JP2007169498A - Moisture-curable resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a moisture-curable resin composition having excellent workability and storage stability and even in use with a urethane prepolymer, has excellent storage stability. <P>SOLUTION: The moisture-curable resin composition comprises an epoxy resin and a ketimine compound that contains a ketimine (C=N) bond derived from a ketone represented by general formula (1) (R<SP>1</SP>is a 1-5C alkyl group which may contain a substituent group; R<SP>2</SP>is a 1-4C alkyl group; R<SP>3</SP>and R<SP>4</SP>are each independently a 1-3C alkyl group and one of R<SP>3</SP>and R<SP>4</SP>may be a hydrogen atom) and an amine. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a moisture curable resin composition containing an epoxy resin and a ketimine compound.

Many one-pack type epoxy resin compositions are known, and various techniques have been disclosed for one-pack type epoxy resin compositions using a ketimine compound obtained from methyl isobutyl ketone (MIBK).
However, when a ketimine compound obtained from MIBK is used, there is a problem that storage stability is inferior.

ただし、Ｒ¹、Ｒ²は炭素数２〜６のアルキル基からなる群から選ばれるいずれか１つのアルキル基であり、Ｒ¹、Ｒ²は同じかまたは異なるアルキル基である。

ただし、Ｒ³はアミン化合物の１級アミノ基を除く残基であり、Ｒ⁴、Ｒ⁵は炭素数２〜６のアルキル基からなる群から選ばれるいずれか１つのアルキル基であり、Ｒ⁴、Ｒ⁵は同じかまたは異なるアルキル基である。ｎは、１以上の整数である。」が記載されている。 On the other hand, Patent Document 1 discloses that “a ketimine compound represented by the following chemical formula (2) obtained by reacting a carbonyl compound represented by the following chemical formula (1) with an amine compound having a primary amino group and an epoxy resin. One-component moisture-curable epoxy resin composition containing

However, R ^1, R ² is any one of an alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms, R ^1, R ² are the same or different alkyl groups.

However, R ³ is a residue excluding a primary amino group of the amine compound, R ^4, R ⁵ is any one of an alkyl group selected from the group consisting of alkyl groups having 2 to 6 carbon atoms, R ⁴ , R ⁵ are the same or different alkyl groups. n is an integer of 1 or more. Is described.

Japanese Patent No. 3404390

  However, although the one-pack type epoxy resin composition described in Patent Document 1 is excellent in storage stability, it has a problem that its usable time is short because of its high curing speed, that is, it is inferior in workability. It has been found that when urethane prepolymer is used in combination from the viewpoint of imparting and the like, there is a problem that storage stability is also deteriorated.

  Then, this invention makes it a subject to provide the moisture curable resin composition which is excellent in both workability | operativity and storage stability, and is excellent in storage stability even if it uses a urethane prepolymer together.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a composition containing an epoxy resin and a specific ketimine compound is a moisture curable resin composition excellent in both workability and storage stability. As a result, the present invention has been completed.
That is, this invention provides the moisture curable resin composition shown to the following (i)-(vii).

  (I) A moisture curable resin composition containing an epoxy resin and a ketimine compound having a ketimine (C = N) bond derived from a ketone represented by the following formula (1) and an amine.

In the formula, R ¹ represents an optionally substituted alkyl group having 1 to 5 carbon atoms, and R ² represents an alkyl group having 1 to 4 carbon atoms. R ³ and R ⁴ each independently represents an alkyl group having 1 to 3 carbon atoms, and one of them may be a hydrogen atom.

  (Ii) The moisture curable resin composition according to (i), wherein the ketone is a ketone represented by the following formula (2).

In the formula, R ² represents an alkyl group having 1 to 4 carbon atoms, and a plurality of R ² may be the same or different. R ³ and R ⁴ each independently represents an alkyl group having 1 to 3 carbon atoms, one of which may be a hydrogen atom, and a plurality of R ³ and R ⁴ may be the same or different. Good.

(Iii) The moisture curable resin composition according to the above (i) or (ii), wherein the amine is a polyamine having two or more amino groups in the molecule.
(Iv) The moisture curable resin composition according to (iii) above, wherein the polyamine is a linear polyalkylene polyamine.
(V) The moisture curable resin composition according to (iv) above, wherein the polyamine has amino groups at both ends of a linear alkylene having 3 to 6 carbon atoms.
(Vi) The moisture curable resin composition according to any one of (i) to (v), further containing 1 to 100 parts by mass of a urethane prepolymer with respect to 100 parts by mass of the epoxy resin. .
(Vii) The moisture curable resin composition according to (vi), wherein the urethane prepolymer has a structure in which all isocyanate groups in the molecule are bonded to a secondary carbon or a tertiary carbon not containing an aromatic ring. object.

  INDUSTRIAL APPLICABILITY According to the present invention, a moisture curable resin composition that is excellent in both workability and storage stability and excellent in storage stability even when used together with a urethane prepolymer is very useful.

The present invention is described in detail below.
The moisture curable resin composition of the present invention (hereinafter also simply referred to as “the composition of the present invention”) is an epoxy resin, a ketimine derived from a ketone and an amine represented by the above formula (1) (C = N) It is a moisture curable resin composition containing a ketimine compound having a bond, and further preferably contains a urethane prepolymer from the viewpoint of imparting flexibility.
Next, the epoxy resin, ketimine compound, and urethane prepolymer used in the moisture curable resin composition of the present invention will be described in detail.

<Epoxy resin>
The epoxy resin used in the composition of the present invention is not particularly limited as long as it is a resin composed of a compound having two or more oxirane rings (epoxy groups) in one molecule, and generally has an epoxy equivalent of 90 to 2000. belongs to.
As such an epoxy resin, a conventionally known epoxy resin can be used. Specifically, for example, bisphenol A type, bisphenol F type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol S type, Bifunctional glycidyl such as bisphenol AF type and biphenyl type epoxy compounds having a bisphenyl group, polyalkylene glycol type and alkylene glycol type epoxy compounds, an epoxy compound having a naphthalene ring, and an epoxy compound having a fluorene group Ether type epoxy resin;
Polyfunctional glycidyl ether type epoxy resins such as phenol novolak type, orthocresol novolak type, DPP novolak type, tris-hydroxyphenylmethane type, trifunctional type, tetraphenylolethane type, etc .;
Glycidyl ester type epoxy resin of synthetic fatty acid such as dimer acid;
N, N, N ′, N′-tetraglycidyldiaminodiphenylmethane (TGDDM), tetraglycidyl-m-xylylenediamine, triglycidyl-p-aminophenol, N, N-diglycidyl represented by the following formula (3) An aromatic epoxy resin having a glycidylamino group such as aniline;

Formula (4) an epoxy compound having a tricyclo [5,2,1,0 ^2,6] decane ring represented by, specifically, for example, cresol or phenols, such as dicyclopentadiene and cresol An epoxy compound which can be obtained by a known production method of reacting epichlorohydrin after polymerization;

式中、ｍは、０〜１５の整数を表す。

In formula, m represents the integer of 0-15.

Cycloaliphatic epoxy resin; epoxy resin represented by Toray Rethiokol's Flep 10 epoxy resin having a sulfur atom in the main chain; urethane modified epoxy resin having urethane bond; polybutadiene, liquid polyacrylonitrile-butadiene rubber or acrylonitrile butadiene rubber Examples thereof include a rubber-modified epoxy resin containing (NBR).
These may be used alone or in combination of two or more.

Of the various epoxy resins exemplified above, the use of an epoxy resin having an aromatic ring in the skeleton is because the physical properties (for example, tensile strength, etc.) and adhesiveness of the resulting moisture curable resin composition become better. preferable.
As such an epoxy resin, commercially available products such as EP4100E manufactured by Asahi Denka Kogyo Co., Ltd., Epicoat 828, Epicoat 807, Epicoat 806, Epicoat 154, Epicoat 630 and the like manufactured by Japan Epoxy Resin Co., Ltd. can be used.

<Ketimine compound>
The ketimine compound used in the composition of the present invention is a ketimine compound having a ketimine (C═N) bond derived from a ketone and an amine represented by the following formula (1).
The moisture curable resin composition containing a ketimine compound obtained by using such a specific ketone has good workability and storage stability. This is because of having a C 2-6 alkyl group in any bond of the carbonyl carbon, and at least one β-position carbon of the carbonyl carbon is a branched carbon, so that the bulk derived from the branched carbon is bulky. This is presumably because the movable range of the substituent is ensured to some extent and the epoxy group of the epoxy resin is difficult to approach the nitrogen atom of the ketimine compound due to the steric hindrance of the substituent.

In the formula, R ¹ represents an optionally substituted alkyl group having 1 to 5 carbon atoms, and R ² represents an alkyl group having 1 to 4 carbon atoms. R ³ and R ⁴ each independently represents an alkyl group having 1 to 3 carbon atoms, and one of them may be a hydrogen atom.

Here, in the above formula (1), specific examples of the alkyl group having 1 to 5 carbon atoms which may have a substituent of R ¹ include, for example, a methyl group, an ethyl group, and an n-propyl group. , N-butyl group, n-pentyl group, isopropyl group, 1-methylpropyl group and the like.
Further, the formula (1), the alkyl group having 1 to 4 carbon atoms R ^2, a methyl group, an ethyl group, n- propyl group, and n- butyl.
Further, the formula (1), the alkyl group having 1 to 3 carbon atoms of R ³ and R ^4, a methyl group, an ethyl group, and an n- propyl group.

  Specific examples of the ketone represented by the above formula (1) include ethyl isobutyl ketone represented by the following formula (5), isobutyl propyl ketone represented by the following formula (6), and the following formula (7). ) Represented by ethyl (2-methylbutyl) ketone.

  In the present invention, the ketone represented by the above formula (1) is the ketone represented by the following formula (2). The workability of the moisture curable resin composition containing a ketimine compound obtained from the ketone is as follows. And it is preferable for the reason that the storage stability becomes better.

In the formula, R ² represents an alkyl group having 1 to 4 carbon atoms, and a plurality of R ² may be the same or different. R ³ and R ⁴ each independently represents an alkyl group having 1 to 3 carbon atoms, one of which may be a hydrogen atom, and a plurality of R ³ and R ⁴ may be the same or different. Good.
Wherein, R ^1, R ^2, R ³ and R ⁴ in the formula (2) are respectively the same as R ^1, R ^2, R ³ and R ⁴ described in the above formula (1).

  Specific examples of the ketone represented by the above formula (2) include diisobutyl ketone represented by the following formula (8).

  On the other hand, in the present invention, widely known amines can be used for the synthesis of the ketimine compound, and polyamines having two or more amino groups in the molecule are preferable.

  Specific examples of the polyamine include, for example, ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, hexamethylenediamine, trimethylhexamethylenediamine, 1 , 2-propanediamine, iminobispropylamine, methyliminobispropylamine, aliphatic polyamines such as 1,5-diamino-2-methylpentane (for example, MPMD manufactured by DuPont Japan); metaphenylenediamine, Orthophenylenediamine, paraphenylenediamine, m-xylylenediamine (MXDA), diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiethyldipheny Aromatic polyamines such as methane; N-aminoethylpiperazine; monoamines having an ether bond in the main chain such as 3-butoxyisopropylamine; diamines having a polyether skeleton represented by Jeffamine EDR148 manufactured by San Techno Chemical Co .; isophorone Diamine, 1,3-bisaminomethylcyclohexane (for example, 1,3BAC manufactured by Mitsubishi Gas Chemical Co., Inc.), 1-cyclohexylamino-3-aminopropane, 3-aminomethyl-3,3,5-trimethyl-cyclohexylamine An alicyclic polyamine such as: norbornane diamine (for example, NBDA manufactured by Mitsui Chemicals, Inc.); norbornane skeleton diamine; polyamide amine having an amino group at the molecular end of polyamide; 2,5-dimethyl-2,5 -Hexamethylenediamine, Sendiamine, 1,4-bis (2-amino-2-methylpropyl) piperazine, and Jeffermine D230 and Jeffermin D400 manufactured by Sun Techno Chemical Co., which have polypropylene glycol (PPG) as a skeleton, are listed. It may be used alone or in combination of two or more.

In the present invention, among polyamines, from the viewpoint that flexibility can be imparted to the cured product, a linear polyalkylene polyamine is more preferable, the melting point is 50 ° C. or less, and the boiling point is 100 ° C. or more. From the viewpoint of good handleability, it is more preferable that the polyamine has amino groups at both ends of the linear alkylene having 3 to 6 carbon atoms.
Specifically, among the various polyamines exemplified above, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, and hexamethylenediamine are preferable.

Examples of the ketimine compound used in the composition of the present invention include a combination of various ketones exemplified above and various amines.
Specifically, those obtained from diisobutylketone (DIBK) and tetramethylenediamine (TMDA); those obtained from DIBK and hexamethylenediamine (HMDA); obtained from ethyl (2-methylbutyl) ketone and HMDA Obtained from DIBK and trimethylenediamine; obtained from ethyl (2-methylbutyl) ketone and TMDA; obtained from ethyl (2-methylbutyl) ketone and trimethylenediamine; DIBK and norbornanediamine And the like obtained from

  In addition, the ketimine compound used in the composition of the present invention is prepared by heating and refluxing ketone or aldehyde and amine in the absence of a solvent or in the presence of a solvent such as benzene, toluene, xylene, and the like. It can be obtained by reacting while removing by boiling.

  Further, the ketimine compound used in the composition of the present invention contains an equivalent ratio represented by (epoxy group in epoxy resin) / (ketimine bond in ketimine compound) of 0.1 to 1.5. It is preferable to contain, and it is more preferable to contain so that it may become 0.3-1.2. Moreover, when using urethane prepolymer together, the equivalent ratio represented by (epoxy group in epoxy resin + isocyanate group in urethane prepolymer) / (ketimine bond in ketimine compound) is 0.2 to 3.0. It is preferable to contain so that it may become, and it is more preferable to contain so that it may become 0.5-2.0.

<Urethane prepolymer>
The urethane prepolymer optionally used in the composition of the present invention is a reaction obtained by reacting a polyol compound and an excess polyisocyanate compound (that is, an excess isocyanate (NCO) group with respect to a hydroxyl (OH) group). Product.

The polyisocyanate compound for producing such a urethane prepolymer is not particularly limited as long as it is a compound having two or more NCO groups in the molecule. Specific examples thereof include 2,4-tolylene diisocyanate (2,4 -TDI), 2,6-tolylene diisocyanate (2,6-TDI), 4,4'-diphenylmethane diisocyanate (4,4'-MDI), 2,4'-diphenylmethane diisocyanate (2,4'-MDI) , 1,4-phenylene diisocyanate, xylylene diisocyanate (XDI), tetramethylxylylene diisocyanate (TMXDI), tolidine diisocyanate (TODI), 1,5-naphthalene diisocyanate (NDI), and the like; hexamethylene diisocyanate ( HDI), Trimethyl hexamethylene diisocyanate (TMHDI), lysine diisocyanate, aliphatic polyisocyanates such as norbornane diisocyanate methyl (NBDI); trans-cyclohexane-1,4-diisocyanate, isophorone diisocyanate (IPDI), H ₆ XDI (hydrogenated XDI) , Cycloaliphatic polyisocyanates such as H ₁₂ MDI (hydrogenated MDI), H ₆ TDI (hydrogenated TDI); polyisocyanate compounds such as polymethylene polyphenylene polyisocyanate; carbodiimide-modified polyisocyanates of these isocyanate compounds; Isocyanurate-modified polyisocyanates of compounds; urethane prepolymers obtained by reacting these isocyanate compounds with polyol compounds described below ; And the like, may be used in combination of two or more even with these alone.
A monoisocyanate compound having only one NCO group in the molecule can also be used by mixing with a diisocyanate compound or the like.

  Further, the polyol compound for producing such a urethane prepolymer is not particularly limited in its molecular weight and skeleton as long as it is a compound having two or more OH groups. Specific examples thereof include low molecular weight polyhydric alcohols. , Polyether polyols, polyester polyols, other polyols, and mixed polyols thereof.

  Specific examples of low molecular weight polyhydric alcohols include ethylene glycol (EG), diethylene glycol, propylene glycol (PG), dipropylene glycol, (1,3- or 1,4-) butanediol, and pentanediol. , Neopentyl glycol, hexanediol, cyclohexanedimethanol, glycerin, 1,1,1-trimethylolpropane (TMP), 1,2,5-hexanetriol, low molecular polyols such as pentaerythritol; saccharides such as sorbitol; etc. Is mentioned.

Next, as the polyether polyol and polyester polyol, those derived from the above low-molecular polyhydric alcohols are usually used. In the present invention, the following aromatic diols, amines and alkanolamines are further used. Those derived from the above can also be suitably used.
Here, specific examples of the aromatic diols include resorcin (m-dihydroxybenzene), xylylene glycol, 1,4-benzenedimethanol, styrene glycol, 4,4′-dihydroxyethylphenol; Bisphenol A structure (4,4'-dihydroxyphenylpropane), bisphenol F structure (4,4'-dihydroxyphenylmethane), brominated bisphenol A structure, hydrogenated bisphenol A structure, bisphenol S structure, bisphenol AF Those having a bisphenol skeleton having a structure;

  Specific examples of amines include ethylenediamine and hexamethylenediamine. Specific examples of alkanolamines include ethanolamine and propanolamine.

As the polyether polyol, for example, at least one selected from the compounds exemplified as the above low molecular polyhydric alcohols, the above aromatic diols, the above amines, and the above alkanolamines, ethylene oxide, propylene oxide, butylene oxide Examples thereof include polyols obtained by adding at least one selected from (tetramethylene oxide), alkylene oxides such as tetrahydrofuran, styrene oxide, and the like.
Specific examples of such polyether polyols include polyethylene glycol, polypropylene glycol (PPG), polypropylene triol, ethylene oxide / propylene oxide copolymer, polytetramethylene ether glycol (PTMEG), polytetraethylene glycol, sorbitol-based polyol. Etc.

Similarly, as the polyester polyol, for example, a condensate (condensed polyester polyol) of any one of the low molecular polyhydric alcohols, the aromatic diols, the amines and the alkanolamines with a polybasic carboxylic acid. ); Lactone polyol; polycarbonate polyol; and the like.
Here, as the polybasic carboxylic acid forming the condensed polyester polyol, specifically, for example, glutaric acid, adipic acid, azelaic acid, fumaric acid, maleic acid, pimelic acid, suberic acid, sebacic acid, Hydroxycarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid, dimer acid, pyromellitic acid, other low-molecular carboxylic acids, oligomeric acids, castor oil, reaction products of castor oil and ethylene glycol (or propylene glycol), etc. Is mentioned.
Further, as the lactone-based polyol, specifically, for example, a lactone such as ε-caprolactone, α-methyl-ε-caprolactone, ε-methyl-ε-caprolactone was ring-opened and polymerized with an appropriate polymerization initiator. And those having hydroxyl groups at both ends.

  Specific examples of other polyols include acrylic polyols; polybutadiene polyols; polymer polyols having carbon-carbon bonds in the main chain skeleton such as hydrogenated polybutadiene polyols.

  In the present invention, the various polyol compounds exemplified above may be used alone or in combination of two or more.

  As described above, the urethane prepolymer optionally used in the composition of the present invention is obtained by reacting a polyol compound and an excess polyisocyanate compound, and specific examples thereof include various types exemplified above. The thing by the combination of a polyol compound and various polyisocyanate compounds is mentioned.

  In the present invention, the production method of the urethane prepolymer is not particularly limited, and specific examples thereof include a reaction temperature of 30 to 120 ° C., preferably about 50 to 100 ° C., and a polyol compound and a polyisocyanate compound at normal pressure. The method of making it react and obtaining a urethane prepolymer is mentioned. Further, a urethanization catalyst such as an organic tin compound or an organic bismuth compound can be used.

  Moreover, in this invention, in manufacture of a urethane prepolymer, it is preferable that the equivalent ratio (NCO / OH) of the NCO group of the polyisocyanate compound with respect to the OH group of a polyol compound is 1.2-5.0. More preferably, it is 5-3.0. When NCO / OH is within this range, there is no foaming due to the remaining polyisocyanate compound and no increase in the viscosity of the urethane prepolymer due to molecular chain extension, and the physical properties after curing of the composition of the present invention are improved.

In the present invention, by using such a urethane prepolymer, the viscosity of the resulting moisture curable resin composition becomes appropriate (10 to 100 Pa · s at 23 ° C.), so that workability is further improved.
Moreover, in this invention, even if such a urethane prepolymer is used, the storage stability of the obtained moisture curable resin composition is hold | maintained favorably. As can be seen from the examples and comparative examples described later, it is clear that the composition of the present invention contains the specific ketimine compound described above. Due to the effect of steric hindrance by the branched carbon having at least one β-position of the carbonyl carbon and the molecular motion of the bulky substituent derived from the branched carbon, not only the epoxy group of the epoxy resin but also the NCO group of the urethane prepolymer is a ketimine compound. It is thought that this is because it becomes difficult to approach the nitrogen atom.

  In the present invention, the urethane prepolymer has a structure in which all NCO groups in the molecule are bonded to secondary carbon or tertiary carbon not containing an aromatic ring, as represented by the following formula (9). It is preferable that the moisture-curable resin composition of the present invention obtained has better storage stability and also has good heat resistance and water resistance after curing.

In the above formula (9), p represents an integer of 2 or more, and R ⁵ , R ⁶ and R ⁷ each independently contain at least one heteroatom selected from the group consisting of O, N and S R ⁶ may be a hydrogen atom. The plurality of R ⁵ and R ⁶ may be the same or different. Furthermore, when R ⁶ is a hydrogen atom, R ⁵ and a part of R ⁶ may be bonded to form a ring.

Here, the organic group specifically includes, for example, a hydrocarbon group such as an alkyl group, a cycloalkyl group, an aryl group, and an alkylaryl group; and at least a heteroatom selected from the group consisting of O, N, and S And organic groups containing one group (for example, ether, carbonyl, amide, urea group (carbamide group), urethane bond, etc.). Among these, the organic group represented by R ⁵ and R ⁶ is preferably an alkyl group, and specifically, a methyl group is preferable.

  Specific examples of the polyisocyanate compound that generates the urethane prepolymer represented by the formula (9) include TMXDI, IPDI, hydrogenated MDI, hydrogenated TDI, and the like among the various polyisocyanate compounds exemplified above. Preferably exemplified.

  In this invention, content of such a urethane prepolymer is 1 mass part or more and less than 100 mass parts with respect to 100 mass parts of said epoxy resins, and it is preferable that it is 2-80 mass parts.

From the viewpoint of workability adjustment, the composition of the present invention is one of the preferred embodiments that contains the ketimine compound hydrolysis catalyst.
The hydrolysis catalyst optionally used in the composition of the present invention is not particularly limited, and specific examples thereof include carboxylic acids such as 2-ethylhexanoic acid and oleic acid; polyphosphoric acid, ethyl acid phosphate, butyl acid phosphate, and the like. Phosphoric acids; organometallics such as dibutyltin dilaurate and dioctyltin dilaurate; and the like.

  In the present invention, the content of such a hydrolysis catalyst is preferably 0.01 to 20 parts by mass and more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the ketimine compound. preferable.

In one preferred embodiment, the composition of the present invention contains a silane coupling agent.
The silane coupling agent optionally used in the composition of the present invention is not particularly limited, and specific examples thereof include vinyl silane, epoxy silane, methacryl silane, isocyanate silane, ketimine silane, a mixture or a reaction product thereof, or these And a compound obtained by the reaction between polyisocyanate and polyisocyanate.

Examples of vinyl silane include vinyl trimethoxy silane, vinyl triethoxy silane, and tris- (2-methoxy ethoxy) vinyl silane.
Examples of the epoxy silane include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyldimethylethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β- (3,4-epoxycyclohexyl) ethylmethyl. Examples include dimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and the like.
Examples of methacrylic silane include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane.
Examples of the isocyanate silane include isocyanate propyl triethoxy silane and isocyanate propyl trimethoxy silane.
Examples of ketimine silanes include ketiminated propyltrimethoxysilane and ketiminated propyltriethoxysilane.

  In the present invention, the content of such a silane coupling agent is 0.1 to 10 parts by mass with respect to a total of 100 parts by mass of the epoxy resin and the urethane prepolymer that is optionally added. preferable. If content of a silane coupling agent is this range, it is preferable from the reason for the adhesiveness at the time of using the composition of this invention as a sealing material.

  The composition of the present invention can contain various additives as necessary in addition to the above-mentioned various components within a range not impairing the object of the present invention. Examples of the additive include a filler, an anti-aging agent, an antioxidant, an antistatic agent, a flame retardant, an adhesiveness imparting agent, a dispersant, and a solvent.

  Examples of the filler include wax stone clay, kaolin clay, calcined clay; fumed silica, calcined silica, precipitated silica, ground silica, fused silica; diatomaceous earth; iron oxide, zinc oxide, titanium oxide, barium oxide, oxidized Magnesium; calcium carbonate, magnesium carbonate, zinc carbonate; organic or inorganic fillers such as carbon black; these fatty acids, resin acids, fatty acid ester treated products, and fatty acid ester urethane compound treated products.

Examples of the antiaging agent include hindered phenol compounds and hindered amine compounds.
Examples of the antioxidant include butylhydroxytoluene (BHT) and butylhydroxyanisole (BHA).
Examples of the antistatic agent include quaternary ammonium salts; hydrophilic compounds such as polyglycols and ethylene oxide derivatives.

Examples of the flame retardant include chloroalkyl phosphate, dimethyl / methylphosphonate, bromine / phosphorus compound, ammonium polyphosphate, neopentyl bromide-polyether, and brominated polyether.
Examples of the adhesion imparting agent include terpene resins, phenol resins, terpene-phenol resins, rosin resins, xylene resins, and epoxy resins.
The above additives can be used in combination as appropriate.

  The method for producing the composition of the present invention from the above components is not particularly limited, but the above-described epoxy resin and ketimine compound, and optionally added urethane prepolymer and various additives can be used in rolls, kneaders, extruders. And a method of mixing with a universal stirrer or the like.

The composition of the present invention is moisture curable and can be used as a one-component composition. Moreover, if necessary, it can also be used as a two-component composition in which the epoxy resin is the main agent (liquid A) side and the ketimine compound is the curing agent (liquid B) side.
In addition, when the composition of the present invention is exposed to moisture, the curing reaction proceeds by an amine compound generated by hydrolysis of the ketimine compound, but the curing reaction can also proceed by supplying water appropriately.

  Since the composition of the present invention has the above-mentioned properties, it is used as a sealing material for buildings used between panels of outer walls, between windows and sashes of glass, and structural adhesives in concrete and mortar. It can be suitably used for agents, cracking injection materials and the like.

  EXAMPLES Next, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.

<Epoxy resin A>
As the epoxy resin A, a general-purpose bisphenol A type epoxy resin EP4100E (Asahi Denka Kogyo Co., Ltd., epoxy equivalent 190) was used.

<Urethane prepolymer A>
As urethane prepolymer A, bifunctional PPG (Exenol 2020, manufactured by Asahi Glass Co., Ltd.) having a number average molecular weight of 2,000 and tetramethylxylylene diisocyanate (TMXDI, manufactured by Nippon Cytec Industries, Inc.) The number of isocyanate groups per unit) (hereinafter simply referred to as “NCO / OH”) = 2.0, and the mixture was reacted at 80 ° C. for 8 hours in a nitrogen stream in the presence of a tin catalyst. The obtained urethane prepolymer (isocyanate group content: 3.5% by mass) was used.

<Ketimine Compound A>
As ketimine compound A, tetramethylenediamine (TMDA) and diisobutylketone (DIBK) represented by the above formula (8) are added to a flask together with toluene used as an azeotropic solvent so that the molar ratio is 1: 4. The ketimine compound synthesized by adding and reacting at 160 ° C. for 20 hours while removing generated water by azeotropy was used.

<Ketimine compound B>
As ketimine compound B, a ketimine compound synthesized by the same method as ketimine compound A was used except that hexamethylenediamine (HMDA) was used instead of tetramethylenediamine (TMDA).

<Ketimine compound C>
As ketimine compound C, a ketimine compound synthesized by the same method as ketimine compound B was used except that ethyl (2-methylbutyl) ketone represented by the above formula (7) was used instead of diisobutyl ketone (DIBK).

<Ketimine compound D>
As ketimine compound D, a ketimine compound synthesized by the same method as ketimine compound B was used except that methyl isobutyl ketone (MIBK) was used instead of diisobutyl ketone (DIBK).

<Ketimine Compound E>
As ketimine compound E, a ketimine compound synthesized by the same method as ketimine compound B was used except that di (n-butyl) ketone was used instead of diisobutylketone (DIBK).

<Ketimine compound F>
As ketimine compound F, a ketimine compound synthesized by the same method as ketimine compound A was used except that norbornanediamine (NBDA) was used instead of tetramethylenediamine (TMDA).

<Calcium carbonate>
As calcium carbonate, precipitated calcium carbonate (Biscolite MBP, manufactured by Shiroishi Calcium Co., Ltd.) was used.

<Vinylsilane>
Vinyltrimethoxysilane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd.) was used as vinylsilane.

(Examples 1-7, Comparative Examples 1-3)
Each composition component described above was blended at a component ratio (parts by mass) shown in Table 1 below to prepare each composition. About each obtained composition, the workability | operativity and storage stability which were shown below were evaluated. The results are shown in Table 1 below.

<Workability>
As an evaluation of workability, the pot life of each composition obtained was examined.
The pot life (hours) was measured immediately after the preparation of each composition obtained until the tack of the cured product surface disappeared at 30 ° C.
Here, workability can be evaluated as being excellent if the pot life is 3 to 4 hours.

<Storage stability>
As an evaluation of storage stability, the ratio of the viscosity (thickening rate) immediately after adjustment of the obtained composition and after storage was examined.
Thickening rate (times) was measured at 23 ° C. using a BS type viscometer (No. 7 rotor) immediately after adjustment of each composition obtained and after storage at 30 ° C. for 1 month. The viscosity (Pa · s) was measured at a speed of 10 rpm, and the viscosity was determined by (viscosity after storage at 30 ° C. for 1 month) / (viscosity immediately after preparation).
Here, it can be evaluated that the storage stability is excellent if the viscosity increase rate is less than 2 times.

  From the result shown in Table 1, it turned out that the composition shown in Examples 1-7 is excellent in workability | operativity and storage stability compared with the composition of Comparative Examples 1-3.

Claims (7)

A moisture curable resin composition comprising an epoxy resin and a ketimine compound having a ketimine (C = N) bond derived from a ketone represented by the following formula (1) and an amine.

(In the formula, R ¹ represents an optionally substituted alkyl group having 1 to 5 carbon atoms, R ² represents an alkyl group having 1 to 4 carbon atoms. R ³ and R ⁴ are each independently Represents an alkyl group having 1 to 3 carbon atoms, and one of them may be a hydrogen atom.) The moisture curable resin composition according to claim 1, wherein the ketone is a ketone represented by the following formula (2).

(In the formula, R ² represents an alkyl group having 1 to 4 carbon atoms, and a plurality of R ² may be the same or different. R ³ and R ⁴ are each independently alkyl having 1 to 3 carbon atoms. And any one of them may be a hydrogen atom, and a plurality of R ³ and R ⁴ may be the same or different.)   The moisture-curable resin composition according to claim 1 or 2, wherein the amine is a polyamine having two or more amino groups in the molecule.   The moisture curable resin composition according to claim 3, wherein the polyamine is a linear polyalkylene polyamine.   The moisture-curable resin composition according to claim 4, wherein the polyamine has amino groups at both ends of a linear alkylene having 3 to 6 carbon atoms.   The moisture curable resin composition according to any one of claims 1 to 5, further comprising 1 part by mass or more and less than 100 parts by mass of a urethane prepolymer with respect to 100 parts by mass of the epoxy resin.   The moisture curable resin composition according to claim 6, wherein the urethane prepolymer has a structure in which all isocyanate groups in the molecule are bonded to secondary carbon or tertiary carbon not containing an aromatic ring.