JP2007234944A - Determination method of silk printing version number, and printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method of a silk printing version number in which a line pattern representing a version number of a silk printing is printed by a conductive ink and the version number of the silk printing is inspected at the printed position, and to provide its printed board. <P>SOLUTION: In the inspection method of the silk printing version number of the printed board, this method comprises a sequence of silk-printing the line pattern of a given shape on the printed board by using a screen mask disposed corresponding to a version number and the conductive ink, and a sequence of applying a probe pin to a position predetermined on the printed board which is silk-printed, for energization, to inspect the version number according to whether or not the printed board is energized. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  More specifically, a method for inspecting the number of silk-printed plates on a printed circuit board, more specifically, printing a line pattern indicating the number of silk-printed plates with a conductive ink, and inspecting the number of silk-printed plates at the printed position. The present invention relates to a number inspection method and a printed circuit board on which a line pattern representing a plate number is printed at a predetermined position with conductive ink.

  Various circuit components are mounted on the printed circuit board, and symbols, symbols, component numbers, pin numbers, and the like indicating the types of these mounted components are printed on the printed circuit board. This printing is called silk printing, and the silk printing makes it easy to check the position and direction of placement in component mounting, or to inspect the position and wiring of components after mounting.

  In recent years, it has become common to design printed circuit boards using a mounting CAD (Computer Aided Design) system. Specifically, on the basis of information on an electronic circuit designed using a CAD system for circuit design, components are arranged on a board while interacting with a computer, and wiring between these components is performed. In a more advanced CAD system, component placement and wiring are automatically processed. From the design information thus designed, the wiring pattern, resist pattern, silk print pattern artwork data and drill data for drilling are output. In silk printing, a block is created using artwork data for silk printing, and screen printing is performed on a printed circuit board with a screen created by the block.

  If there is any inconvenience in the electronic circuit, a part of the electronic circuit is changed, and the conductor circuit pattern (wiring pattern), the solder resist pattern, and the silk print pattern are changed accordingly. Such a change is managed by the plate number of the figure number. For example, in the case of a conductor circuit pattern, a copper pattern is formed so that the plate number can be visually confirmed by etching at a predetermined place on the printed circuit board. In the case of silk printing, the number of silk printing plates is printed on a predetermined place of a printed board by screen printing. FIG. 7 shows an example of a conventional silk-printed printed circuit board. The printed circuit board 100 has a circuit symbol 130 (here, a symbol indicating a fixed resistor is shown as an example) and a part number 120 (here, In this example, a part number of the fixed resistor is shown as an example), and a silk-printed figure number and its plate number 110 are printed.

  In the production of a printed circuit board, it is important to form a conductor circuit pattern and a silk print pattern with a predetermined number of plates, and an inspection process for that is indispensable. Visual inspection is common for these plate number inspection methods.

A method using a CCD (Charge Coupled Device) camera has been proposed as a pattern inspection method for silk printing. This method illuminates a silk-printed printed circuit board from an oblique direction, and detects the pattern by utilizing the fact that the swell of the silk-printed portion is irregularly reflected by the oblique illumination and the pattern shines (for example, patent document). 1).
JP 2001-343337 A

  As described above, the inspection of the number of silk printing plates is generally performed by visual inspection. Although it is not impossible to read the version number represented by alphanumeric characters using an OCR (Optical Character Reader), the inspection equipment is expensive and the inspection cost is high, and there is a problem in introducing the equipment.

  Although the method proposed in Patent Document 1 is considered to be an effective method for detecting a defect in a pattern by silk printing, it is difficult to detect the number of silk printing plates.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for inspecting the number of plates of silk printing by an easy method at a low cost and a printed circuit board corresponding to the method.

The silk printing plate number inspection method and printed circuit board of the present invention are configured as follows.
(1) 1st invention 1st invention is an inspection method which prints the line pattern showing the number of plates of silk printing on a printed circuit board, and performs plate number inspection. This method comprises a silk printing procedure 10 and a plate number inspection procedure 20, and the principle diagram is shown in FIG.

  The silk printing procedure 10 is to perform silk printing on a printed circuit board using a screen mask and conductive ink. The screen mask has a predetermined symbol in addition to a circuit symbol and a character representing a part number used in the prior art. A line pattern having a shape is arranged. This line pattern is arranged to be printed at a specific position among a plurality of predetermined positions on the printed circuit board so as to represent the number of silk-printed plates at the position of the line pattern.

  The plate number inspection procedure 20 is energized by applying probe pins for energization checking to a plurality of predetermined positions on the printed circuit board printed by the silk printing procedure 10. Then, the number of silk-printed plates is inspected based on the position where the line pattern is printed and energized and the position where the line pattern is not printed and energized. For example, when there are three predetermined positions a, b, and c, a probe pin for performing energization check is applied to the position to energize, and a conductive line pattern is printed and energized. When “1” is set to “0” when no line pattern is printed and no current is supplied, the results of current supply at positions a, b, and c are “0”, “0”, and “1”, respectively. If it is, the version number is inspected as “1 version”.

According to the first aspect of the invention, since the plate number inspection of silk printing can be performed with a simple energization check, a low-cost inspection method can be provided.
(2) Second invention The second invention is an invention of a printed circuit board capable of inspecting the plate number of silk printing.

  A line pattern for plate number inspection is printed on the printed board using conductive ink, and the arrangement position of the printed line pattern is a specific position among a plurality of predetermined positions on the printed board. The number of silk-printed plates is represented at the position of the arrangement.

According to the second invention, since the line pattern representing the number of plates for silk printing has conductivity, it is possible to provide a printed circuit board capable of inspecting the number of plates by a simple method of whether or not current is applied.
(3) Third invention In a third invention, a predetermined position of a line pattern printed on a printed circuit board corresponds to a binary digit. For example, when there are three predetermined positions a, b, and c, the energization results at the positions a, b, and c in which the energization check is performed as described above are “0”, “1”, In the case of “1”, a corresponds to the 2nd digit of binary number, b corresponds to the 1st digit of binary number, c corresponds to the 2nd digit of binary number 2, In this case, the version number is inspected as “3 version”.

  According to the third invention, since the printing position of the line pattern expresses a binary numerical value, a large numerical value can be expressed with a small number of line patterns, and the printing area of the line pattern can be reduced.

  According to the first invention, since the number of silk-printed plates can be inspected by a simple energization check, a low-cost inspection method can be provided.

  According to the second invention, since the silk-printed line pattern has conductivity, it is possible to provide a printed circuit board capable of inspecting the plate number with a simple energization check.

  According to the third aspect of the present invention, since the arrangement position of the line pattern is made to correspond to the binary digit, the printing area of the line pattern that can express a large numerical plate number with a small number of line patterns can be reduced.

  An embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 shows an example of a printed board printed with silk based on the first invention. In addition to the diagram illustrating silk printing of a conventional printed circuit board in FIG. 7, the line pattern 140 is silk-printed in FIG. In this example, the line pattern 140 is arranged so as to be printed near the portion where the figure number and the plate number of the end portion of the printed circuit board 100 are printed.

  Moreover, the conductive ink used for this silk printing can mention the thing which used the polyester resin as a binder and used silver as the electroconductive particle, for example.

  FIG. 3 is a diagram for explaining an inspection method for examining the plate number of a printed board on which the line pattern shown in FIG. 2 is silk-printed. First, the inspection apparatus will be described. The inspection apparatus includes an inspection table 200 including a column 210 and a plate number inspection jig probe 300.

  The inspection table 200 includes two sides of a frame that are in contact with each other, and the inside of the frame portion is a reference plane. The printed circuit board 100 to be inspected is placed on the inspection table in a predetermined direction, and the printed circuit board is placed against the reference surface. Thereby, the position of the area where the line pattern 140 of the printed board is printed is determined.

  A support 210 is attached to the inspection table 200, and a plate number inspection jig probe 300 is attached so as to slide the support 210 up and down. The plate number inspection jig probe 300 includes an electrode assembly 310, a DC power source 320, and lamps La330 to Lc350. The electrode assembly 310 includes a wide common electrode on the bottom surface and three narrow individual electrodes facing the common electrode, with a predetermined gap between the common electrode and the three individual electrodes. Yes. The common electrode is connected to one terminal of three lamps via a DC power source, and the individual electrode is connected to the other terminal of each lamp. In this example, three lamps are provided, which can detect the presence or absence of up to three line patterns 140.

  Next, a method for performing a plate number inspection for silk printing using the above-described inspection apparatus will be described. The printed circuit board is installed in alignment with the reference surface of the inspection table 200, and the plate number inspection jig probe 300 is moved downward along the support 210 so that the bottom surface of the plate number inspection jig probe 300 is in contact with the printed circuit board 100. To do. The plate number inspection jig probe 300 is in contact with the area where the line pattern 140 is printed on the printed circuit board 100. If the line pattern 140 is printed in that area, the line pattern 140 has conductivity, so that the common electrode and the individual electrode Are electrically connected to each other, and a current flows through the lamp. That is, the lamp is turned on. For example, if the line pattern 140 is printed at the innermost position in FIG. 3, the lamp La330 is lit. Further, if the line pattern 140 is printed at the front position, the lamp Lb340 is turned on, and if the line pattern 140 is printed at the frontmost position, the lamp Lc350 is turned on. If the two line patterns 140 are printed, the two lamps are turned on. The number of silk printing plates is determined by the printing position of the line pattern 140. For example, when only the lamp La is turned on, the number of plates is assumed to be “one plate”.

  Next, an example of the relationship between the arrangement position of the line pattern 140 and the version number will be described. FIG. 4 shows the number of plates using three line patterns 140. If the line pattern 140 is printed at the position shown in FIG. FIG. 4B shows a state in which the line pattern 140 is printed at a position spaced apart from the position in FIG. 4A by a predetermined distance. If the line pattern 140 is printed at this position, “two plates” is displayed. And FIG. 4C shows a state in which the line pattern 140 is printed at a position spaced apart from the position of FIG. 4B by a predetermined interval. If the line pattern 140 is printed at this position, “3” is shown. Version ". By detecting that the line pattern 140 is printed at these three positions by the plate number inspection jig probe 300 described above, the plate numbers from “1 plate” to “3 plate” can be inspected.

  Next, an example of the relationship between the arrangement position of the other line pattern 140 and the version number will be described. FIG. 5 also shows the number of plates using three line patterns 140. If the line pattern 140 is printed at the position of FIG. 5A, this is referred to as “one plate”. This is the same as FIG. Next, if two line patterns 140 are printed as shown in FIG. In this case, two lamps La330 and Lb340 of the plate number inspection jig probe 300 are lit. The arrangement of the line pattern 140 indicating “3 version” is the arrangement shown in FIG. The intervals of the line patterns 140 are assumed to be separated by a predetermined interval as described with reference to FIG. The example shown in FIG. 5 has a feature that can be easily identified visually.

  Finally, an example of the arrangement position of another line pattern 140 will be described. In this case, the arrangement position of the line pattern 140 is made to correspond to each binary digit. FIG. 6 illustrates an example. For example, if the line pattern 140 is printed at the position shown in FIG. 6A, this position corresponds to the binary number “2 to the 0th power” and is “1 version”. To be interpreted. The next position in FIG. 6B corresponds to “1 to the power of 2”. If only one line pattern 140 is printed at this position, the number of plates is “2 plates”. Furthermore, if the line pattern 140 is printed as shown in FIG. The foremost position corresponds to “square of 2”, and if the line pattern 140 is printed only at this position, it is “fourth plate”. Therefore, if the line pattern 140 is printed at all three positions, it is “seventh plate”. In this way, by matching the three arrangement positions of the binary number and the line pattern 140, “1st plate” to “7th plate” can be expressed, and the print area of the line pattern 140 can be reduced.

  The inspection apparatus, the inspection method using the inspection apparatus, and the line pattern arrangement method have been described above. Since the inspection device has a simple structure and circuit, the inspection cost can be kept low.

It is a principle diagram of the invention. It is an example of the printed circuit board which performed the silk printing by this invention. It is an Example of the inspection method of the number of silk printing plates. It is the example of arrangement | positioning of a line pattern (the 1). It is the example of arrangement | positioning of the line pattern (the 2). It is the example of the arrangement of a line pattern (the 3). It is an example of a conventional printed board for silk printing.

Explanation of symbols

100 Printed circuit board 110 Drawing number and version number
120 Part number
130 Circuit Symbol 140 Line Pattern 300 Version Number Inspection Jig Probe 310 L1 (Lamp 1)
320 L2 (Lamp 2)
330 L3 (Lamp 3)

Claims (3)

A silk printing plate number inspection method for inspecting the number of silk printing plates printed on a printed circuit board,
In addition to the characters and the like representing circuit symbols and component numbers of components mounted on the printed circuit board, a plurality of predetermined predetermined line patterns on the printed circuit board so that the line pattern having a predetermined shape is represented by the position of the line pattern. A silk printing procedure for performing silk printing on the printed circuit board using a screen mask arranged to be printed at a specific position among the positions, and a conductive ink;
Energization is performed by applying probe pins for energization checking to the predetermined positions of the printed circuit board printed with silk, and the line pattern is printed and energized without printing the line pattern. A plate number inspection procedure for inspecting the number of plates of silk printing based on the position without
A silk printing plate number inspection method comprising: A printed circuit board printed with a line pattern for inspection of the number of silk printing plates,
The line pattern having a predetermined shape is silk-printed with a conductive ink at a specific position among a plurality of predetermined positions on the printed circuit board, and the number of silk-printed plates is represented at the printing position of the line pattern. Characteristic printed circuit board. A plurality of predetermined positions, each of the positions corresponding to a predetermined binary digit;
The printed circuit board according to claim 2.

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