JP2007173399A - Electric wiring component, manufacturing method therefor, and liquid discharge head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric wiring component manufacturing method for surely forming fine electric wiring, and also, to provide an electric wiring component and a liquid discharge head. <P>SOLUTION: The electric wiring component manufacturing method is provided with steps (a)-(c) for forming wiring-pattern-shaped grooves 81 in a substrate 80; steps (d), (e) for forming each photocatalyst layer 82 (820) inside each groove 81 in the substrate 80; and a step (g) for forming the electric wiring inside each groove 81 by depositing a metal 84 inside each groove 81 in the substrate 80 by emitting ultraviolet rays 94 to each photocatalyst layer 82 in the substrate 80, while immersing the substrate 80 in a solution 83 including metal ions and a sacrificial agent. It is preferable to further execute a step (f) for making each photocatalyst layer 82 hydrophilic by emitting the ultraviolet rays 94 to each photocatalyst layer 82 formed inside each groove 81 before the photodeposition step (g). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electrical wiring component having electrical wiring, an electrical wiring component, and a liquid discharge head.

  2. Description of the Related Art Conventionally, a liquid discharge head that has a nozzle for discharging ink and discharges ink from the nozzle toward a recording medium such as paper has been used.

  As such a liquid discharge head, for example, a piezoelectric element is used as an actuator, and the volume of the pressure chamber communicating with the nozzle is changed by the piezoelectric element via a diaphragm constituting one wall surface of the pressure chamber. An apparatus in which ink is ejected from a nozzle is known.

  There is also known a liquid discharge head in which a heating element such as a heater is used as an actuator, ink is heated in the pressure chamber by the heating element to generate bubbles, and ink is discharged from the nozzle with the pressure.

  In these liquid discharge heads, as a method for forming an electric wiring for transmitting an electric signal to be applied to an actuator, for example, there is a method of etching a conductive metal such as copper by using a photolithography technique.

  Further, in Patent Document 1, a groove is formed on a substrate, an electroless plating catalyst-containing solution is patterned inside the groove by an ink jet technique, and then the opening of the groove is formed by electroless plating or electroplating subsequent to electroless plating. Describes a method of depositing a conductive substance on the part.

  In order to form electrical wiring by electroless plating, for example, a compound of Pd (palladium) and Sn (tin) is attached to the surface of the substrate, and then Sn is dissolved and a Pd layer as a catalyst is formed on the surface of the substrate. In the plating solution containing the conductive metal ions for forming the target electrical wiring by performing the generation process (so-called acceleration), the conductive metal in the plating solution is reduced to the surface of the Pd layer. A step of forming a plating film is performed. Through these steps, a target electrical wiring is formed on the substrate.

In Patent Document 2, a photocatalyst powder-containing binder is applied in a pattern on the surface of a non-conductive object, and then irradiated with ultraviolet rays while being immersed in an aqueous solution of metal ions containing a reducing agent. A method of forming is described. Here, as a practical application method of the binder containing the photocatalyst powder, pad printing, screen printing, or drawing with a plotter attached to a dispenser is used.
JP 2005-50969 A JP-A-2-205388

  In a liquid ejection head, in order to form a high-resolution image at high speed, it is required to arrange a large number of nozzles at high density. Here, if it is going to arrange many nozzles with high density, it will be necessary to arrange | position the electrical wiring for actuator drive with high density on a board | substrate. For example, it is required to form an electric wiring having a wiring pitch of 20 μm and an L / S (line width / space interval) of 10 μm / 10 μm, or an electric wiring finer than this. On the other hand, electrical wiring is also required to be formed at low cost.

  In addition, in the method using the photolithography technique, it is necessary to reduce the resist thickness as the definition of the electrical wiring is increased, and accordingly, the thickness of the conductor serving as the electrical wiring must be reduced. As a result, the resistance value of the electrical wiring increases.

  As described in Patent Document 1, the method of using an expensive noble metal such as Pd as the electroless plating catalyst increases the manufacturing cost. Therefore, the method using such an expensive noble metal is disadvantageous from the viewpoint of cost.

  Further, when the electrical wiring is miniaturized, there is a problem that the adhesion between the electrical wiring and the substrate is lowered.

  As described in Patent Document 1, when the catalyst-containing liquid is patterned by the ink jet technique after forming the grooves, it is necessary to drive the electroless plating catalyst-containing liquid into the fine grooves. For example, in order to drive into a groove having a width of 10 μm or less, the injection amount needs to be in the order of sub pL, and thus it is difficult to accurately drive a small amount of liquid only into a fine groove.

  When the photocatalyst powder-containing binder is applied to the substrate surface by pad printing, screen printing, or a dispenser attached to the dispenser as described in Patent Document 2, generally, the photocatalyst pattern is formed in a convex shape on the substrate surface. As a result, metal deposition proceeds isotropically starting from the convex portion, so that the insulation between the electrical wirings becomes uncertain if the electrical wirings are miniaturized. Therefore, it is actually difficult to form fine electric wiring.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electrical wiring component manufacturing method, an electrical wiring component, and a liquid discharge head capable of reliably forming fine electrical wiring.

  In order to achieve the object, the invention according to claim 1 includes a groove forming step of forming a wiring pattern-like groove on a substrate, and a photocatalyst layer forming step of forming a photocatalyst layer inside the groove of the substrate. By irradiating the photocatalyst layer of the substrate with ultraviolet rays while immersing the substrate in a solution containing metal ions and a sacrificial agent, the metal is deposited inside the groove of the substrate, so that the inside of the groove Provided is a method for manufacturing an electrical wiring component comprising a light deposition step of forming electrical wiring.

  The photocatalyst exhibits catalytic activity when irradiated with ultraviolet rays. For example, titanium oxide, zirconium oxide, potassium tantalate, strontium titanate and the like are practical. Other photocatalysts may be used as long as they exhibit catalytic activity when irradiated with ultraviolet rays.

  A sacrificial agent (also referred to as a “sacrificial reagent”) is a substance that oxidizes itself while reducing metal ions. For example, formaldehyde, methanol, ethanol, formic acid and the like can be mentioned. Other sacrificial agents may be used as long as they deposit metal.

  According to the present invention, the grooves are formed in the substrate, and the electric wiring is formed inside the groove by light deposition. Therefore, the pitch between the grooves formed in the substrate is reduced to increase the density of the electric wiring and between the electric wirings. It becomes possible to ensure insulation. Further, since the electrical wiring is formed inside the groove through the photocatalyst layer, the electrical wiring is improved in adhesion to the substrate, and the electroless plating with a catalytic process using an expensive noble metal such as Pd is used. Compared with the case of forming the wiring, the electric wiring can be formed at a low cost. Therefore, the electrical wiring can be formed at a low cost while achieving both high density and high reliability of the electrical wiring.

  The invention according to claim 2 is the invention according to claim 1, wherein the solution is an electroless plating solution, and further includes a step of increasing the thickness of the metal deposited in the photodeposition step by electroless plating. The manufacturing method of the electrical wiring components characterized by this is provided.

  According to the present invention, the metal photodeposited in the electroless plating solution can be directly formed by electroless plating, so that the process can be shortened.

  The invention according to claim 3 is the method according to claim 1, further comprising a step of performing electrolytic plating using the metal photodeposited in the photodeposition step as a seed layer. Provide a method.

  According to the present invention, the merits of electrolytic plating such as improved environmental suitability can be obtained.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the photocatalyst layer formed in the groove is irradiated with ultraviolet rays before the photodeposition step. And providing a method for producing an electrical wiring component, further comprising a hydrophilization step of hydrophilizing the photocatalyst layer.

  According to this invention, since the photodeposition process is performed after the photocatalyst layer is hydrophilized, bubbles are prevented from adhering to the photocatalyst layer in the photodeposition process, so that metal deposition defects are suppressed and electrical wiring is suppressed. Reliability is improved.

  The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the groove forming step forms the groove by shape transfer using a mold having a convex portion. A method of manufacturing an electrical wiring component is provided.

  According to the present invention, since the groove is formed by shape transfer using a mold prepared in advance, it is possible to form the groove more easily than in the case of forming the groove using a photolithography technique.

  The invention according to claim 6 is characterized in that a groove having a wiring pattern is formed on at least one surface, and an electric wiring made of metal is formed inside the groove through a photocatalytic layer. Provide electrical wiring components.

  According to a seventh aspect of the present invention, a liquid discharge port for discharging a liquid, a pressure chamber for storing the liquid discharged from the liquid discharge port, and a liquid in the pressure chamber by changing the pressure in the pressure chamber. A liquid discharge head comprising: the discharge force applying means for applying a discharge force; and the electric wiring component according to claim 6, wherein the electric wiring for transmitting an electric signal applied to the discharge force applying means is formed. provide.

  According to the present invention, since the electric wiring for liquid discharge can be arranged with high density, the liquid discharge ports can be made high density.

  According to the present invention, the electrical wiring can be formed finely and reliably.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Liquid discharge head]
FIG. 1 is a plan view showing the entire structure of an example of a liquid discharge head as seen through the left half in the drawing.

  A liquid discharge head 50 shown in FIG. 1 is a so-called full-line type head, and is orthogonal to the conveyance direction (the sub-scanning direction indicated by the arrow S in the drawing) of the recording medium 116 as the discharge medium (FIG. 1). A large number of nozzles 51 (liquid ejection ports) that eject liquid toward the recording medium 116 over a length corresponding to the width Wm of the recording medium 116. It has a structure.

  Specifically, the liquid discharge head 50 is formed to communicate with the nozzle 51, the pressure chamber 52 that communicates with the nozzle 51, and stores the liquid discharged from the nozzle 51, and the liquid is supplied into the pressure chamber 52. A plurality of pressure chamber units 54 including a liquid supply port 53 as an opening form a predetermined acute angle (θ: 0 ° <θ <90 °) with respect to the main scanning direction M and the main scanning direction M. Two-dimensionally arranged along two oblique directions. In FIG. 1, only a part of the pressure chamber units 54 is illustrated for convenience of illustration.

  Specifically, the plurality of nozzles 51 are arranged at a constant pitch (d) along a direction that forms an acute angle (θ) with respect to the main scanning direction M, and are arranged on a straight line along the main scanning direction M. It can be handled equivalently to those arranged at a predetermined pitch (d × cos θ). According to such a nozzle arrangement, a configuration substantially equivalent to a high-density nozzle arrangement such as 2400 nozzles per inch (2400 nozzles / inch) along the main scanning direction M can be achieved. That is, a substantial nozzle interval (projection nozzle pitch) projected so as to be arranged on a straight line along the longitudinal direction (main scanning direction M) of the liquid discharge head 50 can be reduced, and high resolution can be achieved.

  In this example, the common liquid chamber 55 that supplies ink to the plurality of pressure chambers 52 is formed in the common liquid chamber forming plate 506 as a flow path that forms one space so as to cover all of the plurality of pressure chambers 52. .

  At the end of the common liquid chamber 55, a liquid inlet 553 is formed through which ink is introduced from a liquid tank (not shown) outside the liquid discharge head 50 into the common liquid chamber 55.

  A sectional view taken along line 2-2 in FIG. 1 is shown in FIG. 2, and a sectional view taken along line 3-3 in FIG. 1 is shown in FIG.

  As shown in FIGS. 2 and 3, the liquid discharge head 50 includes a nozzle forming plate 501, a pressure chamber forming plate 502, a vibration plate 503, an intermediate plate 504, an electric wiring substrate 505, a common liquid chamber forming plate 506, and a sealing member. A plurality of plates including the stop plate 507 are stacked.

  A plurality of nozzles 51 that discharge liquid are two-dimensionally arranged on the nozzle forming plate 501.

  A pressure chamber forming plate 502 in which a plurality of pressure chambers 52 communicating with the nozzle 51 is formed is bonded on the nozzle forming plate 501 (that is, on the side opposite to the nozzle surface 510).

  On the pressure chamber forming plate 502, a vibration plate 503 that constitutes one wall surface (vibration surface) of the pressure chamber 52 and on which the actuator 58 is formed is bonded.

  The actuator 58 includes a piezoelectric body 580 made of a piezoelectric material, a diaphragm 503 made of a conductive material that sandwiches the piezoelectric body 580 in the thickness direction, and an individual electrode 57.

  The actuator 58 is provided at a position corresponding to each pressure chamber 52 on the vibration plate 503, and ejects the liquid in the pressure chamber 52 by vibrating the vibration plate 503 and changing the pressure in the pressure chamber 52. It functions as a discharge force applying means for applying force.

  The diaphragm 503 is connected to the ground and constitutes one electrode (common electrode) of the actuator 58. The other electrode of the actuator 58 is constituted by an individual electrode 57, and an electric wiring 84 for driving the actuator is connected to the individual electrode 57.

  Moreover, the liquid supply port 53 shown in FIG.

  On the vibration plate 503, an air gap 581 is formed around the actuator 58 so as not to hinder the operation of the actuator, and an intermediate plate 504 and an electric wiring board 505 for protecting the entire actuator 58 are bonded.

  A common liquid chamber forming plate 506 is disposed on the side opposite to the side on which the pressure chamber forming plate 502 is disposed with the vibration plate 503, the intermediate plate 504, and the electric wiring board 505 interposed therebetween. A common liquid chamber 55 that supplies liquid to the pressure chamber 52 is formed in the common liquid chamber forming plate 506.

  On the common liquid chamber forming plate 506, a sealing plate 507 constituting the top surface of the common liquid chamber 55 is formed. A space between the electric wiring board 505 and the sealing plate 507 is a common liquid chamber 55, which is filled with ink.

  The common liquid chamber 55 is formed immediately above the plurality of pressure chambers 52 when viewed from the pressure chamber 52 with the nozzle 51 facing down, and is a communication port as an opening formed at the bottom of the common liquid chamber 55. Each pressure chamber 52 communicates with each pressure chamber 531 through a liquid supply channel 531 extending from 530 to the liquid supply port 53 formed in the vibration plate 503 through the electric wiring board 505 and the intermediate plate 504. In other words, the ink in the common liquid chamber 55 flows straight to the plurality of pressure chambers 52 located immediately below the common liquid chamber 55 via the liquid supply flow path 531, so that the ink flows into each pressure chamber 52. It will be supplied with good refill properties.

  The electric wiring 84 for driving the actuator 58 is arranged on the electric wiring board 505 along the horizontal direction (the direction parallel to the arrangement surface of the actuator 58). Specifically, the electrical wiring 84 is formed inside the groove of the electrical wiring substrate 505. Details of the electric wiring board 505 and the electric wiring 84 will be described later in detail.

  When a drive signal is given to the individual electrode 57 of the actuator 58 via the electrical wiring 84, the piezoelectric body 580 constituting the actuator 58 is displaced, and the volume of the pressure chamber 52 changes via the vibration plate 503. As a result, the liquid is discharged from the nozzle 51 communicating with the pressure chamber 52.

  In this example, since the common liquid chamber 55 is disposed on the vibration plate 503, the length of the nozzle flow path 511 from the pressure chamber 52 to the nozzle 51 can be shortened, and high-viscosity ink (for example, about 20 cp to 50 cp). Can be discharged. In this example, since the common liquid chamber 55 is formed in the common liquid chamber forming plate 506 as a flow path that forms one space so as to cover all of the plurality of pressure chambers 52, the size of the common liquid chamber 55. And the flow resistance in the common liquid chamber 55 can be reduced, which is suitable for discharging a highly viscous liquid. The present invention is not particularly limited to such a case. For example, the common liquid chamber forming plate 506 may be formed as a structure including a main flow and a tributary formed by branching from the main flow.

  In the liquid discharge head 50 shown in FIGS. 1, 2, and 3, the common liquid chamber 55 is formed on the diaphragm 503 so as to cover all the pressure chambers 52. As in the liquid discharge head 500 shown in FIG. 4, the common liquid chamber 55 may be provided below the pressure chamber 52 (that is, closer to the nozzle surface 510 than the pressure chamber 52). In the liquid discharge head 500 shown in FIG. 4, the same components as those of the liquid discharge head 50 shown in FIGS. 2 and 3 are denoted by the same reference numerals, and the detailed description thereof will be omitted. To do.

[Method of manufacturing electrical wiring board]
An example of a method for manufacturing an electrical wiring substrate (hereinafter simply referred to as “substrate”) will be described with reference to the process diagram of FIG. In FIG. 5, reference numeral 80 is given to the substrate 505 shown in FIGS.

  First, a wiring pattern-shaped groove 81 is formed in the substrate 80.

  As a specific method of forming the groove 81, first, as shown in FIG. 5A, a plate material made of an insulating resin is prepared as a substrate 80, and a desired electric wiring pattern (wiring pattern) is prepared. As shown in FIGS. 5 (b) and 5 (c), a mold 90 having a convex portion 91 corresponding to the pattern 90 is prepared. There is a method of forming a groove 81 having a shape. Second, there is a method in which a photosensitive resin is used as the substrate 80 and the groove 81 is formed by selective exposure. For the simplification of the process, the former first method is preferable.

  Next, a photocatalyst dispersion liquid is adhered inside the groove 81 to form a photocatalyst layer inside the groove 81.

  The photocatalyst is not particularly limited as long as it exhibits catalytic activity upon irradiation with ultraviolet rays. For example, titanium oxide, zirconium oxide, potassium tantalate, strontium titanate and the like are practical.

  As a method of attaching the photocatalyst dispersion liquid to the inside of the groove 81, first, as shown in FIG. 5 (d-1), the squeegee 92 is slid on the surface of the substrate 80 on which the photocatalyst dispersion liquid 820 is dropped. Thus, there is a method of removing the excess photocatalyst dispersion liquid 820 on the surface of the substrate 80 while leaving the photocatalyst dispersion liquid 820 inside the groove 81. Second, as shown in FIG. 5 (d-2), the substrate 80 on which the photocatalyst dispersion liquid 820 has been dropped is rotated so that the photocatalyst dispersion liquid 820 remains inside the groove 81 while the substrate 80 remains. There is a method of removing excess photocatalyst dispersion liquid 820 on the surface by centrifugal force (so-called spin coating). In order to reliably prevent the photocatalyst dispersion liquid 820 from adhering to portions other than the grooves 81, a process such as wiping may be further added.

  After attaching the photocatalyst dispersion liquid 820 to the inside of the groove 81, the substrate 80 is heated and the photocatalyst layer 82 made of the photocatalyst dispersion liquid 820 is dried as shown in FIG. The substrate 80 is fixed.

  Next, as shown in FIG. 5F, the photocatalyst layer 82 inside the groove 81 of the substrate 80 is irradiated with ultraviolet rays 94 to make the photocatalyst layer 82 hydrophilic.

  FIGS. 6A to 6C are schematic diagrams used for explaining the hydrophilization of the photocatalyst layer 82. 6A to 6C show a case where a thin film made of titanium oxide (referred to as “titanium oxide layer”) is formed as the photocatalyst layer 82.

As shown in FIG. 6A, on the surface of the titanium oxide layer 82, titanium (Ti) and oxygen (O) are cross-linked and stabilized. In this state, the surface of the titanium oxide layer 82 is hydrophobic. When the stabilized titanium oxide layer 82 is irradiated with ultraviolet rays UV, a part of oxygen (O) cross-linked to titanium (Ti) is released and an oxygen defect is generated. Water (H ₂ O) in the atmosphere is bonded to the oxygen defect to generate a hydroxyl group (OH) on the surface of the titanium oxide layer 82, and the hydroxyl group covers the titanium oxide layer 82, thereby making the titanium oxide layer 82 hydrophilic. To express. By making the titanium oxide layer 82 hydrophilic in this manner, bubbles remaining in the groove 81, which is a concern due to the structure of the groove 81 in the next step, can be prevented.

  As a method for uniformly hydrophilizing the photocatalyst layer 82 formed in the concave groove 81, at least one of the substrate 80 and the ultraviolet light source is rotated while irradiating the substrate 80 with ultraviolet rays from an oblique direction. There are a method of exercising (or precession) and a method of changing the irradiation angle of the ultraviolet rays to the substrate 80.

  For example, as shown in FIG. 7A, an ultraviolet light source 96 that emits ultraviolet light 94 from an oblique direction is prepared on a substrate 80 arranged on a horizontal plane, and the ultraviolet light source 96 is rotated. Alternatively, the substrate 80 may be configured to rotate. Further, for example, as shown in FIG. 7B, the tilt angle θi of the substrate 80 may be changed while emitting ultraviolet light from the ultraviolet light source 96 in the vertical direction.

  Next, as shown in FIG. 5G, the substrate 80 having the photocatalyst layer 82 formed in the groove 81 is immersed in a solution 83 containing at least a metal ion and a sacrificial agent to be used as a conductor. The layer 82 is irradiated with ultraviolet rays. Then, the metal 84 as the electrical wiring is photodeposited on the photocatalyst layer 82 inside the groove 81.

  Examples of the metal used include Cu, Ag, Au, and Pt.

  Examples of the sacrificial agent include formaldehyde, methanol, ethanol, formic acid and the like.

  The concentration of the metal ions and the sacrificial agent in the solution 83 is preferably in the range of metal ions: 0.05 to 0.5 mol / L, sacrificial agent: 0.3 to 3 mol / L.

  Here, the sacrificial agent is a substance that oxidizes itself while reducing other substances. Also called sacrificial reagent.

  Specifically, when the photocatalyst layer 82 is irradiated with ultraviolet rays 94, electrons and holes are generated. Then, while the sacrificial agent captures holes, electrons are given to the metal ions, so that the metal is deposited.

  Here, as a method of depositing the metal 84 uniformly, a method of rotating at least one of the substrate 80 and the ultraviolet light source (or a precession) while irradiating the substrate 80 with ultraviolet rays from an oblique direction, There is a method of changing the irradiation angle of ultraviolet rays to the substrate 80.

  Next, as shown in FIG. 5 (h), the metal 84 photodeposited in the groove 81 is used as a seed layer to increase the thickness by electrolytic plating. Instead of increasing the thickness by electrolytic plating, the thickness may be increased by electroless plating using the metal 84 photodeposited in the groove 81 as a catalyst.

  Although a solution for photodeposition may be prepared exclusively, the substrate 80 may be immersed in an electroless plating solution containing metal ions and a sacrificial agent constituting the target electric wiring and irradiated with ultraviolet rays. Good. In this case, since the electroless plating reaction continuously proceeds on the photodeposited metal as a catalyst nucleus, the process can be shortened. Although electroplating can be applied after electroless plating, from the viewpoint of shortening the process, it is preferable to continuously perform photodeposition and film increase in an electroless plating solution.

  According to the method for manufacturing the electrical wiring board 80 described above, the grooves 81 are formed in the electrical wiring board 80, and then the electrical wiring 84 is formed by light deposition inside the grooves 81. Therefore, the electrical wiring board 80 is formed. It is possible to reduce the pitch of the grooves 81 to increase the density of the electrical wiring 84 and ensure insulation between the electrical wirings 84.

  Furthermore, since the electrical wiring 84 is formed inside the groove 81 via the photocatalytic layer 82, the adhesion of the electrical wiring 84 to the electrical wiring substrate 80 is improved, and an expensive noble metal such as Pd (palladium) is used. The electrical wiring 84 can be formed at a lower cost than when so-called catalysis is performed. Therefore, the electrical wiring 84 can be formed at a low cost while achieving both high density and improvement in reliability of the electrical wiring 84.

  Further, since photodeposition is performed after the photocatalyst layer 82 is hydrophilized, bubbles are prevented from adhering to the photocatalyst layer 82 due to photodeposition, so that the deposition failure is suppressed and the reliability of the electrical wiring 84 is improved. To do.

[Image forming apparatus]
FIG. 8 is a block diagram illustrating an overall configuration of an example of the image forming apparatus 110.

  In FIG. 8, the image forming apparatus 110 mainly includes a liquid ejection head 50, a communication interface 210, a system controller 212, memories 214 and 252, a conveyance unit 220, a liquid supply unit 222, a head controller 250, and an actuator driving unit 254. It is configured to include.

  The image forming apparatus 110 is provided with a plurality of liquid ejection heads 50 that eject inks of respective colors of K (black), C (cyan), M (magenta), and Y (yellow). This liquid discharge head 50 is the one shown in FIGS. The liquid discharge head 500 shown in FIG. 4 may be used.

  The communication interface 210 is an image data input unit that receives image data transmitted from the host computer 300. A wired or wireless interface can be applied to the communication interface 210. The image data taken into the image forming apparatus 110 by the communication interface 210 is temporarily stored in the first memory 214 for storing image data.

  The system controller 212 includes a microcomputer and its peripheral circuits, and is main control means for controlling the entire image forming apparatus 110 according to a predetermined program. That is, the system controller 212 controls each unit such as the communication interface 210, the transport unit 220, the head controller 250, and the like.

  The conveyance unit 220 includes a conveyance motor that conveys a recording medium such as paper and a driver circuit thereof. In other words, the liquid discharge head 50 and the recording medium relatively move by the transport unit 220 controlled by the system controller 212.

  The liquid supply unit 222 includes an ink tank that stores liquid supplied to the liquid discharge head 50, a conduit that allows ink to flow from the ink tank to the liquid discharge head 50, a pump that is provided on the conduit, and the like. Has been.

  The actuator driving unit 254 gives an electrical signal to the actuator 58 of the liquid ejection head 50.

  The head controller 250 includes a microcomputer and its peripheral circuits, and is a control unit that controls the liquid supply unit 222 and the actuator driving unit 254 according to a predetermined program.

  The head controller 250 uses the data (dots) necessary for the liquid ejection head 50 to eject the liquid toward the recording medium and form dots on the recording medium based on the image data input to the image forming apparatus 110. Data). That is, the head controller 250 functions as an image processing unit that performs image processing such as various processes and corrections for generating dot data from image data in the first memory 214 under the control of the system controller 212. The obtained dot data is given to the actuator driving unit 254. When the dot data is given to the actuator driving unit 254 in this way, the actuator driving unit 254 sends the dot data to the actuator 58 of the liquid ejection head 50 via the electrical wiring 84 shown in FIGS. Thus, an electric signal is supplied, and the liquid is discharged from the nozzle 51 of the liquid discharge head 50 toward the recording medium.

  In FIG. 8, the second memory 252 is shown as being attached to the head controller 250. However, the second memory 252 can also be used as the first memory 214. Also possible is an aspect in which the head controller 250 and the system controller 212 are integrated to form a single microprocessor.

  Moreover, although the electrical wiring board in which the electrical wiring 84 for driving the actuator 58 is formed as the electrical wiring component has been described, the electrical wiring component of the present invention is not particularly limited to such a case.

  For example, a pressure sensor for detecting the pressure in the pressure chamber 52 is provided in the liquid ejection head 50, and the electrical wiring component of the present invention is applied as a substrate for electrical wiring that transmits an electrical signal output from the pressure sensor. May be.

  Moreover, although the case where the piezoelectric element was used as an actuator (discharge force provision means) was demonstrated to the example, you may use another actuator. For example, the present invention can also be applied to the case where liquid is discharged using a heating element such as a heater.

  Further, the case where the liquid to be discharged is ink has been described as an example, but the present invention manufactures a conductive liquid and a color filter which are discharged toward the substrate material when forming the conductive wiring on the substrate. The present invention can also be applied to liquids ejected toward the optical material.

  In addition, the present invention is not limited to the examples described in this specification and the examples shown in the drawings, and various design changes and improvements may be made without departing from the scope of the present invention. is there.

It is a top view which shows the whole structure of an example of a liquid discharge head. FIG. 2 is a cross-sectional view taken along line 2-2 in FIG. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 1. It is sectional drawing which shows the other example of a liquid discharge head. It is process drawing which shows an example of the manufacturing method of an electrical wiring board. It is a schematic diagram used for description of hydrophilization of a photocatalyst layer. It is a schematic diagram used for description of the ultraviolet irradiation method. 1 is a block diagram illustrating an overall configuration of an example of an image forming apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 50 ... Liquid discharge head, 51 ... Nozzle (liquid discharge port), 52 ... Pressure chamber, 55 ... Common liquid chamber, 58 ... Actuator, 80, 505 ... Electric wiring board (electric wiring component), 81 ... Groove, 82 ... Photocatalyst Layer, 84 ... electric wiring, 90 ... mold, 91 ... mold convex part, 110 ... image forming apparatus, 210 ... communication interface, 212 ... system controller, 214, 252 ... memory, 220 ... conveying unit, 222 ... feed Liquid part, 250 ... head controller, 254 ... actuator drive part

Claims (7)

A groove forming step of forming a wiring pattern-like groove on the substrate;
A photocatalyst layer forming step of forming a photocatalyst layer inside the groove of the substrate;
While immersing the substrate in a solution containing metal ions and a sacrificial agent, the photocatalyst layer of the substrate is irradiated with ultraviolet rays to deposit metal in the groove of the substrate, thereby causing an electric current to enter the groove. A photo-deposition process to form wiring;
A method for manufacturing an electrical wiring component, comprising:   The method of manufacturing an electrical wiring component according to claim 1, wherein the solution is an electroless plating solution, and further includes a step of increasing the thickness of the metal deposited in the light deposition step by electroless plating.   The method of manufacturing an electrical wiring component according to claim 1, further comprising a step of performing electrolytic plating using the metal photodeposited in the photodeposition step as a seed layer.   4. The hydrophilization step of hydrophilizing the photocatalyst layer by irradiating the photocatalyst layer formed in the groove with ultraviolet rays before the photodeposition step. The manufacturing method of the electrical wiring components of any one of Claims 1.   5. The method of manufacturing an electrical wiring component according to claim 1, wherein the groove forming step forms the groove by shape transfer using a mold having a convex portion.   An electrical wiring component comprising: a groove having a wiring pattern formed on at least one surface; and an electrical wiring made of metal formed in the groove through a photocatalyst layer. A liquid outlet for discharging liquid;
A pressure chamber containing liquid discharged from the liquid discharge port;
A discharge force applying means for applying a discharge force to the liquid in the pressure chamber by changing the pressure in the pressure chamber;
The electrical wiring component according to claim 6, wherein the electrical wiring for transmitting an electrical signal applied to the ejection force applying unit is formed.
A liquid discharge head comprising:

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