JP2007313644A - Dressing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently perform regeneration of a polished surface by easily and certainly flattening a recession/projection even if the recession/projection exists on the polished surface. <P>SOLUTION: The dressing device is provided with a dresser 202 for dressing a polishing surface of a polishing table 200 for polishing a surface to be polished relatively slid on the surface to be polished of a material to be polished; a horizontal movement mechanism for horizontally parallel-moving the dresser 202; a lifting base 224 mounted with the horizontal movement mechanism; a screw 248 rotated accompanying with drive of a stepping motor 246 and a nut 250 thread-engaged with the screw 248 and fixed to the lifting base 224. The dressing device has a lifting mechanism 252 for adjusting pressing relative to the polishing surface of the polishing table 200 of the dresser 202 by a pressing amount of the dresser 202 by lifting the lifting base 224 by driving the stepping motor 246. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a dressing apparatus for dressing a polishing surface of a polishing table used for polishing by attaching to a polishing apparatus that polishes the surface of a polishing object such as a semiconductor wafer to a flat and mirror surface.

  In recent years, as semiconductor devices are highly integrated, circuit wiring is becoming finer and the distance between wirings is becoming narrower. In particular, in the case of photolithography having a line width of 0.5 μm or less, the depth of focus becomes shallow, so that the flatness of the imaging surface of the stepper is required. As one means for flattening the surface of such a semiconductor wafer, a polishing apparatus that performs chemical mechanical polishing (CMP) is known.

  Conventionally, as shown in FIG. 43, this type of polishing apparatus has a polishing table 102 that forms a polishing surface by attaching a polishing cloth (polishing pad) 100 to the upper surface, and a substrate W such as a semiconductor wafer that is a polishing object. A top ring 104 that holds the surface to be polished toward the polishing table 102, and while rotating each of them, the top ring 104 presses the substrate W against the polishing surface of the polishing table 102 with a constant pressure. While the polishing liquid is supplied, the surface to be polished of the substrate W is polished to a flat and mirror surface. The abrasive liquid is, for example, a suspension of abrasive grains made of fine particles such as silica in an alkaline solution. Chemical / mechanical, which is a combined action of a chemical polishing action by alkali and a mechanical polishing action by abrasive grains. The substrate W is polished by polishing.

  In order to regenerate the surface of the polishing cloth 100 deteriorated by polishing, a dressing device 108 is attached to the side of the polishing table 102, and the dressing surface of the dressing device 108 is pressed against the polishing surface of the polishing table 102. As a result of the rotation, the polishing liquid and cutting chips adhering to the polishing surface are removed, and the polishing surface is flattened and dressed. As the dressing device 108, when emphasizing the removal of the abrasive fluid and grinding debris, a dressing surface mainly composed of a nylon brush is used, and the emphasis is on cutting and flattening the polished surface. When placing, a diamond dresser is mainly used. Here, the uniformity of the polished surface after dressing greatly affects the polishing accuracy of the subsequent polishing object.

  However, the polishing apparatus as described above has the following problems. First, when polishing is performed on a rotating polishing table (turn table), since there is no displacement at the center of rotation, polishing is performed at a position off the center. Therefore, the size of the polishing table 102 is set to have a diameter at least twice the diameter of the substrate W. For this reason, the polishing apparatus is increased in size and occupies a large floor area, and the equipment cost is also increased. growing. This defect becomes more conspicuous as the substrate W becomes larger.

  The second problem is associated with polishing with the polishing pad 100 made of an elastic material such as urethane. In general, patterns having various dimensions and steps are usually formed from different materials on the semiconductor wafer W. If an attempt is made to flatten such a stepped surface with the polishing cloth 100 having elasticity, the concave portions are also polished together with the convex portions of the pattern, which requires a large amount of polishing and time, which increases the operating cost and eliminates the steps. Therefore, high flatness cannot be obtained. Further, the polishing rate is high at the portion where the micro unevenness is concentrated, and conversely, the polishing rate is low at the portion where the macro unevenness is present, which causes a large undulation on the surface to be polished.

  Further, there is a cost and environmental problem as a third problem. That is, in order to perform polishing with high in-plane uniformity of flatness, it is necessary to supply the abrasive liquid abundantly on the polishing pad 100, but the supplied abrasive liquid is discharged without contributing to actual processing. The rate of being done is also high. For this reason, since the abrasive liquid is expensive, a decrease in operating cost is suppressed. In addition, the above-mentioned abrasive liquid contains a large amount of abrasive grains such as silica, and in some cases is in the form of a slurry containing acid or alkali, so that waste liquid treatment is necessary to maintain the environment, which also reduces the operating cost. It becomes a factor which suppresses.

  For the first problem, it is conceivable to employ a polishing apparatus in which the polishing table 102 performs a circular translational motion (scrolling motion) that draws a circular orbit. In this case, since each point of the polishing surface performs the same movement, the size of the polishing table 102 may be a diameter obtained by adding twice the revolution radius of the polishing table 102 to the substrate that is the polishing target. Cost reduction due to downsizing and reduction of occupied floor space can be achieved.

  Further, for the second and third problems, a method of polishing using a grindstone can be considered. For example, a grindstone in which abrasive grains such as silica are bonded using a binder and processed into a flat plate shape is pasted on a polishing table, and the semiconductor wafer W held on the top ring 104 is pressed and slid. It polishes by moving. As a result, as the grindstone and the wafer slide, the binder is disintegrated or dissolved, and polishing is performed while generating abrasive grains.

  According to such a polishing method, since the grindstone is harder than the polishing cloth, it does not elastically deform, and only the convex portions of the irregularities on the semiconductor wafer W are polished, and the above-described processed substrate surface The problem of the above swell is eliminated. Further, since a slurry-like abrasive liquid containing a large amount of abrasive grains is not used, there is an advantage that the amount of discharged substances is greatly reduced, the operating cost is reduced, and the environment is easily maintained. Further, since no abrasive liquid containing abrasive grains is used as the polishing liquid, there is an advantage that no equipment for supplying the abrasive liquid is required.

  By the way, when a grindstone is fixed to a polishing table that performs circular translational motion (scrolling motion) that draws a circular orbit, and the substrate is polished with this grindstone, the polishing surface of the grindstone surface has a central portion that is always in contact with the substrate A peripheral portion that does not contact the substrate at all and an intermediate portion that does or does not contact the substrate are generated. As a result, as shown in FIG. 9A, a depression is generated on the surface of the grindstone as the polishing surface. That is, the amount of wear at the central portion A of the polished surface is large, the outer peripheral portion C is hardly worn, and the intermediate portion B is worn obliquely. Even if polishing is continued in this state, the substrate cannot be flattened, so dressing of the polishing surface of the grindstone is required.

  In such a case, if dressing is performed using a tool having a dressing surface having a diameter smaller than the polishing surface or a ring-shaped dressing surface as in the conventional case, the polishing surface of the whetstone with unevenness is partially dressed, It is quite difficult to flatten the entire surface. Such a situation is the same when dressing the surface (polishing surface) of the polishing cloth affixed to the polishing table that performs the scroll motion.

  Moreover, in order to make a grindstone or polishing cloth as a polishing tool last longer, it is necessary not to perform dressing more than necessary. Such determination of the end point of dressing is performed, for example, by managing the dressing time to an average time obtained empirically. However, since the appropriate dressing time varies depending on the number of times the polishing tool is used, the number of dressings, and the like, an appropriate dressing amount cannot always be obtained by the above method, resulting in excess or deficiency.

  Furthermore, the dressing surface of the dressing apparatus is generally composed of a single dresser material (cleaning tool) such as a sponge, a brush, or a diamond electrodeposition plate, and it is difficult to arrange a plurality of dresser materials in combination. In addition, the cleaning of the polishing cloth is performed separately from the dressing, and its function is not a substitute for the dressing.

  Further, the dresser material on standby has been immersed in pure water or the like in the dresser cleaning tank to prevent drying, but the dresser material itself has not been generally cleaned. For this reason, the foreign material adhering to the dresser material or the dresser material that is likely to peel off may adhere to the polishing surface and damage the surface to be polished of the polishing object, thereby impairing the polishing performance.

  The present invention has been made in view of the above circumstances, and provides a dressing device that can easily and reliably flatten a polished surface even if the polished surface has irregularities and efficiently regenerate the polished surface. The purpose is to do.

  According to the first aspect of the present invention, there is provided a dresser for dressing a polishing surface of a polishing table that slides relative to a surface to be polished of a material to be polished, and a horizontal movement that horizontally translates the dresser. A mechanism, a lifting base to which the horizontal movement mechanism is attached, a screw that rotates as the stepping motor is driven, and a nut that is screwed to the screw and fixed to the lifting base, and driving the stepping motor A dressing device comprising an elevating mechanism for elevating the elevating base and adjusting the pressure of the dresser against the polishing surface of the polishing table by the pressing amount of the dresser.

  According to a second aspect of the present invention, the height of the polishing surface and the dresser is measured, and the stepping motor is driven by converting into a necessary pulse so as to obtain a pressing amount corresponding to the height. The dressing device according to claim 1, wherein

  According to a third aspect of the present invention, there is provided a dresser for dressing a polishing surface of a polishing table that slides relative to a surface to be polished of a material to be polished and horizontally moves the dresser horizontally in parallel. A mechanism, a lifting cylinder that lifts and lowers the dresser together with the parallel shift mechanism, and a pressing amount control mechanism that controls the pressing of the dresser against the polishing surface of the polishing table by controlling the lifting cylinder by the pressing amount of the dresser. Is a dressing device characterized by

  According to a fourth aspect of the present invention, in the dressing apparatus according to the third aspect, the pressing amount control mechanism includes a stopper that is provided on a cylinder rod of the elevating cylinder and restricts the raised position of the dresser. is there.

  According to the present invention, the polishing surface of the polishing table can be more efficiently and uniformly regenerated over the entire surface.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 6 show a polishing apparatus provided with a dressing apparatus. In this polishing apparatus, as shown in FIG. 1, a polishing section 2 is disposed on one end side of a floor F that is rectangular as a whole, and a loading / unloading unit for mounting substrate storage cassettes 4a and 4b is disposed on the other end side. A load unit 4 is provided. Between the polishing unit 2 and the load / unload unit 4, a transfer unit 6 having two transfer robots 6a and 6b, washing machines 8a and 8b, and a reversing machine 8c are arranged.

  The polishing unit 2 is provided with a polishing table 10 and a top ring device 12 and a dressing device 14 at a position sandwiching the polishing table 10, and mediates transfer of the transfer robot 6b and the substrate W to the side of the polishing table 10. A pusher 15 is installed. As shown in FIG. 2, a top ring cleaning tank 50 and a dresser cleaning tank 52 are provided at the standby positions of the top ring device 12 and the dressing device 14 in the vicinity of the polishing table 10, respectively.

A thin disc-shaped grindstone 16 as a grinding tool is attached to the upper surface of the polishing table 10, and a flat polishing surface 16 a is formed on the surface of the grindstone 16. Below the polishing table 10, the motor 18 is disposed on the upper end of the drive shaft 20 of the motor 18, as shown in FIG. 3, the axis O ₁ and the eccentric amount of the drive shaft 20 "e" by the eccentric drive pin 20a is provided in a position with the axis O _2. On the other hand, at the center of the back surface of the polishing table 10, a recess 10 a that accommodates the drive pin 20 a via a bearing 22 is formed. The polishing table 10 is supported by a support mechanism (not shown) so as to restrict the rotation around the drive pin 20a.

As a result, the rotation of the drive shaft 20 accompanying the drive of the motor 18 causes the drive pin 20a to draw a circular orbit with the eccentricity “e” as the radius, and the polishing table 10 reduces the eccentricity “e” without rotating. A circular translational motion (scrolling motion), which is a revolving motion with a radius, is performed. The diameter _{d 1} of the polishing surface 16a is being doubled (scroll diameter) larger than a value obtained by adding _{(d 1} ≧ _d 2 + 2e) setting the eccentricity "e" to the diameter _{d 2} of the substrate W is polished object Thus, the entire surface of the substrate W can be polished at a time. For example, when the diameter _{d 2} of the substrate W 200 mm, the eccentricity "e" and 10 mm, the diameter _{d 1} of the polishing surface 16a is set to 240 mm.

  The grindstone 16 is formed by dispersing and bonding abrasive grains in a predetermined binder, and the abrasive grains are generated by being released from the binder as the polishing progresses. In order to remove frictional heat generated on the polishing surface 16a, remove polishing debris, and further promote the liberation of abrasive grains, a supply device for supplying a predetermined polishing liquid is provided. Since the relative movement between the polishing table 10 and the substrate W is relatively small, for example, an internal flow path is provided on the grindstone side to supply the polishing liquid.

  The top ring device 12 has a substantially disk-shaped top ring 28 attached to the lower end of the top ring shaft 26 depending from the top ring head inside the top ring cover 24, and polishes the substrate W while adsorbing and holding the substrate W. It is designed to be pressed toward the surface 16a with a predetermined force. Inside the top ring cover 24, a motor, a swing arm and a vertical movement cylinder (not shown) are arranged, and the base end of the swing arm is connected to the upper end of a rotatable support column 30 extending in the vertical direction. A top ring shaft 26 is supported on the free end of the swing arm so as to move up and down and rotate. As a result, the swing arm swings in the horizontal direction together with the top ring cover 24 by the rotation of the support column 30, and the top ring shaft 26 and the top ring 28 are integrated with the drive of the motor and the operation of the vertical movement cylinder. It is designed to rotate and move up and down.

  In the dressing apparatus 14, a dresser shaft 34 is provided at the tip of a dressing head provided inside the dressing cover 32, and a dresser 36 is attached to the lower end of the dresser shaft 34. Inside the dressing head, a motor 38 (see FIG. 4), a swing arm and a vertical movement cylinder (not shown) are arranged, and the base end of the swing arm is connected to the upper end of a rotatable support column 40 extending in the vertical direction. In addition, a dresser shaft 34 is supported on the free end of the swing arm so as to be movable up and down and rotatable. As a result, the swing arm swings due to the rotation of the support column 40, and the dresser shaft 34 and the dresser 36 rotate and move up and down together as the motor 38 is driven and the vertical cylinder is actuated. Yes.

As shown in FIG. 5, the dresser 36 has a disk shape that expands downward as a whole, and has a flat dressing surface 36a on its lower surface as shown in FIG. 6 (a). The dressing surface 36a is set to a size that covers the entire region of the movement range of the polishing surface 16a. That is, as described above, the diameter _{d 1} in the polishing surface 16a 240 mm, when the eccentricity e was 10 mm, the diameter _{d 3} of the dressing surface 36a is 2 eccentricity "e" to the diameter _{d 1} in the polishing surface 16a In this example, for example, 270 mm is set, which is larger than the value obtained by adding double (d ₃ ≧ d ₁ + 2e = 260 mm).

  On the dressing surface 36a, diamond particles, which are one of the substances that can condition the polished surface, are uniformly attached over almost the entire surface by, for example, electrodeposition. Note that, as shown in FIG. 6B, diamond particles may be attached by electrodeposition or the like so as to draw a lattice pattern. Alternatively, as shown in FIG. 7A, a diamond sheet 42 having diamond abrasive grains bonded to one side may be prepared, and the diamond sheet 42 may be attached to a pedestal as shown in FIG. 7B.

  By using the diamond sheet 42 in this way, there is an advantage that the flexibility and flexibility with respect to the shape and dimensions of the polished surface can be achieved, and the diamond sheet 42 can be replaced without replacing the entire pedestal when worn. is there. Furthermore, other granular materials may be used in place of the diamond particles, or a ceramic material such as ceramics may be attached, and the dressing surface may be formed by a brush as shown in FIG.

  In this example, determination means for determining the progress of dressing with a simple configuration is provided. That is, as shown in FIG. 4, motor current detectors 44a and 44b are respectively provided in a motor 18 that rotates the drive shaft 20 of the polishing table 10 and a motor 38 that rotates the dresser shaft 34 to which the dresser 36 is attached. These signals are input to the signal processing device 46. The signal processing device 46 is connected to a control device 48 that controls the overall operating state of the polishing apparatus. It should be noted that the torque detected by the current can be detected by only one of the polishing table 10 and the dresser 36.

  Next, the operation of the polishing apparatus having such a configuration will be described. In the polishing operation, first, the motor 18 is driven to cause the polishing table 10 to circulate in a translational circular motion (scrolling motion), and then the substrate W is attracted and held by the top ring 28 and lowered while being rotated. The substrate W is polished by pressing toward the polishing surface 16a. The necessary polishing liquid is supplied from the polishing liquid flow path inside the grindstone 16. Along with the polishing, the binder collapses or dissolves and the abrasive grains are self-generated.

The thickness reduction state of the grindstone 16 after polishing for a predetermined time is as shown in FIG. That is, since the central portion A of the polishing surface 16a is used for polishing, the amount of wear is large, the outer peripheral portion C is less worn, and the intermediate portion B is worn obliquely in cross section. Here, the dressing device 14 is swung so that the axis of the dresser shaft 34 substantially coincides with the axis O ₁ of the drive shaft 20 of the polishing table 10. Then, the dresser 36 is lowered and pressed toward the polishing surface 16 a of the polishing table 10 that performs a circular translational motion that draws a circular locus as the motor 18 is driven, and at the same time, the dresser 36 is rotated by the motor 38. . Thus, the polishing surface 16a is dressed with the dressing surface 36a of the dresser 36, and the polishing surface 16a is flattened as shown in FIG. 9B.

  At this time, since the entire region of the polishing surface 16a of the grindstone 16 is integrally covered with the flat dressing surface 36a, it is possible to prevent the polishing surface 16a and the dressing surface 36a from partially contacting and causing unevenness of dressing. Thus, the polishing surface 16a is more uniformly regenerated and flattened over the entire surface.

  The signal processing device 46 detects the current of the motor 38 that rotationally drives the dresser 36 by a motor current detector 44b, removes noise and the like from the current value, and performs predetermined signal processing to flatten the polishing surface 16a. The end point signal is sent to the control device of the polishing apparatus and the control apparatus 48 stops the apparatus to finish the dressing.

  The end point of the dressing is detected as follows. That is, the frictional force between the dressing surface 36 a during dressing and the polishing surface 16 a of the polishing table 10 acts as a resistance torque to the polishing table 10. When the means for rotating the polishing table 10 is an electric motor, a change in torque can be indirectly measured as a change in the electric motor current. Therefore, it is considered that a change in dressing condition during dressing can be detected by measuring the current value.

  FIG. 10 shows a test result in the actual machine such as the inventors, and is a graph in which the current flowing through the motor 38 that rotationally drives the dresser 36 is detected by the motor current detector 44b, and the horizontal axis represents the dressing time. The vertical axis represents the current value of the motor. Thereby, it can be seen that the load at the initial stage of dressing is large and gradually decreases and saturates at a constant value. This is presumably because the unevenness of the polishing surface 16a is removed as the dressing progresses, and the friction coefficient between the dresser 36 and the polishing table 10 decreases. Accordingly, an appropriate parameter for detecting the time point ◯ in FIG. 10 may be employed. This includes, for example, the gradient of the current value graph, the current difference ΔI from the initial dressing, or the current value itself.

Such determination means can also be used to determine the life of the dresser, that is, the replacement time. FIG. 11 is a diagram for explaining the method. When comparing a graph A when dressing with a dresser without wear and a graph B when dressing with a dresser with advanced wear, the load itself as a whole is a graph. The case of B is smaller than the graph A, and the current difference ΔI (difference between the motor current value I at the start of dressing and at the end of dressing) is also the case of graph B (ΔI _B ) is the graph A (ΔI _A ) You can see that it is smaller. Therefore, even when the current difference ΔI is smaller than a certain reference value, and when the difference ΔIm at the initial stage of dressing becomes a predetermined value or more as shown in FIG. It is good also as an end point.

  In this example, based on the current value of the motor 38 that rotationally drives the dresser 36, the end of dressing is determined to end dressing. However, the dresser 36 loaded from the dresser shaft 34 is terminated. The dressing process may be controlled step by step by changing the setting of dressing conditions such as the pressing load on the polishing surface 16a and the number of rotations of the polishing table 10.

  In the above example, the case where the current value of the motor 38 that rotationally drives the dresser 36 is detected has been described. However, the current of the motor 18 that drives the drive shaft 20 of the polishing table 10 may be used. In this case, as shown in FIG. 4, the signal processing device 46 may process the signal of the motor current detector 44 a connected to the table-side motor 18.

  As the dressing progresses, the vibration state near the dressing surface or the polishing surface during dressing changes. For example, FIG. 12A is a graph obtained by measuring the frequency spectrum immediately after the start of dressing, and FIG. 12B is a graph obtained by measuring the frequency spectrum after completion of dressing with the polished surface being flattened. Therefore, a vibration detector may be installed at a predetermined position, and a change in the vibration state may be detected to determine the progress of dressing on the polishing surface. Here, for example, it is determined that the end of dressing is when a predetermined waveform (frequency spectrum) is settled. Further, a CCD camera may be arranged at an appropriate location, the polished surface after polishing may be detected, and dressing conditions may be determined based on this, or the dressing condition may be confirmed after dressing.

After the dressing, the dresser 36 is swung by the rotation of the support column 40 and returned to the standby position. The dresser 36 descends and undergoes automatic cleaning in the dresser cleaning tank 52. FIG. 13 shows an example of such an automatic cleaning tank, in which a liquid receiving tank 56 for receiving the cleaning liquid flowing out from the main cleaning tank 54 is provided around a relatively shallow main cleaning tank 54 on the inside. It is configured. The main cleaning tank 54 has a diameter larger than the outer diameter of the dresser 36 and is formed with a taper so that the edge 54a spreads upward, so that the cleaning liquid flows smoothly from the lower inner side to the upper outer side. . Further, a cleaning liquid supply nozzle 58 for supplying a cleaning liquid such as pure water from the edge to the main cleaning tank 54 and a drain port 60 for discharging the cleaning liquid from the liquid receiving tank 56 are provided. For example, the main cleaning tank 54 has a depth of 12 mm, a volume of 600 cm ³ , and the taper angle of the edge portion 54a is set to about 50 degrees with respect to the horizontal. Instead of the cleaning liquid supply nozzle 58, a cleaning liquid supply port may be provided at the bottom of the main cleaning tank 54.

  In this automatic cleaning tank, the main cleaning tank 54 is filled with the cleaning solution in advance, the dresser 36 is lowered at a predetermined speed or more, and the dresser is placed in the main cleaning tank 54 as shown in FIGS. 13 (a) and 13 (b). 36 dressing surfaces 36a are immersed. Thereby, the cleaning liquid corresponding to the volume in which the dresser 36 is immersed is eliminated, a large flow of the cleaning liquid is formed, and the dressing surface 36a is efficiently cleaned. Further, the cleaning liquid is supplied from the cleaning liquid supply nozzle 58 to continuously clean the dressing surface 36a. Here, the dresser 36 may be rotated or may be stationary. The dirty cleaning liquid overflows from the edge 54 a and flows into the liquid receiving tank 56 and is further discharged from the drain port 60. Thereby, since the cleaning liquid in the main cleaning tank 54 is constantly replaced, there is no contamination due to generation of bacteria or the like, and accumulation of polishing scraps is prevented.

  As shown in these drawings, it is preferable to prevent the contamination of the upper surface of the dresser 36 by adjusting the lowered position of the dresser 36 so that the upper surface of the dresser 36 is not immersed. In this case, the ratio of the submerged volume of the dresser 36 to the internal volume of the main cleaning tank 54 is set to 1: 1.5 to 2.5, and more preferably set to 1: 1.5 to 2.0. . It is preferable to continuously supply the cleaning liquid even when the dresser 36 is not in the standby position, and to replace the cleaning liquid in the main cleaning tank 54 in order to prevent contamination. In this case, for example, the flow rate may be the same as that in the case of cleaning or may be reduced.

  FIG. 14 and FIG. 15 show another example of the automatic cleaning tank, and only the main cleaning tank 54 is shown here. In the example of FIG. 14, the ultrasonic vibrator 62 is attached to the bottom of the main cleaning tank 54, and the cleaning effect is obtained by applying vibration to the main cleaning tank 54 with the dresser 36 immersed in the cleaning liquid. Can be increased. The condition of ultrasonic vibration is, for example, that the distance between the vibrator (the bottom surface of the cleaning tank) and the dressing surface 36a is 10 to 50 mm, the oscillation frequency of the vibrator is about 28 kHz, the output is 300 to 600 W, and the run is about 60 to 120 seconds. Just do it. The ultrasonic vibration may be performed while supplying the cleaning liquid or while the supply is stopped. However, after the vibration is stopped, the cleaning liquid is supplied and the inside of the main cleaning tank 54 is replaced.

  In the example of FIG. 15, a brush 64 is attached to the inner bottom portion of the main cleaning tank 54. As a result, the dresser 36 is lowered to a predetermined height and then rotated at a low speed, and the dressing surface 36a is rubbed against the brush 64 while supplying the cleaning liquid, thereby improving the cleaning effect. Of course, you may use together with the ultrasonic vibration of FIG.

A cavit jet nozzle may be provided at the main cleaning tank 54 or at a predetermined location around it. For example, high-pressure water and low-pressure water are supplied from a double nozzle, and cavitation is generated by the difference in speed to enhance the cleaning effect. The dressing surface 36a is not an immersed state but the dressing surface 36a is an automatic cleaning tank. In a state of being a predetermined distance above. Preferably, the distance between the tip of the cabjet nozzle and the dressing surface 36a is 5 to 15 mm, the ejection pressure of the cleaning liquid is 294 to 980 N / cm ² (30 to 100 kgf / cm ² ), and the cleaning liquid flow rate is 0.5 to 1. 5 l / sec. In addition, you may wash | clean the top ring 28 with the washing tank of the structure mentioned above, or a cabjet nozzle.

FIG. 16 is a view schematically showing another dressing device 14, which has a roller 70 that rotates around an axis parallel to the polishing surface 16 a of the polishing table 10, and around this roller 70. A dressing surface 72a is formed on the surface to form a dresser 72. The axial length l ₄ of the roller 70 and the dressing surface 72a formed thereon is set to be larger than the scroll diameter on which the polishing table 10 moves. That is, the length l ₄ is set to a value (l ₄ ≧ d ₁ + 2e) larger than a value obtained by adding twice the eccentric amount “e” to the diameter d ₁ of the polishing surface 16a.

  A shaft 74 that supports the roller 70 includes a fluid pressure cylinder 76 that moves the roller 70 up and down and presses the roller 70 against a polishing surface, a motor 78 that rotates the roller 70, and an actuator (not shown) that moves horizontally along the polishing surface. Abbreviation) etc. are connected. The entire configuration is held by a dressing arm (not shown) and can swing between the polishing table 10 and a standby position. In this example, two rollers 70 are arranged, but may be one or three or more.

  When dressing is performed by the dressing device 14 having such a configuration, the dressing device 14 is moved from the standby position onto the polishing table 10. Then, the roller 70 is lowered by the cylinder 76, and dressing is performed while moving the roller 70 along the polishing surface in a direction perpendicular to the shaft 74 in a state where the dressing surface 72a is pressed against the polishing surface of the polishing table 10 with a predetermined pressure. Do. In this example as well, even when the polishing surface is uneven, the dressing surface is in contact with the entire surface, and dressing can be performed efficiently while the polishing surface is flattened.

  17 to 23 show the dressing apparatus 14 according to the first embodiment of the present invention. As shown in FIG. 17, the dressing apparatus 14 includes a polishing table 200 having a polishing surface 200a and a polishing table 200. A dresser 202 that performs dressing of the surface 200a, a dresser arm 204 that holds the dresser 202 on the free end side, a dresser drive mechanism 206 that swings and moves the dresser arm 204 up and down, and a dresser 202 that stores cleaning liquid. Is mainly composed of a dresser cleaning tank 208 for cleaning the surface and a pair of guide tables 210 disposed on both sides of the polishing table 200 to prevent the dresser 202 from falling off.

  18 and 19 show the details of the polishing table 200. As shown in the figure, an upper flange 751 of a motor 750 having a hollow shaft and a shaft 752 having a hollow inside are sequentially fastened by bolts. Yes. A set ring 754 is supported on the upper portion of the shaft 752 by a bearing 753. A table 759 is fastened to the upper surface of the set ring 754, and the polishing table 200 is fastened by bolts 790 on the top. The entire polishing table 200 may be composed of, for example, a grindstone, or the polishing table 200 is composed of a metal having excellent corrosion resistance, such as stainless steel, and a polishing cloth (polishing pad) is attached to the upper surface thereof. Also good. When a grindstone or a polishing cloth is used, the upper surface of the polishing table 200 may be flat or uneven. These are selected depending on the type of the substrate W to be polished. The outer diameter of the polishing table 200 is set to be equal to or larger than the diameter of the substrate W + 2 “e”, and the substrate W does not protrude from the polishing table 200 even if the polishing table 200 performs a scrolling motion (translational circular motion). It has become.

  The set ring 754 has three or more support portions 758 formed in the circumferential direction, and supports a table 759. That is, a plurality of recesses 760 and 761 are formed at equal intervals in the circumferential direction at corresponding positions on the upper surface of the support portion 758 and the lower surface of the table 759, and bearings 762 and 763 are formed in these recesses 760 and 761. Are installed. As shown in FIGS. 18 and 19, support members 766 having two shaft bodies 764 and 765 shifted by “e” are inserted into the bearings 762 and 763 and supported by inserting end portions of the shaft bodies. By rotating 750, the polishing table 200 can translate (revolve) along a circle of radius “e”.

  Similarly, the flange 751 is eccentric by “e” between the motor 750 and the shaft 752. A balancer 767 is attached to the shaft 752 to balance the load due to eccentricity.

  The polishing liquid is supplied onto the polishing table 200 through the motor 750 and the shaft 752 and through the joint 791 to the through hole 757 provided in the center of the table 759. The supplied polishing liquid is once stored in a space 756 formed between the polishing table 200 and the table 759 so as to directly contact the substrate W through a plurality of through holes 768 provided in the polishing table 200. Supplied. The number and position of the through holes 768 are appropriately selected depending on the type of process. When the polishing cloth is used by being attached to the polishing table 200, the polishing cloth is provided with a through hole at a position corresponding to the position of the through hole 768. When the entire polishing table 200 is manufactured with a grindstone, a lattice, spiral, or radial groove may be provided on the upper surface of the polishing table, and the through hole 768 may be communicated with the groove.

In addition, the optimum polishing abrasive liquid is selected from pure water, chemical liquid, slurry, etc., and one or more kinds of polishing abrasive liquids are supplied simultaneously, alternately, or sequentially as necessary. Controlled.
A flinger 769 is attached to the table 200 to protect the mechanism that performs translational motion from the polishing abrasive liquid during polishing, and forms a labyrinth mechanism with the flange 770.

  In the above configuration, the polishing table 200 is moved in a translational circular motion (scrolling motion), which is a non-rotating motion, by the operation of the motor 750, and the substrate W attached to the top ring is pressed onto the polishing surface of the polishing table 200.

  Polishing is performed by the polishing liquid supplied to the polishing surface through the through hole 757, the space 756, and the through hole 768. Between the polishing surface 200a on the polishing table 200 and the substrate W, a minute relative translational circular motion (scrolling motion) having a radius “e” occurs, and an equal relative velocity is generated in the entire polishing surface. Accordingly, the surface to be polished of the substrate W is uniformly polished on the entire surface. In addition, if the positional relationship between the surface to be polished and the polished surface is the same, it will be affected by local differences in the polished surface. To avoid this, the top ring is gradually rotated and only the same location on the polished surface is used. It is prevented from being polished with.

Here, the dresser 202 is formed in a long shape, and its length l is a value larger than the range of motion of the table obtained by adding twice the eccentric amount “e” (scroll diameter) to the diameter d of the polishing surface 200a. (L> d + 2e), and its width is set as small as the dresser condition allows. That is, when compared with the wafer diameter, l> wafer diameter d ₂ + 4e. As a result, for example, space can be greatly saved in the width direction as compared with a circular dresser. Similarly, the dresser cleaning tank 208 can be saved in installation space by using a long one that matches the shape of the dresser 202. In addition, since the polishing table performs a scrolling motion without rotation, the dresser also has a structure that does not rotate. The relative speed of the table and the dresser at each point on the polishing surface is made equal by the scroll movement of the table and the constant speed slide in the lateral direction of the dresser.

  The dressing device 14 of this embodiment uses a cylinder type for raising and lowering the dresser 202, a stroke type using a cylinder and a stopper for controlling the pressing amount, and a swing link mechanism for horizontally moving the dresser 202. A dresser material (cleaning tool) 212 made of a soft elastic body is attached to the lower surface of the sheet, and this lower surface is used as a dressing surface 212a.

  That is, as shown in FIGS. 20 to 23, there are a lifting shaft 218 that moves up and down with a linear motion guide 216 fixed to the base 214 as a guide, and a swinging shaft 220 of a hollow structure that surrounds the periphery of the lifting shaft 218. The dresser arm 204 is connected to the swing shaft 220. On the other hand, an elevating cylinder 222 is fixed to the base 214, and an elevating base 224 fixed to an elevating shaft 218 is connected to an upper end of a piston rod of the cylinder 222. The piston rod of the elevating cylinder 222 extends downward, and a stopper 226 is attached to the cylinder rod via a screw or the like so that the position can be adjusted.

  As a result, the lift shaft 218, the swing shaft 220, and the dresser arm 204 move up and down together with the operation of the lift cylinder 222, and the stopper 226 attached to the cylinder rod comes into contact with the cylinder lower end surface of the lift cylinder 222. As a result, this rise is regulated. By fixing the raised position of the dresser, dressing can always be performed with a constant pressure.

  Here, the position of the stopper 226 is a position where the dresser 202 moves in the lateral direction in a state where the ascent is restricted by the stopper 226, and the dressing surface 212a is dressed by pressing the polishing surface 200a with the dresser material 212. The guide table 210 is set so that the upper surface thereof is flush with the plane formed by the polishing surface 200a.

  A driving pulley 228 is fixed to the upper end of the elevating shaft 218, and a belt 234 is interposed between the driving pulley 228 and a driven pulley 232 fixed to the upper end of a dresser support shaft 230 that is rotatably disposed on the free end side of the dresser arm 204. Is over. A bearing 231 is interposed between the elevating shaft 218 and the swing shaft 220. The dresser support shaft 230 extends downward, and the dresser 202 is connected to the lower end thereof. On the other hand, a rocking cylinder 236 is fixed to the elevating base 224, and a piston rod of the rocking cylinder 236 is attached to a tip of a link arm 238 provided on the rocking shaft 220 so as to protrude in a direction perpendicular to the axial direction. They are connected via a ball joint 240.

  As a result, the swing cylinder 236 is also moved up and down integrally with the lift cylinder 222 through the lift base 224, and the swing shaft 220 is rotated and the dresser arm 204 swings with the swing cylinder 236. In addition, the dresser 202 is translated in one direction at a constant speed as the dresser arm 204 swings through a so-called parallel motion mechanism including the pulleys 228 and 232 and the belt 234.

  In this embodiment, the dresser cleaning tank 208 serves to prevent the dresser material 212 from drying, and a tube 242 for supplying liquid is attached to the dresser cleaning tank 208 as shown in FIG. The cleanliness is maintained by always supplying water. The dresser 202 in the standby state is lowered, and the dresser material 212 is prevented from drying by immersing the dresser material 212 in the dresser cleaning tank 208 filled with liquid.

  Next, a series of operations until the dresser 202 leaves the dresser cleaning tank 208, dresses the polishing surface 200a of the polishing table 200, and returns to the dresser cleaning tank 208 will be described.

  The dresser 202 is in the lowered position in the dresser cleaning tank 208, and the dresser 202 is lifted from the dresser cleaning tank 208 by the lift cylinder 222. The rising position is determined by the stopper 226.

  In this state, the swing cylinder 236 is operated to rotate the swing shaft 220 to swing the dresser arm 204 toward the polishing surface 200 a side of the polishing table 200. Then, since the drive pulley 228, the driven pulley 232, and the belt 234 form a link mechanism that performs parallel movement, even if the dresser arm 204 swings as the swing shaft 220 rotates, the dresser 202 does not turn. Perform parallel motion that does not change.

  Accordingly, the dresser 202 moves onto the polishing surface 200a so as to ride on the polishing surface 200a of the polishing table 200, and performs dressing with the dressing surface 212a while pressing the dresser material 212 against the polishing surface 200a. The center of the dresser 202 passes through the center of the polishing surface 200a, and the length l of the dresser 202 is larger than the operating range of the table, that is, the diameter of the circle drawn by the locus of the polishing surface 200a that scrolls. Dress the surface.

  Then, the dresser 202 stops when it reaches the end of the polishing surface 200a, which is the stroke end, while dressing the polishing surface 200a that is performing a scrolling motion, and again while moving in the opposite direction by switching the direction of expansion and contraction. Do the dressing. As shown in FIG. 21, a cylinder sensor 244 for detecting an expansion / contraction stroke end is attached to the oscillating cylinder 236 to detect the operation switching timing and monitor the operation.

  Here, the guide table 210 is configured to follow the outer periphery of the revolving motion of the polishing table 200 and the swing range of the dresser 202 so as to surround the periphery of the polishing table 200. That is, the inner side of the guide table 210 is formed in a circle or arc shape having a radius (d + 2e) / 2 or more from the scroll center of the polishing table 200.

  Further, by arranging the guide table 210 so that the upper surface thereof is the same plane as the plane formed by the polishing surface 200a, when the dresser 202 is detached from the polishing table 200, the lower end of the dresser material 212 is lowered downward by the elastic amount. It can be prevented from falling off. Thus, when the dresser 202 is about to ride on the polishing table 200, if the polishing table 200 and the dresser material 212 cannot absorb this step, for example, in the polishing table 200 to which the polishing cloth is adhered, The polishing cloth is peeled off, or in the worst case, the dresser 202 is prevented from colliding with the side surface of the polishing table 200 and damaging the apparatus.

As described above, the set number of dressings are performed, the process returns to the dresser cleaning tank 208 and the dressing operation is completed.
In this embodiment, a pressing amount control formula is used to control the pressing of the dresser material 212 against the polishing surface 200a, and a stopper 226 is attached to the elevating cylinder 222 in order to keep the height of the dresser 202 constant. ing.

  Here, the thickness of the polishing table 200 gradually wears with each dressing. In order to follow this change, as shown in FIG. 23, a stepping motor 246, a screw 248 connected to the stepping motor 246 via a coupling 247, and rotating as the stepping motor 246 is driven, and a lifting base An elevating mechanism 252 combined with a nut 250 screwed to the screw 248 fixed to 224, and a non-contact distance measuring sensor 254 disposed above the polishing surface 200a are provided. Thereby, the height of the polishing surface 200a and the dresser 202 is measured by the distance measuring sensor 254, the current pressing amount is detected from the difference, and the difference is set to the stepping motor 246 so that the set pressing amount is obtained. Therefore, the position of the dresser 202 is corrected by driving the necessary number of pulses. If this operation is performed every time dressing is performed, the same pressing amount can always be maintained, and the reliability of the dressing process can be improved.

  FIG. 24 shows a dressing device 14 according to a second embodiment of the present invention, which uses a pressing force control formula for controlling the pressing of the dresser material 212 against the polishing surface 200a. That is, the lift cylinder 222 is used as the lift mechanism of the dresser 202, and the difference (Wt−F) between the thrust F of the lift cylinder 222 and the weight Wt of the mechanism becomes the target pressing force against the polishing surface 200a of the dresser 202. In addition, for example, the drive supply pressure is controlled by an electropneumatic regulator or the like.

  FIGS. 25 to 27 show a dressing device 14 according to a third embodiment of the present invention, which employs a pressing force control formula for controlling the pressure of the dresser 202 as in the second embodiment. At the same time, a polishing table 258 is attached to the upper surface, and a guide table 264 having the same type of polishing cloth 262 attached to the upper surface is provided on the side of the polishing table 200 having the upper surface as the polishing surface 200a. It is arranged to surround the surroundings. When fixed abrasive grains (grinding stones) are installed on the table, the same kind of fixed abrasive grains (grinding stones) are also provided on the guide table 264.

  As a result, when the dresser 202 is detached from the polishing table 200, the dresser 202 is prevented from dropping from the polishing table 200 by an extra stroke of the thrust mechanism, and the polishing surface of the polishing table 200 being dressed while moving is provided. It can be prevented that the area in contact with the dresser material 212 of 200a is changed, and the dressing pressure applied to the polishing surface 200a is changed to prevent uniform dressing.

  In other words, after the dresser 202 is dropped from the polishing table 200, when the dresser 202 tries to ride on the polishing table 200 again, if the polishing cloth 258 and the dresser material 212 cannot absorb this step, the polishing cloth 258 is peeled off. In the worst case, the dresser 202 collides with the side surface of the polishing table 200 and the apparatus is damaged.

  Further, when the pressing control is performed with the pressing force, the area of the polishing surface 200a that is being dressed while moving is changed in contact with the dresser material 212, and the dressing pressure is changed, so that uniform dressing cannot be performed. . In particular, the area of contact with the dresser material 212 is greatly different between the center portion and both end portions of the polishing surface 200a.

  Therefore, in the dressing apparatus 14 of this embodiment, the guide table 264 having the same type of polishing cloth 262 attached to the upper surface is provided on the side of the polishing table 200 having the polishing cloth 258 attached to the upper surface. These problems are solved by arranging them so as to surround them and so that the polishing cloths 258 and 262 have the same height.

  As a result, the dresser 202 can dress the entire polishing surface 200a on the upper surface of the polishing pad 258 without changing its height. Further, the change in the contact area with the dresser material 212 can be corrected with the polishing cloth 262 attached to the upper surface of the guide table 264.

  In addition, a rinse nozzle 266 is provided so that the liquids supplied to the polishing cloths 258 and 262 can be the same in type and flow rate so that the wear rates of the polishing cloths 258 and 262 are the same. Since the guide table 264 is divided into two places, at least two rinse nozzles 266 are also required. For example, these supply valves and flow meters may be combined into one and then branched to a plurality of rinse nozzles 266.

  FIG. 27 is a view showing a height adjustment mechanism of the guide table 264. This includes a bolt 270 provided with screw parts that are reversely screwed up and down, and nuts 274 and 276 that are screwed into the screw parts of the bolt 270 fixed to the guide table 264 and the floor 272, respectively. The guide table 264 is raised by rotating the 270 in one direction and lowered by rotating in the other direction.

  The polishing cloths 258 and 262 are exchanged simultaneously on the left and right guide tables 264 and the polishing table 200 in order to make the wear rate and other conditions uniform. That is, since all the new polishing cloths have the same thickness, the height adjustment mechanism is used to make the distance between each guide table 264 and the polishing table 200 the same, and then the same kind of polishing cloth is applied to each guide table 264 and the polishing table 200. By affixing 258 and 262, the polishing cloths 258 and 262 can have the same height.

  FIG. 28 is a view showing an automatic height adjusting mechanism of the guide table 264. This is because left and right guide tables 264 are attached to separate bases 278, and each base 278 is screwed onto a stepping motor 280, a feed screw 282 that rotates by driving the stepping motor 280, and the feed screw 282 fixed to the base 278. It is made to move up and down with a nut 284 to be joined.

  Here, the height of the guide table 264 and the polishing table 200 is measured using a contact or non-contact distance measuring sensor 286 disposed above the left and right guide tables 264 and the polishing table 200, and the height deviation is measured. taking measurement. Then, the measured deviation is converted into the number of pulses of the stepping motor 280, and the stepping motor 280 is driven by the necessary number of pulses to adjust the deviation between the left and right guide tables 264 and the polishing table 200 to zero. .

  As shown in FIG. 29, one distance measurement sensor 286 is attached to the dresser arm 204, and when the dresser arm 204 moves horizontally, the height of the left and right guide tables 264 and the polishing table 200 is determined from the sensor 286 to the polishing surface. The distance to the guide table 264 may be determined based on the measurement result.

  FIGS. 30 and 31 show another dressing device 14 which prevents the dresser 202 from falling off, and in order to efficiently dress the inside of the polishing surface 200a of the polishing table 200. It is designed to minimize movement as much as possible. That is, in this example, the sensor dog 296 is provided on the swing shaft 220, and the sensors 298a and 298b are provided at positions where the sensor dog 296 is positioned when the dresser 202 reaches the polishing surface outside region 294.

  As a result, the dressing range can be minimized by detecting that the dresser 202 has reached the out-of-polishing region 294 with the sensors 298a and 298b and switching the operation of the cylinder, for example. Here, for example, if a stepping motor is used to drive the dresser arm 204, the minimum dressing range may be controlled by the number of pulses.

  FIGS. 32 to 34 show another example of the dresser 202. The dresser 202 is attached by attaching a long side dresser 302 on both sides of a long basic dresser 300 located in the center. It is composed. That is, a plurality of types of dressing materials are attached to the lower surface of the base 304 connected to the lower end of the dresser support shaft 230. For example, a basic dresser 300 to which a hard dresser material 306 is attached is attached, and another side dresser 302 to which a required dresser material 308 such as a soft dresser material is attached is added to the left and right sides of the basic dresser 300. Thus, effective dressing is performed by utilizing the characteristics of the dresser materials 306 and 308.

  In other words, the polishing cloth using the hard dresser material 306 may be only the basic dresser 300 with the hard dresser material 306 attached, but if the side dresser 302 with the soft dresser material 308 is added to the left and right, the dressing is performed. It is possible to remove foreign matter before being applied and foreign matter after dressing. Even if dressing with a soft dresser material 308 such as a nylon brush on a polishing cloth using a hard dresser material 306 such as diamond, there is no effect other than improving the cleanliness of the surface. Usage is possible.

  In this example, a pin (not shown) is provided on the side surface of the side dresser 302, and a recess (not shown) is provided at a position corresponding to the pin of the basic dresser 300, and the pin is fitted in the recess. The maintenance is improved by connecting with the bolt 310 while performing positioning.

  FIG. 35 shows still another example of the dresser 202. This is a combination of a dressing material for dressing in contact with the polishing surface and a dressing / cleaning mechanism for dressing and cleaning the polishing surface as one dresser. It is a thing. That is, an ultrasonic cleaner which is a non-contact cleaning mechanism having a side dresser 302 on one side surface of the basic dresser 300 and a plurality of nozzles 312 at a predetermined pitch having the same length as the basic dresser 300 on the other side surface. 314 is attached. The ultrasonic cleaner 314 removes the foreign matter by transmitting the oscillating ultrasonic wave to the foreign matter stuck to the polishing surface and vibrating it. Thus, by providing the ultrasonic cleaner 314, it is possible to perform ultrasonic cleaning while dressing the polished surface, and there is an effect of increasing the cleanliness of the polished surface.

  In addition, it is possible to create optimum dressing conditions by freely combining these hard dresser material 306, soft dresser material 308, and ultrasonic cleaner 314.

  As another example of the dressing and cleaning mechanism, instead of the ultrasonic cleaner 314 with a nozzle, a liquid 318 is filled between the vibrator 316 and the polishing surface 200a as shown in FIG. A vibrator cleaner 320 may be provided that transmits vibrations to the polishing surface 200a via the liquid 318 to vibrate and remove foreign matter on the polishing surface 200a. As shown in FIG. 37, it is provided with a washer 330 that discharges high-pressure water 324 into low-pressure water 322 to generate cavitation 326 and cleans the polishing surface 200a with a shock wave 328 resulting from the destruction. May be. These contact dressing material and dressing / cleaning mechanism are combined to form a dressing member.

  FIG. 38 shows another dresser cleaning tank 208 of the cleaning product rotating type, which is a cleaning product 332 such as a nylon brush, which is rotated by a motor or the like, and the cleaning product 332 is, for example, shown in FIGS. In the dresser 202 shown in FIG. 2, the dresser materials 306 and 308 are rubbed against the entire lower surface of the dresser materials 306 and 308 to clean the dresser materials 306 and 308. The brush rotation mechanism may have a waterproof structure. The dresser cleaning tank 208 includes bolts 334 provided with screw parts that are mutually oppositely screwed up and down, and nuts 336 and 338 that are screwed into the screw parts of the bolts 334 fixed to the dresser cleaning tank 208 and the floor 272, respectively. The height of the dresser cleaning tank 208, and hence the cleaning article 332, can be adjusted by the height adjusting mechanism 340, and the pressing amount against the dresser material can be adjusted on the dresser cleaning tank side.

  In addition, the dresser cleaning tank 208 is supplied with rinse toward the cleaning article 332 of the dresser cleaning tank 208 to enhance the cleaning effect, and one or more rinse nozzles for filling the dresser cleaning tank 208 with liquid. 342 is provided. Further, a lower drainage port 346 having a drainage valve 344 that closes when the dresser cleaning tank 208 is filled with liquid, and a valve that does not have a valve or has a valve that is always open in the dresser cleaning tank 208. Two drain ports, upper drain port 348, for overflowing the filled liquid are provided.

  As a result, when the dresser materials 306 and 308 are cleaned, the liquid in the dresser cleaning tank 208 is drained from the drain ports 346 and 348 to prevent reattachment of foreign matters to the dresser materials 306 and 308 and to perform contact cleaning. When not performed, the drain valve 344 is closed so that the dresser materials 306 and 308 are immersed in the liquid in the dresser cleaning tank 208 to prevent this drying.

FIG. 39 shows another example of the dresser cleaning tank 208. In this example, instead of the rotary type cleaning article 332 in the example shown in FIG. For example, in the case of the dresser 202 shown in FIGS. 32 to 34, the dresser 202 is disposed in the dresser cleaning tank 208, and is moved laterally so that the entire lower surface of the dresser material 306, 308 is rubbed against the cleaning product 350. The materials 306 and 308 are cleaned.
These two types of dresser cleaning tanks can fill the liquid up to a height where the dresser material is completely immersed.

  In addition, in the dresser 202 including the vibrator cleaner 320 having the vibrator 316 shown in FIG. 36, the vibrator 316 is oscillated and immersed in the same liquid 352 as shown in FIG. The dresser materials 306 and 308 of the dresser 202 can be cleaned. In this case, the dresser is cleaned using the vibration of the ultrasonic vibrator of the dresser itself. However, as shown in FIG. 14, an ultrasonic vibrator may be provided in the dresser cleaning tank, and the dresser may be cleaned with that force.

41 and 42 are plan views of a polishing apparatus provided with the dressing apparatus 14 shown in FIGS.
This polishing apparatus includes four load / unload stages 402 on which a wafer cassette 401 for stocking a large number of semiconductor wafers is placed. The load / unload stage 402 may have a mechanism capable of moving up and down. A transfer robot 404 having two hands is arranged on the traveling mechanism 403 so that each wafer cassette 401 on the load / unload stage 402 can be reached.

  Two cleaning machines 405 and 406 are arranged on the opposite side of the wafer cassette 401 with the traveling mechanism 403 of the transfer robot 404 as the axis of symmetry. Each of the cleaning machines 405 and 406 is disposed at a position where the hand of the transfer robot 404 can reach. A wafer station 450 including four semiconductor wafer mounting tables 407, 408, 409, and 410 is disposed between the two cleaning machines 405 and 406 at a position where the transfer robot 404 can reach. The cleaning machines 405 and 406 have a spin dry function of rotating the wafer at a high speed to dry it, so that it is possible to cope with two-stage cleaning and three-stage cleaning of the wafer without replacing the modules.

  A partition wall 414 is arranged to divide the cleanliness between the area B where the cleaning machines 405 and 406 and the mounting tables 407, 408, 409 and 410 are arranged and the area A where the wafer cassette 401 and the transfer robot 404 are arranged. In addition, a shutter 411 is provided in the opening of the partition for transporting the semiconductor wafer between the regions. A transfer robot 420 having two hands is arranged at a position that can reach the cleaning machine 405 and the three mounting tables 407, 409, and 410, and can reach the cleaning machine 406 and the three mounting tables 408, 409, and 410. A transfer robot 421 having two hands is arranged at a proper position.

  The mounting table 407 is used for transferring semiconductor wafers between the transfer robot 404 and the transfer robot 420, and the mounting table 408 is used for transferring semiconductor wafers between the transfer robot 404 and the transfer robot 421. Used for. The mounting table 409 is used to transfer a semiconductor wafer from the transfer robot 421 to the transfer robot 420, and the mounting table 410 is used to transfer a semiconductor wafer from the transfer robot 420 to the transfer robot 421.

  A cleaning machine 422 is disposed at a position where the hand of the transfer robot 420 can reach so as to be adjacent to the cleaning machine 405. Further, a cleaning machine 423 is arranged at a position where the hand of the transfer robot 421 can reach so as to be adjacent to the cleaning machine 406.

  The cleaning machines 405, 406, 422, 423, the mounting bases 407, 408, 409, 410 of the wafer station 450 and the transfer robots 420, 421 are all disposed in the region B and are lower than the atmospheric pressure in the region A. It is adjusted to atmospheric pressure. The washing machines 422 and 423 are washing machines capable of performing double-sided washing.

  This polishing apparatus has a housing 446 so as to surround each device, and the housing 446 includes a plurality of rooms (region A and region B) by a partition wall 414, a partition wall 415, a partition wall 416, a partition wall 424, and a partition wall 447. Included).

  A polishing chamber separated from the region B by the partition wall 424 is formed, and the polishing chamber is further partitioned into two regions C and D by the partition wall 447. In the two regions C and D, two polishing tables, a polishing table 434 that performs rotational movement, and a polishing table 200 that performs scroll movement shown in detail in FIGS. 18 and 19, and one semiconductor wafer are provided. One top ring 432 for holding and polishing the semiconductor wafer while pressing it against the polishing tables 434 and 200, an abrasive nozzle 440 for supplying polishing abrasive liquid to the polishing table 434, and dressing of the polishing table 434 In addition, a dresser 438 for performing dressing, and a dressing device 14 for dressing the polishing table 200 shown in detail in FIGS. 19 to 23 are disposed.

  FIG. 42 is a view showing the relationship between the top ring 432 and the polishing tables 434 and 200. As shown in FIG. 42, the top ring 432 is suspended from the top ring head 431 by a rotatable top ring drive shaft 491. The top ring head 431 is supported by a positionable swing shaft 492, and the top ring 432 can access the polishing tables 434 and 200. The dresser 438 is suspended from the dresser head 494 by a rotatable dresser drive shaft 493. The dresser head 494 is supported by a rockable shaft 495 that can be positioned, and the dresser 438 is movable between a standby position and a dresser position on the polishing table 434. That is, the polishing table 434 and the dresser 438 are both of the type that rotates.

  The dressing device 14 includes a dresser 202 extending in a long shape for dressing the polishing surface of the polishing table 200 by moving in parallel along the surface of the polishing table 200 that is scrolled, and a dresser cleaning tank for cleaning the dresser 202. 208 is provided.

  As shown in FIG. 41, a reversing machine 428 for reversing the semiconductor wafer to a position that can be reached by the hand of the transfer robot 420 in the area C separated from the area B by the partition wall 424 is provided in the transfer robot 421. A reversing machine 428 ′ for reversing the semiconductor wafer is disposed at a position where the hand can reach.

  A rotary transporter 427 for transferring a wafer between the cleaning chamber (region B) and the polishing chamber (regions C and D) is disposed below the reversing machines 428 and 428 ′ and the top ring 432. The rotary transporter 427 is provided with four stages equally placed on the wafer, and a plurality of wafers can be mounted at the same time. The wafers transferred to the reversing machines 428 and 428 ′ are placed below the rotary transporter 427 when the center of the stage of the rotary transporter 427 and the center of the wafer chucked by the reversing machine 428 or 428 ′ are in phase. The installed lifter 429 or 429 ′ moves up and down and is conveyed onto the rotary transporter 427. The wafer placed on the stage of the rotary transporter 427 is conveyed below one top ring 432 by changing the position of the rotary transporter 427 by 90 °. The top ring 432 swings in advance to the position of the rotary transporter 427. When the center of the top ring 432 is in phase with the center of the wafer mounted on the rotary transporter 427, the pusher 430 or 430 ′ disposed below them moves up and down, so that the wafer is removed from the rotary transporter 427. It is transferred to one top ring 432.

  The wafer transferred to the top ring 432 is adsorbed by the top ring vacuum adsorption mechanism, and the wafer is conveyed while being adsorbed to the polishing table 434. Then, the wafer is polished by a polishing surface made of a polishing cloth or a grindstone attached on the polishing table 434. The second polishing table 200 that performs the scrolling motion described above is disposed at a position where the top ring 432 can reach each. As a result, the wafer can be polished by the second polishing table 200 after the polishing by the first polishing table 434 is completed. However, depending on the film type attached to the semiconductor wafer, the film may be processed by the first polishing table 434 after being polished by the second polishing table 200. In this case, since the polishing surface of the second polishing table 200 has a small diameter, after attaching a grindstone that is more expensive than the polishing cloth and roughing, the life of the first polishing table having a large diameter is longer than that of the grindstone. It is possible to reduce the running cost by applying a short polishing cloth to finish polishing. Thus, an inexpensive polishing table can be supplied by using the first polishing table as a polishing cloth and the second polishing table as a grindstone. This is because the price of a grindstone is higher than that of a polishing cloth, and increases in proportion to the diameter. In addition, since the life of the polishing cloth is shorter than that of the grindstone, the life is extended by performing a light load such as finish polishing. Moreover, when the diameter is large, the contact frequency can be dispersed and the life is extended. Therefore, the maintenance cycle is extended and productivity is improved.

  In this case, after polishing the wafer with the first polishing table 434 and before the top ring 432 moves to the second polishing table 200, the top ring 432 is adjacent to the polishing table 434 at a position away from the polishing table 434. Then, the cleaning liquid is ejected toward the wafer held by the top ring 432 by the cleaning liquid nozzle 440 installed in this manner. Thus, since the wafer is rinsed once before moving to the second polishing table 200, contamination between the plurality of polishing tables can be prevented.

Next, two-cassette parallel processing will be described as an example of the substrate flow when the substrate is polished by the polishing apparatus shown in FIG.
That is, one substrate is: wafer cassette 401 → transfer robot 404 → wafer station table 407 → transfer robot 420 → reversing machine 428 → rotary transporter 427 loading table → top ring 432 → polishing table 434 → top. It goes through a path from the ring 432 to the rotary transporter 427 unloading stand → the reversing machine 428 → the transfer robot 420 → the cleaning machine 422 → the transfer robot 420 → the cleaning machine 405 → the transfer robot 404 → the wafer cassette 401.

  The other wafer is: wafer cassette 401 → transfer robot 404 → wafer station table 408 → transfer robot 421 → reversing machine 428 ′ → rotary transporter 427 loading table → top ring 432 → polishing table 434 → The route passes from the top ring 432 to the unloading platform of the rotary transporter 427 to the reversing machine 428 ′ → the transfer robot 421 → the cleaning machine 423 → the transfer robot 421 → the cleaning machine 406 → the transfer robot 404 → the wafer cassette 401.

It is a top view which shows the whole structure of the polishing apparatus provided with the dressing apparatus. It is a perspective view which shows the principal part of the polishing apparatus of FIG. FIG. 3 is a plan view of the polishing table of FIG. 2. It is sectional drawing of the state which is dressing the grinding | polishing surface in the polishing apparatus of FIG. It is a perspective view of the state which is dressing the grinding | polishing surface in the polishing apparatus of FIG. It is a perspective view which shows the dresser of a different shape. It is a perspective view which shows another dresser. It is a perspective view which shows another dresser. (A) is sectional drawing which shows the grindstone used for polishing, (b) is sectional drawing which shows the state of the grindstone after dressing. It is a graph which shows the fluctuation | variation of the electric current value of the motor during dressing. It is a graph which shows the fluctuation | variation of the electric current value of the motor when dressing using the dresser from which wear differs. It is a graph which shows the frequency spectrum immediately after dressing start and at the end of dressing. It is (a) perspective view which shows a dresser washing tank, (b) It is sectional drawing. It is sectional drawing which shows the other example of a dresser washing tank. It is sectional drawing which shows the other example of a dresser washing tank. It is a perspective view which shows another dressing apparatus. It is a perspective view which shows the dressing apparatus of the 1st Embodiment of this invention. It is a longitudinal cross-sectional view of the polishing table used in FIG. (A) is the PP sectional view taken on the line of FIG. 18, (b) is the XX sectional view of (a). It is a top view of FIG. It is a front view which cut and shows a part of FIG. Similarly, it is the left view which cuts and shows a part. Similarly, it is a side view showing a state when the dresser is positioned on the polishing table. It is a side view which shows the dressing apparatus of the 2nd Embodiment of this invention. It is a top view which shows the dressing apparatus of the 3rd Embodiment of this invention. Similarly, it is the YY sectional view taken on the line of FIG. Similarly, it is a figure which shows the height adjustment mechanism of a guide table. It is a figure which shows the other example of the height adjustment mechanism of a guide table. It is a figure which shows the further another example of the height adjustment mechanism of a guide table. It is a top view which shows other dressing apparatus. Similarly, it is a front view. It is a disassembled perspective view which shows the other example of a dresser. Similarly, it is a perspective view which shows the state which attached the side part dresser to the both sides of the basic dresser. Similarly, it is a front view. It is a front view which shows the other example of a dresser. It is a front view which shows other example of a dresser. It is a figure attached | subjected to description of the washing | cleaning machine using the cavitation used for a dresser. It is sectional drawing which shows the other example of a dresser washing tank. It is sectional drawing which shows the further another example of a dresser washing tank. It is a figure which shows the cleaning example of the dresser shown in FIG. It is a top view which shows a blade for the whole structure of the polishing apparatus provided with the dresser apparatus shown in FIGS. It is a figure which shows the relationship between the top ring and polishing table in FIG. It is sectional drawing which shows the conventional polishing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Polishing table 12 Top ring device 14 Dressing device 16 Grinding wheel 16a Polishing surface 18, 38 Motor 20 Drive shaft 20a Drive pin 28 Top ring 36 Dresser 36a Dressing surface 42 Diamond sheet 44a, 44b Motor current detector 46 Signal processing device 48 Control device 50 Top ring cleaning tank 52 Dresser cleaning tank 54 Main cleaning tank 56 Receiving tank 58 Cleaning liquid supply nozzle 62 Ultrasonic vibrator 64 Brush 70 Roller 72 Dresser 72a Dressing surface 74 Shaft 200 Polishing table 200a Polishing surface 202 Dresser 204 Dresser arm 206 Dresser Drive mechanism 208 Dresser cleaning tank 210 Guide table 212 Dresser material 212a Dressing surface 218 Elevating shaft 220 Oscillating shaft 222 Elevating cylinder 226 Stopper 2 8 Driving pulley 230 Dresser support shaft 232 Driven pulley 234 Belt 236 Oscillating cylinder 238 Link arm 240 Ball joints 246 and 280 Stepping motor 252 Lifting mechanism 254 and 286 Distance measuring sensors 258 and 262 Polishing cloth 264 Guide table 266 Rinsing nozzle 294 Polishing surface Outer region 296 Sensor dog 298a, 298b Sensor 300 Basic dresser 302 Side dresser 306, 308 Dresser material 312 Nozzle 314 Ultrasonic cleaner 316 Vibrator 320 Vibrator cleaner 322 Low pressure water 324 High pressure water 326 Cavitation 328 Shock wave 330 Washer 332 350 Cleaning article 340 Height adjustment mechanism 342 Rinse nozzle 427 Rotary transporter 432 Top ring 434 Polishing table 43 Dresser 450 wafer station 494 dresser head

Claims (4)

A dresser for dressing the polishing surface of a polishing table that slides relative to the surface to be polished of the material to be polished to polish the surface to be polished;
A horizontal movement mechanism that translates the dresser horizontally;
A lifting base to which the horizontal movement mechanism is attached;
A screw that rotates as the stepping motor is driven and a nut that is screwed to the screw and fixed to the elevating base are driven, and the elevating base is raised and lowered by driving the stepping motor to polish the polishing table of the dresser. A dressing device comprising an elevating mechanism that adjusts the pressing against the surface by the pressing amount of the dresser.   2. The dressing according to claim 1, wherein the height of the polishing surface and the dresser is measured, and the stepping motor is driven by converting into a necessary pulse so as to obtain a pressing amount corresponding to the height. apparatus. A dresser for dressing the polishing surface of a polishing table that slides relative to the surface to be polished of the material to be polished to polish the surface to be polished;
A horizontal movement mechanism that translates the dresser horizontally;
A lifting cylinder that lifts and lowers the dresser together with the parallel movement mechanism;
A dressing apparatus comprising: a pressing amount control mechanism that controls the lifting cylinder to control the pressing of the dresser against the polishing surface of the polishing table by the pressing amount of the dresser.   4. The dressing apparatus according to claim 3, wherein the pressing amount control mechanism includes a stopper that is provided on a cylinder rod of the elevating cylinder and restricts the raised position of the dresser.

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