JP2008001966A5 - - Google Patents

Download PDF

Info

Publication number
JP2008001966A5
JP2008001966A5 JP2006175135A JP2006175135A JP2008001966A5 JP 2008001966 A5 JP2008001966 A5 JP 2008001966A5 JP 2006175135 A JP2006175135 A JP 2006175135A JP 2006175135 A JP2006175135 A JP 2006175135A JP 2008001966 A5 JP2008001966 A5 JP 2008001966A5
Authority
JP
Japan
Prior art keywords
plating
plating solution
pair
electrodes
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006175135A
Other languages
Japanese (ja)
Other versions
JP2008001966A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006175135A priority Critical patent/JP2008001966A/en
Priority claimed from JP2006175135A external-priority patent/JP2008001966A/en
Publication of JP2008001966A publication Critical patent/JP2008001966A/en
Publication of JP2008001966A5 publication Critical patent/JP2008001966A5/ja
Withdrawn legal-status Critical Current

Links

Claims (6)

めっき液中に少なくとも一対の電極を配し、該めっき液中に基材を浸漬する工程と、
前記一対の電極に交流電圧を印加し、前記めっき液中に含有された水を電気分解することで前記一対の電極の各々において前記めっき液中に酸素を発生させるとともに、前記基材にめっき膜を形成する工程と、を備えることを特徴とするめっき膜の製造方法。
Disposing at least a pair of electrodes in the plating solution, and immersing the substrate in the plating solution;
An alternating voltage is applied to the pair of electrodes, and water contained in the plating solution is electrolyzed to generate oxygen in the plating solution in each of the pair of electrodes, and a plating film on the substrate And a step of forming a plating film.
前記交流電圧の周波数が、30Hz以上100Hz以下であることを特徴とする請求項1に記載のめっき膜の製造方法。 The method for producing a plating film according to claim 1, wherein the frequency of the AC voltage is 30 Hz to 100 Hz . 前記めっき液として、無電解Auめっき液を用いることを特徴とする請求項1又は2に記載のめっき膜の製造方法。 The method for producing a plating film according to claim 1, wherein an electroless Au plating solution is used as the plating solution . 前記基材として、貫通孔が設けられた基材を用いることを特徴とする請求項1〜のいずれか一項に記載のめっき膜の製造方法。 The method for producing a plating film according to any one of claims 1 to 3 , wherein a base material provided with a through hole is used as the base material . 水を含有するめっき液が入れられためっき槽と、該めっき液中に配される少なくとも一対の電極と、該一対の電極間に交流電圧を印加し、前記めっき液中の水を電気分解することにより、前記一対の電極の各々において該めっき液中に酸素を発生させる電源部と、を備えたことを特徴とするめっき処理装置。 A plating tank containing a plating solution containing water, at least a pair of electrodes disposed in the plating solution, and an AC voltage is applied between the pair of electrodes to electrolyze the water in the plating solution. Thus, a plating apparatus comprising: a power supply unit that generates oxygen in the plating solution in each of the pair of electrodes . 前記交流電源の周波数が、30Hz以上100Hz以下であることを特徴とする請求項に記載のめっき処理装置。 6. The plating apparatus according to claim 5 , wherein the frequency of the AC power source is 30 Hz or more and 100 Hz or less .
JP2006175135A 2006-06-26 2006-06-26 Manufacturing method of plating film and plating treatment device Withdrawn JP2008001966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006175135A JP2008001966A (en) 2006-06-26 2006-06-26 Manufacturing method of plating film and plating treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006175135A JP2008001966A (en) 2006-06-26 2006-06-26 Manufacturing method of plating film and plating treatment device

Publications (2)

Publication Number Publication Date
JP2008001966A JP2008001966A (en) 2008-01-10
JP2008001966A5 true JP2008001966A5 (en) 2009-07-23

Family

ID=39006594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006175135A Withdrawn JP2008001966A (en) 2006-06-26 2006-06-26 Manufacturing method of plating film and plating treatment device

Country Status (1)

Country Link
JP (1) JP2008001966A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102433215B1 (en) * 2015-09-25 2022-08-18 (주) 엔피홀딩스 Apparatus and method for electroplating

Similar Documents

Publication Publication Date Title
JP2002186969A5 (en)
US6797134B2 (en) Pulsed power supply for electrochemical cell
SG170052A1 (en) An electrolysis apparatus
EP1703001A3 (en) Electrolytic anode and method for electrolytically synthesizing fluorine-containing substance using the electrolytic anode
ATE358735T1 (en) PLASMA TREATMENT FOR CLEANING COPPER OR NICKEL
WO2007053191A3 (en) Electrochemistry and electrogenerated chemiluminescence with a single faradaic electrode
NZ589886A (en) Use of acoustic energy in cavitation assisted sonochemical hydrogen production system
TW201129723A (en) Ozone generating apparatus
NL1033983A1 (en) Device for generating extreme ultraviolet radiation by means of electrical discharge on regenerable electrodes.
ATE519872T1 (en) DEVICE AND METHOD FOR ELECTROLYTICALLY TREATING A PLATE-SHAPED PRODUCT
JP2011522123A5 (en)
JP6869188B2 (en) Reduction water production equipment and reduction water production method
DE60307062D1 (en) METHOD FOR THE PLASMA CLEANING OF MATERIAL SURFACES COATED WITH AN ORGANIC SUBSTANCE AND DEVICE THEREFOR
JP2008001966A5 (en)
JP5210455B1 (en) Wash water generator
FR2851560B1 (en) METHOD AND DEVICE FOR ELECTROCHEMICAL DISINFECTION OF WATER
SG162685A1 (en) Micro-blasting treatment for lead frames
CL2008001809A1 (en) METHOD FOR MANUFACTURING A NORMAL STERILIZED SALT SOLUTION THAT INCLUDES SUBMERGING A SET OF ELECTRODES IN A SALT SOLUTION, SUPPLYING A CONTINUOUS CURRENT TO THE ELECTRODES, GENERATING FREE CHLORINE; AND PORTABLE DEVICE FOR MANUFACTURING SUCH S
JP2005129692A5 (en)
CN205556834U (en) Plated item hanger transversely rocks device
TW200607766A (en) Apparatus for producing reduced water
JP2008543358A5 (en)
WO2021220383A1 (en) Ozone-dissolved water production method
JP2008136996A (en) Apparatus and method for deodorizing paint booth circulating water
DK1643580T3 (en) Process for producing an electrolytic catalyst support, electrolytic catalyst support and electrochemical electrode