JP2007329146A - Information processor, semiconductor manufacturing system, information processing method, program, and recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein a value having a different scale, such as a unit cannot be converted to a value suitable for an analysis, or the like without depending on the scale in a conventional information processor. <P>SOLUTION: An information processor 100 processes a state value related to a state in processing in a semiconductor-manufacturing apparatus 200 for treating a treatment target including a semiconductor, and comprises a state: value reception 101 for receiving a state value; a reference value storage 102 for storing a reference value that is a reference value of the state value; a threshold storage 103 for storing a threshold that is a value used for determining whether the state value is a desired value; a calculator 104 for calculating the ratio of a value related to the difference between the state value and the reference value received by the state reception 101 to a value related to the difference between the threshold and the reference value; and an outputting section for outputting the ratio calculated by the calculator 104. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an information processing apparatus that processes a value acquired from a semiconductor manufacturing apparatus.

  As a semiconductor manufacturing apparatus for manufacturing a semiconductor device, for example, there is a heat treatment apparatus for performing a heat treatment such as a film formation process, an oxidation process, or a diffusion process on a processing object including a semiconductor such as a semiconductor wafer.

  In a heat treatment apparatus or the like, heat treatment is usually performed by controlling a treatment temperature, a treatment pressure, a gas flow rate, and the like so as to coincide with a set value for setting a treatment condition called a recipe.

  For example, with respect to such a heat treatment apparatus, a plurality of temperature sensors are arranged in a reaction furnace, and the temperature of the semiconductor wafer is calculated using a thermal model (mathematical model) based on the output of the temperature sensor and the power supplied to the heater. There is a technique for sequentially predicting the heater power and controlling the heater power using the predicted value (see, for example, Patent Document 1). According to such a technique, the processing temperature can be accurately controlled by predicting the temperature of the semiconductor wafer relatively accurately without contact.

On the other hand, in the heat treatment apparatus as described above, values indicating the processing state such as processing temperature, processing pressure, heater power, etc. during actual processing are obtained and monitored. Thus, it is determined whether or not the apparatus is operating normally, whether or not a desired process is normally performed, and the like. For example, in a single device, the results of multiple times of processing performed in the same recipe are arranged and graphed over time, thereby judging deterioration over time in the function of the heat treatment device. Was possible.
Japanese Patent Laid-Open No. 2002-25997 (first page, FIG. 1 etc.)

  However, in the conventional information processing apparatus, it is difficult to superimpose and display or compare values obtained from the semiconductor manufacturing apparatus with different value units and value widths. For example, even if the value of the internal temperature acquired from the semiconductor manufacturing apparatus and the value of the power of the heater in the semiconductor manufacturing apparatus are simply overlapped and displayed on a graph or the like, each unit is different, It is difficult to compare the two accurately.

  In addition, for values with different units, etc., even if they are applied, the values obtained will vary depending on how each unit is taken. I can't.

  For this reason, it is conceivable to perform so-called standardization on the values acquired from the semiconductor manufacturing apparatus. The standardization is to convert the value unit or the like into a value that is not affected by how to obtain the unit, for example, by making the average value or standard deviation a specific value. By performing such standardization, it is possible to compare information with different units, or to analyze using multivariate analysis. In general, standardization is performed such that the average value is 0 and the standard deviation is 1. Specifically, this standardization is performed by calculating “(value indicating state−average value) / standard deviation” for each value indicating the state of the semiconductor manufacturing apparatus acquired from the semiconductor manufacturing apparatus. Done.

  However, such conventional standardization is effective when the data is normally distributed, but has a problem that it is not suitable as a process when the data is not normally distributed.

  For example, consider the case where multivariate analysis is performed for state values of different scales. In general, in multivariate analysis, standardization is performed as preprocessing so as not to be affected by units or the like. At this time, it is assumed that most of the state values are concentrated in the vicinity of a certain fixed value and only one value is a value far from the fixed value. In this case, even if the one value obtained from the semiconductor manufacturing apparatus is a value belonging to the range of normal values, if standardization using the standard deviation as described above is performed, many values are obtained. As a result of the variable analysis, there is a problem that the value may be determined to be significantly different from others.

  In addition, when the values obtained by standardizing the values of different scales as described above are displayed and compared in a graph or the like, the values of the different scales themselves are not affected by the scale. However, if threshold values and the like are set for each value, even if the above-described standardization processing is performed on these threshold values and the like, the threshold values are different from each other. For this reason, the values obtained by standardizing the values of different scales must be evaluated using different threshold values as a result, and it cannot be said that the comparison between the state values has become sufficiently easy. There was a problem that the effect that was done was not obtained.

  As described above, conventionally, there has been a problem that it is not possible to convert different values such as units into appropriate values that do not depend on a scale and are suitable for multivariate analysis, data analysis such as comparison of values, and the like. It was.

  An information processing apparatus according to the present invention is an information processing apparatus that processes a state value that is a value related to a state during processing of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor, and is a state value that receives the state value A reception unit, a reference value storage unit that can store a reference value that is a reference value of the state value, and a threshold that is a value used to determine whether the state value is a desired value are stored. A threshold value storage unit, a calculation unit that calculates a ratio between a value related to the difference between the state value received by the state value reception unit and the reference value, and a value related to the difference between the threshold value and the reference value; And an output unit that outputs the ratio calculated by the calculation unit.

  With this configuration, the state value can be converted into a ratio using the threshold value and the reference value, and can be converted into a value suitable for analysis and the like that does not depend on the scale. Moreover, since the ratio is converted into a ratio in consideration of the relationship between the condition value and the threshold, the state value can be evaluated with the same threshold without depending on the scale. Thereby, there exists an effect which can analyze a state value etc. easily.

  Further, in the information processing apparatus according to the present invention, in the information processing apparatus, the state value receiving unit receives a plurality of state values having different scales, and the calculation unit corresponds to each of the plurality of state values having different scales. The ratio is calculated, and the output unit is an information processing apparatus that outputs a plurality of ratios calculated by the calculation unit.

  With this configuration, state values of different scales such as units can be converted into a ratio using a threshold value and a reference value, and can be converted into values suitable for analysis and the like that do not depend on the scale. In addition, since the ratio is converted into a ratio in consideration of the relationship between the condition value and the threshold value, values having different scales can be evaluated with a common threshold value. Thereby, there is an effect that it is possible to easily analyze the state values of different scales.

  The information processing apparatus according to the present invention is an information processing apparatus that processes a state value that is a value related to a state at the time of processing of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor. A state value receiving unit that receives a plurality of state values of different scales, a reference value storage unit that can store a reference value that is a reference value of the state value, and whether the state value is a desired value A threshold value storage unit that can store a threshold value that is a value used to determine whether or not, a value related to a difference between a plurality of state values of the scale received by the state value reception unit and the reference value, and the threshold value A calculation unit that calculates a ratio to a value related to a difference from the reference value, a multivariate analysis unit that performs multivariate analysis using a plurality of ratios calculated by the calculation unit, and an analysis by the multivariate analysis unit Output part that outputs the result It is an information processing apparatus for Bei.

  With this configuration, state values of different scales such as units can be converted into a ratio using a threshold value and a reference value, and can be converted into values suitable for analysis and the like that do not depend on the scale. By performing multivariate analysis using the converted state value, an appropriate analysis result considering the threshold value can be obtained regardless of whether or not the state value is normally distributed.

  In the information processing apparatus of the present invention, in the information processing apparatus, the threshold used by the calculation unit to calculate the ratio is a range of values that can be taken by the state value divided into two ranges by the reference value. The information processing apparatus is a value within a range to which the state value belongs.

  With this configuration, the state value can be evaluated with a common threshold without depending on the scale, or appropriate multivariate analysis can be performed in consideration of the threshold.

  The information processing apparatus according to the present invention is the information processing apparatus, wherein the state value is a measured value of a temperature in the semiconductor manufacturing apparatus or a value obtained by statistically processing the measured value.

  With this configuration, it is possible to easily analyze the state value.

  The information processing apparatus according to the present invention is the information processing apparatus, wherein the state value is a measured value of pressure in the semiconductor manufacturing apparatus or a value obtained by statistically processing the measured value.

  With this configuration, it is possible to easily analyze the state value.

  Further, the information processing apparatus according to the present invention is the information processing apparatus, wherein the state value is a measured value of a gas flow rate introduced into the semiconductor manufacturing apparatus or a value obtained by statistically processing the measured value. is there.

  With this configuration, it is possible to easily analyze the state value.

  In the information processing apparatus of the present invention, in the information processing apparatus, the plurality of state values having different scales include a measured value of the temperature in the semiconductor manufacturing apparatus and a measured value of the pressure in the semiconductor manufacturing apparatus, or These are information processing apparatuses which are statistically processed values.

  With this configuration, there is an effect that the state value can be easily analyzed.

  Further, in the information processing apparatus of the present invention, in the information processing apparatus, the plurality of state values having different scales are further subjected to statistical processing on the measured value of the gas flow rate introduced into the semiconductor manufacturing apparatus or the measured value An information processing apparatus including a value.

  With this configuration, there is an effect that the state value can be easily analyzed.

  The semiconductor manufacturing system of the present invention is a semiconductor manufacturing system including a semiconductor manufacturing apparatus for processing a processing object including a semiconductor, and the information processing apparatus, wherein the semiconductor manufacturing apparatus has the state value. A semiconductor manufacturing system including a processing state value acquisition unit to be acquired and a processing output unit for outputting the state value.

  With this configuration, it is possible to easily analyze the state value.

  In the semiconductor manufacturing system of the present invention, in the semiconductor manufacturing system, the semiconductor manufacturing apparatus includes a processing container for processing the processing object, and one or more temperature detection units for detecting the temperature in the processing container. Further, the processing state value acquisition unit is a semiconductor manufacturing system that acquires a state value that is a temperature value detected by the temperature detection unit.

  With this configuration, it is possible to easily analyze the temperature of the semiconductor manufacturing apparatus.

  Moreover, the semiconductor manufacturing system of the present invention is the semiconductor manufacturing system, wherein the semiconductor manufacturing apparatus further includes a processing container for processing the object to be processed and a pressure detection unit for detecting the pressure in the processing container. The processing state value acquisition unit is a semiconductor manufacturing system that acquires a state value that is a pressure value detected by the pressure detection unit.

  With this configuration, pressure analysis and the like can be easily performed.

  In the semiconductor manufacturing system of the present invention, in the semiconductor manufacturing system, the semiconductor manufacturing apparatus detects a processing container that performs processing on the processing object, and a gas flow rate detection that detects a gas flow rate introduced into the processing container. The processing state value acquisition unit is a semiconductor manufacturing system that acquires a value of the gas flow rate detected by the gas flow rate detection unit or a state value that is a statistically processed value.

  With this configuration, it is possible to easily analyze the gas flow rate.

  According to the information processing apparatus and the like according to the present invention, it is possible to convert values having different scales such as units into values suitable for analysis and the like that do not depend on scales.

  Hereinafter, embodiments of an information processing apparatus and the like will be described with reference to the drawings. In addition, since the component which attached | subjected the same code | symbol in embodiment performs the same operation | movement, description may be abbreviate | omitted again.

(Embodiment)
FIG. 1 is a diagram showing a configuration of an information processing system in the present embodiment. The semiconductor manufacturing system includes an information processing apparatus 100 and a semiconductor manufacturing apparatus 200. The semiconductor manufacturing apparatus 200 performs processing on a processing object including a semiconductor. Here, the semiconductor manufacturing apparatus 200 is a heat treatment apparatus that performs processing including heat treatment, and the case where the processing target is a semiconductor wafer will be described as an example. However, the semiconductor manufacturing apparatus 200 is a processing target including a semiconductor. The processing performed on the object may be any processing. That is, the configuration of the present invention can be applied even when the semiconductor manufacturing apparatus 200 is other than a heat treatment apparatus or when the object to be processed is a semiconductor containing semiconductor other than a semiconductor wafer, such as a semiconductor chip. Here, the information processing apparatus 100 and the semiconductor manufacturing apparatus 200 are connected by a network such as the Internet or a LAN, a dedicated signal line, or the like so that information can be input and output.

  The information processing apparatus 100 includes a state value receiving unit 101, a reference value storage unit 102, a threshold value storage unit 103, a calculation unit 104, and an output unit 105.

  The state value receiving unit 101 receives a state value that is a value acquired for the state of the semiconductor manufacturing apparatus 200 during processing. “Accept” is to acquire or receive an input or the like. Here, the “state value” is a value acquired when the semiconductor manufacturing apparatus 200 is performing a desired process. The “value acquired regarding the processing state” is an acquirable value and may be any value as long as it can indicate the processing state of the semiconductor manufacturing apparatus 200. Specifically, the measurement value acquired at the time of processing from the semiconductor manufacturing apparatus 200 itself or the internal environment of the semiconductor manufacturing apparatus 200, the calculated value calculated using this measurement value, or the semiconductor manufacturing apparatus 200 is The value controlled by. Moreover, the value which statistically processed the measured value etc. may be sufficient. For example, the state value is a measured value of the temperature in the semiconductor manufacturing apparatus 200 at the time of processing, specifically, a value obtained by measuring the temperature at a desired position in the processing container 211 using a temperature sensor or the like, A value obtained by measuring the pressure (atmospheric pressure) using the pressure detector 217 or the like, a power value of a heater for heating the inside of the semiconductor manufacturing apparatus 200 measured by a power meter, an average value or a maximum value of these measured values , Minimum value, standard deviation, etc. The state value may be, for example, a heater power value calculated from a voltage, current, or the like output from the semiconductor manufacturing apparatus to the internal heater during processing. The state value received by the state value receiving unit 101 may be a plurality of state values with different scales. The scale described here is a unit of state value, 0 point, or the like. The plurality of state values having different scales are, for example, a measured value of the temperature in the semiconductor manufacturing apparatus 200, a power value of a heater for heating the inside of the semiconductor manufacturing apparatus 200, and a pressure (atmospheric pressure) in the semiconductor manufacturing apparatus 200. Value etc. It does not matter how the state value receiving unit 101 receives the state value. For example, the state value receiving unit 101 may receive and receive a state value transmitted from another device or the like via a communication line or the like, or may read a state value recorded on a recording medium or the like. . Further, the state value receiving unit 101 may receive a state value input by an input unit such as a numeric keypad, a keyboard, a mouse, or a menu screen. Further, the state value receiving unit 101 may store the received state value in a memory or the like (not shown). The state value receiving unit 101 is a device that reads information from a device driver for input means such as a numeric keypad or a keyboard, control software for a menu screen, a driver for a communication device, a memory card reader, a recording medium such as a CD drive, etc. It can be realized with a driver or the like.

The reference value storage unit 102 can store a reference value that is a value serving as a reference for the state value. The value serving as a reference for the state value may be a value that can be used as a reference for comparing the state values. The reference value is, for example, a target value that is a control target for the state value. This reference value may be, for example, a set value for setting a value to be a control target of the state value used when controlling the semiconductor manufacturing apparatus 200, or the semiconductor manufacturing apparatus 200 may be set normally by a desired setting. It may be an actual value of the state value obtained when controlled, an average value of the actual value, or the like. The reference value may be an average value, a minimum value, a maximum value, or the like of two or more state values obtained when the semiconductor manufacturing apparatus 200 performs a desired process with a desired setting.
The reference value storage unit 102 is preferably a non-volatile recording medium, but can also be realized by a volatile recording medium.

  The threshold storage unit 103 can store a threshold that is a value used to determine whether or not the state value is a desired value. The “desired value” is a value indicating that the semiconductor manufacturing apparatus 200 is normal or abnormal, a desired process is normally performed by the semiconductor manufacturing apparatus 200, or is not performed normally. It is a value indicating that this is the case. Specifically, the threshold value is an upper limit value or a lower limit value indicating a range of values indicating that the state value is a desired value. Further, the threshold storage unit 103 may have a threshold that is an upper limit and a threshold that is a lower limit. This threshold is normally set for each state value with a different scale. Further, it is set according to the processing conditions of processing performed by the semiconductor manufacturing apparatus 200. The “determination as to whether or not the state value is a desired value” is, for example, a determination as to whether or not the state value is a value greater than or equal to a threshold, whether or not the value is less than the threshold, This is a determination as to whether or not the value is within a range defined by two threshold values. By making such a determination, specifically, it is possible to determine whether or not the semiconductor manufacturing apparatus 200 is normal, whether or not a desired process is normally performed, based on the state value. Become. Such a threshold value is set in advance according to the design of the semiconductor manufacturing apparatus 200, an experiment using the semiconductor manufacturing apparatus 200, a simulation, and the like, and is accumulated in the threshold value storage unit 103. If the threshold value is an upper limit value and a lower limit value, the reference value is usually set to a value between them. The threshold storage unit 103 is preferably a non-volatile recording medium, but can also be realized by a volatile recording medium.

  The calculation unit 104 calculates a ratio between a value related to the difference between the state value received by the state value receiving unit 101 and the reference value and a value related to the difference between the threshold value and the reference value. Here, the calculation unit 104 reads the reference value from the reference value storage unit 102 and the threshold value from the threshold storage unit 103 as appropriate. The “value relating to the difference between the state value and the reference value” is usually the difference between the state value and the reference value, but may be an absolute value of this difference. Further, if the ratio value finally calculated is not changed, a value obtained by performing a desired calculation, for example, multiplication of a predetermined value, etc., on the difference between the state value and the reference value, It may be a value related to a difference between the state value and the reference value. Further, a difference between the state value and the reference value may be finely adjusted by adding a desired value or the like as necessary. The “value relating to the difference between the threshold value and the reference value” is usually the difference between the threshold value and the reference value, but may be an absolute value of this difference. Further, if the finally calculated ratio value is not changed, a value obtained by performing a desired operation such as multiplication of a predetermined value on the difference between the threshold value and the reference value is set as the threshold value. It may be a value related to the difference between the reference value and the reference value. Further, a difference between the threshold value and the reference value may be finely adjusted by adding a desired value or the like as necessary. Further, if the state value received by the state value receiving unit 101 is a plurality of state values having different scales, the calculation unit 104 corresponds to the plurality of state values received by the state value receiving unit and different state values. A ratio between a value related to the difference from the reference value and a value related to the difference between the threshold corresponding to the state value and the reference value is calculated. Assuming that the ratio described here is R, the ratio R is specifically defined by the following equation.

  This ratio may be displayed as a percentage or the like as necessary. Further, when the ratio R is always a positive value, for example, when the magnitude of the ratio is obtained, the following expression (2) in which the absolute value of the denominator of the above expression (1) is omitted is used. May be.

  Here, when there are two threshold values, for example, when there are two threshold values for setting an upper limit value and a lower limit value for setting a desired range, the calculation unit 104 has two threshold values according to the reference value described above. Of the range of values that can be taken by the state value, a threshold value that is a value within the range to which the state value belongs is acquired from the threshold storage unit 103, and this threshold value is used for the calculation of the ratio. Specifically, if the state value is larger than the reference value, a threshold value larger than the reference value is read from the threshold storage unit 103, and the difference between the threshold value and the reference value is calculated in the above-described ratio calculation. Use. If the state value is smaller than the reference value, a threshold smaller than the reference value is read from the threshold storage unit 103, and the difference between the threshold and the reference value is used for the above-described ratio calculation. If the state value is the same value as the reference value, either threshold value may be used. The calculation unit 104 can usually be realized by an MPU, a memory, or the like. The processing procedure of the calculation unit 104 is usually realized by software, and the software is recorded on a recording medium such as a ROM. However, it may be realized by hardware (dedicated circuit).

  The output unit 105 outputs the ratio calculated by the calculation unit 104. When the state values received by the state value receiving unit 101 are a plurality of state values with different scales, the calculation unit 104 outputs a plurality of calculated ratios for the state values with different scales. The output described here is a concept including display on a display, printing on paper by a printer, transmission to an external device, temporary storage in a storage medium such as a memory, and the like. For example, the output unit 105 displays the ratio calculated by the calculation unit 104 as a graph on a display or the like. In addition, ratios calculated using a plurality of state values with different scales may be displayed in a superimposed manner on a graph. The output unit 105 may or may not include an output device such as a display or a printer. The output unit 105 can be implemented by output device driver software, or output device driver software and an output device.

  The semiconductor manufacturing apparatus 200 includes a processing container 211. The processing vessel 211 may be called a reaction vessel or a reaction furnace. The processing vessel 211 accommodates a semiconductor wafer 250 as a processing target and performs a predetermined heat treatment, for example, a CVD (Chemical Vapor Deposition) process, and is a material having heat resistance and corrosion resistance, for example, quartz. It is made of glass. The processing vessel 211 has a single tube structure with an open upper end and a lower end, and the upper end is narrowed to a small diameter to form an exhaust part 212. The exhaust unit 212 is connected to a vacuum pump (not shown) or the like via the pressure adjustment unit 216. The pressure adjusting unit 216 includes a pressure adjusting valve and the like, and controls the pressure in the processing container 211 by driving the valve and opening and closing the valve under the control of the control unit 201 described later. Further, the processing container 211 includes a pressure detection unit 217 for detecting the pressure (atmospheric pressure) in the processing container 211. The pressure detector 217 detects the pressure and outputs an electrical signal corresponding to the detected temperature. The pressure detection unit 217 is specifically a pressure sensor, and any structure may be used as long as the pressure can be detected.

  A gas introduction part 213 for introducing a processing gas or an inert gas into the processing container 211 is disposed below the processing container 211. A plurality of gas supply pipes 214 leading to the gas source are inserted into the gas introduction part 213. The processing gas introduced from the gas introduction unit 213 rises in the processing vessel 211 and is subjected to a predetermined heat treatment of the semiconductor wafer 250, and is then exhausted from the exhaust unit 212. The pipe 214 is provided with a gas flow rate detection unit 218 that detects the flow rate of the gas introduced into the processing container 211 from the gas introduction unit 213. As the gas flow rate detection unit 218, a mass flow rate controller (mass flow controller) provided for controlling the gas flow rate in a general semiconductor manufacturing apparatus may be used. Such a mass flow rate controller can usually detect a gas flow rate and output the detected measurement value or the like.

  A lower end portion 215 formed in a flange shape of the processing vessel 211 is opened and closed by a lid 221 formed of a material having heat resistance and corrosion resistance such as stainless steel. The lid 221 is lifted and lowered by an elevator (not shown), seals the lower end 215 of the processing container 211 at the raised position, and opens the lower end 215 of the processing container 211 at the lowered position.

  An O (O) ring 222 for ensuring airtightness is disposed between the lower end 215 of the processing container 211 and the lid 221.

  At the center of the lid 221, a rotating column 223 is erected in a rotatable manner, and a rotating table 224 is fixed to the upper end of the rotating column 223.

  In addition, a drive unit 225 that rotationally drives the rotary column 223 is provided below the lid 221.

  On the turntable 224, for example, a quartz glass boat 226 capable of mounting 60 semiconductor wafers 250 at a predetermined interval in the height direction, a so-called semiconductor wafer boat is mounted. The boat 226 is placed on the rotary table 224 with the lid body 221 lowered, and when the lid body 221 rises and seals the lower end 215 of the processing container 211, the loading into the processing container 211 is completed. After the processing is completed, the lid 221 is unloaded by dropping. Further, during the process, the semiconductor wafer 250 is rotated by the rotation of the rotary table 224 by the driving unit 225, and the semiconductor wafer 250 is subjected to uniform heat treatment.

  Around the processing vessel 211, a heating furnace 230 is provided that includes one or more heaters 231 that are heating means for heating and heating the semiconductor wafer 250 accommodated in the processing vessel 211 from the periphery. The heater 231 is disposed along the periphery of the processing container 211. The heater 231 has, for example, a resistance heating element, and generates heat when electric power is supplied. As the resistance heating element, it is preferable to use a carbon wire or the like having excellent temperature rising / falling characteristics. However, the structure of the heater 231 does not matter. Here, as an example, the case where one or more heaters 231 are five heaters 231a to 231c is shown, but the number of heaters is not limited. The heaters 231 a to 231 c are arranged along the parallel direction of the semiconductor wafer 250. Moreover, the arrangement | positioning location of heater 231a-231c is not ask | required.

  One or more temperature detection units 241 are provided along the outer peripheral surface of the processing container 211. Here, as an example, the case where one or more temperature detection units 241 are three temperature detection units 241a to 241c is described, but the number of temperature detection units 241 is not limited. Here, the three temperature detectors 241a to 241c are arranged in a line in the vertical direction, but the heater arrangement location is not limited. The temperature detectors 241a to 241c detect the temperature and output an electrical signal corresponding to the detected temperature. The temperature detection units 241a to 241c are specifically temperature sensors, and any structure such as a thermocouple may be used as long as the temperature can be detected. In addition, arrangement | positioning of the temperature detection parts 241a-241c is not ask | required. The outputs of the temperature detection units 241a to 241c are used for predicting the surface temperature of the semiconductor wafer 250 arranged in the boat 226, as will be described later.

  The semiconductor manufacturing apparatus 200 further includes a control unit 201, a processing state value acquisition unit 202, and a processing output unit 203.

  The control unit 201 controls various operations of the semiconductor manufacturing apparatus 200 in accordance with setting values for setting processing conditions for processing objects set in advance. For example, when the processing temperature is set, the control unit 201 performs so-called feedback control on the output of the heater 231 in accordance with the temperature detected by the one or more temperature detection units 241 to change the temperature in the processing container 211. Control the temperature to be set according to the set value. Further, the control unit 201 performs so-called feedback control of the pressure adjustment unit 216 in accordance with the pressure detected by the pressure detection unit 217 so as to control the pressure in the processing container 211 to a pressure set by the set value. To do. For example, such control may be performed using the reference value stored in the reference value storage unit 102 described above as a control target value. The control unit 201 also controls the entire semiconductor manufacturing apparatus 200 other than this, for example, control of gas flow rate, control of valve opening / closing, control of boat elevator, etc., but these controls are known techniques. The description is omitted here. The control unit 201 can be usually realized by an MPU, a memory, or the like. The processing procedure of the control unit 201 is usually realized by software, and the software is recorded on a recording medium such as a ROM. However, it may be realized by hardware (dedicated circuit).

  The processing state value acquisition unit 202 acquires a state value that is a value related to a state during processing of the semiconductor manufacturing apparatus 200. This state value is usually the same value as the state value received by the state value receiving unit 101 described above. The state value is, for example, a temperature value detected by each temperature detection unit 241, that is, a temperature measurement value or a power value of each heater 231. For example, the processing state value acquisition unit 202 uses a temperature value corresponding to this signal from a signal output as a result of the temperature detection unit 241 detecting the temperature when performing a predetermined process on the processing object. Get a state value. The state value may be, for example, a pressure value detected by the pressure detection unit 217, that is, a pressure measurement value. The processing state value acquisition unit 202 acquires a state value that is the power value of the heater 231 controlled by the control unit 201, or acquires a state value that is the power value of the heater 231 from a power detection value of a power meter (not shown). May be. Here, the case where the output of the temperature detection unit 241 is once input to the control unit 201 and the output of the temperature detection unit 241 is output from the control unit 201 to the processing state value acquisition unit 202 will be described. The unit 202 may directly receive the output of the temperature detection unit 241. In this case, the processing state value acquisition unit 202 may output the input received by the processing state value acquisition unit 202 to the control unit 201 as appropriate. The processing state value acquisition unit 202 can be usually realized by an MPU, a memory, or the like. The processing procedure of the processing state value acquisition unit 202 is usually realized by software, and the software is recorded on a recording medium such as a ROM. However, it may be realized by hardware (dedicated circuit).

  The process output unit 203 outputs the state value acquired by the process state value acquisition unit 202. Here, as an example, a case will be described in which the processing output unit 203 transmits the state value acquired by the processing state value acquisition unit 202 to the state value reception unit 101 of the information processing apparatus 100. In addition, the timing, trigger, etc. which output a state value from the process output part 203 to the state value reception part 101 are not ask | required. For example, each time the processing state value acquisition unit 202 acquires a value related to a state at the time of processing, the processing output unit 203 may output a state value, or after a plurality of values are temporarily stored in a storage medium such as a memory, You may make it output. In addition, when an instruction to output a state value is received from the information processing apparatus 100, the state value may be output. The output described here is a concept including transmission to an external device, accumulation in a recording medium such as a memory, and the like. The processing output unit 203 may be considered as including or not including an output device such as a communication device. The processing output unit 203 can be realized by output device driver software, or output device driver software and an output device.

  Next, the operation of the information processing apparatus 100 will be described using the flowchart of FIG. Here, for convenience of explanation, a plurality of state values transmitted from the semiconductor manufacturing apparatus 200 and the like, which have the same scale acquired at different times, specifically, a plurality of units having the same unit and 0 point. A case where the information processing apparatus 100 receives the state value will be described. These state values are, for example, a plurality of state values with the same scale acquired by the semiconductor manufacturing apparatus 200 at different times when the semiconductor manufacturing apparatus 200 performs a desired process with the same setting in advance. . It is assumed that each of the plurality of state values is associated with information on the time when each is acquired. Here, it is assumed that a value that is a control target of the state value is set in advance as the reference value. Further, there are a first threshold value that is an upper limit value and a second threshold value that is a lower limit value for setting a range of state value values when processing of the semiconductor manufacturing apparatus 200 or the like is normally performed. The case where it is stored in the threshold storage unit 103 in advance will be described. The reference value is assumed to be a value between the first threshold value and the second threshold value.

  (Step S201) The state value receiving unit 101 receives a plurality of state values output from the semiconductor manufacturing apparatus 200 or the like. The received state value is stored in a storage medium such as a memory (not shown).

  (Step S <b> 202) The calculation unit 104 acquires a reference value stored in advance from the reference value storage unit 102.

  (Step S <b> 203) The calculation unit 104 acquires a threshold value stored in advance from the threshold value storage unit 103. Here, the calculation unit 104 acquires a first threshold value and a second threshold value.

  (Step S204) The calculation unit 104 substitutes 1 for the counter K.

  (Step S205) The calculation unit 104 acquires the Kth state value. Here, the state value receiving unit 101 acquires the Kth state value from the state values accumulated in a memory (not shown) or the like, counting from the earliest time acquired by the semiconductor manufacturing apparatus 200 or the like.

  (Step S206) The calculation unit 104 determines whether or not the state value is greater than or equal to a reference value. If it is greater than or equal to the reference value, the process proceeds to step S207, and if it is less than the reference value, the process proceeds to step S211. Instead of determining whether or not the state value is greater than or equal to the reference value, it may be determined whether or not the state value is above the reference value.

  (Step S207) The calculation unit 104 substitutes the first threshold acquired in Step S203 for the threshold of Expression (1) described above, and acquires the state value and the reference value of Expression (1) in Step S205, respectively. The ratio R is calculated by substituting the Kth state value and the reference value acquired in step S202. The calculated ratio R is accumulated in a storage medium such as a memory (not shown).

  (Step S208) The calculation unit 104 increments the counter K by 1.

  (Step S209) The calculation unit 104 determines whether there is a Kth state value. If there is, the process returns to step S205, and if not, the process proceeds to step S210.

  (Step S210) The output unit 105 reads the ratio R calculated by the calculation unit 104 from a memory or the like and outputs it. For example, the output unit 105 displays the ratio R as a graph. Then, the process ends.

  (Step S211) The calculation unit 104 substitutes the second threshold acquired in Step S203 for the threshold of Expression (1) described above, and acquires the state value and the reference value of Expression (1) in Step S205, respectively. The ratio R is calculated by substituting the Kth state value and the reference value acquired in step S202. The calculated ratio R is accumulated in a storage medium such as a memory (not shown).

  In the flowchart of FIG. 2, the above processing may be performed by representing a reference value, a threshold value, a plurality of state values acquired in one time, and the like by a matrix or the like. For example, when using a plurality of values obtained from the power values of the plurality of heaters 231 in the semiconductor manufacturing apparatus 200 or the temperatures acquired by the plurality of temperature detection units 241 as the state value, the state value is the heater. It may be represented by a matrix of the number of elements according to the number of 231 and the number of temperature detection units 241. In this case, for example, processes such as step S207 and step S211 are performed by matrix calculation.

  In addition, although the case where a state value with the same scale is used has been described here, a state value with the same scale is used when a state value with a different scale is used, for example, in the case of a state value with a different state value. After performing the processing for obtaining the ratio, the same processing may be performed using state values of different scales. For example, in step S201, when it is possible to accept state values with different scales, it is determined whether or not there are state values with different scales after processing for the state values of one scale according to the above flowchart. If there are state values with different scales, for example, the process returns to step S202 and the like, and a reference value and a threshold value corresponding to the scales are acquired, and the same processing as in the above flowchart may be repeated.

  In the flowchart of FIG. 2, the process is terminated by powering off or a process termination interrupt.

  Note that the operation of the semiconductor manufacturing apparatus 200 for performing a desired process and the operation of acquiring the state value in the semiconductor manufacturing system are well-known techniques, and thus description thereof is omitted.

  Hereinafter, a specific operation of the semiconductor manufacturing system in the present embodiment will be described. A conceptual diagram of the semiconductor manufacturing system is shown in FIG. Here, it is assumed that the information processing apparatus 100 is realized by the computer 10 as an example. In addition, the control unit 201, the processing state value acquisition unit 202, and the processing output unit 203 of the semiconductor manufacturing apparatus 200 are realized by the control computer 20 that is a part of the semiconductor manufacturing apparatus 200 as an example here. Shall. Note that the setting values and state values used here are values prepared for explanation, and are different from actual measurement values obtained when the semiconductor manufacturing apparatus 200 actually performs desired processing. To do.

  Here, as a specific example, it is assumed that the semiconductor manufacturing apparatus 200 is a heat treatment apparatus. In addition, the semiconductor manufacturing apparatus 200 repeats predetermined processing for the semiconductor wafer in batch units with the same processing setting, and the average value of the temperatures detected by the temperature detection unit 241a in the period in which the processing temperature is stable for each batch. The state value receiving unit 101 acquires the first state value that is and the second state value that is the average value of the pressure in the processing container 211 detected by the pressure detection unit 217. The unit of temperature, which is the first state value, is degrees (° C.), and the unit of pressure, which is the second state value, is Pascal (Pa). As described above, the first state value and the second state value are values having different scales, here, units. Then, the first state value and the second state value acquired by the processing state value acquisition unit 202 are temporarily accumulated by the processing output unit 203, and the plurality of accumulated first state values and the second state value are stored. It is assumed that the status value is transmitted from the processing output unit 203 to the information processing apparatus 100.

  In addition, in the reference value storage unit 102, a target value for controlling the temperature, which is the first state value, and a target value for the pressure in the processing container 211, which is the second state value, are respectively stored in the first value. It is assumed that the state value reference value and the second state value reference value are stored in advance. These target values are reference values. Further, the threshold storage unit 103 includes a temperature that is a first state value and a pressure in the processing container 211 that is a second state value when normal processing is performed by the semiconductor manufacturing apparatus 200. A threshold value that is an upper limit value for setting each range (hereinafter referred to as a first threshold value) and a threshold value that is a lower limit value (hereinafter referred to as a second threshold value) are respectively stored. To do. The reference value described above is located between the first threshold value and the second threshold value.

  First, the semiconductor manufacturing apparatus 200 performs predetermined processing, and the processing state value acquisition unit 202 acquires the temperature and pressure during processing, respectively. Then, the processing state value acquisition unit 202 calculates the average temperature value and the average pressure value in one batch. The calculated average value of the temperatures, that is, the first state value, and the average value of the pressure, that is, the second state value, are temporarily stored in a memory or the like (not shown) by the processing output unit 203. This process is repeated for a plurality of batches.

  The process output unit 203 transmits the plurality of accumulated first state values and second state values to the information processing apparatus 100. There is no limitation on the timing or trigger for performing this transmission, but here, an instruction requesting the first state value and the second state value is received from the information processing apparatus 100, and the instruction is stored for this. A plurality of first state values and second state values are transmitted to the information processing apparatus 100.

  The state value receiving unit 101 receives a plurality of batches of an average temperature value that is the first state value and an average pressure value that is the second state value. The state value receiving unit 101 temporarily stores the received first state value and second state value in a memory or the like.

FIG. 4 is a graph showing the first state value received by the state value receiving unit 101. In the figure, the horizontal axis represents time, here, the number of batches, and the vertical axis represents the first state value, that is, the average value of the temperatures detected by the temperature detector 241a. Further, T _S is the reference value of the first state value, T _H is a first threshold value of the first state value, is T _L and the second threshold value of the first state value. If the first state value exists between the first threshold value _TH and the second threshold value _TL , it can be determined that the processing by the semiconductor manufacturing apparatus 200 has been performed normally.

FIG. 5 is a graph showing the second state value received by the state value receiving unit 101. In the figure, the horizontal axis indicates time, here the number of batches, and the vertical axis indicates the second state value, that is, the average value of the pressure detected by the pressure detector 217 (not shown). Also, P _S is the reference value of the second state value, P _H is the first threshold value of the second state value, the P _L and the second threshold value of the second state value. Long as it second state value is present between the first threshold value P _H and the second threshold value P _L, the processing by the semiconductor manufacturing device 200 can be determined to have been normally performed.

Then, calculating unit 104, a reference value T _S corresponding to the first state value and a first threshold value T _H and the second threshold value T _L, the reference value storage unit 102, a threshold storage unit 103 read out. Then, for each of the first state values received by the state value receiving unit 101, the calculation using the above-described equation (1) is performed to obtain the ratio R. Here, the ratio R calculated with respect to the first state value and the ratio R _1. In addition, the information which shows Formula (1) mentioned above shall be previously stored in storage media, such as memory which is not shown in figure.

Similarly, calculator 104, and the reference value P _S corresponding to the second state value and a first threshold value P _H and the second threshold value P _L, a reference value storage unit 102, the threshold value storage unit Read from 103. Then, for each of the second state values received by the state value receiving unit 101, the calculation using the above-described equation (1) is performed to obtain the ratio R. Here, the ratio R calculated with respect to the second state value and the ratio R _2.

The output unit 105 superimposes the graph of the ratio R ₁ calculated for the _first state value and the ratio R ₂ calculated for the second state value so that the respective 0 points coincide. indicate.

FIG. 6 is a display example of a graph in which the ratio R ₁ and the ratio R ₂ are superimposed on the display 110 or the like of the information processing apparatus 100. In the figure, the horizontal axis represents time, here the number of batches, and the vertical axis represents the ratio R. Here, the ratio R1 and the ratio R2 are displayed in a superimposed manner, but may not be displayed in a superimposed manner.

  In this specific example, a value obtained by subtracting a reference value that is a target value of each control from a first state value and a second state value in different units, and a first state value and a second state value, respectively. A value obtained by subtracting the reference value from the corresponding threshold value is obtained, and the ratio thereof is calculated. For this reason, when the state value matches the reference value, the value (ratio) obtained is always 0, and the state value is a value between the first threshold value and the second threshold value. The obtained value (ratio) is a value between -1 and 1. That is, the first threshold value and the second threshold value are set to 1 and -1, which are common threshold values. As a result, regardless of differences in the scale of units, etc., different state values can be overlapped so that the reference values match and can be easily compared without depending on the unit, or by using a common threshold It is possible to monitor abnormalities in processing of the apparatus 200 and the like. For example, in the above specific example, if the output value is greater than 1 or smaller than −1 regardless of which state value corresponds to the state value, the state value corresponding to that value Can be determined to be larger than the first threshold value or smaller than the second threshold value, and it can be determined that an abnormality has occurred in the processing of the semiconductor manufacturing apparatus 200. Therefore, it is possible to monitor whether or not the processing of the semiconductor manufacturing apparatus is normally performed using a control chart having a single integrated graph, and the semiconductor manufacturing apparatus can be easily monitored. It becomes possible.

  Here, when the graph of the first state value shown in FIG. 4 and the graph shown in FIG. 5 are simply overlapped so that the respective reference values overlap with each other while ignoring the unit, etc. It becomes a graph like this. However, in such a graph, each state value has a different threshold value. For this reason, even if the second state value is equal to or lower than the first threshold value of the second state value, the second state value is smaller than the first threshold value of the first state value. If the state value is a large value, if the state value is insufficiently determined to be the first state value or the second state value, the second state value is a value outside the normal value range. There is a risk that the user will make a wrong decision. For this reason, it is necessary to carefully monitor whether the state value is the first state value or the second state value, which increases the burden on the user necessary for monitoring. For this reason, it is not possible to easily compare or monitor state values of different scales as in the above specific example.

  In the above specific example, the case of using state values of two different scales has been described. However, the present embodiment can be applied to the case of using state values of three or more different scales.

  For example, in addition to the average value of the temperature that is the first state value and the average value of the pressure that is the second state value described in the above specific example, it is introduced into the processing container 211 of the semiconductor manufacturing apparatus 200. The case where the third state value that is the average value of the gas flow rate of the processing gas or the like is used will be described below.

  First, the state value acquisition unit 202 acquires a gas flow rate of a processing gas or the like when the semiconductor manufacturing apparatus 200 performs a predetermined process, like the above-described temperature, and then calculates the average value. The average value of the gas flow rate is the third state value. Then, the process output unit 203 transmits the third state value together with the first state value and the second state value described above.

  The state value receiving unit 101 receives the gas flow rate that is the third state value transmitted together with the first state value and the second state value.

FIG. 8 is a graph showing the gas flow rate that is the third state value received by the state value receiving unit 101. In FIG. 8, the horizontal axis represents time, here the number of batches, and the vertical axis represents the average value of the gas flow rate per batch. As the value of the gas flow rate, for example, a measurement value of a mass flow controller (MFC) that controls the flow rate of the gas supplied to the gas introduction unit 213 of the semiconductor manufacturing apparatus 200 is used. _GS is a reference value for the third state value, _GH is a first threshold value for the third state value, and _GL is a second threshold value for the third state value. The reference value _{G S} is the reference value storage unit 102, The threshold _G H, _{G L} is the threshold value storage unit 103, and is stored in advance, respectively. If the third state value exists between the first threshold value _GH and the second threshold value _GL , it can be determined that the processing by the semiconductor manufacturing apparatus 200 has been performed normally.

Calculation unit 104, similarly to the first state value and the like, and the reference value G _S corresponding to the third state value and a first threshold value G _H and the second threshold value G _L, the reference value storage unit 102 and the threshold value storage unit 103. Then, for each of the third state values received by the state value receiving unit 101, the calculation using the above-described equation (1) is performed to obtain the ratio R. Here, the ratio R calculated for the third state value is defined as a ratio R ₃ .

The output unit 105 further includes a graph in which the ratio R ₁ calculated for the first state value and the ratio R ₂ calculated for the second state value as shown in FIG. the ratio R ₃ calculated against the third state value is displayed superimposed as 0 points coincide.

FIG. 9 is a display example of a graph in which the ratio R ₁ , the ratio R _2, and the ratio R ₃ are superimposed on the display 110 or the like of the information processing apparatus 100. In the figure, the horizontal axis represents time, here the number of batches, and the vertical axis represents the ratio R.

Even in such a case, when the third state value matches the reference value G _S , the value (ratio) always obtained is 0, and the third state value is the first threshold value G _When the value is between _H and the second threshold value _GL , the obtained value (ratio) is a value between −1 and 1. That is, the first threshold value and the second threshold value for the third state value are set to 1 and −1 which are the threshold values common to the first and second state values. As a result, regardless of differences in the scale of units, etc., different state values can be overlapped so that the reference values match and can be easily compared without depending on the unit, or by using a common threshold It is possible to monitor abnormalities in processing of the apparatus 200 and the like.

  As described above, according to the present embodiment, the ratio between the value related to the difference between the state value received by the state value receiving unit 101 and the reference value and the value related to the difference between the threshold value and the reference value are calculated. It is possible to convert values of different scales such as units into values that take into account the respective threshold values without depending on the scale. Thus, values suitable for analysis such as data comparison and monitoring can be obtained from state values in different units, and state values of different scales can be easily compared and monitored.

  In the present embodiment, when the state value receiving unit 101 receives two or more different state values, as shown in FIG. 10, a multivariate analyzing unit 106 is provided, and the output unit 105 is a calculating unit. Instead of outputting the calculated ratio of 104, the result of multivariate analysis by the multivariate analysis unit 106 may be output.

  The multivariate analysis unit 106 performs multivariate analysis using the calculation results of the calculation unit 104 for different state values of two or more scales. The analysis performed by the multivariate analysis unit 106 may be any analysis such as discriminant analysis using the Mahalanobis distance or multiple regression analysis. Note that details of the multivariate analysis are well-known techniques, and a description thereof will be omitted. The multivariate analysis unit 106 can usually be realized by an MPU, a memory, or the like. Information such as a multivariate analysis formula is usually stored in a storage medium such as a memory. The processing procedure of the multivariate analysis unit 106 is usually realized by software, and the software is recorded in a recording medium such as a ROM. However, it may be realized by hardware (dedicated circuit).

  As in the past, when the information obtained by standardizing the state value using the standard deviation is used for multivariate analysis, if the state value is not normally distributed, the result of multivariate analysis is Even if the state value that is significantly different from the value is actually a value within the range of normal values that can be taken from the state value, it is determined to be a value that is significantly different from other values. There is a possibility to be evaluated as it is.

  However, in the present embodiment, the state value is standardized in consideration of the threshold of the state value, not the standard deviation. Therefore, even if the state value is not normally distributed, as long as the state value that is significantly different from the other values is within the region that is determined to be normal by the threshold value, the value is determined as a result of multivariate analysis. It is possible to reduce the possibility of being determined to be a value significantly different from other values. Therefore, according to such a modification, it is possible to perform an appropriate multivariate analysis in consideration of the threshold value of each state value using state values having different units.

  In the above embodiment, the information processing apparatus 100 may be separated from the semiconductor manufacturing apparatus 200 and used alone. In this case, for example, the information processing apparatus 100 may receive data to be processed via a recording medium.

  Moreover, although the case where the state values are temperature, pressure, and gas flow rate has been described in the above specific example, the present invention can also be applied to other state values.

  In the above embodiment, each processing (each function) may be realized by centralized processing by a single device (system), or may be realized by distributed processing by a plurality of devices. May be.

  In the above embodiment, each component may be configured by dedicated hardware, or a component that can be realized by software may be realized by executing a program. For example, each component can be realized by a program execution unit such as a CPU reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

  Note that the software that realizes the information processing apparatus in the above embodiment is the following program. That is, this program is a program for causing a computer to execute processing of a state value that is a value related to a state at the time of processing of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor. A state value receiving step for receiving a state value, a value related to a difference between the state value received by the state value receiving step and a reference value that is a reference value of the stored state value, and stored A calculating step for calculating a ratio between a threshold value for dividing the region to which the state value belongs, out of two regions having the reference value as a boundary, into two regions, and a value relating to a difference between the reference value; and the calculating step This is a program for executing the output step of outputting the ratio calculated by the above.

  In the above program, the state value receiving step receives a plurality of state values having different scales, the calculating step calculates the ratios corresponding to the plurality of state values having different scales, and the output step includes A program for outputting a plurality of ratios calculated in the calculating step.

  In addition, a program for causing a computer to execute processing of a state value that is a value related to a state at the time of processing of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor, the computer having a plurality of different scales A value relating to a difference between a state value receiving step for receiving the state value, and a plurality of state values of different scales received by the state value receiving step and a reference value which is a reference value of the stored state value; A calculation step for calculating a ratio between a threshold value, which is a value used for determining whether or not the stored state value is a desired value, and a value related to a difference between the reference value and the calculation step; A multivariate analysis step for performing multivariate analysis using the plurality of ratios, and an output step for outputting a result analyzed by the multivariate analysis step It is because of the program.

In the above program, the threshold used for calculating the ratio in the calculating step is:
The program is a value within a range to which the state value belongs out of a range of values that can be taken by the state value divided into two ranges by the reference value.

  In the above program, in a transmission step for transmitting information, a reception step for receiving information, etc., processing performed by hardware, for example, processing performed by a modem or an interface card in the transmission step (only performed by hardware). Not included) is not included.

  Further, this program may be executed by being downloaded from a server or the like, and a program recorded on a predetermined recording medium (for example, an optical disk such as a CD-ROM, a magnetic disk, a semiconductor memory, or the like) is read out. May be executed by

  Further, the computer that executes this program may be singular or plural. That is, centralized processing may be performed, or distributed processing may be performed.

  In the above embodiment, it goes without saying that two or more communication means (output unit, receiving unit, etc.) existing in one device may be physically realized by one medium.

  The present invention is not limited to the above-described embodiments, and various modifications are possible, and it goes without saying that these are also included in the scope of the present invention.

  Moreover, although the case where the information processing apparatus 100 is a stand-alone has been described in the above embodiment, the information processing apparatus 100 may be a stand-alone apparatus or a server apparatus in a server / client system. In the latter case, the output unit or the reception unit receives an input or outputs a screen via a communication line.

  As described above, the information processing apparatus or the like according to the present invention is suitable as an information processing apparatus or the like that processes information obtained at the time of manufacturing a semiconductor manufacturing apparatus, and in particular, information processing that processes values of different scales such as units. It is useful as a device.

The figure which shows the structure of the information processing system in embodiment Flow chart for explaining the operation of the information processing apparatus Diagram showing the conceptual diagram The figure which shows the first state value Diagram showing the second state value Figure showing the display example Diagram for explaining the operation of the information processing apparatus Figure showing the third state value Figure showing the display example The figure which shows the modification

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Computer 20 Control computer 100 Information processing apparatus 101 State value reception part 102 Reference value storage part 103 Threshold value storage part 104 Calculation part 105 Output part 106 Multivariate analysis part 200 Semiconductor manufacturing apparatus 201 Control part 202 Processing state value acquisition part 203 Process Output unit 211 Processing vessel 212 Exhaust unit 213 Gas introduction unit 214 Pipe 215 Lower end portion 216 Pressure adjustment unit 217 Pressure detection unit 218 Gas flow rate detection unit 221 Lid 222 Ring 223 Rotation column 224 Rotation table 225 Drive unit 226 Boat 230 Heating furnace 231 231a-231c heater 241, 241a-241c temperature detection unit 250 semiconductor wafer

Claims (23)

An information processing apparatus that processes a state value that is a value related to a state during processing of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
A state value receiving unit for receiving the state value;
A reference value storage that can store a reference value that is a value serving as a reference for the state value;
A threshold storage unit that can store a threshold that is a value used to determine whether or not the state value is a desired value;
A calculation unit that calculates a ratio between a value related to the difference between the state value received by the state value receiving unit and the reference value, and a value related to the difference between the threshold value and the reference value;
An information processing apparatus comprising: an output unit that outputs the ratio calculated by the calculation unit. The state value receiving unit receives a plurality of state values of different scales,
The calculation unit calculates the ratio corresponding to each of a plurality of state values having different scales,
The information processing apparatus according to claim 1, wherein the output unit outputs a plurality of ratios calculated by the calculation unit. An information processing apparatus that processes a state value that is a value related to a state during processing of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
A state value receiving unit that receives a plurality of the state values of different scales;
A reference value storage unit in which a reference value that is a reference value of the state value can be stored;
A threshold storage unit that can store a threshold that is a value used to determine whether or not the state value is a desired value;
A calculation unit that calculates a ratio between a value related to a difference between a plurality of state values of the scale received by the state value receiving unit and the reference value, and a value related to a difference between the threshold value and the reference value;
A multivariate analysis unit that performs multivariate analysis using a plurality of ratios calculated by the calculation unit;
An information processing apparatus comprising: an output unit that outputs a result analyzed by the multivariate analysis unit. The threshold used by the calculation unit to calculate the ratio is:
The information processing apparatus according to any one of claims 1 to 4, wherein the state value is a value within a range to which the state value belongs, among a range of values that can be taken by the state value divided into two ranges by the reference value. The information processing apparatus according to claim 1, wherein the state value is a temperature measurement value in the semiconductor manufacturing apparatus or a value obtained by statistically processing the measurement value. 5. The information processing apparatus according to claim 1, wherein the state value is a measured value of pressure in the semiconductor manufacturing apparatus or a value obtained by statistically processing the measured value. 6. The information processing apparatus according to claim 1, wherein the state value is a measured value of a gas flow rate introduced into the semiconductor manufacturing apparatus or a value obtained by statistically processing the measured value. The plurality of state values having different scales are measured values of temperature in the semiconductor manufacturing apparatus and measured values of pressure in the semiconductor manufacturing apparatus, or values obtained by statistical processing thereof. Any one of the information processing apparatuses. The information processing apparatus according to claim 8, wherein the plurality of state values having different scales further include a measurement value of a gas flow rate introduced into the semiconductor manufacturing apparatus or a value obtained by statistically processing the measurement value. A semiconductor manufacturing system comprising: a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor; and the information processing apparatus according to claim 1.
The semiconductor manufacturing apparatus includes:
A processing state value acquisition unit for acquiring the state value;
A semiconductor manufacturing system comprising a processing output unit for outputting the state value. The semiconductor manufacturing apparatus includes:
A processing container for processing the processing object;
And further comprising one or more temperature detection units for detecting the temperature in the processing container,
The semiconductor manufacturing system according to claim 10, wherein the processing state value acquisition unit acquires a state value that is a temperature value detected by the temperature detection unit or a value obtained by statistical processing. The semiconductor manufacturing apparatus includes:
A processing container for processing the processing object;
Further comprising a pressure detector for detecting the pressure inside the processing vessel;
The semiconductor manufacturing system according to claim 10, wherein the processing state value acquisition unit acquires a state value that is a value of the pressure detected by the pressure detection unit or a value obtained by statistical processing. The semiconductor manufacturing apparatus includes:
A processing container for processing the processing object;
A gas flow rate detector for detecting a gas flow rate introduced into the processing vessel;
The semiconductor manufacturing system according to claim 10, wherein the processing state value acquisition unit acquires a state value that is a value of a gas flow rate detected by the gas flow rate detection unit or a value obtained by statistical processing. An information processing method for processing a state value, which is a value related to a state during processing, of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
A state value receiving step for receiving the state value;
A value relating to a difference between the state value received in the state value receiving step and a reference value that is a reference value of the stored state value, and whether the stored state value is a desired value A calculation step of calculating a ratio between a threshold value that is a value used for the determination and a value related to a difference between the reference value;
An information processing method comprising: an output step of outputting the ratio calculated in the calculation step. The state value receiving step receives a plurality of state values of different scales,
The calculating step calculates the ratio corresponding to each of a plurality of state values having different scales,
The information processing method according to claim 14, wherein the output step outputs a plurality of ratios calculated in the calculation step. An information processing method for processing a state value, which is a value related to a state during processing, of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
A state value receiving step for receiving a plurality of the state values of different scales;
A value related to a difference between a plurality of state values of different scales received by the state value receiving step and a reference value that is a reference value of the stored state value, and the stored state value is a desired value A calculation step of calculating a ratio between a threshold value that is a value used to determine whether the value is a value and a value related to a difference between the reference value;
A multivariate analysis step for performing a multivariate analysis using a plurality of ratios calculated in the calculation step;
An information processing method comprising: an output step of outputting a result analyzed by the multivariate analysis step. The threshold used for calculating the ratio in the calculating step is:
The information processing method according to any one of claims 14 to 16, wherein the state value is a value within a range to which the state value belongs in a range of values that can be taken by the state value divided into two ranges by the reference value. A program for causing a computer to execute processing of a state value, which is a value related to a state at the time of processing, of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
On the computer,
A state value receiving step for receiving the state value;
Two regions having a boundary between the state value received by the state value receiving step and a value related to a difference between a reference value that is a reference value of the stored state value and the stored reference value A calculation step of calculating a ratio between a threshold value for dividing the region to which the state value belongs to two regions and a value relating to a difference between the reference value;
A program for executing the output step of outputting the ratio calculated in the calculation step. The state value receiving step receives a plurality of state values of different scales,
The calculating step calculates the ratio corresponding to each of a plurality of state values having different scales,
The program according to claim 18, wherein the output step outputs a plurality of ratios calculated in the calculation step. A program for causing a computer to execute processing of a state value, which is a value related to a state at the time of processing, of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
On the computer,
A state value receiving step for receiving a plurality of the state values of different scales;
A value related to a difference between a plurality of state values of different scales received by the state value receiving step and a reference value that is a reference value of the stored state value, and the stored state value is a desired value A calculation step of calculating a ratio between a threshold value that is a value used to determine whether the value is a value and a value related to a difference between the reference value;
A multivariate analysis step for performing a multivariate analysis using a plurality of ratios calculated in the calculation step;
A program for executing an output step of outputting a result analyzed by the multivariate analysis step. The threshold used for calculating the ratio in the calculating step is:
The program according to any one of claims 18 to 20, wherein the state value is a value within a range to which the state value belongs in a range of values that can be taken by the state value divided into two ranges by the reference value. A recording medium on which a program for causing a computer to execute processing of a state value, which is a value related to a state at the time of processing, of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
On the computer,
A state value receiving step for receiving the state value;
Two regions having a boundary between the state value received by the state value receiving step and a value related to a difference between a reference value that is a reference value of the stored state value and the stored reference value A calculation step of calculating a ratio between a threshold value for dividing the region to which the state value belongs to two regions and a value relating to a difference between the reference value;
A recording medium on which a program for executing the output step of outputting the ratio calculated in the calculating step is recorded. A recording medium on which a program for causing a computer to execute processing of a state value, which is a value related to a state at the time of processing, of a semiconductor manufacturing apparatus that performs processing on a processing object including a semiconductor,
On the computer,
A state value receiving step for receiving a plurality of the state values of different scales;
A value related to a difference between a plurality of state values of different scales received by the state value receiving step and a reference value that is a reference value of the stored state value, and the stored state value is a desired value A calculation step of calculating a ratio between a threshold value that is a value used to determine whether the value is a value and a value related to a difference between the reference value;
A multivariate analysis step for performing a multivariate analysis using a plurality of ratios calculated in the calculation step;
A recording medium on which a program for executing an output step of outputting a result analyzed by the multivariate analysis step is recorded.

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