JP2007333821A - Optical component supporting structure, optical pickup device, and method for manufacturing optical component supporting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the deterioration of optical characteristic caused by the change of an adhesion state by applying an adhesive to an appropriate coating position in the adhesion of an optical component. <P>SOLUTION: The optical component supporting structure 40 is equipped with a prism 1 and a supporting member 20. The prism 1 is arranged in an optical path. The supporting member 20 fixedly supports the prism 1 with the adhesive, and a through-hole 10 is formed at the spot of the supporting member 20 where the prism 1 is adhesively fixed. The prism 1 is adhesively fixed on the supporting member 20 at a position opposed to the through-hole 10 of the supporting member 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical component support structure, and more particularly to a structure for bonding and supporting an optical component arranged in an optical path. The present invention also relates to an optical pickup device including an optical component support structure and a method for manufacturing the optical component support structure.

Various proposals have been made regarding the adhesion of molded articles (see, for example, Patent Document 1 and Patent Document 2). In particular, with respect to bonding of optical components constituting an optical pickup, a technique is known in which an optical component is bonded and fixed to a base with an adhesive applied on the base. This will be described with reference to FIGS.
FIG. 9 is a diagram showing a conventional prism bonding process. 10 and 11 are views showing the shape of the adhesive after the prism is installed.
9 to 11, 1 is a prism as an optical component, 2 is a base, 3 is a UV adhesive (hereinafter referred to as an adhesive), 4 is a first moving direction of the prism, 5 is a second moving direction, Reference numeral 8 denotes a height positioning projection.
As shown in FIG. 9, in the conventional prism bonding process, the adhesive 3 is applied to the upper surface of the base 2 with several dispensers, and then the prism 1 is lowered in the first moving direction 4 so that the prism 1 is protruded 8. Place on top. Thereafter, the positioning in the direction along the upper surface of the base 2 is performed, for example, shifted by a minute distance in the second moving direction 5 and brought into contact with the side surface of the base 2. Further, UV light is irradiated to cure the adhesive 3 and perform adhesive fixing.
As shown in FIGS. 10 and 11, in the conventional prism bonding process, the adhesive 3 adheres to the lower surface of the prism 1 and the adhesive 3 is crushed when the prism 1 is placed on the positioning projection 8. It spreads in the direction along the lower surface of the prism 1. Further, when the prism 1 is slightly displaced in the second moving direction 5, the adhesive 3 further flows in a direction along the lower surface of the prism 1. Therefore, if the application amount and the application position of the adhesive 3 are not accurately controlled, the adhesive 3 adheres to each other as shown in FIG. 10, or the adhesive 3 adheres to the side surfaces of the prism 1 and the base 2 as shown in FIG. It often happens that the projection protrudes between the projections 8 and an adhesive layer is formed between the protrusion 8 and the lower surface of the prism 1.

Thus, when the application state of the adhesive 3 is not accurately performed, for example, when thermal expansion of the adhesive 3 occurs due to a temperature change or the like as shown in FIG. As a result of displacing or rotating the optical axis, the optical axis passing through the prism 1 is displaced, which deteriorates the optical characteristics of the optical system.
Further, the deterioration of the optical characteristics due to such a change in the adhesion state occurs not only when the adhesive 3 thermally expands but also when the adhesive 3 changes over time.
In order to prevent the deterioration of the optical characteristics due to such a change in the adhesive state of the adhesive, an adhesive relief hole is provided on the adhesive surface, and the adhesive located on the adhesive surface is intended to have a uniform thickness. A technique has been proposed (see, for example, Patent Document 3).
However, even with such a technique, the problem that it is necessary to accurately control the coating amount of the adhesive and the problem that the adhesive protrudes from the side surface of the optical part as the optical part is positioned are still present. Remain.
Japanese Utility Model Publication No. 3-65217 Japanese Patent Laid-Open No. 7-138534 Japanese Patent Laid-Open No. 5-210851

  In view of the above, an object of the present invention is to apply an adhesive at an appropriate application position in bonding of optical components to prevent deterioration of optical characteristics due to a change in the bonding state.

The optical component support structure of the present invention includes an optical component and a support member. The optical component is disposed in the optical path. The support member fixes and supports the optical component with an adhesive, and a through-hole is formed at a position where the optical component is bonded and fixed. The optical component is bonded and fixed to the support member at a position facing the through hole of the support member.
In the optical component support structure of the present invention, since the optical component is bonded and fixed to the support member at a position facing the through hole of the support member, it is possible to apply an adhesive to an appropriate application position, and an unnecessary position. It is possible to prevent the optical properties from deteriorating due to the change in the position of the optical component due to the change in the adhesive state of the adhesive applied to the adhesive.
In the optical component support structure of the present invention, the optical component is preferably fixed to the side surface of the through hole of the support member via an adhesive.
In the optical component support structure of the present invention, the adhesive fixing between the optical component and the support member is mainly performed between the side surface of the through hole of the support member of the optical component. The adhesive is not located between the opposing surfaces of the optical component and the support member, and it is possible to prevent deterioration of optical characteristics due to a change in the adhesive state of the adhesive.
In the optical component support structure of the present invention, it is desirable that the adhesive is injected from the side opposite to the optical component side of the through hole to fix the optical component and the support member.

In the optical component support structure of the present invention, for example, after the positioning of the optical component with respect to the support member is completed, the adhesive can be injected from the through hole. For this reason, when the optical component is positioned, the applied adhesive can be prevented from spreading or protruding between the optical component and the support member, and the optical component and the support member are bonded at an appropriate bonding position. It becomes possible.
In the optical component support structure of the present invention, it is desirable that the hole diameter of the through hole on the optical component side is smaller than the hole diameter on the side opposite to the optical component side.
In the optical component support structure of the present invention, the hole diameter of the through hole is smaller on the optical component side than on the opposite side. For this reason, for example, when the adhesive is injected into the through hole from the side opposite to the optical component side, the injection becomes easy. Further, even if the adhesive injected into the through hole expands, the adhesive mainly displaces to the opposite side of the optical component having a larger hole diameter, so the position of the optical component changes due to the displacement of the adhesive. Can be prevented.
In the optical component support structure of the present invention, it is desirable that the side surface of the through hole includes an inclined surface that is reduced in diameter toward the optical component side.
In the optical component support structure of the present invention, since the side surface of the through hole is formed in a tapered shape, for example, even if the adhesive thermally expands at a high temperature, the thermal expansion of the adhesive occurs on the surface opposite to the optical component. Therefore, without changing the position of the optical component, the displacement and rotation of the optical component at the time of temperature change can be suppressed, and deterioration of the optical characteristics can be prevented.

In the optical component support structure of the present invention, it is desirable that the support member has a base on which a through hole is formed and a protrusion that protrudes from the base toward the optical component and contacts the optical component.
In the optical component support structure of the present invention, the optical component is positioned in contact with the protrusion directly without using an adhesive. For this reason, it is possible to prevent the change in the adhesive state of the adhesive from affecting the positioning of the optical component, and it is possible to prevent the deterioration of the optical characteristics due to the change in the position of the optical component. At a low temperature, the adhesive contracts, and the adhesive pulls the optical component toward the support member. For this reason, at a low temperature, the optical component is positioned more accurately in the height direction.
An optical pickup device of the present invention is an optical pickup device for reading a signal recorded on an optical disc, and includes a light source, an optical pickup optical system, and a light receiving element. The optical pickup optical system guides the light beam from the light source to the optical disk. The light receiving element receives the reflected light beam from the optical disk. The optical pickup optical system has the optical component support structure described above.
Since the optical pickup device of the present invention has the optical component support structure described above, the same effects as described above can be obtained.
The manufacturing method of the optical component support structure of the present invention includes an optical component disposed in the optical path, a support member that fixes and supports the optical component with an adhesive, and a through hole is formed at an adhesive fixing location with the optical component, It is a manufacturing method of the optical component support structure which has this. In this manufacturing method, the optical component is placed and positioned on the support member, an adhesive is injected from the opposite side of the through hole to the optical component side, and the optical component and the side surface of the through hole are fixed.

  In the method for manufacturing an optical component support structure of the present invention, since the adhesive is injected from the through hole after the positioning of the optical component with respect to the support member is completed, the applied adhesive is supported by the optical component and the support when positioning the optical component. It is possible to prevent the optical component and the support member from being bonded to each other at an appropriate bonding position. Therefore, it is possible to prevent deterioration of the optical characteristics even if the adhesion state changes.

  According to the present invention, it is possible to prevent the deterioration of optical characteristics due to a change in the adhesive state by applying an appropriate application position in the bonding of optical components.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
(1) Configuration of Optical Pickup Device FIG. 1 is a schematic configuration diagram of an optical pickup device as an example of an optical apparatus that employs the optical component support structure according to the first embodiment of the present invention. As shown in FIG. 1, an optical pickup device 50 is a device for reading a signal recorded on an optical disk 51, and mainly emits a light beam for reading a signal and receives a reflected light beam from the optical disk 51. And an optical pickup optical system 53 that guides the light flux from the semiconductor laser unit 58 to the optical disc 51 and guides the reflected light flux from the optical disc 51 to the semiconductor laser unit 58.
The semiconductor laser unit 58 includes, for example, a semiconductor laser 52 as a light source, a hologram 59 that diffracts reflected light from the optical disc 51, and a light receiving element 54 that detects light diffracted by the hologram 59.
The optical pickup optical system 53 includes, for example, a collimating optical system 55 that converts a light beam from the semiconductor laser 52 into substantially parallel light, a reflection optical system 57 such as a prism that bends substantially parallel light, and a substantially bent shape by the reflection optical system 57. An objective optical system 56 that condenses parallel light on the recording surface of the optical disk, and an optical component support structure 40 is employed in at least a part of the optical pickup optical system 53. Since the configuration other than the optical component support structure 40 is not different from the conventional configuration, detailed description thereof is omitted.

(2) About optical component support structure The optical component support structure 40 is demonstrated using FIG. FIG. 2 is a cross-sectional view showing the optical component support structure 40 of the present invention. 1 is a prism (optical component), 2 is a base, 3 is a UV adhesive (adhesive), and 8 is integrated with or separate from the base 2. A height positioning projection (projection) formed as a body, 9 is an adhesive injection direction and UV irradiation direction, and 10 is a through-hole formed in the base 2.
The prism 1 is a member constituting the reflection optical system 57 shown in FIG. 1 and is disposed in the optical path of the light from the semiconductor laser 52 or the reflected light from the optical disk 51.
The base 2 and the protrusion 8 constitute a support member 20 that fixes and supports the prism 1 as an optical component. A through-hole 10 is formed in the base 2 at a location where the prism 1 is bonded and fixed. The protrusion 8 is a member that protrudes from the base 2 toward the prism 1 and contacts the prism 1, and performs positioning of the prism 1 in the height direction (direction indicated by an arrow 9) with respect to the base 2.
The adhesive 3 is injected along the adhesive injection direction 9 from the side opposite to the prism 1 side of the through hole 10.
With the above configuration, the optical component support structure 40 adheres and fixes the prism 1 to the base 2 at a position facing the through hole 10 of the base 2. More specifically, the optical component support structure 40 fixes the optical component and the side surface of the through hole 10 via the adhesive 3.

In addition, the through-hole 10 should just be formed in at least 1 place or more in the base 2, and when bonding the prism 1 and the base 2 at a position facing the through-hole 10, sufficient strength can be secured, The number and the size of the hole diameter may be anything. In the optical component support structure 40 shown in FIG. 2, through holes 10 are provided at three locations on the base 2, and the prism 1 and the base 2 are fixed at the three adhesion locations.
Next, a method for manufacturing the optical component support structure 40 will be described.
When manufacturing the optical component support structure 40, first, the support member 20 is prepared. The support member 20 includes a base 2 in which the through hole 10 is formed, and a protrusion 8 that is formed on the base 2 as a single body or as a separate body.
Next, the prism 1 is placed on the support member 20 and positioned. In positioning, the height direction position of the prism 1 with respect to the base 2 is positioned by bringing the prism 1 into contact with the protrusion 8 of the support member 20. Further, positioning in the direction along the base 2 (two directions orthogonal to the direction indicated by the arrow 9) is performed while the prism 1 is brought into contact with the protrusion 8.
Next, the adhesive 3 is injected in the adhesive injection direction 9 from the side opposite to the prism 1 side into the through hole 10 of the base 2. At this time, the adhesive 3 swells so as to reach the end face of the prism 1 from the through hole 10. The through hole 10 is filled with the adhesive 3, and the side surface of the through hole 10 and the adhesive 3 are in contact with each other with a sufficient bonding area. Furthermore, UV light is irradiated toward the UV irradiation direction 9 to cure the adhesive 3 and perform adhesive fixing. Thereby, the position of the prism 1 facing the through hole 10 is fixed to the side surface of the through hole 10 via the adhesive 3 filled in the through hole 10.

In the conventional bonding of the prism 1 (see, for example, FIGS. 9 to 12), when the prism 1 and the base 2 are bonded, an adhesive is applied to the upper surface of the base 2, and then the prism 1 is placed on the base 2. Position to. Specifically, the prism 1 is placed on the protrusion 8 and positioned in the height direction with respect to the base 2. Thereafter, the prism 1 is slightly moved in the direction along the base 2 to perform positioning in the direction (horizontal direction) along the base 2. Thereafter, UV light is irradiated from the prism 1 side of the base 2 to cure the adhesive.
On the other hand, in the bonding of the prism according to the present invention shown in FIG. 2, the prism 1 is slightly moved in the horizontal direction in a state where the prism 1 is placed on the protrusion 8, thereby positioning in the height direction and the horizontal direction. Thereafter, the adhesive 3 is injected and cured through the through hole 10 from the side opposite to the prism 1 side of the base 2. That is, the through-hole 10 of the present invention is not provided for the purpose of releasing the excess adhesive 3, but is provided for the purpose of injecting the adhesive 3.
In the technique disclosed in Patent Document 3, the adhesion between the prism and the base is performed between the upper surface (the whole) of the base and the lower surface (the whole) of the prism, but in the present invention (FIG. 2). See), between the side surface of the through hole 10 of the base 2 and the portion of the lower surface of the prism 1 facing the through hole 10.

The operation of the present invention will be described below.
As in the prior art, when the prism 1 is moved and positioned after the adhesive 3 is applied, the adhesive 3 moves as described in the background art, and adheres to a portion that should not originally adhere, May become unbalanced. As a result, the thermal expansion and contraction of the adhesive when the temperature changes causes the prism to displace and the optical characteristics may deteriorate.
On the other hand, in the case of the present invention, after positioning the prism 1, the adhesive 3 can be applied only to a predetermined location. For this reason, in this invention, it becomes possible to prevent that the adhesive agent 3 moves, and it becomes possible to apply | coat the adhesive agent 3 only to a required location, and to perform adhesive fixation.
As a result, in the present invention, even if the temperature of the adhesive 3 changes, the displacement of the prism 1 can be suppressed, or the prism 1 can be displaced as designed, and the deterioration of optical characteristics is suppressed. It becomes possible to do.
Further, when an adhesive is applied to the upper surface (whole) of the base 2 as in the prior art, the adhesive 3 expands toward the prism 1 when the adhesive 3 is thermally expanded at a high temperature. A force in the direction of pushing up the prism 1 is applied to 1.
On the other hand, since the lower surface of the adhesive 3 (the side opposite to the prism 1 side of the through hole 10) is a free surface in the present invention, the adhesive 3 can also thermally expand below the through hole 10. For this reason, even if the adhesive 3 is thermally expanded, the amount of expansion of the adhesive 3 toward the prism 1 and the force in the direction of pushing up the prism 1 can be reduced. Furthermore, during the cooling, the adhesive 3 contracts, so that a force in a direction of pulling the prism 1 downward acts on the prism 1. However, since the prism 1 is supported by the protrusions 8 formed on the base 2, the prism 1 is not displaced.

In the present invention, the prism 1 is supported by directly contacting the support member 20 (specifically, the protrusion 8) without using the adhesive 3. For this reason, the displacement due to expansion or contraction of the adhesive 3 does not directly act on the prism 1, and the optical characteristics can be maintained.
(Second Embodiment)
FIG. 3 shows an optical component support structure 40a as a second embodiment of the present invention. FIG. 3 is a cross-sectional view showing the optical component support structure 40a of the present invention, wherein 1 is a prism (optical component), 2 is a base, 3 is a UV adhesive (adhesive), and 8 is integrated with or separate from the base 2. Height positioning protrusions (protrusions) 10 a formed as a body are through holes formed in the base 2.
The present invention is different from the first embodiment in that a step 7 is formed in the through hole 10a. Thereby, the hole diameter by the side of the prism 1 of the through-hole 10a is smaller than the hole diameter by the side opposite to the prism 1 side. With this configuration, it becomes easy to inject resin (injection of adhesive) with a dispenser from the side opposite to the prism 1 side with respect to the through hole 10a, and unnecessary adhesion of the adhesive around the through hole 10a is reduced. .
(Third embodiment)
4 to 8 show an optical component support structure 40b as a third embodiment of the present invention. FIG. 4 is a cross-sectional view showing the optical component support structure 40b of the present invention, wherein 1 is a prism (optical component), 2 is a base, 3 is a UV adhesive (adhesive), and 8 is integrated with or separate from the base 2. The height positioning projections (projections) 10b formed as a body are through holes formed in the base 2, and 11 is a taper (inclined surface) formed on the side surface of the through hole 10b. The taper 11 is formed to have a taper angle θ.

The present invention differs from the prior art and the first embodiment in that a taper that reduces the diameter toward the prism 1 is provided on the side surface of the through hole 10b. Thereby, the hole diameter by the side of the prism 1 of the through-hole 10b is smaller than the hole diameter by the side opposite to the prism 1 side.
The operation and effect of the optical component support structure 40b will be described with reference to FIGS.
The thermal expansion of the adhesive 3 at the time of high temperature in the optical component support structure 40b will be described with reference to FIG.
As described in the first embodiment, in the present invention, the adhesive 3 is filled in the through holes, and the lower surface of the adhesive 3 (the surface opposite to the prism 1 side) is a free surface. . For this reason, even if the adhesive 3 is thermally expanded, the adhesive 3 can expand downward, and the influence of the thermal expansion of the adhesive 3 on the direction in which the prism 1 is pushed up is reduced.
In the present invention, the taper 11 is provided on the side surface of the through hole 10b. Thus, when the adhesive 3 is thermally expanded, the adhesive 3 is thermally expanded in the direction indicated by the arrow 6 in FIG. That is, the adhesive 3 is mainly displaced toward the side opposite to the prism 1 by the action of the taper 11 when thermally expanding. For this reason, the displacement to the prism 1 side is suppressed.
The effect of the taper 11 of the present invention will be described with reference to FIGS. Here, in each base 2 having the through holes 10b with different taper angles θ, the thermal expansion of the adhesive 3 upward (on the prism 1 side) when the temperature is increased from 25 ° C. to 100 ° C. The amount (L1) and the amount of thermal expansion (L2) in the downward direction (on the opposite side to the prism 1 side) were determined by numerical analysis using the finite element method.

FIG. 6 shows parameters used for the numerical analysis. As the base 2, four models (Model Nos. 1 to 4) having a taper angle θ of 90 degrees, 60 degrees, 45 degrees, and 30 degrees are used. In each model, the diameter of the through hole 10b on the prism 1 side is fixed to a predetermined diameter φ, and the thickness of the base 2 is 2 mm. As the adhesive 3, an epoxy adhesive is assumed, and a thermal expansion coefficient of 50 PPM is used.
FIG. 7 shows the result of numerical analysis. As shown in FIG. 7, as the taper angle θ decreases, that is, as the ratio of the lower hole diameter (hole diameter opposite to the prism 1 side) to the upper hole diameter (hole diameter on the prism 1 side) of the through hole 10b increases. The thermal expansion in the downward direction of the adhesive 3 increases, while the thermal expansion in the upward direction decreases. This is because the downward thermal expansion force is suppressed by the downward taper 11 and the downward thermal expansion is promoted.
Thus, in the present invention, the taper 11 can suppress the upward thermal expansion of the adhesive 3. In particular, if the taper angle θ is, for example, 30 degrees, 45 degrees, or 60 degrees, it can be said that the upward thermal expansion of the adhesive 3 can be suppressed. As a result, it is possible to prevent the prism 1 from being displaced by the adhesive 3 pushing the prism 1 upward, and to prevent deterioration of the optical characteristics.

The stress acting on the adhesive 3 of the optical component support structure 40b and the behavior of the adhesive 3 will be described with reference to FIG.
As described above, no adhesive layer is interposed between the prism 1 and the protrusion 8 in the optical component support structure 40b. Further, during cooling, the adhesive 3 contracts so as to pull the lower surface of the prism 1 toward the base 2 side. For this reason, at the time of cooling, the positioning of the prism 1 by the protrusion 8 becomes stronger, and there is little possibility of causing a positional shift, and stable optical characteristics can be obtained.
Similar to the optical component support structure 40a, in the optical component support structure 40b of the present embodiment, the hole diameter on the opposite side of the through hole 10b from the prism 1 side is larger than the hole diameter on the prism 1 side. For this reason, it is easy to inject resin (injection of adhesive) with a dispenser from the side opposite to the prism 1 side with respect to the through hole 10b, and unnecessary adhesion of the adhesive around the through hole 10 is reduced.
Further, in this embodiment, the side surface of the through hole 10b is tapered with respect to the entire thickness of the base 2, but the hole diameter on the prism 1 side as shown in FIG. Is smaller than the hole diameter on the side opposite to the prism 1 side, and may have a two-stage shape provided with through holes having a predetermined thickness and the same hole diameter. That is, the through hole on the side opposite to the prism 1 side from the stepped portion 7 in FIG. 3 may be a through hole having a tapered shape.

  The present invention relates to an optical component support structure for an optical component of an optical pickup such as a DVD, and in the bonding of an optical component, an adhesive is applied at an appropriate application position to prevent deterioration of optical characteristics due to a change in the adhesion state. It is useful in the field where is required.

1 is a schematic configuration diagram of an optical pickup device employing an optical component support structure according to a first embodiment. Sectional drawing which shows the optical component support structure which concerns on 1st Embodiment. Sectional drawing which shows the optical component support structure which concerns on 2nd Embodiment. Sectional drawing which shows the optical component support structure which concerns on 3rd Embodiment. Sectional drawing which shows the thermal expansion state of the adhesive agent at the time of the high temperature of the optical component support structure which concerns on 3rd Embodiment. Numerical analysis model for verifying the effect of the optical component support structure according to the third embodiment Numerical analysis results showing the effect of the optical component support structure according to the third embodiment Sectional drawing which shows the contraction state of the adhesive agent at the time of the low temperature of the optical component support structure which concerns on 3rd Embodiment. The figure which shows the conventional adhesion process and adhesive application state Explanatory drawing which shows the 1st adhesive agent state after adhesion | attachment in the conventional adhesion process. Explanatory drawing which shows the 2nd adhesive agent state after adhesion | attachment in the conventional adhesion process. Explanatory drawing which shows the thermal expansion state of the adhesive agent at the time of high temperature in the conventional adhesion process

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Prism 2 Base 3 UV adhesive 7 Step part 8 Protrusion 10, 10a, 10b Through-hole 11 Taper 20 Support member 40, 40a, 40b Optical component support structure

Claims (8)

Optical components placed in the optical path;
The optical component is fixed and supported with an adhesive, and a support member in which a through hole is formed at an adhesive fixing location with the optical component;
With
The optical component is bonded and fixed to the support member at a position facing the through hole of the support member.
Optical component support structure. The optical component is fixed to the side surface of the through hole of the support member via the adhesive.
The optical component support structure according to claim 1. The adhesive is injected from the side opposite to the optical component side of the through hole, and fixes the optical component and the support member.
The optical component support structure according to claim 1 or 2. The hole diameter on the optical component side of the through hole is smaller than the hole diameter on the side opposite to the optical component side,
The optical component support structure according to claim 1. The side surface of the through hole includes an inclined surface that decreases in diameter toward the optical component side.
The optical component support structure of any one of Claims 1-4. The support member includes a base on which the through-hole is formed, and a protrusion that protrudes from the base toward the optical component and contacts the optical component.
The optical component support structure according to any one of claims 1 to 5. An optical pickup device for reading a signal recorded on an optical disc,
A light source;
An optical pickup optical system for guiding a light beam from the light source to the optical disc;
A light receiving element for receiving a reflected light beam from the optical disc,
The optical pickup optical system has the optical component support structure according to any one of claims 1 to 6.
Optical pickup device. An optical component support structure comprising: an optical component disposed in an optical path; and a support member that fixes and supports the optical component with an adhesive and has a through-hole formed in an adhesive fixing position with the optical component. There,
Placing and positioning the optical component on the support member;
Injecting adhesive from the side opposite to the optical component side of the through hole, and fixing the optical component and the side surface of the through hole,
Manufacturing method of optical component support structure.

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