JP2007194313A - Multilayer ceramic capacitor - Google Patents

Multilayer ceramic capacitor Download PDF

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JP2007194313A
JP2007194313A JP2006009556A JP2006009556A JP2007194313A JP 2007194313 A JP2007194313 A JP 2007194313A JP 2006009556 A JP2006009556 A JP 2006009556A JP 2006009556 A JP2006009556 A JP 2006009556A JP 2007194313 A JP2007194313 A JP 2007194313A
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element body
multilayer ceramic
pair
ceramic capacitor
external electrode
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Satoshi Oomi
智 大参
Toshiya Kawamura
俊哉 川村
Susumu Tanii
晋 谷井
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce vibration noises due to the vibration of a multilayer ceramic capacitor which is generated by superposition of an AC voltage on a DC voltage. <P>SOLUTION: In order to realize the purpose, the multilayer ceramic capacitor is provided with a base in which dielectric layers and internal electrodes are alternately laminated, and a pair of external electrodes to which the internal electrodes are alternately connected on at least both end surfaces and the rear surface of the base. The internal electrode connected to one external electrode is provided with a first notch on at least a portion opposite to the other external electrode provided on the rear surface of the base, and the internal electrode connected to the other external electrode is provided with a second notch on at least a portion opposite to the one external electrode provided on the rear surface of the base. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、各種電子機器に用いられる積層セラミックコンデンサに関する。   The present invention relates to a multilayer ceramic capacitor used in various electronic devices.

近年、電子機器の電源回路における平滑用回路において、積層セラミックコンデンサが用いられるようになってきている。図１４は、電子機器であるノート型パソコンの斜視図、図１５は、同電源の回路図である。   In recent years, multilayer ceramic capacitors have been used in smoothing circuits in power supply circuits of electronic devices. FIG. 14 is a perspective view of a notebook personal computer which is an electronic device, and FIG. 15 is a circuit diagram of the power source.

図１４においてノート型パソコンは、ディスプレー部５１と本体部５２からなり、電源はアダプタ（図示せず）、バッテリの少なくともいずれかから供給される。   In FIG. 14, the notebook computer includes a display unit 51 and a main unit 52, and power is supplied from at least one of an adapter (not shown) and a battery.

図１５において、バッテリ５３は、ＤＣ−ＤＣコンバータ５４、チョークコイル５５を介してＣＰＵ５６に電力を供給している。前記ＤＣ−ＤＣコンバータ５４の入力側には、電源平滑用として積層セラミックコンデンサ５７が並列に接続され、また、前記ＤＣ−ＤＣコンバータ５４と前記ＣＰＵ５６の間にはデカップリングコンデンサ５８が並列に接続されている。   In FIG. 15, a battery 53 supplies power to a CPU 56 via a DC-DC converter 54 and a choke coil 55. On the input side of the DC-DC converter 54, a multilayer ceramic capacitor 57 is connected in parallel for smoothing the power source, and a decoupling capacitor 58 is connected in parallel between the DC-DC converter 54 and the CPU 56. ing.

そして、前記ＣＰＵ５６から制御ＩＣ５９に接続されており、制御ＩＣ５９は、表示装置６０、入出力装置６１、記憶装置６２とそれぞれ接続され信号をやり取りしている。   The CPU 56 is connected to a control IC 59, and the control IC 59 is connected to the display device 60, the input / output device 61, and the storage device 62 to exchange signals.

近年、ノート型パソコンにおいても省電力化のため、電源投入後の不使用時には、バッテリ５３からＣＰＵ５６への電力供給においてスイッチング周波数を変えずにそのインターバルを変えることで待機電力を削減する、いわゆる、スリープモードが採用されている。   In recent years, in order to save power even in notebook personal computers, when not in use after turning on the power, the standby power is reduced by changing the interval without changing the switching frequency in the power supply from the battery 53 to the CPU 56. Sleep mode is adopted.

なお、本願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２０００−２３２０３０号公報 As prior art document information related to the invention of the present application, for example, Patent Document 1 is known.
JP 2000-23320 A

ここで上述した電源回路の積層セラミックコンデンサ５７に着目すると、この積層セラミックコンデンサ５７は、誘電体の材料として、主として強誘電体材料であるチタン酸バリウムが用いられている。強誘電体材料は、直流電圧が印加されている状態において交流電圧が重畳されると圧電作用を発現する。そのため、それを用いた積層セラミックコンデンサ５７は、直流電圧に交流電圧が重畳されると振動を発生させる。   Focusing on the above-described multilayer ceramic capacitor 57 of the power supply circuit, the multilayer ceramic capacitor 57 mainly uses barium titanate, which is a ferroelectric material, as a dielectric material. A ferroelectric material exhibits a piezoelectric action when an AC voltage is superimposed in a state where a DC voltage is applied. Therefore, the multilayer ceramic capacitor 57 using the same generates vibration when an AC voltage is superimposed on a DC voltage.

この直流電圧に交流電圧が重畳された状態とは、上述した、いわゆる、スリープモードにおける積層セラミックコンデンサの状態である。   The state in which the AC voltage is superimposed on the DC voltage is the above-described state of the multilayer ceramic capacitor in the so-called sleep mode.

この振動は、積層セラミックコンデンサが実装されているプリント基板に伝わることでさらに大きな振動に増幅され、その結果、耳障りな振動音が発生するという問題があった。   This vibration is transmitted to the printed circuit board on which the multilayer ceramic capacitor is mounted, so that it is amplified to a larger vibration, and as a result, there is a problem that an unpleasant vibration sound is generated.

そこで、本発明は、この振動音を低減することを目的とする。   Therefore, an object of the present invention is to reduce this vibration sound.

この目的を達成するために、本発明は、誘電体と内部電極を交互に積層した素体と、この素体の少なくとも両端面および裏面に、前記内部電極が交互に接続された一対の外部電極とを備え、一方の外部電極に接続された内部電極は、前記素体の裏面に設けた他方の外部電極との少なくとも対向部に第１切欠部を設けてなるとともに前記他方の外部電極に接続された内部電極は、前記素体の裏面に設けた前記一方の外部電極との少なくとも対向部に第２切欠部を設けた構成としたものである。   In order to achieve this object, the present invention provides an element body in which dielectric bodies and internal electrodes are alternately stacked, and a pair of external electrodes in which the internal electrodes are alternately connected to at least both end faces and the back surface of the element body. The internal electrode connected to one external electrode is provided with a first notch at least at a portion facing the other external electrode provided on the back surface of the element body and connected to the other external electrode. The formed internal electrode has a configuration in which a second notch is provided at least at a portion facing the one external electrode provided on the back surface of the element body.

本発明は、第１、第２の切欠部を設けることで一対の外部電極間における内部電極の対向部面積を少なくして一対の外部電極間の誘電体の圧電効果を小さくするものである。これにより、はんだで固着される外部電極部分の振動の変位量を小さくすることができ、その結果、振動音を低減することができるという作用効果を有するものである。   In the present invention, by providing the first and second cutout portions, the area of the facing portion of the internal electrode between the pair of external electrodes is reduced, and the piezoelectric effect of the dielectric between the pair of external electrodes is reduced. As a result, the amount of vibration displacement of the external electrode portion fixed with solder can be reduced, and as a result, vibrational noise can be reduced.

以下、本発明の積層セラミックコンデンサについて一実施の形態および図面を用いて説明する。   Hereinafter, a multilayer ceramic capacitor of the present invention will be described with reference to an embodiment and drawings.

図１は、本発明の一実施の形態における積層セラミックコンデンサの斜視図、図２は、同内部電極の斜視図、図３は図１のａ−ａ’線での断面図、図４は図１のｂ−ｂ’線での断面図、図５は図１のｃ−ｃ’線での断面図である。   1 is a perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention, FIG. 2 is a perspective view of the internal electrode, FIG. 3 is a cross-sectional view taken along the line aa ′ of FIG. 1, and FIG. 1 is a cross-sectional view taken along line bb ′ of FIG. 1, and FIG. 5 is a cross-sectional view taken along line cc ′ of FIG.

図１〜図５において、誘電体１と内部電極３は交互に積層され素体８を構成し、前記内部電極３は交互に一対の外部電極２に接続されている。そして、前記一対の外部電極２は、素体８の幅方向の素体８の両端面、表面、裏面に形成され積層セラミックコンデンサが構成されている。なお、本発明での幅方向とは、積層セラミックコンデンサの長手方向と前記積層方向に垂直の方向を意味する。   1 to 5, dielectrics 1 and internal electrodes 3 are alternately stacked to form an element body 8, and the internal electrodes 3 are alternately connected to a pair of external electrodes 2. The pair of external electrodes 2 are formed on both end surfaces, the front surface, and the back surface of the element body 8 in the width direction of the element body 8 to constitute a multilayer ceramic capacitor. In the present invention, the width direction means a direction perpendicular to the longitudinal direction of the multilayer ceramic capacitor and the lamination direction.

この一対の外部電極２は、少なくとも素体８の両端面、裏面に形成されていればよく、必要に応じて素体８の表面にも設けることができる。この場合、プリント基板に実装する際表裏を区別する必要がなくなるという利点がある。   The pair of external electrodes 2 only need to be formed on at least both end surfaces and the back surface of the element body 8, and can also be provided on the surface of the element body 8 as necessary. In this case, there is an advantage that it is not necessary to distinguish between the front and the back when mounting on a printed circuit board.

図２に示すように、一対の外部電極２に接続された一組の内部電極３には、素体８の裏面に設けた他方の外部電極２との少なくとも対向部に第１切欠部４を設けており、同様に、他方の外部電極２に接続された内部電極３にも、素体８の裏面に設けた前記一方の外部電極２との少なくとも対向部に第２切欠部５を設けている。それ故、図３に示すａ−ａ’線での断面図では、内部電極３が対向していない構成になっている。   As shown in FIG. 2, the set of internal electrodes 3 connected to the pair of external electrodes 2 has a first notch 4 at least at a portion facing the other external electrode 2 provided on the back surface of the element body 8. Similarly, the internal electrode 3 connected to the other external electrode 2 is also provided with a second notch 5 at least at a portion facing the one external electrode 2 provided on the back surface of the element body 8. Yes. Therefore, in the cross-sectional view taken along line a-a ′ shown in FIG. 3, the internal electrodes 3 are not opposed to each other.

一方、図５に示すように、外部電極２間でない部位、例えば、図１のｃ−ｃ’線の断面図では内部電極３が対向する構成になっている。   On the other hand, as shown in FIG. 5, the internal electrode 3 is opposed to a portion not between the external electrodes 2, for example, in a cross-sectional view taken along the line c-c ′ in FIG. 1.

このように第１、第２の切欠部４、５を内部電極３の所定の位置に設けることで一対の外部電極２間における内部電極３の対向部面積を少なくして一対の外部電極２間の誘電体１の圧電効果を小さくすることができる。これにより、はんだで固着される外部電極部分の振動の変位量を小さくすることができ、その結果、振動音を低減することができるという作用効果を有する。   Thus, by providing the first and second cutout portions 4 and 5 at predetermined positions of the internal electrode 3, the area of the opposing portion of the internal electrode 3 between the pair of external electrodes 2 can be reduced, and the space between the pair of external electrodes 2. The piezoelectric effect of the dielectric 1 can be reduced. Thereby, the amount of vibration displacement of the external electrode portion fixed with solder can be reduced, and as a result, there is an effect that vibration noise can be reduced.

上記第１、第２の切欠部４、５は、図３に示したように、外部電極２間における内部電極３が全く対向しないように設定することが最も振動音の低減に効果があるが、全く対向しないという設定までしなくても振動音の低減効果は認められる。   As shown in FIG. 3, the first and second cutouts 4 and 5 are most effective in reducing vibration noise when the internal electrodes 3 are not opposed to each other between the external electrodes 2. Even if the setting is not made so that they do not face each other, the effect of reducing the vibration noise is recognized.

図６（ａ）は、内部電極の斜視図、図６（ｂ）、（ｃ）はそれぞれ同上面図であるが、図６に示すように、外部電極２間における一組の内部電極３が対向する面積（図６Ａ、すなわち、上面から見て一組の内部電極３が重なる面積）を外部電極２間における一組の内部電極３の投影面積（図６Ｂ、すなわち、上面から見た外部電極２間の一組の内部電極３の総面積）の２／３以下になるように第１、第２切欠部を設定することにより４ｄｂの音圧低下が確認できた。   6 (a) is a perspective view of the internal electrodes, and FIGS. 6 (b) and 6 (c) are the same top views, respectively. As shown in FIG. The opposing area (FIG. 6A, ie, the area where the set of internal electrodes 3 overlaps when viewed from above) is the projected area of the set of internal electrodes 3 between the external electrodes 2 (FIG. 6B, ie, external electrodes when viewed from above) By setting the first and second notches to be 2/3 or less of the total area of the pair of internal electrodes 3 between the two, a sound pressure drop of 4 db could be confirmed.

一般的に、人間の耳では音圧が３ｄｂ違えば明らかに差を感じることができるものであるが、それ以上の４ｄｂの音圧低下は人間の耳で明らかに振動音が低下したと認識できるレベルの値である。   In general, the difference in sound pressure can be clearly felt in the human ear if the sound pressure is different by 3 db. However, if the sound pressure is further reduced by 4 db, it can be recognized that the vibration sound is clearly reduced in the human ear. Level value.

また、さらなる振動音の低下が必要な場合は、外部電極間における一組の内部電極が対向する面積を外部電極間における一組の内部電極の投影面積の１／２以下になるように第１、第２切欠部を設定すればよい。この構成によれば約６ｄｂの音圧低下が確認でき、さらなる振動音の低下を実現することができる。   When further reduction in vibration noise is required, the first area is set so that the area of the pair of internal electrodes facing each other between the external electrodes is equal to or less than ½ of the projected area of the pair of internal electrodes between the external electrodes. What is necessary is just to set a 2nd notch part. According to this configuration, a sound pressure reduction of about 6 db can be confirmed, and a further reduction in vibration sound can be realized.

さて、次に図７を用いて、特に、素体の裏面に形成する一対の外部電極（以下、一対の裏面電極と記す）について説明する。以下に説明する一対の裏面電極の構成を上述した内部電極の構成と組み合わせることで、振動音をより低減することができる。   Now, a pair of external electrodes (hereinafter referred to as a pair of back electrodes) formed on the back surface of the element body will be described with reference to FIG. By combining the configuration of the pair of back electrodes described below with the configuration of the internal electrodes described above, vibration noise can be further reduced.

図７（ａ）は一実施の形態における積層セラミックコンデンサの斜視図であり、図７（ｂ）は同裏面図である。   Fig.7 (a) is a perspective view of the multilayer ceramic capacitor in one Embodiment, FIG.7 (b) is the same rear view.

一対の裏面電極１２は、積層セラミックコンデンサの振動をプリント基板に伝搬させる部位である。したがって、この振動の伝搬を抑制することで振動音を抑制することができるが、その一方で、この部位は積層セラミックコンデンサとプリント基板との接続を担う部位でもある。そのため、一対の裏面電極に関してこの両方の観点、すなわち、振動伝搬の抑制と接続強度の確保という両面から考える必要がある。   The pair of backside electrodes 12 are parts that propagate the vibration of the multilayer ceramic capacitor to the printed circuit board. Therefore, vibration noise can be suppressed by suppressing propagation of this vibration, but this part is also a part responsible for connection between the multilayer ceramic capacitor and the printed board. Therefore, it is necessary to consider both aspects of the pair of back electrodes, that is, from the viewpoint of suppressing vibration propagation and ensuring connection strength.

図７は、一対の裏面電極１２の形状を素体８の幅方向の端部に向かって電極幅が狭くなる形状にしたものである。つまり、一対の裏面電極１２の素体８端部の辺の長さをａ、一対の裏面電極１２が対向する辺の長さをｂとした場合、ａ＜ｂという関係になるように構成するものである。この構成によれば、振動の抑制をできるだけ阻害せずに接合強度を向上させることができる。   In FIG. 7, the pair of back surface electrodes 12 have a shape in which the electrode width becomes narrower toward the end in the width direction of the element body 8. In other words, when the length of the side of the pair of back electrode 12 at the end of the element body 8 is a and the length of the side facing the pair of back electrodes 12 is b, the relationship is a <b. Is. According to this configuration, the bonding strength can be improved without inhibiting the suppression of vibration as much as possible.

すなわち、素体の裏面の幅方向に裏面電極を設けているので振動が抑制できるとともに、一対の裏面電極の対向辺の長さを対向方向に増加させている（つまり、ａ＜ｂという関係にしている）ので、電極幅を変えない形状のものと比較して接続強度も向上させることができる。この対向辺の長さを対向方向に増加させるのは振動の抑制をできるだけ阻害しないようにするためである。   That is, since the back surface electrode is provided in the width direction of the back surface of the element body, vibration can be suppressed and the length of the opposing sides of the pair of back surface electrodes is increased in the facing direction (that is, the relationship of a <b). Therefore, the connection strength can be improved as compared with a shape that does not change the electrode width. The reason for increasing the length of the opposing side in the opposing direction is to prevent the suppression of vibration as much as possible.

次に、図８（ａ）は一実施の形態における積層セラミックコンデンサの斜視図、図８（ｂ）は同裏面図である。図８に示すように、一対の外部電極２を設ける素体８の両端面に凹部２８を設け、少なくともこの凹部２８に一対の外部電極２を設けたものであり、このように凹部２８を設けることで一対の外部電極２の面積を増やし、これによりプリント基板との固着強度を向上させることができる。また、このような構成にすることにより内部電極と外部電極との接触面積が増加するのでＥＳＲを低減することができるとともに接続不良による容量低下を抑制することもできる。   Next, FIG. 8A is a perspective view of the multilayer ceramic capacitor in one embodiment, and FIG. 8B is a rear view thereof. As shown in FIG. 8, recesses 28 are provided on both end faces of the element body 8 on which the pair of external electrodes 2 are provided, and at least the pair of external electrodes 2 is provided on the recesses 28. Thus, the recesses 28 are provided in this way. As a result, the area of the pair of external electrodes 2 can be increased, thereby improving the fixing strength with the printed circuit board. Further, with such a configuration, the contact area between the internal electrode and the external electrode is increased, so that ESR can be reduced and a decrease in capacity due to poor connection can be suppressed.

次に、図９（ａ）は一実施の形態における積層セラミックコンデンサの斜視図、図９（ｂ）は同裏面図である。図９に示すように、素体８に設けた一対の裏面電極１２間に凸部２９を設けたものであり、これにより積層セラミックコンデンサの周端部をプリント基板から離すことができ、これにより積層セラミックコンデンサの振動をプリント基板に伝えにくくすることができ、その結果、振動音を低減することができる。また、一対の裏面電極１２間に凸部２９を設けることで短絡の防止という作用効果も有する。   Next, FIG. 9A is a perspective view of the multilayer ceramic capacitor in one embodiment, and FIG. 9B is a rear view thereof. As shown in FIG. 9, a convex portion 29 is provided between a pair of backside electrodes 12 provided on the element body 8, whereby the peripheral end portion of the multilayer ceramic capacitor can be separated from the printed circuit board. The vibration of the multilayer ceramic capacitor can be made difficult to be transmitted to the printed circuit board, and as a result, vibration noise can be reduced. Further, providing the convex portion 29 between the pair of back surface electrodes 12 also has an effect of preventing a short circuit.

ここで、凸部２９の高さをｔ１、素体８の長手方向の長さをＬとしたとき１／８１００×Ｌ2＜ｔ１になるように凸部２９を設定することで、特に、プリント基板のたわみに対して剥離しにくい積層セラミックコンデンサとすることができる。 Here, when the height of the convex portion 29 is t1, and the length in the longitudinal direction of the element body 8 is L, the convex portion 29 is set so that 1/8100 × L 2 <t1. A multilayer ceramic capacitor that does not easily peel off from the deflection of the substrate can be obtained.

以下、図１０を用いて説明する。図１０（ａ）は積層セラミックコンデンサの裏面図、（ｂ）同側面図、（ｃ）積層セラミックコンデンサを実装したプリント基板をたわませた側面図である。   Hereinafter, a description will be given using FIG. FIG. 10A is a back view of the multilayer ceramic capacitor, FIG. 10B is a side view thereof, and FIG. 10C is a side view of the printed circuit board on which the multilayer ceramic capacitor is mounted.

プリント基板のたわみ量はＩＥＣ規格においてスパン９０ｍｍでたわみ量１ｍｍが規格化されている。したがって、仮に、プリント基板のたわみ量が最大量であったとしても積層セラミックコンデンサの周縁部がプリント基板に触れなければはんだ接合部に引きはがし方向の力が発生せず、結果、剥離しにくいということになる。   The deflection amount of the printed circuit board is standardized by the IEC standard with a span of 90 mm and a deflection amount of 1 mm. Therefore, even if the amount of deflection of the printed circuit board is the maximum amount, if the peripheral edge of the multilayer ceramic capacitor does not touch the printed circuit board, no force in the peeling direction is generated at the solder joint, and as a result, it is difficult to peel off. It will be.

プリント基板１１のたわみ量が最大量のときの必要な凸部２９の高さを以下に求める。図１０（ｃ）に示すようにたわんだプリント基板１１は放物線で近似可能となるので、この放物曲線は（数１）で表される。   The required height of the convex portion 29 when the amount of deflection of the printed circuit board 11 is the maximum amount is obtained below. Since the bent printed board 11 can be approximated by a parabola as shown in FIG. 10C, this parabolic curve is expressed by (Equation 1).

Figure 2007194313
Figure 2007194313

上記ＩＥＣ規格においてＸは４５、Ｙは１であるからこれによりＡは１／２０２５となる。ここで、積層セラミックコンデンサの長手方向の長さをＬ、凸部２９の高さをｔ１とするとｔ１は（数２）を満たせば、積層セラミックコンデンサの周縁部がプリント基板１１に触れないことになる。   In the IEC standard, X is 45 and Y is 1, so A becomes 1/2025. Here, assuming that the length of the multilayer ceramic capacitor in the longitudinal direction is L and the height of the convex portion 29 is t1, if t1 satisfies (Equation 2), the peripheral portion of the multilayer ceramic capacitor does not touch the printed circuit board 11. Become.

Figure 2007194313
Figure 2007194313

そして、（数２）から（数３）が導出される。   Then, (Equation 3) is derived from (Equation 2).

Figure 2007194313
Figure 2007194313

例えば、３２１６サイズの積層セラミックコンデンサの場合、Ｌは３．２ｍｍであるからｔ１は、約１．２４６μｍを超える値になる。したがって、マージンを考慮して凸部２９の高さ２μｍに設定すれば、積層セラミックコンデンサの周縁部がプリント基板１１に触れることはないため、はんだ接合部に引きはがし方向の力が発生せず、その結果、剥離しにくいという作用効果を有する。   For example, in the case of a 3216 size multilayer ceramic capacitor, since L is 3.2 mm, t1 is a value exceeding about 1.246 μm. Therefore, if the height of the convex portion 29 is set to 2 μm in consideration of the margin, the peripheral portion of the multilayer ceramic capacitor does not touch the printed circuit board 11, so that no force in the peeling direction is generated at the solder joint, As a result, it has the effect of being difficult to peel off.

この凸部２９の材料としては、素体８と同じ材料を用いることもできるし、シリコーン樹脂、ゴム等の弾性体を用いることも可能である。   As the material of the convex portion 29, the same material as that of the element body 8 can be used, or an elastic body such as silicone resin or rubber can be used.

また、弾性体を積層セラミックコンデンサとプリント基板の間に介在させることも振動音を低減するために有効である。図１１（ａ）は一実施の形態における積層セラミックコンデンサの斜視図、図１１（ｂ）は同裏面図である。図１１に示すように、積層セラミックコンデンサの素体８の裏面端部に弾性体３０を設け、この弾性体３０を緩衝材として積層セラミックコンデンサ１０とプリント基板１１の間に介在させて振動音を低減させるものである。上述した弾性体の他、緩衝材が入った両面テープも用いることができる。   In addition, interposing an elastic body between the multilayer ceramic capacitor and the printed board is also effective for reducing vibration noise. FIG. 11A is a perspective view of the multilayer ceramic capacitor in one embodiment, and FIG. As shown in FIG. 11, an elastic body 30 is provided at the back end of the multilayer ceramic capacitor element body 8, and this elastic body 30 is interposed between the multilayer ceramic capacitor 10 and the printed circuit board 11 as a cushioning material to generate vibration noise. It is to reduce. In addition to the elastic body described above, a double-sided tape containing a cushioning material can also be used.

また、上述した凸部２９に代わり、外部電極２、特に、裏面電極１２自体を上記凸部２９と同様の役割を持たせることも可能である。以下、図１２を用いて説明する。   Further, instead of the above-described convex portion 29, the external electrode 2, in particular, the back electrode 12 itself can have the same role as the convex portion 29. Hereinafter, a description will be given using FIG.

図１２（ａ）は一実施の形態における積層セラミックコンデンサの斜視図、図１２（ｂ）は同裏面図、図１２（ｃ）は同側面図である。   12A is a perspective view of the multilayer ceramic capacitor according to the embodiment, FIG. 12B is a back view thereof, and FIG. 12C is a side view thereof.

図１２に示すように、素体８に設けた一対の裏面電極１２の厚み（上記凸部２９の高さと同様）をｔ２、素体８の長手方向の長さをＬとしたとき１／８１００×Ｌ2＜ｔ２とすることにより、上述した理由と同様の理由から、プリント基板１１がたわんだとしても積層セラミックコンデンサの周縁部がプリント基板１１に触れることはない。そのため、はんだ接合部に引きはがし方向の力が発生せず、その結果、剥離しにくいという作用効果を有する。 As shown in FIG. 12, when the thickness of the pair of backside electrodes 12 provided on the element body 8 (similar to the height of the convex portion 29) is t2, and the length in the longitudinal direction of the element body 8 is L, 1/8100. By setting × L 2 <t2, the peripheral portion of the multilayer ceramic capacitor does not touch the printed circuit board 11 even if the printed circuit board 11 is bent for the same reason as described above. For this reason, a force in the peeling direction is not generated at the solder joint, and as a result, there is an effect that it is difficult to peel off.

また、これにより積層セラミックコンデンサの周縁部をプリント基板１１から離すことができるので振動を伝えにくくすることができ、その結果、振動音を低減することができる。   Moreover, since the peripheral part of a multilayer ceramic capacitor can be separated from the printed circuit board 11 by this, it can make it difficult to convey a vibration and, as a result, a vibration sound can be reduced.

次に、図１３（ａ）は、一実施の形態における積層セラミックコンデンサの斜視図、図１３（ｂ）は同裏面図である。図１３に示すように、少なくとも素体８に設けた一対の裏面電極３２は導電性樹脂からなり、その導電性樹脂は、エポキシ系樹脂、フェノール系樹脂から選ばれる樹脂を含む構成とするものである。これらの材料を外部電極２、特に、裏面電極３２に用いることによりプリント基板１１に対するクッション作用を有するので積層セラミックコンデンサの振動をプリント基板に伝えにくくすることができ、その結果、振動音を抑制することができる。   Next, FIG. 13A is a perspective view of the multilayer ceramic capacitor in one embodiment, and FIG. 13B is a back view of the same. As shown in FIG. 13, at least a pair of backside electrodes 32 provided on the element body 8 is made of a conductive resin, and the conductive resin includes a resin selected from an epoxy resin and a phenol resin. is there. By using these materials for the external electrode 2, particularly the back electrode 32, it has a cushioning effect on the printed circuit board 11, so that the vibration of the multilayer ceramic capacitor can be made difficult to be transmitted to the printed circuit board, thereby suppressing vibration noise. be able to.

また、図示はしないが、積層セラミックコンデンサの振動の節を接着剤にてプリント基板に固定する方法も有効である。振動の節を利用するのでその接着によるプリント基板への振動の伝搬は大幅に抑制される。例えば、一対の裏面電極間に節がある場合はそこに接着剤を設ければよいし、その場合、接着剤を上述した凸部２９にすることにより凸部２９と同様の作用効果も得ることができる。   Although not shown, a method of fixing the vibration node of the multilayer ceramic capacitor to the printed circuit board with an adhesive is also effective. Since the vibration node is used, the propagation of vibration to the printed circuit board due to the adhesion is greatly suppressed. For example, if there is a node between the pair of back electrodes, an adhesive may be provided there, and in that case, the same effect as the convex 29 can be obtained by using the convex 29 as the adhesive. Can do.

なお、上述した実施の形態においては、一対の外部電極を素体の幅方向の少なくとも両端面および裏面に設けた構成を例に説明したが、本発明は、従来のような、素体の長手方向の両端部に一対の外部電極を設ける構成においても同様の作用効果を有するものである。   In the above-described embodiment, the configuration in which the pair of external electrodes is provided on at least both end surfaces and the back surface in the width direction of the element body has been described as an example. Even in a configuration in which a pair of external electrodes are provided at both ends in the direction, the same effect is obtained.

本発明は、前記素体の裏面に設けた他方の外部電極との少なくとも対向部に第１切欠部を設けてなるとともに前記他方の外部電極に接続された内部電極は、前記素体の裏面に設けた前記一方の外部電極との少なくとも対向部に第２切欠部を設けるという特徴を有し、これにより直流電圧に交流電圧が重畳されたときに発生していた振動音を低減することができるという作用効果を有し、各種電子機器に有用である。   According to the present invention, a first notch is provided at least in a portion facing the other external electrode provided on the back surface of the element body, and an internal electrode connected to the other external electrode is provided on the back surface of the element body. The second cutout portion is provided at least in a portion facing the one external electrode provided, and thereby vibration noise generated when the AC voltage is superimposed on the DC voltage can be reduced. It is useful for various electronic devices.

本発明の一実施の形態における積層セラミックコンデンサの斜視図The perspective view of the multilayer ceramic capacitor in one embodiment of the present invention 同内部電極の斜視図Perspective view of the internal electrode 図１のａ−ａ’線での断面図Sectional drawing in the a-a 'line of FIG. 図１のｂ−ｂ’線での断面図Sectional view taken along line b-b 'in FIG. 図１のｃ−ｃ’線での断面図Sectional view taken along line c-c 'in FIG. （ａ）は内部電極の斜視図、（ｂ）、（ｃ）は同上面図(A) is a perspective view of an internal electrode, (b) and (c) are top views of the same. （ａ）は一実施の形態における積層セラミックコンデンサの斜視図、（ｂ）は同裏面図(A) is a perspective view of the multilayer ceramic capacitor in one embodiment, (b) is the back view of the same （ａ）は一実施の形態における積層セラミックコンデンサの斜視図、（ｂ）は同裏面図(A) is a perspective view of the multilayer ceramic capacitor in one embodiment, (b) is the back view of the same （ａ）は一実施の形態における積層セラミックコンデンサの斜視図、（ｂ）は同裏面図(A) is a perspective view of the multilayer ceramic capacitor in one embodiment, (b) is the back view of the same （ａ）は一実施の形態における積層セラミックコンデンサの裏面図、（ｂ）は同側面図、（ｃ）は積層セラミックコンデンサを実装したプリント基板の側面図(A) is the back view of the multilayer ceramic capacitor in one Embodiment, (b) is the side view, (c) is the side view of the printed circuit board which mounted the multilayer ceramic capacitor （ａ）は一実施の形態における積層セラミックコンデンサの斜視図、（ｂ）は同裏面図(A) is a perspective view of the multilayer ceramic capacitor in one embodiment, (b) is the back view of the same （ａ）は一実施の形態における積層セラミックコンデンサの斜視図、（ｂ）は同裏面図、（ｃ）は同側面図(A) is the perspective view of the multilayer ceramic capacitor in one Embodiment, (b) is the back view, (c) is the side view （ａ）は一実施の形態における積層セラミックコンデンサの斜視図、（ｂ）は同裏面図(A) is a perspective view of the multilayer ceramic capacitor in one embodiment, (b) is the back view of the same ノート型パソコンの斜視図Perspective view of notebook computer 同電源の回路図Circuit diagram of the same power supply

符号の説明Explanation of symbols

１ 誘電体
２ 外部電極
３ 内部電極
４ 第１切欠部
５ 第２切欠部
８ 素体
１０ 積層セラミックコンデンサ
１２ 裏面電極
２８ 凹部
２９ 凸部
３０ 弾性体
３２ 裏面電極 DESCRIPTION OF SYMBOLS 1 Dielectric 2 External electrode 3 Internal electrode 4 1st notch part 5 2nd notch part 8 Element body 10 Multilayer ceramic capacitor 12 Back surface electrode 28 Recess 29 Projection 30 Elastic body 32 Back surface electrode

Claims (11)

誘電体と内部電極を交互に積層した素体と、この素体の少なくとも両端面および裏面に、前記内部電極が交互に接続された一対の外部電極とを備え、一方の外部電極に接続された内部電極は、前記素体の裏面に設けた他方の外部電極との少なくとも対向部に第１切欠部を設けてなるとともに前記他方の外部電極に接続された内部電極は、前記素体の裏面に設けた前記一方の外部電極との少なくとも対向部に第２切欠部を設けてなる積層セラミックコンデンサ。 An element body in which dielectric bodies and internal electrodes are alternately stacked, and a pair of external electrodes in which the internal electrodes are alternately connected to at least both end faces and the back surface of the element body are connected to one external electrode. The internal electrode is provided with a first cutout at least in a portion facing the other external electrode provided on the back surface of the element body, and the internal electrode connected to the other external electrode is provided on the back surface of the element body. A multilayer ceramic capacitor comprising a second cutout at least at a portion facing the one external electrode provided. 第１切欠部を素体の裏面に設けた他方の外部電極との対向部から一方の外部電極の方向に延設するとともに第２切欠部を素体の裏面に設けた一方の外部電極との対向部から他方の外部電極の方向に延設することにより、
前記一対の外部電極間における少なくとも一組の内部電極の対向部面積は、
前記一対の外部電極間における前記一組の内部電極の投影面積の２／３以下とした請求項１記載の積層セラミックコンデンサ。 The first cutout portion extends from the facing portion of the other external electrode provided on the back surface of the element body in the direction of the one external electrode, and the second cutout portion is provided with one external electrode provided on the back surface of the element body. By extending in the direction of the other external electrode from the facing part,
The opposing area of at least one set of internal electrodes between the pair of external electrodes is:
The multilayer ceramic capacitor according to claim 1, wherein the projected area of the pair of internal electrodes between the pair of external electrodes is 2/3 or less. 第１切欠部を素体の裏面に設けた他方の外部電極との対向部から一方の外部電極の方向に延設するとともに第２切欠部を素体の裏面に設けた一方の外部電極との対向部から他方の外部電極の方向に延設することにより、
前記一対の外部電極間における少なくとも一組の内部電極の対向部面積は、
前記一対の外部電極間における前記一組の内部電極の投影面積の１／２以下とした請求項１記載の積層セラミックコンデンサ。 The first cutout portion extends from the facing portion of the other external electrode provided on the back surface of the element body in the direction of the one external electrode, and the second cutout portion is provided with one external electrode provided on the back surface of the element body. By extending in the direction of the other external electrode from the facing part,
The opposing area of at least one set of internal electrodes between the pair of external electrodes is:
The multilayer ceramic capacitor according to claim 1, wherein the projected area of the set of internal electrodes between the pair of external electrodes is ½ or less. 第１切欠部を素体の裏面に設けた他方の外部電極との対向部から一方の外部電極の方向に延設するとともに第２切欠部を素体の裏面に設けた一方の外部電極との対向部から他方の外部電極の方向に延設することにより、
前記一対の外部電極間における少なくとも一組の内部電極を非対向とした請求項１記載の積層セラミックコンデンサ。 The first cutout portion extends from the facing portion of the other external electrode provided on the back surface of the element body in the direction of the one external electrode, and the second cutout portion is provided with one external electrode provided on the back surface of the element body. By extending in the direction of the other external electrode from the facing part,
The multilayer ceramic capacitor according to claim 1, wherein at least one pair of internal electrodes between the pair of external electrodes is not opposed. 一対の外部電極は、素体の幅方向の少なくとも両端面および裏面に設けた請求項１記載の積層セラミックコンデンサ。 The multilayer ceramic capacitor according to claim 1, wherein the pair of external electrodes are provided on at least both end surfaces and the back surface in the width direction of the element body. 素体の裏面に設けた一対の外部電極の形状は、素体の幅方向の端部に向かって前記外部電極の幅が狭くなる形状である請求項１記載の積層セラミックコンデンサ。 2. The multilayer ceramic capacitor according to claim 1, wherein the pair of external electrodes provided on the back surface of the element body has a shape in which the width of the external electrode becomes narrower toward an end portion in the width direction of the element body. 一対の外部電極を設ける素体の両端面に凹部を設け少なくともこの凹部に一対の外部電極を設けた請求項１記載の積層セラミックコンデンサ。 2. The multilayer ceramic capacitor according to claim 1, wherein recesses are provided on both end faces of the element body on which the pair of external electrodes are provided, and at least a pair of external electrodes are provided in the recesses. 素体の裏面に設けた一対の外部電極間に凸部を設けた請求項１記載の積層セラミックコンデンサ。 The multilayer ceramic capacitor according to claim 1, wherein a convex portion is provided between a pair of external electrodes provided on the back surface of the element body. 凸部は、凸部の高さをｔ１、素体の長手方向の長さをＬとしたとき１／８１００×Ｌ2＜ｔ１である請求項８記載の積層セラミックコンデンサ。 9. The multilayer ceramic capacitor according to claim 8, wherein the height of the convex portion is 1/8100 × L 2 <t1 where t1 is the height of the convex portion and L is the length of the element body in the longitudinal direction. 素体の裏面に設けた一対の外部電極は、外部電極の厚みをｔ２、素体の長手方向の長さをＬとしたとき１／８１００×Ｌ2＜ｔ２である請求項１記載の積層セラミックコンデンサ。 2. The multilayer ceramic according to claim 1, wherein the pair of external electrodes provided on the back surface of the element body is 1/8100 × L 2 <t 2 where t 2 is the thickness of the external electrode and L is the length in the longitudinal direction of the element body. Capacitor. 少なくとも素体の裏面に設けた一対の外部電極は導電性樹脂からなり、その導電性樹脂は、エポキシ系樹脂、フェノール系樹脂から選ばれる樹脂を含む請求項１記載の積層セラミックコンデンサ。 The multilayer ceramic capacitor according to claim 1, wherein at least a pair of external electrodes provided on the back surface of the element body is made of a conductive resin, and the conductive resin includes a resin selected from an epoxy resin and a phenol resin.
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US9384892B2 (en) 2013-06-14 2016-07-05 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same mounted thereon
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US9502177B2 (en) 2013-06-14 2016-11-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same mounted thereon
CN104240946A (en) * 2013-06-14 2014-12-24 三星电机株式会社 Multilayer ceramic capacitor and board having the same mounted thereon
JP2015019045A (en) * 2013-07-15 2015-01-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． Array type multilayer ceramic electronic component and mounting substrate thereof
KR102064013B1 (en) * 2013-07-18 2020-01-08 삼성전기주식회사 Composite electronic component and board for mounting the same
KR20150010181A (en) * 2013-07-18 2015-01-28 삼성전기주식회사 Composite electronic component and board for mounting the same
US20150022937A1 (en) * 2013-07-18 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Composite electronic component and board having the same
US9520244B2 (en) * 2013-07-18 2016-12-13 Samsung Electro-Mechanics Co., Ltd. Composite electronic component and board having the same
WO2015098990A1 (en) * 2013-12-24 2015-07-02 京セラ株式会社 Laminated electronic component and structure for mounting same
CN105849835A (en) * 2013-12-24 2016-08-10 京瓷株式会社 Laminated electronic component and structure for mounting same
CN111048310A (en) * 2018-10-11 2020-04-21 株式会社村田制作所 Electronic component

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