JP2007243531A

JP2007243531A - Lc filter

Info

Publication number: JP2007243531A
Application number: JP2006062320A
Authority: JP
Inventors: Michio Oba; 美智央大庭; Masahiro Shiba; 雅裕芝; Shinya Matsutani; 伸哉松谷; Shinichi Morimoto; 慎一守本
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2006-03-08
Filing date: 2006-03-08
Publication date: 2007-09-20

Abstract

<P>PROBLEM TO BE SOLVED: To reduce variation of transmission characteristics due to manufacturing in a filter having insulating layers and conductive layers. <P>SOLUTION: The filter is provided with: an insulating layer 9; a ground layer 10 formed on the insulating layer 9; a dielectric layer 11 formed on the ground layer 10; a coil layer 12 formed on the dielectric layer 11 and having a coil part 12A; a dielectric layer 13 formed on the coil layer 12; an input/output electrode layer 14 formed on the dielectric layer 13 and having an input/output electrode part 14A; and an insulating layer 15 formed on the input/output electrode layer 14. The insulating layers 9, 15 and the dielectric layers 11, 13 are composed of organic matters. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、各種無線通信機器に用いられるＬＣフィルターに関するものである。 The present invention relates to an LC filter used for various wireless communication devices.

従来この種のフィルターは、図２４に示されるように、セラミック層１上にグランド層２が設けられ、このグランド層２上にセラミック層３及び銀ペーストからなるコイル層４が設けられ、このコイル層４上にセラミック層５及び銀ペーストからなる入出力電極層６が設けられ、この入出力電極層６の上にセラミック層７が設けられ構成されていた。 Conventionally, in this type of filter, as shown in FIG. 24, a ground layer 2 is provided on a ceramic layer 1, and a ceramic layer 3 and a coil layer 4 made of silver paste are provided on the ground layer 2. The ceramic layer 5 and the input / output electrode layer 6 made of silver paste are provided on the layer 4, and the ceramic layer 7 is provided on the input / output electrode layer 6.

なお、この出願に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００３−２９８３７６号公報 As prior art document information relating to this application, for example, Patent Document 1 is known.
JP 2003-298376 A

このような従来のフィルターは製造による伝送特性のばらつきが問題となっていた。 Such a conventional filter has a problem of variation in transmission characteristics due to manufacture.

すなわち、上記従来の構成においては、セラミック層１、３、５、７を焼成してフィルターを製造する必要があるため、その焼成時においてセラミック層１、３、５、７の収縮、および銀ペーストからなるコイル層４、入出力電極層６の収縮が起こってしまう。あらかじめその収縮を予測した設計を施したとしても、その収縮度合いの違いにより製造ばらつきが出てしまい、それがフィルターにおける伝送特性のばらつきとなっていた。 That is, in the above conventional configuration, the ceramic layers 1, 3, 5, and 7 need to be fired to produce a filter. Therefore, the shrinkage of the ceramic layers 1, 3, 5, and 7 during the firing, and the silver paste The coil layer 4 and the input / output electrode layer 6 are contracted. Even if a design that predicts the shrinkage in advance was made, manufacturing variations occurred due to the difference in the degree of shrinkage, which resulted in variations in transmission characteristics in the filter.

そこで本発明は、絶縁層と導電層とを有するフィルターにおいて、製造による伝送特性のばらつきの低減を目的とする。 Accordingly, an object of the present invention is to reduce variation in transmission characteristics due to manufacture in a filter having an insulating layer and a conductive layer.

そして、この目的を達成するために本発明は、第１の絶縁層と、この第１の絶縁層上に形成されたグランド層と、このグランド層上に形成された第１の誘電体層と、この第１の誘電体層上に形成されたコイル部を有するコイル層と、このコイル層上に形成された第２の誘電体層と、この第２の誘電体層上に形成された入出力電極部を有する入出力電極層と、この入出力電極層上に形成された第２の絶縁層とを備え、前記第１、第２の絶縁層と前記第１、第２の誘電体層とは有機物により構成したものである。 In order to achieve this object, the present invention includes a first insulating layer, a ground layer formed on the first insulating layer, and a first dielectric layer formed on the ground layer. A coil layer having a coil portion formed on the first dielectric layer, a second dielectric layer formed on the coil layer, and an input formed on the second dielectric layer. An input / output electrode layer having an output electrode portion, and a second insulating layer formed on the input / output electrode layer, the first and second insulating layers and the first and second dielectric layers Is composed of organic matter.

本発明のフィルターは、第１、第２の絶縁層、及び第１、第２の誘電体層に有機物を用いたため、焼成工程を用いることなく製造することができ、製造による伝送特性のばらつきを低減することができる。 Since the filter of the present invention uses organic substances for the first and second insulating layers and the first and second dielectric layers, the filter can be manufactured without using a firing process, and the transmission characteristics vary due to manufacturing. Can be reduced.

（実施の形態１）
以下、本発明の実施の形態１におけるフィルターについて図面を参照しながら説明する。 (Embodiment 1)
Hereinafter, the filter according to Embodiment 1 of the present invention will be described with reference to the drawings.

図１において、基板８の上方に絶縁層９を形成し、この絶縁層９の上方にはグランド部１０Ａと絶縁部１０Ｂとからなるグランド層１０を形成し、このグランド層１０の上方には誘電体層１１を形成し、この誘電体層１１の上方にはコイル部１２Ａと絶縁部１２Ｂとを有するコイル層１２を形成し、このコイル層１２の上方には誘電体層１３を形成し、この誘電体層１３の上方には入出力電極部１４Ａと絶縁部１４Ｂとからなる入出力電極層１４を形成し、この入出力電極層１４の上方には絶縁層１５を形成している。 In FIG. 1, an insulating layer 9 is formed above a substrate 8, a ground layer 10 including a ground portion 10 A and an insulating portion 10 B is formed above the insulating layer 9, and a dielectric layer is formed above the ground layer 10. A body layer 11 is formed, a coil layer 12 having a coil portion 12A and an insulating portion 12B is formed above the dielectric layer 11, and a dielectric layer 13 is formed above the coil layer 12. An input / output electrode layer 14 composed of an input / output electrode portion 14 A and an insulating portion 14 B is formed above the dielectric layer 13, and an insulating layer 15 is formed above the input / output electrode layer 14.

ここで、絶縁層９、絶縁部１０Ｂ、絶縁部１２Ｂ、絶縁部１４Ｂ、絶縁層１５には有機物、例えばエポキシ樹脂を主剤としたレジストを用いており、誘電体層１１、１３には有機物、例えばエポキシ樹脂に誘電体セラミックの粉末を混在させた誘電体シートを用いている。 Here, the insulating layer 9, the insulating portion 10B, the insulating portion 12B, the insulating portion 14B, and the insulating layer 15 are made of an organic material, for example, a resist mainly composed of an epoxy resin, and the dielectric layers 11 and 13 are made of an organic material, for example, A dielectric sheet in which a dielectric ceramic powder is mixed in an epoxy resin is used.

そして、グランド層１０におけるグランド部１０Ａは図２に示すようなパターン、即ち、ある一方の対向する２辺に絶縁部１０Ｂを形成し、他方の対向する２辺からはグランド部１０Ａが外部に露出した構成としている。 The ground portion 10A in the ground layer 10 has a pattern as shown in FIG. 2, that is, an insulating portion 10B is formed on one opposite two sides, and the ground portion 10A is exposed to the outside from the other two opposite sides. The configuration is as follows.

そして、コイル層１２におけるコイル部１２Ａは図３に示すようなパターンを形成している。即ち、コイル部１２Ａは二つのコイル１２ＡＡ、１２ＡＢを有し、このコイル１２ＡＡ、１２ＡＢはそれぞれ、コイル直線部１６Ａ、１６Ｂと、螺旋部１７Ａ、１７Ｂを有している。そして、このコイル直線部１６Ａ、１６Ｂは互いに略平行となるように配置し、螺旋部１７Ａはコイル直線部１６Ａを基準としてコイル１２ＡＢと逆方向に配置し、螺旋部１７Ｂはコイル直線部１６Ｂを基準としてコイル１２ＡＡと逆方向に配置している。そして、螺旋部１７Ａの巻回方向は螺旋部１７Ｂの巻回方向と逆方向とし、コイル１２ＡＡとコイル１２ＡＢとが略線対称の関係になるよう配置している。ここで、コイル直線部１６Ａ、１６Ｂが、図２に示す絶縁部１０Ｂ非形成対向辺に略直交するように配置する。 And the coil part 12A in the coil layer 12 forms a pattern as shown in FIG. That is, the coil portion 12A has two coils 12AA and 12AB, and the coils 12AA and 12AB have coil straight portions 16A and 16B and spiral portions 17A and 17B, respectively. The coil straight portions 16A and 16B are disposed so as to be substantially parallel to each other, the spiral portion 17A is disposed in a direction opposite to the coil 12AB with respect to the coil straight portion 16A, and the spiral portion 17B is based on the coil straight portion 16B. Is arranged in the opposite direction to the coil 12AA. The winding direction of the spiral portion 17A is opposite to the winding direction of the spiral portion 17B, and the coil 12AA and the coil 12AB are arranged so as to have a substantially line-symmetric relationship. Here, the coil straight portions 16A and 16B are arranged so as to be substantially orthogonal to the insulating portion 10B non-formation facing side shown in FIG.

そして、入出力電極層１４における入出力電極部１４Ａは図４に示すようなパターンを形成している。即ち、入出力電極部１４Ａは二つの入出力電極１４ＡＡ、１４ＡＢを有し、この入出力電極１４ＡＡ、１４ＡＢはそれぞれ、直線部１８Ａ、１８Ｂと、この直線部１８Ａ、１８Ｂに垂直に接続された直線部１９Ａ、１９Ｂを有している。そして、直線部１８Ａ、１８Ｂは互いに略平行になるように配置し、直線部１９Ａは直線部１８Ａを基準として入出力電極１４ＡＢと逆方向に配置し、直線部１９Ｂは直線部１８Ｂを基準として入出力電極１４ＡＡと逆方向に配置し、入出力電極１４ＡＡと入出力電極１４ＡＢとが略線対称の関係になるよう配置している。 The input / output electrode portion 14A in the input / output electrode layer 14 forms a pattern as shown in FIG. That is, the input / output electrode portion 14A has two input / output electrodes 14AA and 14AB. The input / output electrodes 14AA and 14AB are linear portions 18A and 18B and straight lines connected to the straight portions 18A and 18B, respectively. It has parts 19A and 19B. The straight portions 18A and 18B are disposed so as to be substantially parallel to each other, the straight portion 19A is disposed in a direction opposite to the input / output electrode 14AB with respect to the straight portion 18A, and the straight portion 19B is disposed with reference to the straight portion 18B. The input / output electrode 14AA and the input / output electrode 14AB are disposed so as to have a substantially line-symmetric relationship with the output electrode 14AA.

さらに、図３に示すコイル直線部１６Ａと図４に示す直線部１８Ａとを図１に示す誘電体層１３を介して対向位置に配置し、図３に示すコイル直線部１６Ｂと図４に示す直線部１８Ｂとを図１に示す誘電体層１３を介して対向位置に配置している。 Further, the straight coil portion 16A shown in FIG. 3 and the straight portion 18A shown in FIG. 4 are arranged at opposing positions via the dielectric layer 13 shown in FIG. 1, and the straight coil portion 16B shown in FIG. The straight portion 18B is disposed at an opposing position via the dielectric layer 13 shown in FIG.

なお、この図３に示すコイル部１２Ａ、図４に示す入出力電極部１４Ａには、金、銅、ニッケルなどの、マイグレーションの少ない材料を用いることが望ましい。図３に示すコイル１２ＡＡ、１２ＡＢ間、図４に示す入出力電極１４ＡＡ、１４ＡＢ間をショートさせないためである。 Note that it is desirable to use a material with less migration, such as gold, copper, or nickel, for the coil portion 12A shown in FIG. 3 and the input / output electrode portion 14A shown in FIG. This is to prevent a short circuit between the coils 12AA and 12AB shown in FIG. 3 and between the input / output electrodes 14AA and 14AB shown in FIG.

このような構成のフィルターは、例えば図５に示すような伝送特性（減衰量−周波数特性）を示す。帯域Ｘを有する基準周波数成分２０の裾には０次減衰極２２、１次減衰極２３が存在し、２次高調波成分２１の裾には、１次減衰極２３、２次減衰極２４が存在している。 The filter having such a configuration exhibits transmission characteristics (attenuation amount-frequency characteristics) as shown in FIG. 5, for example. A zero-order attenuation pole 22 and a first-order attenuation pole 23 exist at the bottom of the reference frequency component 20 having the band X, and a first-order attenuation pole 23 and a second-order attenuation pole 24 exist at the bottom of the second-order harmonic component 21. Existing.

このようなフィルターに図６に示すような出力−周波数特性を有する入力信号を入力すると、図７に示すような出力−周波数特性を示す出力信号が得られる。即ち、図６において本来伝達すべき信号２５Ａは、図５に示すフィルター特性の基準周波数成分２０において略減衰されず信号２５Ｂとして出力されるのに対し、雑音信号２６Ａ、２７Ａは、図５に示すフィルター特性における１次減衰極２３、２次減衰極２４等により減衰され、雑音信号２６Ｂ、２７Ｂとして出力される。 When an input signal having an output-frequency characteristic as shown in FIG. 6 is input to such a filter, an output signal having an output-frequency characteristic as shown in FIG. 7 is obtained. That is, the signal 25A to be originally transmitted in FIG. 6 is output as the signal 25B without being substantially attenuated in the reference frequency component 20 of the filter characteristic shown in FIG. 5, whereas the noise signals 26A and 27A are shown in FIG. Attenuated by the primary attenuation pole 23, the secondary attenuation pole 24, etc. in the filter characteristics, and output as noise signals 26B and 27B.

ここで、図３に示すコイル層１２におけるコイル直線部１６Ａ、１６Ｂ間が接近した場合、それらの磁気結合が強まるため帯域Ｘが広くなるが、逆に離れた場合には、それらの磁気結合が弱まり帯域Ｘが狭くなる。 Here, when the coil linear portions 16A and 16B in the coil layer 12 shown in FIG. 3 are close to each other, the magnetic coupling is strengthened so that the band X is widened. The weakened band X is narrowed.

また、図４に示す入出力電極層１４における直線部１８Ａ、１８Ｂの長さが長い場合、あるいは直線部１８Ａ、１８Ｂ間が接近した場合、それらの磁気結合が強まるため、図５に示す０次減衰極２２及び１次減衰極２３がＡ方向に移動し、逆に直線部１８Ａ、１８Ｂの長さが短い場合、あるいは直線部１８Ａ、１８Ｂ間が離れた場合には、それらの磁気結合が弱まるため、０次減衰極２２、１次減衰極２３がＢ方向に移動することとなる。 Also, when the length of the straight portions 18A and 18B in the input / output electrode layer 14 shown in FIG. 4 is long or when the straight portions 18A and 18B are close to each other, their magnetic coupling is strengthened. When the attenuation pole 22 and the primary attenuation pole 23 move in the A direction and the lengths of the linear portions 18A and 18B are short or the linear portions 18A and 18B are separated from each other, their magnetic coupling is weakened. Therefore, the zero-order attenuation pole 22 and the primary attenuation pole 23 move in the B direction.

そして、図１に示す誘電体層１３を隔てて配置された図３に示すコイル直線部１６Ａと図４に示す直線部１８Ａとの間、図３に示すコイル直線部１６Ｂと図４に示す直線部１８Ｂとの間が接近した場合、あるいは図３に示すコイル層１２における螺旋部１７Ａ、１７Ｂの長さが長い場合、基準周波数成分２０における中心周波数が低周波側にシフトし、その逆の場合には、基準周波数成分２０における中心周波数が高周波側にシフトする。 Then, between the coil straight part 16A shown in FIG. 3 and the straight part 18A shown in FIG. 4 arranged with the dielectric layer 13 shown in FIG. 1 in between, the coil straight part 16B shown in FIG. 3 and the straight line shown in FIG. When close to the portion 18B, or when the length of the spiral portions 17A, 17B in the coil layer 12 shown in FIG. 3 is long, the center frequency of the reference frequency component 20 is shifted to the low frequency side, and vice versa. The center frequency in the reference frequency component 20 is shifted to the high frequency side.

このように、図３に示すコイル部１２Ａや図４に示す入出力電極部１４Ａの少しの配置ずれにより、構成されたフィルターの伝送特性に大きなばらつきを生んでしまうことになるが、本実施形態のように、絶縁層９、絶縁部１０Ｂ、絶縁部１２Ｂ、絶縁部１４Ｂ、絶縁層１５には有機物、例えばエポキシ樹脂を主剤としたレジストを用い、誘電体層１１、１３には有機物、例えばエポキシ樹脂に誘電体セラミックの粉末を混在させた誘電体シートを用いることにより、焼成プロセスを用いることなくフィルターを構成することができるため、絶縁層９、絶縁部１０Ｂ、絶縁部１２Ｂ、絶縁部１４Ｂ、絶縁層１５、誘電体層１１、１３の収縮を非常に小さくすることができ、製造ばらつきによる伝送特性ばらつきを低減することができる。 In this way, a slight variation in the arrangement of the coil portion 12A shown in FIG. 3 and the input / output electrode portion 14A shown in FIG. 4 causes a large variation in the transmission characteristics of the configured filter. As described above, the insulating layer 9, the insulating portion 10B, the insulating portion 12B, the insulating portion 14B, and the insulating layer 15 are made of an organic material, for example, a resist mainly composed of an epoxy resin, and the dielectric layers 11 and 13 are made of an organic material such as an epoxy. By using a dielectric sheet in which a dielectric ceramic powder is mixed with resin, a filter can be configured without using a firing process, so that the insulating layer 9, the insulating part 10B, the insulating part 12B, the insulating part 14B, Shrinkage of the insulating layer 15 and the dielectric layers 11 and 13 can be made extremely small, and transmission characteristic variations due to manufacturing variations can be reduced.

次に、このようなフィルターの製造方法を以下に示す。 Next, the manufacturing method of such a filter is shown below.

まず、図８に示すごとく、シリコン基板等の基板８を用意する。 First, as shown in FIG. 8, a substrate 8 such as a silicon substrate is prepared.

次に、図９に示すごとく、フォトリソグラフィーにより基板８の上層に絶縁層９を形成する。 Next, as shown in FIG. 9, an insulating layer 9 is formed on the upper layer of the substrate 8 by photolithography.

その後、図１０に示すごとく、フォトリソグラフィーにより絶縁層９の上層に絶縁部１０Ｂを形成する。 Thereafter, as shown in FIG. 10, an insulating portion 10B is formed on the insulating layer 9 by photolithography.

次に、図１１に示すごとく、絶縁層９の上層における絶縁部１０Ｂ非形成部、及び絶縁部１０Ｂの上層に、無電解めっきにより下地電極層を形成した後、電気めっきにより導体３０を形成する。 Next, as shown in FIG. 11, after the base electrode layer is formed by electroless plating on the insulating layer 10B non-forming portion and the insulating portion 10B in the upper layer of the insulating layer 9, the conductor 30 is formed by electroplating. .

その後、図１２に示すごとく、絶縁部１０Ｂ上層に形成された導体を上方から研磨することにより、絶縁部１０Ｂ上層に形成された導体を除去して絶縁部１０Ｂを露出させる。ここで、絶縁層９上層における絶縁部１０Ｂ非形成部に入り込んだ導体３０が、グランド部１０Ａとなる。このグランド部１０Ａと絶縁部１０Ｂにより、グランド層１０を構成する。 Thereafter, as shown in FIG. 12, the conductor formed in the upper layer of the insulating portion 10B is polished from above, thereby removing the conductor formed in the upper layer of the insulating portion 10B and exposing the insulating portion 10B. Here, the conductor 30 that has entered the portion where the insulating portion 10B is not formed in the upper layer of the insulating layer 9 becomes the ground portion 10A. The ground portion 10A and the insulating portion 10B constitute the ground layer 10.

次に、図１３に示すごとく、ホットプレスによりグランド層１０の上層に誘電体層１１を形成する。 Next, as shown in FIG. 13, the dielectric layer 11 is formed on the ground layer 10 by hot pressing.

その後、図１４に示すごとく、フォトリソグラフィーにより誘電体層１１の上層に絶縁部１２Ｂを形成する。 After that, as shown in FIG. 14, an insulating portion 12B is formed on the dielectric layer 11 by photolithography.

次に、図１５に示すごとく、誘電体層１１の上層における絶縁部１２Ｂ非形成部、及び絶縁部１２Ｂの上層に、無電解めっきにより下地電極層を形成した後、電気めっきにより導体３１を形成する。 Next, as shown in FIG. 15, after forming a base electrode layer by electroless plating on the insulating layer 12B non-formation part in the upper layer of the dielectric layer 11 and on the insulating part 12B, a conductor 31 is formed by electroplating. To do.

その後、図１６に示すごとく、絶縁部１２Ｂ上層に形成された導体を上方から研磨することにより、絶縁部１２Ｂ上層に形成された導体を除去して絶縁部１２Ｂを露出させる。ここで、誘電体層１１上層における絶縁部１２Ｂ非形成部に入り込んだ導体３１が、コイル部１２Ａとなる。このコイル部１２Ａと絶縁部１２Ｂにより、コイル層１２を形成する。 Thereafter, as shown in FIG. 16, the conductor formed in the upper layer of the insulating portion 12B is polished from above, thereby removing the conductor formed in the upper layer of the insulating portion 12B and exposing the insulating portion 12B. Here, the conductor 31 that has entered the insulating layer 12B non-formation portion in the upper layer of the dielectric layer 11 becomes the coil portion 12A. The coil layer 12 is formed by the coil portion 12A and the insulating portion 12B.

次に、図１７に示すごとく、ホットプレスによりコイル層１２の上層に誘電体層１３を形成する。 Next, as shown in FIG. 17, the dielectric layer 13 is formed on the upper layer of the coil layer 12 by hot pressing.

その後、図１８に示すごとく、フォトリソグラフィーにより誘電体層１３の上層に絶縁部１４Ｂを形成する。 Thereafter, as shown in FIG. 18, an insulating portion 14B is formed on the dielectric layer 13 by photolithography.

次に、図１９に示すごとく、誘電体層１３の上層における絶縁部１４Ｂ非形成部、及び絶縁部１４Ｂの上層に、無電解めっきにより下地電極層を形成した後、電気めっきにより導体３２を形成する。 Next, as shown in FIG. 19, after forming a base electrode layer by electroless plating on the insulating layer 14B non-forming portion on the dielectric layer 13 and on the insulating portion 14B, a conductor 32 is formed by electroplating. To do.

その後、図２０に示すごとく、絶縁部１４Ｂ上層に形成された導体を上方から研磨することにより、絶縁部１４Ｂ上層に形成された導体を除去して絶縁部１４Ｂを露出させる。ここで、誘電体層１３上層における絶縁部１４Ｂ非形成部に入り込んだ導体３２が、入出力電極部１４Ａとなる。この入出力電極部１４Ａと絶縁部１４Ｂにより、入出力電極層１４を形成する。 Thereafter, as shown in FIG. 20, the conductor formed in the upper layer of the insulating portion 14B is polished from above, thereby removing the conductor formed in the upper layer of the insulating portion 14B and exposing the insulating portion 14B. Here, the conductor 32 entering the non-insulating portion 14B in the upper layer of the dielectric layer 13 becomes the input / output electrode portion 14A. The input / output electrode layer 14 is formed by the input / output electrode portion 14A and the insulating portion 14B.

次に、図１に示すごとく、ホットプレスにより入出力電極層１４の上層に絶縁層１５を形成することで、上記のような伝送特性ばらつきの少ないフィルタを形成することができる。 Next, as shown in FIG. 1, the insulating layer 15 is formed in the upper layer of the input / output electrode layer 14 by hot pressing, so that a filter with less variation in transmission characteristics as described above can be formed.

（実施の形態２）
以下、本発明の実施の形態２におけるフィルターについて図面を参照しながら説明する。 (Embodiment 2)
Hereinafter, the filter according to Embodiment 2 of the present invention will be described with reference to the drawings.

図２１において、実施の形態１と相違する点は、コイル層２８と入出力電極層２９のパターンである。 In FIG. 21, the difference from the first embodiment is the pattern of the coil layer 28 and the input / output electrode layer 29.

即ち、コイル層２８におけるコイル部２８Ａは、図２２に示すごとく４つのコイル２８ＡＡ、２８ＡＢ、２８ＡＣ、２８ＡＤからなり、このコイル２８ＡＡ、２８ＡＢ、２８ＡＣ、２８ＡＤはそれぞれ、コイル直線部３０Ａ、３０Ｂ、３０Ｃ、３０Ｄと、螺旋部３１Ａ、３１Ｂ、３１Ｃ、３１Ｄを有している。そして、このコイル直線部３０Ａ、３０Ｂ、３０Ｃ、３０Ｄは互いに略平行となるように配置し、螺旋部３１Ａはコイル直線部３０Ａを基準としてコイル２８ＡＢと逆方向に配置し、螺旋部３１Ｂはコイル直線部３０Ｂを基準としてコイル２８ＡＡと逆方向に配置し、螺旋部３１Ｃはコイル直線部３０Ｃを基準としてコイル２８ＡＤと逆方向に配置し、螺旋部３１Ｄはコイル直線部３０Ｄを基準としてコイル２８ＡＣと逆方向に配置している。そして、螺旋部３１Ａの巻回方向は螺旋部３１Ｂの巻回方向と逆方向とし、螺旋部３１Ｃの巻回方向は螺旋部３１Ｄの巻回方向と逆方向とし、コイル２８ＡＡとコイル２８ＡＢとが略線対称の関係、コイル２８ＡＣとコイル２８ＡＤとが略線対称の関係となるよう配置している。 That is, the coil portion 28A in the coil layer 28 is composed of four coils 28AA, 28AB, 28AC, 28AD as shown in FIG. 22, and these coils 28AA, 28AB, 28AC, 28AD are respectively coil straight portions 30A, 30B, 30C, 30D and spiral portions 31A, 31B, 31C, 31D. The coil straight portions 30A, 30B, 30C, and 30D are disposed so as to be substantially parallel to each other, the spiral portion 31A is disposed in a direction opposite to the coil 28AB with respect to the coil straight portion 30A, and the spiral portion 31B is disposed as a coil straight line. The spiral portion 31C is disposed in the direction opposite to the coil 28AD with respect to the coil straight portion 30C, and the spiral portion 31D is disposed in the direction opposite to the coil 28AC with respect to the coil straight portion 30D. Is arranged. The winding direction of the spiral portion 31A is opposite to the winding direction of the spiral portion 31B, the winding direction of the spiral portion 31C is opposite to the winding direction of the spiral portion 31D, and the coil 28AA and the coil 28AB are substantially the same. A line-symmetric relationship is established such that the coil 28AC and the coil 28AD have a substantially line-symmetric relationship.

そして、入出力電極層２９における入出力電極部２９Ａは図２３に示すようなパターンを形成している。即ち、入出力電極部２９Ａは直線部３２Ａ、３２Ｂ、３２Ｃ、３２Ｄとこれらに垂直な直線部３３Ａ、３３Ｂ、３３Ｃとから構成しており、直線部３２Ａと直線部３２Ｂとを接近させるとともに、直線部３２Ｃと直線部３２Ｄとを接近させている。そして、直線部３２Ｂと直線部３２Ｃとの間には直線部３３Ｂを配置して接続し、直線部３３Ａは直線部３２Ａを基準として直線部３３Ｂと逆方向に配置するとともに直線部３２Ａと接続し、直線部３３Ｃは直線部３２Ｄを基準として直線部３３Ｂと逆方向に配置するとともに直線部３２Ｄと接続し、入出力電極部２９Ａが全体として略線対称の関係となるよう配置している。 The input / output electrode portion 29A in the input / output electrode layer 29 has a pattern as shown in FIG. That is, the input / output electrode portion 29A is composed of the straight portions 32A, 32B, 32C, and 32D and the straight portions 33A, 33B, and 33C that are perpendicular to the straight portions 32A, 32B, 32C, and 32C. The portion 32C and the straight portion 32D are brought close to each other. The straight portion 33B is disposed and connected between the straight portion 32B and the straight portion 32C, and the straight portion 33A is disposed in the opposite direction to the straight portion 33B with respect to the straight portion 32A and is connected to the straight portion 32A. The straight line portion 33C is disposed in the opposite direction to the straight line portion 33B with respect to the straight line portion 32D and connected to the straight line portion 32D, and the input / output electrode portion 29A is disposed in a substantially line-symmetric relationship as a whole.

さらに、図２２に示すコイル直線部３０Ａと図２３に示す直線部３２Ａとを図２１に示す誘電体層１３を介して対向位置に配置し、図２２に示すコイル直線部３０Ｂと図２３に示す直線部３２Ｂとを図２１に示す誘電体層１３を介して対向位置に配置し、図２２に示すコイル直線部３０Ｃと図２３に示す直線部３２Ｃとを図２１に示す誘電体層１３を介して対向位置に配置し、図２２に示すコイル直線部３０Ｄと図２３に示す直線部３２Ｄとを図２１に示す誘電体層１３を介して対向位置に配置している。 Furthermore, the coil linear portion 30A shown in FIG. 22 and the linear portion 32A shown in FIG. 23 are arranged at opposing positions via the dielectric layer 13 shown in FIG. 21, and the coil linear portion 30B shown in FIG. 22 and FIG. The linear portion 32B is disposed at a position opposed to the dielectric layer 13 shown in FIG. 21, and the coil linear portion 30C shown in FIG. 22 and the linear portion 32C shown in FIG. 23 are arranged via the dielectric layer 13 shown in FIG. The coil linear portion 30D shown in FIG. 22 and the linear portion 32D shown in FIG. 23 are arranged at the opposing position via the dielectric layer 13 shown in FIG.

この構成により、一つのパッケージ内において二つのフィルターを構成することができ、これを用いた電子機器の小型化を実現することができる。 With this configuration, two filters can be configured in one package, and downsizing of electronic equipment using the same can be realized.

本発明のフィルターは、製造による伝送特性のばらつきが少ないという効果を有し、各種無線通信機器において有用である。 The filter of the present invention has an effect that there is little variation in transmission characteristics due to manufacturing, and is useful in various wireless communication devices.

本発明の実施の形態１におけるフィルターの断面図Sectional drawing of the filter in Embodiment 1 of this invention 本発明の実施の形態１のフィルターにおけるグランド層の上面図The top view of the ground layer in the filter of Embodiment 1 of the present invention 本発明の実施の形態１のフィルターにおけるコイル層の上面図The top view of the coil layer in the filter of Embodiment 1 of this invention 本発明の実施の形態１のフィルターにおける入出力電極層の上面図Top view of input / output electrode layer in filter of embodiment 1 of the present invention 本発明の実施の形態１におけるフィルターの伝送特性図Transmission characteristic diagram of filter in Embodiment 1 of the present invention 本発明の実施の形態１における入力信号の出力−周波数特性図Output-frequency characteristics diagram of input signal in Embodiment 1 of the present invention 本発明の実施の形態１における出力信号の出力−周波数特性図Output-frequency characteristic diagram of output signal in Embodiment 1 of the present invention 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態１におけるフィルターの製造工程を示す断面図Sectional drawing which shows the manufacturing process of the filter in Embodiment 1 of this invention. 本発明の実施の形態２におけるフィルターの断面図Sectional drawing of the filter in Embodiment 2 of this invention 本発明の実施の形態２のフィルターにおけるコイル層の上面図The top view of the coil layer in the filter of Embodiment 2 of this invention 本発明の実施の形態２のフィルターにおける入出力電極層の上面図The top view of the input-output electrode layer in the filter of Embodiment 2 of this invention 従来のフィルターの分解斜視図Exploded perspective view of a conventional filter

Explanation of symbols

８基板
９絶縁層
１０グランド層
１０Ａグランド部
１０Ｂ絶縁部
１１誘電体層
１２コイル層
１２Ａコイル部
１２Ｂ絶縁部
１３誘電体層
１４入出力電極層
１４Ａ入出力電極部
１４Ｂ絶縁部
１５絶縁層 8 Substrate 9 Insulating layer 10 Ground layer 10A Ground part 10B Insulating part 11 Dielectric layer 12 Coil layer 12A Coil part 12B Insulating part 13 Dielectric layer 14 Input / output electrode layer 14A Input / output electrode part 14B Insulating part 15 Insulating layer

Claims

A first insulating layer; a ground layer formed on the first insulating layer; a first dielectric layer formed on the ground layer; and formed on the first dielectric layer. A coil layer having a coil portion; a second dielectric layer formed on the coil layer; an input / output electrode layer having an input / output electrode portion formed on the second dielectric layer; An LC filter comprising a second insulating layer formed on an output electrode layer, wherein the first and second insulating layers and the first and second dielectric layers are made of an organic material.

The LC filter according to claim 1, wherein at least one element of copper, gold, and nickel is used for the coil portion.

The LC filter according to claim 1, wherein at least one of copper, gold, and nickel is used for the input / output electrode portion.

The coil portion has a first coil and a second coil, and the first and second coils each have a coil straight portion and a spiral portion, and the coil straight portions of the first and second coils. Are arranged so as to be substantially parallel to each other, and the spiral portion of the first coil is arranged in the direction opposite to the second coil with respect to the coil linear portion of the first coil, and the second coil The spiral portion is disposed in the direction opposite to the first coil with respect to the coil straight portion of the second coil, and the winding direction of the spiral portion of the first coil is the winding of the spiral portion of the second coil. 2. The LC filter according to claim 1, wherein the first coil and the second coil are arranged so as to have a substantially line-symmetrical relationship in a direction opposite to the rotational direction.

The input / output electrode section has a first input / output electrode and a second input / output electrode, and the first and second input / output electrodes are respectively perpendicular to the first straight line section and the first straight line section. And the first linear portions of the first and second input / output electrodes are arranged so as to be substantially parallel to each other, and the first input / output electrodes of the first input / output electrode are arranged in parallel with each other. The second straight line portion is arranged in a direction opposite to the second input / output electrode with respect to the first straight line portion of the first input / output electrode, and the second straight line portion in the second input / output electrode is The first input / output electrode is disposed in a direction opposite to the first input / output electrode with respect to the first straight line portion of the second input / output electrode, and the first input / output electrode and the second input / output electrode are substantially line symmetrical. The LC filter according to claim 4, which is arranged so as to be in a relation.

The coil linear part in the first coil and the first linear part in the first input / output electrode are arranged at opposing positions via the second dielectric layer, and the coil linear part in the second coil and the second linear part The LC filter according to claim 5, wherein the first linear portion of the input / output electrode is disposed at a position opposed to the first linear portion via the second dielectric layer.