JP2007287825A - Circuit board connection structure - Google Patents

Circuit board connection structure Download PDF

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JP2007287825A
JP2007287825A JP2006111717A JP2006111717A JP2007287825A JP 2007287825 A JP2007287825 A JP 2007287825A JP 2006111717 A JP2006111717 A JP 2006111717A JP 2006111717 A JP2006111717 A JP 2006111717A JP 2007287825 A JP2007287825 A JP 2007287825A
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circuit board
connectors
sub
ffc
main circuit
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Hiroshi Namikawa
浩史 並川
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Murata Machinery Ltd
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Murata Machinery Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board connection structure which can save space when connecting circuit boards with a plurality of FFCs and can prevent erroneous connection by clarifying the arrangement relationship between connectors. <P>SOLUTION: In the circuit board connection structure, a plurality of connectors are arranged close to each other in such a manner the longitudinal direction may be nearly parallel to a main circuit board 20 and a sub-circuit board 10, respectively. The main circuit board and the sub-circuit board are arranged in such a manner that the plurality of connectors 21a and 21b on the main circuit board side and the plurality of connectors 11a and 11b on the sub-circuit board side may be nearly perpendicular to each other. The plurality of flat cables 30a and 30b are each folded back in the middle into such a shape that the folded portion may be perpendicular to the main body. Terminal portions formed at both ends of each cable are connected to the connectors formed in the main circuit board and the sub-circuit board, respectively, in such a manner that the cables may overlap in the thickness direction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、回路基板の接続構造に関し、詳しくは、各回路基板のコネクタが直交する向きになっている場合において回路基板間を複数のフラットケーブルにて接続する構造に関するものである。   The present invention relates to a circuit board connection structure, and more particularly to a structure in which circuit boards are connected by a plurality of flat cables when the connectors of each circuit board are orthogonal to each other.

従来、インクジェットプリンタなどの液体噴射装置やフラットベットタイプの画像読取装置においては、インクカートリッジを備え往復動するキャリッジやCCDやレンズを備え往復動するスキャナキャリッジの回路基板と、それらがそれぞれ接続されるメイン制御回路基板との接続において、フラットケーブル(フレキシブルフラットケーブル、以下、FFCと略す。)が配線材として多用されている。   2. Description of the Related Art Conventionally, in a liquid ejecting apparatus such as an ink jet printer or a flat bed type image reading apparatus, a carriage that includes an ink cartridge and a reciprocating carriage, and a circuit board of a scanner carriage that includes a CCD and a lens and reciprocally moves are connected to each other. In connection with the main control circuit board, a flat cable (flexible flat cable, hereinafter abbreviated as FFC) is often used as a wiring material.

上記FFCは、放熱性が良く、単位断面積当たりの電流容量が大きく、また、可撓性に優れ任意の形状に折り曲げて使用することができ、かつ軽量である点で優れた配線材である。   The FFC is an excellent wiring material in that it has good heat dissipation, has a large current capacity per unit cross-sectional area, is excellent in flexibility, can be used by being bent into an arbitrary shape, and is lightweight. .

ところで、FFCで回路基板同士を接続する際に、各回路基板のコネクタが直交する向きになっている場合においては、折り曲げて配線をする事となるが、FFCを折り曲げた場合、FFCに配置されている配線用導体の配列が、逆となり、誤接続のおそれがあった。
このような問題を解決するために、特許文献1では、図3に示すように、FFCの幅方向の一方側を基準線とし、その基準線側に長手方向の全長に亙って一定ピッチで識別マークを設け、何回折り曲げても識別マークの位置により配線用導体の配列状態を一目で確認できるものが提案されている。
By the way, when the circuit boards are connected to each other by the FFC, when the connectors of the circuit boards are orthogonal to each other, the wiring is performed by bending, but when the FFC is bent, the circuit boards are arranged in the FFC. The arrangement of the wiring conductors that were connected was reversed, and there was a risk of incorrect connection.
In order to solve such a problem, in Patent Document 1, as shown in FIG. 3, one side in the width direction of the FFC is set as a reference line, and the reference line side has a constant pitch over the entire length in the longitudinal direction. Proposals have been made in which an identification mark is provided and the arrangement state of the wiring conductors can be confirmed at a glance by the position of the identification mark no matter how many times it is bent.

しかしながら、上記構成としても、インク種類の多様化や、カラー画像の読取などで、制御信号線を増加させる必要がある場合は、配線用導体の本数を増やしてFFCの幅を広くすることが考えられるが、印刷時や画像読取時の往復動などの特にFFCが稼動箇所に設けられている場合に、FFCが他の部材に接触して各キャリッジの動作に支障をきたす、あるいは、左右方向、すなわち幅方向へのスペースが必要となり、省スペース化を阻害するという問題があった。   However, even in the above configuration, when it is necessary to increase the number of control signal lines due to diversification of ink types or reading of color images, it is considered to increase the width of the FFC by increasing the number of wiring conductors. However, when the FFC is provided at the operating location, such as reciprocating movement during printing or image reading, the FFC may contact other members to hinder the operation of each carriage, That is, there is a problem that space in the width direction is required, which hinders space saving.

また、FFCの幅を広くすると幅方向への面積が大きくなるため、FFCから発生する電磁波や放射ノイズによる他の電子部品への干渉や、逆に他の電子部品からの放射ノイズの影響も受ける可能性が大きくなるおそれがあった。   In addition, since the area in the width direction is increased when the width of the FFC is increased, the FFC is also affected by interference with other electronic components due to electromagnetic waves and radiation noise generated from the FFC, and conversely, radiation noise from other electronic components. There was a risk that the possibility would increase.

さらに、上記のようにFFCを折り曲げて、複数のFFCで各回路基板を接続する場合では、コネクタの配置関係がわかりにくくなり、誤接続につながるという問題があった。
特許第3649102号公報
Furthermore, when the FFC is bent as described above and each circuit board is connected by a plurality of FFCs, there is a problem that it becomes difficult to understand the arrangement relationship of the connectors, resulting in erroneous connection.
Japanese Patent No. 3649102

本発明は、上記問題を解決するために提案されたもので、その目的は、複数のFFCにより回路基板間を接続する際に、省スペース化が図れ、しかもコネクタの配置関係を明瞭にして誤接続を防止できる回路基板の接続構造を提供することにある。   The present invention has been proposed in order to solve the above-described problems. The object of the present invention is to save space when connecting circuit boards using a plurality of FFCs, and to clarify the layout relationship of connectors. An object of the present invention is to provide a circuit board connection structure capable of preventing connection.

上記目的を達成するために、請求項1に記載の回路基板の接続構造は、制御部を実装し、複数のコネクタを設けた主回路基板と、機能モジュールを実装し、対応する複数のコネクタを設けた副回路基板とを、複数のフラットケーブルで接続した構成の回路基板の接続構造であって、上記複数のコネクタは、上記主回路基板、および上記副回路基板のそれぞれに長手方向が略平行となるように近接して配置され、上記主回路基板、および上記副回路基板は、上記主回路基板側の上記複数のコネクタと、上記副回路基板側の上記複数のコネクタとが、略直交する向きになるように配設されており、上記複数のフラットケーブルは、個別に途中部分を斜めに折り返して直角方向に折り曲げた形状とされるとともに、厚さ方向に重なりを有するように、それぞれの両端に形成した端子部を、上記主回路基板、上記副回路基板に設けられたそれぞれの対応するコネクタに接続していることを特徴とする。   In order to achieve the above object, the circuit board connection structure according to claim 1 is provided with a main circuit board on which a control unit is mounted and a plurality of connectors are provided, a functional module is mounted, and a plurality of corresponding connectors are mounted. A circuit board connection structure in which the provided sub circuit board is connected by a plurality of flat cables, wherein the plurality of connectors are substantially parallel in the longitudinal direction to each of the main circuit board and the sub circuit board. In the main circuit board and the sub circuit board, the plurality of connectors on the main circuit board side and the plurality of connectors on the sub circuit board side are substantially orthogonal to each other. The plurality of flat cables are individually bent halfway and bent in a right angle direction, and have an overlap in the thickness direction. The terminal portion formed on both ends, the main circuit board, characterized in that connected to the respective corresponding connector provided on the auxiliary circuit board.

ここで、複数のフラットケーブルの厚さ方向の重なりの度合いは、積層された状態で全体、すなわち長手方向、幅方向の全体が重なりを有する必要はなく、複数のFFCがその幅方向を長手方向に沿って部分的に、厚さ方向に重なりを有する場合を含む。   Here, the degree of overlap in the thickness direction of the plurality of flat cables does not have to overlap in the stacked state, that is, in the longitudinal direction and the entire width direction, and the plurality of FFCs extend in the longitudinal direction in the width direction. Including a case where there is an overlap in the thickness direction partially.

請求項2では、スキャナ装置のメイン制御部を実装し、複数のコネクタを設けた主回路基板と、イメージセンサ回路を実装し、対応する複数のコネクタを設けた副回路基板とを、複数のフラットケーブルで接続した構成の回路基板の接続構造であって、上記複数のコネクタは、上記主回路基板、および上記副回路基板のそれぞれに長手方向が略平行となるように近接して配置され、上記主回路基板、および上記副回路基板は、上記主回路基板側の上記複数のコネクタと、上記副回路基板側の上記複数のコネクタとが、略直交する向きになるように配設されており、上記複数のフラットケーブルは、個別に途中部分を斜めに折り返して直角方向に折り曲げた形状とされるとともに、厚さ方向に重なりを有するように、それぞれの両端に形成した端子部を、上記主回路基板、上記副回路基板に設けられたそれぞれの対応するコネクタに接続していることを特徴とする。   According to another aspect of the present invention, a main circuit board on which a main control unit of a scanner device is mounted and a plurality of connectors are provided, and a sub circuit board on which an image sensor circuit is mounted and a plurality of corresponding connectors are provided are provided in a plurality of flats. A circuit board connection structure configured by connecting with a cable, wherein the plurality of connectors are arranged close to each other so that a longitudinal direction thereof is substantially parallel to each of the main circuit board and the sub circuit board, The main circuit board and the sub circuit board are arranged so that the plurality of connectors on the main circuit board side and the plurality of connectors on the sub circuit board side are in a substantially orthogonal direction, The plurality of flat cables are individually bent halfway and bent in a right angle direction, and are formed at both ends so as to overlap in the thickness direction. Child unit, the main circuit board, characterized in that connected to the respective corresponding connector provided on the auxiliary circuit board.

請求項3では、請求項2において、上記主回路基板は装置本体に取り付けられ、上記副回路基板は、往復動するキャリッジに取り付けられ共に往復動し、上記フラットケーブルは、上記キャリッジの往復動に伴って、撓み変形する構造になっていることを特徴とする。   According to a third aspect of the present invention, in the second aspect, the main circuit board is attached to the apparatus main body, the sub circuit board is attached to a reciprocating carriage and reciprocates together, and the flat cable is reciprocated by the carriage. Along with this, the structure is characterized in that it bends and deforms.

請求項4では、請求項1乃至3のいずれか1項において、厚さ方向に重なりを有するように接続している上記複数のフラットケーブルのそれぞれの間には、絶縁スペーサを挟み込んでいることを特徴とする。   According to claim 4, in any one of claims 1 to 3, an insulating spacer is interposed between each of the plurality of flat cables connected so as to overlap in the thickness direction. Features.

請求項1乃至4に記載の回路基板の接続構造によれば、制御信号線の増加により配線用導体の本数を増やす必要が生じた場合にも、FFCの幅を大きくする必要がないため、幅方向の省スペース化を図ることができる。
したがって、種々の電子機器に用いた場合、それらの電子機器を小型、薄型化するのに有益である。
According to the circuit board connection structure of the first to fourth aspects, it is not necessary to increase the width of the FFC even when it is necessary to increase the number of wiring conductors due to an increase in the number of control signal lines. Space saving in the direction can be achieved.
Therefore, when used in various electronic devices, it is useful for reducing the size and thickness of these electronic devices.

また、複数のFFCを、厚さ方向に重なりを有するように、それぞれの両端に形成した端子部を、主回路基板、副回路基板に設けられたそれぞれの対応するコネクタに接続する構造、すなわち、ぞれぞれの一方の端に設けた端子部を、一方の回路基板の対応するコネクタに接続させてから、それぞれの他方の端に設けた端子部を、他方の回路基板の対応するコネクタに接続させればよいため、他方の端に設けた端子部の厚さ方向の位置が入れ替わることがないので、誤接続を防止することができる。
特に、極数の異なる別形状のコネクタや識別用の目印を用いることなく、同形状のコネクタを使用しても、上記のようにコネクタの識別が容易であり誤接続を防止でき、部品の種別を少なくできるので、コスト的に優れたものとなる。
Further, a structure in which a plurality of FFCs are connected to corresponding connectors provided on the main circuit board and the sub circuit board, respectively, so that the terminal portions formed at both ends of the FFCs are overlapped in the thickness direction, that is, After connecting the terminal portion provided at one end of each to the corresponding connector of one circuit board, the terminal portion provided at the other end of the terminal portion is connected to the corresponding connector of the other circuit board. Since it is only necessary to connect, the position in the thickness direction of the terminal portion provided at the other end does not change, and thus erroneous connection can be prevented.
In particular, without using differently shaped connectors with different numbers of poles or identifying marks, even if the same shaped connector is used, the connector can be easily identified as described above, and erroneous connection can be prevented. Therefore, the cost can be improved.

さらに、複数のFFCの幅方向への面積が大きくならないため、FFCから発生する電磁波や放射ノイズによる他の電子部品への干渉や、逆に他の電子部品からの放射ノイズの影響も低減でき、組み込んだ装置の信頼性が向上できる。   Furthermore, since the area in the width direction of the plurality of FFCs does not increase, interference with other electronic components due to electromagnetic waves and radiation noise generated from the FFC, and conversely, the influence of radiation noise from other electronic components can be reduced. The reliability of the incorporated device can be improved.

請求項2のように、主回路基板がスキャナ装置のメイン制御部を実装しており、副回路基板がイメージセンサ回路を実装するものでは、通常、装置内で各回路基板同士が離れた位置に設けられる構造のため、上記と同様の効果が期待できるとともに、スキャナ装置の小型、薄型化、信頼性向上に有益である。   In the case where the main circuit board mounts the main control unit of the scanner device and the sub circuit board mounts the image sensor circuit as in claim 2, the circuit boards are usually separated from each other in the apparatus. Due to the provided structure, the same effect as described above can be expected, and it is beneficial for reducing the size and thickness of the scanner device and improving the reliability.

請求項3のように、主回路基板は装置本体に取り付けられ、副回路基板は、往復動するキャリッジに取り付けられ共に往復動し、FFCはキャリッジの往復動に伴って、撓み変形する構造のものでは、幅方向のスペースを大きくする必要がないため、FFCが他の部材に接触してキャリッジの動作に支障をきたすことがなく、スキャナ装置の小型、薄型化、信頼性向上に有益である。   The main circuit board is attached to the apparatus main body, the sub circuit board is attached to the reciprocating carriage and reciprocates together, and the FFC is bent and deformed as the carriage reciprocates. Then, since it is not necessary to increase the space in the width direction, the FFC does not interfere with the operation of the carriage due to contact with other members, which is beneficial for reducing the size, thickness, and reliability of the scanner device.

請求項4では、厚さ方向に重なりを有するように接続している複数のFFCのそれぞれの間には、絶縁スペーサを挟み込んでいるため、各FFC同士での放射ノイズの発生による影響を低減することができる。   According to the fourth aspect of the present invention, since an insulating spacer is sandwiched between each of the plurality of FFCs connected so as to overlap in the thickness direction, the influence due to the generation of radiation noise between the FFCs is reduced. be able to.

以下に、本発明の実施の形態について、図面を参照しながら説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1及び図2は、本実施例に係る回路基板の接続構造を示し、図1は、回路基板の接続構造を示す模式平面図、図2は図1におけるX−X線概略縦断面図である。   1 and 2 show a circuit board connection structure according to the present embodiment, FIG. 1 is a schematic plan view showing the circuit board connection structure, and FIG. 2 is a schematic vertical sectional view taken along line XX in FIG. is there.

図1では、主回路基板20と副回路基板10を接続する構造を示し、FFC30aは接続されており、FFC30bは接続される前の状態を示しており、図2では、FFC30a、30bともに各回路基板に接続されている状態を示している。   1 shows a structure for connecting the main circuit board 20 and the sub circuit board 10, the FFC 30a is connected, and the FFC 30b shows a state before being connected. In FIG. 2, both the FFCs 30a and 30b are connected to each circuit. A state of being connected to the substrate is shown.

尚、図1では、本実施例の理解を容易とするために、各回路基板が倒された状態を模式的に示しているが、実際には、副回路基板10は、図1の手前方向側に90度回転した状態で、各FFC30の長手方向と直交となるように配置され、主回路基板20は、図1の右手方向側に90度回転した状態で、各FFC30の長手方向と直交となるように配置されている(図2参照。)。
また、図1及び図2では、各回路基板を簡易な構成とし、各FFC30及び絶縁スペーサ40の肉厚が分厚いものを示しているが、これに限られず、通常は、薄いFFC、絶縁スペーサが使用される。
FIG. 1 schematically shows the state in which each circuit board is tilted down in order to facilitate understanding of the present embodiment. The main circuit board 20 is arranged to be orthogonal to the longitudinal direction of each FFC 30 while being rotated 90 degrees to the right-hand direction side in FIG. (See FIG. 2).
1 and 2, each circuit board has a simple configuration, and each FFC 30 and the insulating spacer 40 are thick. However, the present invention is not limited to this, and usually a thin FFC and an insulating spacer are used. used.

詳しくは、本実施例では、フラットベットタイプの画像読取装置において、本体ケーシングの内部に設けられる回路基板に適用した例を示し、主回路基板20は、各電子部品を制御するメイン制御部を実装しており、読取装置本体(不図示)に取り付けられている。
副回路基板10は、スキャナを構成するCCDやレンズ、ミラー、光源等と接続するイメージセンサ回路を実装しており、スキャナキャリッジ(不図示)に取り付けられている。
Specifically, in the present embodiment, an example applied to a circuit board provided inside a main body casing in a flat bed type image reading apparatus is shown, and the main circuit board 20 is mounted with a main control unit that controls each electronic component. It is attached to a reader main body (not shown).
The sub circuit board 10 is mounted with an image sensor circuit connected to a CCD, a lens, a mirror, a light source and the like constituting the scanner, and is attached to a scanner carriage (not shown).

主回路基板20には、複数のコネクタ21a、21bが、長手方向が略平行となるように近接して配置されており、副回路基板10には、複数のコネクタ11a、11bが、長手方向が略平行となるように近接して配置されている。
主回路基板20および副回路基板10は、主回路基板側の複数のコネクタ21a、21bと、副回路基板側の複数のコネクタ11a、11bとが、略直交する向きになるように、配設されている。
すなわち、本実施例においては、主回路基板20側のコネクタ21aと副回路基板10側のコネクタ11aが対応するコネクタとなり、主回路基板20側のコネクタ21bと副回路基板10側のコネクタ11bが対応するコネクタとなっている。
A plurality of connectors 21a, 21b are arranged close to each other on the main circuit board 20 so that the longitudinal directions thereof are substantially parallel, and a plurality of connectors 11a, 11b are arranged on the sub circuit board 10 in the longitudinal direction. It arrange | positions adjacent so that it may become substantially parallel.
The main circuit board 20 and the sub circuit board 10 are arranged so that the plurality of connectors 21a and 21b on the main circuit board side and the plurality of connectors 11a and 11b on the sub circuit board side are in a substantially orthogonal direction. ing.
That is, in this embodiment, the connector 21a on the main circuit board 20 side and the connector 11a on the sub circuit board 10 side correspond to each other, and the connector 21b on the main circuit board 20 side and the connector 11b on the sub circuit board 10 side correspond to each other. It has become a connector.

上記複数のコネクタに接続される2枚のFFC30a、30bは同様の構成からなり、断面矩形の配線用導体33を幅方向に一定間隔をあけて平行に配置し、その上下をポリエチレンテレフタレート(PET)などの可撓性の熱可塑性樹脂からなるプラスチックフィルム32で挟み(図2参照。)、熱溶着あるいは、接着剤により熱融着して、配線用導体33の周囲がプラスチックフィルム32で被覆される構成となっている。
すなわち、各配線用導体33はそれぞれ絶縁された状態となっている。
The two FFCs 30a and 30b connected to the plurality of connectors have the same configuration, and wiring conductors 33 having a rectangular cross section are arranged in parallel in the width direction with a certain interval therebetween, and the upper and lower sides thereof are polyethylene terephthalate (PET). The wiring conductor 33 is covered with the plastic film 32 by being sandwiched between plastic films 32 made of a flexible thermoplastic resin such as (see FIG. 2) and thermally fused or thermally fused with an adhesive. It has a configuration.
That is, each wiring conductor 33 is in an insulated state.

また、FFC30a、FFC30bは、それぞれが途中部分、すなわち、上記コネクタ同士が直交する箇所50で、斜めに折り返して直角方向に折り曲げた形状となっている。
さらに、FFC30a、FFC30bは、厚さ方向に重なりを有するように各回路基板に接続される。
Each of the FFC 30a and the FFC 30b has an intermediate portion, that is, a portion 50 where the connectors are orthogonal to each other, and is bent back at an angle and bent in a right angle direction.
Further, the FFC 30a and the FFC 30b are connected to each circuit board so as to overlap in the thickness direction.

各FFC30は、主回路基板20を介して副回路基板10と接続するCCDなどへの駆動電源の供給線や、副回路基板10を介してCCDなどからの出力信号を主回路基板20のメイン制御部へ伝達する信号線として機能する。
また、各FFC30は、スキャナキャリッジの往復動(図1において矢印Yの方向。)に伴って、主回路基板20と副回路基板10との間で、撓み変形する構造になっている。
Each FFC 30 supplies a drive power supply line to a CCD or the like connected to the sub circuit board 10 via the main circuit board 20, and outputs signals from the CCD or the like via the sub circuit board 10 to the main control of the main circuit board 20. It functions as a signal line to be transmitted to the unit.
Each FFC 30 is configured to bend and deform between the main circuit board 20 and the sub circuit board 10 as the scanner carriage reciprocates (in the direction of arrow Y in FIG. 1).

ここで、本実施例では、FFC30aとFFC30bの間には、絶縁スペーサ40を挟みこんでいる。
絶縁スペーサ40は、絶縁性かつ可撓性の熱可塑性樹脂材などからなり、各FFC30と同幅で、折り曲げられた形状に対応する形状に形成されており、その長さは、FFC30aとFFC30bが厚さ方向に重なりを有する部分の長さに対応して形成されている。
すなわち、本実施例では、FFC30aの上面略全体に絶縁スペーサ40が載置されている。
これにより、各FFC30同士での放射ノイズの発生による影響を低減することができる。
また、特に上記のようにFFC30aとFFC30bが稼動箇所に設けられている場合は、往復動により互いのプラスチックフィルム32が剥離されショートする可能性があるため、絶縁スペーサ40を挟み込むことにより、プラスチックフィルム32の剥離を防止できる。
Here, in this embodiment, an insulating spacer 40 is sandwiched between the FFC 30a and the FFC 30b.
The insulating spacer 40 is made of an insulating and flexible thermoplastic resin material, and has the same width as each FFC 30 and has a shape corresponding to the bent shape. The length of each of the insulating spacers 40 is determined by the FFC 30a and the FFC 30b. It is formed corresponding to the length of the portion having an overlap in the thickness direction.
That is, in the present embodiment, the insulating spacer 40 is placed on substantially the entire top surface of the FFC 30a.
Thereby, the influence by generation | occurrence | production of the radiation noise between each FFC30 can be reduced.
In particular, when the FFC 30a and the FFC 30b are provided at the operation location as described above, the plastic film 32 may be peeled off due to the reciprocating motion, so that the plastic film 32 may be short-circuited. 32 peeling can be prevented.

さらに、例えば、各FFCを厚さ方向に重ね合わせて、ともに折り曲げた場合は、絶縁スペーサをFFCの重なり合う部分の経路全体に挟み込むことができないが、本実施例では、各FFC30を個別に折り曲げているため、FFC30aとFFC30bが厚さ方向に重なりを有する部分の経路全体に亙り、絶縁スペーサとして機能させることが可能となる。   Further, for example, when the FFCs are overlapped in the thickness direction and bent together, the insulating spacer cannot be sandwiched in the entire path of the overlapping portions of the FFCs. However, in this embodiment, each FFC 30 is bent individually. Therefore, the FFC 30a and the FFC 30b can function as an insulating spacer over the entire path where the FFC 30a and the FFC 30b overlap in the thickness direction.

また、上記のように各FFCを重ね合わせて、ともに折り曲げた場合は、コネクタの配置が、それぞれの回路基板で逆、すなわち、本実施例に適用すると、主回路基板20側のコネクタ21bと副回路基板10側のコネクタ11aが対応するコネクタとなり、主回路基板20側のコネクタ21aと副回路基板10側のコネクタ11bが対応するコネクタとなるため、各回路基板において、FFCの厚さ方向の配置も逆となり、コネクタの配置関係、FFCの厚さ方向の配置関係がわかりにくくなるが、各FFC30を個別に折り曲げることにより組み付け検査時に各FFC30の厚さ方向の配置関係が変わることはないため、検査が容易となるとともに、コネクタの位置が入れ替わることがなく、誤接続を防止することができる。
特に、本実施例のように同形状のコネクタを使用しても、上記のようにコネクタの識別が容易であり誤接続を防止でき、部品の種別を少なくできるので、コスト的にも優れたものとなる。
Further, when the FFCs are overlapped and bent together as described above, the connector arrangement is reversed on each circuit board, that is, when applied to the present embodiment, the connector 21b on the main circuit board 20 side and the sub-board are subordinate. The connector 11a on the circuit board 10 side becomes the corresponding connector, and the connector 21a on the main circuit board 20 side and the connector 11b on the sub circuit board 10 side become the corresponding connectors. Therefore, in each circuit board, the FFC is arranged in the thickness direction. On the other hand, the arrangement relationship of the connectors and the arrangement relationship in the thickness direction of the FFC are difficult to understand, but the arrangement relationship in the thickness direction of each FFC 30 does not change during the assembly inspection by bending each FFC 30 individually. Inspection is facilitated, and the connector position is not changed, and erroneous connection can be prevented.
In particular, even if a connector with the same shape as in this embodiment is used, the connector can be easily identified as described above, erroneous connection can be prevented, and the number of parts can be reduced, resulting in excellent cost. It becomes.

次に、本実施例において、主回路基板20と副回路基板10とをFFC30で接続する場合は、図1に示すように、まず、主回路基板20と副回路基板10に設けられたそれぞれの対応するコネクタ21a、11aにFFC30aの両端に形成した端子部31を接続する。
ついで、FFC30aの上面に絶縁スペーサ40を載置し、FFC30bの両端に形成した端子部31を主回路基板20と副回路基板10に設けられたそれぞれの対応するコネクタ21b、11bに接続する。
Next, in this embodiment, when the main circuit board 20 and the sub circuit board 10 are connected by the FFC 30, as shown in FIG. 1, first, each of the main circuit board 20 and the sub circuit board 10 provided on each is provided. Terminal portions 31 formed at both ends of the FFC 30a are connected to the corresponding connectors 21a and 11a.
Next, the insulating spacer 40 is placed on the upper surface of the FFC 30a, and the terminal portions 31 formed on both ends of the FFC 30b are connected to the corresponding connectors 21b and 11b provided on the main circuit board 20 and the sub circuit board 10, respectively.

上記のように各回路基板を複数のFFC30で接続した状態は、図2に示すように、FFC30bとFFC30aが厚さ方向に重なりを有するように、主回路基板20と副回路基板10を接続する構成としている。
また、上述のように各回路基板でコネクタの位置が入れ替わることがない構成としている。
As shown in FIG. 2, when the circuit boards are connected by the plurality of FFCs 30 as described above, the main circuit board 20 and the sub circuit board 10 are connected so that the FFC 30b and the FFC 30a overlap in the thickness direction. It is configured.
Further, as described above, the position of the connector is not changed on each circuit board.

尚、本実施例のように、FFC30aとFFC30bが稼動箇所に設けられている場合は、FFC30aと絶縁スペーサ40、絶縁スペーサ40とFFC30bを、それぞれ接着剤を介して、あるいは粘着テープなどで、ずれが生じないような構成とすることが好ましい。   When the FFC 30a and the FFC 30b are provided at the operating location as in the present embodiment, the FFC 30a and the insulating spacer 40, and the insulating spacer 40 and the FFC 30b are displaced with an adhesive or with an adhesive tape, respectively. It is preferable to adopt a configuration that does not cause the problem.

ここで、本実施例では、FFC30を接続する各コネクタは、各回路基板面に対して垂直方向に開口しているが、各回路基板面に対して水平方向に開口するコネクタとしてもよく、また本実施例のコネクタの形状に限らず、どのような形状のコネクタでも適用可能である。
また、主回路基板20と副回路基板10が、側面視において同じ水平面に配置され、直立した状態を図示しているが、これに限られず、異なる水平面上に配置されたり、一方の回路基板あるいは両方の回路基板がFFC接続方向側に対して上向き、下向きに傾斜している構成、あるいは、両方の回路基板が倒された状態、すなわち、模式的に図示した図1のような構成にも適用可能である。
Here, in this embodiment, each connector that connects the FFC 30 opens in a direction perpendicular to each circuit board surface, but may be a connector that opens in a horizontal direction to each circuit board surface. Not only the shape of the connector of the present embodiment but also any shape of connector can be applied.
In addition, the main circuit board 20 and the sub circuit board 10 are arranged on the same horizontal plane in a side view and are shown in an upright state, but are not limited thereto, and may be arranged on different horizontal planes, The configuration in which both circuit boards are inclined upward and downward with respect to the FFC connection direction side, or the state in which both circuit boards are tilted, that is, the configuration schematically shown in FIG. Is possible.

上記構成によれば、制御信号線の増加により配線用導体33の本数を増加する必要が生じた場合にも、FFC30の幅を大きくする必要がないため、幅方向の省スペース化を図ることができ、電子機器を小型、薄型化するのに有益なものとなる。
特に、本実施例のように稼動箇所にFFC30が設けられ、撓み変形する構造のものでも、FFC30が他の部材に接触してキャリッジの動作に支障をきたすことがなく、優れたものとなる。
According to the above configuration, even when it is necessary to increase the number of wiring conductors 33 due to an increase in the number of control signal lines, it is not necessary to increase the width of the FFC 30, so that space saving in the width direction can be achieved. This is useful for reducing the size and thickness of electronic devices.
In particular, even if the FFC 30 is provided at the operating location as in the present embodiment and bends and deforms, the FFC 30 does not interfere with the operation of the carriage due to contact with other members, which is excellent.

さらに、複数のFFCの幅方向への面積が大きくならないため、FFC30から発生する電磁波や放射ノイズによる他の電子部品への干渉や、逆に他の電子部品からの放射ノイズの影響も低減でき、組み込んだ装置の信頼性が向上できる。   In addition, since the area in the width direction of the plurality of FFCs does not increase, interference with other electronic components due to electromagnetic waves and radiation noise generated from the FFC 30 and conversely the influence of radiation noise from other electronic components can be reduced. The reliability of the incorporated device can be improved.

尚、本実施例では、FFC30aとFFC30bの幅方向の幅は同広さで、長手方向、幅方向において略全体が厚さ方向に重なりを有する構成としているが、各FFCの幅の広さが異なるものでも良く、また、複数のFFC30がその幅方向を長手方向に沿って部分的に、厚さ方向に重なりを有する構成としても良い。   In this embodiment, the width in the width direction of the FFC 30a and the FFC 30b is the same, and the entire length in the longitudinal direction and the width direction is overlapped in the thickness direction, but the width of each FFC is wide. The FFCs 30 may be different from each other, and the FFCs 30 may partially overlap in the width direction in the longitudinal direction and overlap in the thickness direction.

また、各FFCの幅方向や厚さ方向へのずれを防止するガイドを設けてもよい。
さらに、本実施例のように各FFCの間に絶縁スペーサ40を設けるとともに、FFC30bの上面、FFC30aの下面を絶縁フィルムで覆う構成、すなわち、FFC30bとFFC30aが一体となるように絶縁フィルムで被覆する構成としてもよい。
これにより、本実施例のように個別に折り曲げられたFFC30を稼動箇所に設け、撓み変形する構造のものでも、幅方向や厚さ方向へのずれが生じず、また、FFC30から発生する電磁波や放射ノイズによる他の電子部品への干渉や、逆に他の電子部品からの放射ノイズの影響をさらに低減できるものとなる。
Moreover, you may provide the guide which prevents the shift | offset | difference to the width direction or thickness direction of each FFC.
Further, as in this embodiment, the insulating spacer 40 is provided between the FFCs, and the upper surface of the FFC 30b and the lower surface of the FFC 30a are covered with the insulating film, that is, the FFC 30b and the FFC 30a are integrally covered with the insulating film. It is good also as a structure.
As a result, the FFC 30 that is individually bent as in the present embodiment is provided at the operating location, and even in a structure that bends and deforms, there is no displacement in the width direction or the thickness direction, and electromagnetic waves generated from the FFC 30 Interference with other electronic components due to radiation noise, and conversely, the influence of radiation noise from other electronic components can be further reduced.

さらにまた、近時、主流となりつつある、カラー読取装置を製造する場合において、例えば、一方のFFCには従来のモノクロ読取装置に必要なモノクロCCD用の駆動電源供給線と信号線などの配線用導体を形成し、他方のFFCにはカラー読取装置にのみ必要な信号線などを形成する構成とすれば、従来のモノクロ読取装置の機構を使用して、カラー読取装置を製造することが可能となり、モノクロ読取装置とカラー読取装置で機構、回路基板を共通に使用でき、部品管理工数の削減や量産効果によるコストダウンが期待できる。   Furthermore, in the case of manufacturing a color reading apparatus which is becoming mainstream recently, for example, one FFC is used for wiring such as a driving power supply line and a signal line for a monochrome CCD necessary for a conventional monochrome reading apparatus. If a conductor is formed and a signal line or the like necessary only for the color reading device is formed on the other FFC, a color reading device can be manufactured using a mechanism of a conventional monochrome reading device. The mechanism and circuit board can be used in common for the monochrome reader and the color reader, and the reduction of parts management man-hours and cost reduction due to mass production effects can be expected.

尚、本実施例では、画像読取装置に適用される例を示したが、これに限られず、複数のコネクタを設けた回路基板同士をFFCで接続する場合には、どのような装置にも適用できる。
また、2枚のFFCで各回路基板を接続する構成を示したが、2枚に限られず、3枚以上のFFCで各回路基板を接続する場合にも適用可能である。
In this embodiment, the example applied to the image reading apparatus has been shown. However, the present invention is not limited to this, and the present invention is applicable to any apparatus in which circuit boards provided with a plurality of connectors are connected by FFC. it can.
Moreover, although the structure which connects each circuit board by two FFC was shown, it is applicable not only when connecting each circuit board by three or more FFCs but by two or more FFCs.

本発明に係る回路基板の接続構造の一実施例を示す模式平面図である。It is a schematic plan view which shows one Example of the connection structure of the circuit board which concerns on this invention. 図1におけるX―X線概略縦断面図である。FIG. 2 is a schematic longitudinal sectional view taken along line XX in FIG. 1. 従来例を示す図である。It is a figure which shows a prior art example.

符号の説明Explanation of symbols

10 副回路基板
11a、b コネクタ(副回路基板)
20 主回路基板
21a、b コネクタ(主回路基板)
30a、b フラットケーブル(FFC、フレキシブルフラットケーブル)
31 端子部
32 プラスチックフィルム
33 配線用導体
40 絶縁スペーサ
50 コネクタ同士が直交する箇所
10 Sub circuit board 11a, b Connector (sub circuit board)
20 Main circuit board 21a, b Connector (main circuit board)
30a, b Flat cable (FFC, flexible flat cable)
31 Terminal part 32 Plastic film 33 Wiring conductor 40 Insulating spacer 50 Connector crossing

Claims (4)

制御部を実装し、複数のコネクタを設けた主回路基板と、機能モジュールを実装し、対応する複数のコネクタを設けた副回路基板とを、複数のフラットケーブルで接続した構成の回路基板の接続構造であって、
上記複数のコネクタは、上記主回路基板、および上記副回路基板のそれぞれに長手方向が略平行となるように近接して配置され、
上記主回路基板、および上記副回路基板は、上記主回路基板側の上記複数のコネクタと、上記副回路基板側の上記複数のコネクタとが、略直交する向きになるように配設されており、
上記複数のフラットケーブルは、個別に途中部分を斜めに折り返して直角方向に折り曲げた形状とされるとともに、厚さ方向に重なりを有するように、それぞれの両端に形成した端子部を、上記主回路基板、上記副回路基板に設けられたそれぞれの対応するコネクタに接続していることを特徴とする回路基板の接続構造。
Connection of a circuit board with a configuration in which a control circuit is mounted and a main circuit board provided with a plurality of connectors is connected to a sub circuit board on which functional modules are mounted and corresponding connectors are provided with a plurality of flat cables. Structure,
The plurality of connectors are arranged close to each other so that the longitudinal direction is substantially parallel to each of the main circuit board and the sub circuit board,
The main circuit board and the sub circuit board are arranged such that the plurality of connectors on the main circuit board side and the plurality of connectors on the sub circuit board side are substantially orthogonal to each other. ,
The plurality of flat cables are individually bent halfway and bent in a right angle direction, and terminal portions formed at both ends so as to overlap in the thickness direction are connected to the main circuit. A circuit board connection structure, wherein the circuit board is connected to a corresponding connector provided on the sub circuit board.
スキャナ装置のメイン制御部を実装し、複数のコネクタを設けた主回路基板と、イメージセンサ回路を実装し、対応する複数のコネクタを設けた副回路基板とを、複数のフラットケーブルで接続した構成の回路基板の接続構造であって、
上記複数のコネクタは、上記主回路基板、および上記副回路基板のそれぞれに長手方向が略平行となるように近接して配置され、
上記主回路基板、および上記副回路基板は、上記主回路基板側の上記複数のコネクタと、上記副回路基板側の上記複数のコネクタとが、略直交する向きになるように配設されており、
上記複数のフラットケーブルは、個別に途中部分を斜めに折り返して直角方向に折り曲げた形状とされるとともに、厚さ方向に重なりを有するように、それぞれの両端に形成した端子部を、上記主回路基板、上記副回路基板に設けられたそれぞれの対応するコネクタに接続していることを特徴とする回路基板の接続構造。
A configuration in which a main circuit board on which the main control unit of the scanner device is mounted and a plurality of connectors are provided, and a sub circuit board on which an image sensor circuit is mounted and provided with a plurality of corresponding connectors are connected by a plurality of flat cables The circuit board connection structure of
The plurality of connectors are arranged close to each other so that the longitudinal direction is substantially parallel to each of the main circuit board and the sub circuit board,
The main circuit board and the sub circuit board are arranged such that the plurality of connectors on the main circuit board side and the plurality of connectors on the sub circuit board side are substantially orthogonal to each other. ,
The plurality of flat cables are individually bent halfway and bent in a right angle direction, and terminal portions formed at both ends so as to overlap in the thickness direction are connected to the main circuit. A circuit board connection structure, wherein the circuit board is connected to a corresponding connector provided on the sub circuit board.
請求項2において、
上記主回路基板は装置本体に取り付けられ、上記副回路基板は、往復動するキャリッジに取り付けられ共に往復動し、
上記フラットケーブルは、上記キャリッジの往復動に伴って、撓み変形する構造になっていることを特徴とする回路基板の接続構造。
In claim 2,
The main circuit board is attached to the apparatus body, and the sub circuit board is attached to a reciprocating carriage and reciprocates together.
The circuit board connection structure according to claim 1, wherein the flat cable is configured to bend and deform as the carriage reciprocates.
請求項1乃至3のいずれか1項において、
厚さ方向に重なりを有するように接続している上記複数のフラットケーブルのそれぞれの間には、絶縁スペーサを挟み込んでいることを特徴とする回路基板の接続構造。
In any one of Claims 1 thru | or 3,
A circuit board connection structure, wherein an insulating spacer is interposed between each of the plurality of flat cables connected so as to overlap in the thickness direction.
JP2006111717A 2006-04-14 2006-04-14 Circuit board connection structure Withdrawn JP2007287825A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010234019A (en) * 2009-03-31 2010-10-21 Kyoraku Sangyo Kk Game machine
JP2010234020A (en) * 2009-03-31 2010-10-21 Kyoraku Sangyo Kk Game machine
KR101050876B1 (en) * 2010-01-06 2011-07-20 (주)인터플렉스 Manufacturing Method Of Flexible Printed Circuit Board And Its Flexible Printed Circuit Board
US20210368643A1 (en) * 2020-05-21 2021-11-25 Samsung Sdi Co., Ltd. Battery pack

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010234019A (en) * 2009-03-31 2010-10-21 Kyoraku Sangyo Kk Game machine
JP2010234020A (en) * 2009-03-31 2010-10-21 Kyoraku Sangyo Kk Game machine
KR101050876B1 (en) * 2010-01-06 2011-07-20 (주)인터플렉스 Manufacturing Method Of Flexible Printed Circuit Board And Its Flexible Printed Circuit Board
US20210368643A1 (en) * 2020-05-21 2021-11-25 Samsung Sdi Co., Ltd. Battery pack
CN113708003A (en) * 2020-05-21 2021-11-26 三星Sdi株式会社 Battery pack
CN113708003B (en) * 2020-05-21 2024-02-02 三星Sdi株式会社 Battery pack

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