JP2007245530A5 - - Google Patents

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Publication number
JP2007245530A5
JP2007245530A5 JP2006072195A JP2006072195A JP2007245530A5 JP 2007245530 A5 JP2007245530 A5 JP 2007245530A5 JP 2006072195 A JP2006072195 A JP 2006072195A JP 2006072195 A JP2006072195 A JP 2006072195A JP 2007245530 A5 JP2007245530 A5 JP 2007245530A5
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JP
Japan
Prior art keywords
resin
mold
mesh
knitted fabric
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006072195A
Other languages
Japanese (ja)
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JP2007245530A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006072195A priority Critical patent/JP2007245530A/en
Priority claimed from JP2006072195A external-priority patent/JP2007245530A/en
Publication of JP2007245530A publication Critical patent/JP2007245530A/en
Publication of JP2007245530A5 publication Critical patent/JP2007245530A5/ja
Pending legal-status Critical Current

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Claims (3)

メッシュ状導電性編地を、コア型に配置した後、凸部を有するキャビティ型を配置して金型を閉じ、該金型内に溶融樹脂材料を射出してコア側表面に上記メッシュ状導電性編地を一体的に積層した導電性成形体を得る成形方法であって、
上記キャビティ型が、上記メッシュ状導電性編地をコア型内壁面に密着させるための突起を上記凸部に少なくとも一箇所有することを特徴とする導電性成形体の成形方法。 After the mesh-shaped conductive knitted fabric is arranged in the core mold, a cavity mold having a convex portion is arranged, the mold is closed, the molten resin material is injected into the mold, and the mesh-shaped conductive material is applied to the core side surface. A molding method for obtaining a conductive molded body integrally laminated with a knitted fabric,
The method according to claim 1, wherein the cavity mold has at least one protrusion on the convex portion for causing the mesh-shaped conductive knitted fabric to adhere to the inner wall surface of the core mold. メッシュ状導電性編地が一方の表面に一体的に積層された導電性成形体であって、請求項１に記載の導電性成形体の成形方法により成形されたことを特徴とする導電性成形体。   A conductive molded body in which a mesh-shaped conductive knitted fabric is integrally laminated on one surface, and formed by the method for forming a conductive molded body according to claim 1. body. 樹脂材料がポリフェニレンエーテル系樹脂、ポリカーボネート系樹脂、ＡＢＳ系樹脂、ポリカーボネート系樹脂とＡＢＳ系樹脂との組成物、ポリスチレン系樹脂から選択されるいずれかである請求項２に記載の導電性成形体。   The conductive molded body according to claim 2, wherein the resin material is selected from a polyphenylene ether resin, a polycarbonate resin, an ABS resin, a composition of a polycarbonate resin and an ABS resin, and a polystyrene resin.
JP2006072195A 2006-03-16 2006-03-16 Conductive molding and its molding method Pending JP2007245530A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006072195A JP2007245530A (en) 2006-03-16 2006-03-16 Conductive molding and its molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006072195A JP2007245530A (en) 2006-03-16 2006-03-16 Conductive molding and its molding method

Publications (2)

Publication Number Publication Date
JP2007245530A JP2007245530A (en) 2007-09-27
JP2007245530A5 true JP2007245530A5 (en) 2009-04-30

Family

ID=38590311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006072195A Pending JP2007245530A (en) 2006-03-16 2006-03-16 Conductive molding and its molding method

Country Status (1)

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JP (1) JP2007245530A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6719690B1 (en) * 2019-09-06 2020-07-08 ゼロワンプロダクツ株式会社 Natural wood composite material and molded products using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131551A (en) * 1991-11-13 1993-05-28 Kansei Corp Laminating method of skin material
JP2000254939A (en) * 1999-03-08 2000-09-19 Dainippon Printing Co Ltd Resin molded article and apparatus for producing the same

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