JP2007208556A - Dielectric electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dielectric electronic part excellent in an attenuation characteristic at a high frequency side of a pass band. <P>SOLUTION: In the dielectric electronic part 100 provided with a dielectric porcelain block 200, the dielectric porcelain block 200 has one surface 220 forming an almost rectangular shape having long sides 221 and short sides 222, the dielectric porcelain block 200 is formed with a plurality of through holes 213 which pierce from the one surface 220 to the other surface 230 being opposite to the surface 220 and are aligned in the direction of the long sides 221 of the one surface 220, and in addition, resonance frequency adjustment holes 212 are formed on the one surface 220 side of the dielectric porcelain block 200, which are opened larger and more shallowly than the through holes 213 so as to at least partially overlap on the through holes 213 located at the edge of an line among the aligned through holes 213, wherein the shortest distance A between an opening edge of the resonance frequency adjustment hole 212 and the short side and the opening length B of the resonance frequency adjustment hole in the direction of the long side satisfy B<A. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a dielectric electronic component. More specifically, the present invention relates to a dielectric electronic component having excellent attenuation characteristics on the high frequency side with respect to the pass band.

  When designing a filter using dielectric electronic components, as illustrated in FIG. 20, there are a pass band 601 intended to pass a signal and stop bands 602 and 603 intended not to pass. Each is set with a frequency range and an attenuation. The frequency-attenuation curve 604 of the filter is above the pass band 601 (attenuation amount smaller than the lower limit attenuation amount of the pass band 601) and the stop band 602 without contacting the pass band 601 and the stop bands 602 and 603. The filter characteristics are adjusted so as to pass below 603 (attenuation amount larger than the upper limit attenuation amounts of the cutoff bands 602 and 603). It is known that the correlation between the frequency range and the attenuation can be controlled by fine adjustment of the shape of the dielectric electronic component. For example, Patent Document 1 and Patent Document 2 below are known as dielectric electronic components whose attenuation on the high frequency side is controlled with respect to the passband.

JP 2002-290107 A JP 2004-242067 A

Each of Patent Document 1 and Patent Document 2 is a dielectric electronic component in which a conductor layer having a predetermined shape is provided on the outer peripheral surface of a dielectric ceramic block. These dielectric electronic components are excellent in that the attenuation characteristics on the high frequency side are controlled with little influence on the attenuation characteristics of the passband. However, in designing a filter, a variety of control modes are properly used and further combined to further increase the design range, so that more control modes are required.
The present invention solves the above problems and provides a novel control mode capable of controlling the attenuation characteristic on the high frequency side with respect to the pass band, and is excellent in the attenuation characteristic on the high frequency side of the pass band using the same. Another object is to provide a dielectric electronic component.

The present invention is as follows.
(1) In a dielectric electronic component comprising a dielectric ceramic block,
The dielectric porcelain block has a substantially rectangular shape having a long side and a short side,
The dielectric ceramic block is formed with a plurality of through-holes penetrating from the one surface to the opposite other surface and arranged in the long side direction of the one surface.
Further, the one side of the dielectric porcelain block has a larger opening than the through hole so as to at least partially overlap with a through hole located at the end of the row of the through holes provided in the row. A resonance frequency adjusting hole having a shallower depth than the through hole is formed,
The shortest distance A between the opening edge of the resonance frequency adjusting hole and the short side, and the opening length B in the long side direction of the resonance frequency adjusting hole satisfy B <A. parts.
(2) The dielectric electronic component according to (1), wherein A and B satisfy A <2B.
(3) The dielectric electronic component according to (1) or (2), which is a dielectric filter.
(4) The dielectric electronic component according to (1) or (2), wherein the dielectric electronic component is a dielectric duplexer.

According to the dielectric electronic component of the present invention, it is possible to obtain characteristics excellent in attenuation characteristics on the high frequency side with respect to the pass band.
When A <2B is satisfied, a sufficiently miniaturized dielectric electronic component can be obtained while obtaining the above effects.
In the case of a dielectric filter, it is possible to obtain characteristics excellent in attenuation characteristics on the high frequency side with respect to the pass band.
In the case of a dielectric duplexer, it is possible to obtain characteristics excellent in attenuation characteristics on the high frequency side with respect to the pass band.

Hereinafter, the present invention will be described in detail.
The dielectric electronic component of the present invention is a dielectric electronic component comprising a dielectric ceramic block, wherein the dielectric ceramic block has a substantially rectangular surface having a long side and a short side, and the dielectric ceramic component The block is formed with a plurality of through holes penetrating from the one surface to the opposite other surface and arranged in the long side direction of the one surface, and further, on the one surface side of the dielectric ceramic block, A resonance frequency adjusting hole that is larger than the through hole and shallower than the through hole is formed so that at least a part of the through hole located at the end of the row of the formed through holes overlaps. The shortest distance A between the opening edge of the resonance frequency adjusting hole and the short side and the opening length B in the long side direction of the resonance frequency adjusting hole satisfy B <A.

A dielectric electronic component according to an embodiment of the present invention will be described with reference to the drawings.
1 is a schematic perspective view of an embodiment of the dielectric electronic component 100 of the present invention, FIG. 2 is a schematic cross-sectional view thereof, and FIG. 3 is a through hole 213 positioned at the end of the row. 4 is a schematic partial enlarged view of one surface side 220 of a resonance frequency adjustment hole 212. FIG. In FIG. 2, the thicknesses of the inner conductor 300 and the outer conductor 400 are exaggerated for the sake of simplicity. However, the thickness is actually much thinner than that of the dielectric ceramic block 200. In other drawings, only these shapes are shown.

As shown in FIGS. 1 and 2, the dielectric electronic component 100 of the present invention includes a dielectric ceramic block 200. The dielectric ceramic block 200 has a through hole 213 and a resonance frequency adjustment hole 212. The dielectric block 200 has one surface 220 having a substantially rectangular shape having a long side 221 and a short side 222, and the through hole 213 penetrates from the one surface 220 to the opposite other surface 230, and the long side of the one surface 220. They are arranged in the direction of 221. The resonance frequency adjusting hole 212 is formed on the one surface 220 side of the dielectric ceramic block 200. Further, the resonance frequency adjusting hole 212 is at least partially overlapped with a through hole 213 located at the end of the row of the through holes 213 arranged in a row (hereinafter, also simply referred to as “row end through hole”). The opening is larger than the through hole 213 and the depth is smaller than the through hole 213.
Further, as shown in FIG. 3, the shortest distance A between the edge (opening edge) 223 of the opening in the one surface 220 of the resonance frequency adjusting hole 212 and the short side 222 constituting the one surface 220, and the resonance frequency adjusting hole 212. The length (opening length) B of the opening in the direction of the long side 221 is a shape satisfying B <A.

By satisfying this B <A, it is possible to obtain a dielectric characteristic having excellent attenuation characteristics on the high frequency side with respect to the pass band. That is, in the conventional dielectric porcelain block, for example, as shown in FIGS. 9, 11, 14, and 16, the relationship between A and B is designed such that B ≧ A. On the other hand, for example, in a dielectric electronic component having a dielectric ceramic block with B <A as in the present invention product shown in FIGS. A characteristic in which the attenuation pole on the high frequency side of the pass band is shifted to the lower frequency side can be obtained without affecting (that is, keeping the insertion loss of the target pass band small). Therefore, it is possible to obtain a dielectric electronic component having a large attenuation at the low frequency end value of the cutoff band set on the high frequency side of the pass band.
Moreover, it is preferable that A and B satisfy A <2B in addition to B <A. A ≧ 2B may be satisfied, but if A ≧ 2B, the dielectric porcelain block becomes excessively large. Therefore, A <2B is usually preferable in a dielectric porcelain block that requires a reduction in size.

  Although the positional relationship between the resonance frequency adjustment hole 212 and the through hole 213 is not particularly limited, as shown in FIGS. 4 and 5, the entire through hole 213 may overlap the resonance frequency adjustment hole 212. As shown in FIG. 8, only a part of the through hole 213 may overlap the resonance frequency adjustment hole 212, and the other part of the through hole 213 (a portion that does not overlap) may protrude outside the resonance frequency adjustment hole 212. As shown in FIGS. 6 to 8, when a part of the through hole 213 is arranged to protrude outside the resonance frequency adjusting hole 212, the opening length B is set to the resonance frequency adjusting hole as shown in FIGS. 212 represents the length between the opening edge 223 of the actual side wall surface 212 and the opening edge 224 of the virtual side wall surface.

  Normally, as shown in FIG. 7, the plane shape of the resonance frequency adjusting hole 212 has an axis of symmetry, so the position of the opening edge 224 of the virtual side wall surface is determined from the opening edge 223 of the real side wall surface. . However, when the planar shape of the resonance frequency adjustment hole 212 does not have an axis of symmetry, the end line 225 and the end line 226 on the actual side wall surface of the resonance frequency adjustment hole 212 are connected as shown in FIG. The plane that is the opposite side is the virtual side wall surface.

Furthermore, as shown in FIGS. 1 and 2, the dielectric electronic component of the present invention normally includes an inner conductor 300, an outer conductor 400, and a terminal electrode 500 in addition to the dielectric ceramic block 200.
Among these, the inner conductor 300 is a conductor layer that covers the inner wall surface of each through-hole 213. The inner conductor 300 is a conductor layer that covers the entire surface of the through hole 213 and covers all or part of the inner wall surface of the resonance frequency adjusting hole 212.

The outer conductor 400 is a conductor layer that covers the outer surface of the dielectric ceramic block 200 except for a predetermined portion. Examples of the predetermined portion include at least a part of the one surface 220 and a terminal electrode partitioning portion 401 for partitioning the terminal electrode.
The inner conductor 300 and the outer conductor 400 are electrically connected (short-circuited) on the other surface 230 of the dielectric ceramic block 200.
The terminal electrode 500 normally includes two or more. In particular, when the dielectric electronic component of the present invention is used as a dielectric filter, two are provided, and when the dielectric electronic component is used as a dielectric duplexer, three are preferably provided.

The resonance frequency adjusting hole 212 is provided for the column end through-hole 213 of the dielectric ceramic block 200, but may be provided for the other through-holes 213, but not provided. Also good. That is, for example, the resonance frequency adjustment holes 212 may be formed for all the through holes 213 formed in the dielectric ceramic block 200, and at least the column ends of the through holes 213 formed in the dielectric ceramic block 200 The resonance frequency adjusting hole 212 may be formed only for a part of the through holes 213 including the through holes 213. By providing this resonance frequency adjustment hole 212, the resonance frequency can be adjusted.
The resonance frequency adjustment hole 212 can adjust the resonance frequency according to the size (total extension of the opening edge), the planar shape, the depth, and the like. That is, for example, the longer the total extension of the opening edge of the resonance frequency adjustment hole 212 is, and the deeper the resonance frequency adjustment hole 212 is, the lower the resonance frequency can be.

The dielectric ceramic material constituting the dielectric ceramic block is not particularly limited, and examples thereof include alumina dielectric ceramics, MgTiO ₃ —CaTiO ₃ dielectric ceramics, and Ba—Ti oxide dielectric ceramics. These may use only 1 type and may use 2 or more types together, Usually, only 1 type is used.

  Although the conductor material which comprises the said inner conductor and outer conductor is not specifically limited, Metals, such as Cu, Au, Ag, Al, Ni, Cr, can be contained as a conductor component. These may use only 1 type and may use 2 or more types together. That is, it may be made of a single metal, an alloy, or another conductor material.

As described above, the dielectric electronic component of the present invention can be used as a dielectric filter and a dielectric duplexer. FIG. 1 and FIG. 2 illustrate an embodiment in which the present invention is implemented as a dielectric filter. On the other hand, an embodiment in which the present invention is implemented as a dielectric duplexer is illustrated in FIG.
In FIG. 19, a dielectric electronic component 100 is a dielectric duplexer. This dielectric duplexer includes a dielectric ceramic block 200 having eight through holes 213, an inner conductor 300, an outer conductor 400, and three terminal electrodes 500.

  The dielectric ceramic block 200 may be a dielectric ceramic having a rectangular surface 220 having a long side of 11 mm and a short side of 2 mm, and a height of 6.5 mm. The dielectric ceramic block 200 has resonance frequency adjustment holes 212 corresponding to the six through holes 213 including at least the row end through holes among the eight through holes 213. That is, the corresponding resonance frequency adjusting hole 212 is not formed in the two through holes 213. The six through holes 213 and the corresponding resonance frequency adjusting holes 212 function as resonance holes, and the two through holes 213 function as excitation holes.

  Further, the length of “A” (the shortest distance between the opening edge 223 on the one surface 220 of the resonance number fraction adjusting hole 212 corresponding to the row end through-hole 213 and the short side 222 constituting the one surface 220) is 1 mm. Can do. On the other hand, the length of “B” (the opening length in the direction of the long side 221 of the resonance frequency adjusting hole 212 corresponding to the row end through hole 213) can be set to 0.9 mm. That is, B <A <2B is satisfied.

  Furthermore, the inner conductor 300 is disposed so as to cover all inner wall surfaces of all eight through holes 213 and to cover all inner wall surfaces of the six resonance frequency adjusting holes 212. The outer conductor 400 is disposed so as to cover a part of the outer surface of the dielectric ceramic block 200 except for a part of one surface 220 and the terminal electrode partitioning portion 401. Further, the inner conductor 300 that covers the inner wall surface of the resonance hole (the resonance frequency adjustment hole 212 and the six through holes 213 corresponding to the resonance frequency adjustment hole 212) is short-circuited on the outer conductor 400 and the other surface 230. On the other hand, the inner conductor 300 covering the inner wall surface of the excitation hole (two through holes 213 not correspondingly provided with the resonance frequency adjusting hole 212) is short-circuited with the outer conductor 400 on one surface 220, and is also connected by a connection conductor (not shown). Each is connected to a pair of terminal electrodes 500 arranged on the other surface side. Each terminal electrode 500 is an electrode obtained by removing the terminal electrode partition 401 that is a part of the outer conductor 400.

Hereinafter, the present invention will be described specifically by way of examples.
(1) Example 1
A dielectric electronic component 100 of Example 1 shown in FIGS. 10 and 12 was manufactured. FIG. 10 is a schematic perspective view of the dielectric electronic component 100 according to the first embodiment, and FIG.

The dielectric electronic component 100 according to the first embodiment includes a dielectric ceramic block 200 including four through holes 213, an inner conductor 300, an outer conductor 400, and two terminal electrodes 500.
The dielectric ceramic block 200 is a dielectric made of a barium titanate-based dielectric ceramic having a rectangular surface 220 having a long side of 10 mm and a short side of 2.4 mm and a height of 3.8 mm.
The dielectric ceramic block 200 is formed with resonance frequency adjustment holes 212 corresponding to all of the four through holes 213. The shape and positional relationship between each through hole 213 and the corresponding resonance frequency adjusting hole 212 are as shown in FIG. 12, and the diameter of each through hole 213 is 0.7 mm.

  Furthermore, the length of “A” (the shortest distance between the opening edge 223 on the one surface 220 of the resonance frequency adjusting hole 212 and the short side 222 constituting the one surface 220) is 2.1 mm. On the other hand, the length of “B” (the opening length of the resonance frequency adjusting hole 212 in the direction of the long side 221) is 1.6 mm. Note that “B” in Example 1 is an opening length assuming a virtual side wall surface obtained from the symmetry axis of the resonance frequency adjusting hole. These “A” and “B” satisfy B <A and A <2B. That is, B <A <2B.

  The inner conductor 300 is disposed so as to cover all the inner wall surfaces of all four resonance frequency adjusting holes 212 and through holes 213. The outer conductor 400 is disposed so as to cover the surface of the outer surface of the dielectric ceramic block 200 except for the one surface 220 and the terminal electrode partitioning portion 401. Therefore, the inner conductor 300 and the outer conductor 400 are short-circuited on the other surface 230. Further, the terminal electrode 500 is an electrode obtained by removing the terminal electrode partition 401 that is a part of the outer conductor 400.

(2) Comparative Example 1
A dielectric electronic component 100 of Comparative Example 1 shown in FIGS. 9 and 11 was manufactured. FIG. 9 is a schematic perspective view of the dielectric electronic component 100 of Comparative Example 1, and FIG. 11 is a plan view of one surface 220. In the dielectric electronic component 100 of Comparative Example 1, “A” in the dielectric ceramic block 200 is 1.1 mm, and “B” is 1.6 mm. That is, B> A. Others are the same as in the first embodiment.

(3) Comparison of Frequency-Attenuation Curve between Example 1 and Comparative Example 1 The frequency-attenuation curve of each dielectric electronic component of Example 1 and Comparative Example 1 was plotted. The results are shown in FIG. In FIG. 13, the thick line is the frequency-attenuation curve 604 of Example 1, and the thin line is the frequency-attenuation curve 604 of Comparative Example 1. From this result, compared with Comparative Example 1, Example 1 hardly affects the attenuation characteristics of the pass band 601 (that is, while keeping the insertion loss of the target pass band 601 small). A characteristic is obtained in which the attenuation pole 605 on the high frequency side of the pass band 601 is shifted to the lower frequency side. For this reason, the attenuation amount at the low frequency end of the cutoff band 603 set on the high frequency side of the pass band 601 is 26.7 dB in the first comparative example, whereas it is 29.4 dB in the first example. It can be seen that the dielectric electronic component has a large attenuation at the low frequency end value of the band 603. That is, Example 1 can achieve the above-described effect while maintaining the shapes of the through hole 213 and the resonance frequency adjusting hole 212 by extending the length of “A” with respect to the comparative example 2.

(4) Example 2
The dielectric electronic component 100 of Example 2 shown in FIGS. 15 and 17 was manufactured. FIG. 15 is a schematic perspective view of the dielectric electronic component 100 according to the second embodiment, and FIG. In the dielectric electronic component 100 of Example 2, “A” in the dielectric ceramic block 200 is 1.4 mm, “B” is 1.0 mm, B <A is satisfied, and A <2B is satisfied. Yes. That is, B <A <2B. Others are the same as in the first embodiment.

(5) Comparative Example 2
A dielectric electronic component 100 of Comparative Example 2 shown in FIGS. 14 and 16 was manufactured. FIG. 14 is a schematic perspective view of the dielectric electronic component 100 of Comparative Example 2, and FIG. 16 is a plan view of one surface 220. In the dielectric electronic component 100 of Comparative Example 2, “A” in the dielectric ceramic block 200 is 1.2 mm, and “B” is 1.4 mm. That is, B> A. Others are the same as in the second embodiment.

(6) Comparison of Frequency-Attenuation Curve between Example 2 and Comparative Example 2 Using each dielectric electronic component of Example 2 and Comparative Example 2, each frequency-attenuation curve is similar to (3) above. Was plotted. The results are shown in FIG. In FIG. 18, the thick line is the frequency-attenuation curve 604 of Example 2, and the thin line is the frequency-attenuation curve 604 of Comparative Example 2. From this result, compared with Comparative Example 2, Example 2 hardly affects the attenuation characteristics of the passband 601 (that is, while keeping the insertion loss of the target passband 601 small). A characteristic is obtained in which the attenuation pole 605 on the high frequency side of the pass band 601 is shifted to the lower frequency side. For this reason, the attenuation amount at the low frequency end of the cutoff band 603 set on the high frequency side of the pass band 601 is 21.0 dB in the second comparative example, whereas it is 24.2 dB in the second example. It can be seen that the dielectric electronic component has a large attenuation at the low frequency end value of the band 603. In other words, Example 2 achieves the above effect by reducing the length of “B” compared to Comparative Example 2.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention depending on the purpose and application.

  The dielectric electronic component of the present invention is widely used as communication related equipment. In particular, it is suitable for communication devices in the microwave band and millimeter wave band, such as mobile communication base station equipment, mobile communication switching equipment, home cordless telephone equipment, and wireless LAN equipment. Specifically, for example, various filters (reception side filter, transmission side filter, duplexer, band pass filter, etc.) and the like. The mobile communication includes a mobile phone, a PHS phone, a satellite communication phone, a car phone, and the like.

It is a typical perspective view of an example of the dielectric electronic component of the present invention. It is typical sectional drawing of the dielectric material electronic component of FIG. FIG. 2 is a schematic partial enlarged cross-sectional view of the dielectric electronic component of FIG. 1. It is a typical partial expanded perspective view of the other examples of the dielectric electronic component of the present invention. FIG. 5 is a schematic partial enlarged plan view of the dielectric electronic component of FIG. 4. It is a typical partial expanded perspective view of the other examples of the dielectric electronic component of the present invention. FIG. 7 is a schematic partial enlarged plan view of the dielectric electronic component of FIG. 6. FIG. 7 is a schematic partial enlarged plan view of the dielectric electronic component of FIG. 6. 6 is a schematic perspective view of a dielectric electronic component of Comparative Example 1. FIG. 1 is a schematic perspective view of a dielectric electronic component of Example 1. FIG. 6 is a schematic plan view of one surface of a dielectric electronic component of Comparative Example 1. FIG. 3 is a schematic plan view of one surface of a dielectric electronic component of Example 1. FIG. 3 is a graph in which frequency-attenuation curves of Example 1 and Comparative Example 1 are plotted. 6 is a schematic perspective view of a dielectric electronic component of Comparative Example 2. FIG. 6 is a schematic perspective view of a dielectric electronic component of Example 2. FIG. 6 is a schematic plan view of one surface of a dielectric electronic component of Comparative Example 2. FIG. 6 is a schematic plan view of one surface of a dielectric electronic component of Example 2. FIG. 6 is a graph in which frequency-attenuation curves of Example 2 and Comparative Example 2 are plotted. FIG. 10 is a schematic perspective view of still another example of the dielectric electronic component of the present invention. It is explanatory drawing explaining a pass band, a cutoff band, and frequency-attenuation amount.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100; Dielectric electronic component, 200; Dielectric ceramic block, 212; Resonance frequency adjustment hole, 213; Through-hole, 220; One side, 221; Long side, 222; Short side, 223; 300; inner conductor, 400; outer conductor, 500; terminal electrode, 601; passband, 602 and 603; stopband, 604; frequency-attenuation curve.

Claims (4)

In a dielectric electronic component comprising a dielectric ceramic block,
The dielectric porcelain block has a substantially rectangular shape having a long side and a short side,
The dielectric ceramic block is formed with a plurality of through-holes penetrating from the one surface to the opposite other surface and arranged in the long side direction of the one surface.
Further, the one side of the dielectric porcelain block has a larger opening than the through hole so as to at least partially overlap with a through hole located at the end of the row of the through holes provided in the row. A resonance frequency adjusting hole having a shallower depth than the through hole is formed,
The shortest distance A between the opening edge of the resonance frequency adjusting hole and the short side, and the opening length B in the long side direction of the resonance frequency adjusting hole satisfy B <A. parts.   The dielectric electronic component according to claim 1, wherein A and B satisfy A <2B.   The dielectric electronic component according to claim 1, wherein the dielectric electronic component is a dielectric filter.   The dielectric electronic component according to claim 1, wherein the dielectric electronic component is a dielectric duplexer.

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