JP2007234708A - Capacitor - Google Patents

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Publication number
JP2007234708A
JP2007234708A JP2006051617A JP2006051617A JP2007234708A JP 2007234708 A JP2007234708 A JP 2007234708A JP 2006051617 A JP2006051617 A JP 2006051617A JP 2006051617 A JP2006051617 A JP 2006051617A JP 2007234708 A JP2007234708 A JP 2007234708A
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resin
capacitor
external connection
connection terminals
filling
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Katsuyuki Hiragami
克之 平上
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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Priority to JP2006051617A priority Critical patent/JP2007234708A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a capacitor which is raised in reliability and capable of suppressing the occurrence of a crack in the drawing-out part of the outside connecting terminals from a sealing resin, even when circumferential temperature is changed in the arrangement place of the capacitor. <P>SOLUTION: A capacitor element 1 is stored in a case 2 so as to be filled with the resin 3, and the outside connecting terminals 6, 7 are derived from the filling resin 3 to an outside concerning the capacitor. Notched parts 10 obtained by notching the outside connecting terminals 6, 7 are formed at contacts between the outside connecting terminals 6, 7 and the surface of the resin and in each adjacent position so as to be arcuately recessed from both the sides of the outside connecting terminals 6, 7. The filling resin 3 entering the notched parts 10 reinforce the restriction of a relative vertical movement concerning the outside connecting terminal 6, 7 and the filling resin 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、コンデンサ素子をケースに収納し、樹脂を充填した構造のコンデンサに関するものである。   The present invention relates to a capacitor having a structure in which a capacitor element is housed in a case and filled with resin.

コンデンサ素子をケースに収納し、樹脂を充填した構造のコンデンサは公知である(例えば、特許文献1、特許文献2)。このコンデンサの概略構造を図2に示している。同図において、21はコンデンサ素子であり、このコンデンサ素子21が、上方に開口したケース22に収納され、この状態でエポキシ樹脂23によって封止されている。コンデンサ素子21の上下面にはメタリコン電極24、25が形成されており、各メタリコン電極24、25には、外部接続端子26、27が半田付け28によって接続され、各外部接続端子26、27が、封止樹脂23から外部へと導出されている。
特開2005−159107号公報 特開2005−039058号公報
Capacitors having a structure in which a capacitor element is housed in a case and filled with resin are known (for example, Patent Document 1 and Patent Document 2). A schematic structure of this capacitor is shown in FIG. In the figure, reference numeral 21 denotes a capacitor element. The capacitor element 21 is housed in a case 22 opened upward, and is sealed with an epoxy resin 23 in this state. Metallicon electrodes 24, 25 are formed on the upper and lower surfaces of the capacitor element 21. External connection terminals 26, 27 are connected to the metallicon electrodes 24, 25 by soldering 28, and the external connection terminals 26, 27 are connected to each other. The lead is led out from the sealing resin 23 to the outside.
JP-A-2005-159107 Japanese Patent Laying-Open No. 2005-039058

ところで、上記した構造のコンデンサにおいては、コンデンサの設置場所の周囲温度が変化すると、各外部接続端子26、27の封止樹脂23からの引き出し部分(図2における矢印A部分)においてクラックが発生するという問題が生じることがある。それは、コンデンサ素子21、封止樹脂23、外部接続端子26、27の材質の相違により、各部の熱膨張係数が異なることに起因する。これを防止しようとすれば、軟質の樹脂23を用いればよいが、その場合には、コストアップを招くという不都合の生じることが予想される。   By the way, in the capacitor having the above-described structure, when the ambient temperature at the place where the capacitor is installed changes, cracks are generated in the portions where the external connection terminals 26 and 27 are drawn from the sealing resin 23 (arrow A portion in FIG. 2). May arise. This is because the coefficient of thermal expansion of each part differs due to the difference in the material of the capacitor element 21, the sealing resin 23, and the external connection terminals 26 and 27. In order to prevent this, the soft resin 23 may be used, but in that case, it is expected that there will be an inconvenience of increasing the cost.

この発明は、上記従来の問題点を解決するためになされたものであって、その目的は、コンデンサの設置場所の周囲温度が変化しても外部接続端子の封止樹脂からの引き出し部分においてクラックが発生するのを抑制することが可能であり、そのため、信頼性の向上されたコンデンサを提供することにある。   The present invention has been made to solve the above-described conventional problems, and its object is to crack the lead-out portion of the external connection terminal from the sealing resin even if the ambient temperature of the capacitor installation location changes. Therefore, it is possible to provide a capacitor with improved reliability.

そこで、この発明のコンデンサは、コンデンサ素子1をケース2に収納し樹脂3を充填するとともに、外部接続端子6、7を充填樹脂3から外方へと導出して成るコンデンサにおいて、外部接続端子6、7においては、樹脂表面との接触部及びその近傍の位置に、他の部分よりも横断面積の小となる括れ部10を設けたことを特徴としている。   Therefore, the capacitor of the present invention is a capacitor in which the capacitor element 1 is housed in the case 2 and filled with the resin 3, and the external connection terminals 6 and 7 are led out from the filled resin 3 to the outside. 7 is characterized in that a constricted portion 10 having a smaller cross-sectional area than other portions is provided at a portion in contact with the resin surface and in the vicinity thereof.

この発明において、平板状の外部接続端子6、7を用いる場合には、上記括れ部10を、外部接続端子6、7の両側から円弧状に凹入するように外部接続端子6、7を切欠いた切欠き部10として形成している。   In the present invention, when the flat external connection terminals 6 and 7 are used, the external connection terminals 6 and 7 are notched so that the constricted portion 10 is recessed in an arc shape from both sides of the external connection terminals 6 and 7. It is formed as a notch 10 that has been cut.

また、外部接続端子6、7の適所には貫通孔11を設け、貫通孔11内に充填樹脂3を侵入させるようにする。   In addition, through holes 11 are provided at appropriate positions of the external connection terminals 6 and 7 so that the filling resin 3 enters the through holes 11.

さらに、外部接続端子6、7には、コンデンサ素子1のメタリコン電極4、5と接触する部分6a、7aに、透孔12を設け、この透孔12を通して充填樹脂3がメタリコン電極4、5に接触するようにしている。   Further, the external connection terminals 6 and 7 are provided with through holes 12 in the portions 6 a and 7 a that are in contact with the metallicon electrodes 4 and 5 of the capacitor element 1, and the filling resin 3 is connected to the metallicon electrodes 4 and 5 through the through holes 12. I try to make contact.

この発明のコンデンサでは、括れ部、あるいは切欠き部に進入した充填樹脂によって、外部接続端子と充填樹脂との相対移動、例えば、図1においては上下方向への相対移動の規制が強化され、この結果、コンデンサの設置場所の周囲温度が変化しても外部接続端子の封止樹脂からの引き出し部分においてクラックが発生するのを抑制することが可能であり、そのため、信頼性の向上されたコンデンサを提供することができる。   In the capacitor according to the present invention, the restriction of relative movement between the external connection terminal and the filling resin, for example, relative movement in the vertical direction in FIG. As a result, it is possible to suppress the occurrence of cracks in the lead-out portion of the external connection terminal from the sealing resin even if the ambient temperature of the capacitor installation location changes. Therefore, a capacitor with improved reliability can be obtained. Can be provided.

また、この発明のコンデンサでは、外部接続端子の適所には貫通孔を設け、貫通孔内に充填樹脂を侵入させているので、外部接続端子と充填樹脂との相対移動の規制が強化され、この結果、クラックの発生を一段と効果的に抑制でき、コンデンサの信頼性を一段と向上できる。   Further, in the capacitor according to the present invention, a through hole is provided at an appropriate position of the external connection terminal, and the filling resin is intruded into the through hole, so that the restriction on relative movement between the external connection terminal and the filling resin is strengthened. As a result, the occurrence of cracks can be more effectively suppressed, and the reliability of the capacitor can be further improved.

さらに、この発明のコンデンサでは、外部接続端子には、コンデンサ素子のメタリコン電極と接触する部分に、透孔を設け、この透孔を通して充填樹脂がメタリコン電極に接触するようにしているので、外部接続端子、充填樹脂、メタリコン電極の相対移動の規制が強化され、この結果、メタリコン電極に作用する温度変形ストレスが軽減され、クラックの発生を一段と効果的に抑制でき、コンデンサの信頼性を一段と向上できる。   Furthermore, in the capacitor according to the present invention, the external connection terminal is provided with a through hole in a portion of the capacitor element that contacts the metallicon electrode, and the filling resin is in contact with the metallicon electrode through the through hole. Restriction of relative movement of terminals, filling resin, and metallicon electrodes has been strengthened. As a result, temperature deformation stress acting on metallicon electrodes can be reduced, cracks can be more effectively suppressed, and the reliability of capacitors can be further improved. .

次に、この発明のコンデンサの具体的な実施の形態について、図面を参照しつつ詳細に説明する。図1において、1はコンデンサ素子であり、このコンデンサ素子1が、上方に開口したケース2に収納され、この状態でエポキシ樹脂3によって封止されている。コンデンサ素子1の上下面には、例えば、亜鉛溶射によるメタリコン電極4、5が形成されており、各メタリコン電極4、5には、平板状の外部接続端子6、7が半田付け8によって接続され、各外部接続端子6、7が、封止樹脂3から外部へと導出されている。上記上側のメタリコン電極4に接続された外部接続端子6は、電極接続部6aと、外部へと導出される導出部6bと、これらを連結する連結部6cとが一体に形成されたものである。また、上記下側のメタリコン電極5に接続された外部接続端子7も同様に、電極接続部7aと、外部へと導出される導出部7bと、これらを連結する連結部7cとが一体に形成されたものであって、この外部接続端子7は、上側のメタリコン電極4とは、電気的に絶縁されている。   Next, specific embodiments of the capacitor of the present invention will be described in detail with reference to the drawings. In FIG. 1, reference numeral 1 denotes a capacitor element. This capacitor element 1 is housed in a case 2 that opens upward and is sealed with an epoxy resin 3 in this state. Metallicon electrodes 4 and 5 are formed on the upper and lower surfaces of the capacitor element 1 by, for example, zinc spraying, and flat external connection terminals 6 and 7 are connected to the metallicon electrodes 4 and 5 by soldering 8. The external connection terminals 6 and 7 are led out from the sealing resin 3 to the outside. The external connection terminal 6 connected to the upper metallicon electrode 4 is formed by integrally forming an electrode connection portion 6a, a lead-out portion 6b led out to the outside, and a connecting portion 6c for connecting them. . Similarly, the external connection terminal 7 connected to the lower metallicon electrode 5 is also integrally formed with an electrode connection portion 7a, a lead-out portion 7b led out to the outside, and a connecting portion 7c for connecting them. The external connection terminal 7 is electrically insulated from the upper metallicon electrode 4.

図1(b)に示すように、上記両外部接続端子6、7において、導出部6b、7bには、その中途部の位置であって、樹脂表面との接触部及びその近傍の位置(充填樹脂3からの引出し部分)に、他の部分よりも横断面積の小となる括れ部10を設けている。この括れ部10は、この場合、外部接続端子6、7の両側から円弧状に凹入するように外部接続端子6、7を切欠いた切欠き部10として形成している。そして、この切欠き部10の下半分が、充填樹脂3内に埋設されている。また、図1(a)に示すように、上記各外部接続端子6、7における連結部6c、7cの内、上側のメタリコン電極4と相対向する部分には、貫通孔11、11が穿設されており、各貫通孔11、11内にも充填樹脂3を進入させている。さらに、図1(a)に示すように、上側のメタリコン電極4に接続される外部接続端子6の電極接続部6aには、透孔12が穿設されており、充填樹脂3をこの透孔12内に進入させ、メタリコン電極4と充填樹脂3とを密着させている。なお、図示しないが、下側のメタリコン電極5に接続される外部接続端子7の電極接続部7aにも、上記同様の透孔が形成されている。   As shown in FIG. 1 (b), in the external connection terminals 6 and 7, the lead-out portions 6b and 7b are located in the middle of the contact portion with the resin surface and in the vicinity thereof (filling A constricted portion 10 having a smaller cross-sectional area than other portions is provided in a portion drawn from the resin 3. In this case, the constricted portion 10 is formed as a cutout portion 10 in which the external connection terminals 6 and 7 are cut out so as to be recessed in an arc shape from both sides of the external connection terminals 6 and 7. The lower half of the notch 10 is embedded in the filling resin 3. Further, as shown in FIG. 1A, through holes 11 and 11 are formed in portions of the connecting portions 6c and 7c in the external connection terminals 6 and 7 facing the upper metallicon electrode 4 in the respective connecting portions 6c and 7c. The filling resin 3 is also allowed to enter the through holes 11 and 11. Further, as shown in FIG. 1A, a through hole 12 is formed in the electrode connecting portion 6a of the external connection terminal 6 connected to the upper metallicon electrode 4, and the filling resin 3 is passed through the through hole. The metallicon electrode 4 and the filling resin 3 are brought into close contact with each other. Although not shown, a through hole similar to the above is also formed in the electrode connection portion 7 a of the external connection terminal 7 connected to the lower metallicon electrode 5.

上記コンデンサでは、括れ部10、あるいは切欠き部10に進入した充填樹脂3によって、外部接続端子6、7と充填樹脂3との相対移動、例えば、図1においては上下方向への相対移動の規制が強化され、この結果、コンデンサの設置場所の周囲温度が変化しても外部接続端子6、7の封止樹脂3からの引き出し部分においてクラックが発生するのを抑制することが可能であり、そのため、信頼性の向上されたコンデンサを提供することができる。   In the capacitor described above, the relative movement between the external connection terminals 6 and 7 and the filling resin 3, for example, the relative movement in the vertical direction in FIG. As a result, it is possible to suppress the occurrence of cracks in the lead-out portions of the external connection terminals 6 and 7 from the sealing resin 3 even if the ambient temperature at the capacitor installation location is changed. A capacitor with improved reliability can be provided.

また、上記コンデンサでは、外部接続端子6、7の連結部6c、7cに、貫通孔11を設け、貫通孔11内に充填樹脂3を侵入させているので、外部接続端子6、7と充填樹脂3との相対移動の規制が強化され、この結果、クラックの発生を一段と効果的に抑制でき、コンデンサの信頼性を一段と向上できる。   In the capacitor, since the through holes 11 are provided in the connecting portions 6c and 7c of the external connection terminals 6 and 7, and the filling resin 3 is intruded into the through holes 11, the external connection terminals 6 and 7 and the filling resin As a result, the occurrence of cracks can be more effectively suppressed and the reliability of the capacitor can be further improved.

さらに、上記コンデンサでは、外部接続端子6、7には、コンデンサ素子1のメタリコン電極4、5と接触する部分6a、7aに、透孔12を設け、この透孔12を通して充填樹脂3がメタリコン電極4、5に密着するようにしているので、外部接続端子6、7、充填樹脂3、メタリコン電極4、5の相対移動の規制が強化され、この結果、メタリコン電極4、5に作用する温度変形ストレスが軽減され、クラックの発生を一段と効果的に抑制でき、コンデンサの信頼性を一段と向上できる。   Further, in the capacitor, the external connection terminals 6 and 7 are provided with through holes 12 in the portions 6a and 7a that are in contact with the metallicon electrodes 4 and 5 of the capacitor element 1. 4 and 5, the restriction of relative movement of the external connection terminals 6 and 7, the filling resin 3, and the metallicon electrodes 4 and 5 is strengthened. As a result, the temperature deformation acting on the metallicon electrodes 4 and 5 is enhanced. Stress can be reduced, cracks can be suppressed more effectively, and the reliability of the capacitor can be further improved.

以上にこの発明のコンデンサの具体的な実施の形態について説明したが、この発明は上記実施の形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、上記実施形態においては、貫通孔11を、外部接続端子6、7の連結部6c、7cに設けているが、この貫通孔11は、導出部6b、7bにおいて、充填樹脂3に埋設される部分に設けてもよい。また、充填樹脂3は、エポキシ樹脂に限られるものではないし、メタリコン電極4、5も亜鉛溶射に限られるものではなく、これら材質は、種々変更して実施することが可能である。   Although the specific embodiment of the capacitor of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. . For example, in the above-described embodiment, the through hole 11 is provided in the connecting portions 6c and 7c of the external connection terminals 6 and 7, but this through hole 11 is embedded in the filling resin 3 in the lead-out portions 6b and 7b. You may provide in the part. Further, the filling resin 3 is not limited to the epoxy resin, and the metallicon electrodes 4 and 5 are not limited to the zinc spraying, and these materials can be variously changed.

この発明の実施の形態であるコンデンサを示す図で、(a)は樹脂充填前の状態を示す平面図、(b)は樹脂充填後の断面図である。It is a figure which shows the capacitor | condenser which is embodiment of this invention, (a) is a top view which shows the state before resin filling, (b) is sectional drawing after resin filling. 従来のコンデンサを示す図で、(a)は樹脂充填前の状態を示す平面図、(b)は樹脂充填後の断面図である。It is a figure which shows the conventional capacitor | condenser, (a) is a top view which shows the state before resin filling, (b) is sectional drawing after resin filling.

符号の説明Explanation of symbols

1・・コンデンサ素子、2・・ケース、3・・充填樹脂、4、5・・メタリコン電極、6、7・・外部接続端子、8・・半田付け部、10・・括れ部(切欠き部)、11・・貫通孔、12・・透孔     1 .. Capacitor element 2 .. Case 3 .. Filling resin 4, 5 .. Metallicon electrode, 6, 7 .. External connection terminal, 8 .. Solder part, 10. ) 、 11 ・ ・ Through hole, 12 ・ ・ Through hole

Claims (4)

コンデンサ素子(1)をケース(2)に収納し樹脂(3)を充填するとともに、外部接続端子(6)(7)を充填樹脂(3)から外方へと導出して成るコンデンサにおいて、外部接続端子(6)(7)においては、樹脂表面との接触部及びその近傍の位置に、他の部分よりも横断面積の小となる括れ部(10)を設けたことを特徴とするコンデンサ。   The capacitor element (1) is housed in the case (2) and filled with the resin (3), and the external connection terminals (6) and (7) are led out from the filled resin (3) to the outside. In the connection terminals (6) and (7), a constriction portion (10) having a smaller cross-sectional area than other portions is provided at the contact portion with the resin surface and in the vicinity thereof. 上記外部接続端子(6)(7)として平板状のものを用い、上記括れ部(10)を、外部接続端子(6)(7)の両側から円弧状に凹入するように外部接続端子(6)(7)を切欠いた切欠き部(10)として形成したことを特徴とする請求項1のコンデンサ。   The external connection terminals (6) and (7) are flat, and the constricted portion (10) is externally connected to the external connection terminals (6) and (7) so as to be recessed in an arc shape from both sides. 6. The capacitor according to claim 1, wherein the notch is formed as a notch (10). 上記外部接続端子(6)(7)の適所には貫通孔(11)を設け、貫通孔(11)内に充填樹脂(3)を侵入させたことを特徴とする請求項1又は請求項2のコンデンサ。   3. A through hole (11) is provided at an appropriate position of the external connection terminal (6) (7), and the filling resin (3) is inserted into the through hole (11). Capacitor. 上記外部接続端子(6)(7)には、コンデンサ素子1のメタリコン電極(4)(5)と接触する部分(6a)(7a)に、透孔(12)を設け、この透孔(12)を通して充填樹脂(3)がメタリコン電極(4)(5)に接触するようにしていることを特徴とする請求項1〜請求項3のいずれかのコンデンサ。   The external connection terminals (6) and (7) are provided with through holes (12) in portions (6 a) and (7 a) that are in contact with the metallicon electrodes (4) and (5) of the capacitor element 1. The capacitor according to any one of claims 1 to 3, wherein the filling resin (3) is brought into contact with the metallicon electrode (4) (5).
JP2006051617A 2006-02-28 2006-02-28 Capacitor Pending JP2007234708A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323060A (en) * 2018-03-30 2019-10-11 Tdk株式会社 Electronic component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374801A (en) * 1989-08-16 1991-03-29 Matsushita Electric Ind Co Ltd Electronic parts
JP2005085880A (en) * 2003-09-05 2005-03-31 Shizuki Electric Co Inc Electrical component
JP2005108957A (en) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd Case-mold film capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0374801A (en) * 1989-08-16 1991-03-29 Matsushita Electric Ind Co Ltd Electronic parts
JP2005085880A (en) * 2003-09-05 2005-03-31 Shizuki Electric Co Inc Electrical component
JP2005108957A (en) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd Case-mold film capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323060A (en) * 2018-03-30 2019-10-11 Tdk株式会社 Electronic component

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