JP2007200380A - Manufacturing method of optical pickup device, optical pickup device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical pickup device capable of improving a reproduction characteristic and a recording characteristic by making a luminous flux with the largest strength among luminous fluxes emitted from a light emitting element incident on the center of an objective lens. <P>SOLUTION: The posture of a light receiving and emitting integrated type element 14 is adjusted by angularly displacing the light receiving and emitting integrated type element 14 around an axial line perpendicular to a reference axial line 12 to assemble the optical pickup device 11 to thereby be able to adjust the luminous flux with the largest strength among luminous fluxes emitted from the light receiving and emitting integrated type element 14 so as to pass through the center of the objective lens 13. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical pickup device, an optical pickup device, and an electronic apparatus.

  FIG. 10 is a cross-sectional view schematically showing a conventional optical pickup device 1. The optical pickup device 1 records information on an optical recording medium 2 such as a compact disc (abbreviated CD) and a digital versatile disc (abbreviated DVD), and reproduces information recorded on the optical recording medium 2. Provided in a recording / reproducing apparatus.

  The optical pickup device 1 includes a light receiving / emitting integrated element 3 including a light source that emits light and a light receiving element that receives return light from the optical recording medium 2, and light emitted from the light receiving / emitting integrated element 3 in parallel light. A collimating lens 4 that converts the light from the collimating lens 4 to reflect the light from the collimating lens 4 and guides it to the objective lens 5; The lens 5 includes an aberration correcting liquid crystal element 7 disposed between the rising mirror 6 and the objective lens 5. The objective lens 5 is supported by the lens holder 8. In the optical pickup device 1, each optical member described above is accommodated in the housing 9.

  The divergent light emitted from the light receiving / emitting integrated element 3 is incident on the collimator lens 4 and converted into parallel light, and then reflected by the rising mirror 6 so as to be guided to the objective lens 5. The light reflected by the rising mirror 6 is transmitted through the aberration correcting liquid crystal element 7 before entering the objective lens 5, and the tilt of the optical recording medium 2 is made using the birefringence of the liquid crystal of the aberration correcting liquid crystal element 7. In addition, aberrations caused by thickness variations are corrected. The light whose aberration has been corrected by the aberration correcting liquid crystal element 7 passes through the objective lens 5, so that the parallel light becomes convergent light and is condensed on the information recording surface of the optical recording medium 2.

  The reflected light that is condensed on the information recording surface of the optical recording medium 2 and reflected from the optical recording medium 2 becomes parallel light when returning through the objective lens 5 again, reflected by the rising mirror 6, and collimated lens. 4 is returned to the light receiving and emitting integrated element 3. The return light that has returned to the light receiving / emitting integrated element 3 is split by the diffraction grating 3 a formed on the light emitting side surface of the light receiving / emitting integrated element 3 and enters the light receiving element provided in the light receiving / emitting integrated element 3. The light receiving element acquires an optical signal using incident light, and converts the acquired optical signal into an electrical signal. This electric signal is used as information reproduction and recording, a servo signal, and the like.

  In such an optical pickup device 1, the aberration correcting liquid crystal element 7 is provided, and the aberration correcting liquid crystal element 7 corrects aberrations caused by variations in the inclination and thickness of the optical recording medium 2. In the aberration correcting liquid crystal element 7, it is impossible to correct aberrations caused by factors other than variations in the inclination and thickness of the optical recording medium 2. For example, coma aberration may occur due to the inclination of the optical axis of light incident on the objective lens 5, and it is desired that such coma aberration be corrected.

  An optical pickup device that adjusts the angle formed by the optical axis of light incident on the objective lens and the axis of the objective lens for the purpose of correcting coma generated by the inclination of the optical axis of the light incident on the objective lens 5 Has been proposed (see, for example, Patent Documents 1 and 2). In the optical pickup device disclosed in Patent Document 1, a light receiving / emitting integrated element is slid and moved in an XY plane perpendicular to the Z-axis direction and the Z-axis direction that is an optical axis direction emitted from a light source. The position of the light emitting integrated element is adjusted. The light receiving / emitting integrated element is rotated about a virtual axis passing through the light emission center of the light receiving / emitting integrated element and parallel to the Z-axis direction. The mounting position of the light receiving / emitting integrated element with respect to the housing is adjusted by such sliding movement and rotation.

  In the optical pickup device disclosed in Patent Document 1, for example, when the same optical member as the optical pickup device shown in FIG. 10 is provided, the position of the light receiving / emitting integrated element is slid in the XY plane to adjust the position. As a result, the incident position of the incident light on the collimating lens changes, and the incident angle of the light emitted from the light receiving and emitting integrated element and incident on the collimating lens changes. As a result, the emission angle of the light emitted from the collimating lens changes. The light emitted from the collimating lens is incident on the objective lens via the rising mirror and the aberration correcting liquid crystal element. At this time, the incident angle of the light incident on the objective lens changes as the emission angle of the light emitted from the collimating lens changes. As described above, according to the optical pickup device disclosed in Patent Document 1, it is possible to change the incident angle of light incident on the objective lens and adjust the incident angle so as not to cause coma aberration. The coma aberration that occurs when the light beam is condensed on the information recording surface of the optical recording medium can be corrected.

  Patent Document 2 discloses a method of adjusting the mounting position of the lens holder with respect to the housing when the lens holder that supports the objective lens is fixed to the housing. In the technique disclosed in Patent Document 2, the light incident on the objective lens is adjusted by adjusting the attitude of the objective lens so that the angle formed by the optical axis of the light beam incident on the objective lens and the axis of the objective lens changes. By changing the incident angle of the optical recording medium, it is possible to correct aberrations such as coma generated when the light beam is condensed on the information recording surface of the optical recording medium.

JP-A-11-306575 Japanese Patent No. 3637696

  In the optical pickup device, it is preferable that the predetermined reference axis line coincides with the outgoing optical axis of the light emitting element and the optical axis of the optical member. There may be a slight deviation between the reference axis and the optical axis due to errors such as tolerances. Due to such a slight deviation between the reference axis and the optical axis, the light beam incident on the objective lens does not have the maximum intensity at the center of the objective lens, and affects the reproduction characteristics and the recording characteristics.

  In an optical pickup device that records information on an optical recording medium at a high speed, an SN ratio, which is a ratio of an electric signal to noise, is higher than that of a conventional optical pickup device such as an optical pickup device mounted on a thin notebook personal computer. In order to increase the size and improve the recording performance and the reproduction performance, it is required that the light passing through the center of the objective lens has the maximum intensity among the light beams incident on the objective lens. In an optical pickup device that records information on an optical recording medium at a high speed, the recording speed of the optical pickup device onto the optical recording medium is high, and the time required for setting the light amount of the light beam condensed on the optical recording medium to a predetermined amount is short. Become. Therefore, in order to optimize the amount of the light beam condensed on the optical recording medium and improve the recording quality, it is required to adjust the incident light to the objective lens so as to have the maximum intensity at the center of the objective lens. .

  Further, in the optical pickup device provided in the vehicle navigation apparatus, the position of the light spot condensed on the optical recording medium is likely to be changed due to vibration or the like, and the information formed on the information recording surface of the optical recording medium by this position fluctuation. There is a possibility that the intensity of light applied to the groove, which is a guide groove in which is recorded, decreases. Therefore, in order to further improve the performance of the optical pickup device provided in the vehicle navigation device, the light beam that is focused on the recording medium is set so that the light passing through the center of the objective lens has the maximum intensity. Therefore, it is required that the intensity of the light applied to the groove on the information recording surface of the optical recording medium does not decrease even if the positional fluctuation occurs.

  In the optical pickup devices disclosed in Patent Documents 1 and 2, although the aberration can be corrected by sliding the light emitting element or tilting the objective lens, the incident light on the objective lens is centered on the objective lens. The maximum strength is not adjusted.

  An object of the present invention is to manufacture an optical pickup device capable of improving reproduction characteristics and recording characteristics by causing light having the highest intensity among light beams emitted from light emitting elements to enter the center of an objective lens. And a manufacturing method, an optical pickup device, and an electronic apparatus.

In the present invention, an objective lens and a light emitting element are provided so that a predetermined reference axis is substantially coincident with an optical axis of the objective lens and an outgoing optical axis of the light emitting element, and a light beam emitted from the light emitting element is emitted by the objective lens. A method of manufacturing an optical pickup device for recording information on an optical recording medium by focusing on an information recording surface of the recording medium or reading information recorded on the optical recording medium,
The attitude of the light emitting element is adjusted by angularly displacing the light emitting element around an axis perpendicular to the reference axis so that the light having the highest intensity among the light beams emitted from the light emitting element passes through the center of the objective lens. And manufacturing the optical pickup device.

  According to the present invention, the light emitting element is perpendicular to the reference axis by assembling the optical pickup device by angularly displacing the light emitting element about an axis perpendicular to the reference axis and adjusting the posture of the light emitting element. The position of the light emitting element can be adjusted so that the light having the highest intensity passes through the center of the objective lens among the light beams emitted from the light emitting element by angular displacement around the axis. It is possible to manufacture an optical pickup device capable of condensing light that passes through and has the highest intensity on the information recording surface of the optical recording medium.

  The present invention also adjusts the position of the light emitting element by sliding the light emitting element in a direction substantially perpendicular to the reference axis so that the light beam emitted from the light emitting element is condensed on the optical axis of the objective lens. It is characterized by being assembled.

  According to the present invention, the light emitting element is slid and displaced in a direction substantially perpendicular to the reference axis to adjust the position of the light emitting element, and the optical pickup device is assembled. The incident angle to the objective lens can be adjusted so that the light is condensed on the optical axis. As a result, coma aberration generated when the light beam is condensed on the information recording surface of the optical recording medium can be corrected.

In the present invention, the objective lens is supported by the housing via a lens holder that supports the objective lens,
The lens holder is formed integrally with the housing.

  According to the present invention, an optical pickup device in which a lens holder that supports an objective lens and a housing are integrally formed can be manufactured.

  According to the present invention, the lens holder is detachably provided at a predetermined reference position of the housing.

  According to the present invention, since the lens holder is detachably provided at a predetermined reference position of the housing, the lens holder can be replaced.

  The present invention also slides the light emitting element along the reference axis so that the light beam that has passed through the objective lens is collected on a virtual plane on which the optical recording medium is to be placed, thereby positioning the light emitting element. Adjusted and assembled.

  According to the present invention, the light-emitting element is slid along the reference axis, the position of the light-emitting element is adjusted, and the optical pickup device is assembled. Can be matched.

  Further, the invention is characterized in that the posture of the light emitting element is adjusted based on the light receiving state of the light receiving means for receiving the light beam emitted from the light emitting element.

  According to the present invention, since the attitude of the light emitting element is adjusted based on the light receiving state of the light receiving means, the attitude of the light emitting element is adjusted based on the intensity or emission angle of the light beam actually emitted from the light emitting element. Can do.

  Further, the present invention is an optical pickup device manufactured by the method for manufacturing an optical pickup device of the present invention.

  According to the present invention, an optical pickup device manufactured by the method of manufacturing an optical pickup device that achieves the above-described operation can be obtained.

  According to another aspect of the present invention, there is provided an electronic apparatus comprising the optical pickup device according to the present invention.

  According to the present invention, the electronic apparatus can include an optical pickup device that achieves the above-described operation.

  According to the present invention, an optical pickup device is assembled by angularly displacing the light emitting element around an axis perpendicular to the reference axis, and adjusting the posture of the light emitting element to assemble the light emitting element perpendicular to the reference axis. The position of the light emitting element can be adjusted so that the light having the highest intensity passes through the center of the objective lens among the light beams emitted from the light emitting element by angular displacement around the axis. It is possible to manufacture an optical pickup device capable of condensing light that passes through and has the highest intensity on the information recording surface of the optical recording medium. As a result, it is possible to irradiate the groove, which is a guide groove formed on the information recording surface of the optical recording medium, on which information is recorded, so that the intensity of the luminous flux emitted from the light emitting element is high. As compared with the case where the largest light deviates from the center of the objective lens, it is possible to manufacture an optical pickup device with improved SN ratio and excellent reproduction characteristics and recording characteristics.

  Further, according to the present invention, the optical pickup device is assembled by sliding the light emitting element in a direction substantially perpendicular to the reference axis to adjust the position of the light emitting element, so that the light flux emitted from the light emitting element is changed to the objective lens. The incident angle to the objective lens can be adjusted so that the light is condensed on the optical axis. As a result, coma aberration generated when the light beam is condensed on the information recording surface of the optical recording medium can be corrected. As a result, noise due to the occurrence of coma aberration can be reduced, so that the SN ratio, which is the ratio of the electrical signal to noise, can be increased as compared with the case where the position of the light emitting element is not adjusted. Further, when the position of the light emitting element is adjusted by sliding the light emitting element in a direction substantially perpendicular to the reference axis, the aberration can be corrected without adjusting the position and orientation of the objective lens. In manufacturing, the position adjustment and posture adjustment steps of the objective lens are not necessary.

  Further, according to the present invention, an optical pickup device in which a lens holder for supporting an objective lens and a housing are integrally formed can be manufactured, so that the optical pickup device in which the lens holder and the housing are separately provided can be manufactured. The number of parts can be reduced.

  According to the present invention, since the lens holder is detachably provided at a predetermined reference position of the housing, the lens holder can be replaced. As a result, for example, when the objective lens is soiled or scratched, the objective lens and the lens holder that supports the objective lens can be exchanged, so that the optical pickup can be compared with the case where the lens holder cannot be exchanged. The lifetime of the apparatus can be extended.

  According to the present invention, the focal point of the objective lens and the information recording surface are arranged by sliding the light emitting element along the reference axis, adjusting the position of the light emitting element, and assembling the optical pickup device. Can be matched. As a result, the spot diameter of the light beam condensed on the information recording surface of the optical recording medium can be adjusted, and the light flux can be applied to a high-density optical recording medium such as a next-generation optical disk (for example, Blu-ray Disk). It is possible to reduce the spot diameter and to exhibit good recording / reproducing characteristics with less noise.

  According to the present invention, since the posture of the light emitting element is adjusted based on the light receiving state of the light receiving means, the posture of the light emitting element is adjusted based on the intensity or emission angle of light actually emitted from the light emitting element. be able to. As a result, even if an error occurs between an ideal design and an actual design such as component tolerance, the posture of the light emitting element is adjusted so as to be close to the posture where the best light receiving state with the highest SN ratio can be obtained. be able to.

  Further, according to the present invention, an optical pickup device manufactured by an optical pickup device manufacturing method that achieves the above-described effects can be obtained. In such an optical pickup device, the light having the highest intensity passing through the center of the objective lens can be used as the spot center of the light beam condensed on the information recording surface of the optical recording medium. Is superior in recording characteristics and reproduction characteristics to those of an optical pickup device in which the lens is deviated from the center of the objective lens.

  Further, according to the present invention, the electronic apparatus can include an optical pickup device that achieves the above-described effects. As a result, the recording characteristics and reproduction characteristics of the electronic device can be improved.

  FIG. 1 is a cross-sectional view schematically showing an optical pickup device 11 manufactured by an optical pickup device manufacturing method according to an embodiment of the present invention. The manufacturing method of the optical pickup device 11 according to the present embodiment is such that the predetermined reference axis 12 and the optical axis of the objective lens 13 and the outgoing optical axis 15 of the light receiving / emitting integrated element 14 which is a light emitting element substantially coincide with each other. The lens 13 and the light receiving / emitting integrated element 14 are provided, and the light beam emitted from the light receiving / emitting integrated element 14 is condensed on the information recording surface 16 a of the optical recording medium 16 by the objective lens 13 to store information on the optical recording medium 16. A method of manufacturing the optical pickup device 11 for recording or reading information recorded on the optical recording medium 16, wherein the light having the highest intensity among the light beams emitted from the light receiving and emitting integrated element 14 is transmitted from the objective lens 13. The light receiving / emitting integrated element 14 is angularly displaced around an axis perpendicular to the reference axis 12 so as to pass through the center, and the posture of the light receiving / emitting integrated element 14 is adjusted to perform optical pick-up. Characterized in that assembling the apparatus 11.

  Each optical member is arranged so that the predetermined reference axis 12 and the emission optical axis 15 of the light receiving / emitting integrated element 14 are substantially coincident with each other. However, in FIG. The description is made by shifting the emission axis 15. In FIG. 1, the direction in which the reference axis 12 extends between the light emitting / receiving integrated element 14 and the upright mirror 17 is the Z-axis direction, the direction perpendicular to the Z-axis direction, and the directions orthogonal to each other are the X-axis direction and the Y-axis. The direction. The direction in which the reference axis 12 extends between the upright mirror 17 and the objective lens 13 coincides with the Y-axis direction.

  An optical pickup device 11 manufactured by the method of manufacturing an optical pickup device according to the present embodiment includes a compact disk (abbreviation: CD), a digital versatile disk (abbreviation: DVD), and a next-generation optical disc (for example, It is provided in an optical recording medium recording / reproducing apparatus that is an electronic device that records information on an optical recording medium 16 such as a Blu-ray disk and reads information recorded on the optical recording medium 16 (hereinafter also referred to as reproduction). . The optical pickup device 11 includes a light receiving / emitting integrated element 14, a collimating lens 18 that converts light emitted from the light receiving / emitting integrated element 14 into parallel light, and reflects light from the collimating lens 18 to the objective lens 13. The rising mirror 17 for guiding, the objective lens 13 for condensing the light from the rising mirror 17 on the information recording surface 16a of the optical recording medium 16, and the aberration arranged between the rising mirror 17 and the objective lens 13. And the correction liquid crystal element 19. The objective lens 13 is supported by the lens holder 20. In the optical pickup device 11, each optical member except the optical recording medium 16 is accommodated in a housing 21.

  FIG. 2 is a cross-sectional view schematically showing a configuration of the light receiving and emitting integrated element 14 provided in the optical pickup device 11. The light receiving / emitting integrated element 14 is a light emitting element 14 that emits light. The light receiving / emitting integrated element 14 collects the light that is condensed on the information recording surface 16a of the optical recording medium 16 and reflected on the information recording surface 16a of the optical recording medium 16 and the semiconductor laser chip 22 that is a light source that emits light. It includes a light receiving element 23 that receives light and a stem 24 that is a base.

  The stem 24 is formed of a metal such as copper or aluminum having excellent thermal conductivity, and has a substantially disk shape with a diameter of about 5 to 6 mm. On one surface 24 a of the stem 24, a metal cap 25 made of copper, aluminum or the like having excellent thermal conductivity is provided similarly to the stem 24. The cap 25 is formed with an optical window 26 through which light emitted from the semiconductor laser chip 22 toward the collimating lens 18 passes. The optical window 26 is provided with a diffraction grating 27 that diffracts the light reflected by the information recording surface 16 a of the optical recording medium 16. In addition, in the space formed by the stem 24 and the cap 25, the heat radiating table 28 and the light receiving element 23 are fixed, and the semiconductor laser chip 22 is attached to the heat radiating table 28 with an adhesive having thermal conductivity.

  The semiconductor laser chip 22, which is a light source that emits light, emits red laser light having a wavelength of 650 nm, for example, when power is supplied via the lead pins 29. The semiconductor laser chip 22 and the light receiving element 23 are electrically connected to an external circuit by a lead pin 29 through a wiring board such as a flexible printed circuit (FPC).

  The light receiving / emitting integrated element 14 is adjusted in posture and position in a state of being inserted into a through hole 30 formed in one side portion 21 a of the housing 21 and penetrating in the thickness direction, and fixed by an adhesive 31. A method of adjusting the position and adjusting the position of the light receiving / emitting integrated element 14, which is a feature of the method of manufacturing the optical pickup device of the present invention, will be described later.

  The housing 21 of the optical pickup device 11 is, for example, a metal hollow member having excellent thermal conductivity such as aluminum, zinc, or magnesium, and is an optical recording medium mounted so that information can be recorded or reproduced. 16 is provided. The housing 21 is a base on which optical members such as the collimating lens 18, the rising mirror 17, the aberration correcting liquid crystal element 19, and the objective lens 13 are accommodated and mounted, and the light receiving / emitting integrated element 14 is mounted. The light receiving / emitting integrated element 14 is inserted into and fixed to the through hole 30 formed in the housing 21.

  The housing 21 has a predetermined reference axis 12, an optical axis of the collimating lens 18, an optical axis of the objective lens 13, and a receiving axis in the traveling direction of the light emitted from the optical window formed in the light receiving / emitting integrated element 14. The light receiving / emitting integrated element 14 and each optical member such as the objective lens 13, the collimating lens 18, and the rising mirror 17 are provided so that the emission optical axis 15 of the light emitting integrated element 14 substantially matches. The method of manufacturing the optical pickup device of this embodiment is characterized by a method of adjusting the posture and position of the light receiving / emitting integrated element 14 with respect to the reference axis 12, and this method will be described later.

  In the present embodiment, the reference axis 12 shown in FIG. 1 is bent in the same direction as the direction in which the light is reflected on the reflecting surface of the rising mirror 17, and between the light receiving and emitting integrated element 14 and the rising mirror 17. The direction in which the reference axis 12 extends is the Z-axis direction, and the direction in which the reference axis 12 extends between the upright mirror 17 and the objective lens 13 is the Y-axis direction. The Z axis that is the reference axis 12 between the light receiving and emitting integrated element 14 and the upright mirror 17 is determined to coincide with the thickness direction of the housing 21, for example. The Y axis is an axis extending in a direction in which light incident from the Z axis direction is reflected by the rising mirror 17. The X axis is an axis orthogonal to the Z axis and the Y axis determined as described above.

  The collimating lens 18 is an optical member that converts incident light into parallel light. The rising mirror 17 reflects the light transmitted through the collimating lens 18 on the reflection surface and guides it to the objective lens 13.

  The objective lens 13 condenses light on the information recording surface 16 a of the optical recording medium 16. The objective lens 13 is supported by the housing 21 via the lens holder 20. The lens holder 20 is driven by electromagnetic force so as to correct errors in the focus direction and tracking direction due to a thickness error, inclination, etc. of the optical recording medium 16 by a driving means 32 including a magnetic member and a coil.

  The light emitted from the semiconductor laser chip 22 of the light receiving / emitting integrated element 14 is incident on the collimating lens 18 to become parallel light, and is reflected by the rising mirror 17. The light reflected by the rising mirror 17 is condensed on the information recording surface 16 a of the optical recording medium 16 by the objective lens 13. The light reflected by the information recording surface 16a of the optical recording medium 16 enters the objective lens 13 again and is reflected by the rising mirror 17. The light reflected by the rising mirror 17 passes through the collimating lens 18 and returns to the light receiving / emitting integrated element 14. The return light from the optical recording medium 16 is split by the diffraction grating 27 of the light receiving / emitting integrated element 14 and incident on the light receiving element 23 of the light receiving / emitting integrated element 14 to be converted from an optical signal to an electrical signal. Used as playback, recording, erasing and servo signals.

  In such an optical pickup device 11, the predetermined reference axis 12 and the optical axes of optical members such as the collimating lens 18 and the objective lens 13 are substantially coincided with each other, and the predetermined reference axis 12 and the light receiving and emitting integrated type are used. For example, the light receiving / emitting integrated element is arranged so that one surface 24a of the stem 24 of the light receiving / emitting integrated element 14 is perpendicular to the predetermined reference axis 12 so that the emission optical axis 15 of the element 14 substantially coincides. 14, the reference axis 12 is determined in advance depending on an error between an ideal design and an actual design, a component tolerance of an optical member, and an error in an attachment position of the semiconductor laser chip 22 in the light receiving and emitting integrated element 14. The optical axis of the optical member may deviate from the outgoing optical axis 15 of the light receiving / emitting integrated element 14. Due to such a deviation between the reference axis 12 and the optical axis of the optical member and the outgoing optical axis 15 of the light receiving and emitting integrated element 14, the light incident on the objective lens 13 does not have the maximum intensity at the center of the objective lens 13. The recording characteristics on the recording medium 16 are affected.

  In the method of manufacturing the optical pickup device 11 according to the present embodiment, the light receiving / emitting integrated element 14 is arranged such that light having the highest intensity among the light beams emitted from the light receiving / emitting integrated element 14 passes through the center of the objective lens 13. Is angularly displaced about an axis perpendicular to the reference axis 12, and the posture of the light receiving and emitting integrated element 14 is adjusted to assemble the optical pickup device. As a result, the recording characteristics and the reproduction characteristics of the optical pickup device 11 can be improved as compared with the case where the light having the highest intensity out of the luminous flux emitted from the light receiving and emitting integrated element 14 deviates from the center of the objective lens 13. . Here, the center of the objective lens 13 is the optical center of the objective lens 13, and the optical recording medium 16 is mounted so that the optical axis of the objective lens 13 and information of the objective lens 13 can be recorded or reproduced. It is an intersection with the surface facing the side.

  FIG. 3 is a perspective view schematically showing the light receiving and emitting integrated element 14 whose posture is adjusted. 3, the direction in which the reference axis 12 extends between the light emitting / receiving integrated element 14 and the upright mirror 17 shown in FIG. 1 is the Z-axis direction, the two directions perpendicular to the Z-axis direction and perpendicular to each other. The X-axis direction and the Y-axis direction are assumed. The posture of the light receiving / emitting integrated element 14 is such that the light receiving / emitting integrated element 14 is rotated around the X axis that is perpendicular to the Z axis that is the reference axis 12 and another axis that is perpendicular to the Z axis. It is adjusted by angular displacement around the axis. The posture of the light receiving / emitting integrated element 14 may be adjusted with respect to either the X axis or the Y axis.

  In the light receiving and emitting integrated element 14 disposed at the temporary position before the posture is adjusted, one surface 24a of the stem 24 is provided perpendicular to the Z axis. For example, the collimating lens 18 is fixed to the housing 21 such that the Z-axis determined to coincide with the thickness direction of the housing 21 and the optical axis of the collimating lens 18 coincide with the temporary position before the posture is adjusted. The rising mirror 17 is fixed to the housing 21 at a position where light incident from the Z-axis direction is reflected, and the light incident from the Z-axis direction is reflected by the rising mirror 17. In a state where the objective lens 13 is provided in the housing 21 via the lens holder 20 so that a certain Y-axis direction and the optical axis of the objective lens 13 coincide, one surface 24a of the stem 24 is in relation to the Z-axis. This is a position where the light receiving and emitting integrated element 14 is arranged so as to be vertical.

  The X-axis tilting direction is a direction in which a virtual axis perpendicular to one surface 24a of the stem 24 disposed at the temporary position is angularly displaced about the Y-axis, and is in the XZ plane with respect to the Z-axis. The direction of angular displacement. The Y-axis tilting direction is a direction in which a virtual axis perpendicular to one surface 24a of the stem 24 disposed at the temporary position is angularly displaced about the X-axis, and is in the YZ plane with respect to the Z-axis. The direction of angular displacement.

  FIG. 4 is a graph showing the light intensity distribution in the X-axis tilt direction of the light beam emitted from the light receiving / emitting integrated element 14 and incident on the objective lens 13, and FIG. 13 is a graph showing the light intensity distribution in the Y-axis tilt direction of the light beam incident on the beam 13. The light intensity of the luminous flux was measured by emitting a continuous wave (CW) laser beam having an operating temperature (temperature of the stem 24) Tc = 25 ° C., emission intensity Po = 50 mW, and wavelength of 650 nm.

  In the measurement of the light intensity, one surface 24a of the stem 24 of the light receiving / emitting integrated element 14 is perpendicular to the reference axis 12, and the reference axis 12 is aligned with the semiconductor laser chip 22 of the light receiving / emitting integrated element 14. The light receiving / emitting integrated element 14 is disposed at the above-described temporary position passing through the center of the light emitting portion.

  In FIG. 4, the vertical axis represents the light intensity, and the horizontal axis represents the spread angle Δθ // in the X-axis tilt direction (hereinafter also referred to as the X-axis tilt angle Δθ //). The X-axis tilt angle Δθ // is an angle formed by a virtual axis line perpendicular to the one surface 24a of the stem 24 arranged at a temporary position when projected onto the XY plane from the Y-axis direction and the Z-axis. is there. The intersection of the X axis and the Z axis coincides with the center of the light emitting part of the semiconductor laser chip 22.

  For example, the light intensity at the X-axis tilt angle Δθ // = 0 ° indicates that the light receiving / emitting integrated element 14 has no error between the application position of the semiconductor laser chip 22 to the light receiving / emitting integrated element 14 and the ideal application position. This coincides with the light intensity of the optical axis portion of the light beam emitted from the light receiving and emitting integrated element 14 in which the angle formed by the outgoing optical axis 15 and the Z axis is 0 °.

  The sign of Δθ // in FIG. 4 is determined as follows. First, in the direction in which Δθ // is positive, the virtual axis perpendicular to one surface 24a of the stem 24 arranged at the temporary position when projected onto the XZ plane from the Y-axis direction in FIG. 3 is the X-axis direction. This is the direction when located on the positive direction side. Further, the direction in which Δθ // is negative is that the virtual axis perpendicular to one surface 24a of the stem 24 arranged at the temporary position when projected onto the XZ plane from the Y-axis direction in FIG. This is the direction when located on the negative direction side. The positive direction of the X axis is the upward direction of the paper surface in FIG.

  In FIG. 5, the vertical axis represents the light intensity, and the horizontal axis represents the spread angle Δθ⊥ in the Y-axis tilt direction (hereinafter also referred to as Y-axis tilt angle Δθ⊥). The Y-axis tilt angle Δθ⊥ is an angle formed by a virtual axis that is perpendicular to one surface 24a of the stem 24 that is disposed at a temporary position when projected onto the YZ plane from the X-axis direction and the Z-axis. . The intersection of the Y axis and the Z axis coincides with the center of the light emitting part of the semiconductor laser chip 22.

  The light intensity at the Y-axis tilt angle Δθ⊥ = 0 ° is from the light receiving / emitting integrated element 14 when there is no error between the position where the semiconductor laser chip 22 is applied to the light receiving / emitting integrated element 14 and the ideal application position. This coincides with the light intensity of the optical axis portion of the light beam emitted from the light receiving and emitting integrated element 14 where the angle formed by the outgoing optical axis 15 and the Z axis is 0 °.

  The sign of Δθ⊥ in FIG. 4 is determined as follows. First, in the direction in which Δθ⊥ is positive, the virtual axis perpendicular to one surface 24a of the stem 24 arranged at the temporary position when projected onto the YZ plane from the X-axis direction in FIG. 3 is positive in the Y-axis direction. It is the direction when it is located on the direction side. Further, the direction in which Δθ⊥ is negative is that the virtual axis perpendicular to one surface 24a of the stem 24 arranged at the temporary position when projected from the X-axis direction to the YZ plane in FIG. 3 is negative in the Y-axis direction. It is the direction when it is located on the direction side. The positive direction of the Y axis is the right direction of the paper surface in FIG.

  If there is no error between the attachment position of the semiconductor laser chip 22 to the light receiving / emitting integrated element 14 and the ideal application position, the light flux emitted from the light receiving / emitting integrated element 14 is Δθ⊥ = 0 ° and Δθ //. In the case where the peak intensity (maximum intensity) is equal to the light emission intensity Po in the portion of = 0 °, there is an error between the attachment position of the semiconductor laser chip 22 to the light receiving and emitting integrated element 14 and the ideal attachment position. As shown in FIG. 4 and FIG. 5, the portion where the peak intensity of the light beam incident on the objective lens 13 is obtained deviates from the portion where Δθ⊥ = 0 ° and Δθ // = 0 °.

  Specifically, in FIG. 4, the portion where the peak intensity of the light beam incident on the objective lens 13 is obtained is the portion where the X-axis tilt angle Δθ // is included in the range of −0.6 ° to −0.4 °. It can be seen that the optical axis of the light beam emitted from the semiconductor laser chip 22 exists in a portion where the X-axis tilt angle Δθ // is −0.6 ° to −0.4 °. Therefore, by displacing the light receiving / emitting integrated element 14 by an angle of 0.4 ° to 0.6 ° with respect to the X-axis tilt direction, the optical axis of the light beam emitted from the semiconductor laser chip 22 in the X-axis tilt direction is the reference axis. It can be seen that 12 can be matched.

  In FIG. 5, the portion where the peak intensity of the light beam incident on the objective lens 13 is obtained is a portion where the Y-axis tilt angle Δθ⊥ is included in the range of 0.2 ° to 0.4 °. It can be seen that the optical axis of the emitted light beam exists in a portion where the Y-axis tilt angle Δθ⊥ is 0.2 ° to 0.4 °. Therefore, by displacing the light receiving / emitting integrated element 14 by −0.4 ° to −0.2 ° by about the Y-axis tilt direction, the optical axis of the light beam emitted from the semiconductor laser chip 22 is changed in the Y-axis tilt direction. It can be seen that the reference axis 12 can be matched.

  In the present embodiment, the light receiving and emitting integrated element 14 is displaced by an angle of 0.4 ° to 0.6 ° with respect to the X-axis tilt direction, and is displaced by −0.4 ° to −0.2 ° with respect to the Y-axis tilt direction. By such tilt adjustment in the X axis direction that angularly displaces the light receiving / emitting integrated element 14 around the Y axis and tilt adjustment in the Y axis direction that angularly displaces the light receiving / emitting integrated element 14 around the X axis. The posture of the integrated element 14 is adjusted. By this attitude adjustment, the direction of the outgoing optical axis of the light emitted from the light receiving / emitting integrated element 14 can be changed, and the optical axis of the light beam emitted from the light receiving / emitting integrated element 14 is, for example, the reference axis 12. By matching with the Z axis, light can be emitted from the light receiving and emitting integrated element 14 so that light having the highest intensity among the emitted light beams passes through the center of the objective lens 13.

  In the present embodiment, the posture of the light receiving / emitting integrated element 14 is adjusted so that the optical axis of the light beam emitted from the light receiving / emitting integrated element 14 coincides with, for example, the Z axis that is the reference axis 12. The posture of the body element 14 is not limited to being adjusted so that the optical axis of the light beam emitted from the light receiving and emitting integrated element 14 coincides with the Z axis that is the reference axis 12. In the manufacturing method of the optical pickup device of the present invention, the objective lens 13 and the light receiving / emitting one are set so that the predetermined reference axis 12 and the optical axis of the objective lens 13 and the outgoing optical axis 15 of the light receiving / emitting integrated element 14 substantially coincide. A body element 14 is provided. Here, “substantially coincident” includes a coincidence state and a state in which the optical axis of the light beam emitted from the light receiving and emitting integrated element 14 is shifted from the reference axis line 12.

  As described above, the fact that the light of the maximum intensity among the light beams incident on the objective lens 13 does not pass through the center of the objective lens 13 is not only an error in the attaching position of the semiconductor laser chip 22 but also an ideal design. It is also caused by an error from an actual design, an error between an ideal assembly and an actual assembly, and a component tolerance of an optical member. If the maximum intensity light cannot be incident on the center of the objective lens 13 due to design error, assembly error, component tolerance of the optical member, etc., the optical axis of the light beam emitted from the light receiving / emitting integrated element 14 is shifted from the reference axis 12. Accordingly, there is a possibility that the maximum intensity light can be incident on the center of the objective lens 13.

  In such a case, the posture of the light receiving / emitting integrated element 14 is, for example, from the light receiving / emitting integrated element 14 so that light having the highest intensity among the light beams emitted from the light emitting element passes through the center of the objective lens. It is preferable to adjust based on a light receiving state of a light receiving means described later for receiving the emitted light beam. Details of a method of adjusting the posture of the light receiving / emitting integrated element 14 based on the light receiving state of the light receiving means for receiving the light beam emitted from the light receiving / emitting integrated element 14 will be described later.

  In the present embodiment, in addition to the posture adjustment of the light receiving / emitting integrated element 14 by the X-axis tilt adjustment and the Y-axis tilt adjustment, the light beam emitted from the light receiving / emitting integrated element 14 is collected on the optical axis of the objective lens 13. The optical pickup device 11 is assembled by adjusting the position of the light receiving / emitting integrated element 14 by sliding the light receiving / emitting integrated element 14 in a direction substantially perpendicular to the reference axis 12 so as to emit light. In the present embodiment, the slide displacement of the light receiving and emitting integrated element 14 in the direction substantially perpendicular to the reference axis 12 includes slide displacement in the X axis direction and the Y axis direction perpendicular to the Z axis that is the reference axis 12.

  When the position of the light receiving / emitting integrated element 14 is adjusted by the slide displacement in the X-axis direction and the Y-axis direction, the light beam is condensed on the information recording surface 16a of the optical recording medium 16 as follows. Aberrations such as coma generated can be corrected. By adjusting the position by sliding and displacing the light receiving / emitting integrated element 14 in the X-axis direction and the Y-axis direction, the incident light incident position on the collimating lens changes, and the collimating lens 18 is emitted from the light receiving / emitting integrated element. The incident angle of light incident on the light changes. Thereby, the light emitted from the collimating lens 18 is inclined with respect to the Z-axis direction. The light emitted from the collimating lens 18 enters the objective lens 13 through the rising mirror 17 and the aberration correcting liquid crystal element 19. At this time, the optical axis of the light beam incident on the objective lens 13 is inclined with respect to the optical axis of the objective lens 13.

  As described above, it occurs when the light beam is condensed on the information recording surface 16a of the optical recording medium 16 by adjusting the position of the light receiving and emitting integrated element 14 by the slide displacement in the X axis direction and the Y axis direction. Aberration, such as coma aberration, can be corrected, and a large signal intensity can be obtained. Compared to the case where the position is not adjusted by the slide displacement of the light receiving and emitting integrated element 14 in the X axis direction and the Y axis direction. The SN ratio, which is the ratio of the electrical signal to noise, can be increased. When the position of the light receiving / emitting integrated element 14 is adjusted by sliding the light receiving / emitting integrated element 14 in the X-axis direction and the Y-axis direction which are perpendicular to the reference axis 12, the position and orientation of the objective lens 13 are adjusted. Since the aberration can be corrected without adjusting the position of the objective lens 13, the position adjustment and posture adjustment steps of the objective lens 13 are not required in the manufacture of the optical pickup device 11. As a result, the mounting position of the objective lens 13 with respect to the housing 21 can be determined before the light emitting / receiving integrated element 14 is fixed to the housing 21, and work efficiency can be improved.

  Furthermore, in the present embodiment, the light that has passed through the objective lens 13 is received and emitted so as to be condensed on the virtual plane on which the optical recording medium 16 is to be arranged, and on the information recording surface of the optical recording medium 16 in FIG. The integrated element 14 is slid along the Z axis that is the reference axis 12. As a result, the spot diameter of the light beam condensed on the information recording surface 16a of the optical recording medium 16 can be adjusted, and even for a high-density optical recording medium such as a next-generation optical disk (for example, Blu-ray Disk). Therefore, it is possible to reduce the spot diameter of light and to exhibit good recording / reproducing characteristics with less noise.

  FIG. 6 is a block diagram illustrating an electrical configuration of the optical pickup device 11 and the evaluation device 40. The light beam collected by the objective lens 13 of the optical pickup device 11 is evaluated by an evaluation device 40 that is a light receiving means that receives light emitted from the light receiving and emitting integrated element 14 that is a light emitting device, and is evaluated by a cable 41. The evaluation result is input to the control device 42 connected to the control unit 40. The control device 42 is connected by a cable 44 and an adjustment device 43 that adjusts the posture and position of the light receiving and emitting integrated element 14 with respect to the housing 21 of the optical pickup device 11, and controls the operation of the adjustment device 43. Further, the attitude and position data of the light receiving / emitting integrated element 14 adjusted by the adjusting device 43, for example, data relating to the attitude of the light receiving / emitting integrated element 14 such as the X-axis tilt angle Δθ // and the Y-axis tilt angle Δθ⊥, and the like. Data relating to the position of the light receiving and emitting integrated element 14 such as coordinates in the XY plane is input to the control device 42.

  The control device 42 is further electrically connected to a personal computer (PC) 45, and the evaluation result obtained by the evaluation device 40 and the attitude and position data of the light receiving and emitting integrated element 14 adjusted by the adjustment device 43 are obtained. The posture and the position of the integrated light receiving / emitting element 14 are determined so that the evaluation result obtained by the evaluation device 40 is the best. The control device 42 controls the operation of the adjustment device 43 so as to be in the posture and position determined by the PC 45 and adjusts the posture and position of the light receiving and emitting integrated element 14.

  The evaluation device 40 for evaluating the light beam collected by the objective lens 13 of the optical pickup device 11 is, for example, a device that measures the tilt angle of the light emitted from the collimating lens 18 with respect to the Z axis, and is emitted from the objective lens 13. For example, a device for inspecting the occurrence of coma aberration of light or a device for measuring the intensity of light incident on the objective lens 13 can be used. As such an evaluation apparatus 40, for example, an optical interferometer such as a sharing interferometer or an optical pickup operation inspection apparatus can be used. The light receiving / emitting integrated element 14 is adjusted by adjusting the posture of the light receiving / emitting integrated element 14 based on the light receiving state of the evaluation device 40 which is a light receiving means for receiving light emitted from the light receiving / emitting integrated element 14 in this manner. Can be set to an optimum posture such that light having the highest intensity among the emitted light beams passes through the center of the objective lens 13.

  FIG. 7 is a side view showing an outline of the adjusting device 43 that adjusts the posture and position of the light receiving and emitting integrated element 14. 7A is a side view of the light receiving / emitting integrated element 14 and the adjusting device 43 as viewed from the Y-axis direction, and FIG. 7B is a side view of the light receiving / emitting integrated element 14 and the adjusting device 43 in the X-axis direction. It is a side view when seen from.

  The adjusting device 43 that adjusts the posture and position of the light receiving / emitting integrated element 14 includes gripping means 46 that detachably grips the light receiving / emitting integrated element 14. The housing 21 to which the integrated light emitting / receiving element 14 held by the holding means 46 is to be fixed is held on the base. The gripping means 46 adjusts the posture and position of the light receiving / emitting integrated element 14 by gripping the stem 24 portion of the light receiving / emitting integrated element 14 at the gripping portion 47 and causing angular displacement and position displacement with respect to the housing 21. . The gripping portion 47 of the gripping means 46 sandwiches the light receiving / emitting integrated element 14 disposed at the temporary position of the housing 21 from both sides in the X-axis direction.

  The adjusting device 43 mechanically displaces the gripping means 46 by the adjusting driving means. The adjusting device 43 adjusts the position of the light receiving / emitting integrated element 14 by sliding and displacing the housing 21 in the X-axis direction and the Y-axis direction with the gripping portion 47 holding the light receiving / emitting integrated element 14. Further, the light receiving / emitting integrated element 14 is angularly displaced about the X axis and the Y axis, which are axes perpendicular to the reference axis 12, to adjust the X axis tilt and the Y axis tilt, so that the attitude of the light receiving / emitting integrated element 14 is adjusted. Adjust. Further, the spatial position is adjusted by sliding the light emitting / receiving integrated element 14 in the Z-axis direction.

  The posture and position of the light receiving / emitting integrated element 14 are such that optical members other than the light receiving / emitting integrated element 14 are fixed to the housing 21, and the lead pin 29 of the light receiving / emitting integrated element 14 is connected to an external circuit via a wiring board such as an FPC. It is adjusted in an electrically connected state. In addition, the light receiving / emitting integrated element 14 has one surface of the stem 24 in the above-described temporary position where the optical axis of the light beam emitted from the light receiving / emitting integrated element 14 substantially coincides with the reference axis 12 with respect to the housing 21. 24a is arranged so as to be perpendicular to the Z-axis.

  As described above, the posture and position of the light receiving / emitting integrated element 14 are adjusted based on the light receiving state of the light receiving means, which is the evaluation result of the evaluation device 40. When the posture adjustment and position adjustment of the light receiving / emitting integrated element 14 are completed, the light receiving / emitting integrated element 14 is fixed to the housing 21 with an adhesive 31 such as resin or metal paste. When the light receiving / emitting integrated element 14 is fixed, the gripping of the light receiving / emitting integrated element 14 by the gripping means 46 is released. As described above, the posture and position of the light receiving / emitting integrated element 14 are adjusted, and the light receiving / emitting integrated element 14 is fixed to the housing 21.

  FIG. 8 is a flowchart showing a control procedure of the control device 42 when adjusting the posture and position of the light emitting and receiving integrated element 14. The control device 42 controls the adjustment device 43 so as to adjust the posture and position relative to the housing 21 in accordance with, for example, the posture and position adjustment procedure of the present embodiment, whereby the posture and position of the light receiving and emitting integrated element 14 relative to the housing 21 are controlled. Adjust. When the adjustment procedure for the light emitting / receiving integrated element 14 is started in step s0, the process proceeds to step s1.

  In step s 1, the control device 42 controls the operation of the adjustment device 43 so that the light receiving and emitting integrated element 14 is gripped by the gripping portion 47 of the gripping means 46. In step s 1, a command is given to the adjusting device 43, and the light receiving / emitting integrated element 14 is gripped by the gripping portion 47 of the gripping means 46. As a result, the light emitting / receiving integrated element 14 is sandwiched by the grip portion 47 from both sides in the X-axis direction. In step s1, when the light receiving / emitting integrated element 14 is gripped by the gripping means 46, the process proceeds to step s2.

  In step s2, the control device 42 controls the operation of the adjustment device 43 so that the light emitting and receiving integrated element 14 is disposed at the temporary position described above. In step s2, as described above, the one surface 24a of the stem 24 of the integrated light emitting / receiving element 14 is mounted on the housing 21 provided with the optical member so that the reference axis 12 determined in advance matches the optical axis of the optical member. The light receiving / emitting integrated element 14 is arranged by the adjusting means 43 at a temporary position such that is perpendicular to the Z axis. In step s2, when the adjusting / receiving unit 43 places the light receiving / emitting integrated element 14 at the temporary position, the process proceeds to step s3.

  In step s3, the control device 42 controls the adjustment device 43 so as to adjust the positions of the light receiving and emitting integrated element 14 in the X-axis direction and the Y-axis direction. In step s3, based on the evaluation result of the evaluation device 40 and the position data of the light receiving / emitting integrated element 14 obtained by the adjusting device 43, the position of the light receiving / emitting integrated element 14 in the XY plane is adjusted. The light receiving / emitting integrated element 14 is disposed at a position where the evaluation result by the evaluation device 40 is the best, for example, at a position where the SN ratio is the highest. In step s3, when the position of the light receiving / emitting integrated element 14 in the X-axis direction and the Y-axis direction is adjusted by the adjusting means 43, the process proceeds to step s4.

  In step s4, the control device 42 controls the adjustment device 43 so as to adjust the posture of the light receiving and emitting integrated element 14. In step s4, based on the evaluation result of the evaluation device 40 and the posture data of the light receiving / emitting integrated element 14 obtained by the adjusting device 43, the posture of the light receiving / emitting integrated element 14 in the X-axis tilt direction and the Y-axis tilt direction. The adjustment means 43 adjusts the posture of the light receiving / emitting integrated element 14 so that the evaluation result by the evaluation device 40 is the best, for example, the SN ratio is the highest. In step s4, when the posture of the light receiving and emitting integrated element 14 is adjusted by the adjusting means 43, the process proceeds to step s5.

  In step s5, the control device 42 controls the adjustment device 43 so as to adjust the position of the light receiving and emitting integrated element 14 in the Z-axis direction. In step s5, based on the evaluation result of the evaluation device 40 and the position data of the light receiving / emitting integrated element 14 obtained by the adjusting device 43, the position of the light receiving / emitting integrated element 14 in the Z-axis direction is adjusted. The light receiving / emitting integrated element 14 is arranged by the adjusting means 43 at the position where the evaluation result by 40 is the best, for example, the position where the SN ratio is the highest. In step s5, when the position of the light receiving / emitting integrated element 14 in the Z-axis direction is adjusted by the adjusting means 43, the process proceeds to step s6.

  In step s <b> 6, the control device 42 controls a coating unit (not shown) so as to fix the light emitting / receiving integrated element 14 to the housing 21. In step s6, an adhesive 31 such as a resin or a metal paste is applied by an application unit (not shown) in a state where the light receiving and emitting integrated element 14 after the posture and position adjustment is held by the holding unit 46. Thus, the light receiving / emitting integrated element 14 is fixed to the housing 21. In step s6, when the light receiving and emitting integrated element 14 is fixed to the housing 21 by a coating means (not shown), the process proceeds to step s7.

  In step s7, the control device 42 controls the operation of the adjustment device 43 so as to release the gripping of the light receiving and emitting integrated element 14 by the gripping portion 47 of the gripping means 46. In step s7, when the gripping of the light receiving / emitting integrated element 14 by the adjusting device 43 is released, the process proceeds to step s8, and all procedures are ended.

  Step s3 for adjusting the position of the light receiving / emitting integrated element 14 by sliding displacement in the X axis direction and the Y axis direction, and adjusting the posture of the light receiving / emitting integrated element 14 by angular displacement in the X axis tilting direction and the Y axis tilting direction Any of the processing operations of step s4 and step s5 of adjusting the spatial position of the light receiving and emitting integrated element 14 by slide displacement in the Z-axis direction may be executed first.

  In the present embodiment, first in step s3, the light receiving and emitting integrated element 14 is slid and displaced in the X axis direction and the Y axis direction so that the light beam emitted from the light emitting element is condensed on the optical axis of the objective lens. And the occurrence of aberrations when being focused on the optical recording medium 16 is suppressed. Next, in step s4, by adjusting the posture by angularly displacing the light receiving / emitting integrated element 14 in the X-axis tilt direction and the Y-axis tilting direction, the intensity of the light flux emitted from the light receiving / emitting integrated element 14 is increased. Adjustment is performed so that the largest light passes through the center of the objective lens 13. Further, in step s5, the light receiving / emitting integrated element 14 is slid in the Z-axis direction so that the optical recording medium 16 is adjusted so as to be condensed on the virtual plane where it should be arranged.

  After step s5, the processing operations of steps s3 and s4 may be executed again. It is preferable to repeat the series of steps s3 to s5 a plurality of times because the posture and position of the light receiving and emitting integrated element 14 can be made closer to the posture and position where the best light receiving state can be obtained.

  According to the method for manufacturing the optical pickup device 11 of the present embodiment, the optical pickup device 11 is assembled by adjusting the attitude of the light receiving and emitting integrated element 14 by angular displacement in the X-axis tilt direction and the Y-axis tilt direction. Among the light beams emitted from the light receiving and emitting integrated element 14, the light having the highest intensity passes through the center of the objective lens 13. As a result, the light having the highest intensity at the center of the objective lens 13 can be condensed on the information recording surface 16a of the optical recording medium 16, and the intensity of the luminous flux emitted from the light receiving / emitting integrated element 14 is the highest. The recording / reproducing characteristics of the optical pickup device 11 can be improved as compared with the case where large light deviates from the center of the objective lens 13.

  Further, since the position of the light receiving / emitting integrated element 14 is adjusted by sliding the light receiving / emitting integrated element 14 in the X-axis direction and the Y-axis direction, the light beam emitted from the light receiving / emitting integrated element 14 is used as the objective lens 13. Can be condensed on the optical axis. As a result, it is possible to correct aberrations such as coma generated when the light beam is condensed on the information recording surface 16a of the optical recording medium 16, and compared with the case where the position of the light receiving and emitting integrated element 14 is not adjusted. The SN ratio, which is the ratio of the electrical signal to noise, can be increased.

  Further, since the light receiving / emitting integrated element 14 is slid in the Z-axis direction, the light beam that has passed through the objective lens 13 can be condensed on a virtual plane where the optical recording medium 16 is to be disposed. As a result, the spot diameter of the light beam condensed on the information recording surface 16a of the optical recording medium 16 can be adjusted, and even for a high-density optical recording medium such as a next-generation optical disk (for example, Blu-ray Disk). Good recording / reproducing characteristics can be exhibited.

  The optical pickup device 11 manufactured by the method of manufacturing the optical pickup device 11 of the present embodiment can concentrate light having the highest intensity at the center of the objective lens 13 on the information recording surface 16 a of the optical recording medium 16. The recording and reproducing characteristics are superior to those of the optical pickup device in which the light having the highest intensity deviates from the center of the objective lens 13.

  Furthermore, according to the manufacturing method of the optical pickup device 11 of the present embodiment, the aberration can be corrected by adjusting the position of the light receiving / emitting integrated element 14, so that it is not necessary to adjust the position and posture of the objective lens 13. If the number of members for which the mounting position with respect to the housing should be adjusted can be reduced, the optical member can be easily attached and the working time can be shortened.

  Further, since the position and orientation of the objective lens 13 need not be adjusted, the posture and position of the light receiving and emitting integrated element 14 are adjusted at the final stage after fixing the objective lens 13 or the like manufactured in the optical pickup device 11. The light emitting / receiving integrated element 14 can be fixed to the housing 21. Accordingly, the posture and position of the light receiving / emitting integrated element 14 can be adjusted so that the signal balance is optimal while actually performing a reproduction operation, for example, the objective lens 13 and the light receiving / emitting integrated element 14 Thus, it is possible to assemble an optical pickup device having excellent recording / reproduction characteristics more easily than an optical pickup device that is assembled by adjusting both of the above and adjusting the signal balance.

  In addition, the objective lens 13 can be provided at a predetermined reference position of the lens holder 20, and the lens holder 20 can be configured to be detachable at a predetermined reference position of the housing 21, so that the lens holder 20 can be replaced. Thereby, for example, even when the objective lens 13 is soiled or scratched, the objective lens 13 and the lens holder 20 that supports the objective lens 13 can be replaced, and the lens holder 20 cannot be replaced. In comparison, the life of the optical pickup device 11 can be extended. Further, since it is not necessary to adjust the position and orientation of the objective lens 13 even after the objective lens 13 is replaced, complicated assembly work can be avoided, and the working time can be shortened.

  Further, even if there is an error in the attachment position of the semiconductor laser chip 22 attached to the light receiving / emitting integrated element 14 of the optical pickup device 11, the posture and position of the light receiving / emitting integrated element 14 are adjusted according to the error that occurs each time. As a result, the accuracy of the attaching position of the semiconductor laser chip 22 to the light receiving and emitting integrated element 14 can be relaxed, and the follow-up of the chip attaching accuracy by the operator can be mitigated. Further, since the optimum posture and position of the light receiving and emitting integrated element 14 are determined in accordance with the mounting position of the optical member and component tolerances, the mounting position, size, and shape of the optical member are strictly set. Compared to the optical pickup device, the accuracy of the mounting position of the optical member and the component tolerance can be relaxed. As a result, the yield of the optical member can be improved, and the yield of the optical pickup device can also be improved.

  The configuration of the method of manufacturing the optical pickup device 11 is not limited to the above configuration, and various changes can be made. Also, the configuration of the optical pickup device 11 shown in FIG. 1 is not limited to the above configuration, and various changes can be made.

  For example, the posture and position of the light receiving / emitting integrated element 14 are not limited to being adjusted based on the evaluation result by the evaluation device 40, and the reproducing operation of the optical recording medium 16 is actually performed or the optical recording is performed. The recording operation may be performed on the medium 16 and the adjustment may be performed based on the light receiving state of the light receiving element 23 included in the light receiving and emitting integrated element 14. Thereby, it is possible to inspect the pasting position accuracy of the light receiving element 23, and to determine the posture and position of the light receiving and emitting integrated element 14 according to the pasting position of the semiconductor laser chip 22 and the pasting position of the light receiving element 23. Can do.

  In the present embodiment, the light receiving and emitting integrated element 14 including the semiconductor laser chip 22 and the light receiving element 23 is used. However, the light receiving element 23 is not limited to this structure. The structure provided separately from the light emitting element containing may be sufficient.

  FIG. 9 is a cross-sectional view schematically showing an optical pickup device 51 manufactured by an optical pickup device manufacturing method according to another embodiment of the present invention. The optical pickup device 51 of the present embodiment is similar to the optical pickup device 11 of the above-described embodiment, and portions having the same configuration are denoted by the same reference numerals and description thereof is omitted.

  The manufacturing method of the optical pickup device 51 of the present embodiment is characterized in that the lens holder 52 that supports the objective lens 13 is formed integrally with the housing 53 via a focus and tracking control wire 54. . Since the optical pickup device 51 of the present embodiment includes the light receiving and emitting integrated element 14 whose posture and position are adjusted, similarly to the optical pickup device 11 described above, the posture and position of the lens holder 52 that supports the objective lens 13. It is not necessary to adjust. Accordingly, the lens holder 52 that supports the objective lens 13 can be integrated with the housing 53.

  In such a manufacturing method of the optical pickup device 51, since the lens holder 52 and the housing 53 are integrally formed, the number of parts can be reduced as compared with the case where the lens holder and the housing are provided separately, As a result, the assembly work can be simplified and the cost can be reduced.

It is sectional drawing which shows typically the optical pick-up apparatus 11 manufactured by the manufacturing method of the optical pick-up apparatus which is one Embodiment of this invention. 3 is a cross-sectional view schematically showing a configuration of a light receiving / emitting integrated element 14 provided in the optical pickup device 11. FIG. It is a perspective view which shows the outline of the light emitting and receiving integrated element 14 by which an attitude | position is adjusted. 4 is a graph showing a light intensity distribution in the X-axis tilt direction of a light beam emitted from a light receiving / emitting integrated element 14 and incident on an objective lens 13. 3 is a graph showing a light intensity distribution in a Y-axis tilt direction of a light beam emitted from a light receiving / emitting integrated element 14 and incident on an objective lens 13. 2 is a block diagram showing an electrical configuration of an optical pickup device 11 and an evaluation device 40. FIG. It is a side view which shows the outline of the adjustment apparatus 43 which adjusts the attitude | position and position of the light emitting / receiving integrated element 14. FIG. 4 is a flowchart showing a control procedure of the control device 42 when adjusting the posture and position of the light receiving and emitting integrated element 14. It is sectional drawing which shows typically the optical pick-up apparatus 51 manufactured by the manufacturing method of the optical pick-up apparatus which is another other embodiment of this invention. It is sectional drawing which shows the conventional optical pick-up apparatus 1 typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11,51 Optical pick-up apparatus 12 Reference axis 13 Objective lens 14 Light receiving / emitting integrated element 15 Output optical axis 16 Optical recording medium 17 Standing mirror 18 Collimating lens 19 Aberration correcting liquid crystal element 20, 52 Lens holder 21, 53 Housing 22 Semiconductor Laser chip 23 Light receiving element 24 Stem 25 Cap 26 Optical window 27 Diffraction grating 28 Heat sink 29 Lead pin 30 Through hole 31 Adhesive 32 Driving means 40 Evaluation device 41, 44 Cable 42 Control device 43 Adjustment device 45 Personal computer 46 Holding means 47 Holding Part

Claims (8)

The objective lens and the light emitting element are provided so that the predetermined reference axis line and the optical axis of the objective lens and the outgoing optical axis of the light emitting element substantially coincide with each other. A method of manufacturing an optical pickup device that focuses light on a recording surface and records information on an optical recording medium, or reads information recorded on the optical recording medium,
The attitude of the light emitting element is adjusted by angularly displacing the light emitting element around an axis perpendicular to the reference axis so that the light having the highest intensity among the light beams emitted from the light emitting element passes through the center of the objective lens. And manufacturing the optical pickup device.   The light emitting element is slid and displaced in a direction substantially perpendicular to the reference axis so that the light beam emitted from the light emitting element is condensed on the optical axis of the objective lens, and the position of the light emitting element is adjusted and assembled. The method of manufacturing an optical pickup device according to claim 1. The objective lens is supported on the housing via a lens holder that supports the objective lens,
3. The method of manufacturing an optical pickup device according to claim 1, wherein the lens holder is formed integrally with the housing.   3. The method of manufacturing an optical pickup device according to claim 1, wherein the lens holder is detachably provided at a predetermined reference position of the housing.   Assembling by adjusting the position of the light emitting element by sliding the light emitting element along the reference axis so that the light beam that has passed through the objective lens is condensed on a virtual plane on which the optical recording medium is to be placed. The method for manufacturing an optical pickup device according to claim 1, wherein:   6. The method of manufacturing an optical pickup device according to claim 1, wherein the posture of the light emitting element is adjusted based on a light receiving state of a light receiving unit that receives a light beam emitted from the light emitting element. .   An optical pickup device manufactured by the method for manufacturing an optical pickup device according to claim 1.   An electronic apparatus comprising the optical pickup device according to claim 7.

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