JP2007270160A - Nickel-plating solution and method for manufacturing electronic parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a nickel-plating solution which minimizes the growth of a plating film, imparts the plated film satisfactory smoothness, and adequately dissolves an anode therein. <P>SOLUTION: The nickel-plating solution includes a nickel salt mainly containing nickel sulfate, a halogen compound such as nickel chloride, and a pH buffer such as boric acid; has a pH adjusted to 2.2 to 5.5; contains nickel ions in a molar concentration (x) of 1.71 mol/L or higher; and contains halide ions so that a molar concentration ratio x/y of the molar concentration (x) of the nickel ions to the molar concentration (y) of the halide ions can be 3.0<x/y≤10.0. This method for manufacturing electronic parts comprises the steps of: electrolytically plating external electrodes 6a and 6b with nickel in the nickel plating bath to form nickel films 7a and 7b having satisfactory smoothness thereon; and then electrolytically plating the external electrodes with tin to form tin films 8a and 8b on the nickel films 7a and 7b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a nickel plating solution and a method for manufacturing an electronic component using the nickel plating solution.

  In electronic parts such as ceramic electronic parts, a plating film such as a tin film, a tin-based alloy film, or a gold film is formed on the conductive part for the purpose of improving solderability. A nickel film excellent in heat resistance and solder heat resistance is formed.

  As a plating solution for forming this kind of nickel film, a watt bath is conventionally known. This Watt bath generally has nickel sulfate of 0.49 to 1.45 mol / L, nickel chloride of 0.19 to 0.25 mol / L, and boric acid as a pH buffering agent of 0.48 to 0.00. The composition is adjusted to contain 65 mol / L, pH is 2.5 to 5.5, and bath temperature is 40 to 65 ° C.

  Patent Document 1 discloses a nickel plating solution containing nickel sulfamate or a complex thereof as a main component and a halogen compound for preventing nickel passivation and a pH stabilizer. .

JP-A-11-92988

  However, when nickel plating is performed using the Watt bath, the surface roughness of the nickel film is large and lacks smoothness. Therefore, the surface is oxidized, and the denseness of the upper film such as a tin film formed in the subsequent process is reduced. There is a problem that the solderability is lowered particularly in a severe environment of high temperature and high humidity.

  As a measure to smooth the surface of the nickel film, it is possible to add no halogen compound to the watt bath, but in this case, plating is also performed on the component body other than the conductive part on the object to be plated. Since nickel, which is a metal, is deposited, and the dissolution efficiency of the anode is reduced, it is necessary to frequently adjust the concentration of the plating solution during the plating process. Arise.

  As a method for preventing the deposition of nickel on the component body, a method of controlling the concentration ratio of nickel ions and halogen ions is also conceivable, but in Patent Document 1, since nickel sulfamate is used as a nickel source, There is a problem that nickel cannot be prevented from being deposited on the component body and so-called plating growth cannot be sufficiently suppressed.

  The present invention has been made in view of such circumstances, and provides a nickel plating solution that can suppress plating growth as much as possible and that has good smoothness and good anodic solubility. Furthermore, it aims at providing the manufacturing method of the electronic component which has the favorable solderability using this nickel plating solution.

  The inventors of the present invention have made extensive studies to achieve the above object. As a result, the molar concentration of nickel ions in the nickel plating solution is 1.71 mol / L or more, and the molar concentration ratio of nickel ions to halogen ions is 3.0. By quantitatively controlling the plating solution composition so as to be over 10.0 or less, it becomes possible to form a nickel film having good smoothness, and to suppress plating growth as much as possible, and The knowledge that anodic solubility was also good was obtained.

  The present invention has been made based on such knowledge, and the nickel plating solution according to the present invention contains a nickel salt, a halogen compound, and a pH buffer, and the pH is adjusted to 2.5 to 5.5. In the obtained nickel plating solution, the molar concentration x of nickel ions is 1.71 mol / L or more, and the ratio x / y between the molar concentration x of nickel ions and the molar concentration y of halogen ions is 3.0. <X / y ≦ 10.0.

  In the nickel plating solution of the present invention, the nickel salt is mainly composed of nickel sulfate.

  Furthermore, the nickel plating solution of the present invention is characterized in that the halogen compound is one or more of nickel chloride and nickel bromide.

  The nickel plating solution of the present invention is characterized in that the pH buffer is at least one selected from boric acid, oxycarboxylic acid, salts thereof, and lactone compounds.

  In addition, the electronic component manufacturing method according to the present invention is characterized in that the nickel element is formed on the surface of the conductive portion by plating the component body on which the conductive portion is formed using the nickel plating solution. It is said.

  The nickel plating solution of the present invention contains at least a nickel salt such as nickel sulfate, a halogen compound such as nickel chloride and nickel bromide, and a pH buffer such as boric acid, oxycarboxylic acid and lactone compound, and has a pH of In the nickel plating solution adjusted to 2.5 to 5.5, the molar concentration x of nickel ions is 1.71 mol / L or more, and the molar concentration x of nickel ions and the molar concentration y of halogen ions are Since the ratio x / y is 3.0 <x / y ≦ 10.0, it is possible to form a nickel film with good smoothness, and thus good solderability even when exposed to harsh usage environments. Can be obtained. In addition, nickel can be preferentially deposited on the conductive part, which can greatly suppress the growth of plating on the component body, and furthermore, nickel having good anode solubility and easy bath management. A plating solution can be obtained.

  That is, since the molar concentration of nickel ions is set to 1.71 mol / L or more, nickel is preferentially deposited on the conductive portion, and plating growth on a component body other than the conductive portion can be suppressed.

  In addition, since the plating solution is prepared so that the ratio x / y of nickel ion x to halogen ion y exceeds 3.0, the smoothness of the nickel film formed by electrolytic plating is improved. The upper film such as a tin film formed on the nickel film in the process becomes dense, and good solderability can be obtained even when exposed to a severe environment of high temperature and humidity.

  Further, since the ratio x / y is set to 10.0 or less, it is possible to obtain desired good anodic solubility without lowering the anodic dissolution efficiency, and thus adjusting the concentration of the plating solution during the plating process. It is no longer necessary to perform bathing, and bath management is simplified.

  Moreover, according to the method for manufacturing an electronic component of the present invention, the nickel base is formed on the surface of the conductive portion by plating the component body on which the conductive portion is formed using the nickel plating solution. Therefore, even when the plating growth on the component body is suppressed and a nickel film is formed only on the conductive portion, and an upper film such as a tin film is formed on the nickel film, the upper film is dense. Therefore, it is possible to obtain various electronic components such as ceramic electronic components that have good solderability even in a severe environment of high temperature and high humidity and have suppressed plating growth.

  Next, an embodiment of the present invention will be described in detail.

  The nickel plating solution according to the present invention contains a nickel salt, a halogen compound and a pH buffer, the pH is adjusted to 2.5 to 5.5, and the molar concentration x of nickel ions is 1.71 mol / L or more. In addition, the ratio x / y between the molar concentration x of nickel ions and the molar concentration y of halogen ions is adjusted to be 3.0 <x / y ≦ 10.0.

  The reason why the molar concentration x of nickel ions and the ratio x / y between the molar concentration x of nickel ions and the molar concentration y of halogen ions are limited as described above is as follows.

(1) Nickel molar concentration x
When nickel plating is applied to an object to be plated with a conductive part formed on a predetermined surface, in order to suppress plating growth on parts other than the conductive part, that is, the component body, plating is preferentially deposited on the conductive part. It is necessary to let

  As a result of extensive research by the present inventors, in order to preferentially deposit metal on the conductive portion, the molar concentration x of nickel ions is increased so that the molar concentration x is at least 1.71 mol / L or more. Was found to be effective.

  Therefore, in the present embodiment, the nickel plating solution is prepared so that the lower limit value of the molar concentration x of nickel ions is 1.71 mol / L and the molar concentration x of nickel ions is at least 1.71 mol / L or more. Yes.

(2) Ratio x / y between the molar concentration x of nickel ions and the molar concentration y of halogen ions
The nickel plating solution contains a halogen compound in order to avoid passivation of the anode, but if this halogen compound is contained in a large amount, the surface roughness of the nickel film formed by plating becomes large and lacks smoothness. For this reason, the upper layer film such as a tin film formed on the nickel film lacks the denseness, and the solderability is deteriorated.

  Therefore, the present inventors have intensively studied, and as a result, the halogen ion molar concentration y is decreased so that the molar concentration ratio x / y between the nickel ion molar concentration x and the halogen ion molar concentration y is 3.0 or more. By doing so, it was found that a nickel film having good smoothness was obtained.

  Thus, an upper layer film such as a tin film can be densified, and good solderability can be obtained even when exposed to high temperature and high humidity.

  On the other hand, if the molar concentration y of the halogen ions is excessively decreased and the ratio x / y exceeds 10.0, the dissolution efficiency of the anode is lowered, and it is necessary to frequently adjust the concentration during the plating process. The liquid bath management becomes complicated.

  Therefore, in the present embodiment, the nickel plating solution is prepared so that the molar concentration ratio x / y between nickel ions x and halogen ions y satisfies 3.0 <x / y ≦ 10.0.

  As the nickel ion supply source, it is preferable to use a nickel salt containing nickel sulfate as a main component, and as the halogenated compound, nickel halide such as nickel chloride or nickel bromide is preferably used.

  In addition, the compound used as a halogen ion source and a nickel ion source may contain compounds other than the above, unless the objective of this invention is disturbed.

  In addition, the pH of the nickel plating solution was adjusted to 2.5 to 5.5 when the pH is less than 2.5, the nickel plating solution becomes excessively acidic, so that the component elements constituting the component body are eluted. On the other hand, if the pH exceeds 5.5, it is difficult for nickel ions to exist stably in an ionic state. In addition, the preferable range of pH of a nickel plating solution is 3.0-4.5.

  Further, as the pH buffering agent, it is preferable to use boric acid that does not exhibit a complexing action, but oxycarboxylic acids other than boric acid, for example, oxytricarboxylic acid such as citric acid, gluconic acid, glucoheptonic acid, salicylic acid, Oxymonocarboxylic acids such as lactic acid and glycolic acid, oxydicarboxylic acids such as malic acid and tartaric acid can be used, and lactone compounds such as gluconolactone and glucoheptonolactone can also be used.

  However, when oxycarboxylic acids or lactone compounds are used as pH buffering agents, it is necessary to limit the addition amount because adding a predetermined amount or more may cause a strong complexing effect.

  Thus, the nickel plating solution has a molar concentration x of nickel ions of 1.71 mol / L or more and a ratio x / y between the molar concentration x of nickel ions and the molar concentration y of halogen ions is 3. Since it is prepared so as to satisfy 0 <x / y ≦ 10.0, nickel can be preferentially deposited on the conductive portion, thereby significantly suppressing plating growth on the component body. It is possible to preferentially deposit nickel on the conductive portion that can be formed. In addition, since the smoothness of the nickel film is improved, the upper layer film such as a tin film formed on the nickel film in the subsequent process becomes dense, and therefore a good solder even when exposed to a severe environment of high temperature and high humidity. Adherence can be obtained. Moreover, since it is possible to obtain the desired good anodic solubility without lowering the anodic dissolution efficiency, it is not necessary to adjust the concentration of the plating solution during the plating process, and the nickel plating is easy to manage the bath. A liquid can be obtained.

  Next, an electronic component manufactured using the nickel plating solution will be described in detail.

  FIG. 1 is a cross-sectional view showing an embodiment of a multilayer ceramic capacitor as an electronic component.

  In the multilayer ceramic capacitor, internal electrodes 2 to 5 are embedded in a ceramic body (component body) 1 made of a dielectric material such as barium titanate, and both ends of the ceramic body 1 are externally provided. Electrodes (conductive portions) 6a and 6b are formed, and nickel films 7a and 7b and tin films 8a and 8b are sequentially formed on the surfaces of the external electrodes 6a and 6b.

  The lead portions 2a and 4a of the internal electrodes 2 and 4 are electrically connected to one external electrode 6a, and the lead portions 3a and 5a of the internal electrodes 3 and 5 are electrically connected to the other external electrode 6b. In addition, a capacitance is formed between the internal electrodes 2 and 4 and the internal electrodes 3 and 5.

  Next, a method for manufacturing the multilayer ceramic capacitor will be described.

First, a predetermined dielectric ceramic material such as BaCO ₃ , TiO ₂ , and ZrO ₂ is mixed and subjected to processes such as pulverization, drying, and calcination, and a ceramic green sheet is produced by a doctor blade method.

  Next, a conductive paste for internal electrodes is produced in which an organic component such as glass particles or varnish is contained in a conductive material such as Pd or Ni. Then, using the conductive paste, screen printing is performed on the surface of the ceramic green sheet to form a conductive pattern, and after that, the ceramic green sheets on which the conductive pattern is formed are stacked, and then the conductive pattern is formed. It is sandwiched between ceramic green sheets that are not yet bonded, and these are pressed to form a laminate. Thereafter, the laminated body is subjected to a firing treatment at a predetermined temperature (for example, 900 to 1300 ° C.) and subjected to barrel polishing, whereby the ceramic body 1 is manufactured.

  Next, a conductive paste for an external electrode is produced in which an organic component such as glass particles and varnish is contained in a conductive material such as Ag or Cu. Next, the conductive paste is applied to both ends of the ceramic body 1 by a dip method, and then baked at a temperature of 600 to 800 ° C. As a result, organic components such as varnish burn and burn out, and external electrodes 6a and 6b made of a mixture of conductive material and glass particles are formed at both ends.

  Thereafter, the ceramic body 1 on which the external electrodes 6a and 6b are formed is used as an object to be plated, and nickel plating is performed by, for example, electrolytic barrel plating to form nickel films 7a and 7b.

  That is, first, the nickel plating solution is prepared.

  Then, nickel is disposed on the anode, and a cathode plate, an object to be plated, and a barrel containing a conductive medium are disposed on the cathode and immersed in the nickel plating solution, while the barrel is rotated, swung, etc. Then, a current is passed between the cathodes for a predetermined time to form nickel films 7a and 7b on the surfaces of the external electrodes 6a and 6b.

  After forming the nickel films 7a and 7b in this way, the tin plating solution prepared in a predetermined composition is used, and the tin films 8a and 8b are formed on the nickel films 7a and 7b by the electrolytic barrel plating method, for example, as described above. This forms a multilayer ceramic capacitor.

  Thus, since this multilayer ceramic capacitor is manufactured using the said nickel plating solution, the plating growth to the ceramic body 1 is suppressed, and the nickel film with good smoothness only on the external electrodes 6a and 6b 7a and 7b are formed, and thus the tin films 8a and 8b on the nickel films 7a and 7b are densified. Therefore, solderability is good even in a severe environment of high temperature and high humidity, and plating growth is suppressed. A multilayer ceramic capacitor can be obtained.

  The present invention is not limited to the above embodiment. In the above embodiment, the multilayer ceramic capacitor is exemplified as an application example of the nickel plating solution. However, the multilayer ceramic capacitor can be widely applied to other electronic components, for example, a single plate capacitor, a multilayer inductor, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, and the like. Needless to say.

  Next, examples of the present invention will be specifically described.

First, nickel sulfate hexahydrate (NiSO ₄ · 6H ₂ O) as a nickel salt and nickel chloride · hexahydrate (NiCl ₂ · 6H) as a halogen compound so as to have a component composition as shown in Table 1. ₂ O) or nickel bromide (NiBr ₂ ) and boric acid were blended, and the pH and bath temperature were adjusted to prepare nickel plating solutions of Examples 1 to 4 and Comparative Examples 1 to 9.

次に、外形寸法が縦２．０ｍｍ、横１．２５ｍｍ、厚み１．２５ｍｍであって、ニッケルからなる内部電極が埋設されると共に、焼付け処理により銅からなる外部電極が両端部に形成された第１の被めっき物（セラミック素体（主成分：チタン酸バリウム系））を用意した。

Next, the outer dimensions were 2.0 mm in length, 1.25 mm in width, and 1.25 mm in thickness. Internal electrodes made of nickel were embedded, and external electrodes made of copper were formed at both ends by baking treatment. A first object to be plated (ceramic body (main component: barium titanate)) was prepared.

Next, electrolytic barrel plating was applied to the first object to be plated using the nickel plating solutions of Examples 1 to 4 and Comparative Examples 1 to 9, and a nickel film having a thickness of 3 μm was formed on the external electrode. The electrolytic barrel plating was performed by supplying a current of 10 A (average cathode current density of 0.20 A / dm ² ) for 120 minutes.

  Next, a tin plating solution having the following composition was prepared.

[Bath composition of tin plating solution]
Stannous sulfate 43g / L
Ammonium citrate 122g / L
Ammonium sulfate 132g / L
Lauryldiethanolamine 1g / L
pH 5.0
Bath temperature 30 ° C
Next, electrolytic barrel plating was performed using this tin plating solution to form a tin film having a film thickness of 4 μm on the nickel film, and thus multilayer ceramic capacitors of Examples 1 to 4 and Comparative Examples 1 to 9 were obtained. . The electrolytic barrel plating was carried out by applying a current of 8 A (average cathode current density of 0.16 A / dm ² ) for 30 minutes.

  Next, the external dimensions are 2.0 mm in length, 1.25 mm in width, and 1.25 mm in thickness, and an internal electrode made of nickel-palladium alloy is embedded, and external electrodes made of silver are baked at both ends by baking treatment. A formed second object to be plated (ceramic body (main component: ferrite)) was prepared.

  Next, using the nickel plating solutions of Examples 1 to 4 and Comparative Examples 1 to 9, a nickel film having a thickness of 3 μm is formed on the external electrode of the second object to be plated by the same method and procedure as described above. Further, a tin film having a film thickness of 1 μm was formed on the nickel film using the tin plating solution, thereby obtaining multilayer inductors of Examples 1 to 4 and Comparative Examples 1 to 9.

  Next, for each of the multilayer ceramic capacitors and the multilayer inductors of Examples 1 to 4 and Comparative Examples 1 to 9, using a microscope, the elongation of the plating film deposited on the ceramic body was measured and The average value was calculated and the degree of plating growth was evaluated.

  Moreover, solderability was evaluated about ten each of the multilayer ceramic capacitors and multilayer inductors of Examples 1-4 and Comparative Examples 1-9.

  Here, the solderability is determined by allowing each sample to stand for 4 hours at a high temperature and humidity of 105 ° C. and a relative humidity of 100%, and then immersing in a eutectic solder melting bath having a bath temperature of 210 ° C. for 2 seconds. The solder coating area was measured, and the solderability was evaluated based on the coverage.

  Further, for each of the multilayer ceramic capacitors and multilayer inductors of Examples 1 to 4 and Comparative Examples 1 to 9, the anode dissolution efficiency was calculated and the anode solubility was evaluated.

  The dissolution efficiency of the anode was obtained by dividing the measured value of the precipitation amount by the theoretical precipitation amount with respect to the applied current.

  Table 2 shows the measurement results of the multilayer ceramic capacitor, and Table 3 shows the measurement results of the multilayer inductor.

表中、めっき成長については、積層セラミックコンデンサの場合は、セラミック素体上のめっき皮膜の伸びが２μｍ未満の場合を良（○）、２μｍ以上の場合を不良（×）と判断し、積層インダクタの場合は、セラミック素体上のめっき皮膜の伸びが８０μｍ未満の場合を良（○）、８０μｍ以上の場合を不良（×）と判断した。

In the table, regarding the plating growth, in the case of a multilayer ceramic capacitor, the case where the elongation of the plating film on the ceramic body is less than 2 μm is judged as good (◯), and the case where it is 2 μm or more is judged as bad (×). In the case of, the case where the elongation of the plating film on the ceramic body was less than 80 μm was judged as good (◯), and the case where it was 80 μm or more was judged as defective (x).

  With regard to solderability, the solder coverage on the tin film is 95% or higher as a non-defective product, and less than 95% is a defective product. If no defective product occurs at all (Good), even one defective product occurs. The case was judged as bad (x).

  Regarding the anode solubility, a case where the dissolution efficiency was 90% or more was judged as good (◯), and a case where it was less than 90% was judged as poor (×).

  As is apparent from Tables 2 and 3, the nickel plating solution of Comparative Example 1 has a molar concentration ratio x / y of 2.9 and less than 3.0, so that the solderability defect occurrence rate is low. It was found that the yield was 20% in the case of a multilayer ceramic capacitor and 10% in the case of a multilayer inductor, leading to a decrease in product yield. This is because the molar concentration y of the halogen ion in the nickel plating solution is high, so that the plating deposition rate is increased, and the plating film lacks denseness and smoothness, which leads to a decrease in solderability. Seem.

  The nickel plating solution of Comparative Example 2 has a molar concentration ratio x / y of 11.4 and exceeds 10.0. Therefore, in both cases of the multilayer ceramic capacitor and the multilayer inductor, the dissolution efficiency of the anode is 85%. It was found that the anodic solubility was poor.

  Since the nickel plating solution of Comparative Example 3 has a nickel ion molar concentration x of 1.41 mol / L and less than 1.71 mol / L, the elongation of the plating film formed on the ceramic body is a multilayer ceramic. In the case of the capacitor, the thickness was 3.2 μm, and in the case of the multilayer inductor, the thickness was 90 μm. It was found that the plating growth was remarkable in either case. This is because the molar concentration x of nickel ions in the nickel plating solution is low, so that a large potential is applied to the object to be plated during the plating process, so that a plating film is formed on the ceramic body other than the external electrodes. It seems that growth has occurred.

  Since the nickel plating solution of Comparative Example 4 has a molar concentration ratio x / y of 2.8 and less than 3.0, for the same reason as in Comparative Example 1, the rate of occurrence of defective solderability is a multilayer ceramic capacitor. It was found that in any case of the multilayer inductor and the multilayer inductor, it was 30%, and the product yield was reduced.

  The nickel plating solution of Comparative Example 5 has a molar concentration ratio x / y of 32.1 and greatly exceeds 10.0. Therefore, in both cases of the multilayer ceramic capacitor and the multilayer inductor, the dissolution efficiency of the anode is high. It was found that the anodic solubility was inferior, as in Comparative Example 2, as it decreased to 60%.

  The nickel plating solution of Comparative Example 6 has a nickel ion molar concentration x of 1.52 mol / L and is less than 1.71 mol / L. Therefore, it is formed on the ceramic body for the same reason as in Comparative Example 3. The elongation of the plated film was 3.0 μm in the case of the multilayer ceramic capacitor and 110 μm in the case of the multilayer inductor, and it was found that the plating growth was remarkable in either case.

  Since the nickel plating solution of Comparative Example 7 has a molar concentration ratio x / y of 2.9 and less than 3.0, for the same reason as in Comparative Example 1, the rate of occurrence of defective solderability is a multilayer ceramic capacitor. It was found that it was 30% in the case of 10 and 10% in the case of the multilayer inductor, leading to a decrease in product yield.

  The nickel plating solution of Comparative Example 8 had a molar concentration ratio x / y of 11.2 and exceeded 10.0. Therefore, in both cases of the multilayer ceramic capacitor and the multilayer inductor, the dissolution efficiency of the anode was 71%. As in Comparative Example 2 and Comparative Example 5, it was found that the anode solubility was inferior.

  The nickel plating solution of Comparative Example 9 has a nickel ion molar concentration x of 1.70 mol / L and is less than 1.71 mol / L. Therefore, it is formed on the ceramic body for the same reason as in Comparative Example 3. The elongation of the plated film was 2.8 μm in the case of the multilayer ceramic capacitor and 100 μm in the case of the multilayer inductor, and it was found that the plating growth was remarkable in either case.

  In contrast, in the nickel plating solutions of Examples 1 to 4, the molar concentration of nickel ions is 1.71 mol / L or more, and the ratio x / y of the molar concentration x of nickel ions to the molar concentration y of halogen ions is 3.0. <X / y ≦ 10.0, so that the solderability is good even when exposed to high temperature and humidity, and the elongation of the plating film deposited on the ceramic body is 1 μm or less in the case of the multilayer ceramic capacitor In the case of the multilayer inductor, it was as good as 50 to 70 μm, and the plating growth could be suppressed. Further, it was found that the anode dissolution efficiency was 99% or more, the anode solubility was good, and the bath management could be easily performed.

It is sectional drawing which shows typically one Embodiment of the multilayer ceramic capacitor as an electronic component manufactured using the nickel plating liquid which concerns on this invention.

Explanation of symbols

1 Ceramic body (component body)
6a, 6b External electrode (conductive part)
7a, 7b Nickel coating

Claims (5)

In a nickel plating solution containing a nickel salt, a halogen compound, and a pH buffer, and having a pH adjusted to 2.5 to 5.5,
The molar concentration x of nickel ions is 1.71 mol / L or more,
The nickel plating solution is characterized in that the ratio x / y between the molar concentration x of nickel ions and the molar concentration y of halogen ions is 3.0 <x / y ≦ 10.0.   2. The nickel plating solution according to claim 1, wherein the nickel salt is mainly composed of nickel sulfate.   The nickel plating solution according to claim 1 or 2, wherein the halogen compound is at least one of nickel chloride and nickel bromide.   The nickel plating solution according to any one of claims 1 to 3, wherein the pH buffer is at least one selected from boric acid, oxycarboxylic acid, salts thereof, and lactone compounds. .   A nickel plating solution according to any one of claims 1 to 4 is used to plate a component body on which a conductive portion is formed, and a nickel film is formed on the surface of the conductive portion. Manufacturing method for electronic parts.

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