JP2007287477A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket for connecting a semiconductor device to a substrate, and the IC socket which is capable of effectively preventing the other semiconductor device from being destroyed by static electricity charged in the semiconductor device that has been connected to the substrate. <P>SOLUTION: The IC socket is provided with a terminal dedicated for grounding connected to a grounding terminal of the substrate, and with a contactor of which one end is contacted and grounded with the terminal dedicated for grounding in an ordinary state, which is contacted with a connection terminal of the semiconductor device, can put the terminal into a grounded state, and is axially supported rotatably in the direction of releasing the contacted state. When inserting the connection terminal of the semiconductor device into the insertion hole, the other end of the contactor is pushed, thereby the contactor is made to be rotated, and the grounded state of the contact is released. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC socket used when a semiconductor device such as an IC is detachably mounted on a printed wiring board.

  Conventionally, when connecting a semiconductor device to a substrate, there is an advantage that the semiconductor device can be replaced, and therefore, an IC socket is generally used. That is, an IC socket is connected to the substrate in advance, and the IC connection terminal and the substrate are electrically connected by inserting the IC connection terminal into a predetermined portion of the IC socket.

  Examples of the technology related to this IC socket include Patent Documents 1 and 2. Patent Document 1 includes a switching mechanism that switches an input signal to an IC in conjunction with an insertion / extraction lever in order to prevent the semiconductor package from being destroyed when the semiconductor package is inserted into and extracted from the IC socket. An IC socket is disclosed.

  Patent Document 2 discloses a measurement IC socket capable of measuring characteristics without destroying a semiconductor device charged with static electricity. Specifically, there is described an IC socket in which the lead pin of the semiconductor device is grounded when the semiconductor device is inserted into the IC socket, and the ground state of the lead pin is released during measurement.

In either case, the connection state of the connection terminals of the semiconductor device can be switched from the ground state to the non-ground state (or vice versa) using a lever provided in the socket.
Japanese Patent Laid-Open No. 01-243385 Japanese Patent Laid-Open No. 06-120378

By the way, the IC sockets described in Patent Documents 1 and 2 are so-called measurement IC sockets for connecting a semiconductor device to a measuring device for measuring semiconductor characteristics. Therefore, since it is necessary to attach and detach the semiconductor device easily, a relatively complicated structure in which the semiconductor device is fixed to the IC socket using a lever is applied. In addition, the lever can be used to switch the connection state of the connection terminals of the semiconductor device.
However, in the case of a so-called IC socket used for the purpose of connecting a semiconductor device to a substrate via an IC socket, the semiconductor device is not frequently attached and detached, so the structure like the above-described IC socket for measurement is applied. There are few benefits. Further, if an extra member such as a lever is provided, the IC socket tends to be large, and it can be said that the structure is inappropriate as an IC socket. Further, in order to keep the cost low, it is desirable that the structure of the IC socket is as simple as possible.

  On the other hand, even when a semiconductor device is mounted on a substrate, the problem that other semiconductor devices connected to the substrate are destroyed by static electricity charged in the semiconductor device is the same.

  The present invention provides an IC socket for connecting a semiconductor device to a substrate, which can effectively prevent other semiconductor devices connected to the substrate from being destroyed by static electricity charged on the semiconductor device. For the purpose.

  The present invention has been made to achieve the above object, and includes a connection terminal electrically connected to a substrate and an insertion hole into which a lead terminal of a semiconductor device can be inserted (for example, an opening provided in the connection terminal). ), And an IC socket for mounting the semiconductor device in a state of being electrically connected to the substrate, and a dedicated ground terminal to which the ground potential of the substrate is applied, and one end in the normal state It is grounded in contact with the grounding dedicated terminal, is brought into contact with the lead terminal of the semiconductor device to bring it into a grounded state, and includes a contactor pivotally supported in a direction to release the contacted state, When the lead terminal of the semiconductor device is inserted into the insertion hole, the other end of the contact is pushed, and the contact rotates to release the grounding state of the contact. It is.

  Accordingly, it is possible to avoid destruction of other semiconductor devices mounted on the substrate due to static electricity charged in the semiconductor device with a relatively simple structure.

  Moreover, the said contactor is made into the magnitude | size which obstruct | occludes the said insertion hole in a normal state. As a result, when the semiconductor device is inserted into the insertion hole, the contact is always touched, so that the grounded state can be reliably established and the charged static electricity can be discharged.

  Further, the other end of the contact is bent toward the insertion hole. This facilitates alignment when the semiconductor device is inserted into the insertion hole and facilitates insertion.

  Further, an elastic member is provided to urge the contact so that it returns to the normal state. Thereby, when the semiconductor device is not attached to the IC socket, the contact is always in the grounded state, so that the lead terminal of the next semiconductor device to be attached can be reliably grounded.

  According to the present invention, in the IC socket, the ground dedicated terminal connected to the ground terminal of the substrate and one end in the normal state are in contact with the ground dedicated terminal and are in contact with the lead terminal of the semiconductor device. The contact can be grounded and is pivotally supported in a direction to release the contact state, and the lead terminal of the semiconductor device is inserted into the connection terminal (insertion hole provided in the IC socket). In this case, the other end of the contactor is pushed and the contactor rotates to release the grounding state of the contactor. Therefore, the semiconductor device is always attached to the IC socket through the grounding state. Become.

  Therefore, even if the semiconductor device is charged with static electricity, it is discharged before it is electrically connected to the substrate. This effectively prevents other semiconductor devices mounted on the substrate from being destroyed by this static electricity. Can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is an external perspective view of an IC socket according to the present embodiment, FIG. 2 is a cross-sectional view of the IC socket, FIG. 3 is an explanatory view showing a fixed state of a contact, and FIG. 4 is a perspective view of a coil spring.

  In the IC socket 10, an IC mounting portion 20 for connecting lead terminals of an integrated circuit (IC) (not shown) is formed in a rectangular parallelepiped housing 14 made of an insulating material. Specifically, four U-shaped concave portions in plan view are formed along the long side of the housing 14, and the convex portions 18 are formed in an island shape between the opposing U-shaped concave portions. .

  The IC mounting portion 20 is formed with insertion holes 17 through which the connection terminals 11 provided with openings for inserting IC lead terminals are inserted at intervals equal to the arrangement pitch of the IC lead terminals.

Connection terminals 11 are embedded in the respective insertion holes 17 formed in the IC mounting portion 20. An opening is provided above the connection terminal 11, and a spring-like contact piece is provided in the opening (not shown). Thus, when the lead terminal of the IC is inserted into the opening of the connection terminal 11, the lead terminal is sandwiched by the contact piece.
On the other hand, below the connection terminal 11, a pin portion that protrudes vertically from the back surface of the housing 14 is provided. The IC socket 10 is fixed to the printed wiring board by inserting this pin portion into a predetermined insertion hole of the printed wiring board and soldering. As a result, the lead terminal of the IC is electrically connected to a predetermined pattern on the printed wiring board via the connection terminal 11.

  By mounting the IC socket 10 on the printed wiring board and mounting the IC on the IC socket as described above, the IC can be detachably mounted on the printed wiring board.

  Further, in the IC socket 10 of the present embodiment, a metal plate-like conductor portion 19 is disposed on the island-like convex portion 18, and the plate-like conductor portion 19 is grounded connected to the ground line of the printed wiring board. A dedicated terminal 12 is extended. That is, the ground potential is applied to the ground dedicated terminal 12.

  Further, an insertion hole is formed in the opposing wall of the U-shaped concave portion, and the shaft 15 alternately inserts the insertion hole and the coil spring 16.

  One end of the coil spring 16 inserted through the shaft 15 is fixed to the approximate center of the contact 13, and the other end is fixed by the side wall of the island portion 18. As a result, the contact 13 is pivotally supported about the shaft 15 and an urging force acts so that the contact 13 returns to a normal state (a state where the contact 13 is grounded). The contact 13 is provided for each IC mounting portion 20.

  Here, the shape of the contact 13 will be described. The contact 13 has a size that closes the insertion hole 17 in a normal state. As a result, when the lead terminal of the IC is inserted into the opening of the connection terminal 11, the contact 13 is always touched, and the ground is reliably established. Therefore, the static electricity charged in the IC can be reliably discharged.

  Further, the other end 13b of the contact 13 is processed so as to be bent toward the insertion hole side (downward). This facilitates alignment when inserting the lead terminal of the IC into the opening of the connection terminal 11 and facilitates insertion.

  A hemispherical contact portion 13 a is provided at one end of the contact 13, and the contact portion 13 a is in point contact with the plate-like conductor portion 19.

  FIG. 5 is an explanatory diagram showing a state transition when an IC is attached to the IC socket.

  As shown in FIG. 5, the contact 13 of the IC socket 10 is in a grounded state because one end is in contact with the plate-like conductor portion 19 in a normal state (FIG. 5A). When the lead terminal of the IC comes into contact with the contact 13, the lead terminal of the IC is brought into a grounded state (FIG. 5B). Next, when the lead terminal of the IC is inserted into the opening of the connection terminal 11, the other end of the contact 13 is pushed by the lead terminal. As a result, the contact 13 rotates to ground the contact 13. The state and the ground state of the lead terminal are released (FIG. 5B).

  Thus, according to the IC socket of this embodiment, when the IC is mounted on the IC socket 10, the static electricity charged in the IC can be reliably discharged.

  As mentioned above, although the invention made | formed by this inventor was concretely demonstrated based on embodiment, this invention is not limited to the said embodiment, It can change in the range which does not deviate from the summary.

  For example, the manner in which the contact 13 is brought into contact with the lead terminal of the IC and brought into a grounded state is not limited to the above embodiment, and various fixing methods can be applied. At this time, any configuration may be used as long as the ground state is released as the lead terminal of the IC is inserted.

It is an external appearance perspective view of an IC socket. It is sectional drawing of an IC socket. It is explanatory drawing which shows the adhering state of the contactor. It is a perspective view of a coil spring. It is explanatory drawing which shows a state transition when attaching IC to an IC socket.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 IC socket 11 Connection terminal 12 Grounding exclusive terminal 13 Contact 14 Housing 15 Shaft 16 Coil spring 17 Insertion hole 18 Island-shaped convex part 19 Plate-shaped conductor part 20 IC attachment part

Claims (5)

An IC socket comprising a connection terminal electrically connected to a substrate and an insertion hole into which a lead terminal of the semiconductor device can be inserted, and is mounted in a state where the semiconductor device is electrically connected to the substrate. And
A dedicated ground terminal to which the ground potential of the substrate is applied;
In a normal state, one end is in contact with the ground dedicated terminal and grounded, and is brought into contact with the lead terminal of the semiconductor device to make it grounded, and is pivotally supported in a direction to release the contact state, A contact for closing the insertion hole at the other end bent toward the insertion hole;
An elastic member that urges the contact to return to a normal state,
When the lead terminal of the semiconductor device is inserted into the insertion hole, the other end of the contact is pushed, and the contact rotates to release the grounding state of the contact. . An IC socket comprising a connection terminal electrically connected to a substrate and an insertion hole into which a lead terminal of the semiconductor device can be inserted, and is mounted in a state where the semiconductor device is electrically connected to the substrate. And
A dedicated ground terminal to which the ground potential of the substrate is applied;
In a normal state, one end is in contact with the ground dedicated terminal and is grounded, and is brought into contact with the lead terminal of the semiconductor device so as to be grounded, and is pivotally supported in a direction to release the contact state. Equipped with contact
When the lead terminal of the semiconductor device is inserted into the insertion hole, the other end of the contact is pushed, and the contact rotates to release the grounding state of the contact. .   The IC socket according to claim 2, wherein the contactor closes the insertion hole in a normal state.   The IC socket according to claim 3, wherein the other end of the contact is bent toward the insertion hole. 5. The IC socket according to claim 2, further comprising an elastic member that urges the contact to return to a normal state.

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