JP2007331167A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007331167A5 JP2007331167A5 JP2006163818A JP2006163818A JP2007331167A5 JP 2007331167 A5 JP2007331167 A5 JP 2007331167A5 JP 2006163818 A JP2006163818 A JP 2006163818A JP 2006163818 A JP2006163818 A JP 2006163818A JP 2007331167 A5 JP2007331167 A5 JP 2007331167A5
- Authority
- JP
- Japan
- Prior art keywords
- reservoir
- substrate
- nozzle
- droplets
- discharge chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 17
- 230000003139 buffering effect Effects 0.000 claims 3
- 238000007599 discharging Methods 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 230000001902 propagating effect Effects 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Claims (3)
前記振動板にギャップを隔てて対向し、該振動板を駆動する個別電極が形成された電極基板と、
前記吐出室に液滴を供給するリザーバ、前記リザーバから前記吐出室へ液滴を移送するための供給口、及び前記吐出室からノズル孔へ液滴を移送するノズル連通穴が形成されたリザーバ基板と、
前記ノズル連通穴を介して移送される液滴を吐出するノズル孔及び前記リザーバに対応する位置に形成され、前記リザーバ内で発生する圧力変動を緩衝する圧力緩衝溝が形成されたノズル基板と、
可撓性を有する樹脂で形成され、前記ノズル孔に対応する部分を貫通させたダイヤフラム層とを備え、
前記ダイヤフラム層を、前記圧力緩衝溝に所定の空間を形成するように前記ノズル基板と前記リザーバ基板との間に設け、
前記ダイヤフラム層の有する縦弾性係数に伴って、前記リザーバに伝播する圧力変動を緩衝可能にし、前記圧力緩衝溝側に前記ダイヤフラム層が変形することによって前記リザーバに伝播する圧力変動を更に緩衝可能にしている
ことを特徴とする液滴吐出ヘッド。 A cavity substrate in which a bottom wall forms a vibration plate and a discharge chamber for storing and discharging droplets is formed;
An electrode substrate that is opposed to the diaphragm with a gap and on which an individual electrode for driving the diaphragm is formed;
A reservoir substrate having a reservoir for supplying droplets to the discharge chamber, a supply port for transferring droplets from the reservoir to the discharge chamber, and a nozzle communication hole for transferring droplets from the discharge chamber to the nozzle holes When,
A nozzle substrate that is formed at a position corresponding to the nozzle hole and the reservoir for discharging a droplet transferred through the nozzle communication hole, and in which a pressure buffering groove for buffering a pressure fluctuation generated in the reservoir is formed;
Formed of a flexible that having a resin, and a diaphragm layer formed by penetrating the portion corresponding to the nozzle holes,
The diaphragm layer is provided between the nozzle substrate and the reservoir substrate so as to form a predetermined space in the pressure buffer groove,
Along with the longitudinal elastic modulus of the diaphragm layer, the pressure fluctuation propagating to the reservoir can be buffered, and the pressure fluctuation propagating to the reservoir can be further buffered by the deformation of the diaphragm layer on the pressure buffer groove side. and the droplet discharge head, characterized in that are.
ことを特徴とする液滴吐出装置。 A droplet discharge apparatus comprising the droplet discharge head according to claim 1 .
前記吐出室に液滴を供給するリザーバ、前記リザーバから前記吐出室へ液滴を移送するための供給口、及び前記吐出室からノズル孔へ液滴を移送するノズル連通穴が形成されたリザーバ基板を前記キャビティ基板に接合し、
前記ノズル連通穴を介して移送される液滴を吐出するノズル孔及び前記リザーバに対応する位置に前記リザーバ内で発生する圧力変動を緩衝する圧力緩衝溝が同時に形成されたノズル基板の該圧力緩衝溝の形成面にダイヤフラム層を接合し、
前記電極基板、前記キャビティ基板、前記リザーバ基板、前記ダイヤフラム層及び前記ノズル基板の順で積層させる
ことを特徴とする液滴吐出ヘッドの製造方法。 Bonding a silicon substrate on which an ejection chamber is formed to an electrode substrate on which individual electrodes are formed, forming the ejection chamber on the silicon substrate to produce a cavity substrate,
A reservoir substrate having a reservoir for supplying droplets to the discharge chamber, a supply port for transferring droplets from the reservoir to the discharge chamber, and a nozzle communication hole for transferring droplets from the discharge chamber to the nozzle holes Is bonded to the cavity substrate,
Pressure buffer of the nozzle substrate pressure buffering grooves are formed simultaneously to buffer the pressure fluctuation generated in the reservoir at a position corresponding to the nozzle hole and the reservoir for discharging droplets to be transported through the nozzle communicating hole Bonding the diaphragm layer to the groove forming surface,
The method of manufacturing a droplet discharge head, comprising: laminating the electrode substrate, the cavity substrate, the reservoir substrate, the diaphragm layer, and the nozzle substrate in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006163818A JP2007331167A (en) | 2006-06-13 | 2006-06-13 | Liquid droplet-delivering head, liquid droplet-delivering apparatus, method for manufacturing liquid droplet-delivering head and method for manufacturing liquid droplet-delivering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006163818A JP2007331167A (en) | 2006-06-13 | 2006-06-13 | Liquid droplet-delivering head, liquid droplet-delivering apparatus, method for manufacturing liquid droplet-delivering head and method for manufacturing liquid droplet-delivering apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007331167A JP2007331167A (en) | 2007-12-27 |
| JP2007331167A5 true JP2007331167A5 (en) | 2009-07-16 |
Family
ID=38931113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006163818A Withdrawn JP2007331167A (en) | 2006-06-13 | 2006-06-13 | Liquid droplet-delivering head, liquid droplet-delivering apparatus, method for manufacturing liquid droplet-delivering head and method for manufacturing liquid droplet-delivering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007331167A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6070250B2 (en) | 2013-02-18 | 2017-02-01 | 株式会社リコー | Liquid ejection head and image forming apparatus |
| JP6390851B2 (en) * | 2015-02-09 | 2018-09-19 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| JP2020023197A (en) * | 2019-11-26 | 2020-02-13 | セイコーエプソン株式会社 | Flow path component, liquid discharge head and liquid discharge device |
| JP2022148859A (en) * | 2021-03-24 | 2022-10-06 | 東芝テック株式会社 | liquid ejection head |
-
2006
- 2006-06-13 JP JP2006163818A patent/JP2007331167A/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1780017A3 (en) | Piezoelectric inkjet printhead | |
| US20110234710A1 (en) | Liquid ejecting head, method for manufacturing the same and liquid ejecting apparatus | |
| JP2008114589A5 (en) | ||
| KR20090003802A (en) | Piezoelectric inkjet head | |
| JP5196184B2 (en) | Liquid ejecting head, liquid ejecting apparatus, and actuator | |
| JP2012166393A (en) | Inkjet head | |
| JP2012196882A5 (en) | ||
| JP2007331167A5 (en) | ||
| KR101101467B1 (en) | Inkjet head and method of menufacturing inkjet head | |
| US20110102520A1 (en) | Inkjet print head | |
| JP2006218716A5 (en) | ||
| KR20110050974A (en) | Inkjet head | |
| US9073320B2 (en) | Liquid ejecting head and liquid ejecting apparatus | |
| JP2011156856A (en) | Inkjet print head and manufacturing method thereof | |
| JP2010017901A5 (en) | ||
| US8113633B2 (en) | Liquid ejecting head and liquid ejecting apparatus having same | |
| TW200628316A (en) | Droplet-discharging head, method for manufacturing the same, and droplet-discharging device | |
| KR20110014013A (en) | Inkjet head and method of menufacturing inkjet head | |
| JP2013010332A (en) | Liquid ejection head, liquid ejection head block using the same, and recording device | |
| JP2008100382A5 (en) | ||
| JP2011056938A (en) | Inkjet head and inkjet head assembly including the same | |
| JP2006281603A5 (en) | ||
| JP2011206919A (en) | Liquid ejection head and liquid ejection device | |
| JP2007076128A5 (en) | ||
| CN202428807U (en) | Liquid nozzle |