JP2007267045A - Speech unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a speech unit capable of preventing occurrence of howling independently of a frequency of sound outputted from a speaker. <P>SOLUTION: The speech unit A includes a housing A1 for housing: a speaker SP; a main microphone M10; sub microphones M21, M22 located between the main microphone M10 and the speaker SP at a distance different from the main microphone M10; and an IC package 35i incorporating a signal processing section for applying signal processing to a sound signal outputted from each microphone, wherein the signal processing section uses a sound signal of the sub microphone M21 remoter from the main microphone M10 to subtract a sound signal with a low frequency outputted from the speaker SP from the sound signal of the main microphone M10 and uses a sound signal of the sub microphone M22 closer to the main microphone M10 to subtract a sound signal with a high frequency outputted from the speaker SP from the sound signal of the main microphone M10. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a call device.

  Conventionally, there is a communication device installed indoors with an interphone system or the like, which includes a speaker that outputs sound from a communication device installed in another place, a microphone that inputs sound transmitted to the other communication device, and the like. Yes.

  Since howling occurs when the sound generated from the speaker wraps around the microphone, various measures for preventing howling are taken. For example, a delay circuit that includes a speaker and a pair of microphones, delays the output of a microphone closer to the speaker by a delay time of sound waves corresponding to the difference in distance between the two microphones and the speaker, and both the microphone and the speaker. Adjusting the level corresponding to the difference in distance to match the output level of both microphones with respect to the sound from the speaker, and using both microphone outputs through the delay circuit and the level adjusting amplifier circuit as both inputs There has been proposed a communication device that is provided with a differential amplifier circuit and uses the output of the differential amplifier circuit as a transmission signal.

In this communication device, after picking up the sound from the speakers with both microphones, the delay and the level are adjusted, and the sound components from the speakers input to both microphones are canceled by the differential amplifier circuit. Only the components are removed (cancelling process) to prevent howling. (For example, see Patent Document 1)
Japanese Patent No. 2607257 (page 2, left column, line 13 to right column, third line, page 4, right column, lines 26 to 49, FIGS. 1 and 5)

  However, in the above-described conventional example, the operations of the delay circuit and the level adjustment amplifier circuit are set based on the output level difference and phase difference between both microphones in a specific frequency band, and are greatly different from the specific frequency band. In the band, there is a problem that howling occurs because the sound component from the speaker cannot be canceled.

  Here, the band that is significantly different from the specific frequency band is a frequency band in which the diaphragm of the loudspeaker moves in a complex manner without performing an amplitude movement, or a high frequency band.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a communication device capable of preventing the occurrence of howling regardless of the frequency of sound emitted from a speaker.

  The invention according to claim 1 is different from the main microphone between the main microphone and the speaker, the main microphone that collects the sound and outputs the sound signal, the speaker that outputs the sound information transmitted through the wiring. A plurality of sub-microphones arranged at a distance and collecting sound and outputting sound signals, and a signal processing unit for processing sound signals output from the main and sub-microphones and transmitting them through wiring are housed. A main microphone, and the signal processing unit uses a sub-microphone sound signal far from the main microphone to reduce a low-frequency sound signal emitted from the speaker from the main microphone sound signal, and the sub-microphone sound close to the main microphone. The signal is used to reduce the high-frequency sound signal emitted from the speaker from the sound signal of the main microphone.

  According to the present invention, the sound component from the speaker is reduced in a wide frequency band, and howling that occurs when the microphone picks up the sound output of the speaker can be prevented regardless of the frequency of the sound emitted from the speaker. .

  According to a second aspect of the present invention, in the first aspect, the plurality of sub microphones includes a first sub microphone whose output level with respect to the sound from the speaker is twice or more the output level of the main microphone, and a sound with respect to the sound from the speaker. And a second sub-microphone arranged at a position where the output frequency characteristic is substantially similar to the output frequency characteristic of the main microphone, and the signal processing unit receives a sound signal of the first sub-microphone as an input. First filter means for passing a component below the frequency, and second filter means for letting the component above the predetermined frequency pass through the audio signal of the second sub microphone as an input, from the first sub microphone to the second The low frequency side that the speaker emits from the audio signal of the main microphone using the audio signal output through the filter means 1 The voice signal is reduced, and the voice signal output from the main microphone is reduced by using the voice signal output from the second sub-microphone via the second filter means. And

  According to the present invention, howling can be prevented regardless of the frequency of the sound emitted from the speaker.

  According to a third aspect of the present invention, the sound component from the speaker and the external sound source are reduced from the sound signal of the main microphone using the sound signal output from the first sub microphone below the predetermined frequency. Is larger than the difference between the sound component from the speaker and the sound component from the external sound source, which is reduced from the sound signal of the main microphone using the sound signal output from the second sub microphone, Above the predetermined frequency, the difference between the sound component from the speaker and the sound component from the external sound source that is reduced from the sound signal of the main microphone by using the sound signal output from the second sub microphone is the first sub microphone. Greater than the difference between the sound component from the speaker and the sound component from the external sound source that is reduced from the sound signal of the main microphone using the sound signal output by And wherein the door.

  According to the present invention, howling can be prevented regardless of the frequency of the sound emitted from the speaker.

  The invention of claim 4 is characterized in that, in claim 2 or 3, the second sub microphone is located on a straight line connecting the main microphone and the first sub microphone and in the vicinity of the main microphone.

  According to the present invention, howling can be prevented regardless of the frequency of the sound emitted from the speaker.

  According to a fifth aspect of the present invention, in the first aspect, the sub-microphone is provided with three or more sub-microphones, and the signal processing unit uses the audio signal of each sub-microphone to differ the audio signal emitted from the speaker from the audio signal of the main microphone. Each of the frequency bands is reduced.

  According to the present invention, it is possible to reduce the sound emitted from the speaker over a wide frequency band.

  According to a sixth aspect of the present invention, in the first aspect, the signal processing unit includes a plurality of filter units that receive each audio signal of the sub microphone, an output level of each filter unit for the sound from the speaker, and the filter unit. A level adjusting means for matching the output levels of the main microphones in the frequency band of each other, and a sound signal delayed in accordance with a sound wave transmission time corresponding to a difference in distance between the main and sub microphones and the speaker, Delay means for matching the phase of the sound signal output from each filter means with respect to the sound from the sound signal of the main microphone in the frequency band of the filter means, the level adjusting means, the main microphone passing through the delay means, Differential means for outputting the difference between the audio signals of the filter means, and a sub-closer to the main microphone. Connected to the filter means Ikurohon is characterized by passing a signal in a higher frequency band than the filter means connected to the distant sub microphone from the main microphone.

  According to the present invention, the sound component from the speaker included in the transmitted sound signal is canceled out, and the sound component from the sound source outside the apparatus remains in a state of maintaining a sufficient amplitude. The relative difference between the component and the sound component from the speaker to be reduced increases. Therefore, the voice component from the speaker can be reduced without reducing the transmitted voice to be kept from the voice signal to be transmitted as much as possible, and howling can be prevented.

  A seventh aspect of the present invention is the method according to any one of the first to sixth aspects, wherein the main body is installed on an indoor ceiling surface, wall surface, or floor surface and is electrically connected to at least one line of wiring for transmitting power and information signals. A second connection part for electrically connecting to the first connection part, receiving power supply, and transmitting / receiving an information signal to / from the first connection part; The sound information transmitted through the connection unit is output, and the plurality of microphones transmit the sound information through the signal processing unit and the second connection unit, and the first connection unit is arranged and shaped. Corresponding to the standardization, the second connecting portion has a fixed shape.

  According to this invention, if the second connection unit is electrically connected to the first connection unit, it is possible to secure a power path and an information path at the same time, and it is not necessary to newly perform wiring work. Workability can be obtained.

  As described above, the present invention has an effect of preventing howling regardless of the frequency of sound emitted from a speaker.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
The communication device A according to the present embodiment is shown in FIGS. 1 to 4 and includes a speaker SP, a main microphone M10, a sub microphone M21 (first sub microphone), and a sub microphone M22 (second microphone) in a housing (main body) A1. Sub-microphone), call switch SW1, communication unit 35a, echo cancellation units 35b and 35c, amplification unit 35d, and signal processing unit 35e. A voice signal transmitted from the communication device A installed in another room or the like via the information line L2 is received by the communication unit 35a, amplified by the amplification unit 35d via the echo cancellation unit 35b, and then the speaker. Output from SP. In addition, by operating the call switch SW1, a call can be made, and each audio signal input from the microphones M10, M21, M22 is subjected to signal processing (to be described later) by the signal processing unit 35e, and then passes through the echo cancellation unit 35c. Then, the data is transmitted from the communication unit 35a to the call device A installed in another room or the like via the information line L2. That is, it functions as an intercom that allows two-way calls between rooms. Note that the power of the communication device A may be supplied from an outlet provided in the vicinity of the installation location or may be supplied via the information line L2.

  Hereinafter, the configuration of the speaker SP will be described. As shown in FIGS. 1 (a) and 1 (b), the speaker SP is formed of an iron-based material having a thickness of about 0.8 mm, such as cold-rolled steel plate (SPCC, SPKEN), electromagnetic soft iron (SUY), and has one end opened. The circular support body 72 is provided so as to extend outward from the open end of the yoke 70, and a cylindrical support section 72 a is formed on the outer edge of the support body 72. ing.

  A cylindrical permanent magnet 71 (for example, residual magnetic flux density of 1.39T to 1.43T) formed of neodymium is disposed in the cylinder of the yoke 70, and a dome-shaped diaphragm 73 is provided on the end surface of the support portion 72a. It has been. That is, the outer peripheral edge of the diaphragm 73 is fixed to the end surface of the support portion 72a.

  The diaphragm 73 is formed of a thermoplastic plastic (for example, a thickness of 12 μm to 35 μm) such as PET (PolyEthylene Terephthalate) or PEI (Polyetherimide). A cylindrical bobbin 74 is fixed to the rear surface of the diaphragm 73, and the rear end of the bobbin 74 is formed by winding a polyurethane copper wire (for example, φ0.05 mm) around a paper tube of kraft paper. A voice coil 75 is provided. The bobbin 74 and the voice coil 75 are provided so that the voice coil 75 is positioned at the opening end of the yoke 70, and freely move in the front-rear direction near the opening end of the yoke 70.

  When an audio signal is input to the polyurethane copper wire of the voice coil 75, an electromagnetic force is generated in the voice coil 75 due to the current of the audio signal and the magnetic field of the permanent magnet 71, so that the bobbin 74 is moved back and forth with the diaphragm 73. Visible in the direction. At this time, a sound corresponding to the audio signal is emitted from the diaphragm 73. That is, an electrodynamic speaker SP is formed (for example, a diameter of 20 to 25 mm and a thickness of about 4.5 mm).

  A rib 14 having an L-shaped cross-section is formed in an annular shape inside the front surface of the housing A1 facing the diaphragm 73 of the speaker SP, and from the outer peripheral end of the circular support 72 of the speaker SP to the front side. The protruding end surface of the projecting portion 72b contacts the mounting portion 14a of the rib 14, the outer surface of the projecting portion 72b is fitted to the inner surface of the projecting portion 14b of the rib 14, and the diaphragm 73 is placed on the front surface of the housing A1. The speaker SP is positioned in a state of facing from the inside. Moreover, the outer edge part of the support body 72 is formed in a circular shape and the rib 14 is formed in an annular shape, so that the speaker SP can be easily mounted on the housing A1.

  The speaker SP positioned by the rib 14 is attached to the inside of the front surface of the housing A1 by fastening a mounting screw (not shown) to a screw hole (not shown) inside the front surface of the housing A1. .

  Next, the microphones M10, M21, and M22 have directivity that is higher in sensitivity in one direction than that in the other direction, and configuration examples of the microphones M10, M21, and M22 having directivity are shown below.

  The microphones M10, M21, and M22 are made of capacitor-type silicon microphones, and the acoustic signal-electric signal converter has the configuration shown in FIGS. A lower electrode 51 made of a silicon substrate formed on the substrate 57, a vibration part 53c (sound collecting surface), and support parts 53b extending at four positions on the outer periphery of the vibration part 53c, are formed by a polysilicon film. An upper electrode 53 to be formed, a cavity 54 a formed between the lower electrode 51 and the upper electrode 53, and an insulating layer 52 made of a SiN film disposed between the lower electrode 51 and the upper electrode 53. Has been. The insulating layer 52 covers substantially the entire surface of the lower electrode 51 except that an opening is provided almost directly below the vibrating portion 53 c of the upper electrode 53 and a region for connecting a terminal to the lower electrode 51. A plurality of small holes 53a are formed in the vibration portion 53c. Further, a terminal 55 made of an Au / TiW film connected to the lower electrode 51 is formed in the peripheral portion, and a terminal 55 made of an Au / TiW film connected to the upper electrode 53 is formed on the support portion 53b.

  When vibration corresponding to sound is applied from the outside, the upper electrode 53 that is a vibration film vibrates, and the distance from the lower electrode 51 changes. As a result, the capacitances of both electrodes 51 and 53 change, the amount of charge changes, and current flows from both electrodes 51 and 53 in accordance with the change in the amount of charge.

  The current flowing from both electrodes 51 and 53 is converted into a voltage by the circuit shown in FIG. 6 and output to the signal processing unit 35e as an audio signal. In FIG. 6, the acoustic signal-electrical signal converters of the microphones M10, M21, M22 are denoted by Cm. Each microphone includes a constant voltage circuit K1 including a chip IC that converts an operation power supply + V (for example, 5V) into a constant voltage Vr (for example, 12V), and a series circuit of a resistor R11 and an acoustic signal-electric signal conversion unit Cm. Is connected to the gate terminal of the junction type J-FET element S11 via the capacitor C11. The constant point Vr is applied to the resistor R11 and the acoustic signal-electric signal converter Cm. The drain terminal of the J-FET element S11 is connected to the operating power supply + V, and the source terminal is connected to the ground via the resistor R12. Here, the J-FET element S11 is for electrical impedance conversion, and the voltage at the source terminal of the J-FET element S11 is output to the signal processing unit 35e as an audio signal.

  Then, as shown in FIG. 5 (b), the lower electrode 51 facing substantially the center of the vibrating portion 53c and the insertion hole 56 are provided in the substrate 57 so that the cavity 54a communicates with the outside, and the rear (lower electrode 51). Sound signal (indirect sound) reaching the front surface of the vibrating portion 53c from the front side (upper electrode 53 side) to the front surface of the vibrating portion 53c from the rear via the insertion hole 56 (direct sound). The unidirectionality limited to the front can be obtained. At this time, an obstacle is formed in the insertion hole 56 so that the speed of the direct sound is delayed to reach the indirect sound at the same time.

  Or, it has an interference tube type that narrows the directivity acoustically by attaching a long tube with a slit on the side to the tip of the microphone unit, and two unidirectional microphone units of normal phase and reverse phase, A secondary sound pressure gradient type that electrically narrows the directivity may be used.

  By configuring the condenser-type silicon microphone as described above, the microphones M10, M21, and M22 have directivity in which sensitivity in one direction (vibration portion 53c side) is higher than sensitivity in the other direction.

  As shown in FIGS. 1A and 1B, the main microphone M10 has a vibrating portion 53c in the front side of the housing A1 in the box 16 provided below the speaker SP inside the front surface of the housing A1. It is positioned by a rectangular frame-shaped rib 16a so as to face the inside.

  The sub microphones M21 and M22 are disposed between the main microphone M10 and the speaker SP, and the sub microphone M21 is a rectangular provided opposite to the center of the diaphragm 73 of the speaker SP inside the front surface of the housing A1. The frame-shaped rib 15 positions the vibrating portion 53c so as to face the diaphragm 73 of the speaker SP.

  In addition, the sub microphone M22 is provided in a case 17 provided on the straight line connecting the main microphone M10 and the sub microphone M21 on the inner side of the front surface of the case A1 and in the vicinity of the main microphone M10 not facing the diaphragm 73 of the speaker SP. Thus, the vibration portion 53c is positioned by the rectangular frame-shaped rib 17a so as to face the side portion of the speaker SP. The sub microphone M22 is disposed closer to the main microphone M10 than the sub microphone M21.

  Here, if the distances from the center of the speaker SP to the centers of the microphones M10, M21, and M22 are X10, X21, and X22, respectively, X21 <X22 <X10.

  A partition plate 16b is formed from the inner surface of the box 16 to the rear of the main microphone M10, and a rib 16c having an L-shaped cross section is formed on the back surface of the partition plate 16b. The microphone M10 shown in FIG. Peripheral circuit (resistors R11, R12, capacitor C11, J-FET element S11, constant voltage circuit K1) of each of the acoustic signal-electric signal converter Cm of FIG. 2, and an IC package 35i incorporating the signal processor 35e shown in FIG. The front surface of the IC package 35i is placed on the rib 16a, and the back surface of the IC package 35i is in contact with the inner surface of the box 16 to be positioned.

  Further, a partition plate 17b is formed from the inner surface of the box 17 to the rear of the microphone M22, and a rib 17c having an L-shaped cross section is formed on the rear surface of the partition plate 17b. The front surface of the IC package 35j in which the peripheral circuits (resistors R11, R12, capacitor C11, J-FET element S11, constant voltage circuit K1) of each acoustic signal-electric signal converter Cm of M22 are built is placed on the rib 17c. The back surface of the IC package 35j is positioned in contact with the inner surface of the box 17.

  In addition, a plurality of sound holes B are formed in the front surface of the casing A1 facing the speaker SP and the microphones M10, M21, and M22.

  And in this embodiment, in order to prevent the howling which generate | occur | produces when a microphone picks up the audio | voice output of the speaker SP, it has the following structures.

  First, as shown in FIG. 2, the signal processing unit 35 e housed in the IC package 35 i includes an A / D conversion unit 350 that converts an analog output of the main microphone M10 into a digital signal, and an A / D conversion unit 350. A low-pass filter 351 that passes components below a predetermined frequency from the output, a high-pass filter 352 that passes components above a predetermined frequency from the output of the A / D converter 350, and an analog output of the sub microphone M21 that is converted to a digital signal A / D conversion unit 353, low-pass filter 354 (first filter means) that passes a component having a predetermined frequency or less from the output of A / D conversion unit 353, attenuation unit 355 that attenuates the output of low-pass filter 354, and attenuation Delay circuit 356 for delaying the output of the unit 355 and the analog output of the sub microphone M22. A / D converter 357 for converting the signal into a digital signal, a high-pass filter 358 (second filter means) that passes a frequency component of a predetermined frequency or higher from the output of the A / D converter 357, and the output of the high-pass filter 358 Attenuating unit 359 for attenuating, delay circuit 360 for delaying the output of attenuating unit 359, differential circuit 361 for subtracting the difference between the output of low-pass filter 351 and the output of delay circuit 356, and the output and delay of high-pass filter 352 A differential circuit 362 that subtracts the difference from the output of the circuit 360 and an adder circuit 363 that adds the outputs of the differential circuits 361 and 362 are provided.

  7 to 10 show audio signal waveforms of respective parts of the signal processing unit 35e. The signals after the A / D conversion unit are digital signals, but for the sake of explanation, the waveforms in FIGS. 8 to 10 are shown as analog waveforms.

  First, the main microphone M10 has the vibrating portion 53c arranged forward, and collects the sound emitted by the speaker H located in front of the calling device A with higher sensitivity than the sound emitted by the speaker SP. On the other hand, in the sub microphones M21 and M22, the vibrating portion 53c is mounted toward the speaker SP, and the sound emitted by the speaker SP is more than the sound (speaking sound) emitted by the speaker H positioned in front of the communication device A. To collect sound with high sensitivity. In particular, the amplitude of the output Y21a of the sub microphone M21 with respect to the sound emitted from the speaker SP is at least twice the amplitude of the output Y10a of the main microphone M10 with respect to the sound emitted from the speaker SP.

  Further, since the sub microphone M22 is disposed in the vicinity of the main microphone M10, the frequency characteristic of the output Y22a of the sub microphone M22 with respect to the sound emitted from the speaker SP is the frequency characteristic of the output Y10a of the main microphone M10 with respect to the sound emitted from the speaker SP. It becomes almost similar.

  Furthermore, at the time of transmission, both the sound emitted by the speaker H and the sound emitted by the speaker SP are collected by the microphones M10, M21, and M22, but from the center of the speaker SP to the center of each of the microphones M10 and M21. Since the distances X10 and X21 are X10> X21, the sound wave delay time corresponding to the difference between the distances between the microphones M10 and M21 and the speaker SP (X10−X21) [Td21 = The phase of the output Y10a of the microphone M10 is delayed by (X10−X21) / Vs] (Vs is the speed of sound) compared to the output Y21a of the microphone M21 (see FIGS. 7A and 7C).

  Further, since the distances X10 and X22 from the center of the speaker SP to the centers of the microphones M10 and M22 are X10> X22, for the sound from the speaker SP, the distance between both the microphones M10 and M22 and the speaker SP is The phase of the output Y10a of the microphone M10 is delayed by the delay time [Td22 = (X10−X22) / Vs] (Vs is the speed of sound) corresponding to the difference (X10−X22) compared to the output Y22a of the microphone M22. (See FIGS. 7B and 7C).

  On the other hand, since the distances between the microphones M10, M21, and M22 and the speaker H can be regarded as being equal, the outputs Y10a, Y21a, and Y22a of the microphones M10, M21, and M22 are substantially the same for the sound emitted by the speaker H. It becomes a phase.

  Since the amplitude difference and the delay time between the sound signals collected by the microphones M10, M21, and M22 of the sound emitted from the speaker SP vary depending on the frequency of the sound, the sound emitted from the speaker SP as described below for each frequency band. To offset.

  First, the audio signal collected by the main microphone M10 is digitally converted by the A / D converter 350, and then the low-frequency output Y10b that has passed through the low-pass filter 351 and the high-frequency filter that has passed through the high-pass filter 352. The output Y10c is generated.

  The audio signal collected by the sub microphone M21 is digitally converted by the A / D converter 353, and then generated as a low frequency output Y21b that has passed through the low-pass filter 354, and collected by the sub microphone M22. The audio signal is digitally converted by the A / D converter 357 and then generated as a high-frequency output Y22b that has passed through the high-pass filter 358.

  For the output Y21b in the low frequency range from the low-pass filter 354, the attenuator 355 generates an output Y21c in which the output Y21b is attenuated, and the difference in distance between the microphones M10 and M21 and the speaker SP (X10) -X21) and level adjustment corresponding to the difference in sensitivity between the microphones M10 and M21 are performed, and the output levels of both microphones M10 and M21 in the low frequency region are made to coincide with the sound from the speaker SP (FIG. 8 (a) ( b)).

  Next, the delay circuit 356 includes a time delay element or a CR phase delay circuit, generates an output Y21d obtained by delaying the output Y21c of the attenuation unit 355 by the delay time Td21 ′ in the low frequency region, and outputs the output Y21d. The phases of the output Y10b are matched (see FIGS. 9A and 9B). That is, the phases of both microphones M10 and M21 in the low frequency range are matched with the sound from the speaker SP.

  Further, the attenuator 359 generates an output Y22c obtained by attenuating the output Y22b from the high-frequency region output Y22b from the high-pass filter 358, and the difference in distance between the microphones M10 and M22 and the speaker SP (X10− X22) or level adjustment corresponding to the sensitivity difference between the microphones M10 and M22 is performed, and the output levels of both microphones M10 and M22 in the high frequency range are made to coincide with the sound from the speaker SP.

  Next, the delay circuit 360 includes a time delay element or a CR phase delay circuit, generates an output Y22d obtained by delaying the output Y22c of the attenuation unit 359 by the delay time Td22 ′ in the high frequency region, and outputs the output Y22d. The phases of Y10c are matched. That is, the phases of both microphones M10 and M22 in the high frequency range are matched with the sound from the speaker SP.

  Next, the differential circuit 361 calculates the difference between the output Y10b of the low-pass filter 351 and the output Y21d of the delay circuit 356, and the differential circuit 362 calculates the difference between the output Y10c of the high-pass filter 352 and the output Y22d of the delay circuit 360. Calculate the difference. The adder circuit 363 generates an output Yo obtained by adding the outputs YL and YH of the differential circuits 361 and 362 (see FIG. 10), and outputs the output Yo to the echo cancel unit 35c. Here, the differential circuits 361 and 362 and the adder circuit 363 calculate the difference between the output of the main microphone M10 and the outputs of the low-pass filter 354 and the high-pass filter 358 via the attenuation units 355 and 359 and the delay circuits 356 and 360, respectively. The differential means to output is comprised.

  Therefore, the low-frequency sound component from the speaker SP included in the output Y10a of the main microphone M10 and the low-frequency sound component from the speaker SP included in the output Y21a of the sub microphone M21 are the above attenuation processing and delay. The processing results in the same amplitude and the same phase, which are canceled out by the differential processing. Furthermore, the high frequency sound component from the speaker SP included in the output Y10a of the main microphone M10 and the high frequency sound component from the speaker SP included in the output Y22a of the sub microphone M22 are the same by the attenuation process and the delay process. The amplitude and the same phase are canceled out by the differential processing. That is, in the output Yo, the sound component from the speaker SP is reduced in a wide frequency band.

  FIG. 11 shows the sound reduction effect by the signal processing unit 35e with respect to the frequency axis, and the characteristics Z1s and Z2s show the reduction effect on the sound emitted from the speaker SP and are generated based on the output of the sub microphone M21. The sound pressure level of the sound of the speaker SP reduced from the output Y10b using the output Y21d is shown in the characteristic Z1s, and the speaker SP reduced from the output Y10c using the output Y22d generated based on the output of the sub microphone M22 The sound pressure level of the voice is shown in characteristic Z2s. The characteristics Z1h and Z2h indicate a reduction effect on the voice uttered by the speaker H. The sound pressure of the voice of the speaker H reduced from the output Y10b using the output Y21d generated based on the output of the sub microphone M21. The level is shown in the characteristic Z1h, and the sound pressure level of the voice of the speaker H reduced from the output Y10c using the output Y22d generated based on the output of the microphone M22 is shown in the characteristic Z2h.

  Although the reduction amount of the sound emitted from the speaker SP by the sub microphone M21 is drastically decreased in the high frequency range (characteristic Z1s), the reduction amount of the sound emitted from the speaker SP by the sub microphone M22 is substantially over the entire frequency band. It is constant and does not decrease even in the high frequency range (characteristic Z2s). On the other hand, the amount of reduction of the sound produced by the speaker H by the sub microphones M21 and M22 both decreases in the high frequency range, and the absolute value of the amount of reduction is smaller than the amount of reduction of the sound produced by the speaker SP (characteristics Z1h, Z2h). ).

  Then, the difference Z1 (= Z1s−Z1h) between the audio component from the speaker SP and the audio component from the speaker H, which is reduced by the sub microphone M21, decreases in the high frequency range. The relative difference between the audio component from H and the audio component from the speaker SP to be reduced is small. That is, the sound component from the speaker cannot be sufficiently canceled in the high frequency range.

  On the other hand, the difference Z2 (= Z2s−Z2h) between the speech component from the speaker SP and the speech component from the speaker H, which is reduced by the sub microphone M22, increases in the high frequency range, and the speaker to remain in the high frequency range. The relative difference between the audio component from H and the audio component from the speaker SP to be reduced is large. That is, the sound component from the speaker can be sufficiently canceled even in a high frequency range.

  Therefore, if the frequency of the intersection of the characteristic Z1 and the characteristic Z2 is fx, the low-pass filters 351 and 354 allow the components below the frequency fx to pass, and the high-pass filters 352 and 358 allow the components above the frequency fx to pass. If the audio component from the speaker SP is reduced by the sub microphone M21 in the low frequency range below fx, and the audio component from the speaker SP is reduced by the sub microphone M22 in the high frequency region above the frequency fx, the signal processing unit 35e reduces the audio component. The relative difference between the speech component from the speaker H and the speech component from the speaker SP does not decrease even in the high frequency region above the frequency fx as shown by the characteristic Zo in FIG. Therefore, the relative difference between the speech component from the speaker H to be kept and the speech component from the speaker SP to be reduced does not decrease in the high frequency range as in the conventional characteristic Zp, but from the low frequency range to the high frequency range. Over a wide frequency band.

  Further, for the sound emitted by the speaker H, the amplitude of the output Y10a of the main microphone M10 in which the vibration part 53c is arranged toward the speaker H is equal to the sub microphone M21, in which the vibration part 53c is arranged toward the speaker SP. It becomes larger than the amplitude of the outputs Y21a and 22a of M22. Further, since the signals from the sub microphones M21 and M22 are attenuated by the attenuating units 355 and 359, the audio component from the speaker H included in the outputs Y10b and Y10c is the audio from the speaker H included in the outputs Y21d and Y22d. Even larger than the ingredients. That is, the amplitude difference between the speech component from the speaker H included in the outputs Y10b and Y10c and the speech component from the speaker H included in the outputs Y21d and Y22d increases, and the differential circuits 361 and 362 perform the above differential operation. Even if the processing is performed, the signals corresponding to the voice uttered by the speaker H remain in the outputs YL and YH with a sufficient amplitude maintained.

  As described above, in the output Yo of the signal processing unit 35e, the audio component from the speaker SP is reduced in a wide frequency band, while the audio component emitted by the speaker H in front of the communication device A remains, and in the output Yo The relative difference between the speech component from the speaker H to be retained and the speech component from the speaker SP to be reduced increases over a wide frequency band. That is, even when the sound from the speaker H and the sound from the speaker SP are generated at the same time, the sound component from the speaker H maintains a sufficient amplitude and only the sound component from the speaker SP has a wide frequency band. Therefore, howling that occurs when the microphone picks up the sound output of the speaker SP can be prevented regardless of the frequency of the sound emitted by the speaker SP.

  Since the signals from the sub microphones M21 and M22 are subjected to delay processing by the delay circuits 356 and 360, the sound produced by the speaker H is delayed by the signal from the main microphone M10 and the signals from the sub microphones M21 and M22. Although the delay times Td21 and Td22 are shifted, the delay times Td21 and Td22 are in units of μsec, and the deviation of the unit of μsec cannot be identified in the ear of the person to whom the call is made. That is, there is no problem as an audio signal transmitted to the human ear.

  Next, the audio signal output from the signal processing unit 35e is output to the echo canceling unit 35c, and the echo canceling units 35b and 35c (see FIG. 4) further prevent howling by performing the following processing.

  First, the echo canceling unit 35c takes the output of the echo canceling unit 35b as a reference signal, and performs an operation on the output of the signal processing unit 35e, so that the audio signal circulated from the speaker SP to the microphones M10, M21, and M22. Cancel further. On the other hand, the echo canceling unit 35b also captures the output of the echo canceling unit 35c as a reference signal and performs an operation on the output of the communication unit 35a, so that the audio signal wraps around from the speaker to the microphone on the other party side Cancel.

  Specifically, the echo cancellation units 35b and 35c are configured by a speaker SP-microphone M10, M21, M22-signal processing unit 35e-echo cancellation unit 35c-communication unit 35a-echo cancellation unit 35b-amplification unit 35d-speaker SP. By adjusting the amount of loss in variable loss means (not shown) provided in the loop circuit, howling is prevented by setting the loop gain to 1 or less. Here, it is assumed that the smaller signal level of the transmission signal and the reception signal is not important, and the transmission loss of the variable loss circuit inserted in the transmission line having the smaller signal level is increased.

  Here, the microphones M21 and M22 and the IC package 35i are electrically connected via a conductive pattern PT formed inside the front surface of the housing A1 (see FIGS. 1A and 1B). A method for generating the conductive pattern PT will be described below.

  In the present embodiment, the conductive pattern PT is formed using a MID (Molded Interconnection Device) molding substrate technique, and a conductor thin film is formed in a region including a portion where the conductor pattern PT is formed inside the front surface of the synthetic resin casing A1. A plating base electrode made of is formed. The plating base electrode does not need to coincide with the conductor pattern PT, and may include the entire portion where the conductor pattern PT is formed.

  The plating base electrode is patterned by laser irradiation, so that the portion that becomes the conductor pattern PT and the other portion are separated. That is, a part of the plating base electrode is removed along the contour line of the portion that becomes the conductor pattern PT. Next, thickening is performed by electroplating on the portion to be the conductor pattern PT to form the conductor pattern PT, and then the conductor thin film at portions other than the conductor pattern PT is removed by etching. By this procedure, the shape of the conductor pattern PT can be determined by patterning by laser irradiation, and the conductor pattern PT can be finely processed. That is, the conductor pattern PT can be formed precisely. Further, separate power supply lines and signal lines are not required, and the structure can be simplified.

  The number of sub-microphones is not limited to two. Three or more sub-microphones are arranged between the main microphone M10 and the speaker SP, and the sub-microphones farther from the main microphone M10 are the sub-microphones. The audio signal is used to reduce the low-frequency component of the audio signal emitted by the speaker SP from the audio signal of the main microphone M10, and the sub-microphone closer to the main microphone M10 uses the audio signal of the sub-microphone. Of the audio signal emitted from the speaker SP from the audio signal of the microphone M10, the high frequency component may be reduced. In this case, the signal processing unit 35e uses the audio signal of each sub microphone to reduce the audio signal emitted from the speaker SP from the audio signal of the main microphone M10 in each of three or more frequency bands. The sound emitted from the speaker SP can be reduced.

(Embodiment 2)
An example of a wiring system using the communication device of the present invention will be described below.

  First, as shown in FIG. 13, one or a plurality of switch boxes 2 that are embedded and disposed at appropriate positions in a building are provided, and power lines L1 and information lines L2 that are wired in advance in the wall surface between the switch boxes 2 are provided. In addition to feed wiring, the power line L1 drawn indoors through the main breaker MB and branch breaker BB in the wiring board 1 is introduced to the switch box 2 at the start, and the gateway is connected to the external Internet network NT. An information line L2 connected through a GW (router and hub built-in) is introduced. Here, the switch box 2 is provided at a high position HP such as an indoor ceiling surface, the switch box 2 is provided at a height position (middle position MP) recommended by a wall switch or the like, and near the foot (low position LP). ).

  These switch boxes 2 are standardized corresponding to a series of mounting frames 4 (see FIG. 14) to which three large-sized rectangular single-module embedded wiring devices can be mounted. As shown in FIG. 22, the power line L1 and the information line L2 sent from the wiring board 1 or other switch box 2 are introduced from the upper part as shown in FIG. 22, and the other switch box 2 is introduced from the lower part. A power line L1 and an information line L2 for leading and wiring are derived. The body of the gate device 3 to which the basic function module 8 is connected is attached to each switch box 2 by the attachment frame 4.

  As shown in FIG. 14, the mounting frame 4 is provided with a window hole 4a for mounting an instrument in the center, and the front part of the instrument body to be mounted is fitted into the window hole 4a from the back, and the left and right frame pieces are attached. The locked body provided on the both sides of the device main body is locked by the locking means provided on the device to fix the device main body. And the attachment screw | thread (not shown) penetrated to the attachment hole 4b provided in the up-and-down frame piece is fastened to the screw hole (not shown) of the switch box 2, and it attaches to the switch box 2 with the instrument main body. Further, when the mounting is performed on the wall panel with the embedded hole opened without using the switch box 2, the wall panel can be clamped with a so-called clip fitting or can be mounted with a wood screw.

  As shown in FIG. 15, the gate device 3 is provided with connection terminal portions 5a and 5b having a quick connection terminal structure and connection terminal portions 5a ′ and 5b ′ for feed wirings on the back surface of the body, and corresponding power lines L1 and information lines. L2 is connected. Further, on the front surface of the body, a power path connection port 6A having a contact portion electrically connected to the sent power line L1, and an information path electrically connected to the sent information line L2. A modular connection port 6 having a connection port 6B is provided as shown in FIG.

  These connection ports 6A and 6B are standardized as a system in terms of the distance between them, the arrangement of internal contact portions, the shape of the opening, and the like. The front surface of the switch box 2 is covered so as to cover the front surface of the body of the gate device 3. Connected portions 7A and 7B of the connector 7 provided on the back surface of the basic function module 8 shown in FIG. 16 attached to the opening side are detachably coupled to the connection ports 6A and 6B.

  The basic function module 8 constitutes a functional device with the extended function module 10 described later, and is a flat module body made of synthetic resin (non-crystalline general-purpose plastic such as ABS) shown in FIGS. 16 and 17A. The circuit shown in FIG. 19 is built in 8A, and by connecting the connected portions 7A and 7B of the connector 7 on the back surface to the connection ports 6A and 6B of the gate device 3, the front opening of the switch box 2 is obtained. In addition, the mounting flange (not shown) is attached to the front surface of the mounting hole 80 which is perforated in the center of the upper portion and the lower portion. It is attached to the switch box 2 via the attachment frame 4 by being inserted from the part side and screwed into a screw hole 4 c provided in the upper and lower frames of the attachment frame 4.

  Further, on the front surface of the module main body 8A, at a position above or below the opening position of the upper and lower mounting holes 80, as shown in FIG. 17A, a wide groove 81a and a narrow width are formed in the width direction of the module main body 8A. A connecting groove 81 comprising a groove 81b is formed to be divided into left and right by a central partition wall 82.

  A half of one side of the synthetic resin coupling body 100 shown in FIG. 17B is fitted into the coupling groove 81 on the left or right side of the partition wall 82 to a position where it contacts the partition wall 82, and the other half of the coupling body 100 is illustrated. As shown in FIG. 18, the basic function module 8 and the extended function module 10 can be mechanically coupled by fitting into a connecting groove 81 that is similarly provided on the extended function module 10 side. The connecting body 100 is provided with a groove 100a in which a partition wall 81c for partitioning the wide groove 81a and the narrow groove 81b is fitted on the back surface, and is inserted so as to straddle both the grooves 81a and 81b. In the basic function module 8, the decorative cover 8 </ b> B is detachably attached from the front side, and in the extended function module 10, the lid 83 is closed so as to be fitted over the connecting groove 81. A certain connected body 100 is held so as not to fall off and is maintained in a connected state. Thus, the connecting body 100 and the connecting groove 81 constitute connecting means for the basic function module 8 and the extended function module 10.

  In the wiring system of the present embodiment, a plurality of types of basic function modules 8 are prepared depending on functions, and the basic function module 8 is a commercial power supply AC supplied via a connected portion 7A as shown in FIG. For transmitting / receiving an information signal transmitted bi-directionally through an information line L2 connected via an AC / DC converter 21 that converts the power to an operating power source + V of an internal circuit composed of a stable DC voltage and a connected portion 7B Transmission unit 22, power supply connectors 9A and 9A 'connected to commercial power supply AC via connected part 7A, and information connector connected to information line L2 via communication transmission part 22 and connected part 7B 9B, 9B ′ and the information signal received by the communication transmission unit 22 are used to perform processing, and from the basic function module 8 to another basic function module 8 Data is exchanged between the arithmetic processing unit 23 that performs data generation processing when data is sent to the extended function module 10 or via the information line L2, and the arithmetic processing unit 23 via the I / O interface 24. The function unit 25 is operated by performing the operation, and these units are supplied with the operating power source + V from the AC / DC converter 21. The configuration of the function unit 25 differs depending on the basic function module 8.

  A male power connector 9A and an information connector 9B are provided on one side of both side surfaces of the module main body 8A of the basic function module 8, and a female power connector 9A 'and an information connector 9B' are provided on the other side. Yes. Then, by connecting the contact pieces of the connected portion 7A to the contact pieces of the power connectors 9A and 9A ′, the commercial power supply AC is supplied even if the extended function module 10 is connected in either direction. To be able to. Further, by connecting the input / output of the communication transmission unit 22 to the contact pieces of the information connectors 9B and 9B ′, the information signal can be exchanged even if the extended function module 10 is connected in either the left or right direction. . The power connectors 9A and 9A ′ are arranged to be biased to one end on both side surfaces of the module body 8A, and the information connectors 9B and 9B ′ are biased to the other side on both side surfaces of the module body 8A. Arranged.

  The power connectors 9A and 9A ′ and the information connectors 9B and 9B ′ are standardized as a system in the arrangement of the internal contact portions, the shape of the openings, and the power connector and information arranged on the same surface. The distance from the connector for the connector is also standardized as a system, and power supply connectors 11A and 11A ′ and information connectors 11B and 11B ′, which will be described later, of the extended function module 10 are detachably coupled.

  Next, in the wiring system according to the present embodiment, a plurality of types of extended function modules 10 are prepared according to functions that operate upon receiving power supply, and the extended function module 10 includes a power connector 11A as shown in FIG. , 11A ′, the information connectors 11B, 11B ′, and the commercial power supply AC supplied via any one of the power connectors 11A, 11A ′ are converted into an operating power supply + V of an internal circuit composed of a stable DC voltage. AC / DC converter 31, communication transmission unit 32 that transmits and receives information signals transmitted bidirectionally via information connectors 11 </ b> B and 11 </ b> B ′, and processing by capturing data from information signals received by communication transmission unit 32 To the basic function module 8 or another extended function module 10 from the extended function module 10 or information An arithmetic processing unit 33 that performs data generation processing when sending data via L2 and a functional unit 35 that operates by exchanging data with the arithmetic processing unit 33 via the I / O interface 34 These units are supplied with the operating power supply + V from the AC / DC converter 31. The configuration of the function unit 35 differs depending on the extended function module 10.

  In the extended function module 10, the height of the module main body 10A is basically standardized to the same height as that of the basic function module 8 as shown in FIG. Standardized to an integral multiple of the unit module dimensions.

  Also, a male power connector 11A and an information connector 11B are provided on one side of both sides of the flat module body 10A made of synthetic resin (amorphous general-purpose plastic such as ABS), and a female power source is provided on the other side. Connector 11A 'and information connector 11B' are provided. The power connectors 11A and 11A ′ are biased to one end on both side surfaces of the module body 10A, and the information connectors 11B and 11B ′ are biased to the other side on both side surfaces of the module body 10A. Be placed. These power connectors 11A and 11A ′ and information connectors 11B and 11B ′ are arranged in the same manner as the power connectors 9A and 9A ′ and information connectors 9B and 9B ′ of the basic function module 8, and the arrangement and opening of the internal contact portions. The shape of the unit is standardized as a system, and the interval between the power connector and the information connector arranged on the same plane is also standardized as a system. The power connectors 9A, 9A ′ of the basic function module 8 are standardized. The information connectors 9B and 9B ′ or the power connectors 11A and 11A ′ and the information connectors 11B and 11B ′ of the other extended function modules 10 are detachably coupled.

  Specifically, the male power connector 11A and the information connector 11B are the female power connector 9A 'of the basic function module 8, the information connector 9B', or the female connector of another extension function module 10. Connected to the power connector 11A ′ and the information connector 11B ′, the female power connector 11A ′ and the information connector 11B ′ are the male power connector 9A, the information connector 9B of the basic function module 8, or The other extension function module 10 is connected to the male power connector 11A and the information connector 11B.

  In the module body 10A, the contact pieces of these power supply connectors 11A and 11A ′ are connected to each other, and the power supply connector on one side is fitted to the power supply connector of the adjacent basic function module 8 or the extended function module 10. When the power is received (power reception port), the other power connector is the power supply side (power supply port).

  Further, by connecting the input / output of the communication transmission unit 32 to the contact pieces of the information connectors (information transfer ports) 11B and 11B ′, the basic function module 8 and other extended function modules 10 are connected in either direction. However, the information signal can be exchanged, and the information signal can be exchanged with the basic function module 8 or the extended function module 10 adjacent to both sides.

  Further, the shape of the module main body 10A of the extended function module 10 is such that the back surface is formed as a flat surface as shown in FIGS. The upper and lower positions are provided with a connecting groove portion 81 including a wide groove 81a and a narrow groove 81b for inserting the connecting body 100 in the same manner as the basic function module 8, and a lid portion for opening and closing the connecting groove portion 81. 83, the lid 83 is opened when the connecting body 100 is mounted or removed, and is closed as described above when the mounting state of the connecting body 100 is maintained (FIG. 21 (c). )reference).

  Next, the call device 10a of this embodiment which is one form of the extended function module 10 will be described. As shown in FIG. 23 and FIG. 24, the call device 10 a includes an AC / DC converter 31, a communication transmission unit 32, an arithmetic processing unit 33, an I / O interface 34, and a functional unit 35, similar to the extended function module 10. The module main body 10A is housed in a main body 10A. One side of the both sides of the module main body 10A has a male power connector 11A and an information connector 11B, and the other side has a female power connector 11A 'and an information connector 11B'. Provided.

  A plurality of sound holes 10B are formed in the front surface of the module main body 10A, and the call switch SW1 and the alarm release switch SW2 are exposed on the front surface.

  In the module main body 10A, as shown in FIG. 24, as the function unit 35, the speaker SP, the main microphone M10, the sub microphones M21 and M22, the call switch SW1, the alarm release switch SW2, the communication unit 35a, and the echo cancellation units 35b and 35c. , An amplifier 35d and a signal processor 35e, which have the same functions as those of the communication device A of the first embodiment, and the arrangement of the speakers SP and microphones M10, M21, and M22 is the same as that of the first embodiment. Howling that occurs when the microphone picks up the sound output is prevented.

  Further, when an alarm signal is transmitted from the basic function module 8 or the extended function module 10 having a sensor function installed in the room where the communication device 10a is arranged, or another room via the information line L2, An alarm sound is emitted from the speaker SP, but the alarm sound output can be canceled by operating the alarm cancel switch SW2.

  And, for example, as shown in FIG. 22, the basic function module 8b that constitutes a wall switch for turning on / off the lighting fixture by exposing the operation portion of the operation switch SW3 to the front surface of the decorative cover 8B is connected to the gate device 3, An extended function module 10b having a clock function with the time display unit 35g exposed on the front surface of the module main body 10A is connected to the right side of the basic function module 8b, and the call device 10a is connected to the right side of the extended function module 10b. By connecting, an intercom function can be added to various functional devices such as a wall switch function and a clock function. Alternatively, a new extended function module 10b can be connected to the communication device 10a installed in advance.

  In this case, the power connector 11A ′ and the information connector 11B ′ of the extended function module 10b are installed on the indoor ceiling surface, wall surface, and floor surface and are electrically connected to at least one line of wiring for transmitting power and information signals. The power connector 11A and the information connector 11B of the communication device 10a are supplied with power from the first connection unit, and receive information signals with the first connection unit. It corresponds to a second connection part for giving and receiving. Further, if an extended function module (not shown) having a predetermined function is connected to the right side of the communication device 10a, the power connector 11A ′ and the information connector 11B ′ of the communication device 10a supply power to the extended function module. This corresponds to a third connection unit for exchanging information signals with the extended function module.

  Therefore, the communication device 10a is connected to the power line L1 and the information line L2 that are preliminarily wired in advance through the gate device 3, the basic function module 8, and the other extended function module 10, so that the power path and the information path Can be secured at the same time, and there is no need to perform new wiring work, and the workability is excellent. Further, by using the same information line L2 as that of the basic function module 8 and the other extended function modules 10, it is possible to easily perform interlocking control between the communication device 10a and the basic function module 8 and the other extended function modules 10. Can be expanded and has excellent extensibility.

  Next, the communication device 8a of this embodiment, which is one form of the basic function module 8, will be described. As the function unit 25 of the basic function module 8, as shown in FIGS. 25 and 26, the speaker SP, the main microphone M10, the sub microphones M21 and M22, the call switch SW1, the alarm release switch SW2, the communication unit 35a, and the echo cancellation unit 35b. , 35c, amplifying unit 35d, and signal processing unit 35e, a call device 8a having the same function as the above-described call device 10a is configured.

  A plurality of sound holes 8C are formed on the front surface of the module main body 8A, and the call switch SW1 and the alarm release switch SW2 are exposed on the front surface.

  The communication device 8a can be used alone as a basic function module. Further, if necessary, the extended function module 10 is connected to the side via the power connectors 9A and 9A ′ and the information connectors 9B and 9B ′. do it. In this case, the connection port 6 including the power path connection port 6 </ b> A and the information path connection port 6 </ b> B of the gate device 3 is installed on the indoor ceiling surface, wall surface, and floor surface, and transmits at least one system wiring. The connector 7 including the connected portion 7A and the connected portion 7B of the communication device 8a is supplied with power from the first connecting portion, and is connected to the first connection portion. This corresponds to a second connection unit for exchanging information signals with the unit. Further, if an extended function module (not shown) having a predetermined function is connected to the right side or the left side of the communication device 8a, the power connectors 9A and 9A ′ and the information connectors 9B and 9B ′ of the communication device 8a are expanded functions. It corresponds to a third connection part for supplying power to the module and exchanging information signals with the extended function module.

  Therefore, the communication device 8a can simultaneously secure the power path and the information path by connecting to the power line L1 and the information line L2 that are previously wired in the same way via the gate device 3, and it is necessary to newly perform wiring work. No workability and excellent workability. Further, by using the same information line L2 as the other basic function module 8 and the extended function module 10, it is possible to easily perform the interlock control between the communication device 8a and the other basic function module 8 and the extended function module 10. Can be expanded and has excellent extensibility.

  In addition to the above, the basic function module 8 includes a module having an outlet function, a module having a monitor function, and a module having only a speaker function.

  In addition to the above, the extended function module 10 includes an air conditioner operation controller, an air conditioner temperature setting device, an electric razor using electric power supply, an electric toothbrush, a charger such as a portable audio player, a lighting device, and an air conditioner. And the like having remote control infrared rays. In addition to audio information, there are interphone master and slave units that have a transmission function for video captured by a surveillance camera or the like, and a video monitoring function.

  In addition, as a transmission system of the information signal of the wiring system using the functional device of the present invention, either baseband transmission or broadband transmission may be adopted and any protocol may be used. A pair of audio and video is sent to and from the master unit and slave unit based on JT-H232 packets, and one or more can be operated by operation data from the operation side in the control system. A route control protocol corresponding to unicast and broadcast capable of one-to-one or one-to-N correspondence may be employed, and is not particularly limited, and thus description thereof is omitted. Further, the protocol used between the gate devices 3 and the protocol used in the functional modules 8 and 10 connected to the gate device 3 may be made different, for example, the protocol conversion may be performed by the gate device 3.

  Thus, in using the basic function module 8 constituting the functional device, first, the gate device 3 is first attached to the switch box 2 embedded in the appropriate wall surface of the building via the mounting frame 4 and wired in advance. The power line L1 and the information line L2 are connected. Thereafter, the corresponding connected portions 7A and 7B of the connector 7 of the basic function module 8 are connected to the electric wire connection ports 6A and 6B provided on the front surface portion of the gate device 3, and the basic function module 8 is connected to the gate device. 3 is attached to the attachment frame 4 so as to cover the front surface portion of the frame 3. When the basic function module 8 is attached, the front surface portion protrudes from the wall surface, and both side surfaces are exposed to the indoor side.

  Then, the extended function module 10 is connected to one of the exposed side surfaces of the basic function module 8 by connecting the side surface of one side to the connector, and in this state, the extended function module 10 and the basic function module 8 are connected using the coupling body 100. Connect mechanically. Thereby, the basic function module 8 and the extended function module 10 constitute a functional device. At this time, the back surface of the extended function module 10 is along the side wall surface of the switch box 2. For example, when the wall surface is cross-bonded or the like, the position of the back surface of the extended function module 10 is slightly shifted. In addition, it can be disposed in a state in which the back surface is in close contact with the wall portion, and even if an operation force or the like is applied from the front surface portion of the extended function module 10, the load applied to the connection portion can be reduced.

  Further, when another extended function module 10 is connected to the previously connected extended function module 10, the extended function modules 10 are mechanically connected to each other by the connecting body 100 in a state where the opposing side surfaces are in contact with each other and are connected by connectors. In this manner, as shown in FIG. 22, the extended function modules 10 (10a, 10b...) Can be sequentially connected to the sides.

  Since the basic function module 8 can connect the extended function module 10 to both sides, the extended function module 10 may be connected to both sides of the basic function module 8. After the extended function module 10 is connected in this way, the end cover 101 is detachably attached to the side of the connection portion of the extended function module 10 or the basic function module 8 located at both ends, so that the extended function module 10 is attached. Will be completed. When the extended function module 9 is not connected to the basic function module 8, that is, when it is left unused, the end cover 101 is attached to both sides of the basic function module 8.

  The frame composed of the upper and lower sides of the decorative cover 8B of the basic function module 8, the lid 83 provided on the upper and lower sides of the extended function module 10 (including the communication device 10a), and the end cover 101 is standardized by JIS. It has substantially the same shape as the wide handle type switch plate (JIS8316), and it provides a uniform appearance with a wide handle type switch that has already been installed. Note that the shape of the frame is not limited to the shape of the wide handle type switch plate, but if the shape is substantially the same as the plate used for the large-angle continuous wiring apparatus standardized by JIS, It is possible to obtain a uniform appearance with an embedded wiring device such as the above.

  Further, the dimensions of the basic function module 8 and the extended function module 10 in the width direction and the height direction are the plate used for the large-angle continuous wiring apparatus standardized by JIS with the end covers 101 attached to both sides. The basic function module 8 and the extended function module 10 are formed to have the same dimensions, and the thickness dimensions of the basic function module 8 and the extended function module 10 are the same. Can be easily replaced.

  In addition, the number of extended function modules 10 that can be connected to the basic function module 8 is limited by the magnitude of the load applied to the connection site, and is also limited by the power supply capability of the basic function module 8.

  Here, for example, as shown in FIG. 13, the gate device of the switch box 2 provided at a high position HP such as an indoor ceiling surface among the one or a plurality of switch boxes 2 which are embedded and disposed at appropriate positions in the building. 3 is connected to a basic function module 8 having a hooking blade connecting portion 60, and the basic function module 8 is connected to an extended function module 9 provided with a human sensor 61 or the like, or a gate device 3 A basic function module 8c having only a speaker SP and having a function for BGM and the like is connected.

  A basic function module 8b constituting a wall switch for turning on / off a lighting fixture is provided in the gate device 3 of the switch box 2 provided at a height position (middle position MP) such as a wall surface recommended by a wall switch or the like. In addition, an extended function module 10b having a clock function and a communication device 10a are connected. Alternatively, the basic function module 8 including the monitor device 64 is connected to the gate device 3 of the switch box 2 in the middle position MP.

  Furthermore, a basic function module 8 having a power outlet 62 is connected to the gate device 3 of the switch box 2 provided in the vicinity of the foot including the floor (low position LP), and an extended function module constituting the foot lamp 63. Or a basic function module 8c having only a speaker SP and having a function for BGM or the like is connected to the gate device 3.

  After the installation work is completed and the system is completed as described above, an information signal is exchanged between the corresponding basic function module 8 and the extended function module 10, and if it is the communication device 8a or 10a, another room is provided. The intercom system is configured with the communication devices 8a and 10a, and the communication between the two is made possible and alarm notification is performed.

  Further, in this embodiment, no special construction is required for the addition or deletion of the extended function module 10 or the basic function module 8, and therefore, only by connecting the extended function module 10 to the basic function module 8 according to general user preference, Extensibility is ensured.

  Although the gate device 3 used in the present embodiment is attached to the switch box 2 with the attachment frame 4, it is of course possible to attach it directly to the back wall of the switch box 2 and attach the basic function module 8 to the switch box 2.

(Embodiment 3)
In the second embodiment, a power path and an information path are established by connector connection between the gate device 3, the basic function module 8 (including the call device 8a), and the extended function module 10 (including the call device 10a). .

  However, in this embodiment, the power path is configured by supplying electric power in a non-contact manner by magnetic coupling instead of connector connection. Specifically, the gate device 3, the basic function module 8, and the extended function module 10 each have a configuration in which a coil is wound around a core instead of a connector, and the cores are magnetically coupled to each other so that the other coil has a low pressure. AC power supply voltage is induced to supply power. Here, by applying an AC power supply having a frequency higher than the commercial frequency to the coil, the transformer configuration by the electromagnetic coupling portion can be reduced in size.

  Further, in the gate device 3, the basic function module 8, and the extended function module 10, an information signal is sent out through E / O conversion, and an information signal is taken in through O / E conversion, whereby an information signal composed of an optical signal is emitted as a light emitting element. Thus, an information path that can be transmitted bidirectionally without contact using the light receiving element is constructed.

(Embodiment 4)
In the second and third embodiments, power (power supply) transmission and information signal delivery are performed in separate systems. However, in this embodiment, the information signal transmission method for the entire system is performed on the power line carrier. The road and information path are shared.

  In other words, the preceding wiring in each switch box 2 is only the power line L1, and the connection port of the gate device 3 corresponding to this is only the power path connection port 6A of the connection port shown in FIG. 14, and the corresponding basic function module 8 The connector 7 (including the communication device 8a) also has only a connected port 7A corresponding to the power path connecting port 6A, and the information connectors 9B and 9B ′ are also omitted. Further, the extended function module 10 (including the communication device 10a) also omits the information connectors 11B and 11B '.

  As shown in FIG. 27, in the communication device 10a, the information signal received by the power line carrier and the PLC modem unit 36 for transmitting the information signal and the information signal received through the PLC modem unit 36 are received. Are provided between the arithmetic processing unit 33, the functional unit 35, and the functional unit 35 and the arithmetic processing unit 33 for performing data processing of the above and generating data of an information signal transmitted by the power line carrier via the PLC modem unit 36. An I / O interface 34 is provided. The arithmetic processing unit 33, the I / O interface 34, and the functional unit 35 have the same functions as those in the second and third embodiments.

  Further, the same configuration as the PLC modem unit 36 is also provided in the gate device 3, the basic function module 8, and the extended function module 10.

  The power line carrier modulation scheme employed in this embodiment may be any of various schemes such as a broadband spread spectrum scheme, a multi-carrier scheme, and an OFDM scheme, and is not particularly described here.

  Thus, in this embodiment, since the power path and the information path are common, the connection port in the gate device 3 is only the power path connection port 6A, and the connector 7 of the basic function module 8 is also one connected portion 7A. Thus, the connector 11 of the extended function module 10 also has only one connected portion 11A, so that the space around the connection is reduced. In addition, the internal circuit of the basic function module 8 or the extended function module 10 does not require the configuration of a communication transmission unit or an information connector, so that the arrangement space in the thin module bodies 8A and 10A can be increased.

  In addition, since a PLC modem part is built in the lighting equipment and air conditioning equipment, it is possible to send information signals directly to the lighting equipment and air conditioning equipment, so it is necessary to provide a function module with an infrared remote control signal transmission function for remote control. Disappears.

(A) (b) It is sectional drawing which shows the attachment state of the speaker of the telephone apparatus of Embodiment 1, and a microphone. It is a circuit block diagram of a signal processing part same as the above. It is a perspective view same as the above. It is a circuit block diagram same as the above. (A) (b) It is a block diagram of the acoustic signal-electrical signal conversion part of a microphone same as the above. It is a circuit block diagram of a microphone same as the above. (A) (b) (c) It is a signal waveform diagram of the signal processing part same as the above. (A) (b) It is a signal waveform diagram of a signal processing part same as the above. (A) (b) It is a signal waveform diagram of a signal processing part same as the above. It is a signal waveform figure of a signal processing part same as the above. It is a figure which shows the audio | voice reduction effect with respect to a frequency same as the above. It is a figure which shows the audio | voice reduction effect with respect to a frequency same as the above. It is a block diagram of the wiring system using the communication apparatus of Embodiment 2. It is a front view of the state which attached the gate apparatus same as the above to the attachment frame. It is a perspective view which shows the wiring form to the gate apparatus same as the above. It is a perspective view of the state which removed the basic functional module same as the above from the switch box. (A) is a perspective view of the basic functional module same as above with the decorative cover removed, and (b) is a perspective view of the coupling body. It is explanatory drawing of the connection structure of a basic function module same as the above and an expansion module. It is a circuit block diagram of a basic functional module same as the above. It is a circuit block diagram of an extended function module same as the above. The extended function module same as the above is shown, (a) is a front view, (b) is a side view, and (c) is a side view in a state where a lid is opened and a coupling body is removed. It is a partially broken perspective view which shows the arrangement | positioning state of the wiring system using the telephone apparatus (extended function module) same as the above. It is a perspective view which shows the telephone apparatus (extended function module) same as the above. It is a circuit block diagram of a communication apparatus (extended function module) same as the above. It is a circuit block diagram of the function part of a communication apparatus (basic function module) same as the above. It is a perspective view which shows the arrangement | positioning state of the wiring system using the communication apparatus (basic function module) same as the above. FIG. 6 is a circuit configuration diagram of a communication device according to a fourth embodiment.

Explanation of symbols

A Calling device A1 Case SP Speaker M10 Main microphone M21, M22 Sub microphone 35e Signal processor 35i IC package

Claims (7)

A speaker that outputs audio information transmitted through the wiring, a main microphone that collects sound and outputs an audio signal, and a main microphone and a speaker that are arranged at different distances from the main microphone to transmit audio. A plurality of sub-microphones for collecting and outputting sound signals; and a main body housing a signal processing unit for processing the sound signals output from the main and sub-microphones and transmitting the signals through wiring;
The signal processing unit uses the audio signal of the sub microphone far from the main microphone to reduce the low frequency audio signal emitted from the speaker from the audio signal of the main microphone, and uses the audio signal of the sub microphone close to the main microphone. A telephone device characterized in that a high frequency side audio signal emitted from a speaker is reduced from an audio signal of a main microphone. The plurality of sub microphones include a first sub microphone whose output level with respect to sound from a speaker is twice or more the output level of the main microphone, and a frequency characteristic of output from the speaker with respect to a frequency characteristic of the output of the main microphone. And a second sub microphone arranged at a position that is substantially similar to
The signal processing unit receives the first sub-microphone audio signal as input and passes the first filter means that passes a component below a predetermined frequency, and the second sub-microphone audio signal as an input and receives the component above the predetermined frequency. A low-frequency side audio signal emitted by the speaker from the audio signal of the main microphone, using the audio signal output from the first sub-microphone via the first filter means. The high frequency side audio signal emitted from the speaker is reduced from the audio signal of the main microphone by using the audio signal that is reduced and output from the second sub microphone through the second filter means. Item 4. The communication device according to Item 1. Below the predetermined frequency, the difference between the sound component from the speaker and the sound component from the external sound source, which is reduced from the sound signal of the main microphone using the sound signal output from the first sub microphone, is the second sub microphone. The difference between the sound component from the speaker and the sound component from the external sound source that is reduced from the sound signal of the main microphone using the sound signal output by the microphone is greater than
Above the predetermined frequency, the difference between the sound component from the speaker and the sound component from the external sound source that is reduced from the sound signal of the main microphone using the sound signal output from the second sub microphone is the first sub-microphone. 3. The communication device according to claim 2, wherein a difference between an audio component from a speaker and an audio component from an external sound source, which is reduced from an audio signal of the main microphone by using an audio signal output from the microphone, is larger. 4. The communication device according to claim 2, wherein the second sub microphone is located on a straight line connecting the main microphone and the first sub microphone and in the vicinity of the main microphone. The sub-microphone includes three or more sub-microphones, and the signal processing unit uses the audio signal of each sub-microphone to reduce the audio signal emitted from the speaker from the audio signal of the main microphone in different frequency bands. Item 4. The communication device according to Item 1. The signal processing unit includes a plurality of filter means for receiving the audio signals of the sub microphones, an output level of each filter means for sound from a speaker, and an output level of the main microphone in the frequency band of the filter means. Each filter means outputs the sound signal from the speaker by delaying the sound signal according to the transmission time of the sound wave corresponding to the difference in distance between the main and sub microphones and the speaker. Delay means for matching the phase of the sound signal with the sound signal of the main microphone in the frequency band of the filter means, the level adjusting means, the main microphone that has passed through the delay means, and the differential that outputs the difference between the sound signals of the filter means And a filter hand connected to a sub microphone close to the main microphone. The communication apparatus according to claim 1, wherein passing the higher frequency band of the signal as compared to the filter means connected to the distant sub microphone from the main microphone. The main body is electrically connected to a first connection portion that is installed on an indoor ceiling surface, wall surface, floor surface and electrically connected to at least one system wiring for transmitting power and information signals. A second connection unit for receiving and supplying information signals to and from the first connection unit, wherein the speaker outputs audio information transmitted through the second connection unit, The microphone transmits audio information through the signal processing unit and the second connection unit, and the configuration of the second connection unit is standardized corresponding to the stylization of the arrangement and shape of the first connection unit. The call device according to any one of claims 1 to 6, wherein

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