JP2007273813A - Electronic component placement method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component placement method for efficiently obtaining an offset value for appropriately making lower the amount of an absorption nozzle during retrieval or placement of an electronic component. <P>SOLUTION: A tool nozzle that is attached to a placement head instead of an absorption nozzle is lowered by a given distance, and the position to which the tool nozzle is lowered is measured by a line sensor unit. If the measurement by the line sensor unit shows that the lowered tool nozzle does not abut on a tool for teaching the placement height positioned by a substrate positioning portion and the tool nozzle is not displaced, it is further lowered slightly and then measurement is performed. A given number of such further slight lowering of the tool nozzle and subsequent measurements are repeated until the tool nozzle is displaced. A CPU calculates the offset value based on the displaced amount of the tool nozzle. The calculated offset value is stored in a RAM. The CPU performs control such that the absorption nozzle is lowered during the placement of the electric component on a printed circuit board while the offset value is added. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.

This type of electronic component mounting method is widely known in Patent Document 1 and the like. Generally, the offset value in the height direction of the suction nozzle for picking up or mounting the electronic component is controlled with a measuring instrument such as a dial gauge. The measurement is performed using a tool, and the operator manually inputs the measured offset value and stores it in the storage device.
JP 2001-156498 A

  However, the conventional method is troublesome and the work efficiency is poor.

  Accordingly, an object of the present invention is to provide an electronic component mounting method capable of obtaining an offset value for making the amount of lowering of the suction nozzle appropriate when taking out or mounting the electronic component with high work efficiency.

Therefore, the first invention is an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The line sensor unit measures the position of the jig nozzle when the lowered jig nozzle is displaced in contact with the mounting height teaching jig or the printed board positioned by the board positioning unit,
An offset value is calculated from the displaced displacement amount,
The calculated offset value is stored,
The suction nozzle is lowered in consideration of the offset value when the electronic component is mounted on the printed circuit board.

A second invention is an electronic component mounting method in which an electronic component supplied from a component supply apparatus is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The line sensor unit measures the position of the lowered jig nozzle,
When the line sensor unit measures that the lowered jig nozzle has not been displaced without coming into contact with the mounting height teaching jig or the printed board positioned by the board positioning unit, the jig nozzle further measures the jig. Lower the tool nozzle slightly and repeat the measurement a predetermined number of times until it is displaced,
An offset value is calculated based on the displaced displacement amount,
The calculated offset value is stored,
The suction nozzle is lowered in consideration of the offset value when the electronic component is mounted on the printed circuit board.

A third invention is an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The position of the jig nozzle when the lowered jig nozzle is displaced in contact with the suction height jig or the component supply device is measured with a line sensor unit,
An offset value is calculated from the displaced displacement amount,
The calculated offset value is stored,
The suction nozzle is moved down in consideration of the offset value when picking up and picking up electronic components from the component supply device.

A fourth invention is an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The line sensor unit measures the position of the lowered jig nozzle,
If the line sensor unit measures that the lowered jig nozzle has not been displaced without contacting the suction height jig or the component supply device, the jig nozzle is further lowered slightly. Repeat the measurement a predetermined number of times until it is displaced,
An offset value is calculated based on the displaced displacement amount,
The calculated offset value is stored,
The suction nozzle is moved down in consideration of the offset value when picking up and picking up electronic components from the component supply device.

  The present invention can provide an electronic component mounting apparatus capable of obtaining an offset value for making the amount of lowering of the suction nozzle appropriate when taking out or mounting an electronic component with high work efficiency.

  Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the accompanying drawings. 1 is a plan view of the electronic component mounting apparatus 1, FIG. 2 is a front view of a lower main body of the electronic component mounting apparatus 1, and FIG. 3 is a right side view of the electronic component mounting apparatus 1 on the base 2 of the apparatus 1. On the feeder bases 3A, 3B, 3C, and 3D, a plurality of component supply units 3 that supply various electronic components one by one to the component take-out position (component suction position) are fixed in parallel and detachable in a stationary state. ing. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 sequentially conveys the printed board P received from the upstream to the positioning unit 5, and after electronic components are mounted on the board P positioned by a positioning mechanism (not shown) in the positioning unit 5, Be transported.

  Reference numeral 8 denotes a pair of front and rear beams which are provided in the left and right portions of the mounting apparatus 1 and which are long in the X direction, and sliders 11 fixed to the beams 8 along the pair of left and right guides 10 by driving the linear motors 9. It slides and individually moves in the Y direction above the printed circuit board P on the positioning unit 5 and the component take-out position (component suction position) of the component supply unit 3. The linear motor 9 includes a pair of upper and lower stators 9A fixed to the base 2 and a mover 9B fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along a guide 13 by a linear motor 14 in the longitudinal direction, that is, in the X direction. As shown in FIG. 3, the linear motor 14 includes a pair of front and rear stators 14A fixed to the beam 8, and a movable element 14B provided on the mounting head body 7 and positioned between the stators 14A. Is done.

  Each mounting head body 7 includes a mounting head 16 having a suction nozzle 15 which is provided at the lower portion and is biased downward by 12 springs 12. Each mounting head 16 of each mounting head body 7 is provided with a substrate recognition camera 19 and images a positioning mark (not shown) attached to the printed circuit board P located in the positioning unit 5.

  Hereinafter, the lifting device of the mounting head 16 and the mounting head 16 will be described in detail with reference to FIGS. 5 and 6. Reference numeral 20 denotes a base of the mounting head body 7 that moves along the guide 13, and 21 denotes a beam-side base fixed to the base 20. Reference numeral 22 denotes a mounting head side base fixed to the upper and lower portions of the mounting head 16, and a head lifting device 23 is provided between the mounting head side base 22 and the beam side base 21.

  The head lifting device 23 includes a guide 24 for guiding the mounting head 16 when the mounting head 16 is lifted, a ball screw 25 attached to the beam-side base 21, and a head lifting motor that rotates the ball screw 25 to raise and lower the mounting head 16. 26, a lifting nut 27 screwed to the ball screw 25, a head lifting motor 26, and a support 28 that rotatably supports the upper portion of the ball screw 25. It is fixed to. For this reason, by the rotation of the ball screw 25 by the rotation of the head lifting / lowering motor 26, the lifting / lowering nut 27 is lifted / lowered. As a result, the mounting head 16 is lifted / lowered.

  Reference numeral 30 denotes a slip ring. The slip ring 30 is provided for communication between the mounting apparatus main body and the mounting head 16 and for supplying electric power to a rotation motor of a nozzle support portion described later. Reference numeral 31 denotes a nozzle support provided at the lower portion of the mounting head 16 so as to support the suction nozzles 15 arranged at predetermined intervals, that is, twelve suction nozzles 15 arranged on the circumference at predetermined angles. Is an outer cylindrical body below the mounting head 16, and 33 is a head rotation motor which is, for example, a pulse motor for θ rotation of the suction nozzle 15 provided between the outer cylindrical body 32 and the nozzle support 31. The rotor 34 of the head rotation motor 33 is provided on the outer peripheral surface of the nozzle support 31 and is provided so as to be rotatable in the θ direction together with the nozzle support 31 inside the stator 35 provided on the outer cylinder 32.

  Reference numeral 37 denotes a line sensor unit as a part detecting unit for detecting the presence / absence of a component and a detecting unit for detecting a suctioning posture (sucking state) and a unit for detecting the thickness of the electronic component D provided to protrude downward from the center of the head support 31. A light emitting element 42 such as an LED is disposed in the upper portion of a cylindrical light emitting unit mounting body 41 provided at the lower end of a support 38 provided at a substantially central portion of the lens 16, and a lens 43 below the lens 43 and below the lens 43. A light emitting unit 45 configured by disposing a reflector 44 having a conical reflection surface 44 a and light from the light emitting element 42 that is fixed to the bottom surface of the outer cylindrical body 32 and passes through the reflector 44 are received. The light receiving unit 46 includes a plurality of CCD elements as light receiving elements.

  For example, when the component provided on the mounting head 16 performs suction, the suction operation of the electronic component D by the selected suction nozzle 15 ends, and the height of the lower end surface of the electronic component D every time the nozzle support 31 rotates. By detecting the position as the boundary position where the light receiving state of each CCD element changes from light shielding to light receiving, the part is normally sucked as shown in FIG. It is detected separately from the case where it is attached or the case where it is adsorbed obliquely. That is, the suction nozzle 15 descends and picks up the electronic component D from the component supply unit 3, and after it is lifted, the nozzle support 31 is rotated by driving the head rotating motor 33 to suck and hold the electronic component D. 15, the electronic component D attracted by the suction nozzle 15 during the turning is located between the reflector 44 and the light receiving unit 46, so that the height position of the lower end surface of the electronic component D at a plurality of positions. By detecting this, it is possible to detect the presence / absence of a component, to detect a suction posture, to detect the thickness of a component sucked and held by the suction nozzle 15, and the like. The detection is performed when the nozzle support 31 moves while rotating. However, when the electronic component D is positioned between the reflector 44 and the light receiving unit 46, the rotation is stopped and detected. It may be.

  When the suction nozzle 15 does not suck the electronic component D, light to be shielded (by the sucked electronic component) out of the light from the light emitting element 42 is received by the light receiving unit 46. Therefore, the absence of the electronic component D is detected, and the suction nozzle 15 communicates with the vacuum source 47 by the operation of a solenoid valve 82 which is a vacuum valve on / off operation body (described later) provided on the side of each nozzle shaft 64. The flow path is cut off, the vacuum passage from the vacuum source 47 is cut off to stop the vacuum suction operation to prevent leakage, and the surface that should not be sucked is sucked and is so-called standing or sucked diagonally If it is detected that the mounting head 16 and the suction nozzle 15 are moved upward, the electronic component D is dropped.

  Reference numeral 50 denotes a nozzle lifting device provided in the mounting head 16, and this nozzle lifting device will be described below. Reference numeral 51 denotes a nozzle lifting / lowering motor attached to the head-side base 22; 52, a ball screw which is rotated by the nozzle lifting / lowering motor 51 by a rotation shaft 511 of the nozzle lifting / lowering motor 51 being connected by a connecting member 59; Lifting body which is screwed to 52 and moves up and down by the rotation of the ball screw 52, 55 is a guide attached to the head side base 22 to guide the lifting and lowering body 53, 56 is a roller which is rotatably attached to the lower end of the lifting body 53 It is.

  Reference numeral 57 denotes a first cylinder having a central axis 60 of the mounting head 16 passing through the center. An annular flange 58 formed on the first cylinder 57 is positioned on the roller 56, and the first cylinder is formed. 57 is supported by a roller 56. Here, the first cylindrical body 57 is composed of, for example, a ball spline, and is biased downward by a spring 61 whose lower end is in contact with the upper surface of the collar portion 58 and rotates θ with the rotation of the pulley described later. The roller 56 moves up and down as the lifting body 53 moves up and down. Reference numeral 62 denotes a nozzle support member that is fixed to the lower portion of the first cylindrical body 57 and rotates θ together with the first cylindrical body 57. An elevating support piece 63 that extends horizontally in the circumferential direction is formed at the lower end of the nozzle support member 62. Has been. The elevating support piece 63 moves up and down as the first cylindrical body 57 moves up and down, and the lowering of the elevating support piece 63 lowers the predetermined suction nozzle 15 among the plurality of suction nozzles.

  That is, a roller 65 is rotatably attached to the upper end of each nozzle shaft 64 extending upward from each suction nozzle 15, and the upper end of the nozzle shaft 64 of one suction nozzle 15 selected by a nozzle selection device described later. While the roller 65 is on the upper surface of the lifting support piece 63, the roller 65 moves up and down by the lowering of the nozzle support member 62 and the lifting support piece 63 as the first cylindrical body 57 is lowered. That is, when the elevating support piece 63 and the roller 65 are lowered to, for example, the positions indicated by the elevating support piece 63A and the roller 65A, the predetermined suction nozzle 15 is lowered along with the lowering. Further, the suction nozzle 15 is lowered by a predetermined stroke by controlling the rotation amount of the nozzle lifting / lowering motor 51 and adjusting the stop height when the lifting / lowering body 53 is lowered.

  Reference numeral 66 denotes a third cylindrical body which is provided under the nozzle support member 62 and can be rotated by θ. The upper portion of the third cylindrical body 66 has the same height as the elevation support piece 63 of the nozzle support member 62 before being lowered. A substantially disc-shaped fixed support piece 67 is formed at this position. As shown in FIG. 7, the fixed support piece 67 has a notch 68 corresponding to the lifting support piece 63, and each roller 65 at the upper end of the nozzle shaft 64 of the suction nozzle 15 excluding the lowering suction nozzle 15. Is supported by a fixed support piece 67. That is, in the fixed support piece 67, a notch 68 is formed at a position at an angle equally divided by the number of nozzles 15 in the circumferential direction, or at a position of approximately 30 °, which is an angle divided by 12 in this embodiment. The lift support piece 63 of the nozzle support member 62 is located at the notch 68.

  70 is a nozzle selection device provided in the mounting head 16, 71 is a nozzle selection motor for selecting a descending nozzle, 72 is a first pulley fixed to a rotation shaft 73 of the nozzle selection motor 71, and 74 is a center shaft 60. The second pulley 75 is rotatably supported, 75 is a belt passed between the first pulley 72 and the second pulley 74, and 76 is located outside the central shaft 60 and extends downward from the center of the second pulley 74. The spring 61 is a cylindrical rotating body, and is provided between the second pulley 74 and the flange portion 58 of the first cylinder 57.

  The first cylindrical body 57 is positioned outside the outer peripheral surface of the lower portion of the rotating body 76, and the first cylindrical body 57 is rotated as the second pulley 74 rotates due to the action of the first cylindrical body 57 as a ball spline. When the elevating body 53 is moved up and down as the elevating body 53 is moved up and down, the elevating body 53 is lowered along the rotating body 76.

  That is, at the time of nozzle selection accompanying the suction and mounting of the electronic component D, when the nozzle selection motor 71 rotates, the first cylinder 57 rotates through the first pulley 72 belt 75, the second pulley 74, and the rotating body 76, Further, the nozzle support member 62 connected to the first cylinder 57 rotates together with the third cylinder 66, and the lifting support piece 63 of the nozzle support member 62 is positioned below the nozzle shaft 64 extending from the selected suction nozzle 15. To do. In such a state, when the nozzle lifting / lowering motor 51 rotates and the lifting / lowering body 53 descends according to the thickness of the electronic component to be sucked and mounted, the first cylinder 57 and the nozzle support member 62 are lowered accordingly. Only the nozzle 15 selected by the lowering of the support piece 63 is lowered by a predetermined stroke according to the thickness of the electronic component.

  In FIG. 9, reference numeral 80 denotes an air switching valve, which is provided at an equiangular interval corresponding to each suction nozzle 15 at a position on the outer side in the circumferential direction from each suction nozzle 15, and can individually switch between air suction and blowing. is there. The air switching valve 80 includes a case 81 provided in the upper part, and a solenoid valve 82 in which the upper part is located in the case 81 and the energization is controlled by a signal from the CPU 90. The solenoid valve 82 is an annular electromagnet 83 provided on the inner surface of the case 81, and moves up and down in the case 81 by energizing and de-energizing the electromagnet 83, and a cylindrical permanent magnet 84 corresponding to the electromagnet 83 at the upper part. It is comprised from the channel | path switching body 85 etc. in which this was provided. An air blow passage 86, a nozzle communication passage 87, and a evacuation passage 88 are formed in this order from the top to the bottom between the passage switching body 85 and the cylinder portion 81A below the case 81.

  Further, the nozzle shaft 64 is formed with a nozzle shaft passage 100 communicating with the internal passage of the suction nozzle 15 and the nozzle communication passage 87, and the nozzle shaft passage 100 and the vacuum are connected to the nozzle shaft passage 100 via the nozzle communication passage 87 by raising and lowering the passage switching body 85. The communication with the pulling passage 88 or the air blow passage 86 is switched.

  That is, when the passage switching body 85 is raised by energization of the electromagnet 83 of the solenoid valve 82, the evacuation passage 88 and the nozzle communication passage 87 communicate with each other, and the nozzle communication passage 87 and the air blow passage 86 communicate with each other. The suction nozzle 15 is closed, and the internal passage of the suction nozzle 15 communicates with the vacuum source 47 via the nozzle shaft passage 100, the nozzle communication passage 87, and the evacuation passage 88, and the suction nozzle 15 maintains vacuum suction of the electronic components. Further, when the electromagnet 83 is de-energized and the passage switching body 85 is lowered, the evacuation passage 88 and the nozzle communication passage 87 communicated with the vacuum source 47 are blocked, and the nozzle communication passage 87 and the air blower are used. The passage 86 communicates to stop the vacuum suction of the electronic component D by the suction nozzle 15, and air from the air supply source 48 enters the internal passage of the suction nozzle 15, the air blow passage 86, the nozzle communication passage 87, and the nozzle shaft passage 100. Is blown through.

  As described above, the energization / non-energization of the air switching valve 80 (electromagnet 83 of the solenoid valve 82) provided corresponding to each adsorption nozzle 15 causes the adsorption nozzle 15 and the vacuum source 47 or the air supply source 48 to be connected. The communication can be switched, and the air switching valve 80 corresponding to the selected suction nozzle 15 can be switched individually.

  49A is a switching valve whose one end communicates with the air switching valve 80, and switches the other end between communicating with the vacuum source 47 and sucking the suction nozzle 15 or communicating with the air supply source 48 and blowing out the suction nozzle 15. It is a valve. 49B is an open / close valve having one end communicating with the air switching valve 80 and the other end communicating with the air supply source 48. When the electronic component is mounted by the suction nozzle 15, the air switching valve 80 switches from air suction to air blowing. The vacuum is broken when the air switching valve 80 is switched to the air blowing when the suction nozzle 15 starts sucking and sucking the electronic component by opening the air supply source 48 before the air is turned on. It is a valve to do.

  Reference numeral 89 denotes a component recognition camera, which is provided on the mounting plate 99 of the base body 2 in correspondence with each of the mounting heads 16 so that the electronic components are displaced and held with respect to the suction nozzle 15. In order to recognize the position in the XY direction and the rotation angle, all the electronic components D sucked and held by the plurality of suction nozzles 15 are collectively imaged, but a plurality of electronic components can be simultaneously imaged. is there. The component recognition camera 89 can also check whether the electronic component D is sucked and held by the suction nozzle 15 by taking an image.

  Next, a description will be given below based on a control block diagram of the electronic component mounting apparatus 1 of FIG. Reference numeral 90 denotes a CPU (Central Processing Unit) as a control unit that performs overall control of the mounting apparatus 1, and the CPU 90 is connected to a RAM (Random Access Memory) 92 and a ROM (Read. Only memory) 93 is connected. Based on the data stored in the RAM 92, the CPU 90 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 93. That is, the CPU 90 receives the linear motors 9 and 14, the head elevating motor 26, the head rotating motor 33, the nozzle elevating motor 51, the nozzle selecting motor 71, the solenoid valve 82, and each mounting head 16 via the interface 94 and the drive circuit 95. The driving of the opening / closing valve 49B, the switching valve 49A and the like provided in the control is controlled.

  The RAM 92 stores mounting data related to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 92 stores component arrangement data, which stores the types of electronic components (component IDs) and the arrangement coordinates of the supply units 3 corresponding to the arrangement numbers of the component supply units 3. Has been.

  A recognition processing device 91 is connected to the CPU 90 via an interface 94, and recognizes an image captured by the component recognition camera 89 and recognizes an image captured by the board recognition camera 19. Processing is performed by the component recognition processing device 91.

  The images taken by the component recognition camera 89 and the board recognition camera 19 are displayed on a monitor 96 as a display device. The monitor 96 is provided with various touch panel switches 97, and when the operator operates the touch panel switch 97, various settings including settings for teaching designation can be performed.

  The touch panel switch 97 has a transparent conductive film coated on the entire surface of a glass substrate, and electrodes are printed on four sides. Therefore, when a very small current is passed through the surface of the touch panel switch 97 and the operator touches, current changes are caused in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Therefore, if the coordinate value matches a coordinate value in a coordinate value group stored in advance in the RAM 92 as a switch unit for performing a certain operation, the operation is performed.

  The light receiving unit 46 of the line sensor unit 37 is connected to the CPU 112 of the detection controller 111 via the interface 110. The CPU 112 is connected to a RAM (Random Access Memory) 113 and a ROM (Reset) via the bus line. -De-only memory) 114 is connected. The CPU 112 is connected to the CPU 90 via an interface 115 and a serial line 116.

  Next, teaching of the mounting height of the electronic component will be described below with reference to FIGS. First, instead of the suction nozzle 15 attached to the mounting head 16, an operator attaches a jig nozzle 77 having a flange 78 formed around the mounting head 15 (see FIG. 10) to resemble the printed circuit board P. The flat plate-shaped mounting height teaching jig (not shown) or the printed circuit board P is set on the supply conveyor 4. Here, the mounting height teaching jig is used. The jig nozzle 77 resembles the suction nozzle 15.

  When the teaching is started by operating the touch panel switch 97 on the monitor 96, the CPU 90 conveys the mounting height teaching jig to the positioning unit 5, and then positions the mounting height teaching jig by the positioning mechanism. Next, the CPU 90 controls the linear motors 9 and 14 to move the mounting head 16 to a specified position in the XY direction, and controls the head rotation motor 13 to move the specified jig nozzle 77 to a predetermined position. .

  Thereafter, the CPU 90 drives the nozzle raising / lowering motor 51 to lower the jig nozzle 77 by a predetermined distance (for example, 15.0 mm). This predetermined distance is stored in the RAM 92 in advance, and the CPU 90 controls the nozzle lifting / lowering motor 51 to stop when detecting that the encoder has moved a predetermined distance. The line sensor unit 37 measures the position of the flange 78 of the jig nozzle 77 at the position where the lowering is stopped, and stores it in the RAM 113 and RAM 92 of the detection controller 111. When the flange 78 is measured, the flange 78 is located between the reflection timing 44 and the light receiving unit 46.

  Next, the CPU 90 drives the head lifting motor 26 to lower the mounting head 16 by a predetermined distance (for example, 17.0 mm), and the line sensor unit 37 measures the position of the flange 78 of the jig nozzle 77 again. And stored in the RAM 113 and the RAM 92 of the detection controller 111. This predetermined distance is also stored in the RAM 92 in advance, and the CPU 90 controls the head elevating motor 26 to stop when detecting that the encoder has moved a predetermined distance.

  When the mounting head 16 is lowered by a predetermined distance, the CPU 90 determines whether or not there is a displacement in the measurement result before and after the lowering by the line sensor unit 37. In this case, when the mounting head 16 is lowered and the lower end of the jig nozzle 77 comes into contact with the mounting height teaching jig from above and rises against the urging force of the spring 12, measurement before and after the lowering is performed. From the result, it is determined that there is displacement, and when the lower end of the jig nozzle 77 does not contact the mounting height teaching jig, it is determined that there is no displacement. That is, the suction nozzle 15 is lowered by a total of 32.0 mm, which is a lowering amount of 15.0 mm by the nozzle elevating motor 51 and a lowering amount by 17.0 mm by the head elevating motor 26, and the presence or absence of displacement is determined.

  If it is determined that there is a displacement, the CPU 90 obtains an offset value from the measured displacement amount. That is, when the displacement amount is, for example, Amm, the offset value is minus Amm, and this offset value is stored in the RAMs 113 and 92. If it is determined that there is no displacement, the CPU 90 drives the head lifting / lowering motor 26 to lower the mounting head 16 by 0.2 mm, and the line sensor unit 37 measures the position of the flange 78 of the jig nozzle 77 again. Then, it is stored in the RAM 113 and the RAM 92 of the detection controller 111 and the presence / absence of the displacement as described above is determined. If it is determined that the displacement is present, the CPU 90 calculates an offset value from the measured displacement amount. That is, when the amount of displacement is B mm, for example, the offset value is (0.2−B) mm, and this offset value is stored in the RAMs 113 and 92. When it is determined that there is no displacement, it is determined whether or not the count value of the counter 98 by this measurement has reached a predetermined number of times (for example, 5 times). Repeat the descent and measurement up to 5 times.

  Accordingly, in detail, the CPU 90 calculates an offset value from the value of 0.2 mm × n (number of times) and the measured displacement, and stores the offset value in the RAMs 113 and 92. When it is counted five times that there is no displacement, the fact of abnormality is displayed on the monitor 96 and notified by other notifying means.

  Based on this notification, the operator confirms the presence or absence of the jig nozzle 77 and the like and ends. The above is the explanation of the operation of teaching the mounting height of the electronic component. Similarly, the teaching of the suction height of the electronic component can be performed.

  That is, as shown in FIG. 11, first, the suction height teaching jig or the component supply unit 3 having the same suction height level as the component supply unit 3 and resembling the component supply unit 3 is set on the feeder base 3A. The mounting head 16 is moved to a specified position in the XY directions, and the specified jig nozzle 77 is moved to a predetermined position (above the component suction / extraction position) by controlling the head rotation motor 13. Is lowered by a predetermined distance, and the line sensor unit 37 measures the position of the flange 78 of the jig nozzle 77.

  Next, the mounting head 16 is lowered by a predetermined distance, the line sensor unit 37 measures again, and the CPU 90 determines whether or not the measurement result before and after the descent by the line sensor unit 37 is displaced. If it is determined that there is a displacement, the CPU 90 calculates an offset value from the measured displacement amount, and stores the offset value in the RAMs 113 and 92. If it is determined that there is no displacement, the CPU 90 drives the head lifting / lowering motor 26 to lower the mounting head 16 by 0.2 mm, and the line sensor unit 37 measures the position of the flange 78 of the jig nozzle 77 again. The CPU 90 determines whether or not there is a displacement as described above and stores it in the RAM 113 and the RAM 92 of the detection controller 111. If it is determined that the displacement is present, the CPU 90 calculates an offset value from the measured displacement amount. And 92.

  When it is determined that there is no displacement, it is determined whether or not the count value of the counter 98 by this measurement has reached a predetermined number of times (for example, 5 times). Repeat the descent and measurement up to 5 times.

  Accordingly, in detail, the CPU 90 calculates an offset value from the value of 0.2 mm × n (number of times) and the measured displacement, and stores the offset value in the RAMs 113 and 92. When it is counted five times that there is no displacement, the fact of abnormality is displayed on the monitor 96 and notified by other notifying means. Based on this notification, the operator confirms the presence or absence of the jig nozzle 77 and the like, and finishes the work of teaching the suction height of the electronic component.

  With the configuration as described above, the operation of sucking and mounting the electronic component D by the electronic component mounting apparatus 1 will be described in detail below. First, the printed circuit board P is carried into the positioning unit 5 from the upstream device via the supply conveyor 4, and the positioning operation is started by the positioning mechanism.

  Next, the CPU 90 generates suction sequence data from the mounting data stored in the RAM 92. That is, the CPU 90 first reads data from the mounting data, determines the suction procedure by the suction nozzle 15, and performs the final electronic component of the chain suction (up to 12 pieces can be sucked per one mounting head 16). The component supply unit 3 that supplies D is determined, the arrangement coordinates of the final suction position are stored in the RAM 92, and the mounting coordinate position of the electronic component D to be mounted first after completion of the chain suction (mounting before correction of component suction displacement) The position of the data) is determined, and the coordinates are stored in the RAM 92.

  Then, the suction operation of the electronic component D is executed. That is, the suction nozzle 15 corresponding to the component type of the electronic component should be mounted in accordance with the mounting data in which the XY coordinate position where the printed circuit board is to be mounted, the rotation angle position around the vertical axis, the arrangement number, and the like are specified in the RAM 92. The electronic component is picked up and taken out from a predetermined component supply unit 3.

  At this time, the linear motors 9 and 14 are controlled by the CPU 90 so that the suction nozzle 15 of each mounting head 16 of each mounting head body 7 is located above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides 10. In the X direction, the linear motor 14 is also driven by the drive circuit 95. Each mounting head body 7 moves along the guide 13.

  Since each predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the head lifting motor 26 is based on signals output from the CPU 90 via the interface 94 and the drive circuit 95. Rotates, and the mounting head 16 moves down along the guide 24 to a predetermined height. Next, a suction nozzle (hereinafter referred to as “first suction nozzle”) 15 that first sucks an electronic component is a suction position, that is, a suction position shown in FIG. If it is deviated from 101), the CPU 90 outputs a signal for moving the suction nozzle 15 to the suction position 101 shown in FIG. 8, which is the suction position. Rotate. The nozzle support 31 of the mounting head 16 rotates θ around the central axis 60 by driving the head rotation motor 33.

  Then, when the roller 65 rides on the lifting support piece 63, the CPU 90 is based on the rotation angle of the nozzle support 31 and the angle of the side edge of the lifting support piece 63 (position shifted by 15 ° from the center of the lifting support piece). Then, a signal is output to the nozzle lifting / lowering motor 51 via the interface 94 and the drive circuit 95. Based on this signal, the nozzle lifting / lowering motor 51 rotates in the direction of lowering the first suction nozzle 15 and moves up / down by the rotation of the ball screw 52. The body 53 and the lifting support piece 63 are lowered, and the first suction nozzle 15 is lowered toward a predetermined height, that is, a height suitable for sucking and taking out the electronic components from the supply unit 3 set in advance. That is, by the θ rotation of the nozzle support 31 and the descending of the lifting support piece 63, the first suction nozzle 15 turns and descends, the roller 65 reaches the center of the lifting support piece 63, and the first suction nozzle 15 sucks. In addition to reaching the position 101, the offset value obtained by the suction height teaching is added to the height suitable for sucking the electronic component, that is, the predetermined distance that is lowered for the suction stored in the RAM 92 in advance. The CPU 90 is controlled so as to be lowered by the nozzle raising / lowering motor 51.

  As described above, when the first suction nozzle 15 reaches the suction position 101 and descends to a height suitable for sucking electronic components, the solenoid valve 82 corresponding to the first suction nozzle 15 receives a signal from the CPU 90. The passage switching body 85 is raised, the evacuation passage 88 and the nozzle communication passage 87 communicate with each other, the nozzle communication passage 87 and the air blow passage 86 are blocked, and the internal passage of the suction nozzle 15 Communicates with the vacuum source 47 via the nozzle shaft passage 100, the nozzle communication passage 87, the vacuum passage 88, and the switching valve 49A switched to the suction side, and the suction nozzle 15 maintains the vacuum suction of the electronic components.

  As described above, when the electronic component suction operation by the first suction nozzle 15 is completed, the CPU 90 outputs a signal to the nozzle lifting motor 51, and the nozzle lifting motor 51 lifts the first suction nozzle 15 based on this signal. The elevating body 53 is raised to a predetermined height, that is, the height before being lowered, by the rotation of the ball screw 52.

  The other suction nozzles 15 other than the first suction nozzle 15 also perform the operation of sucking and taking out electronic components from the component supply unit 3 in the same manner as described above.

  Then, presence / absence detection of the electronic component, detection of the suction posture, and detection of the thickness of the electronic component sucked and held by the suction nozzle 15 are performed by the line sensor unit 37 accompanying the suction operation of the electronic component by each suction nozzle 15. That is, the light receiving unit 46 of the line sensor unit 37 is provided at a position shifted by, for example, 45 ° from the suction position 101 shown in FIG. 8, and sucks electronic components as the nozzle support 32 is intermittently rotated in the arrow direction. When the suction nozzle 15 passes through the detection position 102 shown in FIG. 8, as described above, the line sensor unit 37 detects the presence / absence of all electronic components at the lower end of the suction nozzle 15, the detection of the suction posture, and the thickness of the components. The height is detected by rotating the mounting head 16 once.

  Accordingly, when the CPU 112 determines that there is no electronic component based on the detection information from the detection controller 111, the operation is again performed from the component supply unit 3, or the surface that should not be picked up is picked up, so-called standing state. If it is determined that the electronic component has detected an abnormal posture state when it is sucked or sucked diagonally, the mounting head 16 and the suction nozzle 15 are removed from the collection box before the electronic component is recognized and mounted. 79 The individual disposal (collection) operation of moving upward and dropping the electronic component D is performed for each electronic component.

  That is, the CPU 90 does not switch the air switching valve 80 (the electromagnet 83 of the solenoid valve 82) corresponding to the target suction nozzle 15 for which the line sensor unit 37 has detected an abnormal posture of the electronic component from the air suction side to the air blowing side. Before energization, the open / close valve 49B is opened to blow air from the air supply source 48. Then, when the suction nozzle 15 that sucks and holds the electronic components starts to descend, the air switching valve 80 is switched to the air blowing side, and the vacuum suction of the suction nozzle 15 is broken by the air from the air supply source 48 via the opening / closing valve 49B. Then, the electronic component D is dropped into the collection box 79 and an individual disposal (collection) operation is performed. That is, air from the air supply source 48 is blown into the internal passage of the suction nozzle 15 from the suction nozzle 15 through the air blow passage 86, the nozzle communication passage 87, and the nozzle shaft passage 100, and the electronic component D is dropped. The individual disposal (collection) operation is performed. At this time, in consideration of the stability of components during the component mounting operation and the like, the path from the opening / closing valve 49B to the air switching valve 80 is not closed, so the air blowing pressure from the suction nozzle 15 is small.

  Then, after this individual disposal operation, the CPU 90 energizes the air switching valve 80 (the electromagnet 83 of the solenoid valve 82) corresponding to the target suction nozzle 15 to switch from the air blowing side to the air suction side, and further the nozzle support 32. 8 is output to the head rotation motor 33 to pass the target suction nozzle 15 through the detection position 102 shown in FIG. 8, and the line sensor unit 37 again detects the presence / absence of electronic components as described above. . When it is detected that there is no electronic component, the air switching valve 80 (the electromagnet 83 of the solenoid valve 82) corresponding to the target suction nozzle 15 is switched from the air suction side to the air blowing side.

  Then, after all the individual disposal operations are performed, the component recognition operation such as the imaging of the electronic component by the component recognition camera 89 and the recognition processing of the recognition processing device 91 is performed, or the component recognition operation is performed when there is no abnormal posture of the electronic component. To perform the mounting operation on the printed circuit board P.

  That is, the CPU 90 controls the linear motors 9 and 14 so that the suction nozzle 15 moves to the mounting coordinate position on the printed circuit board P positioned by the positioning unit 5 in consideration of the recognition processing result from the recognition processing device 91. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides 10. In the X direction, the linear motor 14 is also driven by the drive circuit 95 along the guide 13. Each mounting head body 7 moves and controls the head rotation motor 33, the head lifting / lowering motor 26 and the nozzle lifting / lowering motor 51 to mount electronic components on the printed circuit board P.

  In this case, the CPU 90 takes into account the offset value obtained by the teaching of the mounting height to a predetermined distance that is lowered for mounting, that is, stored in advance in the RAM 92, and further, based on the thickness of the electronic component D, the nozzle Control is performed so as to be lowered by the lifting motor 51.

  Accordingly, the amount of lowering of the suction nozzle 15 when the electronic component D is mounted on the printed circuit board P is determined according to the offset value and the thickness of the electronic component D. Therefore, the electronic component D is mounted with an appropriate pushing amount. Therefore, the electronic component D is not damaged and the electronic component D cannot be mounted, and is securely mounted.

  When the electronic component is mounted, the air switching valve 80 corresponding to when the suction nozzle 15 sucking and holding the electronic component starts to move down is switched to the air blowing side, and the open / close valve 49B from the air supply source 48 is switched. The vacuum suction of the suction nozzle 15 is broken by the intervening air and mounted on the printed circuit board P.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a front view of an electronic component mounting apparatus. It is a right view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is a vertical front view of a mounting head body. It is a vertical side view of a mounting head body. It is a top view which shows a fixed support piece and a raising / lowering support piece. It is a schematic bottom view of a mounting head. It is an enlarged vertical front view of the lower part of a mounting head. It is a side view of the mounting head which attached the jig nozzle. It is a figure which shows a flowchart.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Component supply unit 5 Positioning part 7 Mounting head body 15 Adsorption nozzle 16 Mounting head 26 Head lifting motor 37 Line sensor unit 51 Nozzle lifting motor 77 Jig nozzle 90 CPU
92 RAM
98 counter

Claims (4)

In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The line sensor unit measures the position of the jig nozzle when the lowered jig nozzle is displaced in contact with the mounting height teaching jig or the printed board positioned by the board positioning unit,
An offset value is calculated from the displaced displacement amount,
The calculated offset value is stored,
An electronic component mounting method comprising lowering the suction nozzle in consideration of the offset value when mounting the electronic component on the printed circuit board. In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The line sensor unit measures the position of the lowered jig nozzle,
When the line sensor unit measures that the lowered jig nozzle has not been displaced without coming into contact with the mounting height teaching jig or the printed board positioned by the board positioning unit, the jig nozzle further measures the jig. Lower the tool nozzle slightly and repeat the measurement a predetermined number of times until it is displaced,
An offset value is calculated based on the displaced displacement amount,
The calculated offset value is stored,
An electronic component mounting method comprising lowering the suction nozzle in consideration of the offset value when mounting the electronic component on the printed circuit board. In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The position of the jig nozzle when the lowered jig nozzle is displaced in contact with the suction height jig or the component supply device is measured with a line sensor unit,
An offset value is calculated from the displaced displacement amount,
The calculated offset value is stored,
An electronic component mounting method comprising lowering the suction nozzle in consideration of the offset value when picking up an electronic component from the component supply device. In an electronic component mounting method in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board positioned by a substrate positioning unit.
A jig nozzle attached to the mounting head instead of the suction nozzle is lowered by a predetermined distance by an elevating drive source,
The line sensor unit measures the position of the lowered jig nozzle,
If the line sensor unit measures that the lowered jig nozzle has not been displaced without contacting the suction height jig or the component supply device, the jig nozzle is further lowered slightly. Repeat the measurement a predetermined number of times until it is displaced,
An offset value is calculated based on the displaced displacement amount,
The calculated offset value is stored,
An electronic component mounting method comprising lowering the suction nozzle in consideration of the offset value when picking up an electronic component from the component supply device.

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