JP2007191639A - Method for producing resin composition and resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition having improved mechanical characteristics and heat resistance while keeping its good transparency (light transmission properties) and a method for producing the resin composition. <P>SOLUTION: The method for producing the resin composition comprises a 1st step for obtaining a mixed solution through mixing of an organic solvent containing inorganic particles of submicrometer orders with an acrylic monomer, a 2nd step for removing the organic solvent from the mixed solution obtained in the 1st step, and a 3rd step for obtaining a resin composition through addition of a material that causes interaction between an organic material and an inorganic material by acting on both an acrylic monomer and inorganic particles in the mixed solution from which the organic solvent has been substantially removed by the 2nd step to cause formation of interaction between the acrylic monomer and the inorganic particles via polymerization reaction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an acrylic resin composition containing inorganic fine particles and a method for producing the same.

For the purpose of improving the mechanical properties, heat resistance and the like of acrylic resins such as polymethyl methacrylate (hereinafter referred to as PMMA), resin compositions in which inorganic fine particles are blended in the resin are known. Such a resin composition is known to improve other characteristics while suppressing a decrease in translucency (transparency) by blending inorganic fine particles having an average particle size on the order of submicron.
JP 2004-131702 A

Although the resin composition containing the above-mentioned inorganic fine particles is improved in mechanical properties, heat resistance and the like as compared with an acrylic resin composed of a single component, sufficient translucency is not obtained.
In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a resin composition with improved mechanical properties and heat resistance while maintaining good translucency (transparency), and a method for producing the same. .

  As a result of intensive studies, the present inventors have found that a resin composition in which an inorganic resin of submicron order and an organic / inorganic interaction material (modifier) interacting with each other are mixed with an acrylic resin. Found that heat resistance and surface hardness were improved while ensuring high transparency. In such a resin composition, an organic solvent containing submicron-order inorganic fine particles and an acrylic monomer are mixed to obtain a mixed liquid, and after removing the organic solvent from the mixed liquid, the acrylic monomer and the inorganic fine particles are mixed. By carrying out the polymerization reaction using the organic-inorganic interaction material that interacts with each other, it can be obtained by only one stage of reaction.

In the present invention, specific examples of the raw material for the acrylic resin used include those listed below. In the description, “... (Meth) acrylate” means “... Acrylate” or “methacrylate”.
First, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, tert-butyl (meth) acrylate, isobutyl (meth) acrylate, n-pentyl (meth) acrylate, tert-pentyl (meth) acrylate, hexyl (meth) acrylate, 2-methylbutyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, Decyl (meth) acrylate, dodecyl (meth) acrylate, stearyl (meth) acrylate, butoxyethyl (meth) acrylate, isodecyl (meth) acrylate, butoxyethylene glycol (meth) acrylate, methoxytri Tylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, ethylene glycol phenyl ether acrylate, tetrahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl methacrylate Linear, branched, and cyclic alkyl (meth) acrylates such as isobornyl (meth) acrylate, trifluoroethyl (meth) acrylate, and perfluorooctylethyl (meth) acrylate. A copolymer obtained by using one or more kinds can be used as an acrylic resin.

Further, inorganic fine particles having an average particle size on the order of submicron are used. Preferably, the lower limit is not particularly limited as long as it is 100 nm or less and has a physical size. It will be determined by the particle size of available inorganic fine particles. Examples of the inorganic fine particles that can be used include metal oxide sols that can be surface-modified with an organic-inorganic interaction material described later. For example, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), titania (TiO ₂ ), ITO (tin-doped indium oxide), tin oxide (SnO ₂ ), zinc oxide (ZnO), antimony oxide (Sb ₂ O ₃ , Sb ₂ O _5, etc.), and composite fine particles thereof. The blending amount of the inorganic fine particles is preferably 1.0% by weight to 70% by weight, more preferably 15% by weight to 45% by weight with respect to the mixed amount of the acrylic resin and the inorganic fine particles. If the inorganic fine particles are less than 1.0% by weight, the effect is hardly exhibited. Moreover, when it exceeds 70 weight%, the obtained resin composition tends to become weak.
The organic-inorganic interaction material used in the present invention may be a material having an organic functional group for acting on an organic material and a hydrolyzing group for acting on an inorganic material. For example, the following formula (1) The organic-inorganic interaction material represented by can be used.

（式中、Ｒ₁は水素またはＣ₁〜Ｃ₅の直鎖又は側鎖のアルキル基、Ｒ２はＣ₁〜Ｃ₁₀の直鎖又は側鎖のアルキル基を示す。Ｙは水酸基、ハロゲン基、エポキシ基、アルコキシシリル基、カルボキシル基、イソシアネート基、クロロシリル基、アシルハライド基、メルカプト基、アミノ基からなる群より選択される）
具体的には、γ−メタクリロキシプロピルトリメトキシシラン（ＭＰＳ）、グリシジルメタクリレート（ＭＧ）、２−メタクリロイルオキシエチルイソシアネート（ＭＯＩ）、２−アクリロイルオキシエチルイソシアネート（ＡＯＩ）、２−ヒドロキシエチルメタクリレート等が挙げられる。

(In the formula, R ₁ represents hydrogen or a C _{1 to} C ₅ linear or side chain alkyl group, R 2 represents a C _{1 to} C ₁₀ linear or side chain alkyl group, Y represents a hydroxyl group, a halogen group, (Selected from the group consisting of epoxy group, alkoxysilyl group, carboxyl group, isocyanate group, chlorosilyl group, acyl halide group, mercapto group, amino group)
Specifically, γ-methacryloxypropyltrimethoxysilane (MPS), glycidyl methacrylate (MG), 2-methacryloyloxyethyl isocyanate (MOI), 2-acryloyloxyethyl isocyanate (AOI), 2-hydroxyethyl methacrylate, etc. Can be mentioned.

  The lower compounding amount in such an organic / inorganic interaction material is such that the organic material side (acrylic monomer, oligomer, polymer) and the inorganic material side (metal oxidation) in order to provide compatibility between the organic material and the inorganic material. Compound) may be used as long as it is 0.01% by weight or more based on the total amount of the resin composition. Moreover, the upper limit compounding quantity should just be a grade which physical properties, such as heat resistance and surface hardness of a resin composition, are not impaired.

  In addition, when the inorganic fine particles are mixed with the monomer used as the raw material for the acrylic resin, the inorganic fine particles are preferably dispersed in advance in an organic solvent in order to uniformly disperse the inorganic fine particles. Any organic solvent can be used as long as it can be mixed with an acrylic monomer and can remove the organic solvent from the mixed solution using a solvent substitution method. For example, methyl ethyl ketone (hereinafter referred to as MEK), benzene, toluene, xylene, methyl cellosolve, ethyl cellosolve, n-propyl cellosolve, methanol, ethanol, isopropyl alcohol, methyl isobutyl ketone and the like can be mentioned. Further, it is preferably an organic solvent that is hydrophobic and can dissolve the acrylic monomer.

  Polymerization initiators for polymerizing acrylic monomers include benzoyl peroxide (BPO), t-butylperoxy-2-ethylhexanoate, 1,1-di-t-butylperoxy-2-methyl General peroxide initiators such as cyclohexane, azo initiators such as 2,2′-azobis-isobutyronitrile (AIBN), 2,2′-azobis-2,4-dimethylvaleronitrile, etc. A polymerization initiator can be used.

Next, the manufacturing method of the resin composition of this invention is demonstrated, referring drawings. FIG. 1 is a flowchart showing a flow of a method for producing a resin composition of the present invention.
First, a predetermined amount of an organic solvent in which submicron-order inorganic fine particles are uniformly dispersed in a liquid and an acrylic monomer are mixed to prepare a mixed liquid. Next, by using a solvent substitution method, the mixed solution is heated for a predetermined time under reduced pressure to remove the organic solvent from the mixed solution. Thereafter, a small amount of an organic-inorganic interaction material (modifier) and a polymerization initiator are added to the mixed solution from which the organic solvent has been removed, and then a polymerization reaction is performed at a predetermined temperature for a predetermined time to obtain a polymer. By performing, the target resin composition will be obtained. In this manufacturing process, the organic-inorganic interaction material is covalently bonded to the acrylic monomer and is covalently bonded or interacts with the inorganic fine particles.

  In addition, since the resin composition of this invention can be obtained only by one step of reaction in this way, a manufacturing process is also simple and can be manufactured cheaply. Further, by using this resin composition as a raw material, an injection molding machine, an extrusion molding machine or the like can be used to obtain a sheet-like or plate-like resin composition (resin molding) having excellent heat resistance and mechanical properties. it can. In particular, such a composition can be suitably used for optical applications. Furthermore, a coating having an effect of improving surface hardness and heat resistance can be performed by applying a predetermined thickness on the surface of the optical member by using a spin coating method or the like using a mixed solution before polymerization, and then curing. It will be.

  ADVANTAGE OF THE INVENTION According to this invention, the resin composition which can improve mechanical characteristics and heat resistance can be obtained, maintaining favorable translucency (transparency), without going through a complicated process.

  Next, although the Example and comparative example regarding this invention are given and demonstrated, this invention is not limited to these.

Example 1
As a preliminary preparation, MMA was distilled to remove a polymerization inhibitor in MMA (manufactured by methyl methacrylate Aldrich).
Next, colloidal silica (MEK-ST solid content SiO ₂ (average particle size 10 to 15 nm) 30% MEK 70%) manufactured by Nissan Chemical Industries, Ltd. (5.0 g) and MMA from which the polymerization inhibitor has been removed were mixed with colloidal silica. About 10 times the amount was taken in a flask to make a mixed solution, and then MEK in the mixed solution was removed with an evaporator. The solvent replacement conditions by the evaporator were a liquid temperature of 40 ° C. to 50 ° C. and an internal pressure of 0.085 MPa. After confirming that the remaining amount of MEK in the mixed solution is 1% or less using a gas chromatographic method, the amount of the mixed solution after the solvent replacement (mixed solution from which MEK has been removed) finally becomes 10 g. adjust the MMA as, 15 wt% SiO ₂ is to this mixture (MMA 8.5g, SiO ₂ 1.5g) as a to give a clear mixture.
In the mixed solution from which MEK was removed, a small amount of polymerization initiator (benzoyl peroxide Kishida Chemical Co., Ltd.) (0.5 mol% with respect to MMA) and MOI (Karenz MOI as a modifier (organic-inorganic interaction material)) were used. A small amount (0.44 g) of Showa Denko Co., Ltd. was added. The mixed solution to which the polymerization initiator and the modifier were added was stirred for about 30 minutes, then placed in a predetermined mold and polymerized in a warm bath at 80 ° C. for 6 hours to obtain the desired resin composition. Furthermore, this resin composition was placed in an oven and dried at 80 ° C. for 12 hours to obtain a transparent plate-shaped resin composition having a thickness of 2 mm.

The physical properties and the like of the obtained plate-shaped resin composition were measured. Measurement was performed by measuring transmittance, measuring thermal properties, and measuring mechanical properties.
(1) Transmittance measurement: Using a spectrophotometer (manufactured by Shimadzu Corporation, UV2100), the transmittance in the visible region (380 nm to 720 nm) of the obtained plate-shaped resin composition was determined.
(2) Thermal property measurement: Thermal analysis was performed using EXSTAR6000 TG / DTA6300 manufactured by Seiko Instruments Inc. Three types of 5% weight loss temperature, 10% weight loss temperature, and thermal decomposition temperature of the obtained plate-shaped resin composition were measured at a temperature increase rate of 10 ° C./min under a nitrogen stream of 50 ml / min. .
(3) Mechanical property measurement: Pencil hardness (surface hardness) of the obtained plate-shaped resin composition was measured according to JISK-5600.
(4) Appearance inspection: The transparent state was examined by visual observation.
The results are shown in Table 1.

(Example 2)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method as described above, and SiO ₂ was 30% by weight (MMA 7.0 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 3.0 g).
A small amount of the same polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) and a small amount of MOI (0.42 g) as a modifier were added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Example 3)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method in the same manner as described above, and SiO ₂ was 45% by weight (MMA 5.5 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 4.5 g).
A small amount of the same polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) and a small amount of MOI (0.44 g) as a modifier were added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

Example 4
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method as described above, and SiO ₂ was 15% by weight (MMA 8.5 g, SiO ₂ 1.5 g).
In the mixed solution from which MEK was removed, the same polymerization initiator as in Example 1 was added in a trace amount (0.5 mol% with respect to MMA), and MPS (KBM503 Shin-Etsu Chemical Co., Ltd.) as a modifier was added in a trace amount (0.4 g). did. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Example 5)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method as described above, and SiO ₂ was 30% by weight (MMA 7.0 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 3.0 g).
A small amount of the same polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) and a small amount of MPS (0.4 g) as a modifier were added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Example 6)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method in the same manner as described above, and SiO ₂ was 45% by weight (MMA 5.5 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 4.5 g).
A small amount of the same polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) and a small amount of MPS (0.44 g) as a modifier were added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Example 7)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method as described above, and SiO ₂ was 15% by weight (MMA 8.5 g, SiO ₂ 1.5 g).
In the mixed solution from which MEK was removed, the same amount of the polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) was used, and MG (Light Ester G Kyoeisha Chemical Co., Ltd.) was used as a modifying agent in a trace amount (0.44 g). Added. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Example 8)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method as described above, and SiO ₂ was 30% by weight (MMA 7.0 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 3.0 g).
A small amount of the same polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) and a small amount of MG (0.42 g) as a modifier were added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

Example 9
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method in the same manner as described above, and SiO ₂ was 45% by weight (MMA 5.5 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 4.5 g).
A small amount of the same polymerization initiator as in Example 1 (0.5 mol% with respect to MMA) and a small amount of MG (0.44 g) as a modifier were added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Comparative Example 1)
Only 10.0 g of the same polymerization initiator as in Example 1 was added to 10.0 g of MMA excluding the polymerization inhibitor (0.5 mol% with respect to MMA). The MMA solution to which the polymerization initiator was added was stirred for about 30 minutes, then placed in a predetermined mold and polymerized in a warm bath at 80 ° C. for 6 hours. Thereafter, the plate was placed in an oven and dried at 80 ° C. for 12 hours to obtain a transparent plate-shaped resin composition having a thickness of 2 mm that did not contain inorganic fine particles and a modifier.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Comparative Example 2)
After a mixed liquid of colloidal silica and MMA was obtained in the same manner as in Example 1, MEK was removed by the solvent replacement method as described above, and SiO ₂ was 15% by weight (MMA 8.5 g, SiO ₂ 1.5 g).
A small amount (0.5 mol% with respect to MMA) of the same polymerization initiator as in Example 1 was added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Comparative Example 3)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method in the same manner as described above, and SiO ₂ was 30% by weight (MMA 7.0 g, SiO ₂ was adjusted to 3.0 g).
A small amount (0.5 mol% with respect to MMA) of the same polymerization initiator as in Example 1 was added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(Comparative Example 4)
After obtaining a mixed liquid of colloidal silica and MMA in the same manner as in Example 1, MEK was removed by the solvent replacement method in the same manner as described above, and SiO ₂ was 30% by weight (MMA 5.5 g, MMA based on the mixed liquid after solvent replacement). SiO ₂ was adjusted to 4.5 g).
A small amount (0.5 mol% with respect to MMA) of the same polymerization initiator as in Example 1 was added to the mixed solution from which MEK was removed. Then, after stirring the mixed liquid to which the polymerization initiator and the modifier were added for about 30 minutes, the polymerization was performed in a warm bath at 80 ° C. for 6 hours, and further dried at 80 ° C. for 12 hours, as in Example 1. A transparent plate-like resin composition having a thickness of 2 mm was obtained.
The physical properties and the like were measured by the same method as in Example 1 for the resin composition obtained by the above treatment. The results are shown in Table 1.

(result)
As shown in Table 1, it is confirmed that the acrylic resin compositions obtained using the resin compositions of Examples 1 to 9 have improved heat resistance and surface hardness while ensuring high transparency. did it. Other mechanical properties (tensile strength, tensile modulus, etc.) are also considered to be improved.

  Next, about the case where the quantity of the modifier to add is changed, it mentions below as Examples 10-19 and Comparative Examples 5-9. The resin compositions (plate-shaped resin compositions having a thickness of 2 mm) obtained in Examples 11 to 20 and Comparative Examples 5 to 9 were obtained by the same operation as in Example 1 described above. . In addition, each composition in each example and comparative example is as shown in Table 2. Moreover, the obtained plate-shaped resin composition was visually evaluated (appearance evaluation). The results are also shown in Table 2.

(result)
As shown in Examples 10, 12, and 14 of Table 2, transparency can be secured even if the weight ratio of the modifier to the total amount is about 0.015% by weight, regardless of the content of the inorganic fine particles. It was. Further, as shown in Examples 16 and 18, even when the type of modifier was changed, transparency could be ensured even when the weight ratio of the modifier relative to the total amount was about 0.015% by weight. From this, it is considered that the lower limit of addition of the modifier is about 0.01% by weight. Further, as shown in Examples 11, 13, 15, 17, and 19, transparency can be ensured even when the amount of the modifier added is about 50% by weight. Therefore, the upper limit of the addition amount of the modifier may be such that physical properties such as heat resistance and surface hardness of the resin composition are not impaired.

It is the flowchart which showed the flow of manufacture of the resin composition of this invention.

Claims (6)

A first step in which an organic solvent containing submicron-order inorganic fine particles and an acrylic monomer are mixed to obtain a mixed solution; a second step in which the organic solvent is removed from the mixed solution obtained by the first step; An organic-inorganic interaction material that interacts with the acrylic monomer and the inorganic fine particles is added to the mixed liquid from which the organic solvent has been substantially removed by the second step, and the acrylic monomer and the inorganic fine particles are reacted by a polymerization reaction And a third step of obtaining a resin composition by forming an interaction between the two, and a method for producing a resin composition. The method for producing a resin composition according to claim 1, wherein the organic solvent is removed by a solvent replacement method in the second step. 3. The method for producing a resin composition according to claim 2, wherein the polymerization reaction in the third step includes a reaction for polymerizing the acrylic monomer. In the manufacturing method of the resin composition of Claim 2, the said organic-inorganic interaction material is a formula (1).

(Wherein R ₁ represents hydrogen or a C _{1 to} C ₅ linear or side chain alkyl group, and R ₂ represents a C _{1 to} C ₁₀ linear or side chain alkyl group. Y Is selected from the group consisting of a hydroxyl group, a halogen group, an epoxy group, an alkoxysilyl group, a carboxyl group, an isocyanate group, a chlorosilyl group, an acyl halide group, a mercapto group, and an amino group). Production method. A resin composition obtained by the method for producing a resin composition according to claim 1. A resin composition obtained by a polymerization reaction in a state in which an inorganic fine particle of submicron order and an organic-inorganic interaction material that interacts with the acrylic monomer and the inorganic fine particle are blended in an acrylic monomer.

Images