JP2007266292A - Three-dimensional circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a three-dimensional circuit module by which the size of a system can be reduced, sufficient volumes of communication traffic can be processed at high speed, and electrical power necessary for the communication can be saved. <P>SOLUTION: Several housings in pyramid form are arranged in such a way that their apexes are coincident with one another, and their bottoms constitute a housing in polyhedron form. The housing has several modules in each of which at least an optical communication means and a signal processing circuit are housed and an optical distribution means 21 inside which can distribute an optical signal transmitted from an arbitrary module to other arbitrary modules, when the modules are set in such a way that the apexes of their pyramids are coincident with one another, and their bottoms constitute arbitrary surfaces of a polyhedron. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a three-dimensional circuit module, and more particularly to a three-dimensional circuit module constituting a communication system or the like.

  In recent years, in various systems including a communication system, a microprocessor is incorporated to perform complicated signal processing. Therefore, the system is modularized for each function.

  In each functional module, a semiconductor element and a signal transmission component for exchanging signals between the elements are mounted on the board. A plurality of these boards are arranged in a hierarchy or arranged in a plane to constitute a system. Or there is an example (patent documents 1, patent documents 2, patent documents 3) which constituted a system three-dimensionally.

In these cases, in order to exchange signals between boards and between layers, signal transmission components and the like are provided. For signal transmission components, microstrip lines are used for wiring on the board and backplane, and cables are used to connect the boards. In addition, high-speed serial transmission lines using electrical communication or optical communication are used, and these transmission lines are switched by a many-to-many high-speed switch.
JP-A-2005-84728 Japanese Patent Laid-Open No. 04-208587 JP-A-60-130854 JP 09-84145 A Japanese Patent Laid-Open No. 06-102813

  However, as the system scale increases, the system size increases if a plurality of boards are arranged in a plane. Also, even if the board layout is devised and multiple boards are arranged hierarchically or the system is three-dimensionally configured, the signal path becomes considerably long when signals are exchanged between the multiple boards. Therefore, it becomes difficult to handle a sufficient amount of communication at high speed.

  In addition, the power required for communication has been increased in order to operate a high-speed and large-capacity switching network. In particular, in current high-speed servers, it is necessary to drive signals and clocks used for communication through many long wires. Therefore, the increase in power required for communication is remarkable.

  The present invention was created in view of such conventional problems, and is a tertiary system that can reduce the system size, handle a sufficient amount of communication at high speed, and suppress the power required for communication. The object is to provide an original circuit module.

  According to an aspect of the present invention, a pyramid-shaped casing, the bottoms of which form a polyhedron when the apexes of the pyramids of the plurality of casings are aligned with each other, at least light is included in the casing. A plurality of modules in which communication means and a signal processing circuit are housed, and the apexes of the pyramids of each module coincide with each other, and each module is set so that the bottom surface of each module constitutes an arbitrary surface of a polyhedron Sometimes, a three-dimensional circuit module is provided having optical distribution means capable of distributing an optical signal emitted from any one of the modules to any other module.

  According to this three-dimensional circuit module, a plurality of modules having a pyramid-shaped housing can be set so that the apexes of the pyramids coincide with each other, and the bottom surface of each module constitutes an arbitrary surface of a polyhedron. Therefore, when each module is configured for each function and one system is configured with a plurality of modules, the system shape becomes a three-dimensional shape represented by a polyhedron, or a three-dimensional shape represented by a part of a polyhedron. The system becomes very compact.

  In addition, this three-dimensional circuit module can be obtained from any one module when each module is set so that the apexes of the pyramids of each module coincide with each other and the bottom surface of each module forms an arbitrary surface of the polyhedron. Optical distribution means capable of distributing the emitted optical signal to any other module is provided.

  In this case, if the light distribution means is arranged at the tip including the apex of the pyramid of the module, when any signal is exchanged between any modules, all the modules can exchange signals by optical communication. In addition, the signal path between any modules is short and substantially equal. As a result, the system of the present invention can handle a sufficient amount of communication at high speed.

  According to the three-dimensional circuit module of the present invention, the system shape is a three-dimensional shape represented by a polyhedron or a three-dimensional shape represented by a part of the polyhedron, so that the system is very compact.

  In addition, in the system of the present invention, signals can be exchanged between all modules by optical communication, and the signal paths can be made short and substantially equal between any modules, so that it is sufficiently fast. It is possible to handle a large amount of communication.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
FIG. 1 is a schematic diagram showing a system configuration of a three-dimensional circuit module according to the first embodiment of the present invention.

  In the three-dimensional circuit module of the first embodiment, as shown in FIG. 1, twelve functional modules 1 to 12 are set, and these functional modules 1 to 12 exchange signals with each other through the optical distribution means 21. Can be done.

  In the functional modules 1 to 12 of this embodiment, when the input / output bandwidth is sufficient and there is a processing sharing capability, basically the same modules can be used for each module. It is not necessary to create a separate function from the beginning, and it is sufficient that the necessary function can be programmed. In this case, the load can be redistributed by replacing and reconfiguring all or part of the programs of each module. Further, some modules may have a dedicated interface with the outside.

  In FIG. 1, twelve functional modules 1 to 12 are shown, but it goes without saying that the number of necessary functional modules varies depending on the use of the system.

  As the light distribution means 21 that can be used in the present invention, any one of a light scatterer, a light reflector, a prism, a hologram, and an aggregate of optical waveguides, or a combination of two or more thereof can be used. Details thereof will be described in the second embodiment.

  Next, a specific configuration example of the three-dimensional circuit module will be described below.

  FIG. 2A is a perspective view showing the system shape of the three-dimensional circuit module according to the first embodiment of the present invention, and corresponds to the case where all the twelve functional modules 1 to 12 in FIG. 1 are set.

  The three-dimensional shape of the system of this three-dimensional circuit module has a regular dodecahedron as shown in FIG. Each face of the regular dodecahedron hits the bottom face of each module. This structure will be described in detail. Each module is composed of a pentagonal pyramid housing that houses circuit components and the like, and the apexes of the pyramid of each module housing are gathered at the center of a regular dodecahedron. In this system, a maximum of 12 modules 1 to 12 can be set.

  Each module is not a perfect pentagonal pyramid, and its apex and its peripheral part are cut out. When set as a system, a space is formed in the central part, and the light distribution means 21 is installed there.

  In addition, the case where a system is comprised by the number of modules fewer than 12 is also possible, and a system shape turns into a solid | 3D shape comprised by a part of regular dodecahedron.

  FIG. 2B shows a frame for setting a module composed of a pentagonal pyramid housing when a system composed of a regular dodecahedron or a part of a regular dodecahedron is constructed. FIG.

  In order to set the pentagonal pyramid housing of each module so that the apexes of the pyramids coincide, the frame of the pentagonal pyramid ( Frame) 22 is formed. The pentagonal pyramid frame 22 is composed of a pentagonal frame made up of thin lines constituting the bottom surface and a triangular frame made up of thin lines constituting five side surfaces. The triangular frame constituting the five side surfaces and the pentagonal frame constituting the bottom surface may be formed in common with the corresponding frames of the adjacent pentagonal pyramids as shown in FIG. Good. Alternatively, each pentagonal pyramid may be formed separately.

  In this case, a frame is not formed in the region 23 corresponding to the center of the regular dodecahedron and the periphery thereof, and a space in which the light distribution means is installed is formed in this region.

  As a mechanism for fixing the housing of each module, a groove (not shown) is formed along the ridge line of the pentagonal pyramid of the housing of each module. The module housing groove is fitted into a frame forming a dodecahedron system, and the module housing is fixed. Further, a rail mechanism that supports the ridgeline of the pentagonal pyramid of the housing of each module may be provided in the frame of the regular dodecahedron system.

  Next, specific examples of module functions will be described below.

  When one of the faces of the regular dodecahedron 12 shown in FIG. 2A is placed on a flat floor, the arrangement of 12 modules is as follows. That is, there is one module whose module bottom is arranged on the top, five modules whose module bottom faces diagonally upward, five modules whose module bottom faces diagonally downward, and one module whose module bottom contacts the floor. Become one.

  In consideration of the positional relationship and the presence or absence of an interface when twelve modules are set in a three-dimensional circuit module as described above, the functions of some modules can be set as follows, for example. .

  An image interface is connected to the outer surface of the front lower left and front right lower modules. In addition, an acoustic interface and an acceleration / posture sensor are attached to the rear left lower and rear right lower modules. The lower module is fed with signals from temperature, crash, and tactile sensors, and outputs signals to the actuators to receive its feedback signals.

  Next, the configuration of each module will be described with reference to FIGS. 3A, 3B, 4A, 4B, and 4C.

  FIG. 3A is a view of the pentagonal pyramid housing 201 of the module viewed from the apex of the pentagonal pyramid, and FIG. 3B is a cross-sectional view taken along the line I-I in FIG. is there.

  As shown in FIG. 3A, the module has a pentagonal pyramid-like casing 201 in which the portion 5 including the apex is cut off, and a pentagonal planar shape in accordance with the shape of the casing 201. It consists of three different types of substrates 1, 2, and 3.

  The casing 201 is formed of a triangular plate-shaped resin or ceramic on the side surfaces 4a to 4e, and the bottom surface 6 is formed of a pentagonal plate-shaped resin or ceramic. A solid similar to a pentagonal pyramid is formed so that the plates 4 a to 4 e and 6 surround the inside of the housing 201. Note that only a pentagonal pyramid-like frame (frame) may be formed using a thin line. Further, the bottom surface 6 of the module and the lowermost substrate 1 may be shared.

  Further, as shown in FIGS. 3A and 3B, the casing 201 has a three-dimensional shape similar to a pentagonal pyramid in which the tip portion 5 including the apex of the pentagonal pyramid is cut. When the casing 201 is set in the system, the light distribution means is disposed in the cutout portion 5. Signals can be exchanged between arbitrary modules through the tip portions of all the modules set by the light distribution means arranged in the cut section 5.

  As shown in FIG. 3B, the substrates 1, 2, and 3 are an optical interface substrate 3, a CPU (Center Processing Unit) substrate 2, and a memory substrate 1 from the top. 4A, 4B, and 4C show the optical interface board 3, the CPU board 2, and the memory board 1, respectively, and are views of the boards as viewed from above. Although not shown in FIG. 3B, wiring on the surface of each substrate, a wiring connection layer connecting the substrates shown in FIG. 5, a wiring substrate, and the like are formed.

  As a material for the optical interface substrate 3, the CPU substrate 2, and the memory substrate 1, a metal such as kovar having good thermal conductivity and a thermal expansion coefficient close to that of the semiconductor chip, or an insulating material such as alumina or glass epoxy is used.

  The memory substrate 1 has a memory semiconductor chip 1a and the like mounted on the upper surface of the substrate. On the CPU board 2, semiconductor processor chips 2a, 2b and 2c are mounted on the upper surface of the board.

  The optical interface substrate 3 includes a semiconductor chip 3c on which an electric signal processing circuit that performs at least parallel / serial conversion and modulates the light emitting element is formed on the lower surface of the substrate, and a light emitting element that converts the processed electric signal into light. 3a, a light receiving element 3b for converting an optical signal into an electric signal, and a semiconductor chip 3d on which an electric signal processing circuit for demodulating the converted electric signal and performing serial / parallel conversion are mounted. Furthermore, openings 7a and 7b are formed in the optical interface substrate at a position corresponding to the light emitting area of the light emitting element 3a and a position corresponding to the light receiving area of the light receiving element 3b. As the light emitting element 3a, for example, a surface emitting laser or a single unit or an array of light emitting diodes (LED) can be used. Further, as the light receiving element 3b, a single light receiving diode or an array can be used. As a result, the communication capacity can be increased without significantly increasing the volume in the module.

  The mounting of the semiconductor chip on the substrate is not limited to the method described above, and may be on the upper surface or the lower surface of the substrate.

  Next, with reference to FIG. 5, the details of the wiring connection method in each substrate and between the substrates, and a more detailed internal configuration will be described.

  As shown in FIG. 5, a wiring board 11b is interposed between the optical interface board 3 and the CPU board 2, and wiring is further provided between the optical interface board 3 and the wiring board 11b and between the CPU board 2 and the wiring board 11b. Connection layers 12d and 12c are interposed. The wiring connection layers 12d and 12c interconnect the semiconductor chip 3b mounted on the optical interface substrate 3 and the semiconductor chip 2b mounted on the CPU substrate 2 and the wiring formed on the wiring substrate 11b by vias.

  Further, a wiring board 11a is interposed between the memory board 1 and the CPU board 2, and wiring connection layers 12b and 12a are further interposed between the memory board 1 and the wiring board 11a and between the CPU board 2 and the wiring board 11a. is doing. The wiring connection layers 12b and 12a interconnect the semiconductor chip 1a mounted on the memory substrate 1 and the semiconductor chip 2c mounted on the CPU substrate 2 and the wiring formed on the wiring substrate 11a by vias.

  Further, the wiring board 11b between the optical interface board 3 and the CPU board 2 and the wiring board 11a between the memory board 1 and the CPU board 2 are interconnected by the wiring connection layer 12e through the through hole of the CPU board 2. Yes.

  Further, the heat pipe 13 is mounted over the entire three substrates 1, 2 and 3 through through holes formed in the three substrates 1, 2 and 3. Further, a heat sink 14 is attached to the entire lower surface of the memory substrate 1. In addition, a mechanism may be provided in which air or liquid is allowed to flow through the pipe or is circulated to cool the pipe. In this case, a pump created by MEMS (Micro Electro Mechanical System) can be used. Further, a material with good heat dissipation may be used for the plate material constituting the housing, and a mechanism for transmitting heat to the housing may be provided to dissipate the heat. The inside of the module is cooled by these heat pipes and heat radiating plates.

  In addition, external terminals 15 are formed through holes that penetrate the memory substrate 1 and the heat sink 14. The external terminal 15 is connected to the wiring board 11a between the memory board 1 and the CPU board 2 by the wiring connection layer 12d.

  As the wiring boards 11a and 11b, generally used wiring boards, Teflon (registered trademark), epoxy-based or ceramic single-layer or multilayer wiring boards are used.

  In addition, the insulating material of the wiring connection layers 12a to 12e is required to have flexibility to absorb thermal stress and mechanical vibration stress, and the material is cut to a size smaller than the size of the semiconductor chip, for example, polybutadiene, polyisoprene. Further, synthetic rubber such as silicone rubber, polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), and the like can be used. In the wiring connection layers 12a to 12e, vias are buried in via holes formed by a photolithography technique in thick films made of these materials.

  It is also possible to mount an optical device on the substrate and perform optical communication within the module using an optical waveguide.

  Further, at least one of the wireless transmission unit and the reception unit may be mounted on one or more of the 12 modules. This enables communication between the three-dimensional circuit module and the outside. In addition, since communication is performed using optical signals in the three-dimensional circuit module and does not hinder microwave to millimeter wave band communication, wireless transmission means and reception means are provided within the module or between modules, and within the three-dimensional circuit module. It is also possible to use wireless communication via the same part together.

  Each module may be equipped with a fuel cell having a power generation function. In this case, a part of the fuel may be used as a refrigerant by using methanol as the fuel. As a result, even if the number of installed lines is large, the power is used only for the necessary lines, so that there is no overhead required for switching / multiplexing, so that the power consumption can be greatly reduced as a whole.

  As described above, according to the first embodiment of the present invention, the three-dimensional circuit module includes a plurality of modules including the pyramid-shaped casing 201 and the apexes of the pyramids are made to coincide with each other, and the bottom surface of each module. 6 is configured such that it can be set so as to constitute an arbitrary surface of the polyhedron 101.

  Therefore, when each module is configured for each function and one system is configured with a plurality of modules, the system shape is a three-dimensional shape represented by a polyhedron, or a three-dimensional shape represented by a part of the polyhedron. The system becomes very compact.

  In addition, as described above, when the three-dimensional circuit module is set so that the apexes of the pyramids of each module coincide with each other and the bottom surface of each module constitutes an arbitrary surface of the polyhedron, It has an optical distribution means 21 that can distribute an optical signal emitted from the module to any other module.

  In this case, if the tip portion including the apex of the pentagonal pyramid of the module is excised and the light distribution means is arranged in the excised portion, signals can be exchanged through the tip portions of all the modules that are set. Therefore, when signals are exchanged between arbitrary modules, signals can be exchanged between all modules by optical communication, and the signal paths are short and substantially equal between any modules. As a result, the system of the present invention can handle a sufficient amount of communication at high speed.

  Further, in the event of a failure, the system can be restored simply by replacing the failed module found by the diagnostic program. Further, it is not necessary to perform complicated connection between modules, and the module can be inserted and removed from the outside of the polyhedron, so that maintenance and updating are easy.

  In the above, three layers of the substrates 1, 2, and 3 are provided in the module, but one or more arbitrary plural substrates can be provided within a practical range.

  Moreover, although the case where the shape of the system is a regular dodecahedron 101 has been described, the present invention can also be applied to a regular polyhedron having a regular tetrahedron or more and a practical polyhedron.

  Further, not limited to regular polyhedrons, for example, five or hexagonal pyramids may be deformed and mixed to form a more free solid. Alternatively, for example, a quadrangular pyramidal module that is easy to handle in a spherical or polyhedral frame may be separated and preferably fixed with the apex inside.

(Second Embodiment)
Next, the specific light distribution means 21 attached to the central region of the regular polyhedron of the three-dimensional circuit module will be described with reference to FIGS. The following is a specific example of the optical distribution means according to the second embodiment.

(1) Light Scatterer A spherical structure having a diameter around the diameter of the light beam from the light-emitting element, which is produced by a method such as agglomeration of glass powder at a temperature about the softening point, is used. A configuration in which the LED is directly modulated is suitable, and speckle is likely to occur when a high-intensity LED or LD with high coherence is used. Therefore, attention should be paid to the particle size of the material, the firing method, and the shape of the structure.

  Each module directly modulates the LED and transmits the light, and the light is emitted as a light beam by a simple optical system to a single light scatterer held at the center of the polyhedron from the direction of each module. As shown in FIG. 7, the light scatterer 21a scatters this light approximately isotropically, and the scattered light can be received by all modules. In this way, this method realizes bus-type connection.

(2) Light Reflector As shown in FIG. 8, the light reflector 21b is turned upside down with the side surface of a small shallow pyramid having a half of the angle between the bottom surface 6 of the module and the bottom surface of the adjacent module as a mirror surface. Hold near the apex of each pyramid.

  Note that the light reflector 21b does not necessarily have to be turned upside down, but in that case, it should be noted that the optical paths intersect.

  By transmitting a single transmission beam uniformly on the mirror surface and dividing it, transmission to adjacent modules becomes possible. In addition, if a large number of transmitters are provided in each module and each beam is irradiated on the square face of the pyramid, dedicated wiring paths can be individually provided in the adjacent modules.

  By using a partial polyhedral mirror instead of a pyramidal mirror, it is possible to transmit to a larger number of modules such as adjacent modules, adjacent modules, and the like.

(3) Prism As shown in FIGS. 9A, 9B, and 9C, the prisms 21c, 21d, and 21e that are trapezoidal, concave, or convex are opposed to each other with the center of the polyhedron as a boundary. It can be transmitted to the module and the module adjacent to it.

(4) Hologram A hologram is held above the light emitting element of each module, and the transmission light from each module is distributed to an arbitrary module. Preferably, as shown in FIG. 10, a hologram 21f is directly mounted on the light emitting surface of the light emitting element 3a of each module.

  The hologram 21f can be produced by a calculation process, or can be produced by irradiating and exposing a light beam split from a single laser on the assumed optical path from both the transmitting side and the light receiving unit side of the receiving side module toward the hologram master. it can.

(5) Assembly of optical waveguide The optical waveguide is connected from the light emitting element to the light receiving element of each module via the star coupler. On the light receiving element, it is coupled by a directional coupler to perform photoelectric conversion.

(6) Light distribution means according to the above combination The above-described light scatterer and light reflector can be combined. It is desirable to hold the light scatterer at the center of the polyhedron. In this case, even if the light reflector is held on the central axis of each pyramid, for example, by providing a window that transmits light at the center Can be shared with light scatterers.

  Further, a prism and a light reflector (or a half mirror) are combined to use straight light and reflected light. Thereby, it can transmit to the module which opposes the module which performs transmission, the module which adjoins the module which performs transmission, the module which adjoins, and the module which adjoins the module which opposes.

  Also, other optical distribution means can be arbitrarily selected and shared. In this case, it is necessary only from the position away from the central axis of each pyramid so that the light beam delivered by the light delivery means of one module is not blocked by the delivery means of the other module, and hence from the center of the polyhedron. Hold in each separate pyramid.

  Next, an operation method of the three-dimensional circuit module will be described with reference to FIGS. FIG. 6 is a schematic diagram of a three-dimensional circuit module for explaining an operation method.

  Of the modules 1 to 12, only the modules 1, 6, 7, and 12 are shown in FIG. Further, a light scatterer is used as the light distribution means.

  Light including a processing signal and a code representing a transmission destination is emitted from the light emitting element mounted on the optical interface board of the module 7 toward the light distribution means. The number of destinations may be one, or all modules 2 to 12 may be used.

  The light is scattered by the light distribution means and distributed to the modules 2 to 12.

  In each of the modules 2 to 12, the distributed light enters the light receiving element and is converted into an electric signal. Then, the transmission destination is discriminated from the converted electric signal by the electric circuit connected to the light receiving element, and if applicable, the signal is taken in and sent to the next processing circuit. If not, the signal is not sent to the subsequent processing circuit.

  In the corresponding module among the modules 2 to 12, signal processing is performed by the subsequent processing circuit based on the transmitted electrical signal.

  As described above, according to the three-dimensional circuit module of the second embodiment, one-to-one and one-to-many communication is possible.

  Hereinafter, various aspects of the present invention will be collectively described as supplementary notes.

(Appendix 1)
At least an optical communication means and a signal processing circuit are housed in a pyramid-shaped casing, the bottom of which forms a polyhedron when the apexes of the pyramids of the plurality of casings are arranged to coincide. An optical signal emitted from any one of the modules when the plurality of modules are set so that the apexes of the pyramids of each module coincide with each other and the bottom surface of each module forms an arbitrary surface of a polyhedron. A three-dimensional circuit module, comprising: an optical distribution means capable of distributing the light to any other module.

(Appendix 2)
The three-dimensional circuit module according to appendix 1, wherein the number of modules smaller than the number of modules constituting the complete polyhedron can be set.

(Appendix 3)
The optical communication means includes at least an electric signal processing circuit for performing parallel / serial conversion, a light emitting means for converting the processed electric signal into light, a light receiving means for converting the optical signal into an electric signal, and the conversion The three-dimensional circuit module according to any one of appendices 1 and 2, characterized in that the three-dimensional circuit module comprises an electrical signal processing circuit that performs serial / parallel conversion of the electrical signal.

(Appendix 4)
The pyramid constituting each module is cut off at a portion including its apex, and the light distribution means is provided in a space formed by the cut portion when each module is set. The three-dimensional circuit module according to any one of Supplementary notes 1 to 3.

(Appendix 5)
The three-dimensional circuit module according to any one of appendices 1 to 4, wherein the light distribution means is a light scatterer.

(Appendix 6)
The three-dimensional circuit module according to any one of appendices 1 to 4, wherein the light distribution means is a light reflector.

(Appendix 7)
The three-dimensional circuit module according to any one of appendices 1 to 4, wherein the light distribution means is a prism that refracts or reflects light.

(Appendix 8)
The three-dimensional circuit module according to any one of appendices 1 to 4, wherein the light distribution means is a hologram.

(Appendix 9)
The three-dimensional circuit module according to any one of appendices 1 to 4, wherein the light distribution means is an aggregate of optical waveguides.

(Appendix 10)
The light distribution means is a combination of at least two or more of a light scatterer, a light reflector, a prism, a hologram, and an aggregate of optical waveguides. The three-dimensional circuit module described in 1.

(Appendix 11)
In the module, the optical communication means and the signal processing circuit are mounted and housed on separate substrates, and from the side closer to the apex of the pyramid, the substrate on which the optical communication means is mounted, and the signal processing 11. The three-dimensional circuit module according to any one of appendices 1 to 10, wherein a substrate on which a circuit is mounted is arranged in a layered structure.

(Appendix 12)
The three-dimensional circuit module according to appendix 11, wherein the signals are transmitted and received between the substrates directly, electrostatically or electromagnetically by electrical wiring, or by light.

(Appendix 13)
13. The three-dimensional circuit module according to any one of appendices 11 and 12, wherein one or more connection layers for assisting transmission / reception of signals between the substrates are interposed between the substrates.

(Appendix 14)
The three-dimensional circuit module according to any one of appendices 1 to 13, wherein the module includes a pipe through which a cooling medium flows.

(Appendix 15)
The three-dimensional circuit module according to any one of appendices 1 to 14, wherein the module includes a transmission / reception device for performing wireless communication within the module or between the modules.

(Appendix 16)
The three-dimensional circuit according to any one of appendices 1 to 14, wherein at least one of the modules includes a transmission / reception device for wirelessly communicating with the outside of the three-dimensional circuit module. module.

(Appendix 17)
The three-dimensional circuit module according to any one of appendices 1 to 16, wherein at least one of the modules includes power generation means.

It is a schematic diagram which shows the three-dimensional circuit module which concerns on the 1st Embodiment of this invention. (A) is a perspective view which shows the structure of the three-dimensional circuit module which concerns on the 1st Embodiment of this invention. (B) is a perspective view which shows a flame | frame among the structures of the three-dimensional circuit module which concerns on the 1st Embodiment of this invention. (A) is a top view which shows the structure of one module which comprises the three-dimensional circuit module which concerns on the 1st Embodiment of this invention. (B) is the II sectional view taken on the line of (a). FIG. 4A is a top view showing a configuration of an optical interface board in one module constituting the three-dimensional circuit module according to the first embodiment of the present invention. (B) is a top view which similarly shows the structure of CPU board | substrate. (C) is a top view showing the configuration of the memory substrate. It is sectional drawing which shows the structure in one module which comprises the three-dimensional circuit module which concerns on the 1st Embodiment of this invention. It is a schematic diagram which shows the optical delivery method of the three-dimensional circuit module which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the light scatterer which is the light delivery means of the three-dimensional circuit module which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the reflector of the light which is a light delivery means of the three-dimensional circuit module which concerns on the 2nd Embodiment of this invention. (A), (b), (c) It is a figure which shows the prism which is a light delivery means of the three-dimensional circuit module which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the hologram which is a light delivery means of the three-dimensional circuit module which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

1 ... Memory board,
1a, 2a-2c, 3a-3d ... semiconductor chip 2 ... CPU substrate,
3 ... Optical interface board,
4a-4e ... the side of the module,
5 ... Resection part,
6 ... the bottom of the module,
7a, 7b ... opening,
11a, 11b ... wiring board,
12a-12e ... wiring connection layer,
13 ... Heat pipe,
14 ... heat sink,
15 ... External terminal,
21: Optical distribution means,
21a ... light scatterer,
21b ... light reflector,
21c, 21d, 21e ... prism,
21f ... Hologram,
101 ... polyhedron (regular dodecahedron),
201: A housing.

Claims (5)

At least an optical communication means and a signal processing circuit are housed in a pyramid-shaped casing, the bottom of which forms a polyhedron when the apexes of the pyramids of the plurality of casings are arranged to coincide. Multiple modules,
When each module is set so that the apexes of the pyramids of each module coincide with each other and the bottom surface of each module constitutes an arbitrary surface of a polyhedron, optical signals emitted from any one of the modules are A three-dimensional circuit module comprising: an optical distribution unit capable of distributing to any other said module.   2. The three-dimensional circuit module according to claim 1, wherein a number of the modules smaller than the number of modules constituting the complete polyhedron can be set.   The pyramid constituting each module is cut off at a portion including its apex, and the light distribution means is provided in a space formed by the cut portion when each module is set. The three-dimensional circuit module according to any one of claims 1 and 2.   In the module, the optical communication means and the signal processing circuit are mounted and housed on separate substrates, and from the side closer to the apex of the pyramid, the substrate on which the optical communication means is mounted, and the signal processing The three-dimensional circuit module according to any one of claims 1 to 3, wherein the substrate on which the circuit is mounted is arranged in a layered structure.   5. The three-dimensional circuit module according to claim 4, wherein the transmission / reception of signals between the substrates is performed directly, electrostatically or electromagnetically by electrical wiring, or by light.

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