JP2007177270A - Hanger for suspending printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hanger which is used for plating a printed circuit board, stably holds the printed circuit board without causing a rattle even after a long period of use, can stably hold even various printed circuit boards each having different board thickness, and can simply and lightly attach and detach the printed circuit board. <P>SOLUTION: The hanger comprises: a frame body 2 which surrounds the four sides of the printed circuit board (W) by a head part 5, a bottom part and vertical parts; and a hook member which projects upward from the head part 5 of the frame body 2. The head part 5 comprises: a board receiver 12 for abutting on and fixing one surface of an upper part of the printed circuit board (W); a wedge member 13 which is held in a front side of the board receiver 12 so as not to fall off; and a wedge-guiding member 15 for pushing the wedge member 13 to the board receiver 12 side as the wedge member 13 moves to a lower position. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a hanger for hanging a printed circuit board used in continuous electroplating or the like.

  When electroplating a printed circuit board, a hanger that holds the printed circuit board in an upright position is suspended from a substrate transfer path installed above the plating tank, and the printed circuit board is immersed in the plating solution in the tank at the position of the plating tank. Thus, continuous electroplating is known in which the hanger is moved along the substrate transport path (see, for example, Patent Document 1). The substrate transport path also serves as the cathode electrode, and the hanger has conductivity as a whole. Therefore, in the plating tank, the anode current applied to the electrode provided in the tank and the substrate transport A plating process (formation of a plating film on the printed circuit board) is performed with the cathode current applied to the printed circuit board through the path.

By the way, in order to hold the printed circuit board on the hanger, the printed circuit board is placed in a superposed state with respect to the frame main body having the same size as the outer shape of the printed circuit board. A structure has been proposed in which the left and right side edge portions are sandwiched by sandwiching members having a U-shaped cross section (see Patent Document 2, etc.).
However, with this known hanger, the printed board that is thinner than the board thickness to be held generates rattling in the holding state, and as a result, it cannot be used for various printed boards with different board thicknesses, that is, it has a drawback of poor versatility. was there.

In particular, when the hanger vibrates while moving on the substrate conveyance path, the printed circuit board in the holding state may be displaced or dropped off, which has a great adverse effect on the finish of the plating.
Accordingly, the present applicant provides a pressing member that is in contact with the printed circuit board via a corrugated plate spring so that the pressing member can be opened and closed in a double-folded manner with respect to the left and right vertical bars of the frame body. Developed a hanger with a structure that sandwiches the printed circuit board in a sandwich shape with a pressing member with a leaf spring and sandwiches the sandwiched thickness direction with an external fitting of a clip tool formed in a U-shaped cross section And applied for a patent (see Patent Document 3).
JP 2000-54197 A JP 2000-290797 A JP 2003-73895 A

  In the hanger that the applicant has developed and applied for a patent earlier, the thickness of the printed circuit board with different plate thickness is automatically adjusted by the degree of compression of the leaf spring. There was an advantage that it could be held. As a result, versatility can be improved. Moreover, there was an epoch-making advantage that the printed circuit board can be attached and detached easily and lightly.

However, if the hanger is used for a long period of time, it will be inevitable that the spring force of the leaf spring will decrease due to the high frequency of use, and there will be a slight backlash in the holding state of the printed circuit board. there were.
The present invention has been made in view of the above circumstances, and is intended to be able to stably hold various printed boards having different plate thicknesses, so as to enhance its versatility, and further, the printed board can be used for a long period of use. An object of the present invention is to provide a hanger for suspending a printed circuit board that can be stably held without rattling.

  Another object of the present invention is to provide a hanger for suspending a printed circuit board that can stably hold the printed circuit board for a long period of use and can be attached and detached easily and lightly.

In order to achieve the above object, the present invention has taken the following measures.
That is, the hanger for hanging a printed circuit board according to the present invention includes a frame main body that surrounds the four circumferences of the printed circuit board by an upper frame part, a lower frame part, and a pair of left and right vertical frame parts that connect the upper frame part, the upper frame part, And a hook portion that protrudes upward from the frame portion and is used to suspend the substrate transfer path passing above the plating tank.

And the upper frame part of a frame main body has the board | substrate receiving part which stops the upper end part single side | surface of a printed circuit board, and the wedge member hold | maintained so that it cannot drop | omit on the front side of this board | substrate receiving part. The upper frame portion has a wedge guiding member.
This wedge guiding member secures at least a play for generating or shrinking a printed board clamping gap between the front surface of the substrate receiving portion and the wedge member, and the wedge receiving member moves to the lower position as the wedge member moves to the lower position. The clamping gap is shortened by pushing to the side.

  Since it is such a configuration, after the upper end portion of the printed circuit board is sandwiched between the substrate receiving portion and the wedge member with respect to the upper frame portion of the frame main body, the wedge member is moved downwardly The wedge member is pushed into the substrate receiving portion by the wedge guiding member. As a result, the printed circuit board is sandwiched between the substrate receiving portion and the wedge member, so that the printed circuit board does not fall off and is not displaced.

As the wedge member moves downward, the wedge guiding portion is pushed into the board receiving portion, so that the clamping pressure of the printed board becomes more and more undue, and the printed board does not rattle even with conveyance vibration. Absent.
With respect to the attachment / detachment of the printed board, the upper end of the printed board can be inserted / removed between the board receiving portion and the wedge member by moving the wedge member up and down a little, so that it is very simple and light.

A plurality of wedge guiding members may be provided in a dotted manner at predetermined intervals in the longitudinal direction with respect to the upper frame portion of the frame body. By doing so, it is possible to simplify the structure, make it compact, and reduce the cost. In addition, since the weight of the hanger can be maintained as a whole, there is no risk of adverse effects in transport driving and handling operations.
The wedge member may be formed in a horizontally long shape that can be contacted in a line contact manner along the upper side portion of the printed circuit board. For example, the wedge member can be formed of a rod having a circular cross section. By doing in this way, a wedge member can be formed as one bar, and it is useful for simplification of a structure, compactization, reduction in price, weight reduction, etc. When the wedge member is a rod having a circular cross section, the directionality as a cross-sectional shape is lost, so that there is an advantage that the wedge member can be easily held and the structure is simplified.

The wedge guiding member may have an attachment base that is attached to the upper frame portion of the frame body and a holding portion that protrudes downward from the attachment base in a bowl shape. On the back side of the holding portion, the wedge member is held from the front side with the substrate receiving portion of the upper frame portion to allow play and vertical movement.
In this case, the cam surface that comes into contact with the wedge member in a state in which the back surface of the holding portion (inner surface portion that holds the wedge member) is inclined in a direction that becomes narrower as the distance between the upper frame portion and the substrate receiving portion becomes lower. To form.

It is preferable to provide a wedge pressing means for pressing the wedge member downward with respect to the upper frame portion of the frame body. By providing the wedge pressing means, the clamping action of the printed circuit board can be forcibly generated, so that the clamping action is ensured, and unless the wedge pressing means is released and motivated, the clamping action is relaxed. There is an advantage that it does not occur.
The wedge pressing means may have an attachment base attached to the upper frame portion of the frame main body and a push bolt screwed in a direction vertically passing through the attachment base. In this case, the wedge member can be pushed down at the lower end of the push bolt.

The wedge pressing means can be arranged in the center of the upper frame portion of the frame main body, and the wedge guiding members can be separately arranged on both sides of the wedge pressing means.
It is preferable that a weight bar is provided between the left and right vertical frame parts so as to be movable up and down with respect to the frame body, and a board holding means for holding the lower end part of the printed board is provided on the weight bar.

  When such a substrate clamping means is provided, a downward tensile load due to the weight bar can be applied to the lower end portion of the printed circuit board. Therefore, a moderate tension can be given to the holding state of the printed circuit board, which is suitable for the plating process. Further, by applying a downward tensile load to the printed circuit board, the wedge member can also be drawn downward, and the clamping action of the upper end portion of the printed circuit board by the wedge member can be made more and more reliable.

  Moreover, in addition to stabilizing the holding state of the printed circuit board, the conductivity of the upper and lower ends of the printed circuit board can be ensured, so that when the printed circuit board is immersed in the plating solution in the plating tank, There is also an advantage that there is no potential difference between the upper and lower sides, and as a result, a uniform plating film can be obtained.

The hanger for hanging a printed circuit board according to the present invention is capable of stably holding various printed circuit boards having different plate thicknesses, and has improved versatility. In addition, the printed circuit board can be kept in a stable holding state without backlash even when the service period is long.
Further, the hanger for hanging a printed board according to the present invention can stably hold various printed boards having different thicknesses, and can easily and easily attach and detach the printed board.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 5 show an embodiment of a hanger 1 according to the present invention. The hanger 1 is for holding the printed circuit board W in an upright position. In this holding state, the hanger 1 is suspended from a substrate transfer path installed above the plating tank and is provided in the substrate transfer path. While being pushed by the feeding claw of the claw feeding device, it is conveyed along this substrate conveyance path. At the position of the plating tank, the held printed circuit board W is guided with an ascending / descending operation so as to be immersed in the plating solution in the tank.

  As shown in FIGS. 1 and 2, the hanger 1 has a frame body 2 and a hook portion 3. The frame body 2 is a part for holding the printed circuit board W, and the printed circuit board W can be freely attached and detached. The hook portion 3 is provided in a state of protruding upward from the frame body 2 (upper frame portion 5 described later), and the hanger 1 is suspended directly or indirectly by the hook portion 3 on the substrate transport path. Become.

  As for these basic structures, there is no significant difference from conventionally known hangers (see Patent Documents 2 and 3, etc.). For example, the frame body 2 and the hook part 3 are inseparably integrated even if they are detachable from each other. It is good also as a structure (integrated structure by integral formation or connection). Although the hook part 3 of this embodiment is provided as a pair of left and right and is formed in a downward U-shape, this is not particularly limited, such as the number or hook shape.

  The frame body 2 has a structure that surrounds the four circumferences of the printed circuit board W by an upper frame portion 5, a lower frame portion 6, and a pair of left and right vertical frame portions 7 that connect them. In addition, a weight bar 10 is provided between the left and right vertical frame portions 7 on the frame body 2. In the frame main body 2 of the present embodiment, the lower frame portion 6 and the left and right vertical frame portions 7 are integrally formed by bending a wire member having a circular cross section into a U shape.

  The vertical distance between the upper frame portion 5 and the lower frame portion 6 is further longer than at least the space where the weight bar 10 is provided, compared to the long side of the printed circuit board W to be held, which is the maximum size. It is formed as follows. Further, the left and right vertical frame portions 7 are formed so that the horizontal interval is longer than the short side of the printed circuit board W to be held, which is the maximum size.

Therefore, any size printed circuit board W to be held is not in contact with the lower frame portion 6 and the left and right vertical frame portions 7 in the held state.
The upper frame portion 5 is formed in a band plate shape with its longitudinal direction facing left and right, and as shown in FIGS. 3 and 4, a substrate receiving portion 12 is provided on the front surface thereof. The board receiving part 12 is a part for holding the upper surface of the printed circuit board W, and in this embodiment, a step 5a is provided so as to dent the front part along the lower side part of the upper frame part 5. The substrate receiving portion 12 is formed as a flat surface that is long in the left-right direction on the lower side (the recessed surface side) of the step 5a.

  The step 5a is formed with a dent amount larger than the thickness of the printed board W to be held, which is the maximum thickness, and is formed over substantially the entire length of the board receiving portion 12 in the left-right direction. Therefore, any thick printed circuit board W to be held can be accommodated in the recess amount of the step 5a in a state where the upper surface of the printed circuit board W is held against the board receiving portion 12. It has become.

Although the step 5a is not necessarily required, the printed circuit board W held by the board receiving portion 12 can be positioned in the height direction (can be moved over the step 5a so as not to be displaced upward) and in the left-right direction. It can be said that it is preferable to provide it because it can be prevented from tilting.
The upper frame portion 5 is provided with a wedge member 13 at a position corresponding to the front surface of the substrate receiving portion 12. Further, the upper frame portion 5 is provided with a wedge guiding member 15 and a wedge pressing means 16.

The wedge member 13 is formed in a horizontally long shape along the board receiving portion 12, and when the printed board W is held against the board receiving portion 12, one surface on the opposite side to the upper end portion of the printed board W It can come into contact with (front) in line contact.
In the present embodiment, the wedge member 13 is formed of a rod having a circular cross section and has substantially the same length as the horizontal direction of the substrate receiving portion 12 (upper frame portion 5). Therefore, the line-contact contact with the printed board W also extends in a horizontally long range along the upper end portion of the printed board W.

Note that at least one of the substrate receiving portion 12 and the wedge member 13 is formed of a conductive material such as stainless steel, so that when the printed circuit board W is immersed in the plating solution in the plating tank and electroplated. Are used as cathode electrodes.
As shown in FIG. 3, the wedge guiding member 15 is for giving play (dynamicity) in a predetermined range and a law of operation to the wedge member 13 held in front of the substrate receiving portion 12. It is. In this embodiment, the wedge guiding member 15 also has an effect of preventing the wedge member 13 from dropping off from the front surface of the substrate receiving portion 12.

That is, the wedge guiding member 15 has an attachment base 20 attached to the upper frame portion 5 and a holding portion 21 provided so as to protrude downward from the attachment base 20 in a bowl shape. On the back side of the holding portion 21, the wedge member 13 is held between the substrate receiving portion 12 and the front side.
The wedge guiding member 15 is fixed to the upper frame portion 5 by an attachment bolt 22 that passes through the attachment base portion 20 and is screwed to the upper frame portion 5.

A cam surface 23 that contacts the wedge member 13 is formed on the back surface of the holding portion 21, that is, on the inner surface portion that holds the wedge member 13. The cam surface 23 is inclined so as to become narrower as the distance from the substrate receiving portion 12 becomes lower.
Between the front surface portion of the substrate receiving portion 12 and the inner surface (cam surface 23) of the holding portion 21, at least a holding gap of the printed circuit board W may be generated between the substrate receiving portion 12 and the wedge member 13. The play that can be done is secured. In addition, from such a thing, the attachment base 20 restricts the upward movement of the wedge member 13 on the back side of the holding portion 21, and the cam surface 23 prevents the wedge member 13 from falling off. A margin for slightly moving the wedge member 13 up and down is secured.

Accordingly, as the wedge member 13 moves to the lower position, the wedge surface 13 is pushed toward the substrate receiving portion 12 by the cam surface 23. That is, if the wedge member 13 is in the upper position, a clamping gap for the printed circuit board W is formed between the front portion of the substrate receiving portion 12 and the wedge member 13, and if the wedge member 13 is moved to the lower position, this clamping is performed. The gap will be reduced.
In the present embodiment, the wedge guiding members 15 are provided in a plurality (two in the illustrated example) so as to be scattered at predetermined intervals in the longitudinal direction of the upper frame portion 5.

As shown in FIG. 4, the wedge pressing means 16 includes a mounting base 25 that is attached to the upper frame portion 5 and a push bolt 26 that is screwed in a direction that vertically passes through the mounting base 25. The lower end portion of the push bolt 26 is in contact with the wedge member 13, and the wedge member 13 can be pushed down by being screwed downward with respect to the attachment base portion 25.
The wedge pressing means 16 is fixed to the upper frame portion 5 by an attachment bolt 27 that passes through the attachment base portion 25 and is screwed to the upper frame portion 5.

In this embodiment, butterfly bolts are used as the push bolts 26 to facilitate the screwing operation. Further, the wedge pressing means 16 is arranged at the center of the upper frame portion 5, and the wedge guiding members 15 described above are arranged and arranged on both sides of the upper frame portion 5, respectively.
As shown in FIG. 5, the weight bar 10 is provided with a slide guide portion 30 at a portion connected to the left and right vertical frame portions 7 in the frame body 2. The slide guide part 30 is formed with a hole 31 penetrating in the vertical direction, and the vertical frame part 7 is inserted into the hole 31 so as to be relatively slidable without rattling. Therefore, the weight bar 10 is movable up and down along the left and right vertical frame portions 7.

  The weight bar 10 is provided with substrate clamping means 32 for clamping the lower end portion of the printed circuit board W. In the present embodiment, the substrate clamping means 32 has a crosspiece main body 35 formed in a strip shape with its longitudinal direction facing left and right, and a sandwiching plate 36 provided in a superimposed manner on the front of the crosspiece main body 35. The lower end portion of the printed circuit board W can be clamped between the crosspiece main body 35 and the clamping plate 36.

The crosspiece main body 35 is provided with a step 35a so that the front portion is recessed along the upper side portion thereof, and a substrate receiving portion 37 is formed as a flat surface long in the left-right direction on the upper side (concave surface side) of the step 35a. I'm allowed. The substrate receiving portion 37 is a portion for holding and holding one side of the lower end portion of the printed circuit board W.
The sandwiching plate 36 is also formed in a strip shape with the longitudinal direction directed to the left and right, but is slightly smaller than the crosspiece body 35 in length, strip width, and thickness. By overlapping this clamping plate 36 on the crosspiece main body 35, a gap for inserting the printed board W between the back surface of the clamping plate 36 and the substrate receiving portion 37 of the crosspiece main body 35, corresponding to the amount of depression by the step 35a. 38 is formed.

The clamping plate 36 and the crosspiece main body 35 are coupled in a stationary state by a plurality of superposed bolts 39 provided at predetermined intervals along the longitudinal direction thereof.
A plurality of clamping bolts 40 are screwed onto the clamping plate 36 so as to be alternately arranged with the overlapping bolts 39. These clamping bolts 40 are arranged so that the bolt tips are opposed to the board receiving portions 37 of the crosspiece main body 31, and the printed board W is transferred to the board receiving portions 37 at the respective bolt tips by screwing toward the board receiving portions 37. Can be pressed. In order to improve the screwing operability, a butterfly bolt can also be used for the clamping bolt 40.

  That is, by tightening the clamping bolt 40 in a state where the lower end portion of the printed board W is inserted into the gap 38 formed between the crosspiece body 31 and the clamping plate 32, the printed board is at the tip of the clamping bolt 40. W is pressed against the substrate receiving portion 37 of the crosspiece body 31 to be fixed. At this time, the weight of the weight bar 10 as a whole is applied to the printed circuit board W, and a downward tensile action is generated at the lower end of the printed circuit board W.

In the hanger 1 having such a configuration, the upper end portion of the printed circuit board W is sandwiched between the substrate receiving portion 12 and the wedge member 13 with respect to the upper frame portion 5 of the frame body 2, and then the wedge member 13 is attached. When moved toward the lower position, the wedge member 13 is pushed into the substrate receiving portion 12 by the wedge guiding member 15.
In order to move the wedge member 13 downward, the push bolt 26 of the wedge pressing means 16 may be screwed. By doing so, the printed board W is sandwiched between the board receiving portion 12 and the wedge member 13, and does not fall off and is not displaced.

As the wedge member 13 moves downward, it is pushed into the substrate receiving portion 12 by the wedge guiding portion 15, so that the clamping pressure of the printed circuit board W is increased and the printed circuit board W is rattled even by conveyance vibration. Never do.
Next, the lower end portion of the printed board W is held by the board holding means 32 provided on the weight bar 10. Thereby, a downward tensile load by the weight bar 10 is applied to the printed board W, and an appropriate tension is given to the holding state of the printed board W.

In addition, by applying a downward tensile load by the weight bar 10 to the printed board W, the wedge member 13 described above can be further drawn downward. The upper end portion of the printed board W by the wedge member 13 The pinching action of is more and more certain.
In this state, the printed circuit board W is free from backlash and misalignment, and as a result, the printed circuit board W is maintained in a uniform and reliable power supply enabled state over the entire surface of the printed circuit board W.

  When releasing the holding of the printed board W, the clamping bolt 40 of the board clamping means 32 of the weight bar 10 is released, and the push bolt 26 of the wedge pressing means 16 is released, so that the wedge member 13 is moved to the upper position. The upper end portion of the printed circuit board W can be extracted with respect to the space between the substrate receiving portion 12 and the wedge member 13 with a slight movement toward. In this way, the printed circuit board W can be attached and detached very easily and lightly.

  Since the hanger 1 according to the present invention can adjust the thickness of the printed board W according to the downward movement of the wedge member 13, the thickness of the hanger 1 as a holdable printed board W is universal. There is sex. Further, by forming the lower frame portion 6 and the left and right vertical frame portions 7 of the frame main body 2 so as not to come into contact with the printed circuit board W, versatility is exhibited in the vertical and horizontal dimensions of the printed circuit board W. be able to.

By the way, this invention is not limited to the said embodiment, It can change suitably according to embodiment with respect to a detailed structure, member shape, material, etc.
For example, the substrate clamping means 32 provided on the weight bar 10 may be formed by a combination of the wedge member 13, the wedge guiding member 15, and the wedge pressing means 16.

It is the perspective view which showed one Embodiment of the hanger which concerns on this invention. It is a front view corresponding to FIG. It is the principal part expanded sectional view shown corresponding to the AA line of FIG. It is a BB line expanded sectional view of Drawing 1. FIG. 3 is an enlarged cross-sectional view taken along the line CC in FIG. 1.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Hanger 2 Frame main body 3 Hook part 5 Upper frame part 6 Lower frame part 7 Vertical frame part 10 Weight bar 12 Substrate receiving part 13 Wedge member 15 Wedge guide member 16 Wedge depressing means 20 Wedge guide attachment base 21 Holding part 23 Cam surface 25 Wedge pressing base mounting base 26 Push bolt 32 Substrate clamping means W Printed circuit board

Claims (9)

A frame body (2) surrounding the printed circuit board (W) by the upper frame portion (5), the lower frame portion (6), and a pair of left and right vertical frame portions (7) connecting them, and the frame body (2 In the hanger having a hook portion (3) that is projected upward from the upper frame portion (5) and used for hanging to the substrate conveyance path passing above the plating tank,
The upper frame portion (5) of the frame body (2) includes a substrate receiving portion (12) for holding the upper end portion of the printed circuit board (W),
A wedge member (13) which is held on the front side of the substrate receiving portion (12) so as not to drop off;
Between the front surface of the board receiving part (12) and the wedge member (13), at least a play for generating or shrinking the holding gap of the printed board (W) is secured, and the wedge member (13) moves to the lower position. A hanger for hanging a printed circuit board, which has a wedge guide member (15) that pushes toward the substrate receiving part (12) and shrinks the clamping gap.   A plurality of wedge guiding members (15) are provided in a dotted manner at predetermined intervals in the longitudinal direction with respect to the upper frame portion (5) of the frame body (2). A hanger for hanging a printed circuit board according to 1.   The print according to claim 1 or 2, wherein the wedge member (13) is formed in a horizontally long shape that can come into contact with the printed circuit board (W) in a line-contact manner along the upper side portion. A hanger for hanging the board.   The hanger for hanging a printed circuit board according to claim 3, wherein the wedge member (13) is formed of a rod having a circular cross section. The wedge guiding member (15) includes a mounting base (20) attached to the upper frame portion (5) of the frame main body (2), and a holding provided so as to protrude downward from the mounting base (20) in a bowl shape. A wedge member (13) from the front side between the holding portion (21) and the substrate receiving portion (12) of the upper frame portion (5) on the back side of the holding portion (21). While allowing play and vertical movement,
On the back surface of the holding portion (21), a cam surface (23) is formed that is brought into contact with the wedge member (13) while being inclined in a direction that becomes narrower as the distance from the substrate receiving portion (12) becomes lower. The hanger for hanging a printed circuit board according to any one of claims 1 to 4, wherein the hanger is for hanging a printed circuit board.   6. A wedge pressing means (16) for pressing down the wedge member (13) downward is provided on the upper frame portion (5) of the frame body (2). A hanger for hanging a printed circuit board according to claim 1.   The wedge pressing means (16) includes a mounting base (25) attached to the upper frame portion (5) of the frame main body (2) and a push bolt (threaded in a direction vertically passing through the mounting base (25)). 26), and the wedge member (13) can be pushed down at the lower end of the push bolt (26).   The wedge pressing means (16) is arranged at the center of the upper frame portion (5) of the frame main body (2), and the wedge guiding members (15) are arranged on both sides of the wedge pressing means (16). A hanger for hanging a printed circuit board according to claim 6 or 7, wherein   The frame main body (2) is provided with a weight bar (10) erected between the left and right vertical frame parts (7) so as to be movable up and down, and a printed board (W 9. A hanger for hanging a printed circuit board according to any one of claims 1 to 8, further comprising a substrate clamping means (32) for clamping the lower end of the printed circuit board.

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