JP2007302968A - Method for manufacturing plated substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a plated substrate, by which a metal layer having a fine pattern can be formed with good precision. <P>SOLUTION: The method for manufacturing the plated substrate 100 is based on an electroless plating method and includes a process for forming a catalyst layer on a substrate by dipping the substrate into a catalyst solution containing palladium, hydrogen peroxide and hydrochloric acid and a process for forming a metal layer by depositing a metal on an area, where the catalyst layer is not formed, by dipping the substrate in an electroless plating solution. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a plated substrate.

  With the recent increase in speed and density of electronic devices, the additive method has attracted attention as a method for producing a plated substrate having a metal layer on the substrate. In the additive method, a method is known in which a photoresist provided on a substrate is patterned to form a plating resist, and a metal layer is deposited by performing plating on the opening of the plating resist. Patent document 1 is disclosing the electroless-plating liquid for performing a plating process using a plating resist in this way.

  According to this method, a step of finally removing the plating resist is required, and thus the number of manufacturing steps is a problem. Therefore, a method of depositing a metal layer without using a plating resist has attracted attention.

Generally, in order to deposit a metal layer by an electroless plating method, the substrate is immersed in an electroless plating solution. Metal colloidal particles contained in the electroless plating solution are deposited on the substrate to form metal fine particles (plating particles), and these aggregate to form a metal layer. Therefore, the particle size of the metal fine particles resulting from the metal colloid particles is the minimum unit of the metal layer. Therefore, when using a method in which a metal layer is deposited without using a plating resist, the particle size of the metal colloid particles in the electroless plating solution is suitable for the width of the wiring in order to accurately form a fine pattern. It is important to adjust the size.
Japanese Patent Laid-Open No. 10-140364

  The objective of this invention is providing the manufacturing method of the plating substrate which forms a fine pattern accurately.

The method for producing a plated substrate according to the present invention includes:
A method for producing a plated substrate by an electroless plating method for depositing metal,
(A) providing a catalyst layer on the substrate by immersing the substrate in a catalyst solution containing palladium, hydrogen peroxide and hydrochloric acid;
(B) immersing the substrate in an electroless plating solution to deposit a metal in a region where the catalyst layer is not formed to provide a metal layer.

  Thus, by making the formation region of the catalyst layer different from the formation region of the metal layer, fine plating particles can be adsorbed on the substrate. That is, by making the region for depositing plating particles different from the region for adsorption, even fine plating particles can be stably adsorbed on the substrate. Therefore, a metal layer having a fine pattern can be formed.

In the method for producing a plated substrate according to the present invention,
The catalyst solution may be adjusted to pH 4.0 to pH 6.9.

In the method for producing a plated substrate according to the present invention,
The electroless plating solution may be adjusted to pH 2.5 to PH 4.0.

  Thus, by defining the pH of the electroless plating solution, the plating particles can be made finer, so that a metal layer with a fine pattern can be formed.

In the method for producing a plated substrate according to the present invention,
The electroless plating solution may contain nickel.

The method for producing a plated substrate according to the present invention includes:
A method for producing a plated substrate by an electroless plating method for depositing metal,
(A) providing a catalyst layer in a region other than the predetermined pattern on the substrate;
(B) a step of providing a metal layer having a predetermined pattern in a region where the catalyst layer is not formed by immersing the substrate in an electroless plating solution adjusted to pH 2.5 to PH 4.0;
including.

In the method for producing a plated substrate according to the present invention,
The electroless plating solution may contain nickel.

In the method for producing a plated substrate according to the present invention,
The step (a)
Providing a resist layer having a predetermined pattern on the substrate;
Providing a catalyst adsorbing layer containing a surfactant or a silane coupling agent on the substrate;
Providing a catalyst layer on the catalyst adsorption layer by immersing the substrate in a catalyst solution comprising a mixed aqueous solution containing palladium, hydrogen peroxide and hydrochloric acid;
Removing the resist layer to remove the catalyst adsorption layer and the catalyst layer of the predetermined pattern.

In the method for producing a plated substrate according to the present invention,
The step (a)
Providing a resist layer having a predetermined pattern on the substrate;
Providing a catalyst adsorbing layer containing a surfactant or a silane coupling agent on the substrate;
Removing the resist adsorption layer of the predetermined pattern by removing the resist layer;
Providing a catalyst layer on the catalyst adsorption layer by immersing the substrate in a catalyst solution comprising a mixed aqueous solution containing palladium, hydrogen peroxide and hydrochloric acid;
Can be included.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1. Method for Manufacturing Plated Substrate FIGS. 1 to 8 are diagrams showing a method for manufacturing a plated substrate 100 (see FIG. 8) according to the present embodiment. In the present embodiment, a plating substrate is manufactured by applying electroless plating.

  (1) First, the substrate 10 is prepared. The substrate 10 may be an insulating substrate as shown in FIG. A wiring substrate can be manufactured by forming a metal layer on an insulating substrate by a process described later. Alternatively, the substrate 10 may be a light transmissive substrate (for example, a transparent substrate) that transmits visible light. An optical element substrate such as a polarizing plate can be produced by forming a metal layer on the light transmissive substrate by a process described later.

  The substrate 10 may be an organic substrate (for example, a plastic material or a resin substrate) or an inorganic substrate (for example, quartz glass, a silicon wafer, or an oxide layer). Examples of the plastic material include polyimide, polyethylene terephthalate, polycarbonate, polyphenylene sulfide, and polyethylene terephthalate. The substrate 10 includes not only a single layer but also a multilayer substrate in which at least one insulating layer is formed on a base substrate. In this embodiment, a metal layer is formed over the substrate 10. Further, it is preferable that the surface of the substrate 10 is not uneven, and for example, the height of the unevenness is preferably less than 10 nm.

  Next, a resist layer 22 having a predetermined pattern is formed on the substrate 10. A resist layer 22 can be formed as shown in FIG. 2 by applying a resist (not shown) to the upper surface of the substrate 10 and then patterning the resist by a lithography method. Here, the predetermined pattern is a shape of a region where formation of the metal layer 34 is desired, and can be an arbitrary shape.

  (2) Next, the substrate 10 is cleaned. The substrate 10 may be cleaned by dry cleaning or wet cleaning, but dry cleaning is more preferable. By performing dry cleaning, damage to the resist layer 22 such as peeling can be prevented.

  As shown in FIG. 2, the dry cleaning can be performed by irradiating with vacuum ultraviolet rays for 30 seconds to 900 seconds in a nitrogen atmosphere using a vacuum ultraviolet lamp. By cleaning the substrate 10, dirt such as oil and fat adhering to the surface of the substrate 10 can be removed. Further, the surfaces of the substrate 10 and the resist layer 22 can be changed from water-repellent to hydrophilic. Moreover, if the surface potential in the liquid of the substrate 10 is a negative potential, a uniform negative potential surface can be formed by cleaning the substrate 10.

  The wet cleaning can be performed, for example, by immersing the substrate 10 in ozone water (ozone concentration 10 ppm to 20 ppm) at room temperature for about 5 minutes to 30 minutes. Dry cleaning can be performed by irradiating with vacuum ultraviolet rays for 30 seconds to 900 seconds in a nitrogen atmosphere using a vacuum ultraviolet lamp (wavelength 172 nm, output 10 mW, distance between samples 1 mm).

  (3) Next, the catalyst adsorption layer 24 containing a surfactant or a silane coupling agent is formed on the substrate 10.

  First, as shown in FIG. 3, the substrate 10 is immersed in a catalyst adsorption solution 14 in which a surfactant or a silane coupling agent is dissolved. When the surface potential in the liquid on the surface of the substrate 10 is a negative potential, it is preferable to apply a cationic surfactant. This is because the cationic surfactant is more easily adsorbed to the substrate 10 than other surfactants. Examples of cationic surfactants include water-soluble surfactants containing aminosilane components and alkylammonium surfactants (eg, cetyltrimethylammonium chloride, cetyltrimethylammonium bromide, cetyldimethylammonium bromide, etc.). Can be used.

  As the silane coupling agent contained in the catalyst adsorption solution 14, for example, hexamethyldisilazane can be used. The immersion time can be set to about 1 to 10 minutes, for example.

  Next, the substrate 10 is taken out from the surfactant solution and washed with ultrapure water. Thereafter, the substrate 10 is naturally dried at room temperature, for example, or sprayed with compressed air to remove water droplets, and then left in an oven at 90 ° C. to 120 ° C. for about 10 minutes to 1 hour to be dried. Through the above steps, the catalyst adsorption layer 24 can be provided on the substrate 10 as shown in FIG. At this time, when a cationic surfactant is applied as the surfactant, the surface potential in the liquid of the substrate 10 is shifted to the positive potential side than before the adsorption.

  (4) Next, as shown in FIG. 5, the substrate 10 is immersed in the catalyst solution 30. The catalyst solution 30 includes a catalyst component that functions as a catalyst for electroless plating. As the catalyst component, for example, palladium can be used.

For example, the catalyst solution 30 can be produced by the following procedure.
(4a) Palladium pellets having a purity of 99.99% are dissolved in a mixed solution of hydrochloric acid, hydrogen peroxide solution, and water to obtain a palladium chloride solution having a palladium concentration of 0.1 to 0.5 g / l. Here, it is preferable that the mixed solution of hydrochloric acid, hydrogen peroxide solution and water is obtained by adding 50 ml to 200 ml of 35% hydrochloric acid and 50 ml to 200 ml of 30% hydrogen peroxide solution to 600 ml of water.
(4b) The palladium concentration is adjusted to 0.01 g / l to 0.05 g / l by further diluting the above palladium chloride solution with water and hydrogen peroxide. The mixing ratio of water and hydrogen peroxide solution added here is preferably 5 to 30 ml of 30% hydrogen peroxide solution with respect to 250 ml of water.
(4c) The pH of the palladium chloride solution is adjusted to 4.0 to 6.9 using an aqueous sodium hydroxide solution or the like. By adjusting in this way, it can be set as the catalyst solution suitable for forming a catalyst layer.

  The catalyst solution 30 may finally have the pH described above, and the order of addition of each solution is not particularly limited. For example, after adjusting the pH with an aqueous sodium hydroxide solution, hydrogen peroxide solution is added. May be.

  After dipping in the catalyst solution 30, the substrate 10 may be washed with water. The washing with water can be performed with pure water. This washing with water can prevent catalyst residues from being mixed into the electroless plating solution described later.

  Through the above steps, the catalyst layer 31 is formed. As shown in FIG. 6, the catalyst layer 31 is formed on the upper surface of the catalyst adsorption layer 24 on the substrate 10 and the resist layer 22.

  (5) Next, the resist layer 22 on the substrate 10 is removed. Specifically, as shown in FIG. 7, the resist layer 22 having a predetermined pattern is removed. Here, the resist layer 22 can be removed using, for example, acetone. The catalyst adsorption layer 24 and the catalyst layer 31 provided on the resist layer 22 are also removed together with the resist layer 22. Thereby, the catalyst adsorption layer 26 and the catalyst layer 32 can be formed only in regions other than the predetermined pattern.

  (6) Next, a metal layer 34 having a predetermined pattern is formed (see FIG. 8). In other words, the metal layer 34 is formed in a region on the substrate 10 where the catalyst layer 32 is not formed. Specifically, the metal layer 34 can be deposited in a region where the catalyst layer 32 is not formed by immersing the substrate 10 in an electroless plating solution. The electroless plating solution is preferably adjusted so that the average particle diameter of the plating particles is 20 nm to 50 nm when deposited as plating particles on the substrate 10.

  Specifically, the electroless plating solution includes an acidic type and an alkaline type, but in this embodiment, an acidic type is used. When the nickel layer is deposited as the metal layer 34, the electroless plating solution contains, for example, nickel, a reducing agent, a complexing agent, and the like. Specifically, as the electroless plating solution, a solution mainly composed of nickel sulfate hexahydrate or nickel chloride hexahydrate and containing sodium hypophosphite as a reducing agent can be used. In the present embodiment, the electroless plating solution is adjusted to pH 2.5 to pH 4.0. Since a commercially available electroless plating solution usually has a pH of about 4.5 to 5, the pH can be adjusted by adding a strong acid reagent such as sulfuric acid or hydrochloric acid to the electroless plating solution. Moreover, pH can be adjusted also by changing the addition amount etc. of a reducing agent.

  For example, a nickel layer having a thickness of 20 nm to 100 nm can be formed by immersing the substrate 10 in an electroless plating solution (temperature 70 to 80 ° C.) containing nickel sulfate hexahydrate for about 10 seconds to 10 minutes. it can. The material of the metal layer 34 is not particularly limited as long as the material causes a plating reaction by a catalyst. For example, the metal layer 34 can be formed of platinum (Pt), gold (Au), or the like. Thus, the metal layer 34 having a predetermined pattern can be formed on the upper surface of the substrate 10.

  Through the above steps, the plated substrate 100 can be formed. In the method of manufacturing plated substrate 100 according to the present embodiment, a catalyst layer is formed using a catalyst solution prepared using palladium, hydrogen peroxide, and hydrochloric acid. This catalyst solution contains only palladium, hydrogen, oxygen, sodium, and chlorine as components, and does not contain other surfactants, complexing agents, and the like. Therefore, in the catalyst solution, molecules having a large molecular weight, bulky functional groups, and the like do not enter between the palladium atoms constituting the palladium colloid particles, and the size of the palladium colloid particles can be reduced. Therefore, by using such a catalyst solution, a finely patterned catalyst layer can be formed with high accuracy, and as a result, high-density wiring can be accurately formed.

  In the present embodiment, the electroless plating solution is adjusted to pH 2.5 to pH 4.0. This changes pH in the direction of ionizing the metal in the electroless plating solution. By ionizing the metal, the size of the metal colloid particles in the electroless plating solution can be reduced. Therefore, by using such an electroless plating solution, a finely patterned metal layer can be formed with high accuracy.

2. Plated Substrate A plated substrate 100 manufactured by the above-described method will be described with reference to FIG. FIG. 9 is a perspective view schematically showing the plating substrate 100 according to the present embodiment. The plated substrate 100 includes a substrate 10 and a metal layer 34 formed on the substrate 10. The metal layer 34 has a predetermined pattern. The predetermined pattern can be, for example, a one-dimensional or two-dimensional periodic pattern. The plated substrate 100 can function as an optical element substrate such as a polarizing plate by having a predetermined pattern on the light transmissive substrate. For example, as shown in FIG. 9, the plating substrate 100 has a one-dimensional periodic pattern (stripe shape) in which linear metal layers having a constant interval b and a constant width a are repeatedly provided in the X-axis direction. Can be. When the width a in the periodic direction (X-axis direction) is equal to or smaller than the wavelength of visible light and the substrate 10 is made of a light-transmitting substrate, the plated substrate 100 can function as a polarizing plate.

  The plated substrate can have a width a of 30 nm to 200 nm, for example, and a distance b of 200 nm or less. Furthermore, the difference between the width a and the distance b is preferably 20 nm or less. By defining such a size as a predetermined pattern, the metal layer 34 can be formed in a region where the catalyst layer 32 is not formed. That is, when the width a is 30 nm to 200 nm and the interval b is 200 nm or less, the distance between the formation region of the catalyst layer 32 and the formation region of the metal layer 34 is shortened, and the plated particles deposited on the catalyst layer 32 Can be reliably moved to a region where the catalyst layer 32 is not formed. Further, when the difference between the width a and the distance b is 20 nm or less, the catalyst layer 32 including an appropriate amount of catalyst for depositing the metal layer 34 having a predetermined pattern can be formed.

  Further, in the method for manufacturing plated substrate 100 according to the present embodiment, metal layer 34 is formed in a region where catalyst layer 32 is not formed. This mechanism is assumed as follows. The electroless plating reaction is a reduction reaction between a reducing agent and metal ions in the electroless plating solution, and is a reaction in which plated particles are deposited when the metal ions receive electrons from the reducing agent. Since this reaction is promoted by the catalyst contained in the catalyst layer 32, it mainly proceeds in the vicinity of the catalyst layer 32. In the electroless plating solution, since a plurality of metal ions are present as an aggregate, plating particles that are an aggregate of a plurality of metal atoms are deposited by a reduction reaction. When the average particle diameter of the plating particles at the time of deposition is, for example, about 20 nm to 50 nm, the plating particles move to the region where the catalyst layer 32 is not formed after being generated in the vicinity of the catalyst layer 32 and moved to the substrate 10. Adsorb to. That is, the plating particles are deposited in the vicinity of the catalyst layer 32, but the energy state is unstable because the reduction reaction continues further in the vicinity of the catalyst layer 32. If there is no mass above a certain level, the plating particles are stable on the catalyst layer 32. It cannot be adsorbed. Therefore, when the average particle diameter is about 20 nm to 50 nm, the plating particles cannot be stabilized on the catalyst layer 32 and move to the substrate 10 to be adsorbed. Therefore, the metal layer 34 can be formed in a region where the catalyst layer 32 is not formed.

3. Electronic Device FIG. 10 shows an example of an electronic device to which a plated substrate manufactured by the method for manufacturing a plated substrate according to the first embodiment is applied. When the substrate 10 is an insulating substrate, the plating substrate 100 can function as a wiring substrate. The electronic device 1000 includes a plating substrate 100 as a wiring substrate, an integrated circuit chip 90, and another substrate 92.

  The wiring pattern formed on the plating substrate 100 may be for electrically connecting electronic components. The plated substrate 100 is manufactured by the manufacturing method described above. In the example shown in FIG. 10, an integrated circuit chip 90 is electrically connected to the plating substrate 100, and one end of the plating substrate 100 is electrically connected to another substrate 92 (for example, a display panel). Yes. The electronic device 1000 may be a display device such as a liquid crystal display device, a plasma display device, or an EL (Electro luminescence) display device.

  Further, the plating substrate 100 as the optical element substrate may function as a polarizing plate for a liquid crystal display device, a projector device, or the like.

4). Modified Example A method for manufacturing a plated substrate according to a modified example is that the removal step of the resist layer 22 in step (5) in the present embodiment is performed before the formation of the catalyst layer 31. Different from the manufacturing method.

  First, the substrate 10 is prepared, and a resist layer 22 having a predetermined pattern is formed. Thereafter, the substrate 10 is cleaned. Next, the catalyst adsorption layer 24 is provided on the substrate 10 by the method described above, the resist layer 22 is removed, and the catalyst adsorption layer 26 is formed only in a region other than the predetermined pattern. Next, the catalyst layer 32 is formed on the catalyst adsorption layer 26. Next, the metal layer 34 is formed in a region other than the catalyst layer 32 by immersing the substrate 10 in an electroless plating solution.

  The plating substrate concerning a modification can be formed by the above process. Note that the details of each step are the same as the corresponding steps in the present embodiment, and a description thereof will be omitted.

5). Experimental example 5.1. First Experimental Example A plated substrate was formed by the method for manufacturing a plated substrate according to the present embodiment.

  (1) A photoresist film is formed on a glass substrate, and then exposed and developed in a straight line having a width of about 130 nm at a pitch of about 200 nm by a direct drawing method, so that a linear line of about 70 nm and an interval of about 130 nm are obtained. A striped photoresist was formed.

  (2) This glass substrate was cut into a 1 cm square, immersed in a cationic surfactant solution (FPD conditioner manufactured by Technique Japan Co., Ltd.), and then the glass substrate was sufficiently washed with water.

  (3) A catalyst solution was prepared as follows. First, 100 ml of 35% hydrochloric acid (special grade reagent) and 100 ml of 30% hydrogen peroxide solution (special grade reagent) were added to 600 ml of water to prepare a mixed solution of hydrochloric acid, hydrogen peroxide solution and water. 0.2 g of palladium pellets having a purity of 99.99% were put in the above mixed solution and dissolved for about 48 hours to obtain a palladium chloride solution having a palladium concentration of about 0.25 g / l.

  Next, 250 ml of water was added to 50 ml of this palladium chloride solution, and 20 ml of hydrogen peroxide was further added. Furthermore, the palladium chloride solution was adjusted to about pH 5.8 using an aqueous sodium hydroxide solution or the like.

  (4) Next, the glass substrate was immersed in the catalyst solution described above. Thereafter, the photoresist on the glass substrate was removed using an organic solvent such as acetone. Thereafter, the glass substrate was sufficiently washed with water. As a result, a linear catalyst layer having a width of about 130 nm and a stripe-shaped catalyst layer having an interval of about 70 nm was formed.

  (5) Next, the glass substrate on which the catalyst layer was formed was immersed in an 80 ° C. nickel electroless plating solution (FPD nickel manufactured by Technique Japan Co., Ltd.) adjusted to about pH 2.8 and pH 3.8. As a result, a metal layer having a thickness of about 30 nm to 50 nm, a width of about 70 nm and a spacing of 130 nm was obtained on the glass substrate.

  SEM images of the nickel metal layer thus formed are shown in FIGS. FIG. 11 is an SEM image of the nickel metal layer when the nickel electroless plating solution is adjusted to about pH 3.8, and FIG. 12 is a nickel metal layer when the nickel electroless plating solution is adjusted to about pH 2.8. It is a SEM image of.

5.2. Second experimental example (comparative example)
A plated substrate according to the comparative example was formed as follows.

  (1) A photoresist film is formed on a glass substrate, and then exposed and developed in a straight line having a width of about 130 nm at a pitch of about 200 nm by a direct drawing method, so that a linear line of about 70 nm and an interval of about 130 nm are obtained. A striped photoresist was formed.

  (2) This glass substrate was cut into a 1 cm square, immersed in a cationic surfactant solution (FPD conditioner manufactured by Technique Japan Co., Ltd.), and then the glass substrate was sufficiently washed with water.

  (3) It was immersed in a commercially available catalyst solution containing palladium. This catalyst solution contained palladium, a surfactant and the like and had a pH of 6. Thereafter, the photoresist on the glass substrate was removed using an organic solvent such as acetone. Thereafter, the glass substrate was sufficiently washed with water. As a result, a linear catalyst layer having a width of about 800 nm and a stripe-shaped catalyst layer having an interval of about 200 nm was formed.

  (4) Next, the glass substrate on which the catalyst layer was formed was immersed in an 80 ° C. nickel electroless plating solution (FPD nickel manufactured by Technique Japan Co., Ltd.) whose pH was not adjusted. This nickel electroless plating solution had a pH of about 4.5. As a result, a nickel metal layer having a thickness of about 30 nm to 50 nm and a width of about 200 nm in contact with the adjacent line was obtained on the glass substrate. An SEM image of the nickel metal layer thus formed is shown in FIG.

5.3. Experimental Results In the first experimental example, a nickel layer was formed using a catalyst layer containing a catalyst solution containing palladium, hydrogen peroxide and hydrochloric acid and an electroless plating solution adjusted to pH 2.5 to 4.0. In contrast, in the second experimental example, a catalyst layer was formed using a commercially available catalyst solution, and a nickel layer was formed using a nickel electroless plating solution having a normal pH. Since the width of the nickel layer produced in the second experimental example is about 200 nm, it was in contact with the adjacent line as shown in FIG.

  On the other hand, the nickel layer produced in the first experimental example has a width of about 70 nm, which is narrower than the nickel layer produced using a commercially available catalyst solution in the second experimental example. It was confirmed that Therefore, according to the first experimental example and the second experimental example, by using a catalyst solution containing palladium, hydrogen peroxide and hydrochloric acid, and an electroless plating solution adjusted to pH 2.5 to 4.0, It was found that the pattern can be formed with high accuracy and the reliability of the plated substrate can be improved.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, in the above-described embodiment, a resist layer is previously provided on a substrate in a region other than a desired pattern region, and a catalyst adsorption layer and a catalyst layer are formed on the entire surface. However, instead of this, the catalyst layer may be formed without using the resist layer. Specifically, for example, a catalyst adsorption layer is formed on the entire surface of the substrate, and a part of the catalyst adsorption layer is photodecomposed to leave the catalyst adsorption layer only in a desired pattern region. Thereby, the catalyst layer can be formed only in a desired pattern region. The photodecomposition of the catalyst adsorption layer can be performed using vacuum ultraviolet (VUV). By setting the wavelength of light to, for example, 170 nm to 260 nm, interatomic bonds (for example, C—C, C═C, C—H, C—F, C—Cl, C—O, C—N, C = O, O = O, OH, HF, H-Cl, NH, etc.) can be cleaved. By using this wavelength band, equipment such as a yellow room becomes unnecessary, and a series of steps according to the present embodiment can be performed under a white light, for example.

  Further, the invention includes substantially the same configuration (for example, a configuration having the same function, method, and result, or a configuration having the same purpose and result) as the configuration described in the embodiment. In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. The figure which shows the manufacturing method of the plating board | substrate concerning this Embodiment. Sectional drawing which shows the plating board | substrate concerning this Embodiment. The perspective view which shows the plating board | substrate concerning this Embodiment. The figure which shows an example of the electronic device to which the plating substrate concerning this Embodiment is applied. The figure which shows the SEM image of the plating board | substrate concerning a 1st experiment example. The figure which shows the SEM image of the plating board | substrate concerning a 1st experiment example. The figure which shows the SEM image of the plating board | substrate concerning a 2nd experiment example.

Explanation of symbols

10 substrate, 14 surfactant solution, 18 light source, 20 light, 22 resist layer, 24 catalyst adsorption layer, 26 catalyst adsorption layer, 30 catalyst solution, 31 catalyst layer, 32 catalyst layer, 34 metal layer, 90 integrated circuit chip, 92 Other substrates, 100 Plated substrates, 1000 Electronic devices

Claims (8)

A method for producing a plated substrate by an electroless plating method,
(A) providing a catalyst layer on the substrate by immersing the substrate in a catalyst solution containing palladium, hydrogen peroxide and hydrochloric acid;
(B) immersing the substrate in an electroless plating solution to deposit a metal in a region where the catalyst layer is not formed to provide a metal layer;
A method for manufacturing a plated substrate, comprising: In claim 1,
The method for producing a plated substrate, wherein the catalyst solution is adjusted to pH 4.0 to pH 6.9. In claim 1 or 2,
The electroless plating solution is a method for producing a plated substrate, which is adjusted to pH 2.5 to PH 4.0. In claim 3,
The electroless plating solution contains nickel and is a method for manufacturing a plated substrate. A method for producing a plated substrate by an electroless plating method,
(A) providing a catalyst layer in a region other than the predetermined pattern on the substrate;
(B) a step of providing a metal layer having a predetermined pattern in a region where the catalyst layer is not formed by immersing the substrate in an electroless plating solution adjusted to pH 2.5 to PH 4.0;
A method for manufacturing a plated substrate, comprising: In claim 5,
The electroless plating solution contains nickel and is a method for manufacturing a plated substrate. In any one of Claims 1 thru | or 6.
The step (a)
Providing a resist layer having a predetermined pattern on the substrate;
Providing a catalyst adsorbing layer containing a surfactant or a silane coupling agent on the substrate;
Providing a catalyst layer on the catalyst adsorption layer by immersing the substrate in a catalyst solution comprising a mixed aqueous solution containing palladium, hydrogen peroxide and hydrochloric acid;
Removing the catalyst adsorption layer and the catalyst layer of the predetermined pattern by removing the resist layer;
A method for manufacturing a plated substrate, comprising: In any one of Claims 1 thru | or 6.
The step (a)
Providing a resist layer having a predetermined pattern on the substrate;
Providing a catalyst adsorbing layer containing a surfactant or a silane coupling agent on the substrate;
Removing the resist adsorption layer of the predetermined pattern by removing the resist layer;
Providing a catalyst layer on the catalyst adsorption layer by immersing the substrate in a catalyst solution comprising a mixed aqueous solution containing palladium, hydrogen peroxide and hydrochloric acid;
A method for manufacturing a plated substrate, comprising: