JP2008010322A - Electronic component assembly structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component assembly structure forming an electronic circuit by properly connecting electronic components to each other without soldering them. <P>SOLUTION: In this electronic component assembly structure, a semicylindrical electronic housing part 21 for housing an electronic component 60, and lead housing grooves 22 and 23 are formed in a component holding member 20, and the electronic component 60 can be stably held by the component holding member 20. A bus bar member 40 is provided with a body part 41, and connection terminals 42 and 43 for connecting leads 62 and 63 to them, respectively, and can be connected to the leads 62 and 63 of the electronic component 60 without soldering them. Since the electronic component 60 is stably held by the component holding member 20, the leads 62 and 63 are never significantly damaged in connecting them. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component assembly structure that houses a plurality of components including an electronic component having leads to form an electronic circuit.

  Conventionally, a soldering method has been used to connect an electronic component to a printed wiring board or the like. A lead for soldering is led out to the electronic component, and this lead is formed of a material obtained by performing copper plating on the surface of the iron wire. In addition, a lead surface having a pre-solder applied thereto is also used. As described in Patent Document 1, for example, the lead is soldered in a state of being inserted into a through hole formed in the printed wiring board.

As a method not using leads, a method called surface mounting is also known in which an electronic component is directly bonded to a printed wiring board, and an electrode of the electronic component is soldered to the printed wiring board using cream solder or the like. Surface mounting is an electronic component mounting method that is particularly suitable for forming ultra-high density circuits.
JP 2004-172072 A

  However, the above conventional technique has the following problems. In an electronic device in which a built-in electronic component is soldered and connected to a printed wiring board or the like, when it is used, even a reusable electronic component is discarded without being collected. Therefore, there is a problem that resources such as rare metals are wasted. On the other hand, when trying to collect a reusable electronic component, there is a problem that a time-consuming process of melting and sucking the solder is required, resulting in an increase in cost.

  Further, in the soldering performed at the time of manufacturing the electronic device, there is a possibility that a soldering failure may occur. Therefore, it takes time to inspect the printed wiring board after the soldering. Further, when a soldering failure is detected by this inspection, the yield is deteriorated unless the electronic components are collected from the printed wiring board. On the other hand, it takes time and effort to collect the electronic components. As described above, there is a problem in that the high cost associated with the soldering failure is unavoidable even when the electronic device is manufactured.

  Therefore, the present invention has been made to solve these problems, and an object thereof is to provide an electronic component assembly structure that forms an electronic circuit by suitably connecting electronic components without soldering. To do.

  A first aspect of an electronic component assembly structure according to the present invention is an electronic component assembly structure that houses an electronic component having a lead to form an electronic circuit, and includes a connection bar that is fitted to the lead. And a component holding member formed with at least an electronic component storage portion for storing the electronic component and a lead storage groove for storing the lead, wherein the component holding member is orthogonal to the lead storage groove. A connection terminal accommodating portion for accommodating a connection terminal is further formed, and the electronic component and the bus bar member are assembled and held integrally with the component holding member.

Another aspect of the electronic component assembly structure of the present invention is characterized in that the connection terminal has a tightening margin equal to or less than the thickness of the surface plating layer of the lead.
Another aspect of the electronic component assembly structure of the present invention is characterized in that the connection terminal is formed by alternately arranging a plurality of spring pieces in opposite directions.

In another aspect of the electronic component assembly structure of the present invention, the component holding member is further formed with an electric wire storage portion for storing an electric wire.
Another aspect of the electronic component assembly structure of the present invention is characterized by further comprising a bus bar member fixing means for fixing the bus bar member to the component holding member.

In another aspect of the electronic component assembly structure of the present invention, the bus bar member fixing means includes a first bus bar member fixing means for temporarily locking the bus bar member, and a second bus bar for permanently locking the bus bar member. It is characterized by comprising member fixing means.
According to another aspect of the electronic component assembly structure of the present invention, the bus bar member fixing means includes a locking piece provided in the bus bar member and formed with a locking hole, and a locking formed on the component holding member. It consists of a nail.

According to another aspect of the electronic component assembly structure of the present invention, the locking piece includes a temporary locking hole as the first bus bar member fixing means and a main locking hole as the second bus bar member fixing means. And a hole.
In another aspect of the electronic component assembly structure of the present invention, the locking piece is a buckle-like or tongue-like tab.

  As described above, according to the present invention, it is possible to provide an electronic component assembly structure that forms an electronic circuit by suitably connecting electronic components without soldering. The electronic component assembly structure of the present invention is suitable for manufacturing an electronic circuit body by assembling relatively large and expensive electronic components, and can connect the electronic components without using soldering. It is possible to reduce the manufacturing cost by omitting the attaching step.

  Further, according to the electronic component assembly structure of the present invention, since it is possible to assemble the electronic component so as not to damage it as much as possible, the manufacturing yield is improved and the electronic component is reused to reduce the cost. It becomes possible.

  A configuration of an electronic component assembly structure in a preferred embodiment of the present invention will be described in detail with reference to the drawings. In addition, about each structural part which has the same function, the same code | symbol is attached | subjected and shown for simplification of illustration and description.

  The present invention provides an electronic component assembly structure suitable for an electronic component such as a large-capacitance capacitor, a hybrid IC, or a power transistor that is difficult to downsize, and these electronic components are relatively expensive. By not performing soldering, these electronic components can be collected.

  An electronic component assembly structure according to an embodiment of the present invention is shown in FIG. The electronic component assembly structure 10 includes a component holding member 20 that stores electronic components, and a bus bar member 40 for connecting the electronic components, and is formed in a structure that matches each built-in electronic component. . FIG. 1 shows a state before the electronic component 60 is stored in the component holding member 20.

  An electronic component 60 shown in FIG. 1 has a cylindrical main body 61 and two leads 62 and 63. Hereinafter, the electronic component 60 is taken as an example and is housed in the electronic component assembly structure 10 of the present embodiment. The case where it does is demonstrated. Electronic parts having soldering leads are generally widely used. Since the electronic component assembly structure 10 of the present embodiment is relatively inexpensive and stable in supply, the electronic component assembly structure 10 of the present embodiment has a structure suitable for incorporating an electronic component having leads.

  The two leads 62 and 63 provided in the electronic component 60 are different in length, and the lead 62 is short and the lead 63 is long. This is to prevent the polarity from being mistaken. . Generally used electronic parts have leads for soldering, but they are relatively easily deformed, and there is a possibility that poor contact occurs due to stress relaxation. The lead generally has a structure in which the iron inside is covered with copper plating, and if contact failure occurs, there is a risk of inducing heat generation.

  Therefore, the electronic component assembly structure 10 of the present embodiment includes the component holding member 20 that stores and holds the electronic component 60 in order to prevent the electronic component 60 from being deformed. The component holding member 20 is formed of an insulator so that the electronic component can be stored without being particularly insulated.

  The component holding member 20 is formed with a semi-cylindrical electronic component storage portion 21 and lead storage grooves 22 and 23 for storing the electronic component 60 in accordance with the shape of the electronic component 60. The lead storage grooves 22 and 23 are formed in accordance with the dimensions of the leads 62 and 63. The lead storage grooves 22 are short and the lead storage grooves 23 are long. Therefore, there is no possibility that the leads 62 and 63 are attached with the wrong polarity.

  By storing the cylindrical main body 61 in the electronic component storage portion 21 and storing the leads 62 and 63 in the lead storage grooves 22 and 23, the electronic component 60 is stably held by the component holding member 20. A state in which the electronic component 60 is housed in the component holding member 20 is shown in FIG. This figure is a perspective view showing a state in which the electronic component 60 is stored in the electronic component assembly structure 10 of the present embodiment, and (a) and (b) are viewed in different directions.

  Further, ribs can be provided at appropriate positions in the electronic component storage unit 21 and the lead storage grooves 22 and 23, and the cylindrical body 61 and the leads 62 and 63 can be inserted while pressing the ribs. By providing such a rib, it is possible to prevent the electronic component 60 from moving due to vibration or the like after mounting. In this case, it is preferable to use a jig suitable for the shape of the electronic component 60 so that the cylindrical main body 61 and the leads 62 and 63 are not deformed by frictional resistance when the electronic component 60 is inserted.

  On the other hand, the bus bar member 40 includes a main body portion 41, connection terminals 42 and 43 for connecting to the leads 62 and 63, and other terminals 44 to 49. The bus bar member 40 is formed by pressing into a circuit shape that can appropriately connect the electronic components housed in the component holding member 20. The terminals 41 to 49 may be formed by being pressed integrally with the main body 41, or may be connected to the bus bar main body 41 by welding, or may be crimped by swaging or the like. Further, depending on the shape of the lead, it is possible to make contact connection using alternate bidirectional connection terminals.

  In the electronic component assembly structure 10 of the present embodiment, as described above, the electronic component 60 can be stably held by the component holding member 20, so that the connection terminals 42 and 43 of the bus bar member 40 and the electronic component 60 are secured. The leads 62 and 63 can be connected without using soldering. That is, the component holding member 20 is further formed with connection terminal storage portions 24 and 25 orthogonal to the lead storage grooves 22 and 23, and the connection terminals 42 and 43 are stored in the connection terminal storage portions 24 and 25. Therefore, it can be connected to the leads 62 and 63.

  The connection terminal storage portions 24 and 25 are preferably provided in the vicinity of the middle of the lead storage grooves 22 and 23. The connection terminal storage portions 24 and 25 are preferably formed so that the surrounding high walls surround them when the connection terminals 42 and 43 are stored. The leads 62 and 63 are stably held without being deformed by being accommodated in the lead accommodating grooves 22 and 23, and the connection terminals 42 and 43 are straight to the connection terminal accommodating portions 24 and 25 along the surrounding high walls. Since they are inserted, the leads 62 and 63 and the connection terminals 42 and 43 can be easily and reliably fitted together.

  As shown in FIGS. 1 and 2, the connection terminals 42 and 43 are preferably formed in a shape in which a plurality of (here, three) spring pieces are alternately arranged in opposite directions. Thus, for example, the leads 62 and 63 can be connected in a state of being sandwiched between the spring pieces, similarly to the case where the weft of the cloth is sandwiched between the warps. When such a connection is made, the corners of the spring pieces bite into the leads 62 and 63 at the time of connection. However, since the contact area between the spring pieces and the leads 62 and 63 widens when biting to some extent, there is no further biting and constant. The contact state is stabilized by the bite of the depth.

  As described above, the depth at which the corners of the spring pieces bite into the leads 62 and 63 can be stabilized at a certain point, so that the connection terminals 42 and 43 are more than the plated layer on the surface of the leads 62 and 63. You can keep it out. The fastening margin of the connection terminals 42 and 43 is preferably equal to or less than the thickness of the surface plating layer of the leads 62 and 63. Thus, the electronic component 60 can be reused by preventing the iron portion inside the plating layer from being exposed.

  When the connection between the lead and the connection terminal is performed using, for example, a simple contact method, a contact failure due to deformation of the lead may occur. Further, when the connection terminal is made to bite into the lead as in the press-contact connection, the copper alloy of the connection terminal comes into contact with the iron inside the lead to form a dissimilar metal joint, and the risk of heat generation increases.

  On the other hand, in the connection terminals 42 and 43 of the present embodiment, the leads 62 and 63 are fitted with a spring force of about 1/6 as compared with the press contact terminal, and there is no possibility that the leads 62 and 63 are significantly damaged. . Further, since the leads 62 and 63 are connected so as to be sandwiched between the spring pieces, the corners of the spring pieces bite into the leads 62 and 63 to form a small metal coupling portion. Since the copper plating on the surfaces of the leads 62 and 63 is basically the same kind of metal as the copper alloy of the connection terminals 42 and 43, they can be bonded to each other and maintained in a stable contact state for a long time.

  Although connection with a simple contact method can be used repeatedly, the contact force is usually 10 N or less, so even if a deformable soldering lead is connected with a simple contact method, the long-term use period There is a risk of deformation and poor contact, and there is a serious problem in reliability. In addition, with a normal pressure contact terminal, the core wire of the electric wire is sandwiched with a pressure contact force of about 100 N, so that it can be used for a long period of time, but the core wire is damaged by the pressure contact, so it is discarded after being used only once. .

  On the other hand, in the connection terminals 42 and 43 of this embodiment, the leads 62 and 63 are sandwiched by a contact force of 15N to 30N (preferably about 20N), and a weak pressure contact state is created at the corners of the spring pieces. Yes. As a result, a highly reliable connection state can be maintained over a long period of time, and since the bite into the leads 62 and 63 is small, the electronic component 60 can be recycled a plurality of times. Also, by adjusting the contact force according to the lead material and surface treatment, it is possible to connect many types of electronic components.

  In the electronic component assembly structure 10 of the embodiment shown in FIGS. 1 and 2, the bus bar member 40 is attached to the component holding member 20 after the electronic component 60 is stored in the component holding member 20. As one embodiment of the electronic component assembly structure of the present invention, the bus bar member can be attached to the component holding member after all the electronic components to be stored are stored in the component holding member.

  As another embodiment of the present invention, it is also possible to first attach the bus bar member to the component holding member and then store the electronic component in the component holding member. In particular, when the bus bar member is attached after the electronic component is accommodated and the electronic component may be deformed, the electronic component assembly structure of such an embodiment is preferably used.

  As still another embodiment of the present invention, an electronic component in which some electronic components are accommodated in a component holding member, a bus bar member is attached to the component holding member, and then another electronic component is accommodated in the component holding member. It is also possible to provide an assembly structure. The electronic component assembly structure 10 shown in FIGS. 1 and 2 is formed in the electronic component assembly structure of such an embodiment. After the electronic component 60 is accommodated and the bus bar member 40 is attached, another electronic component assembly structure 10 is provided. Electronic parts can be stored.

  After the bus bar member 40 is attached to the component holding member 20, the electronic component assembly structure 10 of the present embodiment can hold the bus bar member 40 in the temporary locking position so that another electronic component can be stored. After all the electronic components are stored, the bus bar member 40 is inserted to the final locking position. By inserting the bus bar member 40 to the final locking position, all the electronic components are collectively connected to terminals provided on the bus bar member 40.

  The electronic component assembly structure 10 is provided with bus bar member fixing means for fixing the bus bar member 40 to the component holding member 20. In FIG. 2, a plurality of locking tabs 50 provided on the bus bar member 40 are provided. And the latching claw 26 provided in the component holding member 20 is shown. The locking tab 50 can be shaped like a buckle or a tongue, for example, and has two holes (dimples), a temporary locking hole 51 and a final locking hole 52.

  As a first bus bar member fixing means for temporarily locking the bus bar member 40 to the component holding member 20, a means for locking the locking claw 26 in the temporary locking hole 51 is provided. Means for locking the locking claw 26 in the locking hole 52 is provided. In this embodiment, the first bus bar member fixing means and the second bus bar member fixing means are distinguished from each other by the locking tab 50 provided on the bus bar member 40. You may provide in the holding member 20 side.

  A state in which the bus bar member 40 is temporarily locked to the component holding member 20 is shown in FIGS. FIG. 3 is a perspective view of the electronic component assembly structure 10 when the bus bar member 40 is temporarily locked to the component holding member 20, and FIG. 4 is a cross-sectional view taken along the line AA of FIG. 4 shows that the locking claw 26 is locked in a temporary locking hole 51 provided in the locking tab 50. As shown in FIG.

  In a state where the bus bar member 40 is temporarily locked, the leads 62 and 63 of the electronic component 60 already accommodated in the component holding member 20 and the connection terminals 42 and 43 of the bus bar member 40 are sufficiently connected. is not. However, in the electronic component 60, the leads 62 and 63 are covered with the connection terminals 42 and 43, so there is no possibility that the electronic component 60 falls off the component holding member 20.

  In order to protect the bus bar member 40 in the temporarily locked state, protective plates 27 are provided at four locations around the component holding member 20 surrounding the bus bar member 40. By providing such a protective plate 27, it is possible to prevent the bus bar member 40, the electronic component 60, and the like from being damaged even if the electronic component assembly structure 10 in the middle of the assembly is toppled. . In addition, the electronic component assembly structure 10 in a temporarily locked state can be stacked and transported.

  In the state where the bus bar member 40 shown in FIGS. 3 and 4 is temporarily locked, it is possible to further store another electronic component in the component holding member 20, but not limited to the electronic component, for example, to each stored electronic component It is also possible to connect an electric wire for supplying electric power. Below, the Example which connects an electric wire to the electronic component assembly structure 10 of a temporary latching state is described using FIG.

  The component holding member 20 is provided with an electric wire storage portion 28 for storing electric wires, and a required number of first grooves 29 for storing electric wires are formed. FIG. 5 shows an embodiment of an electric wire holding member for holding the electric wire facing this. An electric wire holding member 70 shown in the figure has a structure that can be fitted to the component holding member 20 from below, and an electric wire presser 71 is provided at a position facing the electric wire storage portion 28.

  In the wire retainer 71 provided in the wire holding member 70, second grooves 72 for housing the wires 80 are formed at positions facing the same number as the first grooves 29 of the wire housing portion 28. In this embodiment, a predetermined number of electric wires 80 are arranged in the second groove 72 of the electric wire retainer 71, and in this state, the component holding member 20 in a temporarily locked state is fitted from above. FIG. 6 shows a state in which the electric wire holding member 70 and the component holding member 20 are fitted.

  In order to fix the wire holding member 70 to the component holding member 20, the wire holding member 70 is provided with a plurality of fixing tabs 73 around the wire presser 71. The fixing tab 73 is inserted into an insertion port (not shown) provided in the component holding member 20, thereby firmly fixing the electric wire holding member 70 and the electric wire 80.

  In order to connect the electric wire 80 to the bus bar member 40, as shown in FIG. 2, press contact terminals 44 to 46 for connecting electric wires are provided integrally with the bus bar member 40. As shown in FIG. 6, when the electric wire 80 is arranged in the second groove 72 of the electric wire presser 71 and the component holding member 20 in a state where the bus bar member 40 is temporarily locked is fitted from above, the press contact terminal 44. ˜46 are arranged above each of the wires 80. Further, with respect to the length direction of the electric wire 80, it is preferable that the press contact terminals 44 to 46 come near an intermediate position of the electric wire presser 71.

  FIG. 7 shows a state where the bus bar member 40 shown in FIG. 6 is further inserted along the inner wall of the component holding member 20 to the final locking position from the state where the bus bar member 40 is in the temporary locking position. When the bus bar member 40 is further inserted to the final locking position, the press contact terminals 44 to 46 press the respective electric wires 80 to be press contact connected at the same time.

  The connection terminals 42 and 43 are connected so that the leads 62 and 63 of the electronic component 60 are sandwiched between spring pieces. The leads 62 and 63 are supported by the lead storage grooves 22 and 23, and the connection terminals 42 and 43 are inserted vertically along the inner walls of the connection terminal storage portions 24 and 25. Therefore, the leads 62 and 63 are deformed. It is possible to make a reliable connection without any problems.

  When the bus bar member 40 is inserted to the final locking position as shown in FIG. 7, the electronic component 60 and the electric wire 80 housed in the electronic component assembly structure 10 are electrically connected to complete the assembly. Can do. If necessary, the electronic component assembly structure 10 that has been connected can be protected with a cover or the like. In FIG. 8, the Example which attaches the cover 90 to the electronic component assembly structure 10 is shown.

  After attaching the cover 90 to the electronic component assembly structure 10, another electronic component can be connected to the electronic component assembly structure 10. FIG. 9 shows an embodiment in which the electronic component 64 is connected to the electronic component assembly structure 10. After the electronic component 64 is connected, another cover for protecting the electronic component 64 may be further attached if necessary.

  In the embodiment shown in FIG. 9, another electronic component can be connected after the connection between the electronic component housed in the electronic component assembly structure 10 and the bus bar member is completed. When the electronic component assembly structure 10 is configured as described above, all the electronic components can be connected together, but the electronic components can be connected in sequence in a plurality of steps. It is.

  In the above embodiment, after the electronic component is stored in the component holding member, the bus bar member is inserted from above to realize connection with the electronic component, but the electronic component is stored above the component holding member, The bus bar member may be inserted from below the component holding member. In this case, after all the electronic components are stored in the component holding member, it becomes easy to insert the bus bar member from below the component holding member and complete the connection in a lump.

  As described above, the electronic component assembly structure of the present invention is suitable for manufacturing an electronic circuit body by assembling a relatively large and expensive electronic component, and connecting the electronic components without using soldering. Therefore, it is possible to reduce the manufacturing cost by omitting the soldering process. In addition, according to the electronic component assembly structure of the present invention, the electronic component can be assembled and connected so as not to damage the electronic component as much as possible. Alternatively, it can be recovered and reused, and the manufacturing yield can be improved.

  Furthermore, when the electronic component assembly structure of the present invention is used, the electronic component can be used a plurality of times, and the cost can be reduced by recycling the electronic component. The bus bar member incorporated in the electronic component assembly structure of the present invention includes a connection terminal configured so as not to significantly damage the lead of the electronic component, and can be applied to leads having different dimensions and materials. is there.

  In addition, the description in this Embodiment shows an example of the electronic component assembly structure which concerns on this invention, and is not limited to this. The detailed configuration and detailed operation of the electronic component assembly structure in the present embodiment can be changed as appropriate without departing from the spirit of the present invention.

It is a perspective view which shows the electronic component assembly structure which concerns on embodiment of this invention. (A) And (b) is the perspective view which changed the direction and looked at the electronic component assembly structure of this embodiment. It is a perspective view of an electronic component assembly structure when a bus bar member is temporarily locked. FIG. 4 is a cross-sectional view of the electronic component assembly structure shown in FIG. 3 taken along the line AA. It is a perspective view which shows one Example of an electric wire holding member. It is a perspective view which shows the state which made the electronic component assembly structure of a temporary latching state fit with the electric wire holding member. It is a figure which shows the electronic component assembly structure of this latching state. It is a perspective view which shows the Example which attaches a cover to an electronic component assembly structure. It is a perspective view which shows the Example which connects another electronic component to an electronic component assembly structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component assembly structure 20 Component holding member 21 Electronic component accommodating part 22, 23 Lead accommodating groove 24, 25 Connection terminal accommodating part 26 Locking claw 27 Protection board 28 Electric wire accommodating part 29, 72 Groove 40 Bus bar member 41 Main body part 42 , 43 Connection terminals 44 to 49 Another terminal 50 Locking tab 51 Temporary locking hole 52 Main locking hole 60, 64 Electronic component 61 Cylindrical main body 62, 63 Lead 70 Wire holding member 71 Wire holding member 73 Fixing tab 80 Electric wire 90 Cover

Claims (9)

An electronic component assembly structure that houses an electronic component having a lead to form an electronic circuit,
A bus bar member having a connection terminal to be fitted to the lead;
A component holding member formed with at least an electronic component storage portion for storing the electronic component and a lead storage groove for storing the lead;
The component holding member is further formed with a connection terminal accommodating portion for accommodating the connection terminal perpendicular to the lead accommodating groove, and the electronic component and the bus bar member are assembled and held integrally with the component holding member. An electronic component assembly structure characterized by the above. The electronic component assembly structure according to claim 1, wherein the connection terminal has a tightening margin equal to or less than a thickness of a surface plating layer of the lead. 3. The electronic component assembly structure according to claim 1, wherein the connection terminal is formed by alternately arranging a plurality of spring pieces in opposite directions. The electronic component assembly structure according to claim 1, wherein the component holding member is further formed with a wire storage portion for storing a wire. 5. The electronic component assembly structure according to claim 1, further comprising a bus bar member fixing means for fixing the bus bar member to the component holding member. 6. The bus bar member fixing means comprises first bus bar member fixing means for temporarily locking the bus bar member and second bus bar member fixing means for permanently locking the bus bar member. The electronic component assembly structure according to 1. The said bus-bar member fixing means consists of the latching piece with which the said bus-bar member was equipped and the hole for latching was formed, and the latching nail | claw formed in the said component holding member. The electronic component assembly structure according to claim 6. 8. The locking piece includes a temporary locking hole as the first bus bar member fixing means and a final locking hole as the second bus bar member fixing means. The electronic component assembly structure according to 1. 9. The electronic component assembly structure according to claim 7, wherein the locking piece is a buckle-like or tongue-like tab.