JP2007309806A - Semiconductor device inspecting tool and semiconductor device inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress strain generated in a board, when a semiconductor device which is an object to be inspected, is brought into contact with a circuit board for inspection, concerning the circuit board for inspection whereupon many electronic components are mounted. <P>SOLUTION: A pressure vessel 111 is provided on a back part of the circuit board 106 for inspection, countering the pressure for bringing the semiconductor device 102 which is the object to be inspected into contact with the circuit board 106 for inspection, and the pressure of gas or liquid in the pressure vessel 111 is raised, by raising a piston 115 inside the pressure vessel 111. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor device inspection jig and a semiconductor device inspection method for inspecting electrical characteristics in the case of a semiconductor device, particularly a multi-pin.

  In recent years, with the advancement of semiconductor-related technologies, semiconductor devices have become smaller and have more pins, and an increasing number of semiconductor devices have adopted Ball Grid Array packages (hereinafter referred to as BGA packages) in which solder balls are formed on external terminals.

FIG. 5 is a cross-sectional view of a conventional semiconductor device inspection jig used for inspection of electrical characteristics of a BGA package semiconductor device.
In this semiconductor device inspection jig, as shown in FIG. 5, in order to make an electrical connection between an external terminal of a semiconductor device 102 to be inspected and adopting a BGA package and an inspection circuit board 106. Contactor 103 (hereinafter referred to as pogo pin). The semiconductor device 102 of the BGA package is disposed at a position where the pogo pin 103 and the external terminal of the semiconductor device 102 coincide with each other, and the upper surface of the semiconductor device 102 is pressed by the contact pusher jig 101, whereby the external terminal and the pogo pin 103 are Contact. At this time, in the solder ball of the semiconductor device 102, the sharp tip shape of the pogo pin 103 breaks the oxide film formed on the surface of the solder ball, so that the electrical contact between the solder ball of the semiconductor device 102 and the pogo pin 103 is achieved. Is realized.

  For the electrical contact between the solder ball of the semiconductor device 102 and the pogo pin 103, a force that breaks the oxide film of the solder ball is required, and a pressing pressure of several tens of grams per pin of the external terminal of the semiconductor device 102 is applied. For example, in a 1000-pin semiconductor device 102, several tens of kg of pressing force is required for the semiconductor device 102 in order to make electrical contact with all pins.

  As shown in FIG. 5, at the contact portion between the socket 104 and the inspection circuit board 106, the inspection circuit board 106 below the socket 104 is distorted into a U shape by the pressing force from the semiconductor device 102. Due to this distortion, the plate holding the pogo pin 103 of the socket 104 is also distorted in a U-shape like the circuit board 106 for inspection, and the stroke of the pogo pin 103 satisfies the specified stroke particularly in the center of the socket 104. Therefore, it is not possible to obtain a pressing force from the pogo pin 103 that only breaks through the oxide film of the solder ball, and an electrical contact failure occurs between the semiconductor device 102 and the circuit board 106 for inspection. Such an electrical contact failure causes a test error to the semiconductor device 102, such as a failure determination even if the semiconductor device 102 to be inspected is a non-defective semiconductor device.

Therefore, as shown in FIG. 6, by attaching a reinforcing plate 601 to the back surface of the inspection circuit board 106, distortion of the inspection circuit board 106 that leads to an inspection error such as a failure determination that may occur even for a non-defective semiconductor device. In this way, sufficient electrical contact is obtained between the semiconductor device 102 and the circuit board 106 for inspection. In another apparatus (for example, see Patent Document 1), the inspection circuit board is supported by providing a support bar on the back surface thereof, thereby preventing the inspection circuit board from being distorted as described above. ing.
JP 2005-235818 A

  However, in the conventional semiconductor device inspection jig as shown in FIG. 5, the power supply is stabilized and the noise of the analog signal is suppressed in the region facing the back surface of the semiconductor device 102 on the back surface of the circuit board 106 for inspection. When a large number of electronic components 105 are mounted, there is a problem in that a reinforcing plate or a support bar for suppressing distortion of the inspection circuit board 106 cannot be attached to that portion.

  In addition, as shown in FIG. 6, when a reinforcing plate 601 or a support bar for suppressing distortion of the inspection circuit board 106 is attached to a region facing the back surface of the semiconductor device 102 on the back surface of the inspection circuit board 106. In other words, when the upper surface of the semiconductor device 102 is pressurized, a contact point is generated between the reinforcing plate 601 or the support bar attached to the back surface of the circuit board for inspection 106 and the electronic component, and the electronic component is peeled off. There was a problem.

  The present invention solves the above-mentioned conventional problems, and can prevent peeling of an electronic component mounted in a region facing the back surface of a semiconductor device on the back surface of the circuit board for inspection. Even when a large number of electronic components are mounted on the back surface of the semiconductor device in the region facing the back surface of the semiconductor device, a reinforcing plate or a support rod cannot be used for that portion, the distortion of such a test circuit board is also reduced. A semiconductor device inspection jig and a semiconductor device inspection method that can be suppressed are provided.

  In order to solve the above-described problems, a semiconductor device inspection jig according to claim 1 of the present invention is configured to inspect the electrical characteristics of a semiconductor device through an inspection circuit board. In a semiconductor device inspection jig having a mechanism for making electrical contact with a substrate, the inspection circuit substrate is placed against the pressure applied to the inspection circuit substrate by contact of the semiconductor device with the inspection circuit substrate. A pressurization container having a mechanism for pressurizing the contact surface with the semiconductor device from the back surface is provided, and a part of the back surface of the circuit board for inspection and an inner wall of the pressurization container are provided inside the pressurization container. In addition, a partition plate that forms a sealed space for pressurizing the circuit board for inspection from the back surface is provided, and the sealed state of the sealed space is maintained. By the partition plate remains can move the inside of the pressure vessel, characterized by being configured the enclosed space to pressurize.

  Moreover, the semiconductor device inspection jig according to claim 2 of the present invention is the semiconductor device inspection jig according to claim 1, wherein the pressure applied to the sealed space is applied to the circuit board for inspection of the semiconductor device. A mechanism for interlocking with the contact operation is provided.

  According to a third aspect of the present invention, there is provided a semiconductor device inspection jig, wherein the semiconductor device is electrically contacted with the inspection circuit board in order to inspect the electrical characteristics of the semiconductor device through the inspection circuit board. In a semiconductor device inspection jig having a mechanism, the inspection circuit board is placed on a contact surface with the semiconductor device so as to oppose pressure applied to the inspection circuit board by contact of the semiconductor device with the inspection circuit board. In contrast, a pressurization container having a mechanism for pressurizing from the back surface is provided, and the test circuit board is pressurized from the back surface by a part of the back surface of the test circuit board and the inner wall of the pressurization container. A closed space is formed, and the pressurized container is provided with at least one through-hole that connects the sealed space and the outside thereof, and the sealed space passes through the sealed space. Characterized by being configured to pressurize the outside of the sealed space through the hole.

  Moreover, the semiconductor device inspection jig according to claim 4 of the present invention is the semiconductor device inspection jig according to claim 3, wherein the sealed space is only in one direction from the outside of the sealed space toward the through hole. It is characterized by being configured to pressurize.

  Moreover, the semiconductor device inspection jig according to claim 5 of the present invention is the semiconductor device inspection jig according to claim 3 or 4, wherein the inspection of the semiconductor device is performed by applying pressure to the sealed space. And a mechanism for interlocking with the contact operation to the circuit board.

  Moreover, the semiconductor device inspection jig according to claim 6 of the present invention is the semiconductor device inspection jig according to any one of claims 1 to 5, wherein the pressure by pressurization of the sealed space is adjusted. A pressure regulating valve is provided.

  A semiconductor device inspection jig according to claim 7 of the present invention is the semiconductor device inspection jig according to any one of claims 1 to 5, and is filled to pressurize the sealed space. The medium is a gas or a liquid.

  Moreover, the semiconductor device inspection jig according to claim 8 of the present invention is the semiconductor device inspection jig according to any one of claims 1 to 5, wherein the pressurized container is a rigid body. Features.

  According to a ninth aspect of the present invention, there is provided a semiconductor device inspection method comprising: moving the partition plate inside the pressurized container using the semiconductor device inspection jig according to the first or second aspect. The circuit board for inspection faces the pressure applied to the circuit board for inspection by the contact with the circuit board for inspection of the semiconductor device by pressurizing the airtight space while maintaining the sealed state of the airtight space. Is pressed from the back surface against the contact surface with the semiconductor device.

  In addition, a semiconductor device inspection method according to claim 10 of the present invention uses the semiconductor device inspection jig according to claim 3, claim 4, or claim 5, and passes through the through hole from the outside of the sealed space. By pressurizing the sealed space, the inspection circuit board is opposed to the contact surface with the semiconductor device so as to oppose the pressure applied to the inspection circuit board by the contact of the semiconductor device to the inspection circuit board. It is characterized by applying pressure from the back side.

  As described above, according to the present invention, a large number of electronic components are mounted on the back surface of the circuit board for inspection facing the back surface of the semiconductor device. Even when it cannot be used, such distortion of the circuit board for inspection can be suppressed.

  In addition, since there is no contact between the reinforcing plate or support bar and the electronic components that had been generated by attaching the reinforcing plate or support bar as in the past, mounting on the back side of the circuit board for inspection facing the back side of the semiconductor device It is possible to prevent peeling of the electronic components.

  As described above, it is possible to prevent an inspection error such as a defect determination that may occur even for a non-defective semiconductor device due to a defect in the semiconductor device inspection jig.

Hereinafter, a semiconductor device inspection jig and a semiconductor device inspection method showing embodiments of the present invention will be specifically described with reference to the drawings.
First, the configuration of the semiconductor device inspection jig according to the present embodiment will be described with reference to FIGS. 1, 2, 3, and 4.

1, 2, 3, and 4 are cross-sectional views of the semiconductor device inspection jig according to the first, second, third, and fourth embodiments, and suppress distortion of the inspection circuit board in the semiconductor device inspection jig. Is configured to do.
(Embodiment 1)
As shown in FIG. 1, a pressurized container 111 made of, for example, a metal such as stainless steel having a thickness of about 5 mm or more as a rigid body is opposed to a surface on which a socket 104 to which a semiconductor device 102 contacts is mounted on an inspection circuit board 106. The pressurization container 111 is attached to the back surface portion so that the opening of the pressurization container 111 is in contact with the back surface of the test circuit board 106, and a sealed space (hereinafter referred to as a high pressure chamber) 113 is formed by the test circuit board 106 and the pressurization container 111. Provide. The high-pressure chamber 113 is filled with gas or liquid, and a rubber packing 110 is inserted in the docking portion between the pressurized container 111 and the inspection circuit board 106 so that the high-pressure gas or liquid does not escape from the high-pressure chamber 113. Mounting and fixing with jig fixing screw 109. A pressure regulating valve 112 is provided on the wall surface inside the high pressure chamber 113 so that the pressure in the high pressure chamber 113 is constant.

  In order to divide the inside of the high-pressure chamber 113 into a space 114 that does not contact the sealed space (high-pressure chamber 113) that contacts the back surface of the circuit board 106 for inspection, a piston mechanism 115 is provided in the high-pressure chamber 113. In order to increase the pressure in the high-pressure chamber 113 at the portion in contact with the inspection circuit board 106, the piston mechanism 115 is configured to move up and down. The portion where the piston mechanism 115 and the wall surface of the high pressure chamber 113 are in contact with each other has a gap size of 10 μm or less so that the pressure of the high pressure chamber 113 does not escape from between the piston mechanism 115 and the wall surface of the high pressure chamber 113 when the piston mechanism 115 is moved. Then, lubricating oil is applied to the wall surfaces of the piston mechanism 115 and the high-pressure chamber 113 so that the piston mechanism 115 moves smoothly.

  In order to move the piston mechanism 115 up and down, a screw mechanism 118 is provided at the lower part of the piston mechanism 115, and the piston mechanism 115 is moved up and down by turning a handle 116 provided at the lower part of the screw mechanism 118. A handle fixing jig 117 is attached to the upper part of the handle 116 so that the pressure in the high-pressure chamber 113 does not drop due to the looseness of the screw mechanism 118 provided at the lower part of the piston mechanism 115.

In the semiconductor device inspection method of the first embodiment, when pressure is applied to the upper surface of the semiconductor device 102 from the contact pusher jig 101, the handle 116 provided at the lower portion of the piston mechanism 115 is rotated simultaneously or instantaneously, The piston mechanism 115 is raised. As the piston mechanism 115 rises, the volume of the pressurized container 111 in the high-pressure chamber 113 decreases, and the gas pressure inside the high-pressure chamber 113 rises. The distortion of the circuit board for inspection 106 is suppressed by the pressure, and when the pressure can be suppressed in this way, the handle fixing jig 117 above the handle 116 is fixed to keep the pressure in the high-pressure chamber 113 constant.
(Embodiment 2)
As shown in FIG. 2, a pressurized container 111 made of, for example, a metal such as stainless steel having a thickness of about 5 mm or more as a rigid body is opposed to the surface on which the socket 104 to which the semiconductor device 102 contacts is mounted on the inspection circuit board 106. The pressurized container 111 is attached to the rear surface portion so that the opening of the pressurized container 111 is in contact with the rear surface of the inspection circuit board 106, and the high-pressure chamber 113 that is a sealed space is provided by the inspection circuit board 106 and the pressurized container 111. The high-pressure chamber 113 is filled with gas or liquid, and a rubber packing 110 is inserted in the docking portion between the pressurized container 111 and the inspection circuit board 106 so that the high-pressure gas or liquid does not escape from the high-pressure chamber 113. Mounting and fixing with jig fixing screw 109. A pressure regulating valve 112 is provided on the wall surface inside the high pressure chamber 113 so that the pressure in the high pressure chamber 113 is constant.

  The pressurized container 111 is provided with a hole 204 through which gas or liquid can be injected into the high-pressure chamber 113, and high-pressure gas (1 atmosphere or more) or liquid can be sent from the hole 204 portion into the high-pressure chamber 113 through the pipe 202. As described above, the compressor device 201 is provided outside via the pipe 202. The gas or liquid sent from the compressor device 201 is sent in a gas or liquid having a pressure higher than the pressure in the high pressure chamber 113 so as not to flow from the high pressure chamber 113 to the compressor device 201 side. Further, a check valve 203 for preventing backflow is provided in the hole 204 in the wall surface portion of the high pressure chamber 113 so that the gas or liquid in the high pressure chamber 113 does not flow back to the compressor device 201 side.

In the semiconductor device inspection method of the second embodiment, when a pressure is applied to the upper surface of the semiconductor device 102 from the contact pusher jig 101, a high-pressure gas or liquid from the compressor device 201 is fed simultaneously or instantaneously, thereby The pressure of the gas or liquid inside the chamber 113 increases. The distortion of the circuit board for inspection 106 is suppressed by the pressure, and when the pressure can be suppressed in this way, the supply of high-pressure gas or liquid from the compressor device 201 is stopped. A check valve 203 provided in the hole 204 in the high pressure chamber 113 prevents gas or liquid from flowing out of the high pressure chamber 113 and keeps the pressure in the high pressure chamber 113 constant.
(Embodiment 3)
As shown in FIG. 3, a pressure vessel 111 made of, for example, a metal such as stainless steel having a thickness of about 5 mm or more as a rigid body is opposed to the surface on which the socket 104 to which the semiconductor device 102 contacts is mounted on the inspection circuit board 106. The pressurized container 111 is attached to the rear surface portion so that the opening of the pressurized container 111 is in contact with the rear surface of the inspection circuit board 106, and the high-pressure chamber 113 that is a sealed space is provided by the inspection circuit board 106 and the pressurized container 111. The high-pressure chamber 113 is filled with gas or liquid, and a rubber packing 110 is provided in a docking portion between the pressurized container 111 and the inspection circuit board 106 so that high-pressure gas or liquid does not escape from the high-pressure chamber 113. Mounting and fixing with jig fixing screw 109. A pressure regulating valve 112 is provided on the wall surface inside the high pressure chamber 113 so that the pressure in the high pressure chamber 113 is constant.

  The pressurized container 111 is provided with a hole 204 through which gas or liquid can be injected into the high-pressure chamber 113, and high-pressure gas (1 atmosphere or more) or liquid can be sent from the hole 204 portion into the high-pressure chamber 113 through the pipe 202. As described above, the cylinder mechanism 301 is provided via the pipe 202. The cylinder mechanism 301 uses the pressure from the contact pusher jig 101 used to contact the semiconductor device 102 and the pogo pin 103 of the socket 104 on the circuit board 106 for inspection. 302 is moved up and down, and gas or liquid inside the cylinder chamber 304 provided in the lower part of the piston mechanism 302 is sent into the high-pressure chamber 113 through the pipe 202.

In the semiconductor device inspection method of the third embodiment, when a pressure is applied to the upper surface of the semiconductor device 102 from the contact pusher jig 101, the piston mechanism 302 in the cylinder mechanism 301 is lowered simultaneously in conjunction with the contact pusher jig 101. Then, the gas or liquid in the cylinder chamber 304 is sent to the high pressure chamber 113 through the pipe 202, and the pressure of the gas or liquid in the high pressure chamber 113 increases. The pressure suppresses the distortion of the inspection circuit board 106. Next, when the contact pusher jig 101 rises, simultaneously, the piston mechanism 302 in the cylinder mechanism 301 rises in conjunction with the contact pusher jig 101, and gas or liquid in the high pressure chamber 113 enters the cylinder mechanism 301 through the pipe 202. The pressure of the gas or liquid inside the high pressure chamber 113 is reduced.
(Embodiment 4)
As shown in FIG. 4, a pressurized container 111 made of, for example, a metal such as stainless steel having a thickness of about 5 mm or more as a rigid body is opposed to the surface on which the socket 104 with which the semiconductor device 102 contacts is mounted on the inspection circuit board 106. The pressurized container 111 is attached to the rear surface portion so that the opening of the pressurized container 111 is in contact with the rear surface of the inspection circuit board 106, and the high-pressure chamber 113 that is a sealed space is provided by the inspection circuit board 106 and the pressurized container 111. The high-pressure chamber 113 is filled with gas or liquid, and a rubber packing 110 is inserted in the docking portion between the pressurized container 111 and the inspection circuit board 106 so that the high-pressure gas or liquid does not escape from the high-pressure chamber 113. Mounting and fixing with jig fixing screw 109. A pressure regulating valve 112 is provided on the wall surface inside the high pressure chamber 113 so that the pressure in the high pressure chamber 113 is constant.

  In order to divide the internal space of the pressurized container 111 into a high-pressure chamber 113 that is a sealed space in contact with the back surface of the circuit board for inspection 106 and a space 114 that does not contact the pressure mechanism 111, a piston mechanism 115 is provided in the pressurized container 111. The piston mechanism 115 is configured to move up and down in order to increase the pressure in the high pressure chamber 113. The portion where the piston mechanism 115 and the inner wall surface of the pressurized container 111 are in contact is a gap so that the pressure in the high pressure chamber 113 does not escape from between the piston mechanism 115 and the inner wall surface of the pressurized container 111 when the piston mechanism 115 is movable. Lubricating oil is applied to the inner wall surfaces of the piston mechanism 115 and the pressurized container 111 so that the dimensions are within 10 μm and the piston mechanism 115 moves smoothly.

  A piston vertical movement mechanism using pressure from a contact pusher jig 101 used for contacting the semiconductor device 102 and the pogo pin 103 of the socket 104 is provided below the piston mechanism 115. In the structure of this piston vertical movement mechanism, a support bar 403 connected to the lower part of the piston mechanism 115 is connected to an action point 406 which is a bearing, the support bar 401 is connected to the contact pusher jig 101, and the support bar 402 is operated. The point 406 is connected to a fulcrum 405 that is a bearing fixed to the base 407 and a force point 404 at the tip of the support bar 401.

  In the semiconductor device inspection method according to the fourth embodiment, for example, when inspection of the semiconductor device 102 is started and pressure is applied to the upper surface of the semiconductor device 102 from the contact pusher jig 101, at the same time, the above piston is used. Due to the vertical movement mechanism, the pressing force applied from the contact pusher jig 101 to the upper surface of the semiconductor device 102 is transmitted to the support bar 401 and the force point 404 moves downward, so that the support bar 402 is supported by the lever principle 405. And the action point 406 is moved upward, and the support bar 403 connected to the action point 406 pushes up the piston mechanism 115 by moving the action point 406 upward. The volume decreases and the internal gas or liquid pressure increases. As described above, the pressure of the gas or liquid in the high-pressure chamber 113 is increased, so that distortion of the inspection circuit board 106 is suppressed.

  After this, for example, when the inspection of the semiconductor device 102 is completed and the contact pusher jig 101 is raised, simultaneously with the rise, the contact pusher jig 101 is moved to the contact pusher jig 101 by the reverse movement by the piston vertical movement mechanism. When the piston mechanism 115 is moved down in conjunction with it, the volume in the high pressure chamber 113 is increased and the pressure of the internal gas or liquid is decreased.

  In the semiconductor device inspection jig and the semiconductor device inspection method of each of the above embodiments, a large number of electronic components are mounted on the back surface of the circuit board for inspection in the region facing the back surface of the semiconductor device. Even when a conventional reinforcing plate or support rod cannot be used, such distortion of the circuit board for inspection can be suppressed.

  In addition, since there is no contact between the reinforcing plate or support bar and the electronic components that had been generated by attaching the reinforcing plate or support bar as in the past, mounting on the back side of the circuit board for inspection facing the back side of the semiconductor device It is possible to prevent peeling of the electronic components.

  As a result, it is possible to prevent an inspection error such as a defect determination that may occur even for a non-defective semiconductor device due to a defect in the semiconductor device inspection jig.

  The semiconductor device inspection jig and the semiconductor device inspection method of the present invention can suppress distortion of a circuit board for inspection that leads to an inspection error such as a defect determination that may occur even for a non-defective semiconductor device. This is useful for a semiconductor device inspection technique using a semiconductor device inspection jig using an inspection circuit board on which a large number of electronic components for stabilization and suppression of analog signal noise are mounted.

Sectional drawing which shows the structural example of the semiconductor device inspection jig of Embodiment 1 of this invention Sectional drawing which shows the structural example of the semiconductor device inspection jig of Embodiment 2 of this invention. Sectional drawing which shows the structural example of the semiconductor device inspection jig of Embodiment 3 of this invention. Sectional drawing which shows the structural example of the semiconductor device inspection jig | tool of Embodiment 4 of this invention. Sectional drawing which shows the structural example of the conventional semiconductor device inspection jig Sectional drawing which shows the other structural example of the conventional semiconductor device inspection jig

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Contact pusher jig 102 (Inspection object) Semiconductor device 103 Pogo pin 104 Socket housing 105 Mounting component 106 Inspection circuit board 107 Socket fixing screw 108 Socket fixing screw stopper 109 Jig fixing screw 110 Rubber packing 111 Pressurization Container 112 Pressure adjusting valve 113 High pressure chamber 114 (Does not contact test circuit board) space 115 Piston mechanism 116 Handle 117 Handle fixing jig 118 Screw mechanism 201 Compressor device 202 Piping 203 Check valve 204 Hole 301 Cylinder mechanism 302 (Contact pusher) Piston mechanism (movable by jig pressure) 303 Support rod (1)
304 Cylinder chamber 401 Support rod (2)
402 Support rod (3)
403 Support rod (4)
404 Force point 405 Support point 406 Action point 407 Base stand 601 Reinforcement plate

Claims (10)

In order to inspect the electrical characteristics of the semiconductor device through the inspection circuit board, in the semiconductor device inspection jig having a mechanism for electrically contacting the semiconductor device to the inspection circuit board,
A mechanism for pressing the circuit board for inspection from the back surface against the contact surface with the semiconductor device opposite to the pressure applied to the circuit board for inspection by the contact of the semiconductor device to the circuit board for inspection. A pressure vessel having
A partition plate for forming a sealed space for pressurizing the circuit board for inspection from the back surface together with a part of the back surface of the circuit board for inspection and the inner wall of the pressure container is provided inside the pressure container. ,
A semiconductor device inspection jig configured to pressurize the sealed space by moving the inside of the pressurized container while the sealed state of the sealed space is maintained. The semiconductor device inspection jig according to claim 1,
A semiconductor device inspection jig comprising a mechanism for interlocking pressurization of the sealed space with a contact operation of the semiconductor device to the circuit board for inspection. In order to inspect the electrical characteristics of the semiconductor device through the inspection circuit board, in the semiconductor device inspection jig having a mechanism for electrically contacting the semiconductor device to the inspection circuit board,
A mechanism for pressing the circuit board for inspection from the back surface against the contact surface with the semiconductor device opposite to the pressure applied to the circuit board for inspection by the contact of the semiconductor device to the circuit board for inspection. A pressure vessel having
A part of the back surface of the circuit board for inspection and an inner wall of the pressurized container form a sealed space for pressurizing the circuit board for inspection from the back surface,
The pressurized container is provided with at least one through hole connecting the sealed space and the outside thereof,
A semiconductor device inspection jig configured to pressurize the sealed space from the outside of the sealed space through the through hole. A semiconductor device inspection jig according to claim 3,
A semiconductor device inspection jig configured to pressurize the sealed space only in one direction from the outside of the sealed space toward the through hole. A semiconductor device inspection jig according to claim 3 or claim 4,
A semiconductor device inspection jig comprising a mechanism for interlocking pressurization of the sealed space with a contact operation of the semiconductor device to the circuit board for inspection. A semiconductor device inspection jig according to any one of claims 1 to 5,
A semiconductor device inspection jig comprising a pressure adjustment valve for adjusting a pressure due to pressurization of the sealed space. A semiconductor device inspection jig according to any one of claims 1 to 5,
A semiconductor device inspection jig, wherein a medium filled to pressurize the sealed space is gas or liquid. A semiconductor device inspection jig according to any one of claims 1 to 5,
A semiconductor device inspection jig, wherein the pressurized container is a rigid body. Using the semiconductor device inspection jig according to claim 1 or 2,
By moving the partition plate inside the pressurized container, the sealed space is pressurized while maintaining the sealed state of the sealed space,
The circuit board for inspection is pressed from the back surface against the contact surface with the semiconductor device, opposite to the pressure applied to the circuit board for inspection by the contact of the semiconductor device to the circuit board for inspection. Semiconductor device inspection method. Using the semiconductor device inspection jig according to claim 3 or claim 4 or claim 5,
By pressurizing the sealed space from the outside of the sealed space through the through hole,
The circuit board for inspection is pressed from the back surface against the contact surface with the semiconductor device, opposite to the pressure applied to the circuit board for inspection by the contact of the semiconductor device to the circuit board for inspection. Semiconductor device inspection method.

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