JP2007270136A - Sheet molding compound molding materials for heat compression molding, molding using the same, and method for producing the same - Google Patents
Sheet molding compound molding materials for heat compression molding, molding using the same, and method for producing the same Download PDFInfo
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- 239000012778 molding material Substances 0.000 title claims abstract description 67
- 238000000465 moulding Methods 0.000 title claims abstract description 34
- 238000000748 compression moulding Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000003677 Sheet moulding compound Substances 0.000 title claims description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 70
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 70
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 30
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 22
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- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 14
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- 239000004593 Epoxy Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 21
- -1 aromatic sulfonium salt compound Chemical class 0.000 claims description 14
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- 239000000203 mixture Substances 0.000 claims description 6
- 239000012779 reinforcing material Substances 0.000 claims description 6
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 claims description 4
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
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- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- NIJZFHNDUJXJMR-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethanol Chemical compound C1C(CO)CCC2OC21 NIJZFHNDUJXJMR-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004412 Bulk moulding compound Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- 239000000853 adhesive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
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- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910001864 baryta Inorganic materials 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
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- 229910000514 dolomite Inorganic materials 0.000 description 1
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- 239000003365 glass fiber Substances 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
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- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
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- 229920003986 novolac Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Abstract
Description
本発明は、加熱によって増粘させることができ、フィルム剥離性に優れ、シェアエッジを有する金型内で加熱圧縮成形性に優れたシートモールディングコンパウンド成形材料、その成形品及びその製造方法に関するものである。 The present invention relates to a sheet molding compound molding material that can be thickened by heating, has excellent film releasability, and has excellent heat compression moldability in a mold having a shear edge, a molded product thereof, and a manufacturing method thereof. is there.
一般に不飽和ポリエステル樹脂をマトリックス樹脂とした成形材料、シートモールディングコンパウンドと呼ばれるシート状の成形材料、バルクモールディングコンパウンドと呼ばれる塊状の成形材料は、住設部材、自動車部品、電気部品などの分野のＦＲＰ成形品に広く使用されている。 In general, molding materials using unsaturated polyester resin as matrix resin, sheet-shaped molding materials called sheet molding compounds, and bulk molding materials called bulk molding compounds are FRP moldings for fields such as housing components, automobile parts, and electrical parts. Widely used in goods.
しかしながら、上記の不飽和ポリエステル樹脂ＦＲＰ成形品は、成形収縮率が大きいこと、耐疲労特性、高温での熱的特性が劣るという欠点を有する。そこで、この改良のためにマトリックス樹脂としてこれらの特性を有するエポキシ樹脂を用いた成形材料の検討が進められている。（特許文献１）なお、シート状の成形材料をプリプレグと呼ぶ場合がある。
このエポキシ樹脂を用いた成形材料の製造方法としては、溶剤を含むマトリックス樹脂溶液を繊維強化材に塗布し、繊維強化材に樹脂溶液を含浸した後に脱溶剤するラッカー法と、溶剤を使わずにマトリックス樹脂を加熱溶解させ樹脂フィルムを予め作成し、繊維強化材に貼り合わせて含浸させるホットメルト法が主に用いられている。
しかし、いずれの製造方法も硬化剤を含むマトリックス樹脂を長時間加熱する必要があり、製造工程中に成形材料がゲル化するという問題がある。
However, the above-mentioned unsaturated polyester resin FRP molded product has the disadvantages of high molding shrinkage, fatigue resistance, and poor thermal properties at high temperatures. Therefore, for this improvement, a study is being made on a molding material using an epoxy resin having these characteristics as a matrix resin. (Patent Document 1) A sheet-shaped molding material may be referred to as a prepreg.
As a method for producing a molding material using this epoxy resin, a lacquer method in which a matrix resin solution containing a solvent is applied to a fiber reinforcement, and the fiber reinforcement is impregnated with the resin solution and then desolvated, and a solvent is not used. A hot melt method in which a matrix resin is dissolved by heating, a resin film is prepared in advance, and is bonded to a fiber reinforcement and impregnated is mainly used.
However, in any of the production methods, it is necessary to heat the matrix resin containing the curing agent for a long time, and there is a problem that the molding material gels during the production process.
これらエポキシ成形材料の成形方法は、主にオートクレーブ成形法である。すなわち成形材料を加熱、加圧することで賦型させるものである。しかし、この成形法は、硬化時間が、概して１２０℃〜１８０℃の温度下で３０分〜２時間と長時間を要し、プレス加熱圧縮成形法と比較して、加圧による賦型形状に自由度が小さいことが欠点として挙げられる。 The molding method of these epoxy molding materials is mainly an autoclave molding method. That is, the molding material is shaped by heating and pressing. However, this molding method generally requires a long time of 30 minutes to 2 hours at a temperature of 120 ° C. to 180 ° C. Compared with the press heating compression molding method, it has a molded shape by pressurization. A disadvantage is that the degree of freedom is small.
そこでエポキシ成形材料が、プレス加熱圧縮成形法において比較的短時間で成形されたものとして、エポキシプリプレグがプレス加熱圧縮成形法により温度１４０℃、圧力８ＭＰａ、成形時間５分で厚み２．２ｍｍの成形品が得られる技術（特許文献１参照）が提案されている。 Therefore, assuming that the epoxy molding material is molded in a relatively short time by the press heat compression molding method, the epoxy prepreg is molded by the press heat compression molding method at a temperature of 140 ° C., a pressure of 8 MPa, a molding time of 5 minutes and a thickness of 2.2 mm. A technique for obtaining a product (see Patent Document 1) has been proposed.
このエポキシプリプレグは、ビスフェノールＡ型の液状及び固形エポキシ樹脂混合物とアミン化合物とからなる樹脂シートを繊維強化材に加熱加圧含浸法で製造したものであるが、硬化特性としては、上記の不飽和ポリエステル樹脂をマトリックス樹脂としたシートモールディングコンパウンドに比較すると、硬化性に劣り、Ｂステージ化の記載もないことから硬化特性、取り扱い性が不十分な成形材料である。 This epoxy prepreg is a resin sheet made of a bisphenol A type liquid and solid epoxy resin mixture and an amine compound produced by heating and pressure impregnation to a fiber reinforcing material. Compared to a sheet molding compound in which a polyester resin is used as a matrix resin, the molding material is inferior in curability and has no description of B-stage, so that it is a molding material with insufficient curing characteristics and handleability.
エポキシ樹脂の硬化性の問題点を改良するものとして、特定のオニウム塩系熱カチオン重合開始剤を含む樹脂組成物が提案されている（特許文献２、３参照）。
また、こうしたエポキシ樹脂組成物の用途については、塗料、接着剤などの分野への応用が提案されている（特許文献４及び５参照）。
A resin composition containing a specific onium salt-based thermal cationic polymerization initiator has been proposed to improve the problem of curability of the epoxy resin (see Patent Documents 2 and 3).
Moreover, about the use of such an epoxy resin composition, the application to fields, such as a coating material and an adhesive agent, is proposed (refer patent documents 4 and 5).
さらに、プレス加熱圧縮成形法用成形材料としては、脂環式エポキシ樹脂を一部含む成形材料が提案されており（特許文献６参照）、１００℃以下の低温での硬化性に優れたエポキシプリプレグの記載がある。プリプレグとしては、ビスフェノールA型エポキシ樹脂またはビスフェノールA型とフェノールノボラック型エポキシ樹脂との混合物８０〜９０重量％に脂環式エポキシ樹脂を１０〜２０重量％、オニウム塩系熱カチオン重合開始剤３部を目付量１５０ｇ／ｍ２カーボン繊維に加熱含浸したプリプレグからなり、９０℃プレスにて１時間で硬化させたとの記載がある。 Furthermore, as a molding material for press heat compression molding, a molding material partially including an alicyclic epoxy resin has been proposed (see Patent Document 6), and an epoxy prepreg excellent in curability at a low temperature of 100 ° C. or lower. Is described. As the prepreg, bisphenol A type epoxy resin or a mixture of bisphenol A type and phenol novolak type epoxy resin is added to 80 to 90% by weight of alicyclic epoxy resin in an amount of 10 to 20% by weight, and onium salt thermal cationic polymerization initiator 3 parts. Is a prepreg obtained by heat impregnating carbon fiber with a basis weight of 150 g / m 2 , and is cured in a 90 ° C. press for 1 hour.
しかし、本発明者らは、このエポキシ樹脂中に脂環式エポキシ樹脂を１０〜２０重量％用いた例を追試したが、１４０℃で２分間という速硬化性を実現することはできなかった。（比較例１参照）
即ち、従来、加熱増粘して得られるエポキシシートモールディングコンパウンド成形材料で、シェアエッジを有する１２０〜１８０℃の金型内で、１〜２０ＭＰａの圧力にて成形材料を賦型し、成形品厚み１ｍｍ当たり１分間で硬化したエポキシシートモールディングコンパウンド成形材料による成形品はこれまで知られていなかった。
However, the present inventors have additionally tried an example in which 10 to 20% by weight of an alicyclic epoxy resin is used in this epoxy resin, but it has not been possible to realize fast curing at 140 ° C. for 2 minutes. (See Comparative Example 1)
That is, conventionally, an epoxy sheet molding compound molding material obtained by thickening by heating, and molding the molding material at a pressure of 1 to 20 MPa in a 120 to 180 ° C. mold having a shear edge, and the thickness of the molded product A molded article made of an epoxy sheet molding compound molding material cured in 1 minute per 1 mm has not been known so far.
本発明の目的は、加熱増粘することによりＢステージ化することができ、取扱い性に優れ、１２０℃〜１８０℃での加熱圧縮成形性（速硬化性）に優れるエポキシ樹脂シートモールディングコンパウンド成形材料、その物性に優れるエポキシ樹脂ＦＲＰ成形品及びその製造方法を提供することである。 An object of the present invention is an epoxy resin sheet molding compound molding material which can be B-staged by heating and thickening, has excellent handleability, and is excellent in heat compression moldability (fast curability) at 120 ° C. to 180 ° C. An epoxy resin FRP molded product having excellent physical properties and a method for producing the same are provided.
本発明者らは、これらの課題について、鋭意研究の結果、本発明を完成するに至ったものである。
即ち、本発明は、エポキシ当量５０〜２００の常温液状の脂環式エポキシ樹脂（ａ１）、又は前記脂環式エポキシ樹脂（ａ１）及びエポキシ当量１００〜２００のビスフェノールＡ型常温液状のエポキシ樹脂（ａ２）からなるエポキシ樹脂（Ａ）とオニウム塩系熱カチオン重合開始剤（Ｂ）とを含む樹脂組成物を２枚のフィルムに塗布して目付量７５０〜１３００ｇ／ｍ２の繊維強化材（Ｃ）を挟み込むことで樹脂組成物を含浸し、次いでその材料を加熱増粘して得られる加熱圧縮成形用シートモールディングコンパウンド成形材料であって、前記エポキシ樹脂（Ａ）１００重量部に対して前記重合開始剤（Ｂ）を０．１〜１．５重量部使用すること、前記エポキシ樹脂（ａ１）と前記エポキシ樹脂（ａ２）とを併用する場合、前記エポキシ樹脂（Ａ）の脂環式エポキシ樹脂（ａ１）が４５重量％以上であることを特徴とする加熱圧縮成形用シートモールディングコンパウンド成形材料を提供するものである。
また本発明は、この加熱圧縮成形用成形材料を成形してなる成形品を提供するものである。さらに、エポキシ当量５０〜２００の常温液状の脂環式エポキシ樹脂（ａ１）、又は前記脂環式エポキシ樹脂（ａ１）４５重量％以上及びエポキシ当量１００〜２００のビスフェノールＡ型常温液状エポキシ樹脂（ａ２）６５重量％以下からなるエポキシ樹脂（Ａ）１００質量部とオニウム塩系熱カチオン重合開始剤（Ｂ）０．１〜１．５質量部とを含む樹脂組成物を２枚のフィルムに塗布して目付量７５０〜１３００ｇ／ｍ２の繊維強化材（Ｃ）を挟み込むことで樹脂組成物を含浸し、次いでその材料を加熱増粘して得られる加熱圧縮成形用シートモールディングコンパウンド成形材料をシェアエッジを有する金型内に配置し、金型温度１３０〜１６０℃、型内圧力５〜１０ＭＰａ、成形時間1〜３分の条件で加熱圧縮成形することを特徴とする成形品の製造方法を提供するものである。
The inventors of the present invention have completed the present invention as a result of intensive studies on these problems.
That is, the present invention relates to a normal temperature liquid alicyclic epoxy resin (a1) having an epoxy equivalent of 50 to 200, or the alicyclic epoxy resin (a1) and a bisphenol A type normal temperature liquid epoxy resin having an epoxy equivalent of 100 to 200 ( A fiber reinforcing material (C) having a basis weight of 750 to 1300 g / m 2 by applying a resin composition comprising an epoxy resin (A) comprising a2) and an onium salt-based thermal cationic polymerization initiator (B) to two films. ) Is impregnated with a resin composition, and then the material is heated and thickened to obtain a molding compound for heat compression molding, which is obtained by polymerization with respect to 100 parts by weight of the epoxy resin (A). When the initiator (B) is used in an amount of 0.1 to 1.5 parts by weight, and the epoxy resin (a1) and the epoxy resin (a2) are used in combination, the epoxy The present invention provides a sheet molding compound molding material for heat compression molding, wherein the alicyclic epoxy resin (a1) of the resin (A) is 45% by weight or more.
The present invention also provides a molded product formed by molding the molding material for heat compression molding. Furthermore, a normal temperature liquid alicyclic epoxy resin (a1) having an epoxy equivalent of 50 to 200, or 45% by weight or more of the alicyclic epoxy resin (a1) and a bisphenol A type normal temperature liquid epoxy resin having an epoxy equivalent of 100 to 200 (a2 ) A resin composition containing 100 parts by mass of an epoxy resin (A) composed of 65% by weight or less and 0.1 to 1.5 parts by mass of an onium salt-based thermal cationic polymerization initiator (B) was applied to two films. The sheet molding compound molding material for heat compression molding obtained by impregnating the resin composition by sandwiching the fiber reinforcing material (C) with a basis weight of 750 to 1300 g / m 2 and then heating and thickening the material is shared edge It is placed in a mold having a mold, and is heat compression molded under conditions of a mold temperature of 130 to 160 ° C., an in-mold pressure of 5 to 10 MPa, and a molding time of 1 to 3 minutes. There is provided a method for producing a molded article.
本発明は、その構成要件により、取扱い性、加熱圧縮成形性（速硬化性）に優れたの加熱圧縮成形用シートモールディングコンパウンド成形材料、その物性に優れるエポキシ樹脂ＦＲＰ成形品及びその製造方法により、生産性の高いエポキシ成形品を提供することができる。 The present invention is a sheet molding compound molding material for heat compression molding having excellent handling properties and heat compression moldability (fast curing properties), its epoxy resin FRP molded product having excellent physical properties, and a method for producing the same, due to its constituent requirements. A highly productive epoxy molded product can be provided.
次に本発明を詳細に説明する。
本発明の加熱圧縮成形用シートモールディングコンパウンド成形材料は、シェアエッジを有する金型内で加熱圧縮成形されるシート状の成形材料（プリプレグ）である。
本発明で使用されるエポキシ樹脂（Ａ）中の脂環式エポキシ樹脂（ａ１）としては、１分子中に１個以上、好ましくは２個の脂環式エポキシ基を有する常温（２５℃）で液状の脂環式エポキシ樹脂で、エポキシ当量５０〜２００のものである。その例としては、３,４-エポキシシクロヘキシルメチル-３',４'-エポキシシクロヘキサンカルボキシレート、ビス（３,４-エポキシシクロヘキシルメチル）アジペート、リモネンジエポキシド、１,２-エポキシ-４-ビニルシクロヘキサン、１-エポキシエチル-３,４-エポキシシクロヘキサン、３,４-エポキシシクロヘキシルメタノール、３,４-エポキシシクロヘキシルメチルメタアクリレート、ジシクロペンタジエンジエポキシド、液状エポキシ化ポリブタジエン、オリゴマー型脂環式エポキシ等が挙げられる。これらの中でも、３,４-エポキシシクロヘキシルメチル-３',４'-エポキシシクロヘキサンカルボキシレートが、プリプレグ作成上好ましい。
また、脂環式エポキシ樹脂（ａ１）の市販製品としては、ダイセル化学工業（株）製、セロキサイド２１２０Ｐ、ＥＰＯＬＥＡＤ ＧＴ３００、ＥＰＯＬＥＡＤ ＧＴ４００、ＥＨＰＥ３１５０などが挙げられる。
Next, the present invention will be described in detail.
The sheet molding compound molding material for heat compression molding of the present invention is a sheet-shaped molding material (prepreg) that is heat compression molded in a mold having a shear edge.
The alicyclic epoxy resin (a1) in the epoxy resin (A) used in the present invention is at room temperature (25 ° C.) having one or more, preferably two alicyclic epoxy groups in one molecule. It is a liquid alicyclic epoxy resin having an epoxy equivalent of 50 to 200. Examples include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate, limonene diepoxide, 1,2-epoxy-4-vinylcyclohexane. 1-epoxyethyl-3,4-epoxycyclohexane, 3,4-epoxycyclohexylmethanol, 3,4-epoxycyclohexylmethyl methacrylate, dicyclopentadiene diepoxide, liquid epoxidized polybutadiene, oligomeric alicyclic epoxy, etc. Can be mentioned. Among these, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate is preferable for preparing the prepreg.
Moreover, as a commercial product of an alicyclic epoxy resin (a1), Daicel Chemical Industries Ltd. make, Celoxide 2120P, EPOLEEAD GT300, EPOLEEAD GT400, EHPE3150, etc. are mentioned.
本発明で前記脂環式エポキシ樹脂（ａ１）と併用されるビスフェノールＡ型の常温液状エポキシ樹脂（ａ２）は、１分子中に１個以上、好ましくは２個のエポキシ基を有する常温（２５℃）で液状のエポキシ樹脂で、エポキシ当量 １００〜２００である。その併用量は、エポキシ樹脂（Ａ）の６５重量％以下であり、好ましくは１０〜５０重量％である。その際の前記脂環式エポキシ樹脂（ａ１）が４５重量％以上で、好ましくは５０〜９０重量％である。エポキシ樹脂（Ａ）の粘度は、常温（２５℃）で好ましくは１〜３００ｄＰａｓ、より好ましくは１〜５０ｄＰａｓである。シートモールディングコンパウンド成形材料中のエポキシ樹脂（Ａ）の含有量は、好ましくは３５〜５０重量％である。
The bisphenol A type room temperature liquid epoxy resin (a2) used in combination with the alicyclic epoxy resin (a1) in the present invention has a temperature of 1 or more, preferably 2 epoxy groups per molecule (25 ° C.). ) And a liquid epoxy resin having an epoxy equivalent of 100 to 200. The combined amount is 65% by weight or less, preferably 10 to 50% by weight of the epoxy resin (A). The said alicyclic epoxy resin (a1) in that case is 45 weight% or more, Preferably it is 50 to 90 weight%. The viscosity of the epoxy resin (A) is preferably 1 to 300 dPas, more preferably 1 to 50 dPas at ordinary temperature (25 ° C.). The content of the epoxy resin (A) in the sheet molding compound molding material is preferably 35 to 50% by weight.
本発明で使用されるオニウム塩系熱カチオン重合開始剤（Ｂ）としては、加熱により硬化作用を発揮する硬化剤加熱活性型重合開始剤が好ましい。かかる重合開始剤としては、例えば芳香族スルホニウム塩化合物、芳香族ヨードニウム塩化合物、アルミニウムキレート化合物などが挙げられる。好ましくは芳香族スルホニウム塩化合物で、市販製品としては、サンエイドＳＩ−１００Ｌ（三新化学株式会社）が好ましく使用できる。これらの開始剤（Ｂ）は、使用する脂環式エポキシ樹脂（ａ１）の反応性、脂環式エポキシ樹脂（ａ１）とその他エポキシ樹脂（ａ２）の割合、硬化条件により配合割合が決定されるが、プリプレグを作成する上で、全エポキシ樹脂（Ａ）１００重量部に対して、０．１〜１．５重量部である。好ましくは、０．２〜１．０重量部であることが特に好ましい。１．５重量部より多いとプリプレグを作成する際に増粘しすぎ取扱い性に劣るものになるし、０．１重量部より少ないと加熱圧縮成形性（速硬化性）に劣るものとなる。 As the onium salt-based thermal cationic polymerization initiator (B) used in the present invention, a curing agent heat activation type polymerization initiator that exhibits a curing action by heating is preferable. Examples of such polymerization initiators include aromatic sulfonium salt compounds, aromatic iodonium salt compounds, aluminum chelate compounds and the like. Preferably, it is an aromatic sulfonium salt compound, and as a commercial product, Sun-Aid SI-100L (Sanshin Chemical Co., Ltd.) can be preferably used. The mixing ratio of these initiators (B) is determined by the reactivity of the alicyclic epoxy resin (a1) to be used, the ratio of the alicyclic epoxy resin (a1) and the other epoxy resin (a2), and the curing conditions. However, when producing a prepreg, it is 0.1-1.5 weight part with respect to 100 weight part of all the epoxy resins (A). The amount is particularly preferably 0.2 to 1.0 part by weight. When the amount is more than 1.5 parts by weight, the prepreg is excessively thickened and the handling property is inferior.
本発明に使用する繊維強化材（Ｃ）としては、ガラス繊維、アミド、アラミド、ビニロン、ポリエステル、フェノールなどの有機繊維、炭素繊維、金属繊維、セラミック繊維等が挙げられる。これらは単独又は組み合わせて用いられる。また繊維の形態は、平織り、朱子織り、不織布、マット状、チョップドストランドなどがある。特に好ましくは炭素繊維である。繊維強化材（Ｃ）の目付量は、７５０〜１３００ｇ／ｍ２である。７５０ｇ／ｍ２より少ないと成形品の強度に劣り、１３００ｇ／ｍ２より多いとプリプレグを作成するのが困難になり、取扱い性に劣るものとなる。シートモールディングコンパウンド成形材料中の繊維強化材（Ｃ）の含有量は、５０〜６５重量％であることが好ましい。
本発明の成形材料には、その他に充填剤、内部離型剤等を含むことができる。
Examples of the fiber reinforcing material (C) used in the present invention include glass fiber, amide, aramid, vinylon, polyester, organic fiber such as phenol, carbon fiber, metal fiber, ceramic fiber and the like. These may be used alone or in combination. The fiber forms include plain weave, satin weave, non-woven fabric, mat shape, chopped strand, and the like. Particularly preferred is carbon fiber. The basis weight of the fiber reinforcement (C) is 750 to 1300 g / m 2 . When it is less than 750 g / m 2 , the strength of the molded product is inferior, and when it is more than 1300 g / m 2 , it becomes difficult to prepare a prepreg, resulting in poor handling. The content of the fiber reinforcement (C) in the sheet molding compound molding material is preferably 50 to 65% by weight.
In addition to the above, the molding material of the present invention may contain a filler, an internal mold release agent and the like.
充填剤としては、例えば、炭酸カルシウム、炭酸マグネシウム、硫酸バリウム、マイカ、タルク、カオリン、クレー、セライト、アスベスト、バーライト、バライタ、シリカ、ケイ砂、ドロマイト石灰石、石こう、アルミニウム微粉、中空バルーン、アルミナ、ガラス粉、水酸化アルミニウム、酸化ジルコニウム、三酸化アンチモン、酸化チタン、二酸化モリブデン、鉄粉などが挙げられる。これらの充填剤の添加量は、エポキシ樹脂（Ａ）１００重量部に対して、好ましくは１０〜５００重量部、より好ましくは３０〜３００重量部を用いる。 Examples of the filler include calcium carbonate, magnesium carbonate, barium sulfate, mica, talc, kaolin, clay, celite, asbestos, barlite, baryta, silica, silica sand, dolomite limestone, gypsum, aluminum fine powder, hollow balloon, alumina , Glass powder, aluminum hydroxide, zirconium oxide, antimony trioxide, titanium oxide, molybdenum dioxide, iron powder and the like. The added amount of these fillers is preferably 10 to 500 parts by weight, more preferably 30 to 300 parts by weight, based on 100 parts by weight of the epoxy resin (A).
前記内部離型剤としては、例えばステアリン酸亜鉛、ステアリン酸カルシウム、パラフィンワックス、ポリエチレンワックス、カルナバワックスなどが挙げられる。好ましくは、パラフィンワックス、ポリエチレンワックス、カルナバワックスが挙げられる。 Examples of the internal mold release agent include zinc stearate, calcium stearate, paraffin wax, polyethylene wax, carnauba wax and the like. Paraffin wax, polyethylene wax, and carnauba wax are preferable.
本発明の加熱圧縮成形用シートモールディングコンパウンド成形材料は、加熱することによって増粘し、Ｂステージ化することが可能である。その加熱温度は、好ましくは６０℃〜１２０℃、特に好ましくは７０〜９０℃で、その加熱時間は、好ましくは５分から２時間、より好ましくは２０分〜１時間である。加熱温度及び加熱時間は、エポキシ樹脂の組成、重合開始剤の種類および添加量によって異なる。加熱することにより成形材料をタックフリー化することができる。加熱温度が１２０℃を越える場合、硬化反応が進みすぎるのでＢステージ化した成形材料を得ることはできないし、６０℃より低い温度では増粘しないので好ましくない。
また加熱方法は、前記加熱温度の雰囲気下にできる装置を使用して、その装置内に成形材料を前記の一定時間放置し、増粘工程を実施すればよい。増粘後の成形材料の粘度は、好ましくは２５℃で１万ポイズ以上であり、より好ましくは２万ポイズ〜１０万ポイズである。
The sheet molding compound molding material for heat compression molding of the present invention can be thickened by heating to be B-staged. The heating temperature is preferably 60 to 120 ° C., particularly preferably 70 to 90 ° C., and the heating time is preferably 5 minutes to 2 hours, more preferably 20 minutes to 1 hour. The heating temperature and heating time vary depending on the composition of the epoxy resin, the type of polymerization initiator, and the amount added. The molding material can be made tack-free by heating. When the heating temperature exceeds 120 ° C., the curing reaction proceeds too much, so that it is not possible to obtain a B-staged molding material.
The heating method may be performed by using a device that can be placed in the atmosphere of the heating temperature, leaving the molding material in the device for the predetermined time, and then performing the thickening step. The viscosity of the molding material after thickening is preferably 10,000 poise or more at 25 ° C., more preferably 20,000 poise to 100,000 poise.
本発明の加熱圧縮成形用シートモールディングコンパウンド成形材料の製造方法としては、通常のロール、インターミキサー、プラネタリーミキサー、ニーダー、押出機などの混合機を用いて液状成分（エポキシ樹脂等）に粉末成分（充填剤等）を混合することにより、樹脂コンパウンドの各成分を混合分散させる。
各成分の混合順序は、特に限定されるものではないが、常温で液状のエポキシ樹脂（Ａ）に重合開始剤（Ｂ）を添加した後、上記撹拌装置を用いて重合開始剤（Ｂ）をエポキシ樹脂（Ａ）中に分散させるのが好ましい。さらに必要であれば、これに続いて、充填剤を加え混合分散させる。次いでシート化する方法としては、エポキシ樹脂組成物を含むマトリックス樹脂液を２枚のフィルムに塗布し、好ましくはフィルムへの樹脂（Ａ）の塗布量が、２００〜５００ｇ／ｍ２となるように塗布し、繊維強化材（Ｃ）を塗布フィルム面で挟み込むようにして、樹脂液を含浸させる。前記フィルムへの塗布方法は、ドクターナイフ方式が好ましく挙げられる。
As a method for producing the sheet molding compound molding material for heat compression molding of the present invention, a powder component is added to a liquid component (epoxy resin or the like) using a mixer such as a normal roll, an intermixer, a planetary mixer, a kneader, or an extruder. By mixing (filler and the like), each component of the resin compound is mixed and dispersed.
The order of mixing the components is not particularly limited, but after adding the polymerization initiator (B) to the liquid epoxy resin (A) at room temperature, the polymerization initiator (B) is added using the stirring device. It is preferable to disperse in the epoxy resin (A). Further, if necessary, subsequently, a filler is added and mixed and dispersed. Next, as a method for forming a sheet, a matrix resin solution containing an epoxy resin composition is applied to two films, and preferably the amount of resin (A) applied to the film is 200 to 500 g / m 2. It is applied and impregnated with a resin liquid so that the fiber reinforcing material (C) is sandwiched between the coated film surfaces. A doctor knife method is preferably mentioned as the coating method on the film.
前記フィルムとは、樹脂製フィルムで、例えば、ポリエステル樹脂フィルム、オレフィン系フィルム等が使用できる。 The film is a resin film, and for example, a polyester resin film, an olefin film, or the like can be used.
本発明の成形材料の成形方法としては、前記成形材料を所定量計量し、これを予め金型温度１２０℃〜１８０℃、好ましくは１３０〜１６０℃に加熱したシェアエッジを有する金型に投入し、圧縮成形機にて型締めを行い、成形材料を賦型させ、型内圧力０．１〜２０ＭＰａ、好ましくは５〜１０ＭＰａの成形圧力を１〜３分間保持することによって、成形材料を硬化させ、その後成形品を取り出し成形品を得る方法が用いられる。成形時間とは、型を閉じて前記の型内圧力を保持している時間であり、本願発明では１〜３分である。
この場合シェアエッジを有する金型内で金型温度１３０℃〜１６０℃にて、成形品厚み１ｍｍ当たり１分間という規定の時間、１〜１０ＭＰａ、好ましくは５〜１０ＭＰａの成形圧力を1〜３分保持し、加熱圧縮成形する製造方法が好ましい。
こうして得られた成形品は、住設部材、自動車部品、電気電子部品等の各種分野の成形品として使用される。
As a molding method of the molding material of the present invention, a predetermined amount of the molding material is weighed, and this is put into a mold having a shear edge preheated to a mold temperature of 120 ° C. to 180 ° C., preferably 130 to 160 ° C. Then, the mold is clamped by a compression molding machine, the molding material is shaped, and the molding material is cured by holding the molding pressure of 0.1 to 20 MPa, preferably 5 to 10 MPa for 1 to 3 minutes. Then, a method of taking out the molded product and obtaining the molded product is used. The molding time is the time during which the mold is closed and the pressure inside the mold is maintained, and is 1 to 3 minutes in the present invention.
In this case, in a mold having a shear edge, at a mold temperature of 130 ° C. to 160 ° C., a specified time of 1 minute per 1 mm thickness of the molded product, a molding pressure of 1 to 10 MPa, preferably 5 to 10 MPa is applied for 1 to 3 minutes. A production method of holding and heat compression molding is preferred.
The molded product thus obtained is used as a molded product in various fields such as housing equipment, automobile parts, and electric / electronic parts.
以下本発明を実施例によって更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。また、文中「部」とあるのは、重量部を示すものである。 EXAMPLES Hereinafter, although an Example demonstrates this invention still in detail, this invention is not limited to these Examples. Also, “parts” in the text indicates parts by weight.
実施例１
脂環式エポキシ樹脂 （セロキサイド２１２０Ｐ、エポキシ当量１３１、＜３,４-エポキシシクロヘキシルメチル-３',４'-エポキシシクロヘキサンカルボキシレート＞、ダイセル化学工業製）１００重量部、芳香族スルホニウム塩系熱カチオン重合開始剤（サンエイドＳＩ−１００Ｌ、三新化学製）０．４重量部を混合した樹脂組成物を２枚のフィルムに塗布量５００ｇ／ｍ２となるように塗布して目付量１０００ｇ／ｍ２の平織炭素繊維（東邦テナックス社製、Ｗ―３１０１ ５枚）を前記フィルム挟み込み、樹脂含量が５０重量％となるよう含浸させた。該成形材料を、８０℃オーブン中に３０分間放置し、シートモールディングコンパウンド成形材料を得た。プレス成形は該成形材料２５０ｇを３０ｃｍ×３０ｃｍのシェアエッジを有する金型を用いて行った。成形条件は、１４０℃で２分間、圧力９ＭＰａである。成形品厚みは２ｍｍであった。評価結果を表１に示した。
Example 1
Alicyclic epoxy resin (Celoxide 2120P, epoxy equivalent 131, <3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate>, manufactured by Daicel Chemical Industries) 100 parts by weight, aromatic sulfonium salt thermal cation A resin composition mixed with 0.4 parts by weight of a polymerization initiator (Sun-Aid SI-100L, manufactured by Sanshin Chemical Co., Ltd.) was applied to two films so as to have an application amount of 500 g / m 2, and a basis weight of 1000 g / m 2. Plain woven carbon fibers (manufactured by Toho Tenax Co., Ltd., W-3101 5 sheets) were sandwiched between the films and impregnated so that the resin content was 50% by weight. The molding material was left in an 80 ° C. oven for 30 minutes to obtain a sheet molding compound molding material. The press molding was performed using 250 g of the molding material using a mold having a shear edge of 30 cm × 30 cm. The molding conditions are 140 ° C. for 2 minutes and a pressure of 9 MPa. The molded product thickness was 2 mm. The evaluation results are shown in Table 1.
実施例２
脂環式エポキシ樹脂 （セロキサイド２１２０Ｐ） ５０重量部、ビスフェノールＡ型エポキシ樹脂（エピクロン８５０、エポキシ当量１８９、、大日本インキ化学工業製）５０重量部、芳香族スルホニウム塩系熱カチオン重合開始剤（サンエイドＳＩ−１００Ｌ） ０．８重量部を混合した樹脂組成物を２枚のフィルムに塗布量４００ｇ／ｍ２となるように塗布して目付量１２００ｇ／ｍ２の平織炭素繊維（東邦テナックス社製、Ｗ―３１０１ ６枚）を前記フィルム挟み込み、樹脂含量が４０重量％となるよう含浸させた。該成形材料を８０℃オーブン中に３０分間放置し、シートモールディングコンパウンド成形材料を得た。プレス成形は該成形材料２５０ｇを３０ｃｍ×３０ｃｍのシェアエッジを有する金型を用いて行った。成形条件は、１４０℃で２分間、圧力９ＭＰａである。成形品厚みは２ｍｍであった。評価結果を表１に示した。
Example 2
50 parts by weight of alicyclic epoxy resin (Celoxide 2120P), 50 parts by weight of bisphenol A type epoxy resin (Epiclon 850, epoxy equivalent 189, manufactured by Dainippon Ink and Chemicals), aromatic sulfonium salt thermal cationic polymerization initiator (Sun Aid) SI-100L) 0.8 parts by weight of a mixed resin composition two films to be coated to a coating weight 400 g / m 2 basis weight 1200 g / m 2 plain weave carbon fiber (Toho Tenax Co., 6 pieces of W-3101) were sandwiched between the films and impregnated so that the resin content was 40% by weight. The molding material was left in an 80 ° C. oven for 30 minutes to obtain a sheet molding compound molding material. The press molding was performed using 250 g of the molding material using a mold having a shear edge of 30 cm × 30 cm. The molding conditions are 140 ° C. for 2 minutes and a pressure of 9 MPa. The molded product thickness was 2 mm. The evaluation results are shown in Table 1.
実施例３
脂環式エポキシ樹脂 （ セロキサイド２１２０Ｐ） １００重量部、芳香族スルホニウム塩系熱カチオン重合開始剤（サンエイドＳＩ−１００Ｌ） ０．４重量部を混合した樹脂組成物をフィルムに塗布量５００ｇ／ｍ２となるよう塗布し、１インチ長にカットした炭素繊維糸を目付量１０００ｇ／ｍ２となるように積層したフィルム上に樹脂含量が５０重量％となるよう含浸させた。該成形材料を８０℃オーブン中に３０分間放置し、シートモールディングコンパウンド成形材料を得た。プレス成形は該成形材料２５０ｇを３０ｃｍ×３０ｃｍのシェアエッジを有する金型を用いて行った。成形条件は、１４０℃で２分間、圧力９ＭＰａである。成形品厚みは２ｍｍであった。評価結果を表１に示した。
比較例１
脂環式エポキシ樹脂 （セロキサイド２１２０Ｐ） ２５重量部、ビスフェノールＡ型エポキシ樹脂（エピクロン８５０） ７５重量部、芳香族スルホニウム塩系熱カチオン重合開始剤（サンエイドＳＩ−１００Ｌ） １重量部を混合した樹脂組成物をフィルムに塗布量５００ｇ／ｍ２となるよう塗布し、目付量１０００ｇ／ｍ２の平織炭素繊維（東邦テナックス社製、Ｗ―３１０１ ５枚）を前記フィルムに挟み込み、樹脂含量が５０重量％となるよう含浸させた。該成形材料を８０℃オーブン中に６０分間放置し、シートモールディングコンパウンド成形材料を得た。プレス成形は該成形材料２５０ｇを３０×３０ｃｍのシェアエッジを有する金型を用いて行った。成形条件は、１４０℃で２分間、圧力９ＭＰａである。成形品厚みは２ｍｍであった。評価結果を表１に示した。
Example 3
A resin composition obtained by mixing 100 parts by weight of an alicyclic epoxy resin (Celoxide 2120P) and 0.4 parts by weight of an aromatic sulfonium salt-based thermal cationic polymerization initiator (Sun-Aid SI-100L) on a film with an application amount of 500 g / m 2 The carbon fiber yarn cut to 1 inch length was impregnated so as to have a resin content of 50% by weight on a film obtained by laminating the carbon fiber yarn so as to have a basis weight of 1000 g / m 2 . The molding material was left in an 80 ° C. oven for 30 minutes to obtain a sheet molding compound molding material. The press molding was performed using 250 g of the molding material using a mold having a shear edge of 30 cm × 30 cm. The molding conditions are 140 ° C. for 2 minutes and a pressure of 9 MPa. The molded product thickness was 2 mm. The evaluation results are shown in Table 1.
Comparative Example 1
A resin composition in which 25 parts by weight of an alicyclic epoxy resin (Celoxide 2120P), 75 parts by weight of a bisphenol A type epoxy resin (Epicron 850), and 1 part by weight of an aromatic sulfonium salt thermal cationic polymerization initiator (Sun Aid SI-100L) are mixed. The product was applied to a film so as to have an application amount of 500 g / m 2, and plain weave carbon fiber (manufactured by Toho Tenax Co., Ltd., W-3101 5 sheets) having a basis weight of 1000 g / m 2 was sandwiched between the films, and the resin content was 50% by weight. Impregnation was performed. The molding material was left in an oven at 80 ° C. for 60 minutes to obtain a sheet molding compound molding material. The press molding was performed using 250 g of the molding material using a mold having a shear edge of 30 × 30 cm. The molding conditions are 140 ° C. for 2 minutes and a pressure of 9 MPa. The molded product thickness was 2 mm. The evaluation results are shown in Table 1.
比較例２
ビスフェノールＡ型エポキシ樹脂（エピクロン８５０） １００重量部、芳香族スルホニウム塩系熱カチオン重合開始剤（サンエイドＳＩ−１００Ｌ） １重量部を混合した樹脂組成物をフィルムに塗布量５００ｇ／ｍ２となるよう塗布し、目付量１０００ｇ／ｍ２の平織炭素繊維（東邦テナックス社製、Ｗ―３１０１ ５枚）を前記フィルムに挟み込み、樹脂含量が５０重量％となるよう含浸させた。該成形材料を８０℃オーブン中に１２０分間放置したが、シートモールディングコンパウンド成形材料にはベタツキが残りフィルム剥ぎ性に劣った。プレス成形は該成形材料２５０ｇを３０×３０ｃｍのシェアエッジを有する金型を用いて行った。成形条件は１４０℃で２分間、圧力９ＭＰａである。成形品厚みは２ｍｍであった。評価結果を表１に示した。
Comparative Example 2
A resin composition in which 100 parts by weight of a bisphenol A type epoxy resin (Epiclon 850) and 1 part by weight of an aromatic sulfonium salt-based thermal cationic polymerization initiator (Sun-Aid SI-100L) is mixed is applied to a film so that the coating amount is 500 g / m 2. After coating, plain weave carbon fibers (manufactured by Toho Tenax Co., Ltd., W-3101 5 sheets) having a basis weight of 1000 g / m 2 were sandwiched between the films and impregnated so that the resin content was 50% by weight. The molding material was left in an oven at 80 ° C. for 120 minutes. However, the sheet molding compound molding material remained sticky and inferior in film peelability. The press molding was performed using 250 g of the molding material using a mold having a shear edge of 30 × 30 cm. The molding conditions are 140 ° C. for 2 minutes and a pressure of 9 MPa. The molded product thickness was 2 mm. The evaluation results are shown in Table 1.
比較例３
脂環式エポキシ樹脂 （セロキサイド２１２０Ｐ） １００重量部、芳香族スルホニウム塩系熱カチオン重合開始剤（サンエイドＳＩ−１００Ｌ） ３重量部を混合した樹脂組成物をフィルムに塗布量５００ｇ／ｍ２となるよう塗布し、目付量１０００ｇ／ｍ２の平織炭素繊維（東邦テナックス社製、Ｗ―３１０１ ５枚）を前記フィルムに挟み込み、樹脂含量が５０重量％となるよう含浸させ、８０℃オーブン中に５分間放置し、シートモールディングコンパウンド成形材料を得た。シートモールディングコンパウンド成形材料中に一部ゲル化した部分が見られた。プレス成形は該成形材料２５０ｇを３０×３０ｃｍのシェアエッジを有する金型を用いて行った。成形条件は１４０℃で２分間、圧力９ＭＰａである。成形品厚みは２ｍｍであった。評価結果を表１に示した。
Comparative Example 3
A resin composition in which 100 parts by weight of an alicyclic epoxy resin (Celoxide 2120P) and 3 parts by weight of an aromatic sulfonium salt-based thermal cationic polymerization initiator (Sun-Aid SI-100L) is mixed is applied to a film at a coating amount of 500 g / m 2. After coating, plain weave carbon fibers with a basis weight of 1000 g / m 2 (5 pieces of W-3101 manufactured by Toho Tenax Co., Ltd.) are sandwiched between the films, impregnated so that the resin content becomes 50% by weight, and placed in an 80 ° C. oven for 5 minutes. The sheet molding compound molding material was obtained. A partially gelled portion was observed in the sheet molding compound molding material. The press molding was performed using 250 g of the molding material using a mold having a shear edge of 30 × 30 cm. The molding conditions are 140 ° C. for 2 minutes and a pressure of 9 MPa. The molded product thickness was 2 mm. The evaluation results are shown in Table 1.
＊ガラス転移点Tg：熱機械分析装置TMA(Thermo-Mechanical Analysis)による示差膨張方式で測定した値。
加熱圧縮成形性：140℃×2分×プレス（厚み2mm）で成形した際の成形品の状態を目視で判断した。
取扱い性：加熱増粘後、フィルムの剥離が、容易か否かを目視で判断した。
* Glass transition point Tg: Value measured by the differential expansion method using a thermomechanical analyzer TMA (Thermo-Mechanical Analysis).
Heat compression moldability: 140 ° C. × 2 minutes × The state of the molded product when molded with a press (thickness 2 mm) was judged visually.
Handling property: After heating and thickening, it was visually judged whether or not the film could be easily peeled off.
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