JP2008010361A - Backlight device - Google Patents

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JP2008010361A
JP2008010361A JP2006181658A JP2006181658A JP2008010361A JP 2008010361 A JP2008010361 A JP 2008010361A JP 2006181658 A JP2006181658 A JP 2006181658A JP 2006181658 A JP2006181658 A JP 2006181658A JP 2008010361 A JP2008010361 A JP 2008010361A
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flow path
backlight device
cooling fans
heat
cooling fan
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Fumio Kokubo
文雄 小久保
Keiji Sakai
啓至 酒井
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Sharp Corp
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To enable a backlight device to efficiently radiate heat generated from LEDs at low cost, even in case a width of a flow channel is widened for increase of a radiation volume. <P>SOLUTION: The backlight device 10 is provided with a plurality of light-emitting diodes 21, a wiring board 2 equipped with a first and a second sides opposed in parallel as a heat-radiating material for radiating heat generated by lighting operation of the light-emitting diodes, a sub frame 3 as a flow channel forming member forming a flow channel 11 continued from the first side to the second side by surrounding a space adjacent to the wiring board 2, and one or more cooling fans 4 for sending air to the flow channel 11 from the first side to the second side. A width of the flow channel 11 three times or more of a product of diameters and the number of the cooling fans 4. The one or more cooling fans 4 are arranged along either the first side or the second side in the flow channels 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、バックライト装置に関するものである。特に、多数個の発光ダイオードから出射した表示光を、たとえば透過型の液晶表示装置（ＬＣＤ：Liquid Crystal Display）で用いられる透過型液晶表示パネルに向けて照射するバックライト装置に関する。より特定的には多数の発光ダイオードから発生した熱を効率的に放熱できるバックライト装置に関する。   The present invention relates to a backlight device. In particular, the present invention relates to a backlight device that irradiates display light emitted from a plurality of light emitting diodes toward a transmissive liquid crystal display panel used in, for example, a transmissive liquid crystal display (LCD). More specifically, the present invention relates to a backlight device that can efficiently dissipate heat generated from a large number of light emitting diodes.

液晶表示装置は、陰極線管（ＣＲＴ：Cathode-Ray Tube）と比較して表示画面の大型化、装置自体の軽量化、薄型化、消費電力の削減などを図ることができることから、たとえば自発光型のＰＤＰ（Plasma Display Panel）などとともにテレビジョン受像機や各種のディスプレイに用いられている。   Since a liquid crystal display device can increase the size of the display screen, reduce the weight of the device itself, reduce its thickness, reduce power consumption, etc., compared to a cathode ray tube (CRT), for example, a self-luminous type. It is used for television receivers and various displays together with PDP (Plasma Display Panel).

液晶表示パネルは、各種サイズの２枚の透明基板の間に液晶を封入し、電圧を印加することにより、液晶分子の向きを変えて光透過率を変化させて所定の画像などを光学的に表示するための基本的な装置である。液晶表示パネルに必要な付帯装置を取り付けて実際に画像表示ができるようにしたものを「液晶表示装置」と呼ぶものとする。液晶自体は発光体ではないために、たとえば液晶表示パネルの背面側に光源として機能するバックライト装置を設けたものが液晶表示装置に該当する。バックライト装置は、たとえば光源、反射板、拡散板、レンズシートなどを備えており、液晶表示パネルの表示領域の全域にわたって表示光を照射することができる。   A liquid crystal display panel encapsulates liquid crystal between two transparent substrates of various sizes and applies a voltage to change the direction of liquid crystal molecules and change the light transmittance to optically display a predetermined image or the like. It is a basic device for displaying. A liquid crystal display panel attached with a necessary auxiliary device so that an image can be actually displayed is referred to as a “liquid crystal display device”. Since the liquid crystal itself is not a light emitter, for example, a liquid crystal display device includes a backlight device that functions as a light source on the back side of the liquid crystal display panel. The backlight device includes, for example, a light source, a reflection plate, a diffusion plate, a lens sheet, and the like, and can emit display light over the entire display area of the liquid crystal display panel.

バックライト装置には、従来は光源として水銀やキセノンを蛍光管内に封入した冷陰極蛍光ランプ（ＣＣＦＬ：Cold Cathode Fluorescent Lamp）を用いたものが多かった。しかし、近年、表示画像の色再現性を向上させるために、拡散板の背面側に赤緑青の多数個の発光ダイオード（ＬＥＤ：Light Emitting Diode）を２次元配列して白色光を得るＬＥＤバックライトが注目されている。   Conventionally, many backlight devices use a cold cathode fluorescent lamp (CCFL) in which mercury or xenon is enclosed in a fluorescent tube as a light source. However, in recent years, in order to improve the color reproducibility of a display image, an LED backlight that obtains white light by two-dimensionally arranging a large number of red, green, and blue light emitting diodes (LEDs) on the back side of the diffusion plate Is attracting attention.

しかし、現在のＬＥＤは、電力−発光輝度効率が、これまで使用されてきたＣＣＦＬより低い。また、温度上昇により、この電力−発光輝度効率がさらに低下する傾向が顕著である。さらに、赤色ＬＥＤでは温度上昇による波長変動が顕著である。そのため、温度上昇により液晶表示装置の画面上での色が変化していくという問題がある。   However, current LEDs have lower power-emission luminance efficiency than CCFLs that have been used so far. In addition, the tendency of the power-light emission luminance efficiency to further decrease due to temperature rise is remarkable. Furthermore, wavelength variation due to temperature rise is significant in red LEDs. Therefore, there is a problem that the color on the screen of the liquid crystal display device changes due to the temperature rise.

これらの課題を解決するため、特開２００６−５９６０７号公報（特許文献１）に開示されたバックライト装置においては、ＬＥＤを支持するバックパネルの背面側に「ヒートシンク」と称する上下方向に長い構造物を設置している。この様子を図６に示す。ヒートシンク７はベースに多数のフィンが平行に立てられたものであり、これらのフィンは画面の上下方向に延在している。図６ではバックパネル８の上下方向の長さをｈとし、バックパネル８の上下方向の中央位置よりΔｈだけ上寄りに冷却ファン４が位置するようにヒートシンク７が設置されている。このバックライト装置においては、ヒートシンク７は縦長であり、ヒートシンク７の幅が冷却ファン４の直径と略等しいため、図７に矢印で示すように、ヒートシンク７の上下から吸い込まれた空気が真っ直ぐに冷却ファン４に吸い込まれ、その結果、淀みの発生が少なく効率の良い放熱が可能である。
特開２００６−５９６０７号公報 In order to solve these problems, in the backlight device disclosed in Japanese Patent Application Laid-Open No. 2006-59607 (Patent Document 1), a vertically long structure called “heat sink” is provided on the back side of the back panel that supports the LEDs. Things are installed. This is shown in FIG. The heat sink 7 has a large number of fins standing in parallel on a base, and these fins extend in the vertical direction of the screen. In FIG. 6, the length of the back panel 8 in the vertical direction is h, and the heat sink 7 is installed so that the cooling fan 4 is positioned at a position higher by Δh than the center position of the back panel 8 in the vertical direction. In this backlight device, the heat sink 7 is vertically long, and the width of the heat sink 7 is substantially equal to the diameter of the cooling fan 4, so that the air sucked from above and below the heat sink 7 is straight as shown by arrows in FIG. The air is sucked into the cooling fan 4, and as a result, it is possible to efficiently radiate heat with less stagnation.
JP 2006-59607 A

特許文献１に開示されたバックライト装置ではヒートシンク７は表示素子の背面の左右両端をそれぞれ帯状に覆うのみである。このバックライト装置において放熱量をさらに増大させるためには、ヒートシンク７が表示素子背面のなるべく多くの領域を被覆することが好ましいので、ヒートシンク７の幅を広げることが好ましい。   In the backlight device disclosed in Patent Document 1, the heat sink 7 only covers the left and right ends of the back surface of the display element in a band shape. In order to further increase the amount of heat dissipation in this backlight device, it is preferable that the heat sink 7 covers as much area as possible on the back surface of the display element, so that the width of the heat sink 7 is preferably increased.

そこで、ヒートシンク７のフィンの延在する方向は変えずに、ヒートシンク７の幅を大きくすると、図８に示すようなヒートシンク７１が考えられる。ヒートシンク７１においては、図８に示すようにヒートシンク７上下から吸い込まれた空気は途中から冷却ファン４の方に向きを変えて冷却ファン４に吸い込まれていく。したがって、冷却ファン４の左右には、図８にハッチングで示すように、ほとんど流れが発生しない領域（以下「淀み」という。）が発生する。このため、効率良く放熱を行なうことが困難となる。この淀みを解消するためにはヒートシンク７１の幅、すなわち流路の幅を広げるに伴い、その流路の幅に見合った大きな直径の冷却ファンを設置するか、あるいは流路の幅をカバーする程度に多数の冷却ファンを並べて設置することが考えられる。しかし、このような大きな直径の冷却ファンを設置したり、多数の冷却ファンを設置したりすることは、コストアップや騒音レベルの増大につながる。   Therefore, if the width of the heat sink 7 is increased without changing the direction in which the fins of the heat sink 7 extend, a heat sink 71 as shown in FIG. 8 can be considered. In the heat sink 71, as shown in FIG. 8, the air sucked from the top and bottom of the heat sink 7 changes the direction from the middle toward the cooling fan 4 and is sucked into the cooling fan 4. Therefore, regions where the flow hardly occurs (hereinafter referred to as “stagnation”) are generated on the left and right sides of the cooling fan 4 as shown by hatching in FIG. For this reason, it becomes difficult to perform heat dissipation efficiently. In order to eliminate this stagnation, as the width of the heat sink 71, that is, the width of the flow path is increased, a cooling fan having a large diameter corresponding to the width of the flow path is installed or the width of the flow path is covered. It is conceivable to install a large number of cooling fans side by side. However, installing such a large-diameter cooling fan or installing a large number of cooling fans leads to an increase in cost and an increase in noise level.

本発明は、上述の問題を解決するためになされたものであり、放熱量増大のために流路の幅を広げた場合でも、ＬＥＤから発する熱を低コストで効率的に放出することができるようなバックライト装置を提供することを目的とする。   The present invention has been made to solve the above-described problem, and even when the width of the flow path is widened to increase the amount of heat radiation, the heat generated from the LED can be efficiently released at low cost. An object of the present invention is to provide such a backlight device.

上記目的を達成するため、本発明に基づくバックライト装置は、複数の発光ダイオードと、互いに平行に対向し合う第１の辺と第２の辺とを有し上記発光ダイオードの点灯動作によって発生した熱を放出するための放熱部材と、上記放熱部材の近傍空間を囲むことによって上記第１の辺から上記第２の辺まで連続するような流路を形成する流路形成部材と、上記流路に上記第１の辺から上記第２の辺に向けて空気を流すための１以上の冷却ファンとを備える。上記流路の幅は上記冷却ファンの直径と上記冷却ファンの個数との積の３倍以上である。上記１以上の冷却ファンは、上記流路のうち上記第１の辺沿いまたは上記第２の辺沿いに配置されている。   To achieve the above object, a backlight device according to the present invention has a plurality of light emitting diodes and a first side and a second side facing each other in parallel, and is generated by a lighting operation of the light emitting diodes. A heat radiating member for releasing heat, a flow path forming member that forms a continuous flow path from the first side to the second side by surrounding a space near the heat radiating member, and the flow path And one or more cooling fans for flowing air from the first side toward the second side. The width of the flow path is at least three times the product of the diameter of the cooling fan and the number of cooling fans. The one or more cooling fans are arranged along the first side or the second side in the flow path.

本発明によれば、温度上昇幅の最大値を小さく抑えることができ、その結果、バックライト装置の点灯後の色変化、色ムラを小さく抑えることができる。   According to the present invention, it is possible to suppress the maximum value of the temperature rise width, and as a result, it is possible to suppress color change and color unevenness after the backlight device is turned on.

（実施の形態１）
（構成）
図１、図２を参照して、本発明に基づく実施の形態１におけるバックライト装置について説明する。図１は、バックライト装置１０を後ろ側の斜め上から見たところである。バックライト装置１０は、横長の長方形の外形を有し、後ろ側の下方に露出するように２つの冷却ファン４を備えている。図２は図１におけるＩＩ−ＩＩ線に関する矢視断面図である。 (Embodiment 1)
(Constitution)
With reference to FIG. 1 and FIG. 2, the backlight apparatus in Embodiment 1 based on this invention is demonstrated. FIG. 1 shows the backlight device 10 as viewed obliquely from the rear side. The backlight device 10 has a horizontally long rectangular outer shape, and includes two cooling fans 4 so as to be exposed to the lower part on the rear side. 2 is a cross-sectional view taken along the line II-II in FIG.

このバックライト装置１０は、複数の発光ダイオード（「ＬＥＤ」とも表記する。）２１と、互いに平行に対向し合う第１の辺と第２の辺とを有し前記発光ダイオードの点灯動作によって発生した熱を放出するための放熱部材と、前記放熱部材の近傍空間を囲むことによって前記第１の辺から前記第２の辺まで連続する流路を形成する流路形成部材と、前記流路に前記第１の辺から前記第２の辺に向けて空気を流すための１以上の冷却ファン４とを備える。前記流路の幅Ｗは前記冷却ファン４の直径と前記冷却ファン４の個数との積の３倍以上であって、前記１以上の冷却ファン４は、前記流路のうち前記第１の辺沿いまたは前記第２の辺沿いに配置されている。   The backlight device 10 includes a plurality of light emitting diodes (also referred to as “LEDs”) 21, a first side and a second side facing each other in parallel, and is generated by a lighting operation of the light emitting diodes. A heat dissipating member for releasing the heat, a flow path forming member that forms a continuous flow path from the first side to the second side by surrounding a space near the heat dissipating member, and the flow path And one or more cooling fans 4 for flowing air from the first side toward the second side. The width W of the flow path is at least three times the product of the diameter of the cooling fan 4 and the number of the cooling fans 4, and the one or more cooling fans 4 have the first side in the flow path. Or along the second side.

このバックライト装置１０は、横長画面を有する表示素子を背後から照明するためのものであり、流路１１は前記横長画面における上下方向に相当する方向に延びていることが好ましい。このバックライト装置１０において、第１の辺は図１における上辺であり、第２の辺は図１における下辺である。   The backlight device 10 is for illuminating a display element having a horizontally long screen from behind, and the flow path 11 preferably extends in a direction corresponding to the vertical direction of the horizontally long screen. In the backlight device 10, the first side is the upper side in FIG. 1, and the second side is the lower side in FIG.


図２に示すように、バックライト装置１０は、フレーム１とサブフレーム３とを備え、フレーム１の内側には、ＬＥＤ２１が多数実装された配線基板２が設置されている。配線基板２は、アルミニウムなどの高熱伝導材料に絶縁層を成膜し、この絶縁層の上に回路配線をパターニングしたものである。配線基板２の前側の表面には複数のＬＥＤ２１が実装されている。配線基板２は、ＬＥＤ２１の点灯動作に伴って発生する熱を空気中に放熱するための放熱部材の役割も兼ねている。配線基板２の前側には拡散板、レンズシートなどの光学部材６が設置されている。また、流路形成部材として配線基板２の後ろ側にサブフレーム３が設けられている。サブフレーム３と配線基板２との間の空間は流路１１となっている。流路１１の上端は開口５となっている。サブフレーム３の最下部には冷却ファン４が設置されている。このバックライト装置１０は、流路１１の上部の開口５から吸い込んだ空気をサブフレーム３の最下部から冷却ファン４を通じて排気する構造となっている。冷却ファン４の個数は上述のように１以上であればよいが、本実施の形態では、２つの冷却ファン４が配置されている。
As shown in FIG. 2, the backlight device 10 includes a frame 1 and a subframe 3, and a wiring board 2 on which a large number of LEDs 21 are mounted is installed inside the frame 1. The wiring board 2 is obtained by forming an insulating layer on a high thermal conductive material such as aluminum and patterning circuit wiring on the insulating layer. A plurality of LEDs 21 are mounted on the front surface of the wiring board 2. The wiring board 2 also serves as a heat radiating member for radiating heat generated with the lighting operation of the LED 21 into the air. An optical member 6 such as a diffusion plate or a lens sheet is installed on the front side of the wiring board 2. Further, a subframe 3 is provided on the back side of the wiring board 2 as a flow path forming member. A space between the subframe 3 and the wiring board 2 is a flow path 11. The upper end of the flow path 11 is an opening 5. A cooling fan 4 is installed at the bottom of the subframe 3. The backlight device 10 has a structure in which the air sucked from the opening 5 at the upper part of the flow path 11 is exhausted from the lowermost part of the subframe 3 through the cooling fan 4. Although the number of cooling fans 4 may be one or more as described above, in this embodiment, two cooling fans 4 are arranged.

（作用・効果）
本実施の形態におけるバックライト装置の作用・効果を説明するにあたって、まず、上述の構造において冷却ファン４が２個の場合の空気の流れを図３に示す。また、比較のために、冷却ファン４を流路の上下方向の中央に設置し、流路の上端および下端を開口とした場合の空気の流れを図４に示す。図３、図４において流路１１の幅をＷとする。 (Action / Effect)
In describing the operation and effect of the backlight device according to the present embodiment, first, FIG. 3 shows the air flow when the number of cooling fans 4 is two in the above-described structure. For comparison, FIG. 4 shows the air flow when the cooling fan 4 is installed at the center in the vertical direction of the flow path and the upper and lower ends of the flow path are opened. 3 and 4, the width of the flow path 11 is W.

図３では、流路１１の上端の開口５から吸い込まれた空気の流れは、まず下方に進んだ後、流路１１下部においては冷却ファン４の方に向かって曲がり、最終的には冷却ファン４に到達する。このとき、冷却ファン４の左右ではハッチングで示す位置に淀みが発生する。   In FIG. 3, the flow of air sucked from the opening 5 at the upper end of the flow path 11 first proceeds downward, then bends toward the cooling fan 4 at the bottom of the flow path 11, and finally the cooling fan. 4 is reached. At this time, stagnation occurs at positions indicated by hatching on the left and right sides of the cooling fan 4.

図４では、流路１１の上端と下端とからそれぞれ吸い込まれた空気の流れが流路１１の上下方向の中央部に接近したときに冷却ファン４の方に向かって曲がり、やはり冷却ファン４左右のハッチングで示す位置に淀みが発生する。   In FIG. 4, when the air flows sucked from the upper end and the lower end of the flow path 11 approach the central portion in the vertical direction of the flow path 11, they bend toward the cooling fan 4. Stagnation occurs at the position indicated by hatching.

次に、冷却ファン４が配置される上下方向での位置と流路１１の幅Ｗとが配線基板２上の温度上昇に与える影響についてコンピュータ上で解析を行ない、確認した。その結果のグラフを図５に示す。図５の横軸は、流路１１の幅をＷ、冷却ファン４の直径をＤ、冷却ファン４の個数をＮとしたときのＷ／ＤＮを表す。図５の縦軸は、冷却ファン４を最下部に配置したときの温度上昇幅の最大値をΔＴ1、冷却ファン４を上下方向の中央に配置したときの温度上昇幅の最大値をΔＴ2としたときのΔＴ1／ΔＴ2を表している。ここでは、「温度上昇幅の最大値」に注目しているが、これは、バックライト装置の点灯後の色変化すなわちＬＥＤの波長変動を最小にするには、温度上昇幅の最大値を小さく抑えるのが有効だからである。温度上昇幅の最大値を小さく抑えれば温度ムラも小さくなり、その結果、色ムラも小さくなる。 Next, the effect of the position in the vertical direction where the cooling fan 4 is arranged and the width W of the flow path 11 on the temperature rise on the wiring board 2 was analyzed and confirmed on a computer. The resulting graph is shown in FIG. The horizontal axis of FIG. 5 represents W / DN when the width of the flow path 11 is W, the diameter of the cooling fan 4 is D, and the number of the cooling fans 4 is N. FIG vertical axis 5, the cooling fan 4 and [Delta] T 1 the maximum temperature rise when disposed at the bottom, the cooling fan 4 in the vertical direction of the maximum temperature rise when disposed in the center [Delta] T 2 ΔT 1 / ΔT 2 when Here, attention is paid to the “maximum value of the temperature rise range”. In order to minimize the color change after the backlight device is turned on, that is, the LED wavelength variation, the maximum value of the temperature rise range is reduced. This is because it is effective to suppress. If the maximum value of the temperature rise is kept small, the temperature unevenness is reduced, and as a result, the color unevenness is also reduced.

一般的に、冷却ファン４を最下部に設置した場合と上下方向の中央に設置した場合とで温度上昇幅の最大値は異なるが、両者がほぼ等しくなるのは、Ｗ／ＤＮが３付近のときであることが、図５からわかる。さらに図５のグラフからは、Ｗ／ＤＮが３より小さい場合には冷却ファン４を上下方向の中央に設置した方が、また、Ｗ／ＤＮが３より大きい場合には冷却ファン４を流路の最下部に設置した方が温度上昇幅の最大値を小さくできることが分かる。   Generally, the maximum value of the temperature rise is different between the case where the cooling fan 4 is installed at the bottom and the case where it is installed at the center in the vertical direction, but the two are almost equal because W / DN is around 3. It can be seen from FIG. Further, from the graph of FIG. 5, when W / DN is smaller than 3, it is better to install the cooling fan 4 at the center in the vertical direction, and when W / DN is larger than 3, the cooling fan 4 is passed through the flow path. It can be seen that the maximum value of the temperature rise width can be reduced by installing at the lowermost part.

バックライト装置の放熱量を増加させるためには放熱領域を広げることが有効である。そのためには、流路１１の幅Ｗを広くすることが有効である。Ｄ，Ｎを変えずに幅Ｗを大きくしていった場合、Ｗ／ＤＮが３以上となるが、その場合は、冷却ファン４を流路１１の最下部に設置した方が有利といえる。冷却ファン４を流路１１の最下部に設置した方が有利になる原因は、図３より図４の方が淀みの占める領域が大きいためと考えられる。たとえばコストを考慮した通常の設計では、液晶表示装置の背面全体を流路とした場合、Ｗ／ＤＮ≧３となるので、冷却ファン４を流路の上下方向の中央に設置するよりも最下部に設置した方が有利となることが分かる。   In order to increase the heat dissipation amount of the backlight device, it is effective to widen the heat dissipation area. For this purpose, it is effective to increase the width W of the flow path 11. When the width W is increased without changing D and N, W / DN is 3 or more. In this case, it can be said that it is advantageous to install the cooling fan 4 at the lowermost portion of the flow path 11. The reason why it is advantageous to install the cooling fan 4 at the lowermost portion of the flow path 11 is considered to be because the area occupied by stagnation is larger in FIG. 4 than in FIG. For example, in a normal design in consideration of cost, if the entire back surface of the liquid crystal display device is used as a flow path, W / DN ≧ 3, so that the cooling fan 4 is located at the lowermost position than the center in the vertical direction of the flow path. It can be seen that it is more advantageous to install in

以上の説明では、放熱部材を兼ねる配線基板の材料として低コスト化に有利なアルミニウムを用いたが、熱伝導率の高い銅や銀などや、放熱性に優れるセラミックなどを用いてもよい。また、上述の説明では、冷却ファン４を流路の最下部に設置するのがよいとしたが、流路の最上部に配置しても最下部に設置したときと同様に淀みを抑制できるので同様に好ましい。また、図３、図４では冷却のための空気を上端の開口から吸い込んで冷却ファン４から吹き出す構造としたが、冷却のための空気を冷却ファン４から吸い込んで上端開口から吹き出す構造にしても同様に淀みを小さくできるので、放熱効果を高めることが可能となる。   In the above description, aluminum, which is advantageous for cost reduction, is used as a material for the wiring board that also serves as a heat radiating member. However, copper, silver, or the like having high thermal conductivity, or ceramic having excellent heat radiating properties may be used. In the above description, the cooling fan 4 is preferably installed at the lowermost part of the flow path. However, even if it is arranged at the uppermost part of the flow path, it is possible to suppress stagnation in the same manner as when it is installed at the lowermost part. Likewise preferred. 3 and 4, the cooling air is sucked from the opening at the upper end and blown from the cooling fan 4. However, the cooling air is sucked from the cooling fan 4 and blown from the upper opening. Similarly, since the stagnation can be reduced, the heat dissipation effect can be enhanced.

本実施の形態におけるバックライト装置では、１以上の冷却ファン４は、流路１１のうち第１の辺沿いまたは第２の辺沿いに配置されているので、限られた個数、大きさの冷却ファンの使用条件下で温度上昇幅の最大値を小さく抑えることができ、バックライト装置の点灯後の色変化、色ムラを小さく抑えることができる。本実施の形態では、冷却ファン４の個数を増やしたり大きさを拡大したりするわけではないので、低コストで、ＬＥＤの熱を効率的に放出することができる。   In the backlight device according to the present embodiment, one or more cooling fans 4 are arranged along the first side or the second side of the flow path 11, so that a limited number and size of cooling fans are provided. The maximum value of the temperature rise width can be kept small under the usage conditions of the fan, and the color change and color unevenness after the backlight device is turned on can be kept small. In the present embodiment, since the number of cooling fans 4 is not increased or the size thereof is not increased, the heat of the LED can be efficiently released at low cost.

冷却ファン４を流路最下部に設置する構成では冷却ファン４から排気し、冷却ファン４を流路最上部に設置する構成では冷却ファン４から吸気する構造が望ましい。すなわち、流路内では空気が上から下に向かって流れることが好ましい。なぜなら、配線基板２と光学部材６で挟まれたバックライト内部空間１２（図２参照）では、配線基板２からの放熱により上部の方が温度が高くなっており、その結果、温度ムラの原因となりやすいのに対して、流路内では空気が上から下に向かって流れるようにした方がバックライト内部空間１２内の熱を効率良く奪うことができ、温度ムラの抑制ができるからである。ＬＥＤは温度により発光波長が変化するため、ＬＥＤ式のバックライト装置では温度ムラは色ムラの原因になる。   In the configuration in which the cooling fan 4 is installed at the lowermost part of the flow path, it is desirable to exhaust air from the cooling fan 4 and in the structure in which the cooling fan 4 is installed at the uppermost part of the flow path, a structure in which the air is sucked from the cooling fan 4 is desirable. That is, it is preferable that air flows from the top to the bottom in the flow path. This is because, in the backlight internal space 12 (see FIG. 2) sandwiched between the wiring board 2 and the optical member 6, the temperature of the upper part is higher due to heat radiation from the wiring board 2, and as a result, temperature unevenness is caused. This is because, when the air flows in the flow path from the top to the bottom, the heat in the backlight internal space 12 can be efficiently removed, and temperature unevenness can be suppressed. . Since the light emission wavelength of the LED changes depending on the temperature, the temperature unevenness causes color unevenness in the LED type backlight device.

なお、今回開示した上記実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更を含むものである。   In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

本発明に基づく実施の形態１におけるバックライト装置の斜視図である。It is a perspective view of the backlight apparatus in Embodiment 1 based on this invention. 図１におけるＩＩ−ＩＩ線に関する矢視断面図である。It is arrow sectional drawing regarding the II-II line | wire in FIG. 本発明に基づく実施の形態１におけるバックライト装置の流路内の空気の流れを示す説明図である。It is explanatory drawing which shows the flow of the air in the flow path of the backlight apparatus in Embodiment 1 based on this invention. 本発明に基づく実施の形態１において、比較のために、異なる構成のバックライト装置の流路内の空気の流れを示す説明図である。In Embodiment 1 based on this invention, it is explanatory drawing which shows the flow of the air in the flow path of the backlight apparatus of a different structure for the comparison. 本発明に基づく実施の形態１において解析を行なった結果のグラフである。It is a graph of the result of having analyzed in Embodiment 1 based on this invention. 従来技術に基づくバックライト装置の斜視図である。It is a perspective view of the backlight apparatus based on a prior art. 従来技術に基づくバックライト装置の流路内の空気の流れを示す説明図である。It is explanatory drawing which shows the flow of the air in the flow path of the backlight apparatus based on a prior art. 従来技術に基づくバックライト装置のヒートシンクの幅を大きくした場合の流路内の空気の流れを示す説明図である。It is explanatory drawing which shows the flow of the air in a flow path at the time of enlarging the width | variety of the heat sink of the backlight apparatus based on a prior art.

符号の説明Explanation of symbols

１ フレーム、２ 配線基板、３ サブフレーム、４ 冷却ファン、５ 開口、６ 光学部材、７，７１ ヒートシンク、８ バックパネル、１０ バックライト装置、１１ 流路、１２ バックライト内部空間、２１ ＬＥＤ。   1 frame, 2 wiring board, 3 subframe, 4 cooling fan, 5 opening, 6 optical member, 7, 71 heat sink, 8 back panel, 10 backlight device, 11 flow path, 12 backlight internal space, 21 LED.

Claims (5)

複数の発光ダイオードと、
互いに平行に対向し合う第１の辺と第２の辺とを有し前記発光ダイオードの点灯動作によって発生した熱を放出するための放熱部材と、
前記放熱部材の近傍空間を囲むことによって前記第１の辺から前記第２の辺まで連続するような流路を形成する流路形成部材と、
前記流路に前記第１の辺から前記第２の辺に向けて空気を流すための１以上の冷却ファンとを備え、
前記流路の幅は前記冷却ファンの直径と前記冷却ファンの個数との積の３倍以上であって、
前記１以上の冷却ファンは、前記流路のうち前記第１の辺沿いまたは前記第２の辺沿いに配置されている、バックライト装置。 A plurality of light emitting diodes;
A heat dissipating member having a first side and a second side facing each other in parallel, and for releasing heat generated by the lighting operation of the light emitting diode;
A flow path forming member that forms a flow path that is continuous from the first side to the second side by surrounding a space near the heat dissipation member;
One or more cooling fans for flowing air from the first side toward the second side in the flow path;
The width of the flow path is at least three times the product of the diameter of the cooling fan and the number of cooling fans,
The one or more cooling fans are backlight devices arranged along the first side or the second side of the flow path. 横長画面を有する表示素子を背後から照明するためのものであり、前記流路は前記横長画面における上下方向に相当する方向に延びている、請求項１に記載のバックライト装置。   The backlight device according to claim 1, wherein the backlight device is for illuminating a display element having a horizontally long screen from behind, and the flow path extends in a direction corresponding to a vertical direction of the horizontally long screen. 前記第１の辺は前記放熱部材の上辺であり、前記第２の辺は前記放熱部材の下辺である、請求項２に記載のバックライト装置。   The backlight device according to claim 2, wherein the first side is an upper side of the heat radiating member, and the second side is a lower side of the heat radiating member. 前記放熱部材は、金属またはセラミックの板に絶縁層を成膜し、この絶縁層の上に配線をパターニングした配線基板であり、前記複数の発光ダイオードは前記配線基板に実装されている、請求項１から３のいずれかに記載のバックライト装置。   The heat dissipation member is a wiring board in which an insulating layer is formed on a metal or ceramic plate, and wiring is patterned on the insulating layer, and the plurality of light emitting diodes are mounted on the wiring board. The backlight device according to any one of 1 to 3. 前記放熱基板は、アルミニウムの板に絶縁材料を成膜し、配線をパターニングした配線基板であり、前記複数の発光ダイオードは前記配線基板に実装されている、請求項１から３のいずれかに記載のバックライト装置。   The heat dissipation substrate is a wiring substrate obtained by forming an insulating material on an aluminum plate and patterning a wiring, and the plurality of light emitting diodes are mounted on the wiring substrate. Backlight device.
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