JP2007275664A5 - - Google Patents

Info

Publication number

JP2007275664A5

JP2007275664A5 JP2007200059A JP2007200059A JP2007275664A5 JP 2007275664 A5 JP2007275664 A5 JP 2007275664A5 JP 2007200059 A JP2007200059 A JP 2007200059A JP 2007200059 A JP2007200059 A JP 2007200059A JP 2007275664 A5 JP2007275664 A5 JP 2007275664A5

Authority

JP

Japan

Prior art keywords

circuit board

mounting

box

ball

board box

Prior art date

2007-07-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
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• 238000003860 storage Methods 0.000 claims description 40
• 239000000758 substrate Substances 0.000 claims description 36
• 230000002427 irreversible effect Effects 0.000 claims description 17
• 238000007689 inspection Methods 0.000 claims description 7
• 238000003466 welding Methods 0.000 description 20
• 230000007246 mechanism Effects 0.000 description 17
• 239000010410 layer Substances 0.000 description 11
• 238000005520 cutting process Methods 0.000 description 10
• 239000000057 synthetic resin Substances 0.000 description 10
• 229920003002 synthetic resin Polymers 0.000 description 10
• 239000000835 fiber Substances 0.000 description 9
• 239000011521 glass Substances 0.000 description 8
• 238000003780 insertion Methods 0.000 description 8
• 230000037431 insertion Effects 0.000 description 8
• 229910052751 metal Inorganic materials 0.000 description 8
• 239000002184 metal Substances 0.000 description 8
• 230000000694 effects Effects 0.000 description 7
• 238000000034 method Methods 0.000 description 7
• 210000000078 claw Anatomy 0.000 description 6
• 239000000463 material Substances 0.000 description 5
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
• 238000005192 partition Methods 0.000 description 4
• 230000002093 peripheral effect Effects 0.000 description 4
• 241000755266 Kathetostoma giganteum Species 0.000 description 3
• 238000005034 decoration Methods 0.000 description 3
• 230000002265 prevention Effects 0.000 description 3
• 230000003014 reinforcing effect Effects 0.000 description 3
• 238000007789 sealing Methods 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 229910052782 aluminium Inorganic materials 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 230000008859 change Effects 0.000 description 2
• 239000000470 constituent Substances 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 229910052759 nickel Inorganic materials 0.000 description 2
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 239000002904 solvent Substances 0.000 description 2
• 229910001369 Brass Inorganic materials 0.000 description 1
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• 125000002066 L-histidyl group Chemical group [H]N1C([H])=NC(C([H])([H])[C@](C(=O)[*])([H])N([H])[H])=C1[H] 0.000 description 1
• 206010037660 Pyrexia Diseases 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• 230000005856 abnormality Effects 0.000 description 1
• 239000012790 adhesive layer Substances 0.000 description 1
• 230000004075 alteration Effects 0.000 description 1
• 229910052787 antimony Inorganic materials 0.000 description 1
• WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 239000010951 brass Substances 0.000 description 1
• 229910052799 carbon Inorganic materials 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 230000001427 coherent effect Effects 0.000 description 1
• 230000005611 electricity Effects 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 229910003437 indium oxide Inorganic materials 0.000 description 1
• PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• 238000007733 ion plating Methods 0.000 description 1
• 238000012423 maintenance Methods 0.000 description 1
• 238000007726 management method Methods 0.000 description 1
• 229910044991 metal oxide Inorganic materials 0.000 description 1
• 150000004706 metal oxides Chemical class 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 238000012986 modification Methods 0.000 description 1
• 230000004048 modification Effects 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 239000002245 particle Substances 0.000 description 1
• 230000000149 penetrating effect Effects 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1
• 239000011120 plywood Substances 0.000 description 1
• 238000012545 processing Methods 0.000 description 1
• 230000005855 radiation Effects 0.000 description 1
• 230000000191 radiation effect Effects 0.000 description 1
• 230000009467 reduction Effects 0.000 description 1
• 230000002441 reversible effect Effects 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000004544 sputter deposition Methods 0.000 description 1
• 230000003068 static effect Effects 0.000 description 1
• 239000012209 synthetic fiber Substances 0.000 description 1
• 229920002994 synthetic fiber Polymers 0.000 description 1
• 229910052718 tin Inorganic materials 0.000 description 1
• 239000011135 tin Substances 0.000 description 1
• XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
• 229910001887 tin oxide Inorganic materials 0.000 description 1
• 238000002834 transmittance Methods 0.000 description 1
• 238000011144 upstream manufacturing Methods 0.000 description 1
• 238000001771 vacuum deposition Methods 0.000 description 1