JP2007264583A - Organic el panel and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL panel that suppresses the exfoliation of a conductive layer in a crossover part. <P>SOLUTION: An organic EL panel 100 includes an element substrate 101 having a plurality of organic EL elements 109 formed thereon, a sealant 112 provided so as to surround the organic EL elements, and a sealing substrate 110 adhered to the element substrate 101 by the sealant 112 and sealing the organic EL elements 109; and the organic EL panel 100 has the crossover part 115 disposed in a space formed by the element substrate 101, the sealing substrate 110, and the sealant 112. The crossover part 115 has aging connection wiring 116 for supplying an aging voltage from the outside, and the aging connection wiring 116 is connected to a common leading wiring 105 via a contact hole 118 provided in an insulating layer 117. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an organic EL (Electro Luminescence) panel and a manufacturing method thereof, and more particularly to an organic EL panel including an aging treatment and a manufacturing method thereof.

  An organic EL panel used in an organic EL display device has a plurality of anode electrodes arranged in parallel on a glass substrate, a plurality of cathode electrodes arranged in parallel in a direction perpendicular to the anode electrode, It has a structure in which an EL layer is sandwiched. The intersection of the anode electrode and the cathode electrode is one pixel. When the organic EL panel having pixels arranged in a matrix is driven in a simple matrix, for example, the anode electrode is a segment electrode and the cathode electrode is a common electrode.

  The light emission luminance of the organic EL element has a characteristic that it greatly decreases in the initial stage and then gradually decreases. Therefore, in order to remove the change in the light emission characteristics during the initial light emission and stabilize the light emission characteristics, a lifetime aging process is performed in which voltage pulses are applied to the anode electrode and the cathode electrode at the stage of the organic EL panel. The organic EL panel whose luminance has been lowered is set to a new initial state that is stabilized, and subsequent changes in luminance with time are suppressed.

  In addition, when the organic EL display device is manufactured, foreign matter is mixed in the organic EL layer disposed between the anode electrode and the cathode electrode, or a protrusion is generated on the anode electrode, and the protrusion enters the organic EL layer. As a result, a defective portion may occur. When electric charges concentrate on the defective portion, there is a problem that a short circuit occurs between the anode electrode and the cathode electrode, leading to deterioration of element characteristics and non-light emission. In order to solve such a problem, a short-circuit aging process is performed in which a pulse-like reverse bias voltage is applied in advance to a defective portion in which foreign matter is mixed to passivate the defective portion.

  Generally, when manufacturing such an organic EL panel, a plurality of organic EL panels are formed on one mother substrate. In order to efficiently execute the short-circuit aging process and the lifetime aging process, the aging process may be collectively performed on a plurality of organic EL panels before the mother substrate is cut and separated for each organic EL panel. preferable. For this reason, normally, an aging wiring for applying an aging voltage to each of the plurality of organic EL panels is formed on the mother substrate on which the plurality of organic EL panels are formed.

  In recent years, downsizing of organic EL panels has been desired along with downsizing of electronic devices. For this reason, a drive circuit may be mounted on a substrate constituting an organic EL panel using a COG (Chip On Glass) mounting technique. FIG. 16 is a diagram schematically showing a configuration of a conventional COG type organic EL panel 10. As shown in FIG. 16, in a conventional organic EL panel 10, a driver IC 12 is mounted on a substrate 11. On the substrate 11, segment electrodes 13 are formed in the vertical direction, and common electrodes 14 are formed in the horizontal direction.

  A connection terminal (not shown) for supplying a display signal to the segment electrode 13 is provided on the substrate 11 in the vicinity of the upper side of the driver IC 12. The segment electrode 13 is connected to this connection terminal via the segment routing wiring 15. In addition, connection terminals (not shown) for supplying scanning signals to the common electrode 14 are provided in the vicinity of both the left and right sides on the back side of the driver IC 12. The common electrode 14 is connected to this connection terminal via a common lead wiring 16. Further, a connection terminal 17 for connecting a flexible substrate for supplying various control signals necessary for display is provided in the vicinity of the lower side of the driver IC 12. In such a case, it is difficult to form an aging wiring for performing an aging process at once on the segment electrodes 13 of the plurality of organic EL panels on the mother substrate.

In order to solve this problem, as shown in FIGS. 17 to 19, a crossover portion 18 is provided in a peripheral region outside the display region where the organic EL element is disposed on the substrate 11, and the common routing wiring 16 and the common aging are provided. The aging connection wiring 20 for connecting to the wiring 19 is moved over so as not to be in contact with the other common routing wiring 16, and a plurality of organic EL panels are collectively aged in the state of the mother substrate. A technique has been proposed (see Patent Document 1). As shown in FIGS. 18 and 19, the aging connection wiring 20 and the segment aging wiring 21 intersect with each other through the insulating layer 23. The common routing wiring 16 and the aging connection wiring 20 are connected through a contact hole 22 provided in the insulating layer 23.
JP 2005-164679 A

  By the way, in the aging process, a voltage is applied to the aging wiring, and a current flows between the segment electrode 13 and the common electrode 14. At this time, current concentrates on a defective portion such as a foreign substance in the organic EL layer, and Joule heat is generated. As described above, when the common routing wiring 16 and the aging connection wiring 20 are connected via the contact hole 22 provided in the insulating layer 23, the common routing wiring 16 and the aging connection wiring 20 in the contact hole 22 are connected. There is also a problem that Joule heat is generated at the interface between the aging connection wiring 20 and the aging connection wiring 20 is deformed or its film quality is deteriorated.

  Further, in the manufacturing process of the organic EL panel 10, after performing the aging process, the mother substrate is cut and separated for each organic EL panel, and the connection terminal 17 is formed for mounting the drive circuit and the like. Perform ultrasonic cleaning of the surrounding area. In the ultrasonic cleaning, the organic EL panel in the cleaning liquid is cleaned by cavitation in which extremely small bubbles or cavities are rapidly formed in the cleaning liquid or are severely collapsed.

  For this reason, when the aging connection wiring 20 has deteriorated as described above, there is a problem that the aging connection wiring material is peeled off. In particular, the peripheral region where the crossover portion 18 is provided is not covered with the sealing substrate and is exposed. For this reason, the cleaning liquid directly contacts the aging connection wiring 20. Therefore, in the crossover portion 18, such a problem is particularly remarkable in the contact hole 22 portion where the aging connection wiring 20 and the common routing wiring 16 are in contact with each other. If the peeled conductive material floats in the cleaning apparatus and adheres to the wiring of another organic EL panel that flows thereafter, there is a possibility that a leak failure occurs in which adjacent wirings are short-circuited.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an organic EL panel that suppresses peeling of a conductive layer in a crossover portion and a method for manufacturing the same.

  The organic EL panel according to the first aspect of the present invention is disposed between the first electrode, the second electrode facing the first electrode, and the first electrode and the second electrode. An element substrate having an organic EL element having a light emitting layer formed thereon, a sealing material provided so as to surround the organic EL element, and the sealing material being adhered to the element substrate to seal the organic EL element An organic EL panel including a sealing substrate to be stopped, including a crossover portion disposed in a sealing region formed by the element substrate, the sealing substrate, and a sealing material, A first routing wiring connected to the first electrode; an aging wiring disposed on a side of the first routing wiring and supplying an aging voltage to the second electrode from the outside of the organic EL panel; The first routing arrangement And an insulating layer provided on the aging wiring, a contact hole disposed in the sealing region and provided in the insulating layer, provided on the insulating layer, and through the contact hole. And a conductive layer connected to one lead wiring. Thereby, it can suppress that the conductive layer on the contact hole which is a degradation part of a crossover part peels.

  The organic EL panel according to a second aspect of the present invention is the organic EL panel described above, wherein the aging wiring and the first electrode are separated by the insulating layer. The present invention is particularly effective in such a case.

  The organic EL panel according to a third aspect of the present invention is the above-described organic EL panel, wherein the conductive layer is separately formed corresponding to each of the plurality of first routing wires. The present invention is particularly effective in such a case.

  The organic EL panel according to a fourth aspect of the present invention is the above-described organic EL panel, wherein the conductive layer is formed of the same material as the second electrode. Thereby, the increase in a manufacturing process can be suppressed.

  The organic EL panel according to a fifth aspect of the present invention is the organic EL panel described above, further comprising a drive circuit mounted on one side of the element substrate, wherein the first electrode is the first routing wiring. And the second electrode is connected to the drive circuit via a second routing wiring. The present invention is particularly effective in such a case.

  An organic EL panel manufacturing method according to a sixth aspect of the present invention includes: an organic EL element having a light emitting layer disposed between a first electrode and a second electrode on an element substrate; A first routing wiring connected to the first electrode, a second routing wiring connected to the second electrode, and a first aging wiring connected to the first routing wiring via an aging connection wiring And the second aging wiring connected to the second routing wiring, the aging connection wiring and the second aging wiring intersect via an insulating layer, and the first routing wiring and the aging connection wiring And a crossover portion connected through a contact hole provided in the insulating layer, and a sealing substrate is disposed opposite to the organic EL element forming surface side of the element substrate, and the organic EL element, Said The sover portion and the contact hole are sealed so as to be disposed in a sealing region formed by the element substrate and the sealing substrate, and an aging voltage is applied to the first aging wiring and the second aging wiring. Is applied to the element substrate and the sealing substrate to cut the connection between the first aging wiring and the first electrode, and the second aging wiring and the second electrode. After the aging process, the cleaning process is performed. Thereby, it can suppress that the degradation part of the crossover part accompanying an aging process peels by washing | cleaning.

  The organic EL panel according to the seventh aspect of the present invention is arranged between the first electrode, the second electrode facing the first electrode, and the first electrode and the second electrode. An element substrate having an organic EL element having a light emitting layer formed thereon, a sealing material provided so as to surround the organic EL element, and the sealing material being adhered to the element substrate to seal the organic EL element An organic EL panel including a sealing substrate to be stopped, including a crossover portion disposed in a sealing region formed by the element substrate, the sealing substrate, and a sealing material, A first routing wiring connected to the first electrode; an aging wiring disposed on a side of the first routing wiring and supplying an aging voltage to the second electrode from the outside of the organic EL panel; The first routing arrangement And an insulating layer provided under the aging wiring, a contact hole disposed in the sealing region and provided in the insulating layer, and provided under the insulating layer, through the contact hole It has a conductive layer connected to the first routing wiring. Thereby, it can suppress that the conductive layer on the contact hole which is a degradation part of a crossover part peels. Furthermore, since the number of contact holes can be reduced, the occurrence of defects in the contact holes can be reduced.

  The organic EL panel according to an eighth aspect of the present invention is the above-described organic EL panel, wherein a rib is provided around the aging wiring, and the aging wiring and the first electrode are separated by the rib. Is formed. The present invention is particularly effective in such a case.

  An organic EL panel according to a ninth aspect of the present invention is the above-described organic EL panel, wherein the conductive layer is formed corresponding to each of the plurality of first routing wirings. The present invention is particularly effective in such a case.

  The organic EL panel according to a tenth aspect of the present invention is the above-described organic EL panel, wherein the aging wiring is formed of the same material as the first electrode. Thereby, the increase in a manufacturing process can be suppressed.

  An organic EL panel according to an eleventh aspect of the present invention is disposed between a first electrode, a second electrode facing the first electrode, and the first electrode and the second electrode. An element substrate having an organic EL element having a light emitting layer formed thereon, a sealing material provided so as to surround the organic EL element, and the sealing material being adhered to the element substrate to seal the organic EL element An organic EL panel including a sealing substrate to be stopped, including a crossover portion disposed in a sealing region formed by the element substrate, the sealing substrate, and a sealing material, A first routing wiring connected to the first electrode; an aging wiring disposed on a side of the first routing wiring and supplying an aging voltage to the second electrode from the outside of the organic EL panel; The first routing An insulating layer provided under a line; a contact hole provided in the sealing region; provided in the insulating layer; and provided on the insulating layer, the first routing through the contact hole. And a conductive layer connected to the wiring. Thereby, it can suppress that the conductive layer on the contact hole which is a degradation part of a crossover part peels. In addition, since the number of contact holes can be reduced, the occurrence rate of defects in the contact holes can be suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the organic electroluminescent panel which suppresses peeling of the conductive layer of a crossover part, and its manufacturing method can be provided.

Embodiment 1 FIG.
An organic EL panel according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing an example of the configuration of the organic EL panel according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line AA in FIG. Here, an organic EL display panel will be described as an example of the organic EL panel, but the present invention is not limited to the organic EL display panel having the configuration illustrated. In FIG. 1, the sealing substrate 110 is not shown for the sake of explanation. In the present embodiment, the anode electrode is described as a segment electrode and the cathode electrode is a common electrode, but the reverse may be possible.

  As shown in FIGS. 1 and 2, the organic EL panel 100 according to the present embodiment includes an element substrate 101, a segment electrode 102, a segment routing wiring 103, a common electrode 104, a common routing wiring 105, an insulating layer 106, and an opening. 107, an organic EL layer 108, an organic EL element 109, a sealing substrate 110, a water capturing material 111, a sealing material 112, a driver IC 113, an input signal line 114, a crossover portion 115, and an aging connection wiring 116.

  The segment electrode 102 is made of a transparent conductive material such as ITO (Indium Tin Oxide), and is formed on the element substrate 101. As shown in FIG. 1, the plurality of segment electrodes 102 are formed in parallel at regular intervals. Further, on the element substrate 101, segment routing wirings 103 extending to the respective segment electrodes 102 are provided. Further, on the element substrate 101, common routing wirings 105 connected to respective common electrodes 104 described later are provided. The common routing wiring 105 is formed corresponding to the common electrode 104 and is formed in a direction perpendicular to the segment electrode 102. The segment lead-out wiring 103, the common lead-out wiring 105, and the like are formed from a laminated film of ITO as a lower layer and a metal material as an upper layer serving as a connection portion in order to reduce resistance.

  An insulating layer 106 for partitioning pixels is formed on the element substrate 101 on which the segment electrode 102, the segment routing wiring 103, and the common routing wiring 105 are formed. The insulating layer 106 is provided to ensure insulation between the segment electrode 102 and a common electrode 104 described later. The insulating layer 106 is formed at the same time as the insulating layer 117 of the crossover portion 115 described later. The insulating layer 106 is made of an insulating material such as polyimide. The insulating layer 106 is provided with an opening 107 corresponding to an intersection position between the segment electrode 102 and a common electrode 104 described later, that is, a position to be a pixel. That is, the insulating layer 106 serves to define the opening 107 where the organic EL layer 108 and the segment electrode 102 are in contact with each other.

  Although not shown in FIGS. 1 and 2, a partition 120 is formed on the insulating layer 106 as shown in FIG. FIG. 4 is a diagram for explaining the crossover portion 115 and will be described in detail later. The partition 120 is formed in a desired pattern before the common electrode 104 is formed by vapor deposition or the like in order to form the common electrode 104 separately. The partition wall 120 is provided perpendicular to the segment electrode 102 and parallel to the common electrode 104. In order to make the separation of the common electrode 104 more reliable, the partition wall 120 has a reverse taper structure. In other words, the cross section is formed so as to increase as the distance from the element substrate 101 increases. The partition 120 in the display area is formed simultaneously with the wall structure 119 of the crossover portion 115.

  The organic EL layer 108 is disposed in a predetermined size on the segment electrode 102, the insulating layer 106, and the partition 120 described above. The organic EL layer 108 has, for example, a configuration in which a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked.

  The common electrode 104 is made of a conductive material such as aluminum having light reflectivity, and is provided on the organic EL layer 108. Since the common electrode 104 is separated by the partition 120, the common electrode 104 is disposed between the partitions 120. Therefore, the common electrode 104 is provided perpendicular to the segment electrode 102. A position where the segment electrode 102 and the common electrode 104 intersect is a pixel. The organic EL element 109 includes a segment electrode 102, an organic EL layer 108, and a common electrode 104 that are sequentially stacked on the element substrate 101. An area composed of a plurality of pixels is a display area. The common electrode 104 is formed at the same time as the aging connection wiring 116 which is a conductive layer of a crossover portion 115 described later. Thereby, the increase in a manufacturing process can be suppressed.

  The sealing substrate 110 is provided so that moisture and oxygen do not enter the panel. As the sealing substrate 110, in addition to metals such as stainless steel, aluminum, or an alloy thereof, one or two or more types such as glass and acrylic resin can be used. On the surface of the sealing substrate 110 facing the pixels, a recess for arranging the water capturing material 111 is formed.

  The sealing substrate 110 and the element substrate 101 are fixed to each other through a photocurable sealing material 112. As the sealant 112, an ultraviolet curable epoxy sealant having low permeability such as moisture can be used. The sealing material 112 is formed so as to surround the display area. The sealing material 112 fixes the sealing substrate 110 and the element substrate 101 and seals the space including the display region. Therefore, the organic EL element 109 is disposed in an airtight space (hereinafter referred to as a sealing region) formed by the element substrate 101, the sealing substrate 110, and the sealing material 112.

  Further, a crossover portion 115 is provided outside the display area in the sealing area. That is, the sealing material 112 is disposed so that the crossover portion 115 is disposed in an airtight space formed by the element substrate 101, the sealing substrate 110, and the sealing material 112. The crossover portion 115 is connected to the common aging wiring 202 and the common aging wiring 202 so that each aging routing wiring 116 does not contact the adjacent common routing wiring 105 and the segment aging wiring 201 when performing an aging process in the manufacturing process of the organic EL panel 100. It is provided to connect the lead wiring 105. The configuration of the crossover portion 115 will be described in detail later.

  Further, a part of the segment routing wiring 103 and the common routing wiring 105, a driver IC 113 to be described later, and the like are disposed outside the airtight space formed by the element substrate 101, the sealing substrate 110, and the sealing material 112. The outside of the airtight space formed by the element substrate 101, the sealing substrate 110, and the sealing material 112 is defined as a peripheral region.

  In the airtight space, a water catching material 111 is provided for suppressing the influence of moisture and oxygen on the pixels and maintaining stable light emission characteristics. The water trapping material 111 is provided in a recess formed on the surface of the sealing substrate 110 facing the organic EL element 109. As the water catching material 111, an inorganic desiccant, an organic metal compound that is highly reactive with moisture, or a mixture of a solid hygroscopic agent in an inert liquid made of fluorine oil, etc. Can be used.

  A driver IC 113 is mounted on one side of the peripheral area of the element substrate 101. The driver IC 113 includes a common electrode driving circuit that supplies a common voltage to the common electrode 104 and a segment electrode driving circuit that supplies a display voltage to the segment electrode 102.

  The display voltage output terminal of the driver IC 113 and each segment electrode 102 are connected via a segment routing wiring 103. In addition, the common voltage output terminal and each common electrode 104 are connected via a common routing wiring 105. The driver IC 113 is supplied with various control signals, power, and the like necessary for display from the outside of the organic EL panel 100 via an input signal line 114 provided in the vicinity of the lower side in FIG. .

  Here, the organic EL panel substrate 200 used when manufacturing the organic EL panel 100 will be described with reference to FIG. FIG. 3 is a diagram showing a configuration of the organic EL panel substrate 200 according to the first embodiment. Since the driver IC 113 is mounted after the organic EL panel substrate 200 is cut for each organic EL panel 100, it is not yet mounted in the state shown in FIG. Therefore, in FIG. 3, the driver IC 113 is indicated by a dotted line.

  As shown in FIG. 3, in the organic EL panel substrate 200, a plurality of organic EL panels 100 are formed on one mother substrate. A segment aging wiring 201 and a common aging wiring 202 are formed on the mother substrate. The segment aging wiring 201 and the common aging wiring 202 are formed simultaneously with the segment routing wiring 103 and the common routing wiring 105.

  Further, the segment electrode 102 in each organic EL panel 100 is connected to the segment aging wiring 201 via the segment routing wiring 103 formed on the opposite side to the driver IC 113. Therefore, the same aging voltage can be supplied from the segment aging wiring 201 to each segment electrode 102 in all the organic EL panels 100.

  In addition, each common electrode 104 in each organic EL panel 100 is connected to the common aging wiring 202 via the common routing wiring 105 and the aging connection wiring 116 provided in the crossover portion 115. Each aging connection wiring 116 is not directly connected to the common electrode 104 but is electrically connected to the common electrode 104 via the common routing wiring 105. Therefore, an aging voltage can be supplied from the common aging wiring 202 to each common electrode 104 in all the organic EL panels 100. Thereby, an aging process can be collectively performed with respect to the some organic EL panel 100 provided on the mother board | substrate.

  Here, the configuration of the crossover portion 115 will be described with reference to FIGS. 4 and 5. FIG. 4 is a diagram illustrating a configuration of the crossover unit 115. FIG. 5 is a sectional view taken along line BB in FIG. In the crossover portion 115, an insulating layer 117 is formed so as to cover the segment aging wiring 201. The aging connection wiring 116 intersects the segment aging wiring 201 through the insulating layer 117. For this reason, the aging connection wiring 116 and the segment aging wiring 201 are not in contact with each other. An aging connection terminal 203 is formed in the common aging wiring 202. The aging connection wiring 116 is connected to the corresponding aging connection terminal 203. Therefore, the aging connection wiring 116 crosses the segment aging wiring 201 and the other common routing wiring 105 at the crossover portion 115 and electrically connects the common routing wiring 105 and the corresponding aging connection terminal 203.

  The connection between the segment aging wiring 201 and the segment electrode 102, and the connection between the common aging wiring 202 and the common electrode 104 are divided in the process of cutting the mother substrate into individual organic EL panels 100. In other words, all the common routing wirings 105 are electrically connected to the common aging wiring 202 via the aging connection wiring 116 at a portion discarded after the cutting process on the mother substrate. That is, all the common routing wirings 105 and the common aging wirings 202 are electrically connected outside the organic EL panel 100 finally obtained. After this cutting process, the driver IC 113 is mounted on the element substrate 101.

  As shown in FIG. 5, in the crossover portion 115, the common routing wiring 105, the common aging wiring 202, and the segment aging wiring 201 are formed on the element substrate 101. The common aging wiring 202 is extended from the outside of the sealing region to the inside of the sealing region. That is, the common aging wiring 202 is provided so as to intersect the sealing material 112. The segment aging wiring 201 and the common aging wiring 202 are made of ITO. An aging connection terminal 203 is provided in a part of the common aging wiring. The aging connection terminal 203 is made of a laminated film of ITO and a metal film. Further, as described above, the common routing wiring 105 is made of a laminated film of ITO and a metal film in order to reduce resistance.

  An insulating layer 117 is provided on the common routing wiring 105, the segment aging wiring 201, and the aging connection terminal 203 of the crossover portion 115. A first contact hole 118 a is formed at a position corresponding to the common routing wiring 105 in the insulating layer 117. A second contact hole 118b is formed at a position corresponding to the aging connection terminal 203.

  As shown in FIG. 4, a wall structure 119 formed in the same process as the partition wall 120 formed to separate and form the common electrode 104 in the display region is provided between the aging connection wirings 116. . The wall structure 119 has a reverse taper structure in the same manner as the partition walls described above in order to ensure the separation of the aging connection wiring 116. Further, a conductive material such as Al serving as the aging connection wiring 116 is provided on the insulating layer 117 and the wall structure 119 so as to cover the insulating layer 117. The wall structure 119 is separated and formed so that adjacent aging connection wirings 116 do not contact each other.

  The common aging wiring 202 is connected to the aging connection wiring 116 in the sealing region via the second contact hole 118a. The common routing wiring 105 is connected to the aging connection wiring 116 in the sealing region via the first contact hole 118a. Therefore, the common routing wiring 105 and the common aging wiring 202 are electrically connected by the aging connection wiring 116 through the first contact hole 118a and the second contact hole 118b. That is, the aging connection wiring 116 goes over the segment aging wiring 201 arranged on the side and the other common routing wiring 105 and electrically connects the corresponding common routing wiring 105 and the common aging wiring 202.

  Further, a seal material 112 is disposed on the side opposite to the display area of the crossover portion 115. Therefore, not only the organic EL element 109 but also the crossover portion 115 is disposed in a sealing region formed by the element substrate 101, the sealing substrate 110, and the sealing material 112. Therefore, the first contact hole 118a and the second contact hole 118b of the aging connection wiring 116 are also arranged in the sealing region. Also, the aging connection wiring 116 is formed in the sealing region.

  Especially at the first contact hole 118a and the second contact hole 118b of the aging connection wiring 116, that is, at the interface between the common routing wiring 105 and the aging connection wiring 116 and at the interface between the aging connection terminal 203 and the aging connection wiring 116. The aging connection wiring 116 is deformed or its film quality is deteriorated by Joule heat generated by the aging process.

  Thereafter, the mother substrate is cut and separated for each organic EL panel 100, and then the connection terminal portion is subjected to ultrasonic cleaning in order to mount the driver IC 113 and the like. In the ultrasonic cleaning, the organic EL panel in the solution is cleaned by cavitation in which extremely small bubbles or cavities are rapidly formed in the cleaning liquid or are severely collapsed.

  Conventionally, the crossover portion 115 is formed in the peripheral region and exposed. For this reason, the cleaning solution directly contacts the aging connection wiring 116, and the material of the aging connection wiring 116 is particularly easily peeled off in the contact hole 118 a where the aging connection wiring 116 and the common routing wiring 105 are in contact at the crossover portion 115. If the peeled conductive material adheres to the inside of the cleaning apparatus and then adheres to the wiring of another organic EL panel that flows after that, there is a possibility that a leak failure will occur.

  However, according to the present invention, the crossover portion 115 is disposed in the sealing region. For this reason, the cleaning liquid does not directly contact the crossover portion 115. Therefore, in the crossover portion 115, there is no medium (cleaning liquid) that propagates a shock wave (cavitation) when the bubbles of the cleaning liquid repel. Thereby, it can prevent that the aging connection wiring 116 material of the said degradation part remove | deviates. Moreover, generation | occurrence | production of the defective panel resulting from this can be suppressed.

  Here, the manufacturing method of said organic EL panel 100 is demonstrated with reference to FIG. FIG. 6 is a flowchart showing a method for manufacturing the organic EL panel 100 according to the present embodiment. As shown in FIG. 6, in the organic EL panel 100, an organic EL element forming step (step S1) for forming a wiring group and a plurality of organic EL layers on one mother substrate, in order to protect the organic EL layer from moisture and the like. A sealing process (step S2) for separating the organic EL panel from the outside air with a sealing substrate 110 substrate such as glass (step S2), and an aging process for collectively aging the plurality of organic EL panels 100 on the mother substrate (step S3) ), A cutting step (step S4) for cutting the mother substrate and separating the mother substrate into a plurality of organic EL panels 100, a cleaning step (step S5) for cleaning the mounting portion of the driver IC 113, and a mounting step (step for mounting the driver IC 113) It is manufactured through S6).

  First, the organic EL element 109 is formed on the element substrate 101 (step S1). Specifically, first, an ITO film is formed on a mother substrate, a photosensitive resin is applied on the ITO, exposed, developed, and etched to provide a plurality of segment electrodes 102, a plurality of segment routing wires 103, and a segment aging. The wiring 201, the plurality of common routing wirings 105, and the common aging wiring 202 are formed on the same plane. In addition, a metal material is laminated on the segment routing wiring 103 and the common routing wiring 105 in order to reduce the resistance of the connection portion. In addition, a metal electrode larger than the second contact hole 118b is formed of an alloy containing molybdenum at a position where the second contact hole 118b is formed on the aging connection terminal 203.

  Next, an insulating layer 106 material is applied on this layer, and exposure and development are performed to form the opening 107. At the same time as the formation of the insulating layer 106, the insulating layer 117 is formed in the crossover portion 115. In the crossover portion 115, a contact hole 118 is formed at a position corresponding to each aging connection terminal 203 and the common routing wiring 105. The first contact hole 118 a provided corresponding to the common routing wiring 105 is preferably in the vicinity of the bent portion of the common routing wiring 105.

  Further, after applying a negative photosensitive resin, partition walls 120 in the display area where exposure and development are performed are formed. In addition, the wall structure 119 is formed simultaneously with the formation of the partition wall 120 in the display area. Thereby, each aging connection wiring 116 is also formed separately. And after forming the partition 120, each layer which forms the organic EL layer 108 is laminated | stacked one by one. For example, as the organic EL layer 108, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed.

  Finally, the common electrode 104 is formed of a metal such as aluminum by vapor deposition, and the common electrode 104 is connected to the common routing wiring 105. At this time, the partition 120 separates the organic EL layer 108 and the common electrode 104, whereby the organic EL layer 108 is formed between the partitions 120, and the common electrode 104 patterned in a stripe shape is formed.

  Further, when the common electrode 104 is formed, the aging connection wiring 116 is formed simultaneously with the same material as the common electrode 104. That is, the common electrode 104 and the aging connection wiring 116 are formed of the same material. At this time, the wall structure 119 separates the aging connection wiring 116 to form the aging connection wiring 116 patterned in a stripe shape between the wall structures 119. As a result, the aging connection wiring 116 and the common routing wiring 105 and the aging connection wiring 116 and the common aging wiring 202 are electrically connected to each other through the contact hole 118 formed in the previous step. Therefore, it can be formed simultaneously with the organic EL element 109 without adding a step of forming the crossover portion 115 separately.

  As described above, in the crossover portion 115, the aging connection wiring 116 connected to the common routing wiring 105 gets over the other common routing wiring 105 and the segment aging wiring 201 and is electrically connected to the common aging wiring 202. Is done. Here, the partition wall 120 and the wall structure 119 are used to separate and form the common electrode 104 and the aging connection wiring 116, but the common electrode 104 and the aging connection wiring 116 may be formed by mask evaporation in a stripe shape.

  When the organic EL element formation step (step S1) is completed, each segment electrode 102 in the plurality of simple matrix type organic EL elements 109 formed on the element substrate 101 is connected to the segment aging wiring 201 via the segment routing wiring 103. The common electrodes 104 in the plurality of organic EL elements 109 are connected to the common aging wiring 202 via the common routing wiring 105.

  Thereafter, the organic EL element 109 formed on the element substrate 101 in the organic EL element forming step (step S1) is sealed to protect it from moisture (step S2). The sealing material 112 is disposed so as to surround the organic EL element 109 and the crossover portion 115. Then, another sealing substrate different from the element substrate 101 is disposed to face the element substrate 101. Then, both substrates are bonded, and dry nitrogen gas and a small amount of oxygen gas are sealed in an airtight space formed by the two substrates and the sealing material 112. As a result, a plurality of organic EL panels 100 formed of the element substrate 101, the sealing substrate 110, and the sealing material 112 and having the organic EL elements 109 and the crossover portions 115 disposed in the space are formed.

  Next, a life aging process and a short-circuit aging process are performed on the plurality of organic EL panels 100 formed on the element substrate 101 (step S3). Specifically, first, a plurality of element substrates 101 on which the plurality of organic EL panels 100 described above are formed are put together in a cassette, and a voltage application device for aging treatment is connected to the segment aging wiring 201 and the common aging wiring 202. .

  Thereafter, in a state where the element substrate 101 is put in a cassette, the ambient temperature of the element substrate 101 is put into an oven set at a high temperature of room temperature or higher, preferably 80 ° C. or higher. By performing the aging process at a high temperature, it is possible to reduce the desired luminance in a short time. The temperature at which the aging treatment is performed is preferably as high as possible as long as the organic EL element does not change in quality.

  In the short-circuit aging process, a reverse bias voltage larger than the actual drive voltage is applied. That is, a voltage is applied so that the segment electrode 102 is − and the common electrode 104 is +. At this time, the voltage between the segment electrode 102 and the common electrode 104 is set to be larger than the voltage during normal driving. The reverse bias voltage is applied as a pulse waveform. By the short-circuit aging treatment, the defective portion where the segment electrode 102 and the common electrode 104 are short-circuited is destroyed and removed.

In the lifetime aging process, the luminance of each pixel in the aging process is set higher than the luminance when the rated display operation is performed as the organic EL display device in order to reduce the desired luminance in a shorter time. Set conditions. For example, luminance level of the organic EL display device as long as 200 cd / ^{m 2,} applies the aging voltage to emit light at 400 cd / ^{m 2.} By emitting light at a brightness twice as high as the luminance specification as an organic EL display device, the life aging process can be performed in about half the time compared to the case where the aging process is performed according to the luminance specification as an organic EL display device. Complete.

  Thereafter, the mother substrate is cut for each organic EL panel 100 (step S4). For example, a cutting line is set on the segment routing wiring 103 connected to the segment aging wiring 201 and between the common routing wiring 105 and the segment aging wiring 201 so as to surround the organic EL panel 100, and along the cutting line. The mother substrate is cut and separated into a plurality of organic EL panels 100. Thereby, the connection between the segment electrode 102 and the segment aging wiring 201 and the common electrode 104 and the common aging wiring 202 is disconnected. In the cutting step (step S4), therefore, the segment aging wiring 201 and the common aging wiring 202 formed outside the plurality of organic EL panels 100 are cut off and discarded.

  Thereafter, the peripheral area including the mounting portion of the driver IC 113 is cleaned (step S5). In the cleaning process, the organic EL panel 100 immersed in the cleaning liquid is cleaned by cavitation using an ultrasonic cleaning apparatus. As described above, the cleaning liquid is not in direct contact with the sealing region. For this reason, the cleaning liquid serving as a cavitation medium does not come into contact with the crossover portion 115 disposed in the sealing region. Therefore, it is possible to prevent the deteriorated portion of the aging connection wiring 116 generated due to the aging process from being peeled off by performing ultrasonic cleaning.

  Thereafter, in a mounting step (step S6), the driver IC 113 is mounted on the element substrate 101, and a flexible substrate for connecting an external peripheral circuit to the input signal line 114 is mounted to obtain an organic EL display device.

  In addition, after the mounting process (step S6), in order to protect the driver IC 113, the segment routing wiring 103, the common routing wiring 105, and the like, it is preferable to apply an ultraviolet curable resin to the peripheral region of the organic EL panel 100. At that time, an ultraviolet curable resin is also applied to the aging connection wiring 116 to protect the surface.

Embodiment 2. FIG.
An organic EL panel 100 according to Embodiment 2 of the present invention will be described with reference to FIGS. FIG. 7 is a diagram showing a configuration of the crossover portion 115 of the organic EL panel according to the present embodiment. 8 is a DD cross-sectional view of FIG. 7, and FIG. 9 is a EE cross-sectional view of FIG. The present embodiment is different from the first embodiment in that the segment aging wiring 201 is made of the same material as the common electrode 104. The aging connection wiring 116 is formed of the same material as the common aging wiring 202. Note that the basic configuration of the organic EL panel 100 is the same as that of the first embodiment, and thus the description thereof is omitted.

  As shown in FIG. 7, in the present embodiment, a part of the common routing wiring 105 is extended from the common electrode 104. Therefore, a part of the common routing wiring 105 is formed of the same material as the common electrode 104. The partition wall 120 is formed between the common electrodes 104 and also between the common routing wirings 105. Thereby, the common electrode 104 is separated and formed. Further, as shown in FIG. 9, the common routing wiring 105 formed simultaneously with the material of the common electrode 104 is also separated and formed by the partition 120. In order to make the separation between the common electrode 104 and the routing wiring 105 more reliable, the partition wall 120 has an inverted taper structure. In other words, the cross section is formed so as to increase as the distance from the element substrate 101 increases.

  Further, the side of the common routing wiring 105 connected to the driver IC 113 is made of a laminated film of ITO and a metal film. Therefore, the common routing wiring 105 includes a portion made of the same material as the common electrode 104 and a portion made of a laminated film of ITO and a metal film. The common electrode 104 side and the driver IC side of the common routing wiring 105 are connected via a fourth contact hole 118 d provided in the insulating layer 117. A portion where the common electrode 104 side and the driver IC side of the common routing wiring 105 are connected is referred to as a connection portion 122.

  Further, a part of the segment aging wiring 201 is formed of the same material as that of the common electrode 104. As shown in FIG. 7, ribs 121 are formed around the segment aging wiring 201 formed of the same material as the common electrode 104. The rib 121 is formed of the same material as the partition wall 120. The rib 121 has a reverse taper structure in order to ensure separation of the segment aging wiring 201. As shown by a dashed line in FIG. 7, the material of the common electrode 104 is actually formed on substantially the entire surface in the sealing region of the element substrate 101. Therefore, the conductive material is separated by the partition wall 120 and the rib 121, and the common electrode 104, the common routing wiring 105, and the segment aging wiring 201 are formed.

  7 and 8, a part of the segment aging wiring 201 is formed of a laminated film of ITO and a metal film from the outside of the sealing material 112 to the sealing region. In the crossover portion 115, the segment aging wiring 201 is formed of the same material as the common electrode 104. Therefore, the segment aging wiring 201 includes a portion made of the same material as the common electrode 104 and a portion made of a laminated film of ITO and a metal film. A portion where the portions formed of different materials of the segment aging wiring 201 are connected is referred to as a connection portion 123. In the organic EL panel 100, in the connection portion 123 on the side facing the side where the driver IC 113 is mounted, the segment aging wiring 201 made of ITO or the like extends from the outside of the sealing region to the inside of the sealing material 112. ing. In the connection portion 123, the segment aging wiring 201 made of ITO or the like is connected to the segment aging wiring 201 made of the material of the common electrode 104 through the fifth contact hole 118e of the insulating layer 117 provided thereon. Is done.

  On the other hand, in the organic EL panel 100, the segment aging wiring 201 made of ITO or the like is formed from the driver IC 113 to the vicinity of the aging connection wiring 116 at the lower end in FIG. Yes. In the connection portion 123, the segment aging wiring 201 made of ITO or the like is connected to the segment aging wiring 201 made of the material of the common electrode 104 through the fifth contact hole 118e of the insulating layer 117 provided thereon. Is done.

  As shown in FIGS. 8 and 9, in the crossover portion 115, an insulating layer 117 is provided below the segment aging wiring 201 and the common routing wiring 105. An aging connection wiring 116 is formed below the insulating layer 117. In the present embodiment, the aging connection wiring 116 is extended from the common aging wiring 202. The aging connection wiring 116 intersects the segment aging wiring 201 through the insulating layer 117. For this reason, the aging connection wiring 116 and the segment aging wiring 201 are not in contact with each other. That is, the segment aging wiring 201 is formed over the plurality of aging connection wirings 116.

  The aging connection wiring 116 is connected to the corresponding common routing wiring 105 through the third contact hole 118c provided in the insulating layer 117. That is, the aging connection wiring 116 passes through the lower side of the other common routing wiring 105 in the crossover portion 115 and is electrically connected to the corresponding common routing wiring 105. For example, in FIG. 7, the uppermost aging connection wiring 116 is connected to the left common routing wiring 105 via the third contact hole 118c. The second aging connection wiring 116 from the top passes through the lower side of the left common routing wiring 105 and is connected to the middle common routing wiring 105 via the third contact hole 118c.

  The connection between the segment aging wiring 201 and the segment electrode 102, and the connection between the common aging wiring 202 and the common electrode 104 are divided in the process of cutting the mother substrate into individual organic EL panels 100. In other words, all the common routing wirings 105 are electrically connected to the common aging wiring 202 via the aging connection wiring 116 at a portion discarded after the cutting process on the mother substrate. That is, all the common routing wirings 105 and the common aging wirings 202 are electrically connected outside the organic EL panel 100 finally obtained. After this cutting process, the driver IC 113 is mounted on the element substrate 101.

  As shown in FIG. 9, an aging connection wiring 116 is formed on the element substrate 101 in the crossover portion 115. The aging connection wiring 116 is extended from the common aging wiring 202 and is formed from the outside of the sealing region to the sealing region. That is, in this embodiment, the aging connection wiring 116 is provided so as to intersect with the sealing material 112. The common aging wiring 202 and the aging connection wiring 116 are made of a laminated film of ITO and a metal film. Further, as described above, the segment aging wiring 201 and the common routing wiring 105 are made of the same conductive material such as Al as the common electrode 104.

  An insulating layer 117 is provided on the aging connection wiring 116 of the crossover portion 115. A third contact hole 118 c is provided at a position corresponding to the aging connection wiring 116 of the insulating layer 117. Note that a fourth contact hole 118 d corresponding to the connection portion 122 of the common routing wiring 105 is formed in the insulating layer 117. Further, a fifth contact hole 118 e corresponding to the connection portion 123 of the segment aging wiring 201 is formed in the insulating layer 117.

  As shown in FIG. 7, a partition wall 120 is formed between the common routing wirings 105 on the insulating layer 117. In addition, ribs 121 formed in the same process as the partition wall 120 are provided on both sides of the segment aging wiring 201. A conductive material such as Al is provided on the insulating layer 117, the partition wall 120, and the rib 121. The partition 120 is formed so as to prevent the common routing wirings 105 from contacting each other. Further, the segment aging wiring 201 is separated and formed by the rib 121 so as not to contact the common routing wiring 105.

  As described above, the aging connection wiring 116 in the sealing region extends from the common aging wiring 202. Further, the aging connection wiring 116 is connected to the common routing wiring 105 through the third contact hole 118c. Therefore, the common routing wiring 105 and the common aging wiring 202 are electrically connected by the aging connection wiring 116 through the third contact hole 118c. That is, the aging connection wiring 116 passes under the other adjacent common routing wiring 105 to electrically connect the common routing wiring 105 and the common aging wiring 202. Further, the segment aging wiring 201 arranged on the side of the common routing wiring 105 is formed so as to get over the aging connection wiring 116.

  Further, a seal material 112 is disposed on the side opposite to the display area of the crossover portion 115. Therefore, not only the organic EL element 109 but also the crossover portion 115 is disposed in a sealing region formed by the element substrate 101, the sealing substrate 110, and the sealing material 112. For this reason, the third contact hole 118c of the aging connection wiring 116, the fourth contact hole 118d of the common routing wiring 105, and the fifth contact hole 118e of the segment aging wiring 201 are also arranged in the sealing region. Also, the aging connection wiring 116 is formed in the sealing region.

  In particular, the third contact hole 118c corresponding to the aging connection wiring 116, that is, the interface between the common routing wiring 105 and the aging connection wiring 116 is deformed by the Joule heat generated by performing the aging process. The film quality will deteriorate. For this reason, conventionally, the common lead-out wiring 105 made of the material of the common electrode 104 is easily peeled off by ultrasonic cleaning of the peripheral region after the mother substrate is cut.

  However, according to the present invention, the crossover portion 115 is disposed in the sealing region. For this reason, the cleaning liquid does not directly contact the crossover portion 115. Therefore, in the crossover portion 115, there is no medium (cleaning liquid) that propagates a shock wave (cavitation) when the bubbles of the cleaning liquid repel. Thereby, it can prevent that the common electrode 104 material of the said degradation part remove | deviates. Moreover, generation | occurrence | production of the defective panel resulting from this can be suppressed.

  In the first embodiment, if the number of common electrodes 104 is N, N contact holes are formed between the common electrode 104 and the common routing wiring 105, and N contact holes are formed between the aging connection wiring 116 and the common aging terminal 203. N contact holes between the aging connection wiring 116 and the common routing wiring 105, and a total of 3N contact holes are formed in the sealing region. However, according to the second embodiment, the contact hole between the aging connection wiring 116 and the common aging wiring 202 can be omitted, and if the fifth contact hole 118e is provided in the connection portion 123 of the segment aging wiring 201 instead. Good. For this reason, the number of contact holes required in the first embodiment can be reduced to 2N + 2. Thereby, generation | occurrence | production of the malfunction which can be put in a contact hole can be reduced.

Embodiment 3 FIG.
An organic EL panel 100 according to Embodiment 3 of the present invention will be described with reference to FIGS. FIG. 10 is a diagram showing a configuration of the crossover portion 115 of the organic EL panel according to the present embodiment. 11 is a cross-sectional view taken along line FF in FIG. 10, and FIG. 12 is a cross-sectional view taken along line GG in FIG. The present embodiment is different from the first embodiment in that the aging connection wiring 116 and the common electrode 104 are directly connected. Note that the basic configuration of the organic EL panel 100 is the same as that of the first embodiment, and thus the description thereof is omitted.

  As shown in FIG. 10, in the present embodiment, the aging connection wiring 116 is formed of the same material as that of the common electrode 104 as in the first embodiment. Further, the partition 120 is formed between the common electrodes 104 and also between the aging connection wirings 116. That is, the partition wall 120 extends from the display area to the crossover portion 115.

  Further, as shown in FIG. 11, in the crossover portion 115, an insulating layer 117 is formed so as to cover the segment aging wiring 201. As shown in FIG. 12, the aging connection wiring 116 intersects the segment aging wiring 201 through the insulating layer 117. For this reason, the aging connection wiring 116 and the segment aging wiring 201 are not in contact with each other. An aging connection terminal 203 is formed in the common aging wiring 202. The aging connection wiring 116 is connected to the corresponding aging connection terminal 203. Therefore, the aging connection wiring 116 crosses the segment aging wiring 201 and the other common routing wiring 105 at the crossover portion 115 and electrically connects the common routing wiring 105 and the corresponding aging connection terminal 203. For example, in FIG. 10, the second aging connection wiring 116 from the top crosses the common routing wiring 105 and the segment aging wiring 201 at the left end, and the second common routing wiring 105 from the left and the second aging connection terminal from the top. 203 is connected.

  As in the above-described embodiment, the connection between the segment aging wiring 201 and the segment electrode 102 and the connection between the common aging wiring 202 and the common electrode 104 are performed in a process of cutting the mother substrate into individual organic EL panels 100. , Divided. In other words, all the common routing wirings 105 are electrically connected to the common aging wiring 202 via the aging connection wiring 116 at a portion discarded after the cutting process on the mother substrate. That is, all the common routing wirings 105 and the common aging wirings 202 are electrically connected outside the organic EL panel 100 finally obtained. After this cutting process, the driver IC 113 is mounted on the element substrate 101.

  As shown in FIG. 12, a common routing wiring 105, a common aging wiring 202, an aging connection terminal 203, and a segment aging wiring 201 are formed on the element substrate 101. The common aging wiring 202 is extended from the outside of the sealing region to the inside of the sealing region. That is, the common aging wiring 202 is provided so as to intersect the sealing material 112. An aging connection terminal 203 is provided in a part of the common aging wiring. The segment aging wiring 201, the common aging wiring 202, the common routing wiring 105, and the aging connection terminal 203 are made of a laminated film of ITO and a metal film in order to reduce resistance.

  An insulating layer 117 is provided on the common routing wiring 105, the segment aging wiring 201, and the aging connection terminal 203 of the crossover portion 115. A sixth contact hole 118 f for connecting the common electrode 104 and the common routing wiring 105 is formed at a position corresponding to the end portion of the common routing wiring 105 of the insulating layer 117. A display signal input from the outside via the input signal line 114 is supplied to the common electrode 104 via the common routing wiring 105 through the sixth contact hole 118f. The sixth contact hole 118f may include a plurality of contact holes in order to improve the reliability of the organic EL panel 100. For example, as the sixth contact hole 118f, four contact holes may be provided in a matrix.

  In addition, the aging connection wiring 116 and the common routing wiring 105 are connected in the sixth contact hole 118f. That is, the contact hole for connecting the aging connection wiring 116 and the common routing wiring 105 and the contact hole for connecting the common electrode 104 and the common routing wiring 105 are also used. That is, the aging connection wiring 116 and the common electrode 104 are connected in a portion where the sixth contact hole 118f is formed. Thereby, an aging voltage can be supplied from the common aging wiring 202 to each common electrode 104. In addition, a second contact hole 118 b is formed in the insulating layer 117 at a position corresponding to the aging connection terminal 203. In the second contact hole 118b, the aging connection wiring 116 and the aging connection terminal 203 are connected.

  As described above, between the aging connection wirings 116, the partition 120 formed to separate and form the common electrode 104 is extended in the display region. The partition wall 120 has an inverted taper structure in order to ensure separation of the common electrode 104 and the aging connection wiring 116. On the insulating layer 117 and the partition wall 120, a conductive material such as Al that becomes the common electrode 104 and the aging connection wiring 116 is provided so as to cover the insulating layer 117. The partition walls 120 are separated from each other so that adjacent aging connection wirings 116 and adjacent common electrodes 104 do not contact each other.

  The common aging wiring 202 is connected to the aging connection wiring 116 in the sealing region via the second contact hole 118b. The common routing wiring 105 is connected to the aging connection wiring 116 in the sealing region via the sixth contact hole 118f. Therefore, the common routing wiring 105 and the common aging wiring 202 are electrically connected by the aging connection wiring 116 through the second contact hole 118b and the sixth contact hole 118f. In other words, the aging connection wiring 116 goes over the segment aging wiring 201 arranged on the side and the other adjacent common routing wiring 105 to electrically connect the common routing wiring 105 and the common aging wiring 202.

  Further, a seal material 112 is disposed on the side opposite to the display area of the crossover portion 115. Therefore, not only the organic EL element 109 but also the crossover portion 115 is disposed in a sealing region formed by the element substrate 101, the sealing substrate 110, and the sealing material 112. Therefore, the sixth contact hole 118f and the second contact hole 118b are also arranged in the sealing region. Also, the aging connection wiring 116 is formed in the sealing region.

  Particularly at the sixth contact hole 118f portion, that is, at the interface between the common routing wiring 105 and the aging connection wiring 116, the aging connection wiring 116 is deformed or its film quality is deteriorated due to Joule heat generated by performing an aging process. End up. For this reason, conventionally, the common lead-out wiring 105 made of the material of the common electrode 104 has been easily peeled off by ultrasonic cleaning of the connection terminal portion performed after cutting the mother substrate.

  However, according to the present invention, the crossover portion 115 is disposed in the sealing region. For this reason, the cleaning liquid does not directly contact the crossover portion 115. Thereby, it can prevent that the common electrode 104 material of the said degradation part remove | deviates. Moreover, generation | occurrence | production of the defective panel resulting from this can be suppressed.

  Further, according to the third embodiment, the aging connection wiring 116 and the common electrode 104 are directly connected. Therefore, the contact hole of the aging connection wiring 116 and the common routing wiring 105 can be eliminated. For this reason, the number of contact holes required in the first embodiment can be reduced to 2N. Thereby, generation | occurrence | production of the malfunction which can be put in a contact hole can be reduced. Further, unlike the first embodiment, as shown in FIG. 10, it is not necessary to form a contact hole between the common routing wirings 105 in the left-right direction of the organic EL panel 100. For this reason, the width of the frame region other than the display region in the sealing region can be reduced.

Embodiment 4 FIG.
An organic EL panel 100 according to Embodiment 4 of the present invention will be described with reference to FIGS. FIG. 13 is a diagram showing a configuration of the crossover portion 115 of the organic EL panel according to the present embodiment. 14 is a cross-sectional view taken along line HH in FIG. 13, and FIG. 15 is a cross-sectional view taken along line II in FIG. The present embodiment is different from the first embodiment in that the aging connection wiring 116 and the common electrode 104 are directly connected. Further, the segment aging wiring 201 is made of the same material as the common electrode 104, and the aging connection terminal 103 is made of the same material as the common aging wiring 202. Note that the basic configuration of the organic EL panel 100 is the same as that of the first embodiment, and thus the description thereof is omitted.

  As shown in FIG. 13, in this embodiment, the aging connection wiring 116 is formed of the same material as that of the common electrode 104 as in the first embodiment. Further, the partition 120 is formed between the common electrodes 104 and also between the aging connection wirings 116. That is, the partition wall 120 extends from the display area to the crossover portion 115. In order to further ensure the separation of the common electrode 104 and the aging connection wiring 116, the partition wall 120 has an inverted taper structure. In other words, the cross section is formed so as to increase as the distance from the element substrate 101 increases.

  Further, a part of the segment aging wiring 201 is formed of the same material as that of the common electrode 104. Ribs 121 are formed around the segment aging wiring 201 formed of the same material as the common electrode 104. The rib 121 is formed simultaneously with the partition wall 120. Further, the rib 121 has a reverse taper structure in order to ensure separation of the segment aging wiring 201. As shown by a dashed line in FIG. 13, the material of the common electrode 104 is actually formed on substantially the entire surface in the sealing region of the element substrate 101. Therefore, the conductive material is separated by the partition wall 120 and the rib 121, and the common electrode 104, the aging connection wiring 116, and the segment aging wiring 201 are formed.

  As shown in FIGS. 13 and 14, the segment aging wiring 201 is formed of a laminated film made of ITO and a metal film from the outside of the sealing material 112 to the sealing region. In the crossover portion 115, the segment aging wiring 201 is formed of the same material as the common electrode 104. Therefore, the segment aging wiring 201 includes a portion made of the same material as the common electrode 104 and a portion made of a laminated film of ITO and a metal film. A portion where the portions formed of different materials of the segment aging wiring 201 are connected is referred to as a connection portion 123. In the organic EL panel 100, in the connection portion 123 on the side facing the side where the driver IC 113 is mounted, the segment aging wiring 201 made of ITO or the like extends from the outside of the sealing region to the inside of the sealing material 112. ing. In the connection portion 123, the segment aging wiring 201 made of ITO or the like is connected to the segment aging wiring 201 made of the material of the common electrode 104 through the fifth contact hole 118e of the insulating layer 117 provided thereon. Is done.

  On the other hand, in the organic EL panel 100, the segment aging wiring 201 made of ITO or the like is formed from the driver IC 113 to the vicinity of the aging connection wiring 116 at the lower end in FIG. Yes. In the connection portion 123, the segment aging wiring 201 made of ITO or the like is connected to the segment aging wiring 201 made of the material of the common electrode 104 through the fifth contact hole 118e of the insulating layer 117 provided thereon. Is done.

  As shown in FIGS. 13 and 14, in the crossover portion 115, an insulating layer 117 is provided under the segment aging wiring 201. An aging connection terminal 203 is formed under the insulating layer 117. The aging connection terminal 203 is extended from the common aging wiring 202 corresponding to the aging connection wiring 116. The aging connection terminal 203 intersects the segment aging wiring 201 through the insulating layer 117. For this reason, the aging connection terminal 203 and the segment aging wiring 201 are not in contact with each other. That is, the segment aging wiring 201 is formed over the plurality of aging connection terminals 203.

  As shown in FIGS. 13 and 15, a second contact hole 118 b is formed in the insulating layer 117 corresponding to the aging connection terminal 203. The aging connection wiring 116 is connected to the corresponding aging connection terminal 203 through the second contact hole 118b. The aging connection wiring 116 intersects with the common routing wiring 105 through the insulating layer 117. For this reason, the aging connection wiring 116 and the common routing wiring 105 are not in contact with each other. That is, the aging connection wiring 116 is formed over the other common routing wiring 105.

  As described above, the connection between the segment aging wiring 201 and the segment electrode 102, and the connection between the common aging wiring 202 and the common electrode 104 are divided in the step of cutting the mother substrate into individual organic EL panels 100. In other words, all the common routing wirings 105 are electrically connected to the common aging wiring 202 via the aging connection wiring 116 at a portion discarded after the cutting process on the mother substrate. That is, all the common routing wirings 105 and the common aging wirings 202 are electrically connected outside the organic EL panel 100 finally obtained. After this cutting process, the driver IC 113 is mounted on the element substrate 101.

  As shown in FIG. 15, a common aging wiring 202, an aging connection terminal 203, and a common routing wiring 105 are formed on the element substrate 101. The aging connection terminal 203 is extended from the common aging wiring 202 and is formed from the outside of the sealing region to the sealing region. That is, in the present embodiment, the aging connection terminal 203 is provided so as to intersect with the sealing material 112. The common aging wiring 202, the aging connection terminal 203, and the common routing wiring 105 are made of a laminated film of ITO and a metal film. As described above, the segment aging wiring 201 and the aging connection wiring 116 are made of the same conductive material such as Al as the common electrode 104.

  In the crossover portion 115, an insulating layer 117 is provided on the aging connection terminal 203 and the common routing wiring 105. A second contact hole 118 b is formed at a position corresponding to the aging connection terminal 203 of the insulating layer 117. On the insulating layer 117, a partition wall 120 is formed between the aging connection wirings 116. The partition 120 is also formed between the common electrodes 104 in the display area. That is, the partition wall 120 extends from the display area to the crossover portion 115. Around the segment aging wiring 201, a rib 121 formed in the same process as the partition wall 120 is provided.

  Further, a conductive material such as Al is provided on the insulating layer 117, the partition 120, and the rib 121. As shown by a dashed line in FIG. 10, the material of the common electrode 104 is actually formed on substantially the entire surface in the sealing region of the element substrate 101. Therefore, the conductive material is separated by the partition wall 120 and the rib 121, and the common electrode 104, the aging connection wiring 116, and the segment aging wiring 201 are formed.

  A sixth contact hole 118 f for connecting the common electrode 104 and the common routing wiring 105 is formed at a position corresponding to the end portion of the common routing wiring 105 of the insulating layer 117. Through the sixth contact hole 118 f, a display signal input from the outside to the input signal line 114 is supplied to the common electrode 104 through the common routing wiring 105. The sixth contact hole 118f may include a plurality of contact holes in order to improve the reliability of the organic EL panel 100. For example, as the sixth contact hole 118f, four contact holes may be provided in a matrix.

  In the sixth contact hole 118f, the aging connection wiring 116 and the common routing wiring 105 are connected. That is, the contact hole for connecting the aging connection wiring 116 and the common routing wiring 105 and the contact hole for connecting the common electrode 104 and the common routing wiring 105 are also used. That is, the aging connection wiring 116 and the common electrode 104 are connected in a portion where the sixth contact hole 118f is formed. Thereby, an aging voltage can be supplied from the common aging wiring 202 to each common electrode 104. Further, the aging connection terminal 203 in the sealing region passes through the lower side of the segment aging wiring 201 and is connected to the aging connection wiring 116. The aging connection wiring 116 is connected to the corresponding common routing wiring 105 over the other common routing wiring 105.

  Further, a seal material 112 is disposed on the side opposite to the display area of the crossover portion 115. Therefore, not only the organic EL element 109 but also the crossover portion 115 is disposed in a sealing region formed by the element substrate 101, the sealing substrate 110, and the sealing material 112. Therefore, the second contact hole 118b and the sixth contact hole 118f of the aging connection wiring 116 are also arranged in the sealing region. Also, the aging connection wiring 116 is formed in the sealing region.

  At the sixth contact hole 118f corresponding to the aging connection wiring 116, that is, at the interface between the common routing wiring 105 and the aging connection wiring 116, the aging connection wiring 116 is deformed by Joule heat generated by performing the aging process. The film quality will deteriorate. For this reason, conventionally, the common lead-out wiring 105 made of the material of the common electrode 104 has been easily peeled off by ultrasonic cleaning of the connection terminal portion performed after cutting the mother substrate.

  However, according to the present invention, the crossover portion 115 is disposed in the sealing region. For this reason, the cleaning liquid does not directly contact the crossover portion 115. Therefore, in the crossover portion 115, there is no medium (cleaning liquid) that propagates a shock wave (cavitation) when the bubbles of the cleaning liquid repel. Thereby, it can prevent that the common electrode 104 material of the said degradation part remove | deviates. Moreover, generation | occurrence | production of the defective panel resulting from this can be suppressed.

  According to the fourth embodiment, since the aging connection wiring 116 and the common electrode 104 are directly connected, the number of contact holes can be 2N. Then, two fifth contact holes 118 e are provided in the connection portion 123 of the segment aging wiring 201. Therefore, the number of contact holes required in the first embodiment can be reduced to 2N + 2. Thereby, generation | occurrence | production of the malfunction which can be put in a contact hole can be reduced. Further, unlike the first embodiment, as shown in FIG. 10, it is not necessary to form a contact hole between the common routing wirings 105 in the left-right direction of the organic EL panel 100. For this reason, the width of the frame region other than the display region in the sealing region can be reduced.

  As described above, in the organic EL panel 100 according to the present embodiment, peeling of the deteriorated portion of the aging connection wiring 116 that has occurred in the aging process can be suppressed.

  In the present embodiment, the case where the crossover portion 115 is provided for the cathode wiring as the common electrode has been described. However, it is difficult to form wiring for individually pulling out the segment electrodes out of the organic EL panel 100. In some cases, a crossover portion can be provided for the segment electrode. That is, the present invention can be applied to the segment electrode. Further, the present invention is not limited to the case where the driver IC is mounted on the substrate by COG, but can also be applied to the case where the drive circuit is mounted by another mounting technique such as TCP.

1 is a plan view showing a configuration of an organic EL panel according to Embodiment 1. FIG. 1 is a cross-sectional view illustrating a configuration of an organic EL panel according to Embodiment 1. FIG. 1 is a plan view showing a configuration of an organic EL panel substrate according to Embodiment 1. FIG. 4 is a plan view showing a configuration of a crossover portion provided on the organic EL panel substrate according to Embodiment 1. FIG. It is CC sectional drawing of FIG. 5 is a flowchart for explaining a method of manufacturing the organic EL panel according to Embodiment 1. FIG. 6 is a plan view showing a configuration of a crossover portion provided on an organic EL panel substrate according to Embodiment 2. FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. 5 is a plan view showing a configuration of a crossover portion provided on an organic EL panel substrate according to Embodiment 3. FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. 7 is a plan view showing a configuration of a crossover portion provided on an organic EL panel substrate according to Embodiment 4. FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is a top view which shows the structure of the conventional organic electroluminescent panel. It is a top view which shows the structure of the conventional board | substrate for organic EL panels. It is a top view which shows the structure of the crossover part provided in the conventional board | substrate for organic EL panels. It is sectional drawing which shows the structure of the crossover part provided in the conventional board | substrate for organic EL panels.

Explanation of symbols

100 Organic EL Panel 101 Element Substrate 102 Segment Electrode 103 Segment Leading Wiring 104 Common Electrode 105 Common Leading Wiring 106 Insulating Layer 107 Opening 108 Organic EL Layer 109 Organic EL Element 110 Sealing Substrate 111 Water Capture Material 112 Sealing Material 113 Driver IC
114 Input signal line 115 Crossover part 116 Aging connection wiring 117 Insulating layer 118a, 118b, 118c, 118d, 118e, 118f Contact hole 119 Wall structure 120 Partition 121 Rib 122, 123 Connection part 200 Organic EL panel substrate 201 Segment aging Wiring 202 Common aging wiring 203 Aging connection terminal

Claims (11)

An organic EL element having a first electrode, a second electrode opposite to the first electrode, and a light emitting layer disposed between the first electrode and the second electrode is formed. An element substrate;
A sealing material provided so as to surround the organic EL element;
A sealing substrate that is bonded to the element substrate by the sealing material and seals the organic EL element;
An organic EL panel comprising:
A crossover portion disposed in a sealing region formed by the element substrate, the sealing substrate and a sealing material;
The crossover portion is
A first routing wire connected to the first electrode;
An aging wiring disposed on a side of the first routing wiring and supplying an aging voltage to the second electrode from the outside of the organic EL panel;
An insulating layer provided on the first routing wiring and the aging wiring;
A contact hole disposed in the sealing region and provided in the insulating layer;
A conductive layer provided on the insulating layer and connected to the first routing wiring through the contact hole;
An organic EL panel having   The organic EL panel according to claim 1, wherein the aging wiring and the first electrode are separated by the insulating layer.   The organic EL panel according to claim 1, wherein the conductive layer is formed separately corresponding to each of the plurality of first routing wirings.   The organic EL panel according to claim 1, wherein the conductive layer is formed of the same material as the second electrode. A drive circuit mounted on one side of the element substrate;
The first electrode is connected to the drive circuit via the first routing wiring,
5. The organic EL panel according to claim 1, wherein the second electrode is connected to the drive circuit via a second routing wiring. 6. On the element substrate,
An organic EL element having a light-emitting layer disposed between the first electrode and the second electrode;
A first routing wire connected to the first electrode;
A second routing wire connected to the second electrode;
A first aging wiring connected to the first routing wiring via an aging connection wiring;
A second aging wiring connected to the second routing wiring;
A crossover in which the aging connection wiring and the second aging wiring intersect via an insulating layer, and the first routing wiring and the aging connection wiring are connected via a contact hole provided in the insulating layer Forming part with
A sealing substrate is disposed so as to face the organic EL element forming surface side of the element substrate, and the organic EL element, the crossover portion, and the contact hole are formed by the element substrate and the sealing substrate. Sealed to be placed inside,
An aging process is performed by applying an aging voltage to the first aging wiring and the second aging wiring,
Cutting the element substrate and the sealing substrate, and disconnecting the connection between the first aging wiring and the first electrode and the second aging wiring and the second electrode;
A method for producing an organic EL panel in which a cleaning process is performed after an aging process. An organic EL element having a first electrode, a second electrode opposite to the first electrode, and a light emitting layer disposed between the first electrode and the second electrode is formed. An element substrate;
A sealing material provided so as to surround the organic EL element;
A sealing substrate that is bonded to the element substrate by the sealing material and seals the organic EL element;
An organic EL panel comprising:
A crossover portion disposed in a sealing region formed by the element substrate, the sealing substrate and a sealing material;
The crossover portion is
A first routing wire connected to the first electrode;
An aging wiring disposed on the side of the first routing wiring and supplying an aging voltage to the second electrode from the outside of the organic EL panel;
An insulating layer provided under the first routing wiring and the aging wiring;
A contact hole disposed in the sealing region and provided in the insulating layer;
A conductive layer provided under the insulating layer and connected to the first routing wiring through the contact hole;
An organic EL panel having A rib is provided around the aging wiring,
The organic EL panel according to claim 7, wherein the aging wiring and the first electrode are separated by the rib.   The organic EL panel according to claim 7, wherein the conductive layer is formed corresponding to each of the plurality of first routing wirings.   The organic EL panel according to claim 7, wherein the aging wiring is formed of the same material as the first electrode. An organic EL element having a first electrode, a second electrode opposite to the first electrode, and a light emitting layer disposed between the first electrode and the second electrode is formed. An element substrate;
A sealing material provided so as to surround the organic EL element;
A sealing substrate that is bonded to the element substrate by the sealing material and seals the organic EL element;
An organic EL panel comprising:
A crossover portion disposed in a sealing region formed by the element substrate, the sealing substrate and a sealing material;
The crossover portion is
A first routing wire connected to the first electrode;
An aging wiring disposed on a side of the first routing wiring and supplying an aging voltage to the second electrode from the outside of the organic EL panel;
An insulating layer provided under the first routing wiring;
A contact hole disposed in the sealing region and provided in the insulating layer;
A conductive layer provided on the insulating layer and connected to the first routing wiring through the contact hole;
An organic EL panel having

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