlap the first scribe line 6.

  In the lead wire 4 for plating led out from the left side of the terminal 3 on the lower left side of each wiring board 1 belonging to the first column in the vertical direction, the terminal joining portion 42 passes through one wiring through hole 16 and the wiring board assembly 2. Of the left side margin on the back side so that the pattern joining portion 41 overlaps the second scribe line 6 on the back side of the wiring board assembly 2. It is connected to the application pattern 5.

  The lead wire 4 for plating led out from the right side of the terminal 3 on the upper right side of each wiring board 1 belonging to the first column in the vertical direction passes through the other wiring through hole 16 and the wiring board assembly 2. The plating voltage of the central blank portion on the back side overlaps with the first scribe line 6 on the back surface side of the wiring board assembly 2 and overlaps with the second scribe line 6 on the back surface side of the wiring board assembly 2. It is connected to the left side of the application pattern 5.

  On the other hand, the lead wire 4 for plating led out from the right side of the terminal 3 on the upper right side of each wiring board 1 belonging to the second column in the vertical direction passes through the other wiring through-hole 16 and the wiring board assembly The pattern 2 is overlapped on the first scribe line 6 on the back side of the body 2 and the right side margin on the back side so that the pattern bonding portion 41 is overlapped on the second scribe line 6 on the back side of the wiring board assembly 2. It is connected to the plating voltage application pattern 5.

  The plating lead wire 4 led out from the left side of the terminal 3 on the lower left side of each wiring board 1 belonging to the second row has the terminal joint portion 42 passing through one wiring through hole 16 and the wiring board assembly 2. Applying a plating voltage to the central margin on the back side so that the back surface side overlaps the first scribe line 6 and the pattern bonding portion 41 overlaps the second scribe line 6 on the back surface side of the wiring board assembly 2. The right side of the pattern 5 for use is connected.

  In the pattern forming step 8, the second scribe is formed so that the lead wire 4 for plating drawn out from the terminal 3 formed on the inner side of the wiring substrate 1 and subjected to electrolytic plating crosses the first scribe line 6. It is formed so as to overlap the line 7 and is connected to the plating voltage application pattern 5 formed on both the front and back surfaces of the wiring board assembly 2.

  Specifically, among the four terminals 3 in the wiring board 1, the plating lead lines 4 led out from the two terminals are overlapped on the second scribe line 7 and the pattern joining portion 41 is overlapped with the first scribe line 7. It is connected to the plating voltage application pattern 5 on the front side so as to cross the line 6.

  On the other hand, the lead wire 4 for plating led out from the remaining two terminals passes through the wiring through-hole 16 and overlaps the first scribe line 6 on the back surface side of the wiring board assembly 2. At the same time, the pattern bonding portion 41 is connected to the plating voltage application pattern 5 on the back side so as to overlap the second scribe line 6 on the back side of the wiring board assembly 2.

  In the electroplating step 9, a voltage is applied between the plating voltage application pattern 5 and the counter electrode in the electroplating solution to perform electroplating on the terminal 3 inside the wiring board 1.

  In the first scribe line cutting step 10, the wiring board assembly 2 is cut in the vertical direction along the first scribe line 6.

  In the assembly process 11, an electronic component 18 for forming a hybrid integrated circuit is mounted on a mounting region 17 (see FIG. 5) on the wiring board 1.

  In the electrical property measurement step 12, electrical properties for confirming the function of the hybrid integrated circuit are measured.

  In the second scribe line cutting step 13, the aggregate structure of the wiring board 1 (aggregate of individual hybrid integrated circuits) is cut in the horizontal direction along the second scribe line 7 by a dicer, as shown in FIG. As described above, the substrate is divided into wiring boards on which individual hybrid integrated circuits are formed.

  According to the second embodiment, in addition to the same operational effects as the first embodiment, the following operational effects are achieved.

  A single wiring board has four terminals on the inner surface of the surface. Although only the surface (one wiring layer) can lead out lead wires for plating from the two terminals, The lead wire for plating cannot be pulled out from the two terminals.

  Therefore, in the second embodiment, in order to wire the lead wires for plating from the remaining two terminals on the second scribe line, the lead wires for plating drawn from the remaining two terminals are used for wiring. Since it is formed on the second scribe line on the back surface (other wiring layer) through the through hole, it is possible to perform electrolytic plating on all the four terminals.

  In other words, if electrolytic plating is to be performed on all four terminals, the lead wires for plating corresponding to the number of terminals must be connected to the pattern for applying the plating voltage across the first scribe line. In some cases, the lead wires for plating to be drawn out from the remaining two terminals cannot be wired by the component lands provided above or the connection terminals to the outside.

Therefore, in the second embodiment, the lead wire for plating led out from two terminals among the four terminals in the wiring board is arranged on the second scribe line on the surface side of the wiring board assembly. The pattern is connected to the plating voltage application pattern on the front side so as to overlap and cross the first scribe line.
Further, the lead wires for plating led out from the remaining two terminals are routed to the back surface side of the wiring board assembly through the wiring through-holes, and the pattern joining section is connected to the wiring board assembly. Because it is connected to the pattern for applying the plating voltage on the back side so that it overlaps the second scribe line on the back side of the lead, it is possible to wire the lead wires for plating necessary for applying the electrolytic plating to the remaining two terminals It becomes.

  That is, as described above, the present invention functions most effectively when three or more terminals are formed on the surface of a single wiring board and all the terminals must be electrolytically plated.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various design changes and modifications can be made within the scope of the claims attached to this specification.

  The present invention relates to a wiring board assembly having a collective structure in which a plurality of wiring boards on which hybrid integrated circuits having terminals to which electrolytic plating is applied are formed are drawn from the terminals formed on the inner side of the wiring board. Wiring can be effectively performed without requiring a special wiring space dedicated to the lead wire for plating, and a metal film can be reliably formed on the terminal surface by applying electrolytic plating, and each wiring board on which a hybrid integrated circuit is formed Since the electrical characteristics of each hybrid integrated circuit can be accurately measured without being divided into two, it is useful as a method for manufacturing a hybrid integrated circuit substrate having terminals to which electrolytic plating is applied.

It is a top view of the wiring board aggregate | assembly for hybrid integrated circuit formation based on Embodiment 1 of this invention. It is a top view of each wiring board formed by dividing the wiring board aggregate shown in FIG. It is a principal part expanded sectional view of the wiring board by which the metal film was formed in the terminal. It is a flowchart which shows the manufacturing method of the hybrid integrated circuit board of this invention in process order. It is a top view of the wiring board aggregate | assembly for hybrid integrated circuit formation based on Embodiment 2 of this invention. FIG. 6 is a rear view of the wiring board assembly shown in FIG. 5. FIG. 7 is a plan view of individual wiring boards obtained by dividing the wiring board aggregate shown in FIGS. 5 and 6.

Explanation of symbols

1 Wiring board (each hybrid integrated circuit)
2 Wiring board assembly (wiring board with an aggregate structure in which multiple hybrid integrated circuits are formed)
3 Electrolytic Plating Terminal 4 Plating Lead Wire 41 Pattern Joint 42 Terminal Joint 5 Plating Voltage Application Pattern 6 First Scribe Line 7 Second Scribe Line 8 Pattern Formation Process 9 Electroplating Process 10 First Scribe Line Cutting step 11 Electronic component mounting step 12 Electrical characteristic measurement step 13 Second scribe line cutting step 14 Wiring board base material 15 Metal coating 16 Wiring through-hole 17 Mounting area 18 Electronic component 41 Pattern bonding portion 42 Terminal bonding portion

Claims (5)

A wiring board assembly having a plurality of wiring boards each having a terminal to which electrolytic plating is applied and having a hybrid integrated circuit formed thereon is crossed with the first scribe line and the first scribe line. A method for manufacturing a hybrid integrated circuit board, comprising the following steps as a pre-process for sequentially cutting along a scribe line.
(1) In the wiring board assembly, a plating voltage application pattern provided at least in the vicinity of the outer peripheral edge of the wiring board assembly has a lead-out line for plating connected to the terminal across the first scribe line. A step of connecting and forming a predetermined portion of the lead wire for plating overlapping the second scribe line.
(2) A step of subjecting the terminal to electrolytic plating by applying a voltage between the plating voltage application pattern and the counter electrode in the electrolytic plating solution.   In the first scribe line cutting step, the lead wire for plating drawn out from the wiring board is cut from the electroplated terminal along with the cutting of the first scribe line, thereby forming a hybrid integrated circuit. 2. The method of manufacturing a hybrid integrated circuit board according to claim 1, wherein the wiring boards are electrically independent from each other.   3. The first scribe line cutting step, wherein the wiring board has a collective structure in which at least one side thereof is connected to an adjacent wiring board or a peripheral part of the wiring board assembly. A method for producing a hybrid integrated circuit board according to claim 1.   4. The method of manufacturing a hybrid integrated circuit board according to claim 1, wherein in the second scribe line cutting step, the means for dividing the wiring board on which the hybrid integrated circuit is formed is a dicer.   In the second scribe line cutting step, when dividing into the wiring substrate on which the hybrid integrated circuit is formed, the lead wire for plating on the second scribe line is removed by a dicer. 5. A method for producing a hybrid integrated circuit board according to any one of 4 above.

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