JP2007526631A - ウエハに液状ドーパント溶液を塗布するための機器 - Google Patents
ウエハに液状ドーパント溶液を塗布するための機器 Download PDFInfo
- Publication number
- JP2007526631A JP2007526631A JP2006552628A JP2006552628A JP2007526631A JP 2007526631 A JP2007526631 A JP 2007526631A JP 2006552628 A JP2006552628 A JP 2006552628A JP 2006552628 A JP2006552628 A JP 2006552628A JP 2007526631 A JP2007526631 A JP 2007526631A
- Authority
- JP
- Japan
- Prior art keywords
- dopant
- block
- roll
- wafer
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002019 doping agent Substances 0.000 title claims abstract description 123
- 239000007788 liquid Substances 0.000 title claims abstract description 14
- 235000012431 wafers Nutrition 0.000 title description 45
- 239000012530 fluid Substances 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Coating Apparatus (AREA)
- Photovoltaic Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
3 ウエハ
5 ドーパント分配機器
7 ドーパント移送ロール
9 ワークテーブル
12 ドーパント移送ロールの回転軸
15 第一ロール位置
17 第二ロール位置
20 ドーパント移送ブロック
21 ブロックホルダー
24 流体容器
26 シール端部
30 第一ブロック位置
31 第二ブロック位置
Claims (1)
- ウエハ(3)の表面に液状ドーパント溶液を塗布するための機器(1)であって、機器(1)は、ドーパント分配機器(5)と、第一ロール位置(15)及び第二ロール位置(17)の間でドーパント移送ロール(7)の回転軸(12)に垂直な方向で水平方向に並進可能な回転可能ドーパント移送ロール(7)と、通常操作の間にドーパント溶液を与えられるべきウエハ(3)を保持するためのワークテーブル(9)と、を備えて成り、ドーパント分配機器(5)は、ブロックホルダー(21)によって支持されるドーパント移送ブロック(20)と、端部(26)によって囲まれた開放側面を有する流体容器(24)と、を備えて成り、開放側面は、ドーパント移送ブロック(20)の方に向けられ、端部(26)は、ドーパント移送ブロック(20)、ブロックホルダー(21)、又はその両方と、ドーパント溶液のリークを防止するために協働し、ブロックホルダー(21)と流体容器(24)とは、互いに対して変位させることができ、ブロックホルダー(21)は、ドーパント移送ブロック(20)が流体容器(24)の開放側面の下にある第一ブロック位置(30)と、ドーパント移送ブロック(20)が回転可能ドーパント移送ロール(7)にその第一ロール位置(15)で接触する第二ブロック位置(31)との間で、ドーパント移送ロール(7)の回転軸(12)に垂直な方向で水平方向に並進可能であり、通常運転の間に第二ロール位置(17)では、回転可能ドーパント移送ロール(7)は、ウエハ(3)の表面上にドーパント溶液を与えるためにウエハ(3)と接触してきている機器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04003270 | 2004-02-13 | ||
EP04003270.8 | 2004-02-13 | ||
PCT/EP2005/050611 WO2005081286A1 (en) | 2004-02-13 | 2005-02-11 | Device for applying a liquid dopant solution on a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007526631A true JP2007526631A (ja) | 2007-09-13 |
JP4845742B2 JP4845742B2 (ja) | 2011-12-28 |
Family
ID=34878156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006552628A Expired - Fee Related JP4845742B2 (ja) | 2004-02-13 | 2005-02-11 | ウエハに液状ドーパント溶液を塗布するための機器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080210158A1 (ja) |
EP (1) | EP1714309B1 (ja) |
JP (1) | JP4845742B2 (ja) |
CN (1) | CN100378913C (ja) |
AT (1) | ATE364900T1 (ja) |
DE (1) | DE502005000868D1 (ja) |
WO (1) | WO2005081286A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012096699A1 (en) * | 2011-01-10 | 2012-07-19 | Applied Materials, Inc. | Integrated in-line processing system for selective emitter solar cells |
CN102721704A (zh) * | 2012-06-26 | 2012-10-10 | 潮州三环(集团)股份有限公司 | 电子陶瓷片缺陷自动检测方法及其检测装置 |
CN103170428B (zh) * | 2013-03-06 | 2015-09-30 | 莆田市涵江永德兴电子石英有限公司 | 自动滚胶机 |
US10134871B2 (en) * | 2014-12-23 | 2018-11-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Doping of high-K dielectric oxide by wet chemical treatment |
CN112871551B (zh) * | 2021-03-19 | 2023-07-07 | 常州时创能源股份有限公司 | 链式滚涂装置及其应用 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3335230A1 (de) * | 1983-09-29 | 1985-04-11 | Wilfried 7014 Kornwestheim Philipp | Tampondruckmaschine |
JPS62282963A (ja) * | 1986-06-02 | 1987-12-08 | Hitachi Chem Co Ltd | 薄膜の形成法及びその形成装置 |
DE4138043A1 (de) * | 1991-11-19 | 1993-05-27 | Tampoprint Gmbh | Vorrichtung zum einfaerben von klischees |
US5972784A (en) * | 1997-04-24 | 1999-10-26 | Georgia Tech Research Corporation | Arrangement, dopant source, and method for making solar cells |
JP3410639B2 (ja) * | 1997-07-23 | 2003-05-26 | 株式会社日立製作所 | ペースト充填方法及びはんだ付け方法及びペースト印刷機 |
EP1085578B1 (en) * | 1999-03-30 | 2007-04-18 | Seiko Epson Corporation | Method of manufacturing thin-film transistor |
US6231927B1 (en) * | 1999-06-08 | 2001-05-15 | Certainteed Corporation | Method of coating insulation boards |
EP1303793B1 (en) * | 2000-07-17 | 2015-01-28 | Board Of Regents, The University Of Texas System | Method and system of automatic fluid dispensing for imprint lithography processes |
DE10104726A1 (de) * | 2001-02-02 | 2002-08-08 | Siemens Solar Gmbh | Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht |
DE10120686A1 (de) * | 2001-04-27 | 2002-11-07 | Siemens Ag | Verfahren zur Erzeugung dünner homogener Schichten mit Hilfe der Siebdrucktechnik, Vorrichtung zur Durchführung des Verfahren und ihre Verwendung |
JP4015823B2 (ja) * | 2001-05-14 | 2007-11-28 | 株式会社東芝 | アルカリ現像液の製造方法,アルカリ現像液,パターン形成方法,レジスト膜の剥離方法,及び薬液塗布装置 |
EP1289025A1 (fr) * | 2001-08-30 | 2003-03-05 | Universite De Neuchatel | Procédé de dépot d'une couche d'oxyde sur un substrat et cellule photovoltaique utilisant ce substrat |
-
2005
- 2005-02-11 EP EP05716666A patent/EP1714309B1/de not_active Not-in-force
- 2005-02-11 WO PCT/EP2005/050611 patent/WO2005081286A1/en active IP Right Grant
- 2005-02-11 AT AT05716666T patent/ATE364900T1/de not_active IP Right Cessation
- 2005-02-11 CN CNB2005800048847A patent/CN100378913C/zh not_active Expired - Fee Related
- 2005-02-11 DE DE502005000868T patent/DE502005000868D1/de active Active
- 2005-02-11 JP JP2006552628A patent/JP4845742B2/ja not_active Expired - Fee Related
- 2005-02-11 US US10/597,651 patent/US20080210158A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE502005000868D1 (de) | 2007-07-26 |
US20080210158A1 (en) | 2008-09-04 |
JP4845742B2 (ja) | 2011-12-28 |
CN100378913C (zh) | 2008-04-02 |
EP1714309A1 (en) | 2006-10-25 |
ATE364900T1 (de) | 2007-07-15 |
CN1918692A (zh) | 2007-02-21 |
EP1714309B1 (de) | 2007-06-13 |
WO2005081286A1 (en) | 2005-09-01 |
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