JP2008012893A - Tool for splitting wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool capable of easily splitting a wafer. <P>SOLUTION: The splitting tool 2 is constituted by a first pincer 3, a second pincer 4, and the like. The respective starting ends 3a, 4a of the first and second pincers 3, 4 are joined together with a spacer 6 intervening therebetween and the tip ends thereof are capable of opening and closing. A projection 11 is formed on the tip end 4b of the second pincer 4 so as to projecting toward the tip end 3b of the first pincer 3 and extending toward the starting end 4a side. A guide slit 7 for transferring a cutting blade, which forms a notch on the surface of a silicon wafer, along the projection 11, and a cushion 9 for applying a bending moment with a part touching the projection 11 as the fulcrum by pushing the silicon wafer downward at both the sides of the notched line formed on the silicon wafer are formed on the tip end of the first pincer 3. When the silicon wafer is pushed by the cushion 9, the depth of the notched line proceeds to split the silicon wafer. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a tool used for cleaving a wafer.

  As a wafer, for example, in the case of a silicon wafer, a cross section may be observed by dividing the silicon wafer for the purpose of confirming the presence or absence of defects and the confirmation of the result. When observing a cross section of a silicon wafer, the silicon wafer was cut and the exposed cross section was observed with an optical microscope or an electron microscope. When cleaving a silicon wafer, for example, a cutting blade is moved linearly on the surface of the silicon wafer to form a cut line on the wafer, and the silicon wafer is gripped on both sides with the formed cut line as a boundary. I was breaking through the incision.

On the other hand, as described above, when the silicon wafer is cleaved by gripping both sides of the cut line by hand, the silicon wafer may be unevenly cracked. On the other hand, in order to reduce the bias when the silicon wafer is cleaved, place the recon wafer on the spacer so that the spacer is located behind the cut line, and place both sides of the silicon wafer on the pedestal using the point supported by the spacer as a fulcrum. A method of crushing a silicon wafer by pressing it onto the surface (see Patent Document 1) has already been devised.
JP-A-6-321567

  However, when the silicon wafer is cleaved as described above, the step of forming the cut line on the silicon wafer, the step of positioning the cut line on the protrusion, and the step of pressing both sides of the cut line downward are performed separately. It was necessary to cut the silicon wafer. Also, it is difficult to apply equal force to both sides of the cut line, and the silicon wafer may not be cut along the cut line.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a tool capable of more easily cleaving a wafer.

  In order to achieve the above object, the wafer cleaving tool of the present invention includes a pair of sandwiching bodies for sandwiching a wafer, protrudes toward one sandwiching body toward the other sandwiching body, and forms a line shape on the lower surface of the wafer. And a slit for forming a scoring on the upper surface of the wafer and directly above the protrusion, on the other sandwiching body, by guiding the movement of a cutting blade that cuts the surface of the wafer. A pressing portion is provided that protrudes toward the sandwiching body and pushes the upper surface on both sides to the lower surface side with the cut line as a boundary and applies a bending moment to the wafer with the contact portion of the protruding portion as a fulcrum.

  In addition, the pressing portion is characterized by pressing a position that is axially symmetric with the cut line as an axis of symmetry.

  In addition, one holding body is provided with three guide pins that protrude toward the other holding body and are arranged substantially linearly in a direction that is substantially perpendicular to the direction in which the cut line extends, and an orientation flat is formed on the outer periphery. When sandwiching the wafer, the three orientation flats are brought into contact with the guide pins. When the wafer having a notch formed on the outer periphery is sandwiched, the notch is engaged with the guide pin located at the center, and the remaining 2 One edge of the wafer is brought into contact with one guide pin.

  Further, the pressing portion is formed of a cushion member.

  Further, the cutting blade is assembled so as to be movable in the slit.

  Further, the present invention is characterized in that a cushion member is provided on one sandwiching body so as to face the pressing portion.

  Further, the projecting part and the pressing part are arranged at one end of each sandwiching body, and each sandwiching body is pivotally adjusted with the other end side as a fulcrum so that one end faces, and the other end side is gripped by the user. Sometimes one end closes.

  According to the wafer cleaving tool of the present invention, it is provided with a pair of holding members for holding the wafer, and one holding member is provided with a protruding portion that protrudes toward the other holding member and contacts the lower surface of the wafer in a line shape. , A slit for forming a cut line on the upper surface of the wafer and directly above the protruding portion by guiding the movement of the cutting blade for scraping the surface of the wafer to the other holding member, and protruding toward the one holding member, In addition, a cutting blade is moved by the user in the slit by pressing the upper surface on both sides of the cut line to the lower surface side and providing a pressing portion that applies a bending moment to the wafer with the contact portion of the protruding portion as a fulcrum. A cutting moment is formed on the upper surface of the wafer, and a bending moment is applied to the wafer at the portion where the protruding portion abuts on both sides of the cutting line by the pressing part, thereby deepening the cutting line and the wafer. It is fractured. As a result, the process of forming the cut line and the process of cleaving the wafer by applying a bending moment to the wafer on both sides of the cut line can be executed smoothly, and the wafer can be cut more easily.

  Moreover, the pressing part can reduce the difference in the magnitude of the bending moment applied on both sides of the cut line by pressing the position that is axially symmetric with the cut line as the axis of symmetry.

  In addition, one holding body is provided with three guide pins that protrude toward the other holding body and are arranged substantially linearly in a direction that is substantially perpendicular to the direction in which the cut line extends, and an orientation flat is formed on the outer periphery. When sandwiching the wafer, the three orientation flats are brought into contact with the guide pins. When the wafer having a notch formed on the outer periphery is sandwiched, the notch is engaged with the guide pin located at the center, and the remaining 2 By bringing the edge of the wafer into contact with one guide pin, both the wafer having the orientation flat formed on the outer periphery and the wafer having the notch formed on the outer periphery can be firmly held so as not to move.

  Moreover, it can reduce that a silicon wafer will be damaged at the time of cleaving by forming the press part with the cushion member.

  In addition, since the cutting blade is movably assembled in the slit, after the wafer is held, the user can move the cutting blade to make a cut line, and easily form the cut line on the wafer. be able to.

  Further, by providing a cushion member on one of the sandwiching bodies so as to face the pressing portion, it is possible to prevent the wafer from being damaged at the time of cleaving.

  Further, the projecting part and the pressing part are arranged at one end of each sandwiching body, and each sandwiching body is pivotally adjusted with the other end side as a fulcrum so that one end faces, and the other end side is gripped by the user. When one end is sometimes closed, the user can apply a bending moment to the wafer by closing one end of each holding body by grasping the other end side of each holding body, thereby providing a highly convenient tool. .

  Next, an embodiment of the present invention will be described. As shown in FIG. 1 and FIG. 2, the cleaving tool 2 which is a wafer cleaving tool of the present invention includes a first clamping body (the other clamping body) 3, a second clamping body (one clamping body) 4, and a spacer 6. It consists of and. The base ends of the first and second sandwiching bodies 3 and 4 are aligned via a spacer 6. The spacer 6 is formed in a substantially triangular prism shape, and the base ends of the first and second sandwiching bodies 3 and 4 are fixed to the side surface of the spacer 6 formed in a substantially triangular prism shape. As a result, the distal ends of the first and second sandwiching bodies 3 and 4 are opened by a certain angle, and when the proximal ends of the first and second sandwiching bodies 3 and 4 are gripped by the user, the first and second sandwiching bodies 3 and 4 are opened. The tips 3a and 4a of the sandwiching bodies 3 and 4 are closed.

  The distal end 3b of the first sandwiching body 3 extends in a direction substantially perpendicular to the line connecting the proximal end 3a and the distal end 3b. A guide slit (slit) 7 that guides the movement of a cutting blade, which will be described later, that forms a cut line on the silicon wafer is formed at the tip 3b of the first clamping body 3, and the tip of the guide slit 7 opens to the outside. An opening 7 a into which a positioning guide pin described later is inserted is formed on the base end side of the slit 7. On both sides of the guide slit 7, a substantially rectangular parallelepiped cushion (pressing portion) 9 protruding toward the second sandwiching body 4 is provided, and each cushion 9 is made of rubber, for example. Each cushion 9 is disposed at a position equally spaced from the guide slit 7, whereby it is possible to push the target position with the cut line formed on the silicon wafer as the axis of symmetry. The material of the cushion 9 is not limited to this, and may be composed of other materials.

  As shown in FIG. 2, the distal end portion 4b of the second sandwiching body 4 extends in a direction substantially perpendicular to a line connecting the proximal end 4a and the distal end 4b. The tip 4b of the second sandwiching body 4 is provided with a projection (projecting part) 11 projecting toward the first sandwiching body 3, and the projection 11 is formed in a substantially triangular prism shape and extends to the base end 4b side. . On both sides of the protrusion 11, a cushion (cushion member) 13 made of, for example, rubber and formed in a substantially rectangular parallelepiped shape is disposed so as to face the cushion 9. The height of the cushion 13 is the height of the protrusion 11. It is matched. First, second, and third positioning guide pins 15 a, 15 b, and 15 c are provided on the base end 4 b side of the cushion 13, and the first to third positioning guide pins 15 a to 15 c are attached to the distal end 3 b of the first holding body 3. Protrusively. As will be described later, the first to third positioning guide pins 15a to 15c move both the silicon wafer having the orientation flat formed on the outer periphery and the silicon wafer having the V-shaped notch formed on the outer periphery. Can be fixed so that there is no.

  As shown in FIG. 3A, when the silicon wafer 17 on which the orientation flat 17a is formed is sandwiched by the cleaving tool 2, the lower surface of the silicon wafer 17 is supported by the protrusions 11, and the first to third positioning guide pins 15 a to 15 c are in contact with the orientation flat 17 a of the silicon wafer 17. Thereby, it is possible to prevent the silicon wafer 17 from moving in the direction from the distal end 4b to the proximal end 4a.

  As shown in FIG. 3B, in the silicon wafer 18 in which the V notch 18a is formed, among the three guide pins, the second positioning guide pin 15b positioned in the middle engages with the V notch 18a, and the first The third positioning guide pins 15 a and 15 c come into contact with the edge of the silicon wafer 18. Thereby, the silicon wafer 18 can be prevented from moving in the direction from the front end 4b to the base end 4a and in the arrangement direction of the first to third guide pins 15a to 15c, and the silicon wafer 18 is firmly held. Can do.

  Next, the process of cleaving a silicon wafer using the cleaving tool of the present invention will be described. The silicon wafer will be described by using the one on which the orientation flat 17a is formed. As shown in FIG. 4A, first, the proximal end side of the cleaving tool 2 is held by, for example, the user's right hand, and the orientation flat 17a contacts the first to third guide pins 15a to 15c at the tip of the cleaving tool 2. In this state, the cushion 9 comes into contact with the upper surface of the silicon wafer 17 and the cushion 13 comes into contact with the lower surface of the silicon wafer 17 so that the silicon wafer 17 is held.

  As shown in FIG. 4B, when the cutting blade 25 is inserted into the guide slit 7 by the user and the cutting blade 25 moves in the guide slit 7 by the user's moving operation, the cutting blade 25 moves over the upper surface of the silicon wafer 17. A line-shaped cut line 20 is formed by cutting. The guide slit 7 is formed so as to overlap the protrusion 11, and therefore the cut line 20 is formed immediately above the protrusion 11. In addition, the guide slit extends along the protrusion 11, and therefore, the cut line 20 is also formed in a line shape immediately above the protrusion 11.

  After the cut line 20 is formed on the upper surface of the silicon wafer 17, when the base ends of the first and second sandwiching bodies 3 and 4 are further gripped by the user, the cushion 9 further strongly lowers both sides of the cut line 20. Push to the side. At this time, since each cushion 9 pushes a position that is axially symmetric with the cut line 20 as the axis of symmetry, the silicon wafer 17 is pushed with equal force on both sides of the cut line 20. When the upper surface of the silicon wafer 17 is pushed by the cushion 9, the cushion 13 is compressed and the protrusion 11 comes into contact with the lower surface of the silicon wafer 17. When the protrusion 11 comes into contact with the lower surface of the silicon wafer 17, a bending moment is applied to the silicon wafer 17 around the fulcrum P, and the cut line 20 becomes deeper and the silicon wafer 17 is cleaved. At this time, since an equal force is applied to both sides of the silicon wafer 17 across the cut line 20, the silicon wafer 17 is prevented from being displaced from the cut line 20 and being cleaved. Moreover, since the part divided into two is respectively clamped by the cushion 9 and the cushion 13, the surface is not damaged.

  In the above-described embodiment, the guide slit 7 is formed in the first sandwiching body 3, and the cutting line is formed by the user inserting and moving the cutting blade into the guide slit 7. You may hold | maintain to 1 clamping body. As shown in FIG. 5, the cleaving tool 30 includes first and second clamping bodies 32 and 33, and a slide lever 35 is held at the distal end of the first clamping body 32 so as to be movable toward the base end side. . The slide lever 35 is operated by a user, and a cutting blade 35a is attached. A groove 37a is formed in the guide slit 37, a boss 35b that engages with the groove 37a is formed on the slide lever 35, and the boss 35b is engaged with the groove 37a. 32. Thereby, for example, the user grips the proximal end portion of the cleaving tool 30 with one hand and sandwiches the silicon wafer, and then slides the slide lever 35 with the other hand to form a cut line on the silicon wafer. Thus, the work up to the formation of the cut line on the wafer can be executed efficiently.

  Moreover, in said embodiment, although the tweezers type which a front-end | tip opens and closes centering | focusing on the base end of the 1st, 2nd clamping body was illustrated, the form of a cleaving tool is not restricted to this. For example, it may be a plier-type cleaving tool in which the respective sandwiching bodies are pivotally attached to each other between the distal end and the proximal end. The first and second sandwiching bodies are pivotally attached to each other in the vicinity of the middle between the distal end and the proximal end, and the distal end is closed by grasping the grip portion provided on the proximal end side. Compared with this, it is possible to make the holding force easier. Thereby, the magnitude of the bending moment can be easily increased, and the silicon wafer can be easily cut.

  Moreover, in said embodiment, although a pair of cushion 9 was provided as a press part, the shape of a press part is not restricted to this. For example, the pressing portion may be formed into a semi-cylindrical shape with a semicircular cross section, and may be integrally formed with the first sandwiching body so that the side surface is in contact with the upper surface of the silicon wafer. By pushing both sides of the cut line by these semi-cylindrical protrusions, it can be expected to reduce damage to the silicon wafer. Moreover, cost reduction can be expected by forming the pressing portion integrally with the first holding body.

  Moreover, in said embodiment, although the protrusion 11 was a triangular prism shape protruded sharply toward the 1st clamping body 3 as a protrusion part, the shape of a protrusion is not restricted to this. For example, the protrusion may be formed in a semi-cylindrical shape with a semicircular cross section, and may be provided on the second holding body so that the curved surface of the side faces the first holding body. By doing so, it can be expected that the silicon wafer will not be damaged when it is brought into contact with the lower surface of the silicon wafer and a bending moment is applied to the silicon wafer. In addition, it can be expected to assist the progress of the incision.

  Further, in the above embodiment, the cleaving tool 2 is exemplified as a type that is gripped with one hand, but the type of the wafer cleaving tool of the present invention is not limited to this, and is a type that is placed on a table and used. May be. For example, the cleaving tool can be placed on a table with the second clamping body down, and the user can clamp the silicon wafer on the cleaving tool by pressing the first clamping body from above. After the cut lines are formed, the silicon wafer can be cleaved by pushing the first holding body more strongly from above so that a bending moment is applied to the silicon wafer more strongly.

  In the above embodiment, a silicon wafer substantially made of silicon is exemplified as the wafer, but the wafer is not limited to this. As the wafer, for example, the cleaving tool of the present invention may be used for a quartz wafer made of silicic acid, a glass wafer made of glass, or a ceramic wafer made of ceramic.

It is an external appearance perspective view of a cleaving tool. It is a disassembled perspective view of the cleaving tool disassembled for each member constituting the cleaving tool. A plan view showing a state where the orientation flat is brought into contact with the three positioning guide pins and the silicon wafer is held, and a notch is engaged with the middle positioning guide pin, and the edge of the silicon wafer is applied to the guide pins on both sides. It is the top view which showed a mode that the silicon wafer was hold | maintained and contacted. FIG. 5 is a cross-sectional view illustrating a process of sandwiching a silicon wafer, forming a cut line on the upper surface of the sandwiched silicon wafer, and further strongly holding the silicon wafer on which the cut line is formed to cleave the silicon wafer. It is an external appearance perspective view of the cleaving tool assembled so that a cutting blade can move within a guide slit along a protrusion on a silicon wafer surface.

Explanation of symbols

2 Cleaving tool (wafer cleaving tool)
3 1st clamping body (the other clamping body)
3a Base end 3b Tip 4 Second clamping body (one clamping body)
4a Base end 4b Tip 6 Spacer 7 Guide slit (slit)
9 Cushion (Pressing part)
11 Protrusion (protrusion)
13 Cushion (cushion member)
15a to 15b Positioning guide pins 17, 18 Silicon wafer (wafer)
20 cutting line 25 cutting blade

Claims (7)

A pair of clamping bodies for clamping the wafer;
Protruding toward one clamping body, projecting toward the other clamping body, and contacting the lower surface of the wafer in a line,
A slit for guiding the movement of a cutting blade that cuts the surface of the wafer to the other holding member to form a cut line on the upper surface of the wafer and immediately above the protruding portion, and toward the one holding member A wafer cleaving tool characterized by comprising a pressing portion that protrudes and pushes the upper surface of both sides to the lower surface side with the cut line as a boundary and applies a bending moment to the wafer with the contact portion of the protruding portion as a fulcrum .   The wafer cutting tool according to claim 1, wherein the pressing portion presses a position that is axially symmetric with respect to the cut line as an axis of symmetry. The one holding body is provided with three guide pins that protrude toward the other holding body and are arranged substantially linearly in a direction substantially perpendicular to the direction in which the cut line extends,
When sandwiching the wafer having an orientation flat formed on the outer periphery, the three orientation flats are brought into contact with the guide pins,
2. When sandwiching a wafer having a notch formed on its outer periphery, the notch is engaged with a guide pin located in the middle, and the edge of the wafer is brought into contact with the remaining two guide pins. The tool for wafer cleaving according to 1 or 2.   The wafer cleaving tool according to any one of claims 1 to 3, wherein the pressing portion is formed of a cushion member.   The wafer cutting tool according to any one of claims 1 to 4, wherein the cutting blade is assembled so as to be movable in the slit.   6. The wafer cleaving tool according to claim 1, wherein a cushion member is provided on the one clamping body so as to face the pressing portion.   The projecting portion and the pressing portion are arranged at one end of each sandwiching body, and each sandwiching body is pivotally adjusted with the other end side as a fulcrum so that the one end faces, and the other end side is gripped by the user. 7. The wafer cleaving tool according to claim 1, wherein the one end is closed when it is pressed.

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